JP2005303076A - Method for manufacturing substrate with patternized film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the cost for manufacturing a substrate using a drum film. <P>SOLUTION: This substrate manufacturing method selectively removes a part of the cover film 110C from the second side of the photoresist layer 110R. It comprises a process (a) for forming both the first area 110a with the exposed second side in the photoresist layer 110R and the second area 110b with the cover film 110C in the drum film 110; a process (b) for pasting a drum film 110 to the principal plane of a substrate 114 after the above process (a), while bringing the first area 110a to the principal plane of the substrate 114 and bringing the second area 110b to the alignment mark 132; a process (c) for removing the backup film 110S and at least the drum film 110 on the alignment mark 132; a process (d) for relatively positioning the mask (not illustrated) to the alignment mark 132; and a process (e) for forming the patternized resin films on the principal plane of the substrate 114 through the photolithographic process using the mask. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate having a patterned film formed using a dry film and a method for manufacturing the same.

  Liquid crystal display devices are characterized by their small size, thinness, low power consumption, and light weight, and are currently widely used in various electronic devices. In particular, an active matrix liquid crystal display device having a switching element is widely used in OA equipment such as a personal computer, AV equipment such as a television set, and a mobile phone. In recent years, the quality of liquid crystal display devices has been rapidly improved, such as an increase in size, a higher definition, an improved pixel effective area ratio (higher aperture ratio), a wider viewing angle, or improved color purity.

  The structure of a general active matrix liquid crystal display device will be described with reference to FIG. FIG. 12 is a cross-sectional view of the active matrix liquid crystal display device 30.

  The liquid crystal display device 30 includes an active matrix substrate 2 and a color filter substrate 4 disposed so as to face each other, and a liquid crystal layer 6 disposed between these substrates.

  The active matrix substrate 2 includes a transparent insulating substrate 14 such as glass, an active element (circuit layer) 10 formed on the substrate 14, an insulating layer 3, a transparent pixel electrode 12, and an alignment film (not shown). And. The circuit layer 10 includes a gate bus line for a scanning signal line, a source bus line for a data signal line, a thin film transistor (TFT), and the like.

  The color filter substrate 4 includes an insulating transparent substrate 14 such as glass, a color filter layer 22 formed on the substrate 14 including a red color filter 16, a green color filter 18, and a blue color filter 20, and a plurality of light shielding portions. 24, a light shielding layer 26 including a counter electrode 21, a counter electrode 21, and an alignment film (not shown). The red color filter 16, the green color filter 18, and the blue color filter 20 are provided corresponding to each of the plurality of transparent pixel electrodes 12 provided on the active matrix substrate 2 side. The light shielding part 24 is disposed in the gap and the frame area of each color filter.

  The active matrix substrate 2 and the color filter substrate 4 are arranged so that alignment films (not shown) of the respective substrates face each other, and a constant substrate interval is used by using spacers (not shown) made of plastic beads or glass fibers. It is bonded using a sealing material (not shown) while maintaining the (cell gap). After filling the liquid crystal material between the substrate 2 and the substrate 4, the liquid crystal injection port is sealed with a sealing material (not shown), and the liquid crystal display device 30 is manufactured.

  In recent years, a dry film method has been used as a method for producing a color filter substrate (see, for example, Patent Document 1 and Patent Document 2). The dry film method has advantages in that the yield of the material is high and the manufacturing cost can be reduced as compared with the spin coating method conventionally used. In addition, when a dry film is used, there is an advantage that a film having a more uniform thickness can be formed.

  With reference to FIG. 13 and FIG. 14, a dry film bonding method described in Patent Document 1 will be described.

  The dry film 10 includes a photosensitive resin layer 10R, a support film 10S that covers one main surface of the photosensitive resin layer 10R, and a cover film (not shown) that covers the other main surface. The bonding of the dry film 10 is performed while the photosensitive resin layer 10R exposed by removing the cover film is pressed against the main surface of the substrate 14 using a heat roll 74, and the support film 10S is peeled off. The photosensitive resin layer 10R is typically a negative type, and a photolithography process using a mask is used for patterning.

  The alignment of the mask used in the photolithography process with respect to the substrate 14 is performed based on the detection result by optically detecting the alignment mark 32 on the substrate 14 and the alignment mark provided on the mask (not shown). Therefore, in order to accurately detect the alignment mark 32 when aligning the mask with the substrate 14, it is preferable that the alignment mark 32 is not contaminated by the photosensitive resin layer 10R.

  In Patent Document 1, as shown in FIG. 13, photosensitivity having a width Z 1 ′ that is larger than the width X of the display region 33 of the substrate 14 and slightly smaller than the interval Y between the alignment marks 32 provided at both ends of the substrate 14. The alignment mark 32 is prevented from being contaminated by the photosensitive resin layer 10R by using the dry film 10 having the photosensitive resin layer 10R and bonding the dry film 10 and the center line of the substrate 14 so as to coincide with each other. (See Example 1 of Patent Document 1 and FIG. 2).

  However, in the above method, since the width of the photosensitive resin layer 10R and the support film 10S are substantially the same, the surface of the heat roll 74 is in contact with the substrate 14, and the water repellency and surface state of the surface of the substrate 14 are increased. May change, resulting in problems such as the inability to form a second layer or overcoat layer.

