JP2005309956A - Ic tag, interposer, conductive body-formed sheet wound body used for ic tag, interposer-mounted sheet wound body and manufacturing method of ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag which enables an interposer to be easily and firmly connected to an antenna circuit and protects an IC chip without additional processing. <P>SOLUTION: An IC tag 1 is provided with an antenna-formed sheet 3 and an interposer 2 arranged on the antenna-formed sheet 3. The antenna-formed sheet 3 comprises a base sheet 20 and an antenna circuit 22. The interposer 2 comprises a supporting sheet 10, a pair of extended electrodes 13 which is arranged on the supporting sheet 10 and coated with a nonconductive bonding agent 17 on its surface not facing the supporting sheet 10, and an IC chip 15. The surface of the interposer 2 on the IC chip 15 side faces the surface of the antenna-formed sheet 3 on the antenna circuit 22 side. The extended electrodes 13 of the interposer 2 are connected to the antenna by caulking, ultrasonic wave bonding, or thermocompression bonding. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC tag, an interposer, a conductor-formed sheet winding used in an IC tag, an interposer-attached sheet winding, and an IC tag that can exchange data with an external reader / writer without contact. It relates to a manufacturing method.

  2. Description of the Related Art As a non-contact IC tag that exchanges data without contact with an external reader / writer, a tag that includes an antenna-formed sheet on which an antenna circuit having a pair of contacts is formed and an interposer is known.

  Among these, the antenna circuit of the antenna-formed sheet is provided on the base sheet and is usually formed in a spiral shape, a rod shape, a cross shape, or the like, and in the case of a spiral shape, the pair of contacts are arranged on the inner side and the outer side. It is formed by the end. Note that the shape of the antenna circuit is determined by the frequency of electromagnetic waves when data is transmitted / received to / from the reader / writer.

  On the other hand, the interposer has a pair of enlarged electrodes and an IC chip having a pair of electrodes each connected to a different enlarged electrode. Depending on the frequency band of electromagnetic waves used when transmitting / receiving data to / from a reader / writer, a pair of enlarged electrodes may function as an antenna, and an interposer having a pair of enlarged electrodes and an IC chip may be combined with an antenna-formed sheet. And can be used as an IC tag. The term interposer in the present application is a concept including such an IC tag.

  The interposer used together with the antenna-formed sheet is fixed on the antenna-formed sheet by joining each enlarged electrode to a different contact of the antenna circuit.

  However, since the bonding is local and the interposer is exposed on the surface of the IC tag, the interposer is easily peeled off from the antenna-formed sheet. For this reason, processing such as laminating may be further performed on the IC tag, which is one cause of increasing the manufacturing cost of the IC tag. The processing such as laminating is intended to increase the bonding strength of the interposer to the antenna-formed sheet and to protect the IC chip exposed on the surface of the IC tag.

  In addition, the enlarged electrode is formed larger than the IC chip so that the IC chip can be easily positioned when the interposer is manufactured. On the other hand, if the enlarged electrode short-circuits the part other than the pair of contacts of the antenna circuit, there arises a disadvantage that the IC tag cannot perform its assumed function. For this reason, an IC tag or interposer in which only the contact points of the antenna circuit are provided on both surfaces of the base sheet and the interposer is disposed on the back surface of the antenna-formed sheet (the surface on the antenna-formed sheet side where the antenna circuit is not provided). Among the enlarged electrodes, an IC tag is manufactured in which a portion other than the portion that contacts the contact of the antenna circuit is insulated.

  However, when the interposer is disposed on the back surface of the antenna-formed sheet, there is a disadvantage that the continuity between the enlarged electrode and the contact of the antenna circuit becomes unstable when caulking depending on the base material. Further, it is complicated to insulate only a part of the enlarged electrode, which is one cause for increasing the manufacturing cost.

  The present invention has been made in consideration of the above-described problems, and maintains electrical conductivity between the interposer expansion electrode and the contact of the antenna circuit and insulation between the interposer expansion electrode and the circuit portion other than the contact of the antenna circuit. However, the IC tag and the interposer can easily and firmly join the interposer to the antenna circuit, and can protect the IC chip without taking any special measures, thereby reducing the manufacturing cost. It is an object of the present invention to provide a wound body of a conductor-formed sheet used for an IC tag, a wound body of a sheet with an interposer, and a method for manufacturing an IC tag.

  The present invention provides an antenna-formed sheet comprising a base sheet and an antenna circuit, and is disposed on the antenna-formed sheet, and is provided on the support sheet and the surface on the side not facing the support sheet. An interposer having a pair of enlarged electrodes coated with a conductive adhesive and an IC chip connected to the enlarged electrodes, and the surface of the interposer on the IC chip side faces the surface of the antenna-formed sheet on the antenna circuit side In the IC tag, the enlarged electrode of the interposer is caulked to the antenna circuit and connected by ultrasonic waves or thermocompression bonding.

