JP2005277009A - Equipment and method for chip transfer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide chip transfer equipment that does not cause the generation of a flaw and contamination on a chip surface by transferring a chip while making the chip not contact with the chip surface by pushing the chip from the side of a film adhered to a wafer ring, or contact with only a limited region in the vicinity of the chip surface. <P>SOLUTION: The chip transfer equipment comprises a wafer ring 10 that includes a film 12 with a chip 11 bonded thereto, a pusher 30, and a tray 20 supporting the chip 11. The pusher 30 is disposed adjacent to the top of the wafer ring 10, and the tray 20 is disposed adjacent to the bottom of the wafer ring 10. The pusher 30 is moved downward to push out the chip 11 from the film 12 side, and then the chip 11 is transferred into a recess 21 of the tray 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus and method for transferring chips, and more particularly, to an apparatus and method for transferring chips diced on a film provided on a wafer ring and transferred to a tray.

  Conventionally, an operation of transferring chips diced and pasted on a film provided on a wafer ring to a tray has been performed. Here, the chip is, for example, a semiconductor chip obtained by cutting a wafer having a large-scale integrated circuit formed on the surface with a dicing device, a filter chip obtained by cutting a glass substrate having a filter film deposited on the surface and cutting the wafer with a dicing device, or the like. Say.

  This transfer operation may be performed manually or with an automated apparatus. When the transfer operation is performed manually, chips that have been processed in advance so as to widen the distance between the diced chips by pulling the film in the lateral direction and are stuck on the wafer ring film are separated one by one. It is sandwiched between two tweezers and transferred to a recess provided in the tray. When performing the transfer work by such a manual work, there is a problem that the speed is slow because the work is relied on manually, and the tip surface is damaged by the tip of the tweezers.

  Even when the transfer operation is performed by an automated apparatus, the conventional apparatus is pasted on the wafer ring by using a suction head or the like as disclosed in, for example, JP-A-2001-332521. The chip was adsorbed and transferred from the wafer ring onto the tray.

  In this case, the suction head is lowered to approach the chip on the wafer ring, and is lifted again after sucking the chip and horizontally moved onto the tray. Further, the suction head moves down to approach the recess of the tray and transfers the chip. After the transfer of the chip is completed, the suction head moves in the reverse direction and returns to the top of the next chip on the wafer ring, and the transfer of the chip is repeated again.

  However, when a transfer operation is performed with such an automated apparatus, the suction head comes into contact with the surface of the chip, so that there is a problem that a circuit on the chip surface, a deposited film, or the like is damaged or contaminated. . In order to clean this contaminated surface, it was necessary to provide a cleaning step after the transfer was completed. Further, even if a cleaning process is provided, it is difficult to completely remove contaminants, which is a weak point in terms of chip quality.

Further, in the conventional automated apparatus, since the suction head repeats complicated movement as described above, the transfer speed cannot be increased, and it is difficult to improve productivity.
JP 2001-332521 JP

  The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art, and the object of the present invention is not to contact the chip surface by pushing the chip from the film side attached to the wafer ring. In other words, it is possible to prevent the chip surface from being scratched and contaminated by transferring only in a limited area around the chip surface.

  Another object is to reduce the cycle time of the chip transfer by improving the transfer speed by simplifying the movement for transfer or enabling simultaneous operation.

  In order to solve the above-mentioned problem, the apparatus invention described in claim 1 has the following configuration.

It consists of a wafer ring with a film with a plurality of chips attached, a pusher with protrusions on the bottom surface, and a tray with a plurality of depressions to hold the chips,
The pusher is positioned on the wafer ring such that the pusher, any one of the plurality of chips, and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Placed close to the top, and the tray is placed close to the bottom of the wafer ring,
The pusher is moved downward to extrude the chip from the film side, and the chip is transferred into the recess.

  Further, the apparatus invention described in claim 2 has the following configuration.

A wafer ring including a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, and a suction head;
The pusher is positioned on the wafer ring such that the pusher, any one of the plurality of chips, and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Placed close to the top, the tray is placed close to the bottom of the wafer ring, and the suction head is placed below the well;
The pusher is moved downward to project the chip from the film side, and the chip is sucked by the suction head and transferred into the recess.

  Furthermore, the apparatus invention described in claim 3 has the following configuration.

