JP2005317747A - Method for winding up unbaked sheet and method for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an unbaked sheet winding method capable of accurately winding up an unbaked sheet such as a green sheet without generating flaws or holes on the unbaked sheet at the time of winding up the unbaked sheet around a roll body, and to provide a method for manufacturing electronic components prevented from the occurrence of a short circuit defect or the like. <P>SOLUTION: An unbaked sheet 10a which will be a dielectric layer 10 and/or inner electrode layers 12, 14 after baking is formed on the surface of a support sheet 20. The support sheet 20 on which the unbaked sheet 10a is formed is wound up like a roll to form a roll body 29. At the time of winding up the support sheet 20 on which the unbaked sheet 10a is formed like a roll, a cushioning tape 30 with prescribed thickness is located on an area in which the unbaked sheet 10a is not formed on the surface of the support sheet 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for winding a sheet before firing, such as a ceramic green sheet, and a method for manufacturing an electronic component.

  In order to manufacture ceramic electronic parts such as CR built-in type substrates and multilayer ceramic capacitors, it is usually first dielectric that consists of ceramic powder, binder (acrylic resin, butyral resin, etc.), plasticizer and organic solvent (methylene chloride, etc.). Prepare body paint. Next, this dielectric paint is applied onto a PET film by using a doctor blade method or the like, dried by heating, and then the PET film is peeled off to obtain a ceramic green sheet. Next, the internal electrode is printed on the ceramic green sheet and dried, and the laminate is cut into chips to form green chips. After firing these green chips, external electrodes are formed, and the multilayer ceramic is formed. Manufacture electronic components such as capacitors.

  When manufacturing a multilayer ceramic capacitor, the interlayer thickness of the sheet on which the internal electrodes are formed is in the range of about 0.5 μm to 50 μm based on the desired capacitance required for the capacitor. In the multilayer ceramic capacitor, a portion where no internal electrode is formed is formed on the outer portion in the stacking direction of the capacitor chip.

  When manufacturing electronic parts such as a multilayer ceramic capacitor, a sheet before firing such as a ceramic green sheet is usually formed on a support sheet such as a PET film, and then the support sheet is wound into a roll. The process to perform is required (patent document 1 etc.). The support sheet wound in a roll shape is stored or transported and unwound in the next manufacturing process, and an internal electrode (internal conductor layer pattern) is laminated on the pre-fired sheet on the support sheet, Or peeled off from the support sheet.

However, after the pre-firing sheet is formed on the support sheet, when the support sheet is wound into a roll shape, the green on the support sheet is then wound on the back surface of the support sheet wound in the roll shape. The sheet comes into contact. For this reason, a so-called back transfer phenomenon may occur, which may cause scratches or holes in the sheet before firing, and even when back transfer is not performed, contact and friction may occur on the back due to unevenness (projections) such as fillers on the support. It causes the occurrence of scratches and holes, resulting in short circuit failure.
JP 2003-203822 A

  The present invention has been made in view of such a situation, and an object of the present invention is a firing that can be wound with high accuracy without causing scratches or holes in a sheet before firing such as a green sheet when winding on a roll body. It is to provide a method for winding a front sheet. Another object of the present invention is to provide a method for manufacturing an electronic component that does not cause a short circuit failure.

In order to achieve the above object, a method for winding a pre-fired sheet according to the present invention
Forming a pre-fired sheet on the surface of the support sheet, which becomes a dielectric layer and / or an internal electrode layer of the electronic component after firing;
Winding the support sheet on which the pre-firing sheet is formed into a roll shape and forming a roll body,
When winding the support sheet on which the pre-fired sheet is formed into a roll, a buffer tape having a predetermined thickness is positioned in a region where the pre-fired sheet is not formed on the front surface or the back surface of the support sheet. Features.

  In the method for winding a pre-fired sheet according to the present invention, when winding the support sheet in a roll shape, a buffer tape having a predetermined thickness is positioned in a region where the pre-fired sheet is not formed on the front surface or the back surface of the support sheet. . Therefore, even if the sheet before firing on the support sheet to be wound next tries to come into contact with the back surface of the support sheet wound in a roll shape, the back transfer phenomenon is suppressed due to the buffer tape having a predetermined thickness. Since it does not come into contact with the support sheet, defects such as scratches and holes due to friction do not occur.

  In the present invention, even when the support sheet is thin, the buffer tape is disposed between the support sheets to be wound, whereby the strength of the support sheet is reinforced and can be wound with high accuracy.

