JP2005300976A - Joining method of optical parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To conduct joining by laser light irradiation with high speed, high positioning precision and high yield. <P>SOLUTION: When a joining material 3 which is provided to a joining boundary section 4 between a base material 1 and a connector 2 that is to be joined to the base material 1 is hardened or melted and then hardened to join them by the irradiation of laser light beams L, the joining is conducted by suppressing displacement acting force F, that causes displacement of the connector 2 with respect to the base material 1 during the hardening stage of the joining material 3, at every joining place or between joining places and by providing holding and/or aligning of the alignment position by degree of balance, and then, they are hardened and joined. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  TECHNICAL FIELD The present invention relates to a method for joining optical components in which a bonding material or an optical component is melted after being melted or a bonding material is cured to join the optical component, and in particular, a read / write device for a DVD requiring precision manufacturing convenience. The present invention relates to a method for joining optical components suitable for joining optical components used in, for example.

  Conventionally, a recessed portion having a width smaller than that of the printed circuit board is formed in the installation portion of the housing on which the printed circuit board to which the light receiving element of the optical pickup is fixed is disposed, and faces both ends of the printed circuit board aligned in the recessed portion. The UV adhesive was poured into the adhesive groove cut from the upper side into the side surface, and the UV adhesive portion protruding from the adhesive groove to the printed circuit board side in a symmetrical manner by the surface tension was brought into contact with the opposite ends of the printed circuit board. As a state, a technique for preventing UV adhesive from being cured by UV irradiation to prevent the UV substrate from reaching the back side of the printed circuit board and causing delayed curing without causing UV irradiation to reach the position is already known. (For example, refer to Patent Document 1).

On the other hand, two optical components are fitted and positioned in the front and back of one cylindrical body, and laser light, particularly Nd: YAG laser light is irradiated from the outer surface on which a highly reflective film is provided in the cylinder. Even if the laser energy intensity fluctuates for each spot welding, the thermal effect of the laser light on the surrounding area is stabilized by spot welding the optical parts and the laser light reflected by the highly reflective surface in the area around the spot welding part. Therefore, there is also known a technique that does not affect the positioning accuracy of the optical element (see, for example, Patent Document 2).
JP 2002-368234 A JP-A-8-304668

  However, in the technique described in Patent Document 1, the exposure time by UV irradiation for curing the UV adhesive is as long as several minutes, and the productivity is still low. Also, if the amount of UV adhesive applied is different on the left and right, there will be a difference in curing speed and volume change, which will shift the position of the printed circuit board, making it difficult to obtain position accuracy on the order of several tens of microns. Decreases. Accordingly, the product cost increases.

  On the other hand, in the thing of patent document 2, the irradiation output of a laser beam is large, and it is easy to damage an optical component, and it cannot employ | adopt depending on the kind of optical component, and when it employ | adopts, a yield will fall. Moreover, it cannot join depending on the combination of the material of an optical component.

  The object of the present invention is to cure the bonding material or optical component after melting or curing of the bonding material by laser light irradiation. With a combination of many materials, the optical component can be obtained without damage in a short time of about several tens of seconds. To provide a method for joining optical components that can satisfy high joining, and can stably secure positional accuracy on the order of several tens of microns as needed, improving productivity and reducing product cost. .

  The optical component bonding method of the present invention is a method in which the bonding materials are bonded to each other by curing or melting the bonding material provided to the bonding boundary between the base material and the bonding material bonded thereto by laser light irradiation. In order to achieve this, when the bonding material hardens, the displacement force that shifts the position of the bonded material relative to the base material is suppressed at each bonding point or between bonding points, or the alignment position is maintained or aligned by the degree of balance. The first feature is that the curing is completed and the bonding is performed.

  In such a configuration, the bonding materials supplied to the bonding boundary between the base material and the bonded material to be bonded to the bonding material are cured or melted by irradiation with laser light to be cured, and the bonded materials are bonded to each other. Holds the alignment position of the joint by controlling or shifting the position displacement acting force that causes the joint to be displaced relative to the base material at the stage where the material is cured, or between the joints, or the degree of balance, or In addition, since curing is completed with alignment and bonding is performed, bonding under any condition that exerts a displacement force on the bonded material when the bonding material is cured ensures high positional accuracy on the order of several tens of microns as necessary. Can be done. In addition, bonding is by curing of the bonding material by laser light irradiation or curing after melting, and there are many combinations of materials types of optical parts that can be bonded together by adopting a bonding material including brazing material and adhesive, The laser beam irradiation output need not be as high as several W class, and can be joined in a short time of several tens of seconds.

  The displacement force adjusts the balance by feedback control of the irradiation output of the laser beam or the irradiation timing based on the position information of the bonded material between the bonded portions around the outer surface of the bonded material during the bonding material curing. be able to.

  Moreover, the adjustment of the balance degree between the joining locations of the position displacement acting force can be performed by remelting the once-cured joining material.

  In addition, adjustment of the degree of balance between the locations where the displacement force is applied should be performed by reproducing the laser beam irradiation conditions obtained from the appropriate bonding result between the specific base material and the bonded object during subsequent bonding. You can also.

  As one specific example, a brazing material is used as a bonding material, and it is supplied to a bonding boundary portion between the bonding material and the base material at the bonding portions facing each other around the outer periphery of the bonded material, and directly irradiated with a laser beam, melted and bonded. Adjust the timing of laser beam irradiation or the laser beam power so that the brazing material that wets and straddles both the base material and the joint at each boundary part forms a fillet at the same time. On the other hand, the acting force for shifting the position is balanced between the joining points, and the joining is performed while maintaining the alignment position.

  As another specific example, a brazing material is used as a bonding material, and the brazing material is provided to a central portion in a recess having a symmetrical shape about an axis formed on one or more joint surfaces on which a base material joint is abutted. While pressing with alignment between the base material and the joint pressed against the base material, a laser beam is irradiated from the outside on the axis, and the molten brazing material applies the axis to both the concave portion of the base material and the joint. After wetting over the center and curing, the acting force that shifts the position of the joint relative to the base material when the brazing material is cured is balanced around the axis in the unit of the joint, and the alignment position is maintained and joined. .

  As another specific example, a brazing material is used as a bonding material, and formed on a surface including a bonding surface having a concave portion that leaves a bonding margin between the bonding material of the base material or a film forming layer on the surface including the bonding surface of the bonding material A laser beam is irradiated from the outside on the axis while pressing the joint surface of the base material with alignment to the base material joint surface, and the molten joint material is connected between the base material and the joint around the joint outer periphery. It pushes around the inside of the concave portion, wets and straddles both the base material and the joined product at the joining boundary portion, and then hardens, thereby maintaining the alignment position and joining.

  As another specific example, while joining the brazing material film foil to the base material with the brazing material film foil and pressurizing the joint with alignment, the joint boundary portion between the base material and the joint around the outside of the joint is used. Directly irradiate the outer periphery of the exposed brazing filler metal film foil with laser light and melt it so that the brazing material wets and straddles both the base metal and the joint at each joint boundary around the joint to form a fillet. By controlling the irradiation output or irradiation timing of laser beam irradiation, the alignment position is held and bonded.

  As yet another specific example, a brazing material is used as a bonding material, and the laser beam is irradiated directly by supplying it into a through-hole having a symmetrical shape around the axis formed at one or more joints with the base material of the joint. The effect of shifting the position of the joint with respect to the base material when the brazing material is cured by melting the material and melting the material between the base material and the opposing base material with a gap below the joint. The force is balanced around the axis line for each through-hole, and the alignment position is maintained and joined.

  In this case, after joining the joined material to the base material, the auxiliary brazing material is provided across the edge and the base material on the opposite side to the side where the joined material is close, and directly irradiated with laser light. Then, after being melted and cured, alignment can be performed by applying an acting force that shifts the position of the bonded member relative to the base material when the brazing material is cured in a direction opposite to the side on which the position is offset.

  As still another specific example, a brazing material provided as a joining material in which a base material and a joined portion of a joined product are applied via a cylindrical joining member having a symmetrical cross section around an axis. Is melted by laser light irradiation from the outside of the joining member and then cured, so that the acting force for shifting the position of the joined member relative to the base material when the brazing material is cured is balanced around the axis for each inside of the joining member. Thus, the alignment position can be held and bonded.

  Furthermore, as another specific example, the opposite joints of the joint are applied across the grooves provided on both sides of the joint of the base material, and the end surface of the joint of the joint and the base material using the brazing material as the joint material. When the brazing filler metal is cured, it is irradiated with a laser beam directly to the joining boundary portion formed between the grooves between the first and second grooves. The working force for shifting the position of the joint relative to the base material is balanced between the joints, and the joint is held while maintaining the alignment position.

