CN116799609A - Laser packaging device and laser packaging method - Google Patents
Laser packaging device and laser packaging method Download PDFInfo
- Publication number
- CN116799609A CN116799609A CN202310501575.0A CN202310501575A CN116799609A CN 116799609 A CN116799609 A CN 116799609A CN 202310501575 A CN202310501575 A CN 202310501575A CN 116799609 A CN116799609 A CN 116799609A
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- light
- base
- laser
- solder
- lens
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 238000002844 melting Methods 0.000 claims abstract description 19
- 230000008018 melting Effects 0.000 claims abstract description 19
- 239000012768 molten material Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000155 melt Substances 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000002131 composite material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
The invention relates to a laser packaging device and a laser packaging method, wherein the laser packaging device comprises a dichroic mirror, a first laser, a second laser and a focusing mirror, wherein the first laser is used for emitting melting light; the second laser is used for emitting base preheating light, and the base preheating light and the melting material light are combined through the dichroic mirror to form combined beam light; the focusing mirror is used for focusing the combined beam light on the base and the solder arranged on the base. The optical device packaging device can melt solder through molten material and preheat the optical preheating base through the base, so that the base is kept at a preset temperature, the molten solder can infiltrate the base, and the connection strength of the base is ensured. The base is preheated in a targeted manner by the base preheating light. The dichroic mirror enables the first laser and the second laser to combine the base preheating light and the melting light into combined light under the condition that the first laser and the second laser do not interfere with each other, meets the requirement that the base is kept at a preset temperature while the melting light melts solder, and enables the solder to infiltrate the base.
Description
Technical Field
The present invention relates to the field of laser manufacturing technologies, and in particular, to a laser packaging device and a laser packaging method.
Background
In the packaging of semiconductor laser modules, a large number of lenses are required to be mounted, and typically the lenses are glued to a gold plated mount. However, since the glue has volatility, in a laser with high reliability requirements, the volatility of the glue affects the chip and the overall life, and cannot meet the requirements.
In order to solve the above problems, a method of soldering a lens using a glass solder is adopted in the prior art, in which a laser is used to heat the glass solder, and the glass solder is melted and cooled to solder the lens to a base. However, the method can lead the glass solder to be easily separated from the base, and the welding strength is low.
Therefore, a laser packaging device and a laser packaging method are needed to solve the above-mentioned technical problems.
Disclosure of Invention
An object of the present invention is to provide a laser packaging method to improve the soldering strength of a lens.
To achieve the above object, a first aspect of the present invention provides a laser package apparatus, comprising:
a dichroic mirror;
a first laser for emitting a frit light, the frit light being transparent to the dichroic mirror;
the second laser is used for emitting base preheating light, and the base preheating light is combined with the melting stock after being reflected by the dichroic mirror so as to form combined beam light;
and the focusing mirror is arranged between the dichroic mirror and the base and is used for focusing the combined beam light on the base and the welding flux arranged on the base.
Optionally, the dichroic mirror forms an included angle of 45 ° with the frit light, and the dichroic mirror forms an included angle of 45 ° with the base preheating light.
Optionally, the base preheating light is blue light or green light.
Optionally, the melting material light is infrared light.
Optionally, the focal length of the focusing lens is not less than 10cm.
Another object of the present invention is to provide a laser packaging method to improve the soldering strength of the lens.
To achieve the object, the second aspect of the present invention adopts the following technical scheme:
a method of laser packaging, comprising the steps of:
s1, placing solder on a base, placing a lens on the solder, and coupling the lens to a preset position;
s2, preheating the base by the base preheating light, and heating the solder by the melting light to melt the solder.
Optionally, step S2 further includes:
s3, adjusting the position of the lens to a preset position.
Optionally, step S2 further includes:
and closing the base preheating light and the melting stock light, and cooling and solidifying the welding stock.
Optionally, the lens is an aspheric cylindrical lens or a spherical cylindrical lens, and the solder used for welding the aspheric cylindrical lens or the spherical cylindrical lens is in a semicircular structure.
Optionally, the lens is a reflector, and the solder for soldering the reflector is a polygonal structure.
Therefore, according to the technical scheme provided by the invention, the solder can be melted by the molten material through light, and the base is preheated by the base preheating light, so that the base is kept at the preset temperature, the molten solder can infiltrate the base, and the connection strength of the base is ensured. Because the base is usually a gold-plated base, the base has extremely strong reflection capability on molten material light, and the molten material light is difficult to preheat the base, so that the base is preheated pertinently by the base preheating light. Meanwhile, the dichroic mirror enables the first laser and the second laser to combine the base preheating light and the melting material light into combined light under the condition that the first laser and the second laser do not interfere with each other, then the combined light is focused through the focusing mirror, and finally the combined light is focused on the welding material and the base, so that the requirement that the base is kept at a preset temperature while the melting material light melts the welding material is met, and the welding material can infiltrate the base.