  Preferably, the area where the pre-baking sheet is not formed on the front surface or the back surface of the support sheet is a position on both sides of the area where the support sheet is formed, and the buffer tape is positioned on each of these both positions. . By comprising in this way, the stable clearance gap is formed between the support sheets wound by roll shape in the both-sides position of the sheet | seat before baking, and the sheet | seat before baking is located in this clearance gap.

  Preferably, the thickness of the buffer tape is larger than the thickness of the baking sheet. By comprising in this way, it can prevent effectively that the sheet | seat before baking on the support sheet wound next is contacted with the back surface of the support sheet wound in roll shape.

  Preferably, the thickness of the buffer tape is larger than the value obtained by adding the maximum value of the surface roughness defined by JISB0601 on the front surface and / or back surface of the support sheet to the thickness of the baking sheet. In order to improve the handleability of the sheet, some unevenness (projections) are provided on the front surface and / or the back surface of the support sheet. If the surface of the sheet is too smooth, the sheet becomes slippery and the handleability decreases. Therefore, the thickness of the buffer tape is determined in consideration of the maximum value of the surface roughness defined by JISB0601 on the front surface and / or the back surface of the support sheet. If it does so, it can prevent reliably the sheet | seat before baking on the support sheet wound next to the back surface of the support sheet wound in roll shape.

  In the present invention, the sheet before firing is not particularly limited, but preferably, the sheet for firing includes a green sheet that becomes a dielectric layer after firing. Alternatively, the firing sheet includes a green sheet that becomes a dielectric layer after firing and a pre-fired electrode layer that becomes an internal electrode layer after firing, and is the outermost of the support sheet before being wound around the roll body The green sheet is located on the surface. Further, an adhesive layer may be provided on the dielectric layer or the internal electrode (internal conductor layer pattern).

  If scratches or holes are formed in the green sheet, short circuit defects are likely to occur in the fired electronic component. Therefore, the method of the present invention is particularly effective for winding a support sheet having a green sheet at least on the surface.

  Preferably, the said buffer tape is continuously supplied to the back surface or surface of the support sheet located in the outermost periphery of the said roll body. In addition, in this invention, the back surface of a support sheet is a back surface with respect to the surface of the support sheet in which the sheet | seat before baking is formed, and is the surface by which the sheet | seat before baking is not formed. In order to continuously supply the buffer tape to the back surface of the support sheet located on the outermost periphery of the roll body, for example, the buffer tape is continuously provided on the outer periphery of the roll body for the support sheet from the roll body around which the buffer tape is wound It is sufficient to supply it.

  In this invention, you may supply the said buffer tape continuously to the back surface or surface of the support sheet before winding up by the said roll body. Alternatively, the buffer tape may be continuously pasted in advance along the longitudinal direction of the support sheet on the back surface of the support sheet before being wound around the roll body.

  Preferably, the said buffer tape is a single-sided adhesive tape or a double-sided adhesive tape, and the adhesive surface of the adhesive tape is stuck on the back surface or surface of the said support sheet.

  Alternatively, the buffer tape may be continuously and integrally formed in advance along the longitudinal direction of the support sheet on the back surface or front surface of the support sheet before being wound around the roll body. In this case, the buffer tape may be a resin stripe layer formed by a coating method, or may be a stepped portion formed integrally with the support sheet.

An electronic component manufacturing method according to the present invention includes:
A step of unwinding the support sheet wound by the winding method of the sheet before firing according to any one of the above,
A step of peeling and laminating the pre-fired sheet formed on the surface of the unrolled support sheet from the support sheet; and
And baking the laminated pre-fired sheet.

  According to the method for manufacturing an electronic component according to the present invention, since the winding method according to the present invention is adopted, scratches and holes do not occur in the pre-firing sheet. An electronic component obtained after firing can be effectively prevented from short circuit failure.

  Preferably, the plurality of green chips are fired after the laminated pre-fired sheets are cut into green chips.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a schematic cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.
FIG. 2 is a schematic side view showing a method for winding a pre-fired sheet according to an embodiment of the present invention,
FIG. 3A is a cross-sectional view of the main part along the line IIIA-IIIA shown in FIG.
FIG. 3B is a cross-sectional view of the main part along the line IIIB-IIIB shown in FIG.
FIG. 3C is a cross-sectional view of the main part along the line IIIC-IIIC shown in FIG.
FIG. 3D is a cross-sectional view of the main part along the line IIID-IIID shown in FIG.
FIG. 4 is a cross-sectional view of a main part showing a process after the roll body is unwound,
FIG. 5 is a cross-sectional view of an essential part showing a post-process of FIG.
FIG. 6 is a cross-sectional view of an essential part showing a pre-fired sheet according to another embodiment of the present invention.

