JP2005322000A - Cooling unit mounting structure and desktop computer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a desktop computer which realizes efficient cooling, imposes no useless stress on its heat pipe and mother board, prevents its parts from breakage due to stress and is easy to manage its dimension when it is manufactured. <P>SOLUTION: A computer 100 is provided with an air intake 13 which penetrates a housing 10 from a side face. A plurality of air-sucking pores for introducing external air are provided at the side surface and top surface of the air intake 13. A CPU 21 is arranged away from a heat sink 22 via a chassis 31, and they are thermally connected to each other via a heat pipe 23. A cooling unit which diffuses the heat generated by a mother board 20 on which the CPU 21 is arranged and the CPU 21 are preliminarily mounted on the back panel 15 of the computer 100 and removably incorporated from the rear of the housing 10 as an assembly unit 40. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cooling unit mounting structure and a desktop computer using the same. Specifically, it includes a motherboard on which the processor is arranged, a cooling unit that dissipates heat generated by the processor, and a back panel that can be attached to and detached from the housing of the desktop computer. By connecting the motherboard, the cooling unit, and the back panel in advance as a single assembly unit that is thermally connected by a pipe, the assembly unit is detachably incorporated from the back of the housing. Cooling can be realized, the stress on the heat pipe and the motherboard is not excessively stressed, the damage of the parts due to the stress can be suppressed, and the dimensional control during manufacturing can be easily performed. It relates to desktop computers.

  In recent years, the performance of computers, particularly personal computers, has been remarkably improved, and the amount of heat generated from a processor (hereinafter referred to as CPU) has increased accordingly. Therefore, in order to keep the operation stable, a cooling system for quickly releasing a large amount of heat generated by the CPU or the like to the outside has become very important.

  For cooling the computer, an electric heating pad, a heat sink, a heat pipe, a cooling fan, or the like is used alone or in combination. Conventionally, in the case of a high-performance computer having a large heat generation amount, particularly in the case of a desktop computer, it is common to directly cool the CPU having the largest heat generation amount inside the main body with an axial fan or a flat fan. In order to directly cool the CPU with an axial fan, a heat sink is disposed in the middle. In this case, in order to take cooling air into the computer, a large number of air intake holes are provided on the front or side of the housing.

  In order to improve the cooling effect, a computer cooling device using a cross-flow fan has been proposed (see, for example, Patent Document 1).

  In this case, in addition to the axial fan or flat fan that directly cools the CPU, a cross-flow fan that has a discharge width that is sufficient to allow direct discharge air to be directly applied to the heat generating member attached to the motherboard is provided. The fan blows the discharge air directly or near the heat generating member to promote the replacement of air around the heat generating member so that hot air does not stay in the vicinity of the motherboard. In order to introduce outside air, a large number of air intake holes are provided in the side panel of the computer casing.

Further, a heat dissipating mechanism has been proposed in which the heat generating electronic component and the heat sink are arranged apart from each other (for example, see Patent Document 2).
In this case, a through hole is provided in the mother board, and the heat pipe connected to the fan-equipped sheet sink is extended to the back surface of the mother board using the through hole. A heat pipe is connected to the side surface of the fan seat sink. The heat pipe extends from the upper surface of the motherboard to the back surface of the motherboard through the through hole. The heat pipe is connected to the heat-generating electronic component on the back surface side. Thereby, the heat of the heat generating electronic component is moved to the sheet sink with the fan, and the heat transmitted by the heat pipe is radiated by the cooling fan.

Japanese Patent Laid-Open No. 2003-306186 (pages 2, 3 and 1) JP 2004-40125 A (page 7, FIG. 6)

  As described above, the problem of heat generation accompanying the increase in computer specifications has become more serious every year. When the conventional cooling method (Patent Document 1) is continuously adopted, it cannot be sufficiently cooled. In addition, since a large amount of air intake holes are provided on the front or side of the housing in order to take cooling air into the computer, there is a drawback that the aesthetics are impaired in terms of design.

  In the case of Patent Document 2, since the heat-generating electronic component and the heat sink are arranged on the same substrate, no great stress is applied to the heat pipe and the motherboard, but the heat sink is arranged at a position other than the motherboard. In such a case, there is a problem that stress is applied to the heat pipe and parts of the cooling unit may be damaged.