Drawings
Fig. 1 is a schematic structural diagram of a laser packaging device according to an embodiment of the present invention;
fig. 2 is a flowchart of a laser packaging method according to an embodiment of the present invention.
In the figure:
1. melting light; 2. preheating light on a base; 3. a dichroic mirror; 4. combining the beam light; 5. a focusing mirror;
10. a base; 20. and a lens.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
In the present invention, directional terms such as "upper", "lower", "left", "right", "inner" and "outer" are used for convenience of understanding, and thus do not limit the scope of the present invention unless otherwise specified.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The embodiment provides a laser packaging device, which is mainly used for welding a lens 20 in a laser to a base 10, wherein the base 10 can be a tube shell, a chip or a heat sink so as to improve the welding strength of the lens 20. This embodiment describes a case where the solder is glass solder.
As shown in fig. 1, the laser packaging device provided in this embodiment includes a dichroic mirror 3, a first laser, a second laser, and a focusing mirror 5. The first laser is used to emit frit light 1, frit light 1 is used to melt solder, and frit light 1 is able to pass through dichroic mirror 3. The second laser is used for emitting base preheating light 2, the base preheating light 2 can preheat the base 10, and the base preheating light 2 is reflected by the dichroic mirror 3 and then combined with the melting material light 1 to form combined light 4. The focusing mirror 5 is disposed between the dichroic mirror 3 and the base 10, and the focusing mirror 5 is used for focusing the combined beam 4 on the base 10 and the solder disposed on the base 10. It will be appreciated that the first and second lasers are located on opposite sides of the dichroic mirror 3, respectively, i.e. the frit light 1 is incident on the dichroic mirror 3 from one side of the dichroic mirror 3 and the mount preheating light 2 is incident on the dichroic mirror 3 from the other side of the dichroic mirror 3.
The laser packaging device provided by the embodiment can melt solder through the melting light 1, and preheat the base 10 through the base preheating light 2, so that the base 10 is kept at a preset temperature, the melted solder can infiltrate the base 10, and the connection strength of the base 10 is ensured. Since the base 10 is often a gold-plated base, the reflection capability of the base 10 to the molten material 1 is extremely strong, and the molten material 1 is difficult to preheat the base 10, so the base 10 is preheated pertinently by the base preheating light 2, and the molten material 1 is used for heating and melting the molten material, namely, the solder and the base 10 are heated by adopting a composite heating mode. Meanwhile, the dichroic mirror 3 enables the first laser and the second laser to combine the base preheating light 2 and the molten material light 1 to form combined beam light 4 under the condition of no interference, then the combined beam light 4 is focused by the focusing mirror 5, and finally the combined beam light 4 is focused on the solder and the base 10, so that composite heating is realized, the requirement that the base 10 is kept at a preset temperature while the molten material light 1 melts the solder is met, and the solder can infiltrate the base 10. The laser packaging device provided by the embodiment has high reliability and strong realizability on the composite heating mode of the metal solder, the piece to be welded 20 and the base 10.
When the piece to be welded 20 is welded and needs to be electrically coupled with the piece to be welded 20, the chip is heated only aiming at the metal solder and the base 10, and the chip is not heated to an excessive temperature, so that the charged coupling is not affected, and meanwhile, after the base 10 and the metal solder are heated, the piece to be welded 20 is coupled again to an ideal position and then solidified in real time, so that the accuracy of the position of the piece to be welded 20 is ensured.
Preferably, the laser package device further comprises a collimating lens through which the frit light 1 emitted by the quasi-continuous laser and the pre-heat light 2 emitted by the pre-heat laser also pass before entering the dichroic mirror 3.
Preferably, the dichroic mirror 3 forms an included angle of 45 degrees with the frit light 1, and the dichroic mirror 3 forms an included angle of 45 degrees with the base preheating light 2, so that the base preheating light 2 and the frit light 1 are not dispersed, and a better beam combination effect is achieved.
The surface of the base 10 is gold, for example, the surface of the base 10 is gold-plated, and the base preheating light 2 is blue light or green light. The wavelengths of blue light and green light are shorter, so that the light absorption rate of the base 10 is guaranteed to be higher, preferably, the base preheating light 2 is blue light, the light absorption rate of the gold-plated base 10 on the blue light can reach 60-80%, and the cost of a second laser generating the blue light is low.
Preferably, the melting light 1 is infrared light, which can melt solder efficiently, and the infrared light has a long wave length, and the absorption rate of the gold-plated base 10 to infrared light is only 10%, so that it can be ensured that the infrared light does not melt the base 10.
