JP2005289695A - 導電性セラミックス製品及びその製造方法 - Google Patents
導電性セラミックス製品及びその製造方法 Download PDFInfo
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- JP2005289695A JP2005289695A JP2004104792A JP2004104792A JP2005289695A JP 2005289695 A JP2005289695 A JP 2005289695A JP 2004104792 A JP2004104792 A JP 2004104792A JP 2004104792 A JP2004104792 A JP 2004104792A JP 2005289695 A JP2005289695 A JP 2005289695A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000203 mixture Substances 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 23
- 238000010304 firing Methods 0.000 claims abstract description 19
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims description 39
- 239000000178 monomer Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 15
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000002002 slurry Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 230000000379 polymerizing effect Effects 0.000 abstract description 4
- 230000001747 exhibiting effect Effects 0.000 abstract description 3
- 239000003505 polymerization initiator Substances 0.000 description 11
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 8
- 239000002685 polymerization catalyst Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 239000004088 foaming agent Substances 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- -1 isocyanate compound Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920005646 polycarboxylate Polymers 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000012770 industrial material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000002134 carbon nanofiber Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- 235000013681 dietary sucrose Nutrition 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Substances OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- KFIGICHILYTCJF-UHFFFAOYSA-N n'-methylethane-1,2-diamine Chemical compound CNCCN KFIGICHILYTCJF-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 229960004793 sucrose Drugs 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】 セラミックス原料に対して炭素原子を分子中に有する重合性物質の少なくとも1種を配合してなる組成物を、成形型内に供給し、該成形型内において前記重合性物質を重合せしめて、該重合性物質の重合体である高分子化合物が均一に存在せしめられてなる成形体を形成した後、該成形体を還元焼成することにより、セラミックス焼結体として、目的とする導電性セラミックス製品を得る。
【選択図】 な し
Description
組成物Aに対して、0.13gの重合開始剤及び0.13gの重合触媒を添加した後、かかる重合開始剤等が添加された組成物Aの適量を、円盤形状(直径5cm×厚さ1cm)の成形型、及び立方体形状(2cm×2cm×2cm)の成形型内に供給した。それら2種類の成形型を、室内(温度:25℃)において1.5時間静置することにより、組成物に含まれるメタクリルアミドとN,N’−メチレンビスアクリルアミドとを重合させた後、成形型から脱型することにより、円盤形状の成形体及び立方体形状の成形体を得た。
組成物B、Cのそれぞれに対して、0.13gの重合開始剤及び0.13gの重合触媒を添加した後、かかる重合開始剤等が添加された各組成物の適量を、立方体形状(2cm×2cm×2cm)の成形型内にそれぞれ供給した。実験例1と同様の条件の下に、各成形型内において、組成物中のメタクリルアミドとN,N’−メチレンビスアクリルアミドとを重合させ、2種類の立方体形状の成形体を作製した後、実験例1と同様に、各成形体を乾燥させた。そして、かかる乾燥後の成形体を、窒素雰囲気とされた小型電気炉内において、窒素ガスを導入しながら、1550℃の温度にて2時間、還元焼成することにより、2種類のセラミックス焼結体(試料3、4)を得た。得られたセラミックス焼結体(試料3、4)のそれぞれについて、嵩密度及び体積抵抗率を測定し、その結果を、下記表2に示す。
Claims (7)
- セラミックス粒子間に、炭素原子を有する高分子化合物の還元焼成物よりなる導電路が形成せしめられてなるセラミックス焼結体からなり、その体積抵抗率が1.0×108 Ω・cmより小さいことを特徴とする導電性セラミックス製品。
- 前記セラミックス粒子が、アルミナ粒子であることを特徴とする請求項1に記載の導電性セラミックス製品。
