JP2005274404A - Wiring pattern inspection device and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent imaging of a work by some imaging means from becoming a hindrance to imaging of the work by another imaging means, in a device for imaging the work by the plurality of imaging means. <P>SOLUTION: This wiring pattern inspection device is equipped with a driving roller 50 for conveying carrier films 10 at a prescribed pitch when an operation command is issued, and conveying the prescribed number of substrates 12 to inspection tables 60, 62; a plurality of imaging cameras 114, 124 for imaging each substrate conveyed to the inspection table from one surface side or both surface sides of the carrier film respectively; an image processing/driving control part 115 for determining whether imaging of the surface of each corresponding substrate by each imaging camera is finished or not; and an integrated control part 202 for issuing an operation command to the driving roller when determined that imaging of the surface of each corresponding substrate by each imaging camera is finished, and determining existence of a defect of each wiring pattern based on imaged data by each imaging camera. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring pattern inspection apparatus and inspection method for inspecting defects in a wiring pattern formed in a semiconductor package or the like arranged at a predetermined pitch on a carrier film.

  In general, wiring patterns formed on semiconductor packages used to reduce the size and weight of electrical equipment are obtained by laminating a copper foil on a tape-like polyimide film with an adhesive, and using a subtractive or semi-additive method. After patterning, the pattern has a thickness of 5 to 15 μm and a width of about 10 μm at the most integrated part. In this patterning process, serious defects such as thinning (chips), disconnection, short circuit, and thickening (projections) of the wiring pattern occur. Conventionally, the presence or absence of these defects is determined by open / short continuity inspection or visual inspection.

  However, since the visual inspection requires skill, the inspection results vary depending on the physical condition of the inspector. In recent years, the wiring pattern has been increasingly miniaturized, and accordingly, the reliability of such visual inspection cannot be denied. In particular, in a multilayer wiring board as applied to the semiconductor package, it is almost impossible to visually inspect various defects existing in a wiring pattern having a minimum width of 10 μm.

  Thus, recently, various wiring pattern inspection apparatuses that automatically inspect for defects using a camera have been proposed (for example, Patent Documents 1 to 3). In such an apparatus, for example, in order to detect a defect of 1/3 or more within a width of 10 μm, an imaging resolution of 1 μm must be realized.

  That is, such a wiring pattern is generally formed on one side or both sides of a carrier film. Thus, in order to inspect the wiring pattern formed on the carrier film in a short time using a conventional wiring pattern inspection apparatus, it is necessary to inspect continuously while conveying the carrier film in the longitudinal direction. .

  Since the carrier film is generally as thick as 50 μm or more, conveyance guide holes called sprocket holes are provided on both end sides. And using this sprocket hole, the workpiece to be inspected is stably conveyed and set in the inspection area. Then, in this inspection area, an image of the work surface is picked up while scanning the surface of the work using a camera such as a CCD as image pickup means.

  When the imaging of the workpiece is completed, the carrier film is conveyed in the longitudinal direction using a sprocket, and the next workpiece is set in the inspection area. Also in this inspection area, an image of the workpiece surface is taken while scanning the workpiece surface using a camera.

  By repeating this process, images of all workpieces are obtained, and these images are compared with a master image (defect-free image) using image processing or the like to determine the presence or absence of defects. is there.

In order to further shorten the inspection time and further improve the inspection efficiency, for example, Patent Document 1 discloses an apparatus including a plurality of cameras. Further, Patent Document 2 discloses an apparatus including a plurality of cameras for imaging the front and back surfaces of a carrier film.
JP 2000-249662 A JP-A-8-145913 JP 2000-106480 A

  However, such a conventional wiring pattern inspection apparatus has the following problems.

  That is, by using a plurality of cameras, a plurality of workpieces can be imaged in parallel, so that the inspection time can surely be shortened. However, there remains room for further improvement in inspection efficiency for the following reasons.

  That is, as shown in FIG. 14, the imaging of the workpiece is performed while performing so-called line sensing in which the camera is scanned on the workpiece 10 along a substantially S-shaped line. In the case of a wiring pattern inspection apparatus provided with a plurality of cameras, even if scanning by each camera is started at the same time, there is a slight difference in time until scanning is completed due to the difference in scanning drive performance of each camera.