The focal length of the focusing mirror 5 is not less than 10cm, so that the jig or the like sandwiching the lens 20 is avoided.
As shown in fig. 2, this embodiment also provides a laser packaging method, where the laser packaging method provided in this embodiment may use the above-mentioned laser packaging device, and of course, other laser packaging devices may also be used, so long as the base preheating light 2 can preheat the base while the melting light 1 heats the solder. The method comprises the following steps:
s1, placing solder on a base 10, placing a lens 20 on the solder, and coupling the lens 20 to a preset position, so that the accuracy of the position of the lens 20 is ensured;
s2, the base preheating light 2 preheats the base 10, and the melting light 1 heats the solder to melt the solder. The base preheating light 2 preheats the base 10, so that the solder can infiltrate the base 10, and the welding strength of the solder is ensured.
Preferably, step S2 further comprises:
and S3, adjusting the position of the lens 20 to a preset position. During the melting process of the solder, the lens 20 will have a small displacement, and the step S3 can adjust the position of the lens 20, so as to ensure the accuracy of the position of the lens 20.
The step S2 further includes:
the base preheating light 2 and the frit light 1 are turned off, and the solder is cooled and solidified to solder the lens 20 to the base 10.
Preferably, in order to further secure the strength of the welding of the lens 20, when the lens 20 is an aspherical cylindrical lens or a spherical cylindrical lens, the solder for welding the aspherical cylindrical lens or the spherical cylindrical lens is of a semicircular structure. The solder with the semicircular structure is similar to the cross section structure of the aspherical cylindrical lens or the spherical cylindrical lens, so that the solder is not wasted, and the welding strength can be ensured.
When the lens 20 is a mirror, the solder used to solder the mirror is a polygonal structure. The polygonal structure can be square, and the like, and the solder of the polygonal circular structure is similar to the cross section structure of the reflector, so that the solder is not wasted, and the welding strength can be ensured.
While the invention has been described in detail in the foregoing general description, embodiments and experiments, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.
Claims (10)
1. A laser package apparatus, comprising:
a dichroic mirror (3);
-a first laser for emitting a frit light (1), the frit light (1) being permeable to the dichroic mirror (3);
the second laser is used for emitting base preheating light (2), and the base preheating light (2) is reflected by the dichroic mirror (3) and then is combined with the molten material light (1) to form combined light (4);
and a focusing mirror (5), wherein the focusing mirror (5) is arranged between the dichroic mirror (3) and the base (10), and the focusing mirror (5) is used for focusing the combined beam light (4) on the base (10) and on the solder of the base (10).
2. The laser package device according to claim 1, wherein the dichroic mirror (3) forms an angle of 45 ° with the frit light (1), and wherein the dichroic mirror (3) forms an angle of 45 ° with the base preheat light (2).
3. The laser package device according to claim 1, wherein the base pre-heat light (2) is blue light or green light.
4. The laser packaging device according to claim 1, characterized in that the frit light (1) is infrared light.
5. The laser packaging device according to claim 1, characterized in that the focal length of the focusing mirror (5) is not less than 10cm.
6. A method of packaging a laser, comprising the steps of:
s1, placing solder on a base (10), placing a lens (20) on the solder, and coupling the lens (20) to a preset position;
s2, preheating the base (10) by base preheating light (2), and heating the solder by using melting light (1) to melt the solder.
7. The method of laser packaging according to claim 6, further comprising, after step S2:
s3, adjusting the position of the lens (20) to a preset position.
8. The method of laser packaging according to claim 6, further comprising, after step S2:
and closing the base preheating light (2) and the melting material light (1), and cooling and solidifying the welding material.
9. The laser packaging method according to claim 6, characterized in that the lens (20) is an aspherical cylindrical lens or a spherical cylindrical lens, and the solder for soldering the aspherical cylindrical lens or the spherical cylindrical lens is a semicircular structure.
10. The laser packaging method according to claim 6, characterized in that the lens (20) is a mirror, and the solder for soldering the mirror is a polygonal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310501575.0A CN116799609A (en) | 2023-04-27 | 2023-04-27 | Laser packaging device and laser packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310501575.0A CN116799609A (en) | 2023-04-27 | 2023-04-27 | Laser packaging device and laser packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116799609A true CN116799609A (en) | 2023-09-22 |
Family
ID=88037017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310501575.0A Pending CN116799609A (en) | 2023-04-27 | 2023-04-27 | Laser packaging device and laser packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116799609A (en) |
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2023
- 2023-04-27 CN CN202310501575.0A patent/CN116799609A/en active Pending
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