Therefore, in Patent Document 1, as shown in FIG. 14, the width Z1 ′ of the support film 10 </ b> S is maintained with the width Z1 ′ of the photosensitive resin layer 10 </ b> R being slightly smaller than the interval Y between the alignment marks 32. That is, by making the width of the dry film 10) larger than the width of the substrate 14, the surface of the heat roll 74 coming into contact with the substrate 14 while preventing the contamination of the alignment mark 32 by the photosensitive resin layer 10R. Is described (see Example 2 of Patent Document 1 and FIG. 3).
Japanese Patent Laid-Open No. 8-21221 JP 2001-100211 A

  However, in order to use the method described in Patent Document 1, a photosensitive resin layer having a width corresponding to the size of the substrate (width of the substrate) on which the color filter is formed and the position of the alignment mark are formed. There is a need to produce a dry film. Accordingly, there are problems that versatility of the dry film is reduced and manufacturing cost of the dry film itself is increased.

  Usually, the photosensitive resin layer of a dry film is formed by apply | coating photosensitive resin to the whole surface of a support film. On the other hand, when a photosensitive resin layer having a predetermined width is selectively formed on the support film, the production efficiency is lowered and the production cost of the dry film is increased. In general, a dry film is cut out from a raw material (for example, a width of 1500 mm) to a necessary width (for example, 675 mm), but such a method of use cannot be performed, and the cost further increases.

  Here, the problem of the prior art has been described using the color filter substrate used in the liquid crystal display device as an example. However, for accurate alignment, contamination of the alignment mark is prevented and / or the second and subsequent layers (second layer and later). Subsequent formation is not limited to the dry film method), and it is not limited to the color filter substrate to suppress a change in the state of the substrate surface in order to form stably. For example, the problem is common to various substrates having a film formed using a dry film, such as an active matrix substrate, a substrate used for a display device other than a liquid crystal display device (for example, a plasma display), a printed wiring board, and the like.

  This invention is made | formed in view of the said various points, The main objective reduces the manufacturing cost of the board | substrate which has the film | membrane patterned using the dry film.

  The method of manufacturing a substrate having a patterned film according to the present invention includes: (a) a step of preparing a substrate having an alignment mark on a main surface; and (b) a photosensitive resin having a first surface and a second surface facing each other. Preparing a dry film having a layer, a support film provided on the first surface, and a cover film provided on the second surface; and (c) selectively exposing part of the cover film to the photosensitive film. Forming a first region where the second surface of the photosensitive resin layer is exposed and a second region including the cover film on the dry film by removing the second resin layer from the second surface. And (d) after the step (c), the first film is brought into contact with the main surface of the substrate and the second film is brought into contact with the alignment mark while the dry film is A step of bonding to the main surface of the substrate, (e) a step of removing the support film and at least the dry film on the alignment mark after the step (d), and (f) the alignment mark And (g) forming a patterned resin film on the main surface of the substrate by a photolithography process using the mask. To do.

  The width of the dry film is preferably equal to or greater than the width of the substrate.

  In one embodiment, the step (c) includes a step of forming a cut in the cover film, and selectively peeling a part of the cover film from the second surface of the photosensitive resin layer along the cut. Including.

  In one embodiment, the patterned film includes a color filter layer having at least a first color filter and a second color filter, and the step (a) forms the first color filter as the dry film. A photosensitive resin layer for forming the second color filter as the dry film, including the step of forming the first color filter and the alignment mark using a first dry film having the photosensitive resin layer A step of forming the second color filter made of the patterned resin film by performing the steps (b) to (g) using a second dry film having the following.

  In one embodiment, the width of the first dry film and the width of the second dry film are substantially equal.

  In one embodiment, the color filter layer further includes a third color filter, and using the third dry film having a photosensitive resin layer for forming the third color filter as the dry film, the step (b) ) To (g) to form the third color filter made of the patterned resin film. In the case of using three or more kinds of dry films, the widths of all the dry films may be made substantially equal.

  In one embodiment, the patterned film includes at least one of a black matrix, a spacer, and a rib.

  The laminating apparatus of the present invention is a dry film laminating apparatus used in any of the above-described substrate manufacturing methods, and means for rotatably supporting a dry film roll in which the dry film is wound in a cylindrical shape, Means for feeding out the dry film; means for making a cut in the cover film along a feeding direction of the dry film; and a second portion of the photosensitive resin layer selectively for a part of the cover film along the cut. Means for peeling from the surface, and means for bonding the dry film to the main surface of the substrate.

  The manufacturing method of the active matrix substrate of the present invention includes (a) a step of preparing a substrate having a circuit element, a first conductive film and an alignment mark on the main surface, and (b) a first surface and a second surface facing each other. Preparing a dry film having a photosensitive resin layer having a support film provided on the first surface and a cover film provided on the second surface; and (c) a part of the cover film. By selectively removing from the second surface of the photosensitive resin layer, the second surface of the photosensitive resin layer is exposed, and the first region and the second region including the cover film are removed from the dry film. And (d) after the step (c), the first region is brought into contact with the main surface of the substrate and the second region is brought into contact with the alignment mark. A step of bonding a dry film to the main surface of the substrate; (e) a step of removing the support film and at least the dry film on the alignment mark after the step (d); Aligning the mask relative to the alignment mark; (g) forming a patterned resin film on the main surface of the substrate by a photolithography process using the mask; and (h) Forming a second conductive film on the patterned resin film.

  In one embodiment, the patterned resin film is an interlayer insulating film.

  In one embodiment, the patterned resin film is a black matrix.

  In one embodiment, the method further includes a step of forming an interlayer insulating film on the patterned resin film after the step (g), and the step (h) includes forming the second conductive film on the interlayer insulating film. It is a process of forming.