  Further, as another specific example, film formation on the surface including the bonding surface of the bonding material in which the brazing material is used as the bonding material and the surface including the bonding surface of the base material or the concave portion symmetrical about the axis is formed on the back side of the bonding portion. A laser beam is irradiated on the axis from the recess while pressurizing the joint surface of the joint to the joint surface of the base material with alignment, and the brazing material between the base material and the joint is formed into the concave shape. By melting the range around the axis similar to, and then curing it, the acting force that shifts the position of the joint relative to the base material when the brazing material is cured is balanced around the axis to maintain the alignment position. Join.

  As another specific example, a film-forming layer on the surface including a bonding surface of a bonded material in which a brazing material is used as a bonding material and a surface including the bonding surface of the base material or a circular cavity symmetrical about the axis is formed in the bonding portion. And forming a brazing material between the base material and the joint by irradiating laser light on the axis from outside while pressing the joint surface of the joint to the joint surface of the base material with alignment. After melting the range around the axis that resembles the shape of the central part enclosed by the mold, it hardens and balances the acting force that shifts the position of the joint relative to the base material when the brazing material is cured. Hold the position and join.

  Also, as another specific example, an adhesive is provided to two or more temporary joints facing each other around the joint that is aligned with the base material and cured by irradiation with laser light or ultraviolet rays. Temporarily fix it, donate the brazing material as a bonding material to the opposite joints around the outside of the joint, and irradiate it directly with laser light to melt and wet both the base material and the joint. By curing the brazing material, the displacement force that causes the bonded product to be displaced with respect to the base material when the brazing material is cured is suppressed by the temporary fixing force by the adhesive, and the alignment position is maintained and the main fixing is performed. Finish.

  Furthermore, as another specific example, a fast-curing adhesive that cures at high speed by heat is provided as a joining material to the joining boundary portion with the base material at opposite joining points on the outer periphery of the joining material, After holding the material on the base material and aligning it, the high-speed curable adhesive is directly irradiated with laser light to be cured at high speed, thereby suppressing the displacement force of the high-speed curable adhesive on the joint during curing. Hold the alignment position.

  Furthermore, as another specific example, a high-speed curable adhesive that cures at high speed by heat is provided as a bonding material between a facing portion of the base material and a bonded material in which the opposite joint portions on the outer periphery face each other. , After holding and aligning the bonded material on the base material in a bridging state, the high-speed curable adhesive is directly irradiated with laser light to be cured at high speed, so that the fast-curing adhesive is cured. The alignment position is held and bonded while suppressing the displacement force.

  The optical component bonding method of the present invention is also provided by using a brazing material as a bonding material, and providing as a film-forming layer plated on the end surface of the convex portion provided at one bonding portion between the base material and the bonded material. The second feature is that the brazing material is melted by irradiating the convex portions with laser light through the gap formed by the convex portions between the joint portions, and then the brazing material is cured.

  In such a configuration, the laser beam irradiation is extended when it is desired to bond in the inner region of the bonding boundary between the optical components having the materials and dimensions that are difficult to receive the laser beam and the heat caused by the laser beam irradiation from the outside. Thus, the bonding can be performed by curing by irradiation with laser light or by curing after melting. In addition, there are many combinations of optical component materials that can be joined together by the use of a joining material including a brazing material and an adhesive, and the laser beam irradiation output does not have to be as high as a few W class and the joining time is also high. Since it can be joined in a short time of several tens of seconds, it is difficult to damage optical components. In addition, by performing the above-mentioned joining by applying pressure with alignment with the base material of the joined material, the positional displacement acting force exerted on the joined material during curing of the joined material is suppressed, and high positional accuracy of the order of several tens of microns is achieved. Can also be secured and secured as required.

  In this case, two types of brazing materials having different melting points are individually formed on the end surfaces of the plurality of convex portions between the first base material and the bonded article, and the laser beam of the brazing material having a high melting point is used. A low melting point brazing material in which the joint module and the second base material are formed on a convex portion provided at one of the joints by joining by melting after irradiation and curing. It is possible to perform bonding by curing after melting by irradiation of the laser beam.

  The optical component joining method according to the present invention also includes a step of contacting or fitting a resin joint to a resin base material and irradiating a laser beam to a joint boundary between the base material and the joint to form a resin portion. The third feature is that the bonded product is bonded by being held and cured after being melted.

  In such a configuration, the laser beam is directly irradiated to the bonding boundary portion of the resin base material and the bonded article to melt and cure the resin portion, and the laser beam irradiation output is several W class. In addition, the bonding time can be as short as several tens of seconds, the optical component is hardly damaged, and high positional accuracy can be ensured by alignment. However, it is also possible to perform bonding with a specific laser irradiation specified on one side of melting.

  The optical component joining method according to the present invention also irradiates a laser beam to the joining boundary portion of the base material and the joined material by contacting or fitting the base material and the joined material, one of which is made of resin and the other of which is made of glass. Then, after the resin portion is melted, the fourth feature is to join the bonded product by holding and curing the bonded product with alignment.

  In such a configuration, even if one is a combination of a base material made of resin and the other is a glass base material and a joined product, the joining boundary portion is directly irradiated with laser light to melt and cure the resin portion. Therefore, the laser beam irradiation output need not be as high as several watts, and it can be joined in a short time of several tens of seconds, making it difficult to damage optical components and ensuring high positional accuracy through alignment. it can.

  The alignment of the joint is preferably performed by a high-rigidity chuck, and positioning on the order of several tens of microns is adjusted by a double micrometer structure.

  It is preferable that the base material is separated from the support surface by a heat insulating member to prevent the heat from escaping to the support surface side and is irradiated with laser light.

The laser beam is focused and irradiated to a spot size of ² mm ² or less. The further configuration is suitable for bonding with a minimum amount of a small amount of bonding material, and the laser beam damages the base material and the bonded material. Can be prevented.

  A brazing material is used as a bonding material, the surface including the bonded portion of the zinc die cast member is plated, and a laser beam is irradiated from the outside while pressurizing a bonded material made of metallized glass or metalized resin to the bonded portion. Bonding is performed by melting and brazing the brazing material at the joint.

  Fast-curing adhesive that cures at high speed with heat between die-cast metal members such as zinc and aluminum that can be joined with lead-free solder, and non-metal joints such as glass, ceramic, and resin Bonding can be performed by supplying an agent as a bonding material and irradiating and curing with laser light from the outside.

  High-speed curability that cures at high speed by heat between metal die-cast members such as zinc and aluminum that can be joined with lead-free solder and zinc die-cast members with lead-free solder plated on the surface including the joint surface Bonding is performed by supplying an adhesive as a bonding material and irradiating and curing the laser beam from the outside.

  High speed heat curing between a die-cast member made of metal such as zinc and aluminum that can be joined with lead-free solder and a joint made of a metal material plated with lead-free solder on the surface including the joint surface Bonding is performed by supplying a curable adhesive as a bonding material and irradiating it with a laser beam from the outside to be cured.

  A fast-curing adhesive that cures quickly by heat is provided between the base material made of metal such as magnet or stainless steel, which is difficult to join with lead-free solder, and the joined product made of zinc die-casting material. Are bonded by being irradiated with laser light and cured.

  A fast-curing adhesive that hardens at high speed by heat between a base material made of a metal such as a magnet or stainless steel, which is difficult to join with lead-free solder, and a non-metal joined material such as glass or resin. And is bonded by irradiating a laser beam from the outside to be cured.

  High-speed heat curing between a base material made of a metal such as a magnet or stainless steel, which is difficult to join with lead-free solder, and a joint made of metal, such as a magnet or stainless steel, which is difficult to join with lead-free solder Bonding is performed by supplying a curable adhesive as a bonding material and irradiating it with a laser beam from the outside to be cured.

  When joining a base material and a joined product, at least one of which is made of zinc die-cast, using a brazing material as a joining material, the part where the brazing material melts and forms a fillet is coated with a zinc die-casting flux. It is suitable for enhancing the properties.

  It is preferable to apply a coating on the flux so that the flux is not exposed by the bonding and is free of washing.

  By setting the laser beam irradiation spot to a shape that matches the shape of the bonding portion, it is possible to prevent the laser beam from being excessively or insufficiently irradiated to the bonding portion.

  By making the output distribution of the laser light irradiation spot substantially uniform, it is possible to prevent unevenness in temperature rise and temperature drop within the laser light irradiation region.

  Priority is given to one of the opposing joints around the outside of the joint, and then the misalignment of the joint is determined, and the laser beam irradiation output or so that the determined misalignment is reduced or eliminated in the other joint When the irradiation timing is controlled, alignment can be performed easily and reliably by utilizing a displacement force that causes the bonded object to be displaced when the bonding material is cured.

  In this case, the other joining is performed after the one joining material that has been joined is softened so that the previous joining does not interfere with the alignment during the subsequent joining.