  As shown in FIG. 1, a multilayer ceramic capacitor 2 as an example of an electronic component includes a capacitor element body 4 having a configuration in which dielectric layers 10 and internal electrode layers 12 and 14 are alternately stacked. At both ends of the capacitor element body 4, a pair of external electrodes 6, 8 are formed which are electrically connected to the internal electrode layers 12, 14 arranged alternately in the element body 4.

  The shape of the capacitor element body 4 is not particularly limited, but is usually a rectangular parallelepiped shape. Also, the dimensions are not particularly limited, and may be appropriately determined according to the application. Usually, (0.6 to 5.6 mm) × (0.3 to 5.0 mm) × (0.3 ˜1.9 mm).

  The internal electrode layers 12 and 14 are laminated so that each end face is alternately exposed on the surface of the two opposite ends of the capacitor element body 4. The pair of external electrodes 6 and 8 are formed at both ends of the capacitor element body 4 and connected to the exposed end surfaces of the alternately arranged internal electrode layers 12 and 14 to constitute a capacitor circuit.

  In the capacitor element body 4, outer protective layers 40 and 42 are disposed at both outer ends in the stacking direction of the internal electrode layers 12 and 14 and the dielectric layer 10 to protect the inside of the element body 4. .

  The composition of the dielectric layer 10 and the outer protective layers 40 and 42 is not particularly limited in the present invention. For example, the composition is made of the following dielectric ceramic composition. The dielectric ceramic composition of the present embodiment has a main component including, for example, calcium titanate, strontium titanate and / or barium titanate.

  The dielectric ceramic composition of the present embodiment may contain various subcomponents in addition to the main component. The subcomponents included together with the main component in the dielectric ceramic composition include Sr, Y, Gd, Tb, Dy, V, Mo, Zn, Cd, Ti, Sn, W, Ba, Ca, Mn, Mg, Cr Examples are subcomponents containing one or more selected from oxides of Si and P. By adding subcomponents, it is possible to improve temperature characteristics, low-temperature firing, and improve reliability. However, in the present invention, the composition of the dielectric layer 10 is not limited to the above.

  The conditions such as the number and thickness of the dielectric layers 10 shown in FIG. 1 may be appropriately determined according to the purpose and application. In this embodiment, the thickness of the dielectric layer 10 is 0.5 μm to It is about 50 μm. Moreover, the thickness of the outer side protective layers 40 and 42 is, for example, about 100 μm to several hundred μm.

  The conductive material contained in the internal electrode layers 12 and 14 is not particularly limited, but a base metal can be used because the constituent material of the dielectric layer 10 has reduction resistance. As the base metal, Ni, Cu, Ni alloy or Cu alloy is preferable. When the main component of the internal electrode layers 12 and 14 is Ni, a method of firing at a low oxygen partial pressure (reducing atmosphere) is employed so that the dielectric is not reduced. On the other hand, a method of shifting the composition ratio from the stoichiometric composition so that the dielectric is not reduced is employed. The thicknesses of the internal electrode layers 12 and 14 may be appropriately determined according to the use and the like, but are usually 0.5 to 5 μm, preferably about 1 to 2.5 μm.

  The conductive material contained in the external electrodes 6 and 8 is not particularly limited, but usually Cu, Cu alloy, Ni, Ni alloy or the like is used. Of course, Ag, an Ag—Pd alloy, or the like can also be used. In the present embodiment, inexpensive Ni, Cu, and alloys thereof can be used. The thickness of the external electrodes 6 and 8 may be determined as appropriate according to the application, but is preferably about 10 to 50 μm.

Next, a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention will be described.
In this embodiment, the green chip is manufactured by a normal printing method or a sheet method using a paste, fired, and then printed or transferred and fired by external electrodes. Hereinafter, the manufacturing method will be specifically described.

  First, a dielectric layer paste is prepared. In the present embodiment, the dielectric layer paste is made of a dielectric paint having at least a dielectric material, a binder resin, and an organic solvent. A plasticizer, a dispersing agent, a wetting agent, etc. are added to this paint as needed. The dielectric paint may be a water-based dielectric paint.