A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. A rotating chuck having a chuck seat to support,
The pusher is arranged so that the position of any one of the plurality of chips, the chuck, and the plurality of depressions of the tray in the horizontal plane is aligned. Positioned close to the top of the wafer ring, the rotating chuck is positioned close to the bottom of the wafer ring, and the tray is positioned below the rotating chuck,
The pusher is moved downward to protrude the chip from the film side, and the rotary chuck sucks and holds the chip by negative pressure, and after rotating 180 °, the chip is transferred into the recess by positive pressure.

  Further, the device invention described in claim 4 has the following configuration.

A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. A chuck having a chuck seat to support,
The pusher is disposed below the wafer ring and the chuck is disposed above the wafer ring so that the positions of the pusher and any one of the plurality of chips in a horizontal plane are aligned. Furthermore, the tray is arranged on the side of the wafer ring,
The pusher is moved upward to project the chip from the film side, and after the chuck approaches the chip, the chip is sucked and held by negative pressure, and further moved toward the upper part of the recess and then moved to the chip by positive pressure. Is transferred into the recess.

  Further, in the device invention described in claim 5, in addition to the chip transfer device invention described in claims 1 to 4, the position detection device further detects the position of the chip on the wafer ring in the horizontal plane. It was set as the structure provided with.

  Further, in the apparatus invention described in claim 6, in contrast to the chip transfer apparatus invention described in claims 1, 2, and 4, a chip guide is further disposed above the recess of the tray. .

  Further, in the device invention described in claim 7, in contrast to the chip transfer device invention described in claim 3, the upper portion of the tray recess and the rotating chuck are disposed close to the lower portion of the wafer ring. In this case, a chip guide is further arranged above the rotary chuck.

  The method invention described in claim 8 has the following configuration.

Using a wafer ring with a film with a plurality of chips attached, a pusher with protrusions on the lower end, and a tray with a plurality of depressions to hold the chips,
(1) The pusher, any one of the plurality of chips, and any one of the plurality of depressions of the tray are aligned in a horizontal plane, and the pusher is moved to the wafer. Placing close to the top of the ring and further placing the tray close to the bottom of the wafer ring;
(2) moving the pusher downward to extrude the chip from the film side and transferring the chip into the recess;
A chip transfer method comprising:

  The method invention described in claim 9 has the following configuration.

Using a wafer ring provided with a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, and a suction head,
(1) The pusher is placed in the horizontal plane so that any one of the plurality of chips and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Placing close to the top of the wafer ring, placing the tray close to the bottom of the wafer ring, and placing the suction head close to the bottom of the tray;
(2) moving the pusher downward to project the chip from the film side, and sucking the chip by the suction head and transferring it into the recess;
A chip transfer method comprising:

  The method invention described in claim 10 has the following configuration.

A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. Use a rotating chuck with a chuck seat to support,
(1) The pusher, any one of the plurality of chips, the rotary chuck, and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Disposing the pusher proximate above the wafer ring, disposing the rotating chuck proximate to the bottom of the wafer ring, and disposing the tray below the rotating chuck;
(2) moving the pusher downward to project the chip from the film side, and the rotary chuck sucks and holds the chip with negative pressure; and
(3) transferring the chip into the recess by positive pressure after the rotary chuck has rotated 180 °;
A chip transfer method comprising:

  The method invention described in claim 11 has the following configuration.

A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. Use a chuck with a chuck seat to support,
(1) The pusher is disposed below the wafer ring so that any one of the pusher and the plurality of chips is aligned in a horizontal plane, and the chuck is disposed above the wafer ring. Placing and further placing the tray to the side of the wafer ring;
(2) moving the pusher upward to protrude the chip from the film side, and sucking and holding the chip with negative pressure after the chuck approaches the chip; and
(3) After moving the chuck upward and close to the recess, transferring the chip into the recess by positive pressure;
A chip transfer method comprising:

  By adopting the above-described configuration, the present invention does not contact the chip surface, or only contacts a limited area around the chip surface, thereby transferring and flawing the chip surface. Can be prevented. As a result, it is not necessary to provide a further cleaning process after the chip transfer operation is completed, which contributes to the improvement of productivity by shortening the process, and the generation of scratches on the chip surface and the remaining contaminants do not occur. The effect of improving the chip quality is great.

  Furthermore, by simplifying the movement for transfer or enabling simultaneous operation, the cycle time of chip transfer can be compressed and the transfer speed can be improved.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

  FIG. 1 is a diagram illustrating an example of a chip 11 to be transferred according to the present invention, which is attached to a film 12 of a wafer ring 10 and diced, and then the film 12 is laterally (in-plane direction). The distance between the chips 11 is widened by pulling. The chip 11 generally forms a rectangular thin plate, and many of its sides are about several mm.