  In one embodiment, the patterned resin film is a color filter.

  In one embodiment, the substrate manufactured by any of the methods described above is a color filter substrate.

  In an embodiment, the substrate manufactured by any of the above methods is an active matrix substrate.

  The display device of the present invention has a color filter substrate manufactured by any one of the methods described above.

  The display device of the present invention has an active matrix substrate manufactured by any one of the above methods.

  In the substrate manufacturing method of the present invention, a part of the cover film of the dry film is selectively removed to form a region where the photosensitive resin layer is exposed and a region covered with the cover film. Since the dry film is bonded to the substrate while the covered region is in contact with the alignment mark and / or the surface of the substrate, the alignment mark is not contaminated. In addition, if the width of the dry film is the same as or larger than the width of the substrate, the cover film can be bonded to the surface of the substrate so that the state of the substrate surface can be prevented from changing. Is done. Furthermore, in the substrate manufacturing method of the present invention, it is necessary to change according to the width of the substrate and the position of the alignment mark, that is, the position of the area where the photosensitive resin layer is exposed, that is, the position of the area where the cover film is removed. Therefore, unlike the method described in Patent Document 1, it is not necessary to produce a dry film according to the application, and an original film of a dry film produced by a general method can be used. Therefore, the manufacturing cost of a substrate (for example, a color filter substrate) using the dry film can be reduced including the manufacturing cost of the dry film.

  In addition, the substrate manufacturing method of the present invention can be easily executed simply by adding a configuration for selectively peeling a part of a cover film to a conventional laminating apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited to the following embodiment.

  This will be described with reference to FIGS. 1 and 2 are schematic views for explaining a method of manufacturing a substrate having a patterned film according to an embodiment of the present invention. FIG. 2 is a diagram of the configuration of FIG. 1 viewed from the direction of the arrow shown in FIG.

  The substrate manufacturing method according to the embodiment of the present invention is a method of manufacturing a substrate having a film (resin film) patterned using the dry film 110 on its main surface. The dry film 110 typically includes a photosensitive resin layer 110R, a support film 110S on one main surface (first surface) of the photosensitive resin layer 110R, and a cover on the other main surface (second surface). 110C (see FIG. 3A). For example, a PET (polyethylene terephthalate) film is used as the support film 110S, and an LDPE (low density polyethylene) film is used as the cover film 110C, for example. The photosensitive resin layer 110R is typically a negative type, and a photolithography process using a mask is used for patterning. The alignment of the mask with respect to the substrate 114 is performed based on the detection result obtained by optically detecting the alignment mark 132 provided on the main surface of the substrate 114 and the alignment mark provided on the mask.

  In the substrate manufacturing method according to the embodiment of the present invention, a part of the cover film 110C is selectively removed from the second surface of the photosensitive resin layer 110R, whereby the second surface of the photosensitive resin layer 110R is exposed. After the step (a) of forming the first region 110a and the second region 110b including the cover film 110C on the dry film 110 and the step (a), the first region 110a is brought into contact with the main surface of the substrate 114, In addition, after the step (b) of bonding the dry film 110 to the main surface of the substrate 114 while the second region 110b is in contact with the alignment mark 132, and after the step (b), the support film 110S and at least the alignment mark 132 are placed. The step (c) of removing the dry film 110 and the mask (not shown) relative to the alignment mark 132 are positioned. And combined to step (d), by a photolithography process using a mask, it is characterized in that it comprises a step (e) to form a patterned resin layer on the main surface of the substrate 114.

  In the bonding process of the method for manufacturing a substrate according to the embodiment of the present invention, the dry film 110 while the second region 110b in which the photosensitive resin layer 110R of the dry film 110 is covered with the cover film 110C is brought into contact with the alignment mark 132. Is attached to the substrate 114, so that the alignment mark 132 is not contaminated. Further, if the width Z of the dry film 110 is equal to or larger than the width of the substrate 114, the cover film 110C is bonded to the surface of the substrate 114, so that the state of the substrate surface changes. Is also prevented. Therefore, the position of the alignment mark 132 can be detected with high accuracy, and the second and subsequent layers can be reliably formed.

  Furthermore, in the method for manufacturing a substrate according to the embodiment of the present invention, it is necessary to change according to the width of the substrate 114 and the position of the alignment mark 132, that is, the position of the region exposing the photosensitive resin layer 110R, that is, the cover film. Since only the position of the area (second area 110b) from which 110C is removed, there is no need to manufacture a dry film in which the width of the photosensitive resin layer is set according to the application as in the method described in Patent Document 1 described above. . That is, the raw material of the dry film manufactured by the general method can be used for the substrate manufacturing method according to the present embodiment. Therefore, according to the method according to the embodiment of the present invention, the manufacturing cost of a substrate having a patterned film (for example, a color filter substrate) including the cost of a dry film can be reduced.

  Hereinafter, the manufacturing method of the present embodiment will be described more specifically with reference to FIGS.

  As shown in FIG. 1, the substrate 114 has, for example, a central region 133 where a predetermined film is formed and an end region provided around the central region 133. When the substrate 114 is used as a color filter substrate of a liquid crystal display device, for example, the central region 133 corresponds to a display region where a patterned color filter is formed, and the end region corresponds to a frame region. The substrate 114 has alignment marks 132 at, for example, four locations in the end region.

