JP2005319503A - Metallic member joining method, heat exchange plate manufacturing method, and heat exchanger manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metallic member joining method in which metallic members are tightly attached to and joined with each other while an air layer is hardly formed, a heat exchange plate manufacturing method, and a heat exchanger manufacturing method. <P>SOLUTION: In the manufacturing method of a heat exchange plate 10 in which a first metallic member 11 and a second metallic member 12 are joined with each other, and a flow passage 10a is formed inside, the manufacturing method of the heat exchange plate 10 comprises a plating step of providing a plating layer 13 by performing the plating on one side 11a of the first metallic member 11 with a metal having the melting point lower than a metal to form the first metallic member 11 and a metal to form the second metallic member 12, a groove forming step of forming a groove 14 to form a flow passage 10a in the first metallic member 11 while removing a part of the plating layer 13, and a joining step of joining the first metallic member 11 with the second metallic member 12 with friction heat by overlapping the second metallic member 12 so as to cover the groove 14, and pressing a rotating tool T1 against the second metallic member 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for joining metal members, a method for producing a heat exchange plate, and a method for producing a heat exchanger.

Conventionally, a solder joining method using solder is known as a method for joining metal members together. In addition, the present applicant has proposed a “member joining method” in which the base plate and the fin are joined by pressing the circumferential surface of a tool rotating in the circumferential direction against the base plate (see Patent Document 1).
Japanese Patent Laying-Open No. 2003-275875 (paragraphs 0034 to 0068, FIG. 1, etc.)

  However, in the solder joining method, after joining, air bubbles are mixed in the joint portion between the metal members, and an air layer formed by the aggregation of the air bubbles is formed, resulting in a decrease in thermal conductivity and electrical conductivity. was there. In particular, when the surfaces of the metal members are joined, the air layer is formed remarkably, and the thermal conductivity is lowered. Moreover, it is difficult to control the thickness of the solder to a predetermined value, and as a result, variations in thermal conductivity and electrical conductivity have occurred.

  Then, this invention makes it the 1st subject to provide the joining method of the metal member which can join the metal members closely, without forming an air layer, in order to solve the said problem. Moreover, it is set as the 2nd subject to provide the manufacturing method of the heat exchange board using the joining method of this metal member, and the manufacturing method of a heat exchanger.

  As a means for solving the above-mentioned problem, the invention according to claim 1 is a method for joining two metal members, wherein at least one of the two metal members is joined. Plating with a metal having a melting point lower than that of the metal forming the two metal members, and providing a plating layer; overlapping the two metal members; pressing a rotating tool against the metal member; And a joining step for joining the two metal members.

According to such a method for joining metal members, simply by pressing a rotating tool against the metal member and applying pressure, the plating layer is easily melted by frictional heat, and the two metal members are in close contact with each other. can do. Moreover, it is difficult to form an air layer due to the pressurization. Therefore, a joint having high thermal conductivity and high electrical conductivity can be obtained.
In addition, the plating layer is made of a metal with a low melting point and melts easily, so the pressing force (pressing force) of the tool is lowered, or the joining speed (for example, the tool moving speed when moving the tool) Even if the metal that presses the tool is thick, it can be joined.
Furthermore, the plating layer can be formed by, for example, an electroplating method. In this case, the thickness of the plating layer is precisely controlled by controlling the current density and plating time, thereby forming a thin plating layer. You can also Therefore, the thermal conductivity and electrical conductivity do not vary after joining.

Here, the metal to be plated is preferably a metal that undergoes a eutectic reaction or a peritectic reaction with a metal that forms a metal member to be joined.
Moreover, the metal in this specification includes not only a pure metal containing no impurities but also an alloy. That is, for example, the metal forming the metal member or the low melting point metal may be either a pure metal or an alloy.

  The invention according to claim 2 is the metal member joining method according to claim 1, wherein the plating layer has a thickness of 1 to 30 μm.

  According to such a joining method of a metal member, a metal member can be more favorably joined because the thickness of a plating layer shall be 1-30 micrometers.

  The invention according to claim 3 is a method of manufacturing a heat exchange plate having a flow path through which a fluid flows, wherein a plate-like first metal member and a plate-like second metal member are joined. A plating step of plating on one side of the first metal member with a metal having a melting point lower than that of the metal forming the first metal member and the metal forming the second metal member, and providing a plating layer; , While removing a part of the plating layer, a groove forming step of forming a groove to be the flow path in the first metal member, and the second metal member are overlapped so as to cover the groove, A bonding step of pressing a rotating tool against at least one of the first metal member and the second metal member and bonding the first metal member and the second metal member by frictional heat. It is a manufacturing method of the heat exchange board which makes it.

  According to such a method for manufacturing a heat exchange plate, the first metal member and the second member are brought into close contact with each other simply by pressing and rotating a rotating tool against at least one of the first metal member and the second metal member. It is possible to obtain a heat exchange plate that is satisfactorily bonded in the above state. Moreover, it is difficult to form an air layer due to the pressurization.

  The invention according to claim 4 comprises: a metal base plate having a groove on one surface side; and a metal pipe member that fits into the groove and is joined to the metal base plate, the hollow portion of the metal pipe member A method of manufacturing a heat exchange plate in which a fluid flows, wherein a metal forming the metal base plate and a metal forming the metal pipe member are formed on at least one joint surface of the metal base plate and the metal pipe member. Plating with a low melting point metal and providing a plating layer, a fitting step of fitting the metal pipe member into the groove of the metal base plate, and rotation on the other surface of the metal base plate And a joining step of joining the metal base plate and the metal pipe member by frictional heat while pressing a tool to be manufactured.

