JP3110951U - Internally installed cooling device for electronic equipment, and electronic equipment in which the cooling device is installed - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an internally installed cooling device capable of lowering the temperature in a housing of an electronic device, and an electronic device having the cooling device.
An internally installed cooling apparatus includes a cooling unit and a holding unit, and the cooling unit includes a first cooling unit, a second cooling unit, and a low temperature element. . The low temperature element 21 has a low temperature surface 22 in contact with the first cooling unit 24 and a high temperature surface 23 in contact with the second cooling unit 25. Since the low temperature surface 22 of the low temperature element 21 has a temperature lower than room temperature, the first cooling unit 24 can generate cold and dry air to lower the temperature of the electronic device 3. On the other hand, the second cooling unit 25 is used to dissipate heat generated from the low temperature element 21.
[Selection] Figure 7

Description

  The present invention relates to an internal installation type cooling device, and more particularly, to a cooling device installed in an electronic device and an electronic device in which the cooling device is installed.

  Recent electronic devices such as computer mainframes and communication devices have various high-speed computing elements. Electronic equipment is usually in the housing, and heat generated by the computing elements of the electronic equipment is stored in the housing, thus increasing the temperature in the housing. Under such a high temperature environment, the electronic device may output an incorrect result and may be damaged. Therefore, a cooling device for lowering the temperature is generally required for electronic equipment.

  The most common method for cooling an electronic device is to install a cooling fan in the housing of the electronic device. The cooling fan guides outside air into the housing, thereby lowering the temperature in the housing.

  However, in this method, room temperature outside air is only introduced into the electronic device. However, the room temperature in summer is about 35 ° C. and may not be sufficient for cooling electronic devices.

  Therefore, no matter how many cooling fans are installed, the heat in the housing of the electronic device is not dissipated and is not effective.

  In addition, the housing of the electronic device is not provided with sufficient space for installing many cooling fans.

Conventionally, various cooling devices used for a computer frame have been disclosed. For example, Patent Document 1 and Patent Document 2 disclose a detachment installed in one slot of a computer case for a hard disk drive or an optical disk drive. A possible cooling device is disclosed.
Taiwan Patent No. 505378 Taiwan Patent No. 526959

  However, many modern computer systems, such as the minimum required system, have at most two slots for hard disk drives and optical disk drives. Thus, there are often no extra slots for installing something like a cooling device.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an internally installed cooling device that can lower the temperature in the housing of an electronic device.

  Furthermore, an object of the present invention is to provide an internally installed cooling device having a low temperature element.

  Another object of the present invention is to provide an electronic device having an internally installed cooling device that can lower the temperature in the housing of the electronic device.

  The cooling device generates heat from the low temperature element and dissipates the heat in the housing of the electronic device.

  Therefore, the cooling device of the present invention has a cooling unit and a holding unit. The cooling unit includes a first cooling unit, a second cooling unit, and a low temperature element. The low temperature element has a low temperature surface and a high temperature surface, the temperature of the low temperature surface is lower than room temperature, and the heat generated from the low temperature element is dissipated from the high temperature surface. The holding part has a top wall and a plurality of side walls. In the central part of the top wall, an opening for installing a low-temperature element of the cooling part is formed. The top wall and the side wall define an air passage. The first cooling unit is connected to the second cooling unit, and the top wall and the low temperature element are sandwiched between them. As a result, the first cooling unit touches the cold surface and the second cooling unit touches the hot surface. Further, the first cooling fan is installed corresponding to the first cooling unit, and generates cold air for cooling the electronic device. Similarly, the second cooling fan is installed corresponding to the second cooling unit and keeps the low temperature element operating below the working temperature.

  The cooling device according to the present invention configured as described above and the electronic device provided with the cooling device do not lead air into the housing of the electronic device because heat generated from the low temperature element is radiated from the high temperature surface. In addition, heat can be radiated through the second cooling unit.

  Embodiments of the present invention will be described with reference to the drawings.

  1 to 6 show an internally installed cooling device according to a first embodiment of the present invention.

  FIG. 1 is an exploded perspective view of a cooling device according to the first embodiment of the present invention, and FIG. 2 is a perspective view of the cooling device according to the first embodiment of the present invention.

  As shown in FIGS. 1 and 2, the cooling device includes a holding unit 1 and a cooling unit 2. The cooling unit 2 includes a first cooling unit 24, a second cooling unit 25, and a low temperature element 21. In this embodiment, the first cooling unit 24 and the second cooling unit 25 are cooling fin assemblies as shown in FIGS.