  For example, as shown in FIG. 3A, the dry film 110 is initially covered with a support film 110S (eg, about 75 μm thick) on the entire first surface of the photosensitive resin layer 110R (eg, about 2 μm thick), As shown in FIG. 3B, the entire second surface is covered with a cover film 110C (for example, a thickness of about 10 μm) so that the support film 110C is on the outer peripheral side and the cover film 110C is on the inner peripheral side. It is wound around the core 102.

  In the manufacturing method described in Patent Document 1 described with reference to FIG. 14, it is necessary to use a dry film having the photosensitive resin layer 110 </ b> R having a width smaller than the interval Y between the alignment marks 132. On the other hand, in this embodiment, as shown in FIGS. 1 and 2, a dry film 110 in which the width Z of the dry film 110 and the width Z1 of the photosensitive resin layer 110R are substantially equal is used. Therefore, the dry film obtained by cutting out only the predetermined width Z from the raw film of the dry film manufactured with the conventional manufacturing method can be used. The width Z of the dry film 110 is set to be larger than the interval between the alignment marks 132, and preferably set to be equal to or larger than the width of the substrate 114. Since the alignment mark 132 is very small compared to the substrate size, the outer interval of the alignment mark 132 can be regarded as being equal to the interval Y (inner side) of the alignment mark 132.

  By selectively removing (for example, peeling) a part of the cover film 110C from the dry film 110, as shown in FIG. 4A, both end portions (second surface) of the main surface (second surface) of the photosensitive resin layer 110R ( The cover film 110C is left in the second region 110b), and only the central region (first region 110a, width Z2) is selectively exposed.

  As shown in FIG. 4A, a dry film in which the photosensitive resin layer 110R in the central region 110a is selectively exposed can be obtained, for example, as follows.

  As shown in FIG.4 (b), the cut | interruption 111 is continuously formed in the drawing | feeding-out direction (length direction) of a dry film 1 each in the both ends of the cover film 110C. The shape and depth of the cut 111 formed in the cover film 110C are not particularly limited as long as the cover film 110C in the central region 110a can be selectively peeled from the surface of the photosensitive resin 110R. The cut 111 is formed, for example, in a straight line shape or a stitch shape along the dry film feeding direction. Further, the cut 111 may be formed in a part in the thickness direction of the cover film 110C, may penetrate the cover film 110C, and the tip thereof may reach the photosensitive resin 110R. The dry film 100 shown in FIG. 4A can be obtained by selectively peeling the cover film 110C in the central region 110a along the cut 111.

  Here, the width Z2 of the central region (first region) 110a from which the cover film 110C is selectively removed (that is, the width between the two cuts 111 formed at both ends of the cover film 110C) is shown in FIG. As shown, it is set to be larger than the width X of the display area 133 of the substrate 114 and smaller than the interval Y between the alignment marks 132 provided at both ends of the substrate 14.

  In this way, the dry film 110 in which the photosensitive resin layer 110R in the central region 110a is selectively exposed is heat-rolled with the exposed main surface (second surface) of the photosensitive resin layer 110R as the main surface of the substrate 114. Press using 540 and bond to substrate. At this time, since the dry film 110 is bonded to the substrate 114 in a state where the second region 110b in which the photosensitive resin layer 110R of the dry film 110 is covered with the cover film 110C is in contact with the alignment mark 132, the alignment mark 132 is contaminated. There is nothing to do. Further, if the width Z of the dry film 110 is equal to or larger than the width of the substrate 114, the cover film 110C is bonded to the surface of the substrate 114, so that the state of the substrate surface changes. Is also prevented.

  For example, a laminating apparatus 500 shown in FIG. 5 can be used in the substrate manufacturing method of the present embodiment.

  The laminating apparatus 500 includes a unit (for example, a roller 502) that rotatably supports the dry film roll 102 on which the dry film 110 is wound in a cylindrical shape, and a unit (for example, suction rolls 530a and 530b) for feeding the dry film 110. Means for cutting the cover film 110C along the feeding direction of the dry film 110 (for example, a cutter 510), and means for selectively peeling a part of the cover film 110C along the cut from the second surface of the photosensitive resin layer. (For example, a peeling device 520) and means (for example, a heat roll 540) for bonding the dry film 110 to the main surface of the substrate. In addition, the laminating apparatus 500 includes a means (for example, a transporting roll 535) for transporting the substrate 114 and a separating device 250 for cutting the dry film 110 for each substrate 114 after the bonding process is finished. .

  As a means for making a cut in the cover film 110C, for example, it is preferable to use a pair of blades 510a arranged at a predetermined interval (corresponding to the width Z2) in the width direction of the dry film. The pair of blades 510a are fixed to an axis parallel to the rotation axis of the dry film roll 102, for example, so that the position in the width direction of the dry film can be changed. If the position of the blade 510a can be changed in this way, for example, a common dry film is used for substrates with different alignment mark positions, and the photosensitive position can be changed by simply changing the position at which the cut is formed. The dry film can be bonded to the substrate in a state where the resin layer does not contact the alignment mark and the cover film is in contact with the alignment mark. Therefore, it is not necessary to separately prepare a dry film having a photosensitive resin layer having a predetermined width corresponding to the position of the alignment mark, and the dry film can be shared, so that the manufacturing cost can be reduced.

  The laminating apparatus 500 described above may be the same as a known laminating apparatus except that the laminating apparatus 500 includes a configuration (a cutter 510 and a peeling apparatus 520) for selectively peeling a part of the cover film 110C. It can be obtained simply by modifying the laminator.