  According to such a method for manufacturing a heat exchange plate, heat exchange is performed by pressing the rotating tool against the metal base plate and pressurizing it, and the metal base plate and the metal pipe member are in close contact with each other. A board can be obtained. Moreover, it is difficult to form an air layer due to the pressurization.

  The invention according to claim 5 is the method for manufacturing a heat exchange plate according to claim 3 or 4, wherein the plating layer has a thickness of 1 to 30 µm.

  According to such a method for manufacturing a heat exchange plate, the thickness of the plating layer is set to 1 to 30 μm so that the first metal member and the second metal member, or the metal base plate and the metal pipe member are suitably used. Can be joined.

  According to the heat exchange plate thus manufactured, the first metal member and the second metal member, or the metal base plate and the metal pipe member are joined in close contact with each other. The thermal conductivity and electrical conductivity between the 1 gold member and the second metal member or between the metal base plate and the metal pipe member are extremely high. Therefore, heat can be suitably exchanged between this fluid and the heat exchange plate by circulating a high-temperature or low-temperature fluid through the groove of the first metal member or the hollow portion of the metal pipe member.

  The invention according to claim 6 includes: a fin joining step for joining a plurality of fins to one surface of the first metal base plate; and a second metal base plate having a plating layer on the first metal base plate side, An overlapping step of overlapping the other surface of the first metal base plate, a rotating tool is pressed against the second metal base plate, and the first metal base plate and the second metal base plate are caused by frictional heat. A method of manufacturing a heat exchanger comprising: a metal having a lower melting point than the metal forming the first metal base plate and the metal forming the second metal base plate It is a manufacturing method of the heat exchanger characterized by comprising.

  According to such a method of manufacturing a heat exchanger, a heat exchanger having a base plate formed by bonding the first metal base plate and the second metal base plate in close contact with each other can be obtained. Therefore, when the heat exchanger is used as a radiator (heat radiating member) that radiates heat from a heating element such as a CPU, and the CPU is mounted on the side opposite to the fins of the base plate, the heat of the CPU is the second metal. The base plate, the first metal base plate, and the fins are successfully conducted in this order to dissipate heat.

  Further, according to such a heat exchanger manufacturing method, in the fin joining step, the first metal base plate having a thickness smaller than that of the second metal base plate is used, and the friction vibration joining is performed on the thin first metal base plate. The base plate of the heat exchanger can be partially thickened by bonding the second metal base plate in the bonding step after the fins are bonded well by a method or the like. When the base plate is made thick in this way, as described above, when the heat exchanger is used as a heat radiator of a heating element such as a CPU, the heat of the heating element is suitably conducted through the thick base and radiated from the fins.

  The invention according to claim 7 is the method for manufacturing a heat exchanger according to claim 6, wherein the plating layer has a thickness of 1 to 30 μm.

  According to the manufacturing method of such a heat exchanger, a 1st metal base board and a 2nd metal base board can be joined more suitably because the thickness of a plating layer shall be 1-30 micrometers.

  And according to the heat exchanger manufactured in this way, when used as a heat radiator of heat generating bodies, such as CPU, for example, the heat of a heat generating body can be radiated suitably.

  According to the present invention, there is provided a method for joining metal members, in which an air layer is hardly formed and can be joined in close contact with each other, a method for producing a heat exchange plate using this joining method, and a method for producing a heat exchanger. Can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the drawings.

«First embodiment: heat exchange plate»
First, a heat exchange plate manufacturing method and a heat exchange plate according to a first embodiment will be described with reference to FIGS. 1 and 2. In the drawings to be referred to, FIG. 1 is a process diagram showing the manufacturing method of the heat exchange plate according to the first embodiment step by step, FIG. 1A is a sectional view of the first metal member, and FIG. b) shows the stage of plating, FIG. 1 (c) shows the stage of forming a groove to be a flow path, FIG. 1 (d) shows the stage of overlapping the second metal member, and FIG. FIG. 1 (f) shows a manufactured heat exchange plate, showing a joining step using a tool. FIG. 2 is a perspective view showing an example of a tool used in the joining stage shown in FIG.
In addition, the manufacturing method of the heat exchange plate which concerns on 1st Embodiment is a method using the joining method of the metal member which is this invention, and it demonstrates suitably together. Moreover, the manufacturing method of the heat exchange plate which concerns on 2nd Embodiment mentioned later, and the manufacturing method of the heat radiator which concerns on 3rd Embodiment are also methods using the joining method of the metal member which is this invention.

<Method for producing heat exchange plate>
As shown in FIG. 1, the manufacturing method of the heat exchange plate 10 according to the first embodiment is performed on the upper surface 11 a (one side) which is a joining side of the plate-like first metal member 11 (at least one of the two metal members). From the upper surface 11a side, a plating step for plating the metal forming the first metal member 11 and the metal forming the second metal member 12 with a low melting point metal to form the plating layer 13 A groove forming step for forming the groove 14 to be the flow path 10a in the first metal member 11 and the second metal member 12 are overlapped so as to cover the groove 14, and the second metal member 12 (the first metal member and the first metal member A joining step of joining the first metal member 11 and the second metal member 12 by frictional heat by pressing the rotating tool T1 against the second metal member 12 from the upper surface side of at least one of the two metal members). Have.