- 前記高分子化合物が、ビニル系樹脂、ウレタン樹脂又はエポキシ樹脂であることを特徴とする請求項1又は請求項2に記載の導電性セラミックス製品。
- セラミックス原料に対して炭素原子を分子中に有する重合性物質の少なくとも1種を配合してなる組成物を、成形型内に供給し、該成形型内において前記重合性物質を重合せしめて、該重合性物質の重合体である高分子化合物が均一に存在せしめられてなる成形体を形成した後、該成形体を還元焼成することにより、得られるセラミックス焼結体を構成するセラミックス粒子間に、前記高分子化合物の還元焼成物よりなる導電路を形成せしめることを特徴とする導電性セラミックス製品の製造方法。
- 前記重合性物質が、ビニル系不飽和単量体であることを特徴とする請求項4に記載の導電性セラミックス製品の製造方法。
- 前記重合性物質として、ビニル系不飽和単量体と共に、架橋性単量体が用いられることを特徴とする請求項4に記載の導電性セラミックス製品の製造方法。
- 前記成形型内に供給される組成物が、水スラリーの形態において調製される一方、前記重合性物質が親水性乃至は水溶性であることを特徴とする請求項4乃至請求項6の何れかに記載の導電性セラミックス製品の製造方法。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007153646A (ja) * | 2005-12-01 | 2007-06-21 | Nagoya Institute Of Technology | 金属内包型導電性セラミックスの製造方法 |
JP2009123691A (ja) * | 2007-10-24 | 2009-06-04 | Nagoya Institute Of Technology | 耐食性セラミックス電極材およびその製造方法 |
JP2010080911A (ja) * | 2008-04-30 | 2010-04-08 | Tayca Corp | 広帯域電磁波吸収体及びその製造方法 |
WO2010047321A1 (ja) * | 2008-10-21 | 2010-04-29 | 国立大学法人名古屋工業大学 | セラミックス電極材およびその製造方法 |
WO2011105469A1 (ja) * | 2010-02-24 | 2011-09-01 | 国立大学法人名古屋工業大学 | 電磁波吸収体及びその製造方法 |
KR20170095670A (ko) * | 2016-02-15 | 2017-08-23 | 엘지이노텍 주식회사 | 열전 박막 및 이를 포함하는 열전 소자 |
CN114262209A (zh) * | 2021-12-23 | 2022-04-01 | 佛山欧神诺陶瓷有限公司 | 一种轻质防静电陶瓷砖及其制备方法 |
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JPH11503709A (ja) * | 1994-05-10 | 1999-03-30 | ダイテック コーポレイション リミテッド | セラミック物品の製造 |
JP2001199764A (ja) * | 2000-01-17 | 2001-07-24 | Wicera Co Ltd | 導電性セラミックス及びその製造方法 |
JP2003095731A (ja) * | 2001-09-19 | 2003-04-03 | Taiheiyo Cement Corp | アルミナ質焼結体の製造方法 |
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JPH11503709A (ja) * | 1994-05-10 | 1999-03-30 | ダイテック コーポレイション リミテッド | セラミック物品の製造 |
JP2001199764A (ja) * | 2000-01-17 | 2001-07-24 | Wicera Co Ltd | 導電性セラミックス及びその製造方法 |
JP2003095731A (ja) * | 2001-09-19 | 2003-04-03 | Taiheiyo Cement Corp | アルミナ質焼結体の製造方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007153646A (ja) * | 2005-12-01 | 2007-06-21 | Nagoya Institute Of Technology | 金属内包型導電性セラミックスの製造方法 |
JP2009123691A (ja) * | 2007-10-24 | 2009-06-04 | Nagoya Institute Of Technology | 耐食性セラミックス電極材およびその製造方法 |
US8486240B2 (en) | 2007-10-24 | 2013-07-16 | National University Corporation Nagoya Institute Of Technology | Ceramic electrode material and manufacturing method thereof |
JP2010080911A (ja) * | 2008-04-30 | 2010-04-08 | Tayca Corp | 広帯域電磁波吸収体及びその製造方法 |
WO2010047321A1 (ja) * | 2008-10-21 | 2010-04-29 | 国立大学法人名古屋工業大学 | セラミックス電極材およびその製造方法 |
CN102197440B (zh) * | 2008-10-21 | 2013-06-05 | 国立大学法人名古屋工业大学 | 陶瓷电极材及其制造方法 |
WO2011105469A1 (ja) * | 2010-02-24 | 2011-09-01 | 国立大学法人名古屋工業大学 | 電磁波吸収体及びその製造方法 |
JP2011176101A (ja) * | 2010-02-24 | 2011-09-08 | Nagoya Institute Of Technology | 電磁波吸収体及びその製造方法 |
KR20170095670A (ko) * | 2016-02-15 | 2017-08-23 | 엘지이노텍 주식회사 | 열전 박막 및 이를 포함하는 열전 소자 |
KR102459951B1 (ko) * | 2016-02-15 | 2022-10-27 | 엘지이노텍 주식회사 | 열전 박막 및 이를 포함하는 열전 소자 |
CN114262209A (zh) * | 2021-12-23 | 2022-04-01 | 佛山欧神诺陶瓷有限公司 | 一种轻质防静电陶瓷砖及其制备方法 |
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