  The present invention is an IC tag in which each electrode of an IC chip is connected to a different enlarged electrode by ultrasonic bonding or thermocompression bonding.

  The present invention includes a support sheet, a pair of enlarged electrodes provided on the support sheet and coated with a non-conductive adhesive on a surface that does not face the support sheet, and an IC chip connected to the enlarged electrode. It is an interposer characterized by comprising.

  The present invention provides a support sheet extending in a strip shape and a pair of conductive films provided on the support sheet and coated with a non-conductive adhesive on the surface that does not face the support sheet and extending along the support sheet and spaced apart from each other. A conductor-formed sheet wound body for use in an IC tag, comprising a conductor-formed sheet having a body and wound around a winding core.

  The present invention provides a support sheet extending in a strip shape, and a plurality of pairs provided on the support sheet and coated with a nonconductive adhesive on a surface that does not face the support sheet, and arranged along the longitudinal direction of the support sheet. It is a wound body of a conductor formed sheet used for an IC tag, characterized in that it is wound around a winding core.

  The present invention is a wound body of a conductor-formed sheet used for an IC tag, wherein a surface of the support sheet that does not face the conductor is peeled.

  The present invention provides a support sheet extending in a strip shape and a pair of conductive films provided on the support sheet and coated with a non-conductive adhesive on the surface that does not face the support sheet and extending along the support sheet and spaced apart from each other. An interposer-wound sheet comprising a sheet with an interposer having a body and a large number of IC chips provided on a conductor, and being wound around a winding core.

  The present invention provides a support sheet extending in a strip shape, and a plurality of pairs provided on the support sheet and coated with a nonconductive adhesive on a surface that does not face the support sheet, and arranged along the longitudinal direction of the support sheet. A sheet of an interposer-attached sheet comprising a sheet with an interposer having the conductor and a large number of IC chips provided on the conductor, and being wound around a winding core.

  The present invention is a wound body of a sheet with an interposer, further comprising release paper laminated on the surface of the sheet with an interposer on the IC chip side.

  In the present invention, an interposer having an IC chip and a support sheet, a pair of enlarged electrodes coated with a non-conductive adhesive, and an IC chip is cut from the surface on the sheet side with an interposer for each IC chip. It is a roll of a sheet with an interposer, which is characterized in that it can be peeled off.

  The present invention relates to a support sheet extending in a strip shape, and a pair of conductors that are laminated on the support sheet and coated with a non-conductive adhesive on the surface that does not face the support sheet, and that extend along the support sheet and are separated from each other An IC chip having a pair of electrodes is sequentially disposed on the surface of the conductor-formed sheet on which the non-conductive adhesive is applied; A step of forming a sheet with an interposer having a support sheet, a pair of conductors, and a large number of IC chips; and punching or cutting the sheet with an interposer for each IC chip to form an enlarged electrode from the conductor to support A step of forming an interposer having a sheet, a pair of enlarged electrodes, and an IC chip, and a process for preparing an antenna-formed sheet formed by forming an antenna circuit on a base sheet When the IC chip side surface of the interposer so as to face the antenna side of the antenna has been formed sheet, a manufacturing method of an IC tag comprising a step of placing the interposer on the antenna already formed sheet.

  The present invention includes a support sheet extending in a strip shape, and a plurality of pairs arranged along the longitudinal direction of the support sheet by applying a non-conductive adhesive to a surface that is laminated to the support sheet and does not face the support sheet. A step of preparing a conductor-formed sheet having a conductor, and an IC chip having a pair of electrodes are sequentially arranged on the surface of the conductor-formed sheet on the side where the non-conductive adhesive is applied And forming a sheet with an interposer having a support sheet, a large number of pairs of conductors, and a large number of IC chips, and punching or cutting the interposer-attached sheets for each IC chip to form enlarged electrodes from the conductor. A step of forming an interposer having a support sheet, a pair of enlarged electrodes, and an IC chip, and an antenna-formed sheet formed by forming an antenna circuit on a base sheet A step, the IC chip side surface of the interposer so as to face the antenna side of the antenna has been formed sheet, a manufacturing method of an IC tag comprising a step of placing the interposer on the antenna already formed sheet.

  The present invention is a method of manufacturing an IC tag, further comprising a step of connecting each electrode of an IC chip to a different conductor by ultrasonic bonding or thermocompression bonding.

  The present invention is a method for manufacturing an IC tag, further comprising a step of connecting an enlarged electrode of an interposer to an antenna circuit of a base sheet by caulking, ultrasonic bonding, thermocompression bonding, or welding.