  When the position is determined and aligned based on the light emission position of the light source mounted on the bonded object, the position of the bonded object for alignment can be monitored easily and reliably.

  The brazing material is cured by gradually lowering the laser beam irradiation output while maintaining a balance by irradiating the laser beam. In a further configuration, it is easy to use the displacement force that moves the joint when the bonding material is cured. And it can align reliably.

  The laser beam is an LD laser beam. In a further configuration, the necessary class W output can be obtained at low cost, and the irradiation output can be finely controlled with high response by current control, and the irradiation output is feedback controlled. It is suitable for.

  Further objects and features of the present invention will become apparent from the following detailed description and drawings. Further, each feature of the present invention can be employed alone or in combination in various combinations as much as possible.

According to the first feature of the optical component bonding method according to the present invention, bonding under any condition that exerts a displacement force on the bonded material when the bonding material is cured can be performed by irradiating a laser beam to several tens of microns. High positional accuracy such as orders can be ensured as necessary, and there are many combinations of optical component materials that can be joined together, and it can be joined in a short time of several tens of seconds at low output. It is difficult to damage products, and both productivity and yield are improved, and even product costs with high accuracy are reduced.

  According to the second feature of the optical component bonding method according to the present invention, the inside of the bonding boundary portion between optical components of a material or size that is difficult to receive laser light or heat due to external laser light irradiation. There are many combinations of the types of materials of optical components that are suitable for joining in a region and can be joined together. In addition, it can be bonded in a short time of about several tens of seconds with a low output, and it is difficult to damage the optical components, improving both productivity and yield, and reducing the product cost. Moreover, by performing the bonding with alignment, it is possible to bond with a high positional accuracy of the order of several tens of microns as necessary.

  According to the third feature of the optical component joining method according to the present invention, the joining boundary portion is irradiated with a resin base material and a joint with a laser beam, and the output is short and the output is as short as several tens of seconds. It can be joined in time, hardly damages optical components, improves both productivity and yield, secures high positional accuracy by alignment, and reduces product cost.

  According to the fourth feature of the optical component joining method according to the present invention, the joining boundary portion is directly irradiated by a laser beam even when a combination of a base material made of a resin and a glass made of the other is made of a laser. Therefore, it can be bonded in a short time of several tens of seconds with a low output, hardly damages optical components, improves both productivity and yield, secures high positional accuracy by alignment, and reduces product cost.

  In the present invention, a zinc die-cast member and a joint made of metallized glass or metallized resin can be bonded by laser light using a brazing material as a bonding material.

  From die-cast members made of metals such as zinc and aluminum that can be joined with lead-free solder and non-metals such as glass, ceramics, and resins by irradiating with laser light using a fast-curing adhesive as the bonding material To be joined.

  Also, a die-cast member made of metal such as zinc and aluminum that can be joined with lead-free solder by laser light using a fast-curing adhesive as the joining material, and zinc with lead-free solder plated on the surface including the joining surface A die-cast member can be joined.

  Also, metal die-cast members such as zinc and aluminum that can be joined with lead-free solder by laser light using a fast-curing adhesive as the joining material, and metal with lead-free solder plated on the surface including the joining surface It is possible to join a joined material made of a material.

  Further, a base material made of a metal such as a magnet or stainless steel, which is difficult to be joined with lead-free solder, and a joined product made of a zinc die-cast member can be joined by laser light using a fast-curing adhesive as a joining material.

  In addition, by using laser light with a fast-curing adhesive as a bonding material, a base material made of a metal such as a magnet or stainless steel, which is difficult to bond with lead-free solder, and a bonded material made of non-metal such as glass or resin. Be joined.

  In addition, a base material made of a metal such as a magnet or stainless steel that is difficult to join with a lead-free solder and a magnet or stainless steel that is difficult to join with a lead-free solder, as well as a magnet that is difficult to join with a lead-free solder. It can be joined to a metal joint.

  Embodiments of the present invention will be described in detail with reference to the drawings together with some examples to help understanding of the present invention.

  The optical component bonding method according to the embodiment of the present invention uses a laser as the bonding material 3 provided to the bonding boundary between the base material 1 and the bonding material 2 bonded thereto with reference to the example shown in FIG. Positioning force that shifts the position of the bonded product 2 with respect to the base material 1 when the bonding material 3 is cured in order to cure and bond them after being cured or melted by irradiation with light L1 and L2. Curing is finished and joined together with the restraint at each joining point of F and between joining points, or holding or alignment of the alignment position by the degree of balance.

In the example shown in FIG. 1 (a), the bonding material 3 is provided at the corners of the bonding boundary 4 with the base material 1 at the opposite bonding portions 2a and 2b around the outer periphery of the bonding object 2, and the laser beam L1. The fillet 3a is formed by volume change, that is, shrinkage, when melted by irradiation of L2 and wet across both the base material 1 and the bonded article 2 and cured. A stress τ as shown in FIG. 1A is generated in the bonding material 3 at the curing stage for forming the fillet 3a. For the bonding material 3, if the base material 1 and the bonding material 2 can be brazed, for example, lead-free brazing material and cream solder are preferably used if the same or different metal materials are used, and the melting point is 139. Since SnBi 139c, 58, which is as low as about 0 ° C., does not reach a high temperature compared to UV adhesive and the stress τ is small, the displacement force F can be suppressed, and early melting and early curing can be achieved. It is difficult to perform early bonding in 1 second or less. The application amount of the bonding material 3 is preferably set to the minimum necessary to ensure the strength necessary for bonding, and is preferably about 5 kgf or more for precision optical components. Moreover, it is preferable to irradiate the entire area of the bonding material 3 with laser beams L1 and L2 having a uniform output as shown in FIG. More preferably, the laser beams L1 and L2 are condensed and irradiated to a spot size of ² mm ² or less, which is suitable for bonding with a minimum necessary amount of bonding material. It is possible to prevent the base material 1 and the bonded product 2 from being damaged. Further, in order to protect the base material 1 and the joined article 2, it is preferable that the laser beams L1 and L2 are emitted in a rectangular spot shape suitable for the shape and form of the light receiving area of the joining material 3 to be irradiated. It is.

  Here, the joined article 2 has a larger volume and a larger heat capacity on the joined portion 2a side than on the joined portion 2b side. Therefore, if the amount of the bonding material 3 on the side of each bonding portion 2a, 2b and the irradiation output and irradiation timing of the laser beams L1, L2 are the same, the bonding material 3 on the bonding portion 2a side becomes the bonding portion 2b side. It shows a tendency to melt later and harden slower than the bonding material 3. At this time, the position displacement acting force F1 on the side to be hardened first pulls the joint 2 to cause the position displacement and is fixed on the base material 1. Depending on the position displacement acting force F2 of the joining material 3 to be hardened later, the position shifts. Misalignment cannot be corrected. Here, the position shift of the bonded article 2 due to the position shift acting force F1 as shown in FIG.

  The alignment position of the bonded article 2 is maintained or the hardening of the bonding material 3 is accompanied by alignment by suppressing or balancing the position displacement acting forces F1 and F2 between the bonding points and between the bonding points. When the bonding material 3 is cured, bonding under any condition that exerts a displacement force F on the bonded article 2 can be performed without displacement. If the joint portions 2a and 2b are opposed to each other in the XX direction as shown in FIG. 1A, the balance is adjusted in the XX direction, but the Y-Y direction that is orthogonal thereto is also opposed. If so, the Y-Y direction is also adjusted. However, the degree of balance may be adjusted in a necessary direction so that the position of the bonded article 2 does not shift even between odd-numbered joints.

  The mechanical alignment of the joint requires high positional accuracy of the order of several tens of microns through the pressure alignment pin 13 as shown in FIG. 2 (a) by a double micrometer structure positioning mechanism using a high-rigidity chuck. It can be secured according to the condition, and can be held to finish the joining. In the example shown in FIG. 2A, the position of the joined object 2 on the base material 1 is imaged and monitored by the CCD camera 5 using the fact that a light source 14 such as an LD is mounted on the joined object 2. Alignment is possible. Separately, for example, the bonding material 3 in each of the bonding portions 2a and 2b is simultaneously cured and imaged with the CCD camera 5 shown in FIGS. 1 (a) and 1 (b) and observed with the monitor 5a. By controlling the laser light sources 11 and 12 through the microcomputer 7 by the operation from the operation panel 6 or the like, the irradiation output and irradiation timing of the laser beams L1 and L2 as shown in FIG. The misalignment acting force F is balanced, and the bonded object 2 is aligned and mounted on the base material 1 without mechanical positioning or restraining force, and can be bonded while being held. In the example of FIG. 1C, only the irradiation timing is adjusted and the operation is simple. Alternatively, it is possible to adjust the balance degree of the displacement acting forces F1 and F2 while monitoring the change in the position of the bonded article 2 to join the bonded article 2 to the base material 1 with alignment. The bonding is performed by curing the bonding material 3 by irradiation with the laser beams L1 and L2 or by curing after melting. The combination of the types of materials of the optical components that can be bonded together by using the bonding material 3 including the brazing material and the adhesive. In many cases, the irradiation outputs of the laser beams L1 and L2 do not have to be as high as several W class, and the joining time can be as short as several tens of seconds. Therefore, when the laser diode LD is used as the laser light sources 11 and 12, the necessary W class output can be obtained at a low cost, and the irradiation output can be finely controlled with good response by current control, and the irradiation output is feedback controlled. It is suitable for doing.

