JP2005303187A - Adjusting method of device for inspecting semiconductor laser equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately adjust an optical unit of an inspecting device of a semiconductor laser equipment within a short amount of time. <P>SOLUTION: A beam profiler 7 for measuring a positioning device 2 and an optical power is provided to a fixture 6 for adjusting, and the semiconductor laser device 1 is fixed by the positioning device 2. An X-Y position of a collimating lens is adjusted so that a median point of a direct laser beam emitted from the semiconductor laser device 1 and a parallel beam 11 shaped by the collimating lens 3 is correspondent. An inclination between the positioning device 2 and a collimating lens 3 is adjusted so that an intensity distribution characteristic of the laser beam is symmetric. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is applied to adjustment in an inspection apparatus for a semiconductor laser device, and relates to an adjustment method for adjusting an apparatus and an optical system using intensity distribution characteristics of laser light emitted from the semiconductor laser device.

  A semiconductor laser device used for picking up an optical disc has a semiconductor laser element and a light receiving element mounted therein, and a hologram element is mounted on the semiconductor laser device. Laser light emitted from the semiconductor laser device passes through a collimating lens and an actuator on an inspection device as described in Japanese Patent Application No. 2003-405854, and is reflected by the optical disk surface to return to the semiconductor laser. Light is received by a light receiving element inside the apparatus. The optical signal output detected by the light receiving unit is combined to generate a reproduction signal, a focus error signal, and a tracking error signal, and the quality of the semiconductor laser device is determined by quantifying them.

  Next, a method for adjusting a conventional inspection apparatus for a semiconductor laser device will be described.

  The collimating lens used in the conventional inspection apparatus acts to shape the beam emitted from the semiconductor laser, and the XY position, tilt, and distance need to be adjusted with high accuracy with respect to the semiconductor laser apparatus. is there.

  Regarding the adjustment of the XY position or tilt of the collimator lens, the angle of collimated beam shaped by the collimator lens is measured using an autocollimator, and the XY position and tilt of the collimator lens so that there is no tilt with respect to the semiconductor laser device. Adjustments are being made.

  However, in the conventional technique, the autocollimator can measure the angle of the laser beam, but cannot measure the center position of the optical axis. Therefore, even if the positioning device 2 of the semiconductor laser device 1 is tilted as shown in FIG. Since correction can be performed at the position of the lens 3, it is difficult to configure an inspection apparatus having an ideal optical unit equivalent to the optical pickup apparatus. Therefore, a large adjustment time is required until a desired correlation with the reference inspection apparatus is obtained.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art and to provide an adjustment method that enables high-precision and short-time adjustment in adjustment of an optical unit of an inspection apparatus for a semiconductor laser device.

  In order to solve the above problems, an adjustment method in an inspection apparatus for a semiconductor laser device according to the present invention includes a positioning apparatus for a semiconductor laser device and an inspection apparatus for a semiconductor laser device having an optical element for shaping laser light emitted from the semiconductor laser device. In the method of adjusting a semiconductor laser device inspection apparatus, wherein a light intensity measuring device for measuring a light intensity distribution of laser light incident on a laser light path extension line passing through the optical element from the semiconductor laser device is disposed, Adjusting the position and inclination in a two-dimensional direction in a plane substantially perpendicular to the laser beam of the positioning device so that the first light intensity distribution becomes a desired distribution by removing from the laser optical path; In a two-dimensional direction on a plane substantially perpendicular to the laser beam of the optical element so that the second light intensity distribution becomes a desired distribution, and Characterized by a step of adjusting the can.

  Here, the optical element is removed from the laser beam path, and the position in the two-dimensional direction on a plane substantially perpendicular to the laser beam of the positioning device is set so that the first light intensity distribution is symmetric with respect to the optical axis of the laser beam. And the step of adjusting the inclination, the optical element is put in the laser beam path, the second light intensity distribution is symmetric with respect to the optical axis of the laser beam, and the center of gravity of the first light intensity distribution and the first And adjusting the position and inclination of the two-dimensional direction in a plane substantially perpendicular to the laser beam of the optical element so that the center of gravity of the light intensity distribution of the optical element coincides.

  Further, the optical element is removed from the laser beam path, and the position in the two-dimensional direction on a plane substantially perpendicular to the laser beam of the positioning device is set so that the first light intensity distribution is symmetrical with respect to the optical axis of the laser beam. The step of adjusting the tilt, the optical element is placed in the laser light path, the second light intensity distribution is symmetric with respect to the optical axis of the laser light, and the peak of the first light intensity distribution and the first There may be included a step of adjusting the position and inclination in a two-dimensional direction in a plane substantially perpendicular to the laser beam of the optical element so that the peak of the light intensity distribution matches.

  Thus, by the adjustment method in the inspection apparatus of the semiconductor laser device according to the present invention, the light intensity distribution of the laser beam emitted from the semiconductor laser device is measured using the light intensity distribution measuring device without the collimating lens, Furthermore, the light intensity distribution of the laser light emitted from the laser device is measured using a light intensity distribution measuring instrument with the collimating lens inserted in the optical path of the laser light, and the center of gravity or peak position of the light intensity distribution of both coincides. In this manner, the XY position of the collimating lens (the position in the two-dimensional direction in a plane substantially perpendicular to the laser beam) is adjusted, and the inclination of the collimating lens is adjusted by the symmetry of the intensity distribution.

  According to the present invention, it is possible to detect the XY position and the tilt of the collimating lens from the intensity distribution characteristic in the adjustment of the inspection device of the semiconductor laser device. Therefore, the optical unit of the inspection apparatus can be easily adjusted with high accuracy to an optical unit equivalent to the optical pickup apparatus, and the time required for adjustment of the optical unit can be shortened.