  According to the present invention, the interposer can be easily and firmly joined to the antenna circuit, and the IC chip can be protected without requiring any special post-process. Further, the contact between the enlarged electrode of the interposer and the antenna circuit is reliably electrically connected, and the enlarged electrode of the interposer and the circuit portion other than the contact of the antenna circuit are reliably insulated.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 to 8 show an IC tag, an interposer, a wound sheet of a conductor formed sheet used in the IC tag, a wound sheet of a sheet with an interposer, a manufacturing method of an IC tag, a wound sheet of a conductor formed sheet, according to the present invention. It is a figure which shows the manufacturing method and the manufacturing method of the winding body of a sheet | seat with an interposer.

  1 is a partial cross-sectional view showing an embodiment of an IC tag according to the present invention, FIG. 2 is a perspective view showing an antenna-formed sheet of the IC tag, and FIG. 3 shows a method for manufacturing the IC tag. FIG. 4 is a schematic perspective view showing a manufacturing method of an interposer, and FIG. 5 shows a manufacturing method of an embodiment of a wound body of a conductor-formed sheet used for an IC tag according to the present invention. FIG. 6 is a schematic perspective view, FIG. 6 is a schematic perspective view showing a manufacturing method of an embodiment of a wound body of a sheet with an interposer according to the present invention, and FIG. 7 is a cross-sectional view taken along line AA in FIG. FIG. 8 is a perspective view showing a modification of the support sheet laminated with the conductors.

  First, the IC tag 1 will be described with reference to FIGS.

  As shown in FIGS. 1 and 3, the IC tag 1 includes an interposer 2 and an antenna-formed sheet 3.

  Among these, as shown in FIG. 3, the interposer 2 is a pair of enlarged sheets in which a non-conductive adhesive 17 is applied to the entire surface of the support sheet 10 and the side that does not face the support sheet 10 while being laminated on the support sheet 10. It consists of an electrode 13 and an IC chip 15.

  Depending on the frequency band of electromagnetic waves used when transmitting / receiving data to / from the reader / writer, a pair of enlarged electrodes functions as an antenna, and an interposer having a pair of enlarged electrodes and an IC chip is combined with the antenna-formed sheet 3. Without being used as an IC tag. The term interposer in the present application is a concept including such an IC tag.

  As shown in FIG. 3, the IC chip 15 is disposed on the surface of the enlarged electrode 13 on which the nonconductive adhesive 17 is applied, and is fixed to the enlarged electrode 13 by the nonconductive adhesive 17. Further, the IC chip 15 has a pair of electrodes 15a with sharp tips. Each electrode 15a is pierced, contacted, or metal-bonded to a different enlarged electrode 13, whereby the electrode 15a and the enlarged electrode 13 are electrically connected.

  Such a support sheet 10 is made of non-conductive paper, PET, or the like, and the enlarged electrode 13 is made of conductive foil such as conductive aluminum or copper, conductive ink, or the like. Moreover, in this Embodiment, the nonelectroconductive adhesive 17 consists of a pressurization adhesion type adhesive which has insulation, such as a natural rubber type | system | group and a urethane type, for example.

  Next, the antenna-formed sheet 3 will be described with reference to FIG. The antenna-formed sheet 3 includes a base sheet 20 and an antenna circuit 22. Among these, as shown in FIG. 2, the antenna circuit 22 is formed of, for example, a spiral circuit portion 22b and a pair of contact points 22a including both ends of the circuit portion 22b. Such an antenna-formed sheet 3 is produced by, for example, etching the antenna circuit 22 on the base material sheet 20, transferring the foil, or printing it with a printing machine. The base sheet 20 is made of non-conductive paper, PET, or the like, and the antenna circuit 22 is made of conductive foil such as aluminum or copper having conductivity or conductive ink.

  As shown in FIGS. 1 and 3, the interposer 2 is disposed on the antenna-formed sheet 3 so that the surface of the interposer 2 on the IC chip 15 side faces the surface of the antenna-formed sheet 3 on the antenna circuit 22 side. ing. Each enlarged electrode 13 of the interposer 2 is electrically connected to a different contact 22a of the antenna circuit 22 by melting or breaking a non-conductive adhesive layer by thermocompression bonding, ultrasonic bonding or caulking (see FIG. 1).

  In such an IC tag 1, the interposer 2 is joined to the antenna-formed sheet 3 through the most surface of the interposer 2 with a nonconductive adhesive 17. Therefore, the interposer 2 and the antenna-formed sheet 3 are firmly joined, and the interposer 2 can be prevented from being peeled off from the antenna-formed sheet 3 during use of the IC tag 1.

  The IC chip 15 is disposed between the support sheet 10 and the base sheet 20. Therefore, it is possible to prevent the IC chip 15 from being damaged due to contact with the outside during use of the IC tag 1.

  Next, a method for manufacturing the IC tag 1 and the IC tag interposer 2 will be described with reference to FIGS.

  First, a method for manufacturing the interposer 2 will be described with reference to FIG.

