JP2005310773A5 - - Google Patents
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- Publication number
- JP2005310773A5 JP2005310773A5 JP2005115442A JP2005115442A JP2005310773A5 JP 2005310773 A5 JP2005310773 A5 JP 2005310773A5 JP 2005115442 A JP2005115442 A JP 2005115442A JP 2005115442 A JP2005115442 A JP 2005115442A JP 2005310773 A5 JP2005310773 A5 JP 2005310773A5
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- nitride
- cavity
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 17
- 239000000463 material Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 4
- 229910001338 liquidmetal Inorganic materials 0.000 claims 4
- 229910052697 platinum Inorganic materials 0.000 claims 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 4
- 230000004888 barrier function Effects 0.000 claims 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910018487 Ni—Cr Inorganic materials 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/826,248 US6822176B1 (en) | 2004-04-16 | 2004-04-16 | Liquid metal switch and method of manufacture therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005310773A JP2005310773A (ja) | 2005-11-04 |
| JP2005310773A5 true JP2005310773A5 (OSRAM) | 2008-05-29 |
Family
ID=33435678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005115442A Pending JP2005310773A (ja) | 2004-04-16 | 2005-04-13 | 液体金属スイッチ、およびその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6822176B1 (OSRAM) |
| EP (1) | EP1587119A3 (OSRAM) |
| JP (1) | JP2005310773A (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004199887A (ja) * | 2002-12-16 | 2004-07-15 | Agilent Technol Inc | 導電性流体を用いた電気接点開閉装置及びその製造方法 |
| JP2004227858A (ja) * | 2003-01-21 | 2004-08-12 | Agilent Technol Inc | 電気接点開閉装置及び電気接点開閉装置の製造方法 |
| US6924443B2 (en) * | 2003-04-14 | 2005-08-02 | Agilent Technologies, Inc. | Reducing oxides on a switching fluid in a fluid-based switch |
| US7071432B2 (en) * | 2003-04-14 | 2006-07-04 | Agilent Technologies, Inc. | Reduction of oxides in a fluid-based switch |
| US7019236B2 (en) * | 2004-03-11 | 2006-03-28 | Agilent Technologies, Inc. | Switch with lid |
| US7358452B2 (en) * | 2005-06-30 | 2008-04-15 | Agilent Technlolgies, Inc. | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) |
| US7211754B2 (en) * | 2005-08-01 | 2007-05-01 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Fluid-based switch, and method of making same |
| MX2010004059A (es) | 2007-10-31 | 2010-04-30 | Hoffmann La Roche | Patrones electricos para biosensor y metodo para producirlos. |
| JP2009117078A (ja) * | 2007-11-02 | 2009-05-28 | Yokogawa Electric Corp | リレー |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4183817B2 (ja) * | 1998-12-30 | 2008-11-19 | アジレント・テクノロジーズ・インク | 電気接点開閉装置 |
| US6323447B1 (en) * | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| JP2001185017A (ja) * | 1999-12-22 | 2001-07-06 | Agilent Technol Inc | スイッチ装置 |
| US6689976B1 (en) * | 2002-10-08 | 2004-02-10 | Agilent Technologies, Inc. | Electrically isolated liquid metal micro-switches for integrally shielded microcircuits |
| US6457815B1 (en) | 2001-01-29 | 2002-10-01 | Hewlett-Packard Company | Fluid-jet printhead and method of fabricating a fluid-jet printhead |
| US6720507B2 (en) * | 2002-06-14 | 2004-04-13 | Agilent Technologies, Inc. | Multi-seal fluid conductor electrical switch device |
| US6559420B1 (en) * | 2002-07-10 | 2003-05-06 | Agilent Technologies, Inc. | Micro-switch heater with varying gas sub-channel cross-section |
| US20040007449A1 (en) * | 2002-07-10 | 2004-01-15 | Dove Lewis R. | Add-on, suspended heater for liquid metal micro-switch |
| JP2004074514A (ja) * | 2002-08-14 | 2004-03-11 | Seiko Epson Corp | ワイピング部材、液体噴射装置、インクジェット式記録装置 |
| US6743991B1 (en) * | 2003-04-14 | 2004-06-01 | Agilent Technologies, Inc. | Polymeric liquid metal switch |
-
2004
- 2004-04-16 US US10/826,248 patent/US6822176B1/en not_active Expired - Fee Related
- 2004-11-18 EP EP04027442A patent/EP1587119A3/en not_active Withdrawn
-
2005
- 2005-04-13 JP JP2005115442A patent/JP2005310773A/ja active Pending
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