  In addition, when the heat sink is disposed at a position other than the motherboard, it is difficult to manage the dimensions during manufacture.

  Therefore, the present invention can realize efficient cooling, does not put extra stress on the heat pipe and the mother board, can suppress the damage of parts due to the stress, and can easily manage the dimensions during manufacturing. An object of the present invention is to provide a cooling unit mounting structure and a desktop computer which can be performed.

  The cooling unit mounting structure according to the present invention is a cooling unit mounting structure to be incorporated in a housing of a desktop computer, and includes a motherboard on which a processor is arranged, a cooling fan, a heat sink, and a heat pipe, and generates heat generated by the processor. A cooling unit that dissipates and a back panel that can be attached to and detached from the housing, the processor and the heat sink are arranged apart from each other, and are thermally connected by a heat pipe, and the motherboard, the cooling unit, and the back panel are The assembly unit is assembled in advance as one assembly unit, and the assembly unit is detachably incorporated from the back surface of the housing.

  The desktop computer according to the present invention is a desktop computer having a motherboard on which a processor is disposed and a housing in which a power supply unit is stored, and includes a cooling fan, a heat sink, and a heat pipe, and dissipates heat generated by the processor. The cooling unit and a back panel that can be attached to and detached from the housing are provided. The processor and the heat sink are arranged apart from each other and thermally connected by a heat pipe, and the motherboard, the cooling unit, and the back panel are preliminarily connected. It is assembled as one assembly unit, and the assembly unit is detachably incorporated from the back surface of the housing.

  For example, the heat sink is attached to the heat sink cover via an elastic material such as foamed urethane rubber, and can move within a predetermined range in the heat sink cover. Further, the assembly unit is locked by mounting the power supply unit on the housing.

  In addition, for example, a through portion in which a plurality of air intake holes for penetrating the housing from the side surface of the housing and introducing external air into the housing are provided on the wall, and the interior of the housing is vertically moved to the position of the through portion A chassis divided into two spaces is further provided. The processor and the heat sink are arranged apart from each other through the chassis and are thermally connected by a heat pipe.

  In the present invention, the processor and the heat sink are arranged apart from each other and thermally connected by a heat pipe, and a motherboard on which the processor is arranged and a cooling unit for dissipating heat generated by the processor are preliminarily provided on the rear panel of the desktop computer. And is detachably assembled as a single assembly unit from the rear surface of the housing.

  Thereby, efficient cooling can be realized. In addition, it is possible to suppress damage to parts due to stress without applying extra stress to the heat pipe and the mother board. In addition, by assembling the heat sink, the heat pipe, and the mother board in advance, it becomes possible to easily manage the dimensions during manufacturing.

  In addition, an air intake for introducing cooling air into the front or side panel of the desktop computer casing by providing a penetrating portion that penetrates the casing from the side surface of the desktop computer casing and has a predetermined cross-sectional area. The air intake area can be secured without arranging the holes, and the air intake holes are provided in a place that cannot be directly seen, so that the cooling efficiency can be improved and the design can be improved.

  Further, since the assembly unit is detachably incorporated from the back surface of the housing, the assembly unit can be pulled out of the housing and opened in an open space when expanding to the motherboard.

  In addition, since the heat sink is floatingly supported on the heat sink cover via an elastic material such as urethane foam rubber, it is possible to take out the dimensions of the component configuration.

  According to the cooling unit mounting structure and the desktop computer according to the present invention, the motherboard includes a motherboard on which the processor is arranged, a cooling unit that dissipates heat generated by the processor, and a back panel that covers the back of the housing of the desktop computer. The processor and the heat sink are arranged apart from each other and thermally connected by a heat pipe, and the motherboard, the cooling unit, and the back panel are assembled in advance as one assembly unit, and the assembly unit is assembled from the back side of the housing. As well as being able to realize efficient cooling, heat pipes and motherboards are not subjected to excessive stress, damage to parts due to stress can be suppressed, and dimensional management during manufacturing can be easily performed. Can

  Hereinafter, a cooling unit mounting structure and a desktop computer (hereinafter referred to as a computer) according to embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing an outline of a computer 100 according to the embodiment of this invention. The computer 100 is a desktop computer provided with an air intake 13 as a through-hole in which a plurality of intake holes for introducing external air into the housing 10 are provided on the wall.