  As shown in FIG. 4, the support sheet 10 extending in a belt shape is first supplied and sent to the nip roller 25, and the conductor 12 extending in a belt shape along the support sheet 10 is supplied and sent to the nip roller 25. During this time, a pressure bonding type adhesive (not shown) is applied between the support sheet 10 and the conductor 12. Thereafter, the support sheet 10 and the conductor 12 are pressure-bonded by the nip roller 25, whereby the support sheet 10 and the conductor 12 are bonded and fixed to each other, and the conductor 12 is laminated on the support sheet 10. In the present embodiment, as shown in FIG. 4, the width of the conductor 12 and the width of the support sheet 10 are the same, but are not limited thereto, and may be different.

  Next, as shown in FIG. 4, the nonconductive adhesive 17 is applied to the entire surface of the conductor 12 on the side not facing the support sheet 10 by the coating device 27. Then, the conductor 12 is cut | disconnected by the cutter 29 in the center of the width direction along the longitudinal direction (it is also called a flow direction) shown by a thick arrow, and the conductor 12 is divided into a pair. In the present invention, the width direction is a direction (a direction connecting the lower left and the upper right in FIG. 4) perpendicular to the feeding direction (the arrow direction in FIG. 4) of the support sheet extending in a strip shape.

  In this case, the conductor 12 is cut so that the width W of the gap between the pair of conductors 12 is smaller than the width between the electrodes 15 a of the IC chip 15. Moreover, as shown in FIG. 4, the cutting by the cutter 29 is a so-called half cut, and the entire thickness of the laminate of the conductor 12 and the support sheet 10 is not cut, but only the conductor 12 is divided and the support sheet is cut. 10 is not divided.

  As described above, the non-conductive adhesive 17 is applied to the entire surface of the support sheet 10 extending in a belt shape and the side of the support sheet 10 that does not face the support sheet 10 and extends along the support sheet 10. A conductor-formed sheet 6 having a pair of conductors 12 separated from each other is obtained.

  In the step of forming the conductor-formed sheet 6, the non-conductive adhesive 17 may be applied after the conductor 12 is cut by the cutter 29.

  Thereafter, as shown in FIG. 4, IC chips 15 having a pair of electrodes 15 a are sequentially mounted on the surface of the conductor 12 to which the non-conductive adhesive 17 of the conductor-formed sheet 6 is applied. In this case, the IC chip 15 is positioned on the conductor-formed sheet 6 after the electrodes 15 a are positioned so as to face different conductors 12. At this time, since the IC chip 15 is bonded and fixed on the conductor-formed sheet 6 by the non-conductive adhesive 17, it does not deviate from the position once positioned and arranged during the manufacturing process.

  At this time, when the IC chip 15 is pushed into the conductor-formed sheet 6, the electrode 15 a having a sharp tip of the IC chip 15 is pierced into contact with the conductor 12. Thereby, the IC chip 15 is more firmly fixed on the conductor 12. Further, even if the non-conductive adhesive 17 is disposed between the IC chip 15 and the conductor 12, the electrical connection between each electrode 15a of the IC chip 15 and each conductor 12 can be reliably obtained. be able to.

  Still further, the IC chip 15 and the conductor-formed sheet 6 may be ultrasonically bonded by applying ultrasonic vibration. In this case, the non-conductive adhesive 17 layer is melted or broken, the electrode 15a of the IC chip 15 and the conductor 12 are metal-bonded, and the IC chip 15 is securely fixed on the conductor 12, and each electrode The electrical connection between 15a and each conductor 12 can be obtained reliably.

  As described above, the non-conductive adhesive 17 is applied to the entire surface of the support sheet 10 extending in a belt shape and the side of the support sheet 10 that does not face the support sheet 10 and extends along the support sheet 10. A sheet 7 with an interposer having a pair of conductors 12 spaced apart from each other and a large number of IC chips 15 provided on the conductors 12 is formed.

  After that, as shown in FIG. 4, the sheet 7 with the interposer is cut for each IC chip 15 by the cutting cutter 31, and the pair of enlarged electrodes 13 are formed from the pair of conductors 12. A pair of enlarged electrodes 13 laminated on the sheet 10 and coated with a non-conductive adhesive 17 on the entire surface not facing the support sheet 10, and an IC chip 15 connected to the enlarged electrode 13 were provided. Interposer 2 is obtained. In this case, instead of cutting with the cutting cutter 31, the interposer 2 may be obtained by punching the sheet 7 with the interposer for each IC chip 15 by a punching device.

  Next, a method of manufacturing the IC tag 1 by arranging the interposer 2 manufactured as described above on the antenna-formed sheet 3 will be described with reference to FIG. As described above, the antenna-formed sheet 3 can be obtained by printing the antenna circuit 22 on the base sheet 20, etching, or transferring a foil.

  First, the interposer 2 is arranged on the antenna-formed sheet 3. In this case, as shown in FIG. 3, the surface of the interposer 2 on the IC chip 15 side faces the surface of the antenna-formed sheet 3 on the antenna circuit 22 side, and each enlarged electrode 13 of the interposer 2 has a different antenna circuit 22. After being positioned, the interposer 2 is placed on the antenna-formed sheet 3 so as to be placed on the contact 22a.