  As described above, in this embodiment, a dry film can be bonded to a substrate by a simple method using a relatively simple apparatus.

  The alignment mark 132 is typically formed using a dry film. The substrate of this embodiment typically has two or more patterned films, and is aligned using the same dry film in the same process as the first patterned film (first film). A mark 132 is formed. The first film and the alignment mark 132 are obtained by bonding the dry film 110 shown in FIG. 3 on the substrate by a normal method, that is, removing the cover film 110C from one whole main surface of the photosensitive resin layer 110R, After the photosensitive resin layer 110R is bonded to the substrate while being in contact with the substrate, it is formed by a predetermined photolithography process. The patterned film (film after the second film) formed after the first film is formed by the method described above with reference to FIG. 1, FIG. 2, FIG. 4, and FIG.

  In the step of forming the second and subsequent films, the alignment mark is read when the mask is aligned with the substrate. In the conventional substrate manufacturing method in which the dry film 110 shown in FIG. 3 is bonded to the substrate by a normal method, the dry film is exposed to form the second and subsequent films so that the alignment marks can be read. It was necessary to make the width of the conductive resin layer smaller than the interval between the alignment marks. That is, the width of the photosensitive resin layer of the dry film for forming the second and subsequent films needs to be smaller than the width of the photosensitive resin layer of the dry film for forming the first film.

  On the other hand, in this embodiment, after the dry film on which the cover film 110C is selectively left on a part of the photosensitive resin layer 110R is bonded to the substrate, the dry film on the alignment mark is removed. A dry film having a photosensitive resin layer having the same width as that of the first film can be used for two or more films. For this reason, the size of the dry film can be made common regardless of the order used in the manufacturing process, and the manufacturing cost can be reduced.

  Contamination of the alignment mark 132 can be prevented if the width of the dry film 110 is at least the outer space of the alignment mark 132. In order to reliably form the second and subsequent layers, both ends of the substrate are used. It is preferable to protect the substrate with the dry film 110. By making the width of the dry film 110 larger than the width of the substrate, the change in the substrate surface state can be more reliably suppressed. If the surface state of the substrate changes, the second layer or overcoat layer, transparent conductive layer, etc. cannot be formed, or problems such as reduced adhesion between the film formed on the substrate and the substrate may occur. There is.

  The substrate having the patterned film of this embodiment can be applied to, for example, a counter substrate (typically a color filter substrate) used in a liquid crystal display device. When applied to the counter substrate, a color filter of two or more colors, a black matrix, a spacer, a rib (projection), an alignment film, or the like is formed using a dry film. Of course, some of these may be formed by a dry film method, and others may be formed by other methods. Further, the substrate having the patterned film of this embodiment can be applied to an active matrix substrate used for a liquid crystal display device. When applied to an active matrix substrate, an interlayer insulating film can be formed using a dry film in addition to the color filter, black matrix, spacer, rib, and alignment film.

  Hereinafter, embodiments of the color filter substrate and the active matrix substrate will be exemplified. Note that the present invention is not limited to these embodiments, and can be widely applied to various substrates such as a substrate used for a display device other than a liquid crystal display device (for example, a plasma display) and a printed wiring board.

(Embodiment 1)
Hereinafter, the color filter substrate 204 and the manufacturing method thereof according to Embodiment 1 will be described with reference to FIGS. 6, 7, and 8. 6 and 7 are schematic views for explaining a method for manufacturing the color filter substrate 204, and FIG. 8 is a schematic view showing the color filter substrate 204. 8A is a top view, and FIG. 8B is a diagram showing only a part of FIG. 8A. 6 and 7 correspond to a cross-sectional view taken along line 6A-6A ′ of the color filter substrate 204 shown in FIG. 8B. The basic cross-sectional structure of the color filter substrate 204 is the same as that of the color filter substrate 4 shown in FIG.

  The red color filter 216, the green color filter 218, the blue color filter 220, and the light shielding portion (black matrix) 224 of the color filter substrate 204 shown in FIG. 8 are formed using a dry film. That is, four types of dry films in which red, blue, green, and black pigments are dispersed are used to form the color filters and light-shielding portions of the respective colors. Hereinafter, a case in which, for example, the red color filter 216, the green color filter 218, the blue color filter 220, and the light shielding portion 224 are formed in this order will be described with reference to FIGS.

  First, a substrate 214 and four types of dry films are prepared. For the substrate 214, for example, a rectangular glass substrate of 680 mm × 880 mm is used. As the dry film, for example, a common four-color dry film having a width of 675 mm is used. The color filters (green color filter 218 and blue color filter 220) formed after the formation of the first color filter (red color filter 216) and the dry film used for the light shielding portion 224 have a width between the cut lines of the cover film (the width in FIG. 1). Z2) is set to 600 mm. For example, the width X of the display region 233 of the finally obtained color filter substrate 214 (FIG. 8) is 580 mm, and the outer distance between the alignment marks 232 is 640 mm.

  As shown in FIG. 6A, the cover film is peeled off from the entire main surface of the red dry film, the red photosensitive resin layer 216R is bonded onto the glass substrate 214 while being pressed, and the supporting film is peeled off. The red photosensitive resin layer 216R is transferred onto the substrate 214. This process is generally performed while heating the dry film, and is a so-called thermal transfer process. The transferred red photosensitive resin layer 216R is exposed and developed through a mask 230a, and a red color filter 216 and an alignment mark 232 are formed simultaneously as shown in FIG. 6B.