  Since the appropriate irradiation conditions once obtained for the specific bonding object 2 do not change as long as the bonding object 2 of the same type is used for the adjustment of the irradiation output of the laser beams L1 and L2 and the irradiation timing, It can be automatically adjusted if it is stored in the storage means 8 as shown in FIG. 1B and reproduced at the time of subsequent joining. For this purpose, the irradiation condition stored by the bonding program 9 may be programmed.

  In the example shown in FIG. 2 (a), a brazing material film foil is used as the bonding material 3 and is sandwiched between the base material 1 and the bonded material 2, and is pressed around the outer periphery of the bonded material 2 using the positioning force. The two or four outer circumferences of the exposed joining material 3 are melted by irradiating with laser beams L1, L2,..., And then cured and joined as shown in FIG. In this case, the concave portion 2c is provided on the bonding surface of the bonded article 2 so that the heat generated by the laser beams L1 and L2 is likely to concentrate on the protruding portion of the bonding material 3, and the molten bonding material 3 is connected to the outer periphery of the bonded object 2. It pushes to the inner periphery of the recessed part 2c, and makes it easy to make it closely_contact | adhere to the base material 1. FIG. The thickness of the brazing material film foil is preferably about 10 to 50 μm, for example.

  In the example shown in FIG. 3, the positions of the laser beams L <b> 1 and L <b> 2 as shown by the solid line in FIG. 3A in the melting and curing of the bonding material 3 by uniform irradiation as shown by the solid line in FIGS. 3B and 3C. While detecting a position shift state as indicated by a solid line in FIG. 3A for the bonded article 2 having a shift amount S, the irradiation outputs of the laser beams L1 and L2 are shown in FIG. When feedback control was performed as indicated by broken lines in (b) and (c), the positional deviation amount S became substantially zero at the end of curing of the bonding material 3 as indicated by broken lines in FIG. In the experience of the present inventors, the irradiation outputs of the laser beams L1 and L2 are initially maximized, and the start timings t1 and t2 for gradually decreasing the irradiation outputs of the laser beams L1 and L2 and the degree of reduction are adjusted. We found that good results were obtained. Once obtained, suitable irradiation conditions can be reproduced. Once this is programmed, program control can be performed instead of feedback control.

  In addition, adjustment of the balance degree between the joining locations of the position displacement acting force F can be performed by remelting the once-cured joining material 3.

  In the example shown in FIG. 4, the bonding material 2 aligned and applied to the base material 1 is supplied with the adhesive 21 to two or more temporary bonding locations 2 d facing each other as shown in FIG. Then, it is cured and temporarily fixed by irradiation with laser light or ultraviolet rays. As shown in FIGS. 4 (a) and 4 (b), the above-described path in the joint portions 2 a and 2 b facing each other around the outer periphery of the joint 2 is different. The bonding material 3 is supplied to the bonding boundary portion 4 at the main bonding portion, and is directly irradiated with the laser beams L1 and L2, so that the bonding material 3 that melts and wets over both the base material 1 and the bonded material 2 is cured. I am doing so. By doing in this way, the position displacement acting force F is suppressed by the temporary fixing force by the adhesive 21, the alignment position is maintained and the main fixing is performed, and the joining is completed.

  As shown in FIG. 4B, the base material 1 is separated from the support surface 23 by a heat-resistant heat insulating member 22 made of porous ceramic or the like to prevent the escape of heat to the support surface 23 side. As a result, the heating efficiency by the irradiation of the laser beams L1 and L2 is improved, and the irradiation output of the lasers L1 and L2 can be reduced by that amount to save energy, and the displacement force F can be kept small. Moreover, the damage given to the base material 1 and the joined article 2 is also reduced.

  In the example shown in FIG. 5, the brazing material is used as the bonding material 3, and one or more are formed on the bonding surface with which the bonded material 2 of the base material 1 comes into contact. A pressing member with an alignment in the XY2 direction orthogonal to the bonding material 2 which is provided to the central portion of the concave portion 32 and pressed against the bonding material 3 as shown in FIG. 5B and 5C, laser beams L1 and L2 are irradiated on the axis 31 from the outside as shown in FIGS. 5B and 5C, and the melted bonding material 3 becomes the concave portion 32 of the base material 1 and the bonded material 2 As shown in FIG. 5 (d), both the above and the other are wet and straddled as shown in FIG. 5D, and are simultaneously cured around the axis 31 to form the fillet 3 a. As a result, even if the pressing is released when the bonded article 2 comes into contact with the base material 1, the acting force F that shifts the position of the bonded article 2 with respect to the base material 1 when the bonding material 3 is cured is used as a unit for the joining portion. They are joined around the axis 31 while maintaining the alignment position. The positional accuracy is as high as a submicron unit, and it is possible to prevent the base material 1 and the joint 2 from being damaged for a long time by being applied with a large applied pressure or being fatigued. The concave portion 32 as described above is preferably a spherical surface, but the planar shape may be a square shape. For example, a metal having good wettability with the cream solder as the bonding material 3 is suitable as the bonded material 2, but even if it is a glass or a resin member, it is suitable as long as the surface is metallized. Become. Further, since the junction is a spot junction as short as several mS to several tens of mS, the low output laser beam of the YAG laser can be used, and there is no problem in the thermal influence around the junction. In the case of this example, it is particularly preferable to achieve high concentration of the laser beams L1 and L2. In addition, the pressing member 33 can be shared to promote heat radiation of a part not related to the joining of the joined article 2 to achieve thermal safety of the joined article 2. Moreover, although the laser beams L1 and L2 are irradiated from the outside, they are bonded even if they are not transmitted by heat transfer. The greater the penetration, the higher the bonding efficiency.

  In the example shown in FIG. 6, the cream solder is used as the bonding material 3, and the bonding is provided with the recess 41 that leaves the bonding margin A as shown in FIG. 6A between the bonding material 2 of the metal base material 1. 6 (a), the film 2 is formed on the film-forming layer of the surface including the surface (or the surface including the bonding surface of the bonded material 2). As shown in FIG. 6, laser beams L1 and L2 are irradiated from the outside while being pressed with alignment in the XY2 directions orthogonal to each other, and the molten bonding material 3 is formed from the broken line position to the solid line position in FIG. As shown in FIG. 6 (b), the boundary between the base material 1 and the joint 2 is pushed from the portion between the base material 1 and the joint 2 as shown in FIG. 4 so as to form and cure the fillet 3a after being wetly straddled on both the base material 1 and the bonded article 2 Yes and is to bond to hold the alignment position. This example is suitable for joining on the entire outer periphery of the joined article 2, and in this case, the irradiation with the laser beams L 1, L 2,. If the bonded article 2 is a resin or glass, it can be a suitable object if it is metalized. In addition, the bonding property can be improved by performing gold plating or nickel plating including the case where the bonded product 2 is a metal, and it is preferable to use CuSn as the lead-free cream solder in that case. Further, when the concave portion 41 and the joined product 2 have a target shape around the axis 31, the displacement force F due to the formation of the fillet 3 a can be balanced in any direction. In addition, it is possible to ensure ultraprecise positional accuracy with respect to horizontal alignment based on the joint surface of the base material 1. For this purpose, it is preferable that the bonding surface of the base material 1 be a polished surface.

  In the example shown in FIG. 7, the cream solder is used as the bonding material 3, and one or more are formed in the bonding portions 2a and 2b of the bonded material 2 with the base material 1 and are symmetrical about the axis 31 shown in FIG. 7 (a), (b), (c), and (d) are provided into the through holes 51 and directly irradiated with laser beams L1 and L2, and the bonding material 3 is melted to bond the bonding portions 2a and 2b. As shown in FIG. 7 (c), it is made to cure after being melted between the opposing base material 1 with a gap 52 shown in FIG. 7 (b) below, and the fillet of the bonding material 3. The applied force F1 to F4 in all directions as shown in FIG. 7 (d) for shifting the position of the bonded product 2 with respect to the base material 1 at the time of curing to form 3a is balanced around the axis 31 for each through hole 51. Bonding is performed while maintaining the alignment position. In this example, since the joined object 2 is aligned away from the base material 1 by the high-rigidity chuck 53 or the like, it can be joined so as to maintain the alignment position adjusted in the three directions of XYZ, The angles θX, θY, and θZ around the Y axis and the Z axis can also be aligned.