  As shown in FIG. 1, an air intake 13 is provided at a predetermined position of the side panel 12 in the housing 10 of the computer 100. The air intake 13 has a rectangular cross section and is provided with a plurality of intake holes 14A and 14B for introducing external air into the housing 10 on the side surface and the top surface.

  FIG. 2 is a view showing the arrangement position of the intake holes of the air intake. FIG. 2 is a sectional view of the air intake 13 part. FIG. 2A is a side view of the computer 100. FIG. 2B is a horizontal cross section (A-A ′ cross section) of the air intake 13. FIG. 2C is a vertical cross section (B-B ′ cross section) of the air intake 13.

  As shown in FIG. 2B, the top surface 13 </ b> B of the air intake 13 is provided with a plurality of intake holes 14 </ b> B for introducing external air into the housing 10. As shown in FIG. 2C, a plurality of intake holes 14 </ b> A for introducing external air into the housing 10 are provided on both side surfaces 13 </ b> A of the air intake 13. In this example, the intake holes 14A are a plurality of long holes, and the intake holes 14B are a plurality of round holes. As a result, an intake area can be ensured without disposing an intake hole for introducing cooling air into the front panel 11 or the side panel 12 of the computer 100. Further, the intake holes 14A and 14B are provided in a place where they cannot be directly seen. In addition, as shown in FIG. 2, in order to improve the effect of a design surface, the air intake 13 is made into the shape where opening expands to the side panel 12 side. In addition, the air intake 13 has a predetermined cross-sectional area so that the arrangement of the intake holes and the intake area can be secured.

  FIG. 3 is a cross-sectional view showing a configuration example of the computer 100 according to the embodiment of this invention. The arrows in FIG. 3 indicate the flow of cooling air.

  As shown in FIG. 3, the computer 100 includes an air intake 13, a motherboard 20 provided with a CPU 21 as a processor, a heat sink 22, a heat pipe 23, a cooling fan 24, a hard disk (HDD) 25, a power source. The unit 26 includes a graphic board 27, optical drives 28 and 29, a floppy (registered trademark) drive 30, and a chassis 31.

  The housing 10 is divided into two upper and lower spaces (10A, 10B) by the chassis 31. An air intake 13 is provided on the chassis 31.

  Further, one end of the chassis 31 is fixed to the front panel 11 of the casing 10, and the other end is fixed to the rear chassis of the casing 10. A through hole 31A for connecting the upper space 10A and the lower space 10B is provided on the front panel 11 side of the chassis 31.

  In the upper space 10A, a heat sink 22, a cooling fan 24, and optical drives 28 and 29 are arranged. A cooling fan 24 is disposed between the heat sink 22 and the air intake 13. The cooling fan 24 can suck external air from the intake holes 14A and 14B provided in the side surface 13A and the top surface 13B of the air intake 13. Air having the same temperature as the room temperature is directly supplied to the cooling fan 24.

  Further, by arranging the heat sink 22 and the cooling fan 24 in the upper space 10A, the casing 10 is used to the maximum width, and the heat sink 22 and the cooling fan 24 are large. In particular, a large size (for example, 120 mm) fan is used as the cooling fan 24. Therefore, the noise of the cooling fan 24 can be reduced.

  In the lower space 10B, a mother board 20, a hard disk 25, a power supply unit 26, a graphic board 27, and a floppy (registered trademark) drive 30 are arranged. Note that another hard disk may be added at the position of the floppy (registered trademark) drive 30. The CPU 21 and the heat sink 22 are thermally connected by a heat pipe 23. Thereby, the heat generated by the CPU 21 is conducted to the heat sink 22 via the heat pipe 23. The heat carried to the heat sink 22 is cooled by the cooling fan 24. In this case, the waste heat air is exhausted from an exhaust port in the rear panel 15 of the housing 10.

  As shown in FIG. 3, when the computer 100 operates, cooling air is sucked from the side surface 13 </ b> A on the back side of the air intake 13 and the top surface 13 </ b> B by the cooling fan 24. In addition, the cooling air is sucked from the front side surface 13A of the air intake 13 by the fan 26F attached to the power supply unit 26 and introduced into the lower space 10B through the through hole 31A provided in the chassis 31. And it discharges from the exhaust port in the back panel 15 of the housing | casing 10. FIG. Thereby, the cooling air can be easily introduced into the lower space 10B. Further, the cooling air can cool components such as the hard disk 25, the power supply unit 26, and the graphic board 27 that are arranged in the lower space 10B.