  FIG. 2 is a diagram illustrating a tray 20 on which chips are transferred. The tray 20 is provided with a plurality of depressions 21. The recess 21 has a shape corresponding to the shape of the chip 11, and generally has a rectangular shape having a size slightly larger than the size of the chip. A support portion 22 that supports the periphery of the chip 11 is provided in the peripheral portion of the bottom of the recess 21, and the central portion of the bottom 21 of the recess is opened to form a bottom space 23.

  FIG. 3 is a view showing a first embodiment of the present invention. The wafer ring 10 is fixed to a wafer ring carrier 120, which can be moved in a horizontal plane to position the chip in place or to replace the wafer ring 10. It is like that. A tray 20 fixed to the tray carrier 110 is disposed below the wafer ring 10, and the tray carrier 110 is used to position the tray recess 21 in a predetermined position or to replace the tray 20. It can be moved in the horizontal plane. Further, a pusher 30 connected to a pusher drive mechanism 31 is disposed above the wafer ring 10. One or a plurality of projections 32 are provided on the lower end surface of the pusher 30 to push the back surface of the chip 11 from the film 12 side and push the chip 11 downward. The projection 32 can be transferred in a needle shape. The pusher 30 can be moved in the vertical direction by a pusher drive mechanism 31.

  Next, the transfer sequence of the chip 11 based on the first embodiment will be described.

  First, the wafer ring 10 to which the empty tray 20 and the chip 11 are attached is accurately fixed to predetermined positions of the tray carrier 110 and the wafer ring carrier 120 at the respective exchange positions. Next, each carrier moves so that the center positions of the first chip 11 and the first recess 21 coincide with the axial position of the pusher 30 determined in advance.

Next, as shown in FIG. 4, the pusher drive mechanism 31 lowers the pusher 30, and the protrusion 32 pushes the back surface of the first chip 11 from the film 12 side, thereby pushing down the chip 11 downward. The first chip 11 is transferred into the first depression 21 arranged in the above. When the protrusion 32 is formed into a needle shape, the protrusion can break through the film 12 and push the chip 11 downward. When the transfer of the first chip is completed, the pusher drive mechanism 31 raises the pusher 30, and the tray carrier 110 and the wafer ring carrier 120 have the second recess 21 and the center position of the second chip 11 at the center of the pusher 30. Move to match the axial position. Thereafter, the chip 11 is transferred by repeating the same operation as described above.

  When all of the transfer of the chip 11 on the wafer ring 10 is completed, or when all of the recesses 21 of the tray 20 are filled with the chip 11, the wafer ring carrier 120 or the tray carrier 110 is moved to the wafer ring 10 respectively. Alternatively, the transfer operation is continued by moving to the replacement position of the tray 20 and exchanging the wafer ring 10 or the tray 20.

  FIG. 5 is a view showing a second embodiment of the present invention. The wafer ring 10 is fixed to a wafer ring carrier 120, which can be moved in a horizontal plane to position the chip in place or to replace the wafer ring 10. It is like that. A tray 20 fixed to the tray carrier 110 is disposed below the wafer ring 10, and the tray carrier 110 is used to position the tray recess 21 in a predetermined position or to replace the tray 20. It can be moved in the horizontal plane. A pusher 30 connected to a pusher drive mechanism 31 is disposed above the wafer ring 10. One or a plurality of small protrusions 32 are provided on the lower end surface of the pusher 30 so that the chip can be stably protruded through the film, but this protrusion is not essential. The pusher 30 can be moved in the vertical direction by a pusher drive mechanism 31. Further, a suction head 70 is disposed below the tray 20. This suction head 70 is connected to a negative pressure source such as a vacuum pump by a pipe, and an electromagnetic valve is provided in the middle of the pipe so that the communication with the negative pressure source can be switched on and off. Yes. Further, the axis of the suction head 70 is arranged so as to coincide with the axis of the pusher 30.

  Next, the transfer sequence of the chip 11 based on the second embodiment will be described.

  First, the wafer ring 10 to which the empty tray 20 and the chip 11 are attached is accurately fixed to predetermined positions of the tray carrier 110 and the wafer ring carrier 120 at the respective exchange positions. Next, each carrier moves so that the center positions of the first chip 11 and the first recess 21 coincide with the axial position of the pusher 30 determined in advance.

