JP2005315719A - Device test fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the conventional test device cannot cope with device workpieces of a high speed in a check method in which one side of the device workpieces drops on ground as before, i.e. it cannot sufficiently cope with a short pulse and a test fixture (holder) for positioning and holding the device workpieces cannot cope with it. <P>SOLUTION: In a device test fixture, a part being in contact with the device workpiece being at least an object to be tested is formed of an insulator except for a probe and an electrode part. Ceramic mainly comprising aluminum oxide (alumina) or aluminum oxide is used as the insulator, and the device workpiece being the object to be tested is made a laser diode chip. In addition, the device workpiece being the object to be tested is electrically lifted from the fixture to be measured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a device inspection jig, and more particularly to a laser diode chip and a device inspection jig used for accurately measuring the laser characteristics of a laser diode chip having a pulse width set to be small, such as a blu-ray.

  Conventionally, various inspection apparatuses for checking the characteristics of a laser diode chip as described above are known, and an inspection jig (holder) for positioning a target work (device) and performing the check operation. Various configurations are known.

  Conventionally, the pulse width of laser diode chips that are often used is usually at least 1 microsec. To measure and check this characteristic, one side is dropped to ground due to its circuit configuration. It was supposed to be executed.

  However, various types of high-speed laser diode chips whose writing speed is about 20 times the conventional speed have been developed. For example, a blue laser (Bulley) having a pulse width of 10 to 20 nanosec or a red laser ((DUD)) having a pulse width of 50 to 100 nanosec.

In order to accurately check the laser characteristics of these high speed laser diode chips, it is impossible to cope with the situation in which the speed does not increase when one side is dropped to the ground as in the prior art. That is, a sufficient response to a short pulse cannot be achieved. In other words, it cannot be dropped to the ground.
The applicant conducted a search for prior art that seems to be related to the present invention, but could not find any literature that seemed to be particularly similar.

  The problem to be solved by the present invention is that the conventional check method in which one side of the device work is dropped to the ground cannot cope with the high speed device work, that is, a short pulse. A sufficient response to this is that it cannot be handled by a conventional inspection apparatus, which is also an inspection jig (holder) for positioning and holding a device work.

  In order to solve the above-described problems, the device inspection jig according to the present invention is characterized in that at least a portion in contact with a device work to be inspected is formed of an insulator except for a probe and an electrode portion. In addition, aluminum oxide (alumina) or ceramics mainly composed of aluminum oxide is used as the insulator, and the device work to be inspected is a laser diode chip. Yes.

  In addition, the device inspection jig according to the present invention is characterized in that measurement can be performed by electrically floating a device work to be inspected from the jig.

  With the above-described configuration, the device inspection jig according to the present invention emits the heat associated with the laser emitted when checking the characteristics of the device workpiece, particularly the laser diode chip, as the object to be inspected. Therefore, the graph data can be stabilized.

  Further, by adopting such a configuration, it is possible to obtain a product that is much more excellent in wear resistance and durability than a conventionally used metal, and can be economically superior.

  The embodiment shown in the figure is realized as an example of the present invention.

  Next, a preferred embodiment of the present invention will be described with reference to the drawings. 1 is a plan view showing an outline of a device inspection jig according to the present invention, FIG. 2 is a sectional view, FIG. 3 is a plan view showing an example corresponding to a can-type device work, and FIG. 4 is a sectional view. is there.

  1 and 2, reference numeral 1 denotes a table, and a jig body 2 formed of ceramic, particularly aluminum oxide (alumina), is fixed on the table 1.

The above-described jig body 2 is formed in a substantially rectangular parallelepiped shape, and is provided with screw holes 3 and 3 penetrating in the vertical direction near both ends along the longitudinal direction. The fixing action on the table 1 is performed by passing the screws 4 and 4 through the screw holes 3 and 3.

  In addition, a pair of standing walls 5 and 5a along the short direction are integrally formed at a substantially central position on the upper surface of the jig body 2 described above, and one of the standing walls 5a has a size approximately equal to the width of the jig body 1. About three-quarters.

  A receiving member 6 of a device work (laser diode chip) partially protruding in an L shape is provided between the standing walls 5 and 5a by brazing and fixing between the standing walls 5 and 5. The part surrounded by the solid line on the upper surface of the receiving member 6 is a mounting part 6a for the device work. The mounting part 6a extends to the jig body 2 in which the mounting hole 6b for the device work is formed of ceramic. It is formed through.