  At this time, the non-conductive adhesive 17 is applied to the entire surface of the enlarged electrode 13 of the interposer 2 facing the antenna-formed sheet 3, so that the interposer 2 has the enlarged electrode 13 facing the antenna-formed sheet 3. Are bonded and fixed to the antenna-formed sheet 3 through the entire surface. Thus, since the interposer 2 and the antenna-formed sheet 3 are bonded and fixed over a wide area, the joint between the interposer 2 and the antenna-formed sheet 3 becomes strong.

  In this case, since the non-conductive adhesive 17 is disposed between the conductive expansion electrode 13 and the antenna circuit 22, the antenna circuit 22 is insulated from the expansion electrode 13 and is electrically connected. There is nothing. Thereby, it is possible to prevent the antenna circuit 22 from being short-circuited by the enlarged electrode 13.

  Thereafter, the enlarged electrode 13 and the contact 22a of the antenna circuit 22 are joined by caulking between the enlarged electrode 13 of the interposer 2 and the contact 22a of the antenna circuit 22 facing each other. As a result, even if the non-conductive adhesive 17 is disposed between the enlarged electrode 13 and the contact 22a of the antenna circuit 22, the electrical connection between the enlarged electrode 13 of the interposer 2 and the contact 22a of the antenna circuit 22 is achieved. Bonding can be reliably obtained. Note that the enlarged electrode 13 of the interposer 2 and the contact 22a of the antenna circuit 22 may be joined using ultrasonic bonding, thermocompression bonding, or welding instead of caulking. Even in this case, the nonconductive adhesive layer can be melted or broken, and an electrical connection between the enlarged electrode 13 of the interposer 2 and the contact 22a of the antenna circuit 22 can be reliably obtained.

  Thus, the antenna-formed sheet 3 composed of the base sheet 20 and the antenna circuit 22, the pair of enlarged electrodes 13 coated with the non-conductive adhesive 17 and the IC chip 15, and the IC chip 15. 2 is obtained.

  As described above, according to the present embodiment of the IC tag 1, the interposer 2 is joined to the antenna-formed sheet 3 through the most surface of the interposer 2 by the nonconductive adhesive 17. Therefore, the interposer 2 and the antenna-formed sheet 3 are firmly joined, and the interposer 2 can be prevented from being peeled off from the antenna-formed sheet 3 during use of the IC tag 1.

  The IC chip 15 is disposed between the support sheet 10 and the base sheet 20. Therefore, it is possible to prevent the IC chip 15 from being damaged due to contact with the outside during use of the IC tag 1. As a result, a post-process such as a laminating process for protecting the IC chip 15 becomes unnecessary, and the cost can be reduced.

  Further, a non-conductive adhesive 17 is applied between the IC chip 15 and the enlarged electrode 13, but the IC chip 15 has an electrode 15 a having a sharp tip, and this electrode 15 a is inserted into the enlarged electrode 13. The electrode 15a of the IC chip 15 and the enlarged electrode 13 are reliably electrically connected. Similarly, a non-conductive adhesive 17 is also applied between the enlarged electrode 13 and the contact 22a of the antenna circuit 22, but the contact 22a between the enlarged electrode 13 and the antenna circuit 22 by caulking, ultrasonic bonding or thermocompression bonding. Are securely connected electrically. On the other hand, since the non-conductive adhesive 17 is also applied between the enlarged electrode 13 and the antenna circuit 22 part, the enlarged electrode 13 and the circuit part 22b of the antenna circuit 22 are surely insulated, and the antenna circuit 22 short circuit can be prevented.

  Further, according to the present embodiment, after the conductor 12 is laminated on the support sheet 10, the non-conductive adhesive 17 is applied to the entire surface of the conductor 12 on the side not facing the support sheet 10, and the conductor The conductor formed sheet 6 can be obtained by making a cut along the feeding direction at the center of the width direction of 12. The interposer 2 can be obtained by sequentially disposing the IC chips 15 on the conductors 12 of the conductor-formed sheet 6 and then cutting or punching each IC chip 15. Furthermore, the above-described IC tag 1 can be easily obtained by arranging the interposer 2 on the antenna-formed sheet 3 with the surface of the interposer 2 on which the enlarged electrode 13 is provided facing the antenna circuit 22 side.

  According to such a manufacturing method, since the non-conductive adhesive 17 is applied to the entire surface of the conductor 12, the non-conductive adhesive 17 can be easily applied compared to a case where the non-conductive adhesive 17 is applied only to a part. Can do.

  Further, once the IC chip 15 is mounted on the conductor 12, the position of the IC chip 15 is fixed by the non-conductive adhesive 17, and there is no deviation in the subsequent process. Can be easily manufactured.