  In this case, after joining the joined object 2 to the base material 1, as shown in FIG. 8A, the edge 2 e on the joined part 2 a side opposite to the joined part 2 b side where the position of the joined object 2 is offset, and the mother As shown in FIG. 8A, the auxiliary bonding material 3c is provided so as to straddle the material 1, and is directly irradiated with the laser beam L3 to be melted and then cured, so that the auxiliary bonding material 3c shown in FIG. Alignment can be performed by applying an acting force F5 that shifts the position of the bonded product 2 with respect to the base material 1 in the direction opposite to the side on which the position is offset during the curing to form the fillet 3a as shown in b). For this purpose, it is preferable to soften the previously cured bonding material 3 by laser irradiation or the like. In this example, the Z-direction position of the bonded article 2 with respect to the base material 1 can also be aligned if necessary. Angle alignment is also possible.

  In the example shown in FIG. 9, a cylindrical joining member having a symmetrical cross section around an axis 31 as shown in FIGS. 9A and 9B, the base material 1 and the joint portions 2 a and 2 b of the joined article 2. It is made to cure after being melted by laser beam irradiation as shown in FIG. 9A from the outside of the joining member 55 such as the cream solder supplied as the joining material 3 in the joining member 55. It is. As a result, the acting force F that shifts the position of the bonded material 2 relative to the base material 1 when the bonding material 3 is cured is balanced around the axis 31 in each of the bonding members 55 so that the alignment position is maintained and bonded. it can.

  In the example shown in FIG. 10, the joining portions 2a and 2b of the joined article 2 are opposed to each other across the grooves 61 provided on both sides of the joining portions 1a and 1b of the base material 1 as shown in FIGS. And applying the cream solder as a bonding material 3 to the bonding boundary portion formed between the end surfaces of the bonding portions 2a and 2b of the bonded article 2 and the groove 1 between the base material 1, and directly applying the laser beams L1 and L2. , And the melted bonding material 3 is cured so as to form the fillet 3a with the same length a = b with the excessive drop of the molten bonding material 3 into the groove 61. The acting force for shifting the position of the object 2 with respect to the base material 1 is balanced between the joint portions 2a and 2b, and the workpiece 2 is joined while maintaining the alignment position.

In the example illustrated in FIG. 11, the cream solder is used as the bonding material 3, and the axis 31 as illustrated in FIGS. 11A to 11C is formed on the surface including the bonding surface of the base material 1 or on the back side of the bonding portions 2 a and 2 b. Formed as a film-forming layer on the surface including the bonded surface of the bonded object 2 in which, for example, a concave portion 65 having a diameter d is formed symmetrically, the bonded surface of the bonded object 2 is added to the bonded surface of the base material 1 with alignment. 11 (a) and 11 (c), laser beams L1 and L2 are irradiated from the recess 65 onto the axis 31 as shown in FIGS. 11 (a) and 11 (c), and the bonding material 3 between the base material 1 and the bonded article 2 is shaped into the recess 65. 11C around the axis 31 similar to that shown in FIG. 11C is melted and then cured, so that the joined material 2 is bonded to the base material 1 when the joining material 3 is cured. The acting force F for shifting the position of the By Nsu brought into bonding holds the alignment position. The diameter d ₀ of the irradiation spot of the laser beams L 1 and L 2 is preferably equal to or slightly smaller than the diameter d of the recess 65.

  In the example shown in FIG. 12, the cream solder is used as the bonding material 3, and the axis 31 as shown in FIGS. 11A, 11 </ b> B, and 11 </ b> C is formed on the surface including the bonding surface of the base material 1 or in the bonding portions 2 a and 2 b. It is formed as a film-forming layer on the surface including the joint surface of the joined article 2 in which a symmetric annular cavity 71 is formed, and the joined surface of the joined article 2 is pressed against the joined surface of the base material 1 with alignment. A laser beam L1 and L2 are irradiated from the outside on the axis 31 as shown in FIGS. 12 (a) and 12 (c), and a central portion in which the annular cavity 71 surrounds the bonding material 3 between the base material 1 and the bonded material 2 The area shown in black in FIG. 12C around the axis 31 similar to the shape is melted and then cured, so that the joined material 2 is made into the base material 1 when the joining material 3 is cured. The acting force F that shifts the position is separated around the axis 31 for each joint. Scan is allowed to be joined to hold the alignment position.

  In the example shown in FIG. 13, a fast-curing adhesive 30 that is fast-cured by laser light irradiation or heat is joined to a joining boundary portion between the joint 2 and the base material 1 at opposing joints around the outside. After being provided as a material and holding and aligning the bonded product 2 on the base material 1, the high-speed curable adhesive 30 is directly irradiated with the laser beams L1 and L2 to be cured at high speed. The displacement force of the curable adhesive 30 with respect to the bonded product 2 at the time of curing is small in volume change of the high-speed curable adhesive 30 and is suppressed by high-speed curing so that the alignment position can be maintained and bonded. For this, it is preferable to use an epoxy-based adhesive, and the high-speed curable adhesive 30 is formed by directly or directly transmitting the laser beams L1 and L2 through transparent or translucent glass, resin, or a metallized translucent optical component. When the laser beam can be irradiated, a transparent adhesive base material having high absorption of the laser beams L1 and L2, for example, 20% or more of metal particles is preferably mixed. Specifically, metal particles such as Ni and Sn are good, and Ag is not preferable. When such a high-speed curable adhesive 30 is used, it is cured in about 10 seconds to 20 seconds by laser beams L1 and L2 of several W class, which is much faster than a UV adhesive that takes several minutes to cure. In addition, since the high-speed curable adhesive 30 has high thermal conductivity, curing at a portion where the laser beams L1 and L2 are not directly irradiated can be accelerated without a blind spot. In this example, the bonding object 2 can be aligned in the three directions XYZ, and the angles θX, θY, and θZ around the respective X-axis, Y-axis, and Z-axis can also be aligned. It is suitable for the application to the joining of the so-called turning member that mounts the LD (semiconductor laser) and adjusts the position thereof.

  In the example shown in FIG. 13, in particular, a fast-curing adhesive 30 is provided as a bonding material between the facing portions 1 c and 1 d of the base material 1 and the bonded material 2 in which the joint portions facing each other are opposed to each other. However, the joined article 2 is held on the base material 1 in a bridging state and joined, and it is more preferable to align in all the directions.

  In each of the above cases, priority is given to one of the opposing joints around the outer periphery of the joint 2, and then the misalignment of the joint 2 is determined, and the determined misalignment of the other joint is reduced or eliminated. When the irradiation output or the irradiation timing of the laser beam L is controlled as described above, alignment can be performed easily and reliably using a displacement force that causes the bonded object 2 to be displaced when the bonding material 3 is cured. . In this case, the other joining is performed after the one joining material that has been joined is softened so that the previous joining does not interfere with the alignment during the subsequent joining.

  As in the example shown in FIG. 14, when the above-described twisting member is used as the base material 1 and the LD module is joined as the joint 2, their volume is large, and their joint boundary 4 is used for position adjustment. It is located inside the substantially spherical shape, and it is difficult for heat from the laser light L1... To reach by irradiation with the laser light L1. In this example, a solder made of SnCu or SnBi, which is a lead-free brazing material, is used as the bonding material 3, and one of the base material 1 and the bonded material 2, and in the specific example, FIG. (A) (b) (c) As shown in FIG. 14 (b) (c) provided on the end face of the convex portion 75 as a plated film-forming layer, between the base material 1 and the joined article 2 As shown in FIGS. 14 (a) and 14 (c), each of the projections 75 is irradiated with laser beams L 1 to L 3 through gaps 76 as shown in FIG. After being melted, bonding is performed by curing.

  As a result, the laser beams L1 to L3 can be irradiated, and the bonding material 3 can be bonded by the irradiation of the laser beam L1. Further, there are many combinations of materials of optical parts that can be joined together by adopting the joining material 3 including a brazing material and an adhesive, and the irradiation output of the laser light L1. In addition, since the bonding time can be as short as several tens of seconds, it is difficult to damage optical components. Moreover, the position displacement acting force F exerted on the bonded article 2 when the bonding material 3 is cured by performing the bonding by pressurizing or the like with alignment in a state of being supported by the convex portion 75 with respect to the base material 1 of the bonded article 2. Therefore, it is possible to secure a high positional accuracy such as several tens of microns, as required.

In this example, for alignment with the base material 1 of the joint 2, the play 77 as shown in FIGS. 14 (a) and 14 (b) is provided around the support of the joint 2 by the convex portions 75 of the base 1. It is provided and supported. In addition, an inert gas such as N ₂ is blown from the two directions in the junction boundary portion 4 to prevent oxidation. Further, the projection 75 is irradiated with the laser beams L1 to L3 as band-shaped light having a width l and a thickness B at a substantially intermediate height position in the height direction of the projection 75 as shown in FIG. Irradiation is suitable for efficient and reliable bonding without damage to the optical components.