  Next, the cover film 218C in the central region of the green dry film is selectively removed from one surface of the photosensitive resin layer 218R, whereby the photosensitive resin layer is exposed (central region), and the cover film A green dry film 218 formed with a region including 218C (end regions on both sides) is bonded to the glass substrate 214 while being pressed as shown in FIG. Note that the width (Z2 in FIG. 1) of the central region (first region 110a in FIG. 1) where the photosensitive resin layer is exposed is 600 mm with respect to the dry film having a width of 675 mm (Z in FIG. 1), and the cover film The width ((Z−Z2) / 2) of the end region (the second region 110b in FIG. 1) provided with 218C is 37.5 mm.

  The bonding is performed so that the region provided with the cover film 218C is in contact with the alignment mark 232, and the exposed photosensitive resin layer 218R is in contact with the central region (the subsequent display region 233) of the substrate 214. At this time, since the alignment mark 232 and the substrate surface are covered with the cover film 218C, the elution components and dust from the heat roller do not adhere, the alignment mark 232 is contaminated, or the surface of the substrate (edge region) is The state does not change.

  Subsequently, as shown in FIG. 6D, the support film 218S and the dry film 218 on the alignment mark 232 are removed. Since the portion of the dry film 218 on the alignment mark 232 includes the cover film 218C, the alignment mark 232 and the dry film 218 are not bonded and can be easily peeled off. Thus, the green photosensitive resin layer 218R is transferred.

  Note that the steps shown in FIGS. 6C and 6D can be performed in a series of steps using, for example, the laminating apparatus 500 shown in FIG.

  Subsequently, as shown in FIG. 6E, the mask 230 b is relatively aligned with the alignment mark 232 of the substrate 214. For example, the alignment mark 232 of the substrate 214 and the alignment mark 234 included in the mask 230b are optically read, and alignment is performed based on the obtained position information. A known method can be widely used for positioning the mask 230b with respect to the alignment mark 232. When the alignment mark 232 is optically read, the dry film 218 on the alignment mark 232 is removed in the previous step, and the alignment mark 232 is not contaminated, so that the alignment mark 232 can be read with high accuracy. . In addition, since the surface state of the substrate (edge region) does not change, for example, it is possible to form a film satisfactorily without lowering the adhesion without changing the conditions for bonding the second dry film. I can do it.

  The transferred green photosensitive resin layer 218R is exposed and developed through a mask 230b to form a green color filter 218 as shown in FIG.

  The blue color filter 220 is formed as shown in FIG. 7A by using the same method as that for forming the green color filter 218. As described above, the color filter layer 222 composed of the red, green, and blue color filters 216, 218, and 220 is formed.

  After the color filter layer 222 is formed, a predetermined black dry film is bonded onto the glass substrate 214 while being pressed using a method similar to the method for forming the green color filter 216, as shown in FIG. 7B. The black photosensitive resin layer 226R is transferred onto the substrate 214.

  Next, exposure (backside exposure) is performed from the glass substrate 214 side. By this back exposure, the black photosensitive resin layer 226R is exposed (self-aligned exposure) using the red, green and blue color filters 216, 218 and 220 as a mask. After the exposure, development is performed to form a light shielding layer 226 in which the light shielding portion 224 is arranged in the gap between the adjacent color filters and the frame area.

  As described above, the color filter substrate 204 of Embodiment 1 is manufactured as shown in FIG.

  Here, the case where the red color filter 216, the green color filter 218, the blue color filter 220, and the light shielding portion 224 are formed in this order has been described. However, the present invention is not limited to this, and the light shielding portion 224 is formed first, You may form the color filter of each color.

  In the above, a color filter substrate having three color filters has been exemplified. However, in the present embodiment, four or more color filters (for example, five color filters composed of red, green, blue, black and white, The present invention can also be applied to a color filter substrate having six color filters of red, green, blue, cyan, magenta, and yellow as described in Japanese Unexamined Patent Publication No. 2002-286927.

(Embodiment 2)
Hereinafter, the active matrix substrate 300 according to the second embodiment will be described with reference to FIGS. 9, 10, and 11. FIG. 9 is a schematic plan view of the active matrix substrate 300, in which a region corresponding to one pixel is exaggerated. FIG. 10 corresponds to a cross-sectional view taken along line 10A-10A ′ of FIG. FIG. 11 is a plan view schematically showing the entire active matrix substrate 300.

  The active matrix substrate 300 includes, as an interlayer insulating film, a black matrix 322 provided on a TFT channel region and an inter-pixel region, and a color filter 324 provided in the pixel region. The color filter 324 and the black matrix 322 are formed using a dry film.

  Normally, as shown in the liquid crystal display device 30 of FIG. 12, the counter substrate 4 of the active matrix substrate 2 has color filters 16, 18, and 20. However, when a color filter is provided on the active matrix substrate, it faces the active matrix substrate. There is an advantage that it is not necessary to consider the alignment error when bonding to the substrate, and the aperture ratio can be further improved.

  First, the configuration of the active matrix substrate 300 will be described. Details of the configuration of the active matrix substrate 300 are described in, for example, Japanese Patent Laid-Open No. 10-206888.