  Furthermore, once the interposer 2 is placed on the antenna-formed sheet 3, the position of the interposer 2 is fixed by the non-conductive adhesive 17, and the interposer 2 will not be displaced in the subsequent process. A quality IC tag 1 can be easily manufactured.

  Furthermore, since the enlarged electrode 13 and the antenna circuit 22 are reliably insulated by the non-conductive adhesive 17 disposed between them, there is no need to position the interposer 2 with high accuracy and high quality can be achieved stably. The IC tag 1 can be easily manufactured.

  In the present embodiment, the example in which the non-conductive adhesive 17 is applied to the entire surface of the conductor 12 on the side not facing the support sheet 10 is shown, but the present invention is not limited thereto. An anisotropic conductive adhesive is applied to the portion of the conductor 12 where the IC chip 15 is disposed, and a non-conductive adhesive is applied to the other surface of the conductor 12 that does not face the support sheet 10. You may make it apply | coat. The anisotropic conductive adhesive is made of a nonconductive thermosetting resin containing conductive particles such as nickel and silver. Therefore, even if the anisotropic conductive adhesive is applied so as to straddle the pair of conductors, the pair of conductors 12 do not conduct with each other. Further, as in the case of coating on the entire surface, the expansion electrode 13 and the circuit portion 22 b of the antenna circuit 22 are reliably insulated by the nonconductive adhesive 17. On the other hand, between the electrode 15a of the IC chip 15 and the enlarged electrode 13 (conductor 12) by thermocompression bonding between the electrode 15a of the IC chip 15 and the enlarged electrode 13 (conductor 12). Can be reliably electrically connected via the conductive particles. Furthermore, the electrode 15a of the IC chip 15 and the enlarged electrode 13 (conductor 12) may be metal-bonded by ultrasonic bonding to be electrically bonded.

  Further, in the present embodiment, the IC chip 15 has an electrode 15a having a sharp tip, and the tip of the IC chip 15 is pierced or brought into contact with the enlarged electrode 13 (conductor 12) or by metal bonding. Although the example which electrically connects 15a and the expansion electrode 13 (conductor 12) was shown, it is not restricted to this. The IC chip 15 has an electrode having a flat tip, and this electrode and the enlarged electrode 13 (conductor 12) may be bonded by ultrasonic bonding or thermocompression bonding. Thereby, even if the non-conductive adhesive 17 or the anisotropic conductive adhesive described above is disposed between the electrode 15a of the IC chip 15 and the enlarged electrode 13 (conductor 12), the IC chip 15 The electrode 15a and the enlarged electrode 13 (conductor 12) can be reliably electrically joined.

  Further, in the present embodiment, as shown in FIG. 4, the interposer is formed from the support sheet 10, the conductor 12 coated with the nonconductive adhesive 17, and the IC chip 15 by one continuous process. Although the example which forms 2 was shown, it is not restricted to this. A non-conductive adhesive 17 is applied to the entire surface of the support sheet 10 extending in a band shape and provided on the support sheet 10 and not facing the support sheet 10, and extends along the support sheet 10 to be separated from each other. It is good also as one continuous process until it forms the wound body 8 of a conductor formed sheet | seat by winding the conductor formed sheet 6 which has the body 12 in the winding core 8a.

  FIG. 5 is a perspective view showing a method of manufacturing the wound body 8 of such a conductor-formed sheet. In FIG. 5, the same parts as those of the above-described embodiment shown in FIGS.

  Such a conductor-formed sheet wound body 8 is prepared in advance, and various types of IC tags 1 are efficiently manufactured by putting them in each line on which IC chips 15 of different standards are mounted. Can do.

  Moreover, when producing the wound body 8 of such a conductor-formed sheet, it is preferable to perform a peeling process on the entire surface of the support sheet 10 that does not face the conductor 12, or to laminate release paper. . In this case, in the wound body 8 of the conductor-formed sheet wound in a band shape, the surface of the conductor 12 on which the non-conductive adhesive 17 is applied is peeled off by peeling processing of the support sheet 10 or lamination of release paper. Face the treated surface (FIG. 5). Thereby, the conductor formed sheet 6 can be easily fed out from the wound body 8 of the conductor formed sheet.

  Further, similarly, the non-conductive adhesive 17 is applied to the entire surface of the support sheet 10 extending in a strip shape and the side provided on the support sheet 10 and not facing the support sheet 10, and extends along the support sheet 10 to be separated from each other. The sheet 9 with an interposer having the pair of conductors 12 and a large number of IC chips 15 provided on the conductor 12 is wound around the winding core 9a to wind the sheet 9 with a sheet with an interposer. It is good also as one continuous process until it forms.