  By the way, the bonding strength at three points using Sn as a bonding material is as small as about 1.3 kgf, and it is difficult to obtain a bonding strength of about 5 kgf. Therefore, in addition to performing the bonding at the three points as the bonding material 3, SnBi having a melting point lower than that of Sn is also plated as the bonding material 3 on the other protrusions 78 shown in FIG. Simultaneously with the joining by Sn, the projection 78 and the joined article 2 can be joined by the residual heat in this joining. As a result, the area where the laser beams L1 and L2 do not reach can be used to increase the bonding area, and the total bonding strength can be easily obtained at about 5 kgf.

  In this case, two types of brazing materials having different melting points are individually formed as bonding materials 3 on the end surfaces of the plurality of convex portions 75 and 78 between the first base material 1 and the bonded material 2. In addition, the bonded material 3 having a high melting point is bonded by curing after irradiation by irradiation with the laser beams L1 to L3 to obtain a bonded module 101 as shown in FIG. As the bonding material 3, SnBi, which is the low melting point brazing material, is provided on the convex portion 79 provided on one of them with the second base material 102 as a winding base that supports the first base material 1 so as to be adjusted. A film is formed, and bonding is performed by curing after melting by irradiation with laser beams L4 and L5 using a gap 81 between both sides by the convex portion 79. As a result, even if the bonding material 3 that has been bonded at the convex portion 78 between the first base material 1 and the bonded article 2 may be softened and melted by residual heat, The bonding material 3 that has been bonded is not softened or melted, and the bonded state remains secured. In addition, when the joining between the second base material 102 and the joined article module 101 is completed, the joining material 3 at the convex portion 78 is also cured, so that the secured joining strength of about 5 kgf is guaranteed.

  In the example shown in FIG. 15, a laser beam is applied to the joint boundary 4 between the base material 1 and the joined article 2 by abutting or fitting the joined article 2 that is a resin lens to the base material 1 that is a plastic lens barrel. After the resin portion is melted by irradiating L, it is bonded by being held and cured with alignment by the high-rigidity chuck 53 or the like. As a result, the laser beam L is directly applied to the bonding base 4 of the resin base material 1 and the bonded article 2 to melt and cure the resin part, and the irradiation output of the laser beam L is about several W class. In addition, the bonding time can be as short as several tens of seconds, the optical component is hardly damaged, and high positional accuracy can be ensured by alignment. In the illustrated example, in particular, the bonded object 2 is specified as a melting target, and the uniform laser beam L is irradiated to almost the entire area to realize the bonding with the base material 1, and the curing is gradually performed so that the entire process is completed simultaneously. It is suitable to carry out.

  In the example shown in FIG. 16, the base material 1 and the joined material 2, one of which is made of resin and the other is made of glass, are brought into contact with or fitted to each other at the joining boundary portion 4 of the base material 1 and the joined material 2. ), The resin part is melted by irradiating the laser beams L1, L2,..., And then the joined object 2 is bonded by being held and cured by the high-rigidity chuck 53 or the like. . In this case, if the base material 1 and the joint 2 are fitted to each other in a square shape, the laser beams L1, L2,... Are irradiated with a line, and only two opposite sides may be joined. It can also be joined. In addition, when the base material 1 and the joined object 2 are fitted with a quadrangle and a circle as shown in FIG. 16 (b), the joining boundary part 4 becomes the four outer circumferences of the joined object 2, and the laser L1, The irradiation of L2 becomes a spot, and two opposite locations are joined or four locations are joined. In any case, alignment may be performed in a direction in which the shake accuracy of the bonded article 2 with respect to the optical axis is required. Performing in the XY2 direction is suitable for both optical axis alignments. As a result, even if the one is made of resin and the other is a combination of the base material 1 and the joined material 2, the laser beam L 1, L 2. Since the curing is performed and the bonding is performed, the irradiation output of the laser beams L1, L2,... It is hard to give, and high positional accuracy by alignment can be secured.

  In the example shown in FIGS. 17 and 18, the brazing material SnBi58 is used as the bonding material 3 and the zinc die cast member is used as the base material 1 and the surface including the bonding portion is plated, and the bonding portion is metalized glass or metalized. While applying pressure to the bonded product 2 made of resin, the laser beam L is irradiated from the outside to melt the bonding material 3 at the bonded portion and post-cure the bonding. As the metallized material, there are Zn plating and lead-free cream solder, Fe sputtered film, Au sputtered film, Ni sputtered film, and the like, and if all of them are capable of passing the laser light L, the laser light L reaches the bonding material 3. Therefore, it is advantageous for the melting operation. In this joining, it is needless to say that the joining object 2 can be pressed and held with alignment with respect to the base material 1 as necessary to ensure high positional accuracy. The metallized resin needs to have heat resistance with respect to the melting point 139 ° C. of the bonding material 3. Here, it is suitable for melting of the bonding material 3 that the laser beam L has a low reflectance with respect to the coating wavelength applied to the surface of the bonded article 2 and has an even wavelength.

  In the example shown in FIG. 19, the fast-curing adhesive 30 is used as a bonding material, applied to the surface of the bonding portion of the base material 1 made of a zinc die-cast member, and glass (for example, BK7), Or it is made to join by pressurizing the joining material 2 which consists of resin, irradiating the laser beam L from the outside, and hardening the joining material 3 of a junction part. Also in this case, it is suitable for melting the bonding material 3 that the laser beam L has a low reflectance with respect to the coating wavelength applied to the surface of the bonded article 2 and has a uniform wavelength.

  In the example shown in FIG. 20, the base material 1 of a metal die-cast member such as zinc or aluminum that can be joined by lead-free solder, and the lead-free solder is plated as the joining material 3 on the surface including the joining surface. The joint 2 made of a metal material is pressurized and irradiated with laser beams L1 and L2 from the outside of the joints 2a and 2b, and joined together by melting the joint material 3 and simultaneously curing the fillet 3a. ing. The plating of the bonding material 3 can also be provided on the base material 1 side. In this case as well, high positional accuracy can be ensured if the position is maintained with the alignment of the bonded article 2. Here, in order to improve the bonding property, it is preferable to cover the portion where the bonding material 3 is melted to form the fillet 3a with the flux 111 for zinc die casting. Further, it is preferable to apply a coating 112 on the flux 111 so that the flux 111 is not exposed even by the bonding and is free of cleaning.

  In the example shown in FIG. 21, a base material 1 of a die-cast member made of metal such as zinc or aluminum that can be joined with lead-free solder, and a joint 2 made of non-metal such as glass, ceramic, or resin. The lead-free brazing material film foil is provided as the bonding material 3 between the bonding portions 2a and 2b, melted by irradiating the laser beams L1 and L2 from the outside, and then the fillet 3a is formed and simultaneously cured. It is made to join by. In this case as well, high positional accuracy can be ensured if the position is maintained with the alignment of the bonded article 2.

  In the example shown in FIG. 22A, a bonding material 92, which is a PBS for blue laser, is aligned and fixed to a base material 91 made of blue laser. In this case, the bonded article 92 is difficult to transmit UV light having a wavelength of 400 nm and easily transmits LD laser light L having a wavelength of 810 to 980 nm. Therefore, the high-speed curable adhesive 30 is cured with the laser light L as a bonding material. Are joined together. Here, a high positional accuracy with respect to the base material 91 can be ensured if the position is maintained with the alignment of the bonded article 92. However, in this case as well, as shown in FIG. 22B, the lead-free cream solder is used as the bonding material 3, and the two opposite portions of the bonded article 92 are irradiated with the laser beams L1 and L2 as the bonded portions 92a and 92b. In order to melt and harden and join, fillet 3a is formed at each joint 92a and 92b and hardened at the same time, or the displacement force F at that time is suppressed or balanced to maintain the alignment position. You can also

  Although not shown in the drawings, the members related to the above are described with the same reference numerals, and are made of metal die-cast members such as zinc and aluminum that can be joined by lead-free solder as described above. The high-speed curable adhesive 30 is provided as a bonding material between the base material 1 and a bonded material 2 made of a zinc die cast member plated with lead-free solder on the surface including the bonding surface, and the laser beam L is emitted from the outside. It is made to join by irradiating and hardening. In this case, the laser beam L cannot be applied to the high-speed curable adhesive 30 and is cured by heat conduction. However, as described above, the heat conductivity is good and the light-curing is cured.

  Moreover, the base material 1 which consists of metal die-cast members, such as zinc and aluminum which can be joined with lead-free solder, and the joining material 2 which consists of the metal material which plated lead-free solder on the surface containing a joining surface In the meantime, the high-speed curable adhesive 30 is provided as a bonding material, and is bonded by being irradiated with a laser beam L from outside to be cured.