  When the device work (laser diode chip) W is carried and mounted in the mounting hole 6b by vacuum suction or the like, the inspection work using the probe needle is executed with the mounting portion 6a as the positive pole and the protruding portion 6c as the negative pole. Then, the data is expressed as a graph or the like by a separate device.

  3 and 4 show a second embodiment, which corresponds to a so-called can-type device work inspection. 3 and 4, reference numeral 7 denotes an aluminum base. The base 7 is fixed to a table (not shown) with screws 8, 8.

  A through hole 9 is formed in the approximate center of the aluminum base 7 described above, and a ring-shaped recess 10 is formed at the upper opening edge of the through hole 9. A ceramic ring-shaped measuring table 12 having a through hole 11 communicating with the through hole 9 at the center is closely fitted and fixed to the recess by means such as brazing.

  Further, a ceramic positioning plate 13 is fixed at a slightly deeper position on the ring-shaped measuring table 12 with screws or the like. The front surface of the positioning plate 13 has an obtuse fan shape, and a notch 13a for receiving the device work W is formed.

  In this embodiment, the device work (can type laser diode) W to be inspected is partially inserted into the through hole 11 and the through hole 9 with the terminals T and T inserted therein, and a part of the device work (can type laser diode) W The twelve through holes 11 are set on the opening edge. In the figure, B indicates bonding.

  On the other hand, reference numeral 14 in the figure is a ceramic holding plate having a fork at the tip. The holding plate 14 is pivotally supported at the rear end, and the set device work W is viewed from above at the fork-like tip. It is intended to suppress the work.

  Further, in the figure, reference numeral 15 denotes a pressing slider formed of ceramic that causes the set device work W to closely contact the notch portion 13a of the positioning plate 13 and corrects a slight positional deviation of the device work W. The pressing slider 15 slides in the front-rear direction along the upper surface of the ring-shaped measuring table 12.

  The lower surface of the base 7 is provided with at least a pair of plastic probe holders 16 and 16. Each of the probe holders 16 and 16 is provided with probes 17 and 17 whose tips are directed to the terminals T and T of the device work W described above. The probes 17 and 17 are slid so as to be in contact with and away from the terminals T and T. However, this slide can be performed by sliding the probe holders 16 and 16 or by moving the probes 17 and 17 themselves within the probe holders 16 and 16. It is good also as a structure to slide.

  The above-described probe holders 16, 16 are configured such that missing holes 16 a, 16 a are formed in a part of the lower surface thereof, and a part of the probes 17, 17 is exposed. The second probes 18 and 18 electrically connected to the power source are slidable in the vertical direction with their tips directed to the exposed portions of the probes 17 and 17. The tip is in contact with and away from the probes 17 and 17.

  The device inspection jig according to the present invention is configured as described above, and is capable of dealing with a high-speed laser diode because of good heat dissipation without accumulating heat, can perform an accurate check operation, and is durable. Good quality. By applying the characteristics of this inspection jig, it can be used not only as a laser diode but also as an inspection jig for photoelectric devices.

It is a top view which shows the outline | summary of the device inspection jig which concerns on this invention. It is sectional drawing. It is a top view which shows the example matched with a can type device work. Is a cross-sectional view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Table 2 Jig body 3 Screw hole 4 Screw 5 Standing wall 5a Standing wall 6 Receiving member 6a Mounting part 6b Mounting hole 6c Protruding part 7 Base 8 Screw 9 Through-hole 10 Recessed part 11 Through-hole 12 Ring-shaped measuring base 13 Positioning plate 13a Cutting Notch 14 Retaining plate 15 Pressing slider 16 Probe holder 16a Missing hole 17 Probe 18 Second probe W Device work T Terminal B Bonding

Claims (4)

  A device inspection jig characterized in that at least a portion in contact with a device work to be inspected is formed of an insulator excluding a probe and an electrode portion.   2. The device inspection jig according to claim 1, wherein aluminum oxide (alumina) or ceramic mainly composed of aluminum oxide is used as the insulator.   The device inspection jig according to claim 1 or 2, wherein the device work to be inspected is a laser diode chip. 4. The device inspection jig according to claim 1, wherein the device inspection jig can be measured by electrically floating the device work to be inspected from the jig.

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