As the raw material powder for the dielectric material, those having an average particle diameter of about 0.005 to 5 μm are usually used. In order to obtain a dielectric material from such a raw material powder, for example, the following may be performed. First, the starting materials are blended in a predetermined quantity ratio, and are wet mixed by, for example, a ball mill or the like. Subsequently, it is dried by a spray dryer or the like, and then calcined to obtain a dielectric oxide of the above formula constituting the main component. Subsequently, it is pulverized to a predetermined particle size by a jet mill or a ball mill to obtain a dielectric material. The subcomponent and the sintering aid (such as SiO ₂ or Li ₂ O) are calcined separately from the main component and mixed with the obtained dielectric material.

  The dielectric paint is applied to a predetermined thickness by various application methods such as a doctor blade method, a gravure method, a spray method, a roll method, a nozzle method, and a wire method, and dried to form a sheet.

  In the present embodiment, the sheet is formed by the doctor blade method. For example, as shown in FIG. 2 and FIG. 3 (A), a dielectric coating is applied to the surface of the elongated support sheet 20 continuously in the coater 24 and dried, whereby a green sheet (sheet before firing) 10a is formed. It is formed. The green sheet 10a is a portion that is laminated and becomes the dielectric layer 10 shown in FIG. 1 after firing.

  A PET sheet or the like is used as the support sheet 20, but PP (polypropylene), PE (polyethylene), paper, or the like may be used in addition to the PET sheet. The thickness t0 of the support sheet 20 is usually 5 to 120 μm, preferably 20 to 120 μm.

  The green sheet 10a is continuously formed in the center of the surface of the support sheet 20 along the longitudinal direction thereof. On both sides of the green sheet 10a on the surface of the support sheet 20, a surface margin area 20a where the green sheet 10a is not formed is formed.

  The thickness t2 of the green sheet 10a after drying is not particularly limited, but is usually 3 μm or less, preferably 1.5 μm or less. The width W2 of the surface margin region 20a is not particularly limited, but is 20 to 25%, more preferably about 22 to 25% with respect to the width of the support sheet 20.

  As the width W2 is increased, the width W1 of the buffer tape 30 described later can be increased, and a stable gap can be formed between the support sheets when the support sheets are wound. However, if the width W2 is too wide, the width of the green sheet 10a becomes narrower than the width of the support sheet 20, and it is not economical in manufacturing.

  As shown in FIG. 2, the composite sheet 22 composed of the support sheet 20 on which the dried green sheet 10a is formed is sent from the outlet of the coater 24 through the feed roller 26 to the reversing roller 27 and then to the winding roller 28. The roll body 29 is wound up.

  In the present embodiment, as shown in FIGS. 2, 3 (B) and 3 (C), the roll body 29 at a position immediately before being wound around the outermost periphery of the roll body 29 rotating in the rotation direction X. A pair of buffer tapes 30 are continuously supplied from a buffer tape roll 32 to the back surface of the support sheet 20 located on the outermost periphery of the support sheet 20. The buffer tape 30 is a back surface of the support sheet 20 located on the outermost periphery of the roll body 29, and is attached to a pair of back surface corresponding areas 20b corresponding to the front margin area 20a of the support sheet 20 shown in FIG. Consists of adhesive tape.

  The width W1 of each buffer tape 30 is not particularly limited, but is preferably 20 to 90% and more preferably 30 to 80% of the width W2 of the surface margin region 20a.

  In addition, the thickness t1 of each buffer tape 30 is larger than the thickness t2 of the green sheet 10a. Preferably, the maximum value Δt of the surface roughness of the front surface and / or the back surface of the support sheet 20 is added to the thickness t2 of the green sheet. Larger than the value (t2 + Δt). From another viewpoint, the thickness t1 of each buffer tape 30 is preferably 33 to 107 times the thickness t2 of the green sheet. If the thickness t1 is too small, the green sheet 10a may come into contact with the back surface of the support sheet 20. If it is too large, the length of the green sheet 10a with respect to the winding radius around the roll body 29 becomes small.

  In order to improve the handleability of the sheet 20, some irregularities (projections) are provided on the front surface and / or the back surface of the support sheet 20. If the surface of the sheet 20 is too smooth, the sheet 20 becomes slippery and the handleability decreases. Therefore, the thickness t1 of the buffer tape 30 is determined in consideration of the maximum value of the surface roughness defined by JISB0601 on the front surface and / or the back surface of the support sheet 20. Then, as shown in FIGS. 3C and 3D, the green sheet 10a on the support sheet 20 to be wound next contacts the back surface of the support sheet 20 wound in a roll shape. This can be surely prevented. Therefore, the back transfer phenomenon is effectively suppressed, and defects such as scratches and holes due to friction and the like can be suppressed because they do not contact the support sheet.