  FIG. 4 is a cross-sectional view of the lower space 10B. The arrows in FIG. 4 indicate the cooling air passages. As shown in FIG. 4, in the lower space 10 </ b> B, the cooling air enters the power supply unit 26 via the hard disk 25 and is discharged from the back surface of the housing 10.

  FIG. 5 is a diagram illustrating a configuration example of the assembly unit. As shown in FIG. 5, a cooling unit including a heat sink 22, a heat pipe 23, and a cooling fan 24 is attached to the back panel 15. Further, the motherboard 20 on which the CPU 21 is mounted is also attached to the rear panel (rear chassis) 15. The heat sink 22 and the CPU 21 are connected via a heat pipe 23. In this example, the graphic board 27 is also attached to the back panel 15. Thus, the assembly unit 40 is configured. The assembly unit 40 can be assembled from the rear surface of the housing 10 in a detachable manner.

  FIG. 6 is a diagram illustrating a configuration example of the back panel 15 of the computer 100. As shown in FIG. 6, the upper portion of the back panel 15 is provided with an exhaust port for discharging cooling air from the cooling fan 24. A cooling unit, a mother board 20 and a graphic board 27 which are attached in advance are attached to the back panel 15.

  FIG. 7 is a side view showing an assembled state of the heat sink 22. As shown in FIG. 7, the heat sink 22 is fixed to the heat sink cover 16 in a state of being floated via a urethane foam rubber part 17 as an elastic material. Here, the urethane foam rubber part 17 is formed in a quadrangular or circular shape having a central hole. The two urethane foam rubber components 17 are fitted into the exposed heat pipes 23 at the upper and lower ends of the heat sink 22 and are disposed in the fixing recesses 18 of the heat sink cover 16.

  FIG. 8 is a front view showing an assembled state of the heat sink 22. As shown in FIG. 8, urethane foam rubber parts 17 are provided at the upper and lower ends of the heat pipes 23 arranged on both sides of the heat sink 22.

  With this configuration, the heat sink cover 16 and the back panel 15 are fixed, but the heat sink 22 can move within a predetermined range within the heat sink cover 16.

  FIG. 9 is a perspective view showing a state where the assembly unit 40 is pulled out from the housing 10. As shown in FIG. 9, the cooling unit including the heat sink 22, the heat pipe 23, and the cooling fan 24, the motherboard 20 and the graphic board 27 can be pulled out from the housing 10 together. In addition, fixing screw holes 19 a and 19 b are provided in the lower part of the assembly unit 40 and inside the front end side of the housing 10. The assembly unit 40 can be fixed with one fixing screw.

  Thus, in the present embodiment, the computer 100 has the air intake 13 that penetrates the case 10 from the side surface 12 of the case 10 and has a predetermined cross-sectional area. The side surface 13A and the top surface 13B of the air intake 13 are provided. In addition, a plurality of intake holes 14A, 14B for introducing external air are provided. In addition, the CPU 21 and the heat sink 22 are arranged apart from each other via a chassis 31 and are thermally connected by a heat pipe 23, and a motherboard 20 on which the CPU 21 is arranged and a cooling unit that dissipates heat generated by the CPU 21 are provided. It is mounted on the rear panel 15 in advance and is assembled as a single assembly unit 40 so as to be detachable from the rear surface of the housing 10.

  Thereby, efficient cooling is realizable. In addition, it is possible to suppress damage to parts due to stress without applying extra stress to the heat pipe 23 and the motherboard 20. Further, by assembling the heat sink 22, the heat pipe 23, and the mother board 20 in advance, it is possible to easily manage the dimensions during manufacturing.

  Further, by providing the air intake 13 in the computer 100, it is possible to secure an intake area without arranging an intake hole for introducing cooling air in the front or side panel of the casing 10 of the computer 100, or directly. Since the intake hole is provided in a place that cannot be seen, the cooling efficiency can be improved and the design can be improved. Further, since the chassis 31 is provided substantially at the center of the housing 10, the strength of the housing 10 itself can be improved.