  FIG. 6 is a perspective view showing a method of manufacturing such a wound body 9 of a sheet with an interposer. In FIG. 6, the same parts as those of the above-described embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  Such a sheet 9 with an interposer is produced in advance and put into each line to be mounted on the antenna-formed sheet 3 having a different shape, thereby efficiently producing various types of IC tags 1. be able to.

  When producing such a sheet 9 with a sheet with an interposer, the entire surface of the sheet 7 with an interposer 7 on the side of the IC chip 15 is subjected to a peeling process, or the release paper 23 is laminated as shown in FIG. preferable. Thereby, the sheet | seat 7 with an interposer can be easily drawn out from the wound body 9 of a sheet | seat with an interposer.

  Further, as shown in FIG. 7, before the laminate 24 in which the release paper 23 is laminated on the interposer-attached sheet 7 is wound around the take-up core 9a, the interposer-attached sheet 7 side (the lower side in FIG. 6) with respect to the laminate 24. From the above, it is more preferable to make a cut 33 for each IC chip 15 in accordance with the size of the interposer 2. The cut 33 in this case is a so-called half cut, and the release paper 23 is not completely divided. FIG. 7 shows a cross-sectional view (A-A portion in FIG. 6) of the sheet 7 with an interposer into which the cuts 33 are made.

  As shown in FIG. 7, the conductor 12 coated with the support sheet 10 and the nonconductive adhesive 17 is divided by the notch 33. In this case, the laminate 24 of the interposer-attached sheet 7 and the release paper 23 can be easily fed out from the wound body 9 of the interposer-attached sheet, and the support sheet 10 and the pair of conductors 12 can be fed out from the fed-out laminate 24. The interposer 2 having the pair of enlarged electrodes 13 and the IC chip 15 formed from can be easily removed. Since the adhesive layer made of non-conductive adhesive 17 is formed on the enlarged electrode 13 of the peeled interposer 2, the interposer 2 can be placed in a desired place without applying an adhesive again, so-called sealing. Can be pasted.

  Although the cut shape is illustrated as a rectangular shape surrounding the IC chip 15, the shape is not limited to this, and a straight cut along the width direction may be provided on both sides of the IC chip 15 in the feed direction.

  By the way, in this Embodiment, as shown in FIG. 4, the conductor 12 laminated | stacked on the support sheet 10 was half-cut, and the example which forms a pair of conductor 12 on the support sheet 10 by this was shown. However, it is not limited to this. A pair of conductors 12 cut in advance may be laminated on the support sheet 10. Moreover, the conductor 12 can be laminated | stacked on the support sheet 10 also by printing of etching or conductive ink. According to such a method, the pair of conductors 12 spaced along the width direction of the support sheet 10 can be provided on the support sheet 10 without being half-cut by the cutter 29.

  Further, when etching or printing of conductive ink is used, as shown in FIG. 8, the conductors 12 that are separated from each other along the width direction of the support sheet 10 are paired along the longitudinal direction of the support sheet 10. Many pairs can be provided. Thus, the non-conductive adhesive is applied to the support sheet 10 extending in a belt shape and the surface of the support sheet 10 that is provided on the support sheet 10 and does not face the support sheet 10, and is disposed along the longitudinal direction of the support sheet 10. A conductor-formed sheet having many pairs of conductors 22 can be obtained. Further, using such a conductor-formed sheet, the IC tag 10, the interposer 2, the interposer-attached sheet 7, the interposer-attached sheet winding 9, and the conductor-formed sheet winding 8 are manufactured by the above-described method. can do.

  When applying the non-conductive adhesive, not only the conductor 12 but also the non-conductive adhesive 17 is applied to the entire surface of the conductor-formed sheet 6 on the side where the conductor 12 is laminated. Good.

1 is a partial cross-sectional view showing an embodiment of an IC tag according to the present invention. The perspective view which shows the antenna-formed sheet | seat of an IC tag. The side view which shows the manufacturing method of an IC tag. The schematic perspective view which shows the manufacturing method of the interposer of an IC tag. The schematic perspective view which shows the manufacturing method of one Embodiment of the winding body of the conductor formed sheet | seat used for the IC tag by this invention. The schematic perspective view which shows the manufacturing method of one Embodiment of the wound body of the sheet | seat with an interposer by this invention. Sectional drawing along line AA of FIG. The perspective view which shows the modification of the support sheet laminated | stacked on the conductor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC tag 2 Interposer 3 Antenna formed sheet 6 Conductor formed sheet 7 Interposer sheet 8 Conductor formed sheet roll 8a Winding core 9 Interposer sheet wound 9a Winding core 10 Support sheet 12 Conductor 13 Enlarged electrode 15 IC chip 15a Electrode 17 Non-conductive adhesive 20 Base sheet 22 Antenna circuit 22a Contact 23 Release paper

Claims (14)