  As shown in FIGS. 9 and 10, the active matrix substrate 300 includes a source bus line 304 and a gate bus line 302 arranged on a transparent insulating substrate 334 such as a glass substrate so as to cross each other, and a source bus. It includes a TFT 310 provided in the vicinity of the intersection of the line 304 and the gate bus line 302, an auxiliary capacitor bus line 314 for forming a pixel auxiliary capacitor, and a pixel electrode 312 corresponding to each pixel of the liquid crystal display device. The active matrix substrate 300 further includes a black matrix 322 provided on the channel region of the TFT 310, in the vicinity of the source bus line 304 and the gate bus line 302 (inter-pixel region), and a color filter 324 provided in the pixel region. As an interlayer insulating film.

  The TFT 310 includes a gate electrode 302a, a gate insulating film 335, an active semiconductor layer 303, an amorphous silicon (eg, n-type amorphous silicon) layer 305, a source electrode 304a, and a drain electrode 306a. A gate bus line 302 is connected to the gate electrode 302a, and a source bus line 304 is connected to the source electrode 304a. The pixel electrode 312 is electrically connected to the drain electrode 306a through the contact hole 315.

  A display signal supplied to the source bus line 304 is supplied to the pixel electrode 312 via the TFT 310 that is turned on / off by a scanning signal supplied to the gate bus line 302. Display is performed by a potential difference between a voltage applied to the pixel electrode 312 and a voltage supplied to an electrode of a counter substrate (not shown). A predetermined display is maintained by installing the pixel auxiliary capacitor.

  Next, a method for manufacturing the active matrix substrate 300 will be described.

  First, on the glass substrate 334, the gate bus line 302, the gate electrode 302a formed integrally with the gate bus line 302, and the auxiliary capacitance bus line 314 are formed in the same process using a metal material (for example, chromium or aluminum). Form with. In this step, alignment marks 332 (FIG. 11) are further formed simultaneously using the metal material.

  Next, the gate insulating film 335 is formed using, for example, silicon nitride.

  Subsequently, a thin film transistor (TFT) 310 is formed. After forming the active semiconductor layer 303 and the amorphous silicon (for example, n-type amorphous silicon) layer 305, the source bus line 304, the source electrode 304a formed integrally with the source bus line 304, and the drain electrode 306a are made of a metal material ( For example, chromium, aluminum, etc.) are used in the same process.

  Next, the color filter 324 and the black matrix 322 are formed using a dry film. These forming methods are basically the same as those described in the first embodiment with reference to FIGS. 6C to 6F and FIGS. 7A to 7C. As the dry film, four types of dry films in which red, blue, green and black pigments are dispersed are used. Four types of dry films having a common width are used. Either the color filter 324 or the black matrix 322 of each color may be formed first.

  The predetermined dry film shown in FIG. 4A is used for forming the color filters and the black matrix for each color. The dry film has a photosensitive resin layer exposed by selectively removing the cover filter so that the region (second region 110b in FIG. 4A) provided with the cover film is in contact with the alignment mark. The first region 110a in FIG. 4A is pasted so as to be in contact with the central region (the subsequent display region 333) of the substrate. Since the bonding process is performed with the cover film in contact with the alignment mark 332 and the surface of the end region of the substrate, the alignment mark and the surface of the substrate are not contaminated. Thereafter, the support film and the dry film on the alignment mark are removed, the photosensitive resin layer is transferred to the substrate, and then a predetermined photolithography process using a mask is performed.

  When aligning the mask with the substrate, the dry film on the alignment mark 332 is removed in the previous step, and the alignment mark 332 and the surface of the substrate are not contaminated. No hindrance to membrane process.

  The above process is repeated, and the color filter 324 and the black matrix 322 are sequentially formed.

  Contact holes for electrically connecting the TFT 310 and the pixel electrode 312 are formed at predetermined positions of the color filter 324 and the black matrix 322. Thereafter, the pixel electrode 312 is formed so as to cover the contact hole.

  As described above, the active matrix substrate 300 of Embodiment 2 is manufactured.

  Thus, by using the substrate manufacturing method according to the embodiment of the present invention, the manufacturing cost of the active matrix substrate can be reduced.

  Further, the present invention is not limited to the formation of a black matrix or a color filter as exemplified in the above embodiment, and controls the alignment of spacers and liquid crystal molecules for defining the thickness of the liquid crystal layer, for example. The present invention can also be applied to the formation of a rib (for example, see JP-A-11-242225). Of course, these may be formed on the counter substrate or on the active matrix substrate.

  The present invention has various films having a film formed using a dry film, such as a color filter substrate or an active matrix substrate used for a liquid crystal display device, a substrate used for a display device other than the liquid crystal display device (eg, a plasma display), a printed wiring board, Widely applied to various substrates.

It is a schematic diagram for demonstrating the manufacturing method of the board | substrate which has the patterned film | membrane by embodiment of this invention. FIG. 2 is a schematic diagram for explaining a method of manufacturing a substrate having a patterned film according to an embodiment of the present invention, and is a view of the configuration of FIG. 1 from the direction of the arrow shown in FIG. (A) And (b) is a schematic diagram for demonstrating the structure of a dry film. (A) And (b) is a schematic diagram for demonstrating the structure of the dry film used for embodiment. It is a schematic diagram for demonstrating the laminating apparatus used for embodiment. (A), (b), (c), (d), (e), and (f) are schematic diagrams for explaining a method for manufacturing a color filter substrate of an embodiment. (A), (b) and (c) is a schematic diagram for demonstrating the manufacturing method of the color filter substrate of embodiment. It is a schematic diagram which shows the color filter board | substrate of embodiment, (a) is a top view, (b) is a figure which shows only a part of figure (a). It is a typical top view of the active matrix substrate of an embodiment. FIG. 10 is a diagram corresponding to a cross-sectional view taken along line 10A-10A ′ of FIG. 9. It is a top view showing typically the whole active matrix substrate of an embodiment. It is sectional drawing of a common active matrix type liquid crystal display device. It is a schematic diagram for demonstrating the pasting method of the conventional dry film. It is a schematic diagram for demonstrating the pasting method of the conventional dry film.

