JP2005310773A - 液体金属スイッチ、およびその製造方法 - Google Patents

液体金属スイッチ、およびその製造方法 Download PDF

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Publication number
JP2005310773A
JP2005310773A JP2005115442A JP2005115442A JP2005310773A JP 2005310773 A JP2005310773 A JP 2005310773A JP 2005115442 A JP2005115442 A JP 2005115442A JP 2005115442 A JP2005115442 A JP 2005115442A JP 2005310773 A JP2005310773 A JP 2005310773A
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JP
Japan
Prior art keywords
substrate
liquid metal
heating element
layer
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005115442A
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English (en)
Japanese (ja)
Other versions
JP2005310773A5 (OSRAM
Inventor
Ronald Shane Fazzio
ロナルド・シェ−ン・ファジオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2005310773A publication Critical patent/JP2005310773A/ja
Publication of JP2005310773A5 publication Critical patent/JP2005310773A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H29/30—Switches having at least one liquid contact with level of surface of contact liquid displaced by expansion or evaporation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/02—Apparatus or processes specially adapted for the manufacture of electric switches for mercury switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)
JP2005115442A 2004-04-16 2005-04-13 液体金属スイッチ、およびその製造方法 Pending JP2005310773A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/826,248 US6822176B1 (en) 2004-04-16 2004-04-16 Liquid metal switch and method of manufacture therefor

Publications (2)

Publication Number Publication Date
JP2005310773A true JP2005310773A (ja) 2005-11-04
JP2005310773A5 JP2005310773A5 (OSRAM) 2008-05-29

Family

ID=33435678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005115442A Pending JP2005310773A (ja) 2004-04-16 2005-04-13 液体金属スイッチ、およびその製造方法

Country Status (3)

Country Link
US (1) US6822176B1 (OSRAM)
EP (1) EP1587119A3 (OSRAM)
JP (1) JP2005310773A (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004199887A (ja) * 2002-12-16 2004-07-15 Agilent Technol Inc 導電性流体を用いた電気接点開閉装置及びその製造方法
JP2004227858A (ja) * 2003-01-21 2004-08-12 Agilent Technol Inc 電気接点開閉装置及び電気接点開閉装置の製造方法
US6924443B2 (en) * 2003-04-14 2005-08-02 Agilent Technologies, Inc. Reducing oxides on a switching fluid in a fluid-based switch
US7071432B2 (en) * 2003-04-14 2006-07-04 Agilent Technologies, Inc. Reduction of oxides in a fluid-based switch
US7019236B2 (en) * 2004-03-11 2006-03-28 Agilent Technologies, Inc. Switch with lid
US7358452B2 (en) * 2005-06-30 2008-04-15 Agilent Technlolgies, Inc. Architecture and method of fabrication for a liquid metal microswitch (LIMMS)
US7211754B2 (en) * 2005-08-01 2007-05-01 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Fluid-based switch, and method of making same
MX2010004059A (es) 2007-10-31 2010-04-30 Hoffmann La Roche Patrones electricos para biosensor y metodo para producirlos.
JP2009117078A (ja) * 2007-11-02 2009-05-28 Yokogawa Electric Corp リレー

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185017A (ja) * 1999-12-22 2001-07-06 Agilent Technol Inc スイッチ装置
EP1391903A1 (en) * 2002-08-14 2004-02-25 Agilent Technologies, Inc. Micro-relay device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4183817B2 (ja) * 1998-12-30 2008-11-19 アジレント・テクノロジーズ・インク 電気接点開閉装置
US6323447B1 (en) * 1998-12-30 2001-11-27 Agilent Technologies, Inc. Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method
US6689976B1 (en) * 2002-10-08 2004-02-10 Agilent Technologies, Inc. Electrically isolated liquid metal micro-switches for integrally shielded microcircuits
US6457815B1 (en) 2001-01-29 2002-10-01 Hewlett-Packard Company Fluid-jet printhead and method of fabricating a fluid-jet printhead
US6720507B2 (en) * 2002-06-14 2004-04-13 Agilent Technologies, Inc. Multi-seal fluid conductor electrical switch device
US6559420B1 (en) * 2002-07-10 2003-05-06 Agilent Technologies, Inc. Micro-switch heater with varying gas sub-channel cross-section
US20040007449A1 (en) * 2002-07-10 2004-01-15 Dove Lewis R. Add-on, suspended heater for liquid metal micro-switch
US6743991B1 (en) * 2003-04-14 2004-06-01 Agilent Technologies, Inc. Polymeric liquid metal switch

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185017A (ja) * 1999-12-22 2001-07-06 Agilent Technol Inc スイッチ装置
EP1391903A1 (en) * 2002-08-14 2004-02-25 Agilent Technologies, Inc. Micro-relay device

Also Published As

Publication number Publication date
US6822176B1 (en) 2004-11-23
EP1587119A3 (en) 2005-12-21
EP1587119A2 (en) 2005-10-19

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