  Examples of the metal forming the first metal member 11 and the second metal member 12 include copper, a copper alloy, aluminum, and an aluminum alloy. Further, the metal forming the first metal member 11 and the metal forming the second metal member 12 may be the same type or different types.

[Plating process]
A plating layer 13 is formed on the upper surface 11a of the first metal member 11 shown in FIG. 1 (a) by plating with a predetermined metal with a predetermined thickness as shown in FIG. 1 (b). In general, after plating, in order to prevent rust, a chromate treatment is performed to form a coating film. However, in this embodiment, since the coating failure occurs due to the coating film, the chromate treatment is not performed, so that the bonding failure occurs. It does not occur and prevents the thermal conductivity and electrical conductivity from decreasing.

  As the type of metal to be plated, a metal having a melting point lower than that of the metal forming the first metal member 11 and the second metal member 12 to be joined is selected. The metal to be plated is preferably a metal that undergoes a eutectic reaction or a peritectic reaction with the metals according to the first metal member 11 and the second metal member 12.

  Specifically, for example, when the first metal member 11 and the second metal member 12 are made of copper (melting point: 1084.5 ° C.) or a copper alloy, the metal to be plated is Sn (melting point: 231.97). ° C), Zn (melting point: 419.6 ° C), Mg (melting point: 649 ° C), Al (melting point: 660.37 ° C), and the like. Among these, Sn has a eutectic reaction with Cu, the eutectic temperature in Sn-rich composition is 227 ° C., Zn has a peritectic reaction with Cu, and the peritectic temperature in Zn-rich composition is as low as 424 ° C. It is preferable to select Sn, Zn.

  The thickness of the plating layer 13 is preferably 1 to 30 μm. This is because if the plating layer 13 is less than 1 μm, the first metal member 11 and the second metal member 12 are preferably in close contact with each other and do not join. On the other hand, if the plating layer 13 is thicker than 30 μm, the thermal conductivity after bonding is greatly reduced.

  The plating method is not particularly limited in the present invention, and for example, an electroplating method or a so-called dotting method can be employed. Among these, when the electroplating method is adopted, the thickness of the plating layer 13 can be precisely controlled by controlling the current density and the plating time, and the thin plating layer 13 can be formed. Therefore, the thermal conductivity and electrical conductivity do not vary after joining.

[Groove formation process]
Next, as shown in FIG. 1C, a groove 14 having a predetermined shape is formed at a predetermined depth from the upper surface 11a side of the first metal member 11 by an appropriate cutting method. In addition, this groove | channel 14 becomes the flow path 10a through which fluids, such as water, distribute | circulate after manufacture (refer FIG.1 (f)).
Thus, after plating, the plating layer 13 corresponding to the groove 14 is partially removed by forming the groove 14. Thereby, in the heat exchange board 10 after manufacture, the plating layer 13 is not exposed to the inner surface surrounding the flow path 10a. Therefore, a fluid such as water flowing through the flow path 10a does not come into contact with the plating layer 13, and the metal forming the plating layer 13 can be prevented from eluting into this fluid.

[Jointing process]
Next, as shown in FIG. 1 (d), the plate-like second metal member 12 is overlapped so as to cover the groove 14 from the upper surface 11a side, and overlapped using a predetermined jig or the like. Hold the state.

  Next, as illustrated in FIG. 1E, the tool T <b> 1 that rotates from the upper surface side of the second metal member in a state where the second metal member 12 is superimposed on the first metal member 11 is applied to the second metal member 12. It is moved in a predetermined manner while pressing with a predetermined pressure. Then, frictional heat is generated between the rotating tool T1 and the second metal member 12. This frictional heat is conducted through the second metal member, and the plating layer 13 and a part of the first metal member 11 and a part of the second metal member 12 are melted. After the tool T1 moves, the temperature of the molten metal decreases, and the joint 16 formed by alloying these metals between the first metal member 11 and the second metal member 12 (FIG. 1 (f)). The first metal member 11 and the second metal member 12 are joined.

Here, as described above, since the metal forming the plating layer 13 has a lower melting point than the metal forming the first metal member 11 and the second metal member 12, for example, the pressure for pressing the tool T1 is small. Even if the amount of frictional heat generated due to a high moving speed (joining speed) of the tool T1 or a low rotational speed of the tool T1 is small, the second metal member 12 that presses the tool T1 conducts because it is thick. Even if the amount of frictional heat is small, the plating layer 13 is easily melted. Therefore, the first metal member 11 and the second metal member 12 can be suitably joined in a close contact state.
In addition, when the metal forming the plating layer 13 is selected from the metals related to the first metal member 11 and the second metal member 12 and the eutectic reaction or the peritectic reaction, the first metal member 11 and the first metal member 11 The two metal members 12 are further closely bonded to each other, and the thermal conductivity and electric conductivity after the bonding are increased.

  Further, the tool T1 is pressed and bonded at a predetermined pressure as described above. Further, as described above, since the thickness of the plating layer 13 is uniform, bubbles are not easily mixed into the bonded portion 16. That is, it becomes difficult to form an air layer after joining, and it is possible to prevent thermal conductivity and electrical conductivity from being lowered.