An antenna-formed sheet comprising a base sheet and an antenna circuit;
Arranged on the antenna-formed sheet, connected to the support sheet, a pair of enlarged electrodes provided on the support sheet and coated with a non-conductive adhesive on the side not facing the support sheet, and the enlarged electrode An interposer having an IC chip,
The IC chip side surface of the interposer faces the antenna circuit side surface of the antenna-formed sheet,
An IC tag, wherein the enlarged electrode of the interposer is caulked to an antenna circuit and connected by ultrasonic waves or thermocompression bonding.   2. The IC tag according to claim 1, wherein each electrode of the IC chip is connected to a different enlarged electrode by ultrasonic bonding or thermocompression bonding. A support sheet;
A pair of enlarged electrodes provided on the support sheet and coated with a non-conductive adhesive on the side that does not face the support sheet;
An interposer comprising an IC chip connected to an enlarged electrode. A support sheet extending in a strip shape, and a pair of conductors provided on the support sheet, coated with a non-conductive adhesive on a surface not facing the support sheet, and extending along the support sheet and spaced apart from each other It has a conductor-formed sheet,
A wound body of a conductor-formed sheet used for an IC tag, which is wound around a winding core. A support sheet extending in a band shape, and a plurality of pairs of conductors provided on the support sheet and coated with a non-conductive adhesive on a surface that does not face the support sheet, and disposed along the longitudinal direction of the support sheet; Comprising a conductor-formed sheet having
A wound body of a conductor-formed sheet used for an IC tag, which is wound around a winding core.   6. The wound body of a conductor-formed sheet used for an IC tag according to claim 4, wherein a surface of the support sheet that does not face the conductor is peeled. A support sheet extending in a strip shape, a pair of conductors provided on the support sheet, coated with a non-conductive adhesive on a surface not facing the support sheet, extending along the support sheet and spaced apart from each other, and conductive A sheet with an interposer having a large number of IC chips provided on the body,
A wound body of a sheet with an interposer, which is wound around a winding core. A support sheet extending in a band shape, and a plurality of pairs of conductors provided on the support sheet and coated with a non-conductive adhesive on a surface that does not face the support sheet, and disposed along the longitudinal direction of the support sheet; A sheet with an interposer having a number of IC chips provided on a conductor,
A wound body of a sheet with an interposer, which is wound around a winding core.   The wound body of the sheet with an interposer according to any one of claims 7 and 8, further comprising release paper laminated on a surface of the sheet with an interposer on the IC chip side.   Each IC chip is cut from the surface on the sheet side with an interposer, and the interposer having a support sheet, a pair of enlarged electrodes coated with a non-conductive adhesive, and an IC chip can be removed from the release paper. The roll of the sheet | seat with an interposer of Claim 9 characterized by the above-mentioned. A conductive sheet having a belt-like support sheet and a pair of conductors that are laminated on the support sheet and coated with a non-conductive adhesive on a surface that does not face the support sheet, and that extend along the support sheet and are separated from each other. Preparing a body-formed sheet;
An IC chip having a pair of electrodes is sequentially arranged on the surface of the conductor-formed sheet on which the non-conductive adhesive is applied, and a support sheet, a pair of conductors, and a large number of IC chips. Forming a sheet with an interposer having:
Punching or cutting a sheet with an interposer for each IC chip, forming an enlarged electrode from a conductor, and forming an interposer having a support sheet, a pair of enlarged electrodes, and an IC chip;
Preparing an antenna-formed sheet formed by forming an antenna circuit on a base sheet;
A method of manufacturing an IC tag, comprising: placing an interposer on an antenna-formed sheet by causing the surface on the IC chip side of the interposer to face the antenna-side surface of the antenna-formed sheet. A support sheet extending in a strip shape, and a plurality of pairs of conductors that are laminated on the support sheet and coated with a non-conductive adhesive on the surface that does not face the support sheet, and are arranged along the longitudinal direction of the support sheet Preparing a conductor-formed sheet having,
An IC chip having a pair of electrodes is sequentially arranged on the surface of the conductor-formed sheet on which the non-conductive adhesive is applied, and a support sheet, a large number of pairs of conductors, and a large number of ICs Forming a sheet with an interposer having a chip;
Punching or cutting a sheet with an interposer for each IC chip, forming an enlarged electrode from a conductor, and forming an interposer having a support sheet, a pair of enlarged electrodes, and an IC chip;
Preparing an antenna-formed sheet formed by forming an antenna circuit on a base sheet;
A method of manufacturing an IC tag, comprising: placing an interposer on an antenna-formed sheet by causing the surface on the IC chip side of the interposer to face the antenna-side surface of the antenna-formed sheet.   The method for manufacturing an IC tag according to claim 11, further comprising a step of connecting each electrode of the IC chip to a different conductor by ultrasonic bonding or thermocompression bonding.   The IC according to any one of claims 11 and 12, further comprising a step of connecting the enlarged electrode of the interposer to the antenna circuit of the base sheet by caulking, ultrasonic bonding, thermocompression bonding, or welding. Tag manufacturing method.

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