Explanation of symbols

102 Core 114 Substrate 110 Dry film 110a First region 110b Second region 110C Cover film 110S Support film 110R Photosensitive resin layer 132 Alignment mark 133 Display region 204 Color filter substrate 214 Substrate 216 Red color filter 218 Green color filter 218C Cover film 218R Photosensitive resin 218S Support film 220 Blue color filter 224 Shading part 230a Mask 230b Mask 232 Alignment mark 233 Display area 234 Alignment mark 300 Active matrix substrate 302 Gate bus line 302a Gate electrode 304 Source bus line 304a Source electrode 306a Drain electrode 310 TFT
312 Pixel electrode 314 Auxiliary capacitor bus line 315 Contact hole 322 Black matrix 324 Color filter 332 Alignment mark 333 Display area 334 Substrate 335 Gate insulating film

Claims (17)

(A) preparing a substrate having an alignment mark on the main surface;
(B) A dry film having a photosensitive resin layer having a first surface and a second surface facing each other, a support film provided on the first surface, and a cover film provided on the second surface is prepared. And a process of
(C) a first region where the second surface of the photosensitive resin layer is exposed by selectively removing a part of the cover film from the second surface of the photosensitive resin layer; and the cover film Forming a second region with the dry film,
(D) After the step (c), the dry film is attached to the substrate while bringing the first region into contact with the main surface of the substrate and bringing the second region into contact with the alignment mark. Bonding to the main surface;
(E) after the step (d), removing the support film and at least the dry film on the alignment mark;
(F) aligning the mask relative to the alignment mark;
(G) A method of manufacturing a substrate having a patterned film, including a step of forming a patterned resin film on the main surface of the substrate by a photolithography process using the mask.   The method for manufacturing a substrate according to claim 1, wherein a width of the dry film is equal to or greater than a width of the substrate.   The step (c) includes a step of forming a cut in the cover film, and selectively peeling a part of the cover film from the second surface of the photosensitive resin layer along the cut. Or the manufacturing method of the board | substrate of 2. The patterned film includes a color filter layer having at least a first color filter and a second color filter;
The step (a) includes a step of forming the first color filter and the alignment mark using a first dry film having a photosensitive resin layer for forming the first color filter as the dry film. Including
Using the second dry film having a photosensitive resin layer for forming the second color filter as the dry film, and performing the steps (b) to (g), the patterned resin film The manufacturing method of the board | substrate in any one of Claim 1 to 3 including the process of forming the said 2nd color filter which becomes.   The substrate manufacturing method according to claim 4, wherein a width of the first dry film is substantially equal to a width of the second dry film. The color filter layer further includes a third color filter,
Using the third dry film having a photosensitive resin layer for forming the third color filter as the dry film, and performing the steps (b) to (g), the patterned resin film The manufacturing method of the board | substrate of Claim 4 or 5 including the process of forming the said 3rd color filter which becomes.   The method of manufacturing a substrate according to claim 1, wherein the patterned film includes at least one of a black matrix, a spacer, and a rib. A dry film laminating apparatus used in the method for producing a substrate according to claim 1,
Means for rotatably supporting a dry film roll in which the dry film is wound in a cylindrical shape;
Means for unwinding the dry film;
Means for cutting the cover film along the feeding direction of the dry film;
Means for selectively peeling a part of the cover film from the second surface of the photosensitive resin layer along the cut line;
Means for laminating the dry film to the main surface of the substrate. (A) preparing a substrate having a circuit element, a first conductive film and an alignment mark on the main surface;
(B) A dry film having a photosensitive resin layer having a first surface and a second surface facing each other, a support film provided on the first surface, and a cover film provided on the second surface is prepared. And a process of
(C) a first region where the second surface of the photosensitive resin layer is exposed by selectively removing a part of the cover film from the second surface of the photosensitive resin layer; and the cover film Forming a second region with the dry film,
(D) After the step (c), the dry film is attached to the substrate while bringing the first region into contact with the main surface of the substrate and bringing the second region into contact with the alignment mark. Bonding to the main surface;
(E) after the step (d), removing the support film and at least the dry film on the alignment mark;
(F) aligning the mask relative to the alignment mark;
(G) forming a patterned resin film on the main surface of the substrate by a photolithography process using the mask;
(H) forming a second conductive film on the patterned resin film; and a method of manufacturing an active matrix substrate.   The method for manufacturing an active matrix substrate according to claim 9, wherein the patterned resin film is an interlayer insulating film.   The method of manufacturing an active matrix substrate according to claim 9, wherein the patterned resin film is a black matrix. The method further includes a step of forming an interlayer insulating film on the patterned resin film after the step (g),
The method of manufacturing an active matrix substrate according to claim 11, wherein the step (h) is a step of forming the second conductive film on the interlayer insulating film.   The method for manufacturing an active matrix substrate according to claim 9, wherein the patterned resin film is a color filter.   A color filter substrate manufactured by the method according to claim 1.   An active matrix substrate manufactured by the method according to claim 9.   A display device comprising the color filter substrate according to claim 14.   A display device comprising the active matrix substrate according to claim 15.

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