  The tool T1 used in the joining process is not particularly limited as long as frictional heat can be generated in the second metal member 12 by pressing the tool T1 against the second metal member 12, but for example, as shown in FIG. Tool T1 can be used.

As shown in FIG. 2, the tool T1 is, for example, a substantially cylindrical tool attached to the tip of a machine tool (NC machining center) arranged at a predetermined position on the floor surface, and the lower side is a second metal member. Pressed. A spiral protrusion T1a is formed on the lower surface of the tool T1 in order to suitably generate frictional heat in the second metal member. Note that the posture, horizontal and vertical positions, rotational speed, and the like of the tool T1 can be precisely controlled by the machine tool.
However, the tool used in the joining step is not limited to the tool T1 shown in FIG. 2, and is also used in friction vibration joining (see Patent Document 1). The peripheral surface of the rotating tool is the second metal member 12. You may generate | occur | produce friction heat by pressing on. In this case, frictional heat can be efficiently generated by forming grooves and a plurality of protrusions on the peripheral surface of the tool.

  Thus, as shown in FIG. 1 (f), it is possible to manufacture the heat exchange plate 10 in which the first metal member 11 and the second metal member 12 are joined via the joint portion 16.

<Heat exchange plate>
Next, the heat exchange plate 10 manufactured in this way will be briefly described with reference to FIG.
As shown in FIG. 1 (f), the heat exchange plate 10 includes a plate-like first metal member 11 and a plate-like second metal member 12 joined together, and a flow path 10a through which a fluid flows. Have. The fluid flowing through the flow path 10a is appropriately selected according to the usage pattern of the heat exchange plate 10 and may be liquid or gas.

  As one form of use of the heat exchange plate 10, for example, a heat radiator is constituted by the heat exchange plate 10 and a plurality of fins 91 erected on the lower surface 10b (one surface) of the heat exchange plate 10, Further, a fan that blows air to the plurality of fins 91 may be provided to constitute a heat sink that radiates heat from the CPU 92 or the like. In this case, the heat exchange plate 10 is also referred to as a heat sink plate, and a fluid such as water is circulated as a refrigerant through the flow path 10a. The CPU 92 is generally disposed on the upper surface 10c (the other surface) of the heat exchange plate 10.

Since the first metal member 11 and the second metal member 12 are joined in close contact with each other, the thermal conductivity (W / K) and electrical conduction between the first metal member 11 and the second metal member 12 are the same. The degree is extremely high. Therefore, the heat generated from the CPU 92 disposed on the upper surface 10c of the heat exchange plate 10 is suitably conducted over the entire heat exchange plate 10 and is also heat exchanged between the heat exchange plate 10 and water. As a result, the temperature of the heat exchange plate 10 decreases satisfactorily. A part of the heat suitably conducted over the entire heat exchange plate 10 is transmitted to the plurality of fins 91, and the heat transmitted to the fins 91 is radiated from the fins 91 and cooled by the fan.
In addition, the thermal conductivity between the 1st metal member 11 and the 2nd metal member 12 through the junction part 16 is calculated | required by measuring a thermal diffusivity with a laser flash method, for example.

  Therefore, according to such a heat exchange plate 10, heat exchange can be suitably performed between the heat exchange plate 10 and water (fluid) flowing through the flow path 10a.

«Second embodiment: heat exchange plate»
Next, a method for manufacturing a heat exchange plate and a heat exchange plate according to a second embodiment will be described with reference to FIG. FIG. 3 to be referred to is a process diagram showing the manufacturing method of the heat exchange plate according to the second embodiment step by step, and FIG. 3A shows a step in which the metal pipe member is fitted in the groove of the metal base plate. FIG. 3B shows a joining step using a tool, and FIG. 3C is a cross-sectional view of the manufactured heat exchange plate.

<Method for producing heat exchange plate>
As shown in FIG. 3, the manufacturing method of the heat exchange plate 20 according to the second embodiment is different from the first embodiment in that a metal pipe member is formed in the groove 21a on the lower surface (one surface) side of the metal base plate 21. The point which joins 22 mainly differs. In the manufactured heat exchange plate 20, the fluid flows through the hollow portion 22 a of the metal pipe member 22.
The manufacturing method of the heat exchange plate 20 according to the second embodiment includes a metal that forms the metal base plate 21 on the peripheral surface of the metal pipe member 22 (joint surface of at least one of the metal base plate and the metal pipe member), and A plating step of plating the metal forming the metal pipe member 22 with a low melting point metal to form a plating layer 23, and a fitting step of fitting the metal pipe member 22 into the groove 21a of the metal base plate 21; And a joining step of joining the metal base plate 21 and the metal pipe member 22 by frictional heat by pressing the rotating tool T1 on the upper surface (the other surface) of the metal base plate 21.
In addition, as a metal which forms the metal base board 21 and the metal pipe member 22, although a copper, a copper alloy, etc. are mentioned similarly to 1st Embodiment, this invention is not limited.