  The low temperature element 21 has a low temperature chip having a low temperature surface 22 in contact with the first cooling unit 24 and a high temperature surface 23 in contact with the second cooling unit 25.

  The holding unit 1 has a top wall 11 and a plurality of side walls 12.

  The opening 13 is formed in the central portion of the top wall 11 in order to install the low temperature element 21 of the cooling unit 2.

  The top wall 11 and the side wall 12 define an air passage 14. In addition, each of the top wall 11 and the side wall 12 has at least one protrusion 15.

  The protrusion 15 is used for installing a cooling device in the electronic apparatus.

  The first cooling unit 24 and the second cooling unit 25 are firmly connected to each other by a plurality of screws 26 and sandwich the top wall 11 and the low temperature element 21 therebetween.

  3 is an exploded perspective view of the electronic device 3 having the cooling device according to the first embodiment of the present invention, and FIG. 4 is a perspective view of the electronic device 3 having the cooling device according to the first embodiment of the present invention. .

  The electronic device 3 has a housing 31 including a plurality of calculation elements. The housing 31 has a first air intake port 32, a second air intake port 33, and a high temperature air discharge hole 34. When the cooling device is installed in the housing 31 of the electronic device 3, the first cooling unit 24 of the cooling device is arranged corresponding to the first air intake port 32. The second cooling unit 25 of the cooling device is disposed corresponding to the second air intake port 33.

  In addition, the outlet of the air passage 14 is disposed corresponding to the air discharge hole 34. Here, the outlet of the air passage 14 means an opening that guides air to flow outside.

  Further, the first cooling fan 41 is installed in the housing 31 corresponding to the first air intake 32, and the second cooling fan 42 is installed in the housing 31 corresponding to the second air intake 33.

  FIG. 5 is a perspective view of the electronic apparatus 3 having the cooling device and the cover plate 39 according to the first embodiment of the present invention.

  The cover plate 39 has a plurality of holes 38 corresponding to the first cooling fan 41 and the second cooling fan 42, so that air can be guided into the housing 31.

  FIG. 6 is a partial cross-sectional view of the electronic apparatus 3 according to the first embodiment of the present invention.

  As shown in the drawing, the electronic device 3 has a plurality of pads 37 installed on the bottom of the housing 31. The pad 37 raises the electronic device 3 and plays a role of leaving a space for guiding the air to the outside through the high-temperature air discharge hole 34.

  FIG. 7 is a partial cross-sectional view schematically showing the operation of the cooling device according to the first embodiment of the present invention.

  As shown in the figure, the first cooling fan 41 guides room temperature air from the surroundings into the housing 31. Air flows through the first cooling unit 24.

  Since the first cooling unit 24 contacts the cold surface 22 of the cold element 21, the temperature of the cooling unit 24 is much lower than air. After the air flows through the first cooling unit 24, it cools and dries so that the electronic equipment can be effectively cooled.

  The cold element 21 provides a cold surface 22 that is significantly cooler than room temperature, while the hot surface 23 generates heat. Therefore, the heat generated from the high temperature surface 23 radiating heat of the low temperature element 21 is transmitted to the second cooling unit 25 in contact with the high temperature surface 23. By introducing air into the second cooling unit 25 using the second cooling fan 42, the second cooling unit 25 is cooled and the low temperature chip continues to operate below the working temperature.

  FIG. 8 is a partial cross-sectional view showing an electronic apparatus 3 according to the second embodiment of the present invention.

  As shown in the figure, the cooling device is installed in the electronic device 3. In this embodiment, the cooling device is rotated 90 degrees clockwise. Although the arrangement of the cooling device of the second embodiment is different from that of the first embodiment, other features and functions are substantially the same.

  FIG. 9 is a schematic view showing a cooling device in which the electronic device is installed at another position.

  As shown in the figure, the cooling device is installed at the rear of the electronic device 3.

  Although two positions where the cooling device can be installed are shown, it is also possible to install the cooling device at other positions.

  FIG. 10 is a sectional view showing a cooling device according to the third embodiment of the present invention.

  As shown in the figure, in order to form a free space under the base 35 of the housing 31, a stand 30 is provided to support and raise the electronic device 3. Free space is used to define the air passage 14.

  The through hole 36 is formed in the base 35 in order to directly install the cooling unit 2 on the base 35, and divides the cooling unit 2 into a low temperature surface 22 and a high temperature surface 23.

  Further, the first air intake 32 is formed in the housing 31 of the electronic device corresponding to the position of the low temperature surface 22 of the cooling unit 2.