Next, as shown in FIG. 6, the pusher drive mechanism 31 lowers the pusher 30 and pushes the first tip 11 downward through the film. At the same time, the electromagnetic valve is activated so that the suction head 70 communicates with the negative pressure source. In addition, a negative pressure is generated in the bottom space 23 of the recess 21. The first tip 11 protruded downward by this negative pressure is sucked into the first recess 21 arranged below, and the transfer is completed.

  When the transfer of the first chip is completed, the pusher drive mechanism 31 raises the pusher 30, and the tray carrier 110 and the wafer ring carrier 120 have the second recess 21 and the center position of the second chip 11 positioned at the pusher 30. Move to match the axial position. Thereafter, the chip 11 is transferred by repeating the same operation as described above.

  FIG. 7 is a view showing a third embodiment of the present invention. In the third embodiment, the suction head drive mechanism 71 and the suction head 70 disposed below the tray 20 from the second embodiment are removed, and a new rotating chuck 40 is disposed between the wafer ring 10 and the tray 20. Yes. The rotary chuck 40 can be rotated, and one or a plurality of chuck seats 41 can be provided. The chuck seat 41 is connected to a negative pressure source (not shown) such as a vacuum pump and a positive pressure source (not shown) such as a pressurizing pump by piping, and an electromagnetic valve is provided in the middle of the piping. It is provided so that the communication between the negative pressure source and the positive pressure source can be switched. Further, the rotary chuck 40 is arranged so that the axis of the rotary chuck 40 coincides with the axis of the pusher 30.

  Next, the transfer sequence of the chip 11 based on the third embodiment will be described.

  The process is the same as in the second embodiment until the center positions of the first tip 11 and the first recess 21 are moved so as to coincide with the predetermined axial center position of the pusher 30, respectively.

Next, as shown in FIG. 8, the pusher drive mechanism 31 lowers the pusher 30 to project the first chip 11 downward through the film, and at the same time, the chuck seat 41 of the rotary chuck 40 is an electromagnetic valve (not shown). The first chip 11 communicated with the negative pressure source and protruded downward by the negative pressure is transferred to the chuck seat 41 disposed below. Next, the rotary chuck 40 is rotated by 180 °, and the chuck seat 41 holding the chip 11 is positioned above the first recess 21 as shown in FIG. At this time, the chuck seat 41 is connected from the negative pressure source to the positive pressure source by switching the electromagnetic valve. A positive pressure is applied to the chuck seat 41 by the positive pressure source, and the first chip 11 held so far is transferred to the first recess 21 disposed below.

  When the transfer of the first chip is completed, the pusher drive mechanism 31 raises the pusher 30, and the tray carrier 110 and the wafer ring carrier 120 have the second recess 21 and the center position of the second chip 11 at the center of the pusher 30. Move to match the axial position. Thereafter, the chip 11 is transferred by repeating the same operation as described above.

  FIG. 10 is a diagram showing a fourth embodiment of the present invention. The wafer ring 10 is fixed to the wafer ring carrier 120 with the chip 11 facing upward, and the wafer ring carrier 120 is used to position the chip in a predetermined position or to replace the wafer ring 10 in a horizontal plane. You can move in. A tray 20 fixed to a tray carrier 110 is arranged on the side of the wafer ring 10, and this tray carrier 110 is used to position the tray recess 21 at a predetermined position or to replace the tray 20. Therefore, it can move in a horizontal plane. A pusher 30 connected to a pusher drive mechanism 31 is disposed below the wafer ring 10. One or a plurality of small protrusions 32 are provided on the upper end surface of the pusher 30 so that the chip can be stably protruded through the film, but this protrusion is not essential. The pusher 30 can be moved in the vertical direction by a pusher drive mechanism 31. Further, a chuck 90 connected to a chuck driving mechanism 91 that is movable in the vertical direction and the horizontal direction is disposed above the wafer ring 10. A chuck seat 92 is provided at the tip of the chuck 90. The chuck seat 92 is connected to a negative pressure source (not shown) such as a vacuum pump and a positive pressure source (not shown) such as a pressure pump by piping, and an electromagnetic valve (not shown) is placed in the middle of the piping. (Not shown) are provided so that the communication between the negative pressure source and the positive pressure source can be switched.

  Next, the transfer sequence of the chip 11 based on the fourth embodiment will be described.