[Plating process]
The entire circumferential surface of the metal pipe member 22 is plated to form a plating layer 23 (see FIG. 3A). Note that the chromate treatment is not performed also in the second embodiment. Further, the type of metal to be plated is relatively selected as in the first embodiment, and a metal having a melting point lower than that of the metal forming the metal base plate 21 and the metal pipe member 22 to be joined is selected. A metal that undergoes a crystal or peritectic reaction is preferred. Since the thickness of the plating layer 23 and the plating method are the same as those in the first embodiment, description thereof is omitted here.
In the first embodiment, the cross-sectional shape of the metal pipe member 22 is circular as shown in FIG. 3A. However, the present invention is not limited to this, and may be square or the like.

[Mating process]
Then, as shown in FIG. 3A, half of the plated metal pipe member 22 is fitted into the groove 21 a of the metal base plate 21. The metal base plate 21 is formed with a groove 21 a having a shape corresponding to the plated metal pipe member 22. Further, the degree of fitting the metal pipe member 22 into the groove 21a is not limited to half and may be all.

[Jointing process]
Next, as shown in FIG. 3B, the metal base plate 21 fitted with the metal pipe member 22 is placed on a predetermined base (not shown) and rotated to the upper surface side of the metal base plate 21. Move it in place while pressing. Then, as in the first embodiment, frictional heat is generated between the rotating tool T1 and the metal base plate 21. This frictional heat melts part of the plating layer 23, part of the metal base plate 21, and part of the metal pipe member 22. After the tool T1 is moved, the temperature of the molten metal is lowered, and a joint portion 26 formed by alloying these metals between the metal base plate 21 and the metal pipe member 22 (see FIG. 3C). And the metal base plate 21 and the metal pipe member 22 are joined.
Here, as in the first embodiment, the metal forming the plating layer 23 has a lower melting point than the metal forming the metal base plate 21 and the metal pipe member 22, and thus the metal base plate 21, the metal pipe member 22, and the like. Joins well.
Note that the tool T1 to be used is the same as that in the first embodiment, and a description thereof will be omitted here.

  In this way, as shown in FIG. 3C, it is possible to manufacture the heat exchange plate 20 in which the metal base plate 21 and the metal pipe member 22 are joined via the joint portion 26.

<Heat exchange plate>
Next, the heat exchange plate 20 manufactured in this way will be briefly described with reference to FIG.
As shown in FIG. 3C, the heat exchange plate 20 is formed by joining a metal base plate 21 and a metal pipe member 22, and the hollow portion 22a of the metal pipe member 22 becomes a flow path 20a through which fluid flows. ing. That is, in the heat exchange plate 20 according to the second embodiment, since the hollow portion 22a of the metal pipe member 22 becomes the flow path 20a, there is no possibility that the fluid leaks. As in the first embodiment, the fluid is appropriately selected according to the usage pattern of the heat exchange plate 20.

«Third embodiment: heat exchanger»
Next, the manufacturing method of the heat exchanger (heat radiator) which concerns on 3rd Embodiment is demonstrated with reference to FIG. FIGS. 4A and 4B are process diagrams showing the manufacturing method of the heat exchanger according to the third embodiment step by step. FIG. 4A shows the stage of arranging fins on the spacer jig, and FIG. FIG. 4 (c) shows a stage in which one metal base plate is arranged, and FIG. 4 (c) shows a stage in which a tool is pressed against the first metal base plate and the first metal base plate and the fin are joined by frictional vibration joining. d) shows a step of superimposing the plated second metal base plate on the first metal base plate, and FIG. 4 (e) joins the first metal base plate and the second metal base plate with a rotating tool. FIG. 4 (f) shows a stage where the heat exchanger is removed from the spacer jig.

<Manufacturing method of heat exchanger>
As shown in FIG. 4, the manufacturing method of the heat exchanger 30 according to the third embodiment includes a metal base plate 31 formed by joining a first metal base plate 31A and a second metal base plate 31B, and a first metal base. This is a method for manufacturing a heat exchanger 30 (see FIG. 4F) including a plurality of fins 32 erected on a plate 31A.
The manufacturing method of the heat exchanger 30 includes a fin joining step for joining a plurality of fins 32 to the lower surface (one surface) of the first metal base plate 31A, and a first layer having a plating layer 33 on the first metal base plate 31A side. The first metal base plate 31B is superposed on the upper surface (the other surface) of the first metal base plate 31A, and the rotating tool T1 is pressed against the second metal base plate 31B to generate frictional heat. A joining step of joining the base plate 31A and the second metal base plate 31B. The plating layer 33 is made of a metal having a lower melting point than that of the metal forming the first metal base plate 31A and the metal forming the second metal base plate 31B.

[Fin joining process]
First, as shown in FIG. 4A, a plurality of fins 32 are inserted between adjacent spacers J1 of a spacer jig J having spacers J1 arranged at predetermined intervals.

  And as shown in FIG.4 (b), 31 A of 1st metal base plates are arrange | positioned in the predetermined position above the several fin 32 arrange | positioned.

  Next, as shown in FIG. 4C, the peripheral surface of the tool T2 rotating in the circumferential direction is pressed against the upper surface of the first metal base plate 31A with a predetermined pressure, and is moved in the predetermined direction along the upper surface. . Then, the first metal base plate 31A and the plurality of fins 32 are joined by frictional vibration joining.

[Overlaying process, bonding process]
Thereafter, as shown in FIG. 4D, the second metal base plate 31B having the plating layer 33 on the lower surface side is overlaid on the upper surface of the first metal base plate 31A and held in a predetermined position.