  In addition, the fast-curing adhesive 30 is provided as a bonding material between a base material 1 made of a metal such as a magnet or stainless steel, which is difficult to bond with lead-free solder, and a bonded material 2 made of a zinc die-cast member. It joins by irradiating the laser beam L from the outside and making it harden | cure.

  Further, the fast-curing adhesive 30 is bonded between the base material 1 made of a metal such as a magnet or stainless steel, which is difficult to join with lead-free solder, and a non-metal bonded material such as glass or resin. And is bonded by irradiating a laser beam from the outside to be cured.

  In addition, the high speed is provided between the base material 1 made of a metal such as a magnet or stainless steel which is difficult to join with lead-free solder and the joined material 2 made of metal such as a magnet or stainless steel which is difficult to join with lead-free solder. The curable adhesive 30 is provided as a bonding material, and is bonded by being irradiated with a laser beam L from outside to be cured.

  INDUSTRIAL APPLICABILITY The present invention can be practically used for joining optical parts made of metal or resin, and can be advantageously joined by irradiation with laser light.

An example in embodiment of this invention is shown, (a) is the schematic which shows a joining method, (b) is a block diagram of a joining apparatus, (c) is the control state of the irradiation output of the laser beam by a joining apparatus. It is a time chart which shows. The other example in embodiment of this invention is shown, (a) is a side view of a joining operation step, (b) is a side view after joining. Another example in the embodiment of the present invention is a misalignment state of bonding due to imbalance of misalignment acting force, an output control state in which the misalignment acting force is balanced by adjusting the irradiation output of laser light, and joining by the same It is a time chart which shows a position shift prevention state. FIG. 5 shows another example in the embodiment of the present invention, where (a) is a plan view of a joining operation stage, and (b) is a side view of the joining operation stage. FIG. 5 shows still another example in the embodiment of the present invention, where (a) is a side view before the joining operation, (b) is a side view at the joining operation stage, and (c) is a cross-sectional view showing the joining portion at the joining operation stage. (D) is sectional drawing which shows the junction part after joining. Another example in embodiment of this invention is shown, (a) is sectional drawing of a joining operation step, (b) is sectional drawing after joining. The other example in embodiment of this invention is shown, (a) is a top view before joining operation, (b) is sectional drawing of a joining operation step, (c) is sectional drawing after joining operation, (d) These are top views which show the balance state of the position shift action amount in a junction part. Another example in the embodiment of the present invention is shown, in which (a) is a cross-sectional view of a misalignment correction stage after the joining operation, and (b) is a cross-sectional view after misalignment correction. The another example in embodiment of this invention is shown, (a) is sectional drawing of a joining operation step, (b) is a perspective view which shows the state of the joining member used for a junction part, and a joining material. The other example in embodiment of this invention is shown, (a) is a top view before joining operation, (b) is a side view of a joining operation stage, (c) shows the relationship between a base material and a joining thing. It is a front view. 1 shows another example in the embodiment of the present invention, where (a) is a cross-sectional view of the joining operation stage, (b) is a plan view of the joining part before joining, and (c) is a side view of the joining part at the joining stage. It is. The another example in embodiment of this invention is shown, (a) is sectional drawing of a joining operation step, (b) is the top view which looked at part of the junction part before joining, (c) It is sectional drawing of the junction part of a joining operation step. It is sectional drawing which shows one example in another embodiment of this invention. FIG. 4 shows one example in another embodiment of the present invention, where (a) is a plan view of a joining operation stage, (b) is a cross-sectional view of the joining operation stage, and (c) is a side view of a joining portion at the joining operation stage. It is. It is sectional drawing of the joining operation stage which shows one example in this one embodiment of this invention. The other example in this one embodiment of this invention is shown, (a) is sectional drawing of a joining operation step, (b) is a partial top view before joining operation. It is a side view of the joining operation stage which shows one example in further one embodiment of this invention. It is a top view before joining operation of FIG. It is a side view of the joining operation stage which shows another example in further one embodiment of this invention. It is a side view of the joining operation stage which shows one example in another embodiment of this invention. It is sectional drawing of the joining operation step which shows another example in further another embodiment of this invention. FIG. 4 is a perspective view of a joining operation stage, and FIG. 5 (b) is a plan view showing another joining operation method according to another example of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 91, 102 Base material 2, 92, 101 Joined material 2a, 2b Joining part 3 Joining material 3a Fillet 3c Auxiliary joining material 4 Joining boundary part 5 CCD camera 5a Monitor 6 Operation panel 7 Microcomputer 8 Storage means 9 Program 11, 12 Semiconductor laser (laser light source)
21 Adhesive 22 Heat insulation member 23 Support surface 30 High-speed curable adhesive 31 Axis line 32 Recess 33 Press member 41 Recess 51 Through hole 52 Clearance 53 High rigidity chuck 55 Joining member 61 Groove 65 Recess 71 Cavity 75, 78, 79 Protrusion 76 Gap 101 Bonded module L Laser beam F Position shift force

Claims (40)