  First, the wafer ring 10 to which the empty tray 20 and the chip 11 are attached is accurately fixed to predetermined positions of the tray carrier 110 and the wafer ring carrier 120 at the respective exchange positions. Next, each carrier moves to place the first chip 11 and the first recess 21 at a predetermined position for transfer.

  Next, as shown in FIG. 11, the pusher drive mechanism 31 raises the pusher 30 and protrudes the first chip 11 upward through the film.At the same time, the chuck drive mechanism 91 lowers the chuck 90 and the electromagnetic valve In operation, the chuck seat 92 communicates with a negative pressure source. The first chip 11 is adsorbed in the chuck seat 92 by this negative pressure. The chuck 90 that has attracted the first chip 11 is raised, horizontally moved, and lowered by the chuck drive mechanism 91 and moved above the first recess 21. When the movement is completed, the electromagnetic valve is activated, the chuck seat 92 communicates with the positive pressure source, and the first chip 11 adsorbed in the chuck seat 92 is transferred into the first recess 21. .

  When the transfer of the first chip is completed, the pusher 30 is lowered by the pusher drive mechanism 31, and the chuck 90 is returned to the initial position by the chuck drive mechanism 91. Further, the tray carrier 110 and the wafer ring carrier 120 are moved so that the center positions of the second recess 21 and the second chip 11 become predetermined positions. Thereafter, the chip 11 is transferred by repeating the same operation as described above.

  In the first to fourth embodiments described above, in order to accurately grasp the position of the chip on the wafer ring and accurately match the axial center position of the pusher 30, A position detection device 50 for detecting the position in the horizontal plane can be provided (see FIG. 7). As the position detection device 50, for example, a method combining a known CCD camera and an image processing device, or a method using a laser sensor or a photoelectric sensor can be adopted. By accurately grasping the position of the tip 11 on the wafer ring 10 in the horizontal plane, the wafer ring carrier 120 can be driven to accurately match the center position of the tip 11 with the axial center position of the pusher 30. 11 transfer defects can be prevented. Manual alignment using a jig can also be performed.

  Further, in order to ensure transfer of the chip 11, a chip guide 60 is further disposed above the rotary chuck when the rotary chuck is disposed above the recess of the tray and close to the lower part of the wafer ring. (See Fig. 12). The tip guide 60 is provided to make the transfer of the tip 11 smooth, and the inner size of the tip guide 60 is larger than the actual tip size but larger than the recess size. . In addition, a taper with a lower dimension from the upper side can be provided inside the tip guide 60.

  The chip transfer device and chip transfer method disclosed herein can be used for manufacturing a filter chip in which a filter film is deposited on a semiconductor or glass substrate on which a large-scale integrated circuit is formed. It is expected to contribute greatly to the improvement of quality and productivity.

FIG. 1 is a view showing a chip attached to a wafer ring film. FIG. 2 is a view showing a tray to which chips are transferred. FIG. 3 is a diagram showing a first embodiment of the present invention. FIG. 4 is a diagram showing an outline of the entire apparatus of the first embodiment of the present invention. FIG. 5 is a diagram showing a second embodiment of the present invention. FIG. 6 is a diagram showing an overview of the entire apparatus according to the second embodiment of the present invention. FIG. 7 is a diagram showing a third embodiment of the present invention. FIG. 8 is a diagram showing a chip delivery state on the wafer ring side according to the third embodiment of the present invention. FIG. 9 is a diagram showing a chip delivery state on the tray side according to the third embodiment of the present invention. FIG. 10 is a diagram showing a fourth embodiment of the present invention. FIG. 11 is a view showing a state in which the chip is sucked by the chuck according to the fourth embodiment of the present invention. FIG. 12 shows a state in which the chip guide is used when the chip is transferred on the wafer ring side and the chip is transferred on the tray side in the fourth embodiment of the present invention.