  Next, as shown in FIG. 4 (e), the rotating tool T1 is pressed against the upper surface of the second metal base plate 31B at a predetermined pressure and is moved in a predetermined direction. Then, like the first embodiment and the second embodiment, after the plating layer 33, a part of the first metal base plate 31A and a part of the second metal base plate 31B are melted, they are alloyed. A joining portion 36 is formed, and the first metal base plate 31A and the second metal base plate 31B are joined.

  In this way, as shown in FIG. 4 (f), the first metal base plate 31A and the second metal base plate 31B are joined together via the joining portion 36 to constitute the metal base plate 31, and the metal A heat exchanger 30 including a plurality of fins 32 joined to the base plate 31 in a standing state can be manufactured.

As described above, in the method of manufacturing the heat exchanger 30 according to the third embodiment, after the plurality of fins 32 are once joined to the first metal base plate 31A, the second metal base plate 31B is joined. The first metal base plate 31A having a thickness smaller than that of the second metal base plate 31B is used, and the fin 32 is satisfactorily joined to the thin first metal base plate 31A by a frictional vibration joining method or the like. In this case, the metal base plate 31 of the heat exchanger 30 can be easily thickened by joining the second metal base plate 31B.
Moreover, the size of the first metal base plate 31A and the second metal base plate 31B is not limited to the same, and it is easy to make the metal base plate partially thicker by reducing the second metal base plate 31B. . That is, for example, when the heat exchanger 30 is used as a heat radiator such as a CPU, only the vicinity of the CPU mounting position can be thickened.

<Heat exchanger>
Next, the heat exchanger 30 manufactured in this way will be briefly described with reference to FIG.
As shown in FIG. 4 (f), the heat exchanger 30 mainly includes a metal base plate 31 and a plurality of fins 32 joined to the metal base plate 31 at predetermined intervals and in a standing state. Has been. The metal base plate 31 is configured by joining a first metal base plate 31A and a second metal base plate 31B, and the plurality of fins 32 are joined to the first metal base plate 31A.

Since the first metal base plate 31A and the second metal base plate 31B are closely bonded by the above-described bonding method, the thermal conductivity between the first metal base plate 31A and the second metal base plate 31B. The electrical conductivity is extremely high. Further, the first metal base plate 31A and the plurality of fins 32 are favorably joined by using the thin first metal base plate 31A.
Therefore, for example, when the heat exchanger 30 is used as a heat sink of the CPU and the CPU is disposed on the upper surface of the metal base plate 31, that is, the upper surface of the second metal base plate 31B, the heat generated from the CPU Conduction is performed in the order of the metal base plate 31B, the first metal base plate 31A, and the fins 32, and heat is suitably radiated.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and the embodiments may be combined as appropriate without departing from the spirit of the present invention. It can be changed.

  In the first embodiment described above, as shown in FIG. 1B, the plating layer 13 is formed on the upper surface 11 a side of the first metal member 11, but the lower surface side (first metal member 11) of the second metal member 12. A plating layer may be formed on the side).

  In the first embodiment described above, the case where the plate-like first metal member 11 and the plate-like second metal member 12 are joined has been described in order to facilitate understanding of the present invention. 11, the plurality of fins 32 described in the third embodiment may be joined. In this case, when the first metal member 11 and the second metal member 12 are joined, a heat exchange plate is manufactured and a heat exchanger is manufactured at the same time. It goes without saying that it belongs. Moreover, the two metal members joined in this way are not limited to plate shapes.

  In the first embodiment described above, the tool T1 is pressed against the plated second metal member 12 to join the first metal member 11 and the second metal member 12, but the tool T1 is joined to the first metal member 11, Alternatively, it may be pressed against both the first metal member 11 and the second metal member 12.

  In the second embodiment described above, as shown in FIG. 3A, the plating layer 23 is formed on the entire peripheral surface of the metal pipe member 22, but the plating layer includes at least the metal base plate 21 and the metal pipe member. What is necessary is just to form in the joint surface joined. For example, masking is appropriately performed, and only the inner surface of the groove 21a of the metal base plate 21 or the portion of the peripheral surface of the metal pipe member 22 that fits into the groove 21a (in the case of FIG. 3A, the metal pipe member 22 A plating layer may be formed only on the upper half circumferential surface. By reducing the plating layer in this way, the metal used for plating can be reduced.

  In the first embodiment described above, the first metal member 11 and the second metal member 12 having substantially the same size are joined as shown in FIG. It is not limited and can be changed as appropriate.

For example, as shown in FIG. 5, the second metal member 42 having a plating layer is fitted to the first metal member 41 having a recess, and the tool T1 is used to join the first metal member 41 via the joint portion 43. You may produce the heat exchange board 40 which has the flow path 40a .... In this case, the boundary between the first metal member 41 and the second metal member 42 is further joined by friction stir welding using a tool T3 with a pin T3a that is generally used for friction stir welding. In this case, the first metal member 41 and the second metal member 42 are well bonded. By joining in this way, it is possible to reliably prevent the fluid flowing through the flow paths 40a in the heat exchange plate 40 from leaking (see the drawing).
In addition, in order to facilitate positioning, a pipe member 46 having a plating layer 46a on the flange at the end is fitted into the stepped communication hole 42a formed in the second metal member 42, and the tool T1 is pressed against the flange to The member 46 and the second metal member 42 may be joined to form an inlet / outlet for fluid flowing through the flow path 40a (see the drawing). In this case, the communication hole 42a may not be different.