When the bonding material supplied to the bonding boundary between the base material and the object to be bonded is cured or melted by laser light irradiation and then cured, it is bonded at the stage where the bonding material is cured. It is characterized in that the position displacement acting force for shifting the position of the object with respect to the base material is suppressed at each bonding point or between the bonding points, or the alignment position is maintained or maintained by the degree of balance and cured and bonded together. To join optical components. The displacement force adjusts the balance by feedback control of the irradiation output of the laser beam or the irradiation timing based on the position information of the bonded material between the bonded portions around the outer surface of the bonded material during the bonding material curing. The optical component bonding method according to claim 1. The optical component joining method according to any one of claims 1 and 2, wherein the adjustment of the degree of balance between the joining positions of the position displacement acting force is performed by remelting a once-cured joining material. The adjustment of the degree of balance between the joining positions of the position displacement acting force is performed by reproducing the laser light irradiation conditions obtained from an appropriate joining result of the specific base material and the joined article at the subsequent joining. 2. A method for joining optical components according to 1. Brazing material is used as a bonding material, and the laser beam is irradiated directly to the bonding boundary between the bonding material and the base material at the joints facing each other around the outer part of the bonded material, and then melted to form the parent material at each part of the bonding boundary. Adjust the timing of laser beam irradiation and the laser beam power so that the brazing filler metal wets and straddles both joints and forms a fillet at the same time. The optical component bonding method according to claim 1, wherein the force is balanced between the bonding portions and bonded while maintaining the alignment position. A brazing material is used as a joining material, and the brazing material is provided to the central part in the recess having a symmetrical shape around the axis formed on one or more joint surfaces on which the joining material of the base material comes into contact, and the brazing material is pressed against the base material and the brazing material. After irradiating laser light on the axis line from outside while pressing with alignment with the bonded object, after the molten brazing material wets and straddles both the concave part of the base material and the bonded object around the axis line 2. The bonding according to claim 1, wherein an action force for shifting the position of the bonded member relative to the base material when the brazing material is hardened is balanced around the axis line and held at the alignment position while being bonded. A method for joining optical components. A brazing material is used as a bonding material, and is formed on a surface including a bonding surface having a recess that leaves a bonding allowance between the bonding material of the base material or a film forming layer on the surface including the bonding surface of the bonding material. While applying pressure to the joint surface of the joint with alignment, the laser beam is irradiated from the outside on the axis, and the molten joint material is pushed between the base material and the joint around the joint and around the recess. Then, the optical component bonding method according to claim 1, wherein the substrate is wet-stretched on both of the base material and the bonded material at the bonding boundary portion thereof, and then cured to be bonded while maintaining the alignment position. A brazing material film that protrudes from the joint boundary between the base material and the joint around the outer part of the joint while the brazing material film foil is sandwiched between the base material and the joint is pressed with alignment. Irradiation output of laser light irradiation so that the brazing material is irradiated with laser light directly on the outer periphery of the foil and melted to wet both the base material and the joint at each part of the joint boundary around the joint to form a fillet. Alternatively, the optical component joining method according to any one of claims 1 to 4, wherein the joining is performed while maintaining the alignment position by controlling the irradiation timing. The brazing material is used as a joining material, and the brazing material is melted directly by irradiating it in a through-hole having a symmetrical shape around the axis formed at one or more joints with the base material of the joined material to melt the brazing material. For each through hole, the working force for shifting the position of the joint relative to the base material at the time of hardening of the brazing material is cured for each through hole by curing after melting between the base material and the opposing base material with a gap below the part. The method of joining optical components according to claim 1, wherein the joining is performed by balancing around the axis and holding the alignment position. After joining the joint to the base material, it is supplied with the auxiliary brazing material straddling the edge of the opposite side of the joint and the base material, and melted by direct laser irradiation The optical system according to claim 9, wherein the alignment is performed by causing the acting force to shift the position of the bonded member relative to the base material when the brazing material is cured to act in a direction opposite to the side on which the position is offset. Part joining method. The base material and the joint part of the joined object are applied via a cylindrical joining member having a symmetric cross section around the axis, and the brazing material provided as the joining material in the joining member is lasered from the outside of the joining member. By melting after light irradiation and curing, the acting force that shifts the position of the joint with respect to the base material when the brazing material is cured is balanced around the axis for each joint member to maintain the alignment position and join The method for bonding optical components according to claim 1. Applying the joints facing each other across the grooves provided on both sides of the base material joint, and using the brazing material as a joint material, the gap between the end surface of the joint of the joint and the base material is formed. By irradiating laser beam directly to the joining boundary part, the molten brazing material is dropped into the groove and cured, so that the joint is positioned with respect to the base material when the brazing material is cured. The method of joining optical components according to claim 1, wherein the working force to be shifted is balanced between the joint portions and joined while maintaining the alignment position. A brazing material is used as a bonding material, and is formed as a film-forming layer on the surface including the bonding surface of the bonded material in which the surface including the bonding surface of the base material or the concave portion symmetrical about the axis is formed on the back side of the bonding portion. While pressing the joint surface of the joint to the joint surface of the material with alignment, a laser beam is irradiated on the axis from the recess, and the brazing material between the base material and the joint has a range around the axis similar to the recess shape. 2. The bonding according to claim 1, wherein after being melted and hardened, the working force for shifting the position of the joint with respect to the base material when the brazing material is hardened is balanced around the axis and joined while maintaining the alignment position. A method for joining optical components. A brazing material is used as a bonding material, and is formed as a film forming layer on the surface including the bonding surface of the base material or on the surface including the bonding surface of the bonded product in which a circular cavity symmetrical around the axis is formed in the joint. A laser beam is irradiated from the outside on the axis while pressing the joint surface of the joint with alignment to the joint surface of the joint, similar to the shape of the central portion where the annular space surrounds the brazing material between the base material and the joint Claims in which the area around the axis is melted and then cured to balance the acting force that causes the bonded product to be displaced with respect to the base material when the brazing material is cured, thereby maintaining the alignment position and joining. Item 2. A method for bonding optical components according to Item 1. Bonded material that is aligned with the base material is bonded to two or more temporary joints on the outer periphery facing each other and cured by irradiation with laser light or ultraviolet light, and then temporarily fixed. By supplying a brazing agent as a bonding material to other joints facing each other around the object, and directly irradiating with laser light, the brazing material is melted and wetted on both the base material and the bonded material, thereby brazing. 2. The optical component according to claim 1, wherein a position-shifting force that shifts the position of the bonded product with respect to the base material when the material is cured is suppressed by the temporary fixing force by the adhesive, the alignment position is maintained, the main fixing is performed, and the bonding is finished. Joining method. A fast-curing adhesive that cures at high speed by heat is supplied as a bonding material to the bonding boundary with the base material at the opposite joints around the outer part of the joint, and the joint is held on the base material for alignment. After that, the high-speed curable adhesive is directly irradiated with laser light to be cured at high speed, thereby suppressing the displacement force on the joint during curing of the high-speed curable adhesive and maintaining the alignment position and joining. Item 2. A method for bonding optical components according to Item 1. A fast-curing adhesive that cures at high speed by heat is provided as a bonding material between the facing parts of the base material and the joints that face the outer joints facing each other, and the joined material is bridged on the base material. After alignment with holding in a state, the high-speed curable adhesive is directly irradiated with laser light to be cured at high speed, thereby suppressing the displacement force on the bonded product during the curing of the high-speed curable adhesive. The method for bonding optical components according to claim 1, wherein the optical component is held and bonded. A brazing material is used as a bonding material, and is provided as a film-forming layer plated on the end face of the convex portion provided at one of the joint portions of the base material and the joint, and a gap formed by the convex portion is provided between the base material and the joint portion. A method for joining optical components, characterized in that a laser beam is irradiated to a convex portion to melt a brazing material and then cured by curing. Two types of brazing materials having different melting points are individually formed on the end surfaces of the plurality of convex portions between the first base material and the bonded material, and melting of the brazing material having a high melting point by irradiation with laser light. A laser beam of a low melting point brazing material in which the joint module and the second base material are formed on a convex portion provided at one of the joint parts by joining by subsequent curing to form a joint module. The method for joining optical components according to claim 18, wherein the joining is performed by curing after melting by irradiation of. A resin joint is brought into contact with and fitted to a resin base material, laser light is irradiated to the joint boundary between the base material and the joint to melt the resin portion, and then the joint is held with alignment. And bonding by optically curing the optical component. After one side is made of resin and the other side is made of glass and the base material and the joined product are brought into contact with each other and fitted together, the joining boundary portion of the base material and the joined product is irradiated with laser light to melt the resin portion, and then the joined product. A method for joining optical components, characterized in that the optical components are held together with alignment and cured by curing. The optical component joining method according to any one of claims 1 to 17, 20, and 21, wherein the alignment of the joint is performed by a high-rigidity chuck. The optical component joining method according to any one of claims 1 to 22, wherein the base material is irradiated with laser light while being separated from the support surface by a heat insulating member. The method for joining optical components according to any one of claims 1 to 6, wherein the laser beam is condensed and irradiated to a spot size of ² mm ² or less. A brazing material is used as a bonding material, the surface including the bonded portion of the zinc die cast member is plated, and a laser beam is irradiated from the outside while pressurizing a bonded material made of metallized glass or metalized resin to the bonded portion. A method for joining optical components, characterized in that the soldering material is melted and post-cured to be joined. Fast-curing adhesive that cures at high speed with heat between die-cast metal members such as zinc and aluminum that can be joined with lead-free solder, and non-metal joints such as glass, ceramic, and resin A method for joining optical components, characterized in that an agent is provided as a joining material and joining is performed by irradiating a laser beam from the outside and curing. High-speed curability that cures at high speed by heat between metal die-cast members such as zinc and aluminum that can be joined with lead-free solder and zinc die-cast members with lead-free solder plated on the surface including the joint surface A method for joining optical components, characterized in that an adhesive is provided as a joining material, and joining is performed by irradiating a laser beam from the outside and curing. High speed heat curing between a die-cast member made of metal such as zinc and aluminum that can be joined with lead-free solder and a joint made of a metal material plated with lead-free solder on the surface including the joint surface A method for joining optical components, characterized in that a curable adhesive is provided as a joining material, and is joined by irradiating with a laser beam from the outside to be cured. A fast-curing adhesive that cures quickly by heat is provided between the base material made of metal such as magnet or stainless steel, which is difficult to join with lead-free solder, and the joined product made of zinc die-casting material. A method for joining optical components, characterized in that joining is performed by irradiating and curing with laser light. A fast-curing adhesive that hardens at high speed by heat between a base material made of a metal such as a magnet or stainless steel, which is difficult to join with lead-free solder, and a non-metal joined material such as glass or resin. A method for joining optical components, characterized in that the joining is performed by irradiating and curing with laser light from the outside. High-speed heat curing between a base material made of a metal such as a magnet or stainless steel, which is difficult to join with lead-free solder, and a joint made of metal, such as a magnet or stainless steel, which is difficult to join with lead-free solder A method for joining optical components, characterized in that a curable adhesive is provided as a joining material, and is joined by irradiating with a laser beam from the outside to be cured. 26. To join a base material and a joined product, at least one of which is made of zinc die cast, using a brazing material as a joining material, a portion where the brazing material is melted to form a fillet is coated with a zinc die casting flux. The method for joining optical components according to any one of -28. The optical component bonding method according to claim 32, wherein a coating is provided on the flux so that the flux is not exposed even by the bonding and is washed free. The method of joining optical components according to any one of claims 1 to 33, wherein the laser beam irradiation spot has a shape commensurate with the form of the joint. The method of joining optical components according to any one of claims 1 to 34, wherein the output distribution of the laser light irradiation spot is made substantially uniform. Priority is given to one of the opposing joints around the outside of the joint, and then the misalignment of the joint is determined, and the laser beam irradiation output or so that the determined misalignment is reduced or eliminated in the other joint 6. The method for joining optical components according to claim 2, wherein the irradiation timing is controlled. 37. The method of joining optical parts according to claim 36, wherein the other joining is performed after softening one joining material that has been joined. The optical component joining method according to claim 1, wherein the position is determined and aligned based on a light emitting position of a light source mounted on the joint. The method of joining optical parts according to claim 2, wherein the brazing material is cured by gradually decreasing the irradiation power of the laser light while balancing the laser light irradiation. The method for bonding optical components according to any one of claims 1 to 39, wherein the laser beam is an LD laser beam.

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