  Further, even when the support sheet 20 is thin, the buffer tape 30 is disposed between the support sheets 20 to be wound, whereby the strength of the support sheet 20 is reinforced and can be wound around the roll body 29 with high accuracy. .

  The roll body 29 in which the composite sheet 22 composed of the green sheet 10a and the support sheet 20 is wound up via a pair of buffer tapes 30 located on both sides is then transported and stored, or not stored. , Conveyed to the next step. In the next step, the support sheet 20 is unwound from the roll body 29, and as shown in FIG. 4, an electrode pattern layer (pre-firing electrode layer) 12a serving as an internal electrode layer is formed on the surface of the green sheet 10a. .

  The electrode pattern layer 12a is a portion that becomes the internal electrode layer 12 shown in FIG. 1 and is not particularly limited, and is formed by a printing method, a transfer method, or the like. The internal electrode layer 14 shown in FIG. 1 is obtained by firing the electrode pattern layer 14a shown in FIG. The electrode pattern layer 14a is formed on the green sheet 10a on another support sheet 20 in the same manner as the electrode pattern layer 12a.

  In order to form the electrode pattern layer 12a (same for 14a) by a printing method, an internal electrode layer paste is prepared. The internal electrode layer paste is for forming the internal electrode layers 12 and 14 (see FIG. 1), and is prepared by kneading a conductive material and an organic vehicle.

  The conductive material used for producing the internal electrode paste is not particularly limited in shape, such as spherical or flake shaped, and may be a mixture of these shapes. The average particle diameter of the conductive material is usually 0.1 to 10 μm, preferably about 0.2 to 1 μm.

  The green sheet 10a on which the electrode pattern layers 12a and 14a are formed by applying the internal electrode layer paste is peeled off from the support sheet 20 and laminated alternately as shown in FIG. The outer protective green sheets 40a and 42a are laminated in a single layer or multiple layers. The outer protective green sheets 40a and 42a are portions that become the protective layers 40 and 42 shown in FIG.

  Next, the laminated body 50 thus obtained is cut into a predetermined laminated body size to form a green chip, and then a binder removal process and firing are performed. Then, heat treatment is performed to reoxidize the dielectric layer. These processing conditions are not particularly limited, and are normal conditions.

  The sintered body (element body 4) thus obtained is subjected to end face polishing by, for example, barrel polishing, sand plast, etc., and external electrode paste is baked to form external electrodes 6 and 8.

  The multilayer ceramic capacitor thus manufactured is mounted on a printed circuit board by soldering or the like and used for various electronic devices.

  According to the winding method and the manufacturing method of the multilayer ceramic capacitor according to the present embodiment, as shown in FIGS. 3 (C) and 3 (D), on the back surface of the support sheet 20 wound in a roll shape, It is possible to reliably prevent the green sheet 10a on the support sheet 20 wound around the contact. Therefore, defects such as back transfer and scratches / holes can be effectively suppressed.

  Further, even when the support sheet 20 is thin, the buffer tape 30 is disposed between the support sheets 20 to be wound, whereby the strength of the support sheet 20 is reinforced and can be wound around the roll body 29 with high accuracy. .

  Therefore, when winding on the roll body, since defects such as scratches and holes due to contact (friction) with the support on the green sheet 10a can be suppressed, winding can be performed with high precision. No short circuit failure occurs.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, the pre-firing sheet formed on the support sheet 20 is not limited to a single layer of the green sheet 10a in the present invention, and may be a composite sheet as shown in FIG. In FIG. 6, the electrode pattern layer 12a before baking which becomes the internal electrode layer 12 after baking is formed on the surface of the support sheet 20, the green sheet 10a is formed thereon, and the green sheet is located on the outermost surface. It is like that.

  In the present invention, the buffer tape 30 may be any tape other than a single-sided adhesive tape or a double-sided tape as long as it has a high friction and is unlikely to cause winding to some extent. Alternatively, the buffer tape 30 may be previously formed integrally and continuously along the longitudinal direction in the back surface corresponding regions 20b located on both sides of the back surface of the support sheet 20. In this case, the buffer tape 30 may be a resin stripe layer formed by a coating method, or may be a step portion formed integrally with the support sheet 20.