As shown in FIG. 6, another metal plate 51 is joined to the heat exchange plate 20 (see FIG. 2C) obtained by the method for manufacturing the heat exchange plate 20 according to the second embodiment described above. A heat exchange plate 50 in which the pipe member 22 is sandwiched between the metal plate 51 and the metal base plate 21 may be manufactured.
The manufacturing method of the heat exchange plate 50 will be briefly described. As shown in FIG. 6A, another metal having a groove 51a into which the plated metal pipe member 22 is fitted in the heat exchange plate 20 is provided. The plates 51 are stacked. Then, as shown in FIG. 6B, the rotating tool T <b> 1 is pressed against the metal plate 51 to melt the plating layer 23, and the metal plate 51 and the metal pipe member 22 are joined.
Then, as shown in FIG. 6C, the metal pipe member 22 is sandwiched between the metal base plate 21 and the metal plate 51, and a heat exchange plate 50 having a flow path 50a therein is obtained.

  According to such a heat exchange plate 50, the metal pipe member 22 is in close contact with and joined to the metal base plate 21 and the metal plate 51. Therefore, the fluid flowing through the flow path 50 a and the metal base plate 21. The heat exchange capacity of the heat exchange plate 50 is larger than that of the heat exchange plate 20 according to the second embodiment.

  Hereinafter, based on an Example, this invention is demonstrated further more concretely. In the examples, the type of metal to be plated, the thickness of the plating layer, and the thickness of the metal member to be joined were examined.

(1) Examination of type of metal to be plated (1-1) Example 1
As the metal member, two copper alloy plates (C0120) having a plate thickness of 3 mm, a width of 50 mm, and a length of 100 mm were used. Among these, the Sn plating layer which has tin (Sn) as a main component was formed in the thickness of 10 micrometers on the single side | surface of one copper alloy board. And the copper alloy plate in which this Sn plating layer was formed was piled up on the other copper alloy plate, the rotating tool was pressed, and two copper alloy plates were joined. As the tool, a cylindrical tool having a diameter of 20 mm was used as shown in FIG. The tool has spiral projections (wings) with a pitch of 2.5 mm and a height of 1 mm. Further, the tool rotation speed was set to 500 rpm and the tool movement speed was set to 300 mm / min so that the temperature generated in the copper alloy plate during bonding was about 500 ° C.

  Then, after joining, the thermal conductivity between the two joined copper alloy plates was measured by a laser flash method. Moreover, the two copper alloy plates joined were cut, and the quality of the joint was evaluated from the cross-sectional structure. The evaluation results are shown in Table 1 below. In the column of the bonding quality in Table 1, “◯” indicates that bonding was good, and “x” indicates that bonding was not performed. This description is the same for Tables 2 and 3 to be described later, and “Δ” shown in Table 2 indicates that a gap is partially formed.

(1-2) Example 2, Comparative Example 1
In contrast to Example 1, a Zn plating layer having a zinc (Zn) main component was formed as Example 2, and a Ni plating layer having nickel (Ni) as a main component was formed as Comparative Example 1. And it joined on the same conditions as Example 1, and evaluated. The evaluation results are shown in Table 1.

(1-3) Evaluation As is apparent from Table 1, when the object to be joined is formed of a copper alloy, the plating layer is formed of Sn (Example 1) and Zn (Example 2), so that bonding can be performed satisfactorily. It was confirmed that On the other hand, when a plating layer was formed with Ni (Comparative Example 1), it was confirmed that it was not joined.
Specifically, Sn has a eutectic reaction at a eutectic temperature of 227 ° C. in the Cu and Sn rich composition (Example 1), and Zn has a peritectic reaction at a low peritectic temperature of 424 ° C. in the Cu and Zn rich composition ( Example 2) was able to be joined. On the other hand, Ni and Cu could not be joined because they did not have a eutectic reaction or a peritectic reaction. That is, in order to join metal members formed from a copper alloy, it has been found that it is preferable to form a plating layer with a low melting point metal that has a eutectic reaction or a peritectic reaction with the copper alloy forming the metal member. .

(2) Examination of plating thickness-Examination of presence or absence of chromate treatment (2-1) Examples 3 to 5 and Comparative Examples 2 to 3
Next, the thickness of the plating layer was examined. In this examination, the same two copper alloy plates as in Example 1 were used. A Zn plating layer containing Zn as a main component was formed as the plating layer. As shown in the following Table 2, the thickness of the Zn plating layer was compared with the case where the case of 1 μm was set to Example 3, the case of 10 μm was set to Example 4, the case of 30 μm was set to Example 5, and the case of 50 μm was compared. Example 2 was adopted. Further, Comparative Example 3 was formed by forming a 10 μm Zn plating layer and then performing chromate treatment. That is, Examples 3 to 5 and Comparative Example 2 are not subjected to chromate treatment.
And each was joined by the same method as Example 1, and each evaluated. The evaluation results are shown in Table 2.