Explanation of symbols

10 Wafer ring 11 Chip 12 Film 20 Tray 21 Dimple 30 Pusher 31 Pusher drive mechanism 32 Protrusion 40 Rotating chuck 41 Chuck seat 50 Position detecting device 60 Chip guide 70 Suction head 90 Chuck 92 Chuck seat

Claims (11)

It consists of a wafer ring with a film with a plurality of chips attached, a pusher with protrusions on the bottom surface, and a tray with a plurality of depressions to hold the chips,
The pusher is positioned on the wafer ring such that the pusher, any one of the plurality of chips, and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Placed close to the top, and the tray is placed close to the bottom of the wafer ring,
A chip transfer device, wherein the pusher is moved downward to extrude a chip from the film side, and the chip is transferred into the recess. A wafer ring including a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, and a suction head;
The pusher is positioned on the wafer ring such that the pusher, any one of the plurality of chips, and any one of the plurality of depressions in the tray are aligned in a horizontal plane. Placed close to the top, the tray is placed close to the bottom of the wafer ring, and the suction head is placed below the well;
A chip transfer apparatus, wherein the pusher is moved downward to project a chip from the film side, and the chip is sucked by the suction head and transferred into the recess. A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. A rotating chuck having a chuck seat to support,
The pusher is arranged so that the position of any one of the plurality of chips, the chuck, and the plurality of depressions of the tray in the horizontal plane is aligned. Positioned close to the top of the wafer ring, the rotating chuck is positioned close to the bottom of the wafer ring, and the tray is positioned below the rotating chuck,
The pusher is moved downward to project the chip from the film side, and the rotary chuck sucks and holds the chip by negative pressure, and after 180 ° rotation, transfers the chip into the recess by positive pressure. A chip transfer device characterized by the above. A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. A chuck having a chuck seat to support,
The pusher is disposed below the wafer ring and the chuck is disposed above the wafer ring so that the positions of the pusher and any one of the plurality of chips in a horizontal plane are aligned. Furthermore, the tray is arranged on the side of the wafer ring,
The pusher is moved upward to project the chip from the film side, and after the chuck approaches the chip, the chip is sucked and held by negative pressure, and further moved toward the upper part of the recess and then moved to the chip by positive pressure. A chip transfer device, wherein the chip is transferred into the recess.   5. The chip transfer device according to claim 1, further comprising a position detection device for detecting a position of the chip on the wafer ring in a horizontal plane. .   5. The chip transfer device according to claim 1, wherein a chip guide is further disposed above the recess of the tray.   4. The chip transfer device according to claim 3, wherein a chip guide is further provided above the recess of the tray and above the rotary chuck when the rotary chuck is disposed close to the lower part of the wafer ring. A chip transfer device characterized by being arranged. Using a wafer ring with a film with a plurality of chips attached, a pusher with protrusions on the lower end, and a tray with a plurality of depressions to hold the chips,
(1) The pusher, any one of the plurality of chips, and any one of the plurality of depressions of the tray are aligned in a horizontal plane, and the pusher is moved to the wafer. Placing close to the top of the ring and further placing the tray close to the bottom of the wafer ring;
(2) moving the pusher downward to extrude the chip from the film side and transferring the chip into the recess;
A chip transfer method comprising the steps of: Using a wafer ring provided with a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, and a suction head,
(1) The pusher is placed above the wafer ring so that any one of the plurality of chips and any one of the plurality of depressions in the tray are aligned. Placing the tray in proximity to the wafer ring and placing the suction head in proximity to the bottom of the tray; and
(2) moving the pusher downward to project the chip from the film side, and sucking the chip by the suction head and transferring it into the recess;
A chip transfer method comprising the steps of: A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. Use a rotating chuck with a chuck seat to support,
(1) The pusher, any one of the plurality of chips, the chuck, and any one of the plurality of depressions of the tray are aligned with each other in a horizontal plane. Disposing a pusher proximate above the wafer ring, disposing the rotating chuck proximate to the bottom of the wafer ring, and disposing the tray below the rotating chuck;
(2) moving the pusher downward to project the chip from the film side, and the rotary chuck sucks and holds the chip with negative pressure; and
(3) transferring the chip into the recess by positive pressure after the rotary chuck has rotated 180 °;
A chip transfer method comprising the steps of: A wafer ring having a film with a plurality of chips attached thereto, a pusher, a tray provided with a plurality of depressions for holding the chips, a negative pressure source and a positive pressure source, and a peripheral portion of the chips only. Use a chuck with a chuck seat to support,
(1) The pusher is disposed below the wafer ring so that any one of the pusher and the plurality of chips is aligned in a horizontal plane, and the chuck is disposed above the wafer ring. Placing and further placing the tray to the side of the wafer ring;
(2) moving the pusher upward to protrude the chip from the film side, and sucking and holding the chip with negative pressure after the chuck approaches the chip; and
(3) After moving the chuck upward and close to the recess, transferring the chip into the recess by positive pressure;
A chip transfer method comprising the steps of:

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