  Embodiments of an inspection apparatus adjustment method according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a configuration diagram of an inspection device for a semiconductor laser device. The inspection device for a semiconductor laser device includes a semiconductor laser device 1 in which a semiconductor laser, a light receiving element, and a hologram element are integrated, and a positioning for fixing the semiconductor laser device 1. The apparatus 2 includes a collimating lens 3 that shapes laser light emitted from the semiconductor laser device into parallel light, an actuator 4, and a disk 5.

  An adjustment method in the inspection apparatus of this embodiment will be described.

  In adjusting the inclination of the positioning device, as shown in FIG. 2, the positioning device 2 is installed on an adjustment jig 6 and the semiconductor laser device 1 having ideal intensity distribution characteristics is fixed. A beam profiler 7 for measuring the light intensity distribution is installed at the position A, the semiconductor laser is emitted, and the first light intensity distribution is measured.

  When the positioning device of the semiconductor laser device is inclined, a characteristic having no symmetry such as an intensity distribution characteristic 8 shown in FIG. 4 is shown. The inclination of the positioning device is adjusted so that the intensity distribution characteristic becomes a symmetrical intensity distribution characteristic 9.

  The laser light directly from the semiconductor laser is measured without the tilt, and the centroid (or peak) 10 of the first light intensity distribution as shown in FIG. 5 is measured and stored.

  Next, in the adjustment of the collimating lens 3, the collimating lens 3 is installed at the position B as shown in FIG. The height position is adjusted so that the semiconductor laser emits light and the light shaped by the collimating lens 3 becomes parallel light 11 that is not condensed or diffused.

  And the inclination adjustment of the collimating lens 3 measures the parallel light 11 with the beam profiler 7, and measures 2nd light intensity distribution. The second light intensity distribution characteristic is adjusted to be a symmetrical light intensity distribution characteristic 9 shown in FIG.

  Further, the XY position adjustment of the collimating lens 3 is such that the centroid (peak) 12 of the second light intensity distribution coincides with the centroid (peak) 10 of the first light intensity distribution, and the intensity distribution characteristics are symmetrical. Adjust to keep.

  The present invention is applied to an adjustment method and an adjustment device in an inspection of a semiconductor laser device, and is useful also in an assembly adjustment device of a semiconductor laser device.

Configuration diagram of an inspection apparatus for a semiconductor laser device for explaining an embodiment of the present invention Explanatory drawing which concerns on adjustment of the positioning device in the semiconductor laser apparatus of this embodiment Explanatory drawing which concerns on adjustment of the collimating lens in the semiconductor laser apparatus of this embodiment The figure which shows the light intensity distribution characteristic of the semiconductor laser apparatus measured with the beep profiler of this embodiment The figure which shows the gravity center of the light intensity distribution of the semiconductor laser apparatus measured with the beep profiler of this embodiment Explanatory drawing which concerns on the subject at the time of adjusting the inspection apparatus of the conventional semiconductor laser apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor laser apparatus 2 Positioning apparatus 3 Collimating lens 4 Actuator 5 Disc 6 Adjustment jig 7 Beam profiler 8 Asymmetric light intensity distribution 9 Symmetric light intensity distribution 10 Center of gravity 11 of direct light intensity distribution of laser light Parallel light 12 Parallel light Centroid of light intensity distribution

Claims (3)

In a semiconductor laser apparatus positioning apparatus and a semiconductor laser apparatus inspection apparatus having an optical element for shaping laser light emitted from the semiconductor laser apparatus, the semiconductor laser apparatus is incident on a laser light path extension line passing through the optical element. An adjustment method in an inspection apparatus of a semiconductor laser device in which a light intensity measuring device for measuring a light intensity distribution of laser light is arranged,
Removing the optical element from the laser light path and adjusting the position and inclination of the positioning device in a two-dimensional direction in a plane substantially perpendicular to the laser light so that the first light intensity distribution becomes a desired distribution; ,
Placing the optical element in the laser beam path and adjusting the position and inclination of the optical element in a two-dimensional direction in a plane substantially perpendicular to the laser beam so that the second light intensity distribution becomes a desired distribution; A method of adjusting an inspection apparatus for a semiconductor laser device, comprising: 2 in a plane substantially perpendicular to the laser beam of the positioning device so that the optical element is removed from the laser beam path and the first light intensity distribution is symmetric with respect to the optical axis of the laser beam. Adjusting the position and inclination in the dimensional direction;
The optical element is placed in the laser optical path, and the second light intensity distribution is symmetric with respect to the optical axis of the laser light, and the center of gravity of the first light intensity distribution and the first light intensity 2. The semiconductor laser device according to claim 1, further comprising a step of adjusting a position and inclination of a two-dimensional direction in a plane substantially perpendicular to the laser beam of the optical element so that a center of gravity of the distribution coincides. Adjustment method in the inspection apparatus. 2 in a plane substantially perpendicular to the laser beam of the positioning device so that the optical element is removed from the laser beam path and the first light intensity distribution is symmetric with respect to the optical axis of the laser beam. Adjusting the position and inclination in the dimensional direction;
The optical element is placed in the laser optical path, and the second light intensity distribution is symmetric with respect to the optical axis of the laser light, and the peak of the first light intensity distribution and the first light intensity 2. The semiconductor laser device according to claim 1, further comprising a step of adjusting a position and inclination of a two-dimensional direction in a plane substantially perpendicular to the laser beam of the optical element so that a distribution peak coincides. Adjustment method in the inspection apparatus.

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