(2-2) Evaluation results As is clear from Table 2, it was found that the thermal conductivity decreased as the Zn plating layer became thicker (Examples 3 to 5, Comparative Example 2). This is because, as the Zn plating layer becomes thicker, the joining portion formed after joining becomes thicker. Among these, it was confirmed that the Zn plating layer of 50 μm has a thermal conductivity of less than 200 W / mK, which is about the same as that of a conventional solder joint.
Moreover, in the range whose thickness of Zn plating layer is 1-30 micrometers (Examples 3-5), while obtaining the quality of the favorable junction part, favorable thermal conductivity was able to be obtained.
Furthermore, in Comparative Example 3 in which the chromate treatment was performed, a gap, that is, an air layer, was formed in the joint portion as compared with Example 4, and a joint failure occurred. This is presumably because, in Comparative Example 3 where the chromate treatment was performed, gas was generated due to frictional heat at the time of joining.

(3) Examination of thickness of metal member and presence / absence of plating (3-1) Examples 6-8, Comparative Examples 4-6
Next, among the two copper alloy plates having a plate thickness of 3 mm in Example 1, the thickness of the copper alloy plate forming the Sn plating layer is 6 mm (Example 6), 8 mm (Example 7), 10 mm ( Example 8) was changed. Corresponding to this, bonding was performed on 6 mm (Comparative Example 4), 8 mm (Comparative Example 5), and 10 mm (Comparative Example 6) copper alloy plates on which no Sn plating layer was formed.
And it joined similarly to Example 1 and evaluated. The evaluation results are shown in Table 3. Table 1 also shows Example 1.

(3-2) Evaluation Results As is clear from Table 3, in Comparative Examples 4 to 6 where the Sn plating layer was not formed, it was not bonded, whereas in Examples 1 and 6 to 8 where the Sn plating layer was formed, Bonded well. Thereby, it was confirmed that by forming the Sn plating layer, bonding is possible even when the copper alloy plate to be bonded is thick.

It is process drawing which shows the manufacturing method of the heat exchange board which concerns on 1st Embodiment in steps. It is a perspective view which shows an example of the tool used with the manufacturing method of the heat exchange board which concerns on 1st Embodiment. It is process drawing which shows the manufacturing method of the heat exchange board which concerns on 2nd Embodiment in steps. It is process drawing which shows the manufacturing method of the heat exchanger which concerns on 3rd Embodiment in steps. It is a figure which shows the modification of the manufacturing method of the heat exchange board which concerns on 1st Embodiment. It is process drawing which shows the modification of the manufacturing method of the heat exchange plate which concerns on 2nd Embodiment in steps.

Explanation of symbols

10, 20, 40, 50 Heat exchange plate 10a, 20a, 50a Flow path 11, 41 First metal member 11a Upper surface 12, 42 Second metal member 13, 23, 33, 46 Plating layer 14 Groove 16, 26, 36, 43 Joint 21 Metal base plate 22 Metal pipe member 30 Heat exchanger 31 Metal base plate 31A First metal base plate 31B Second metal base plate 32 Fin 51 Metal plate 51a Groove T1, T2, T3 Tool

Claims (7)

A metal member joining method for joining two metal members,
A plating step of plating a bonding side of at least one of the two metal members with a metal having a melting point lower than that of the metal forming the two metal members, and providing a plating layer;
A joining step of joining the two metal members by overlapping the two metal members, pressing a rotating tool against the metal member, and frictional heat;
A metal member joining method characterized by comprising:   The thickness of the said plating layer is 1-30 micrometers, The joining method of the metal member of Claim 1 characterized by the above-mentioned. A plate-like first metal member and a plate-like second metal member are joined, and a method for producing a heat exchange plate having a flow path through which a fluid flows,
Plating on one side of the first metal member with a metal having a melting point lower than that of the metal forming the first metal member and the metal forming the second metal member, and providing a plating layer;
A groove forming step of forming a groove to be the flow path in the first metal member while removing a part of the plating layer from the one surface side,
The second metal member is overlapped so as to cover the groove, a rotating tool is pressed against at least one of the first metal member and the second metal member, and the first metal member is caused by frictional heat. And a joining step for joining the second metal member;
A method for producing a heat exchange plate, comprising: A heat exchange plate comprising: a metal base plate having a groove on one surface side; and a metal pipe member that is fitted in the groove and joined to the metal base plate, and fluid flows through a hollow portion of the metal pipe member A manufacturing method of
Plating step of plating at least one joining surface of the metal base plate and the metal pipe member with a metal having a lower melting point than that of the metal forming the metal base plate and the metal forming the metal pipe member, and providing a plating layer When,
A fitting step of fitting the metal pipe member into the groove of the metal base plate;
A joining step of joining the metal base plate and the metal pipe member by frictional heat by pressing a rotating tool against the other surface of the metal base plate;
A method for producing a heat exchange plate, comprising:   The thickness of the said plating layer is 1-30 micrometers, The manufacturing method of the heat exchange board of Claim 3 or Claim 4 characterized by the above-mentioned. A fin joining step for joining a plurality of fins to one surface of the first metal base plate;
A superposition step of superposing a second metal base plate having a plating layer on the first metal base plate side on the other surface of the first metal base plate;
A joining step of joining the first metal base plate and the second metal base plate by frictional heat by pressing a rotating tool against the second metal base plate;
A method of manufacturing a heat exchanger having
The method for manufacturing a heat exchanger, wherein the plating layer is made of a metal that forms the first metal base plate and a metal having a lower melting point than the metal that forms the second metal base plate.   The thickness of the said plating layer is 1-30 micrometers, The manufacturing method of the heat exchanger of Claim 6 characterized by the above-mentioned.

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