  In the embodiment described above, the pair of buffer tapes 30 is disposed on the back surface of the support sheet 20 positioned on the outermost periphery of the roll body 29 at a position immediately before being wound on the outermost periphery of the roll body 29. Is supplied continuously. In the present invention, in addition, the buffer tape 30 is continuously supplied and pasted to the back surface of the support sheet 20 before being wound around the roll body 29 between the feed roll 26 and the reverse roll 27. Also good.

FIG. 1 is a schematic cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 2 is a schematic side view showing a method for winding a sheet before firing according to an embodiment of the present invention. 3A is a cross-sectional view of a main part taken along line IIIA-IIIA shown in FIG. 2, FIG. 3B is a cross-sectional view of a main part taken along line IIIB-IIIB shown in FIG. 2, and FIG. FIG. 3D is a cross-sectional view of main parts taken along the line IIID-IIID shown in FIG. 2. FIG. 4 is a cross-sectional view of an essential part showing a process after the roll body is unwound. FIG. 5 is a cross-sectional view of a principal part showing a post-process of FIG. FIG. 6 is a cross-sectional view of an essential part showing a pre-fired sheet according to another embodiment of the present invention.

Explanation of symbols

2 ... Multilayer ceramic capacitor 10 ... Dielectric layer 10a ... Green sheet 12, 14 ... Internal conductor layer 12a, 14a ... Electrode pattern layer 20 ... Support sheet 20a ... Surface margin area 20b ... Back side corresponding area 29 ... Roll body 30 ... Buffer tape

Claims (14)

Forming a pre-fired sheet on the surface of the support sheet, which becomes a dielectric layer and / or an internal electrode layer of the electronic component after firing;
Winding the support sheet on which the pre-firing sheet is formed into a roll shape and forming a roll body,
When winding the support sheet on which the pre-firing sheet is formed into a roll, a buffer tape having a predetermined thickness is positioned in a region where the pre-firing sheet is not formed on the front surface or the back surface of the support sheet. A method for winding a pre-fired sheet. The region where the pre-fired sheet is not formed on the front surface or the back surface of the support sheet is a position on both sides of the region where the support sheet is formed, and the buffer tape is located on each of the both side positions. The method for winding a sheet before firing according to claim 1. The method for winding a pre-fired sheet according to claim 1 or 2, wherein the thickness of the buffer tape is larger than the thickness of the fired sheet. The winding of the sheet before firing according to claim 3, wherein the thickness of the buffer tape is larger than a value obtained by adding the maximum value of the surface roughness of the front surface and / or the back surface of the support sheet to the thickness of the firing sheet. Method. The said sheet | seat for baking contains the green sheet used as a dielectric material layer after baking, The winding method of the sheet | seat before baking in any one of Claims 1-4. The firing sheet includes a green sheet that becomes a dielectric layer after firing, and a pre-fired electrode layer that becomes an internal electrode layer after firing,
The winding method of the sheet | seat before baking in any one of Claims 1-4 in which the said green sheet is located in the outermost surface of the said support sheet before winding around the said roll body. The winding method of the sheet | seat before baking in any one of Claims 1-6 which supplies the said buffer tape continuously to the back surface or surface of a support sheet located in the outermost periphery of the said roll body. The winding method of the sheet | seat before baking in any one of Claims 1-6 which supplies the said buffer tape continuously to the back surface or surface of the support sheet before winding up by the said roll body. The pre-baking according to claim 1, wherein the buffer tape is continuously pasted in advance along the longitudinal direction of the support sheet on the back surface or front surface of the support sheet before being wound on the roll body. Winding method of the sheet. The said buffer tape is a single-sided adhesive tape or a double-sided adhesive tape, The winding method of the sheet | seat before baking in any one of Claims 7-9 stuck on the back surface of the said support sheet. The buffer tape is formed continuously and integrally in advance along the longitudinal direction of the support sheet on the back surface or front surface of the support sheet before being wound on the roll body. The winding method of the sheet | seat before baking as described in 2 .. The method for winding a pre-fired sheet according to claim 11, wherein the buffer tape is a resin stripe layer formed by a coating method. A step of unwinding the support sheet wound up by the winding method of the sheet before firing according to any one of claims 1 to 12,
A step of peeling and laminating the unfired sheet formed on the surface of the unrolled support sheet from the support sheet;
And a step of firing the laminated pre-fired sheet. The method for manufacturing an electronic component according to claim 13, wherein the plurality of green chips are fired after the laminated pre-fired sheets are cut into green chips.

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