  The second air intake 33 is formed in the decorative front cover 5 corresponding to the air passage 14, and the high temperature surface 23 of the cooling unit 2 is disposed there.

  As a result, the second cooling unit 25 of the cooling device is arranged completely outside the housing 31 of the electronic device.

  In this way, the heat generated from the low-temperature chip 21 can be radiated through the second cooling unit 25 without introducing air into the housing 31 of the electronic device 3.

  The present invention is not limited to the above description, and many other modifications and improvements can be made by those having ordinary knowledge in the art. Should be interpreted.

  Therefore, the present invention can be variously modified within the scope of the claims for utility model registration without departing from the basic technical idea of the present invention.

The disassembled perspective view of the cooling device which concerns on the 1st Embodiment of this invention is shown. The perspective view of the cooling device concerning a 1st embodiment of the present invention is shown. 1 is an exploded perspective view of an electronic device having a cooling device according to a first embodiment of the present invention. The perspective view of the electronic device which has a cooling device concerning a 1st embodiment of the present invention is shown. 1 is a perspective view of an electronic apparatus having a cooling device and a cover plate according to a first embodiment of the present invention. 1 is a partial cross-sectional view of an electronic device according to a first embodiment of the present invention. It is a fragmentary sectional view which shows roughly the effect | action of the cooling device which concerns on the 1st Embodiment of this invention. It is a fragmentary sectional view which shows the electronic device which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the cooling device with which the electronic device was installed in the other position. These are sectional drawings which show the cooling device concerning the 3rd Embodiment of this invention.

Explanation of symbols

1 holding part,
2 cooling section,
3 Electronic equipment,
11 Top wall,
12 side walls,
13 opening,
14 Air passage,
15 protrusions,
21 low temperature elements,
22 cold surface,
23 hot surface,
24 first cooling unit,
25 second cooling unit,
31 housing,
32 1st air intake,
33 Second air intake,
34 Hot air discharge hole,
35 Basics,
39 Cover plate,
41 1st cooling fan,
42 Second cooling fan.

Claims (10)

A cooling unit comprising a first cooling unit, a second cooling unit, and a low temperature element;
A top wall and a plurality of side walls, the top wall having an opening for installing the cryogenic element, and the top wall and the side wall forming a holding portion that forms an air passage;
The internally installed cooling device, wherein the first cooling unit is connected to the second cooling unit, and the top wall and the low temperature element are sandwiched therebetween.   2. The internally installed cooling device according to claim 1, wherein the low temperature element includes a low temperature chip having a low temperature surface in contact with the first cooling unit and a high temperature surface in contact with the second cooling unit.   3. The internally installed cooling device according to claim 1, wherein the first cooling unit includes a first cooling fin assembly. 4.   The internally installed cooling device according to any one of claims 1 to 3, wherein the second cooling unit includes a second cooling fin assembly.   5. The internally installed cooling device according to claim 1, wherein a side wall of the holding portion has a protruding portion for installing the cooling device in an electronic device.   The internally installed cooling device according to any one of claims 1 to 5, wherein a top wall of the holding portion has a protruding portion for installing the cooling device in an electronic device.   The first cooling fan installed corresponding to the first cooling unit, and the second cooling fan installed corresponding to the second cooling unit, further comprising: The internally installed cooling device according to 1 above. Said housing comprising a plurality of computing elements and comprising at least one air intake;
A cooling device installed in the housing, the cooling device having a cooling unit including a first cooling unit, a second cooling unit, and a low-temperature element, a top wall and a plurality of side walls; A cooling device having a holding part in which a protrusion is formed on each of the top wall and the side wall for attaching the device;
A first cooling fan installed in the housing corresponding to the first cooling unit and guiding air into the housing via an air intake;
A second cooling fan installed in the housing corresponding to the second cooling unit and guiding air into the air passage via the air intake port,
The top wall has an opening formed in a central portion of the top wall for installing the low temperature element of the cooling unit, and the top wall and the side wall define an air passage. machine.   The low-temperature element has a low-temperature chip including a low-temperature surface in contact with a first cooling fin assembly constituting the first cooling unit and a high-temperature surface in contact with a second cooling fin assembly constituting the second cooling unit. The electronic device according to claim 8, wherein:   The front surface of the housing has a cover plate, and the cover plate has a plurality of holes formed corresponding to the first cooling fan and the second cooling fan, and guides air into the housing. The electronic device according to claim 8, wherein the electronic device can be used.

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