  Further, since the assembly unit 40 is detachably incorporated from the back surface of the housing 10, when the expansion to the mother board 20 is performed, the assembly unit 40 can be pulled out from the housing 10 and performed in an open space.

  Further, since the heat sink 22 is floatingly supported by the heat sink cover 16 via the foamed urethane rubber component 17, the clearance of the component configuration can be taken.

  In the above-described embodiment, the computer 100 has been described with the air intake 13 provided, but the present invention is not limited to this. The present invention can also be applied to a desktop computer in which another heat sink is disposed at a position other than the motherboard.

  In the above-described embodiment, the urethane foam rubber part 17 is used as the elastic material. However, the present invention is not limited to this. Other elastic materials may be used.

  As described above, the cooling unit mounting structure and the desktop computer according to the present invention can be applied to a desktop computer in which the heat sink is arranged at a position other than the motherboard.

It is a figure which shows the external shape of the computer 100 of embodiment. It is a figure which shows the arrangement position of the air intake hole of an air intake. 2 is a cross-sectional view illustrating a configuration example of a computer 100. FIG. It is sectional drawing of lower space 10B. It is a figure which shows the structural example of an assembly unit. 2 is a diagram illustrating a configuration example of a back panel 15 of a computer 100. FIG. 3 is a side view showing an assembled state of the heat sink 22. FIG. It is a front view which shows the assembly state of the heat sink. 4 is a perspective view showing a state where the assembly unit 40 is pulled out. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Housing, 11 ... Front panel, 12 ... Side panel, 13 ... Air intake, 13A, 16A ... Side, 13B, 16B ... Top surface, Intake hole, 14A, 14B: intake hole, 15 ... back panel, 16 ... heat sink cover, 17 ... urethane foam rubber part, 18 ... recess, 19a, 19b ... fixing screw hole, 20 ..Motherboard, 21 ... CPU, 22 ... heat sink, 23 ... heat pipe, 24 ... cooling fan, 25 ... hard disk, 26 ... power supply unit, 26F ... fan, 27 ... Graphic board, 28, 29 ... Optical drive, 30 ... Floppy (registered trademark) drive, 31 ... Chassis, 31A ... Through hole, 40 ... Assembly unit , 100 ... computer

Claims (8)

In the cooling unit mounting structure built into the housing of the desktop computer,
A motherboard on which the processor is placed;
A cooling unit having a cooling fan, a heat sink, a heat pipe, and dissipating heat generated by the processor;
A back panel covering the back of the housing,
The processor and the heat sink are spaced apart and thermally connected by the heat pipe,
The cooling unit mounting structure, wherein the mother board, the cooling unit, and the back panel are assembled in advance as one assembly unit, and the assembly unit is detachably mounted from the back surface of the housing. The heat sink
The cooling unit mounting structure according to claim 1, wherein the cooling unit mounting structure is attached to the heat sink cover via an elastic material and can move within a predetermined range in the heat sink cover. The cooling unit mounting structure according to claim 3, wherein the elastic material is made of urethane foam rubber. In a desktop computer having a motherboard on which a processor is arranged and a casing in which a power supply unit is stored,
A cooling unit having a cooling fan, a heat sink, a heat pipe, and dissipating heat generated by the processor;
A back panel covering the back of the housing,
The processor and the heat sink are spaced apart and thermally connected by the heat pipe,
The desktop computer, wherein the mother board, the cooling unit, and the back panel are assembled in advance as one assembly unit, and the assembly unit is detachably incorporated from the rear surface of the housing. The heat sink
The desktop computer according to claim 4, wherein the desktop computer is attached to the heat sink cover via an elastic material and can move within a predetermined range in the heat sink cover. The desktop computer according to claim 4, wherein the elastic material is made of urethane foam rubber. The desktop computer according to claim 4, wherein the assembly unit is locked by attaching the power supply unit to the housing. A through portion provided with a plurality of intake holes for penetrating the housing from the side surface of the housing and introducing external air into the housing on the wall;
A chassis that divides the interior of the housing into two upper and lower spaces at the position of the penetrating portion; and
The desktop computer according to claim 4, wherein the processor and the heat sink are spaced apart via the chassis and are thermally connected by the heat pipe.

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