  When each camera completes the imaging of a certain workpiece, it conveys the carrier film along the longitudinal direction and sets it in the inspection area in order to image the next workpiece. However, at that time, if another camera is in the middle of imaging, there is a problem that the workpiece moves and imaging cannot be performed correctly.

  Also, if there is a sprocket hole, transportation is easy, but since the film thickness is too thin, sprocket holes cannot be formed, so transportation and positioning are difficult, and if stable positioning is not possible, it will have a significant effect on imaging and inspection. .

  The present invention has been made in view of such circumstances, and a first object of the present invention is to capture an image of a workpiece by a plurality of imaging means, in which an image of the workpiece is captured by another imaging means. An object of the present invention is to provide a wiring pattern inspection apparatus and an inspection method that do not interfere with imaging of a workpiece.

  The second object of the present invention is to capture an image of a workpiece by a plurality of imaging means, and when imaging of a workpiece by a certain imaging means is completed, even if imaging of the workpiece by another imaging means is in progress, The operation rate of each imaging means is increased by enabling the transition to the imaging of the next workpiece without interfering with the imaging of the workpiece by other imaging means, thereby shortening the time required for the inspection of the entire carrier film. An object of the present invention is to provide a wiring pattern inspection apparatus and an inspection method that can be used.

  In order to achieve the above object, the present invention takes the following measures.

  That is, in order to achieve the first object, the invention of claim 1 optically inspects each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film. In the wiring pattern inspection apparatus, when there is an operation command, a predetermined number of substrates arranged on the carrier film are transferred to a predetermined inspection area by transferring the carrier film at a predetermined pitch along the longitudinal direction. Conveying means, a plurality of imaging means for imaging each of a predetermined number of substrates conveyed to the inspection area by the conveying means from one side or both sides of the carrier film, and each imaging means, The imaging completion determination means for determining whether or not the imaging of the surface has been completed and the imaging completion determination means allow all of the imaging means to When it is determined that the imaging has been completed, a control unit that commands the conveyance unit to operate, and a defect presence / absence determination unit that determines the presence / absence of a defect in each wiring pattern based on imaging data from each imaging unit are provided. .

  Therefore, in the wiring pattern inspection apparatus according to the first aspect of the present invention, by taking the above-described means, in an apparatus for imaging a substrate by a plurality of imaging means, the imaging of the substrate by a certain imaging means is performed with another imaging. This can be done without interfering with imaging by the means.

  In order to achieve the second object, the invention according to claim 2 is a wiring pattern for optically inspecting each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film. The inspection apparatus includes a plurality of imaging units, buffer means, and defect presence / absence determination means. Each imaging unit, when there is an operation command, transport means for transporting the substrate disposed on the carrier film to a predetermined inspection area by transporting the carrier film at a predetermined pitch along the longitudinal direction. An imaging means for imaging the substrate transported to the inspection area by the transport means from a predetermined surface side of the carrier film; and a control means for instructing the transport means to operate when the predetermined surface of the substrate is imaged by the imaging means; It has. The buffer means is provided between the image pickup units, and is capable of holding a length that is a part of the carrier film and that can arrange one or more substrates. When the transport means of the unit operates, the carrier film transported by the transport means is received while holding the already held carrier film, and the transport means of the imaging unit downstream in the transport direction operates. Does not pull the carrier film from the imaging unit on the upstream side in the transport direction, so that the already held carrier film is transported to the imaging unit on the downstream side in the transport direction. The defect presence / absence determining means determines the presence / absence of a defect in each wiring pattern based on the image data obtained by each imaging means.

  Therefore, in the wiring pattern inspection apparatus according to the second aspect of the present invention, by providing the buffer means as described above, when the imaging of the substrate by a certain imaging means is completed, the imaging of the substrate by another imaging means is in progress. Even if it exists, it can transfer to the imaging of the next board | substrate, without interfering with the imaging by another imaging means. As a result, it is possible to increase the operating rate of each imaging means, and thereby shorten the time required for the inspection of the entire carrier film.

  In order to achieve the second object, the invention according to claim 3 is a wiring pattern for optically inspecting each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film. The inspection apparatus includes two imaging units, a buffer unit, and a defect presence / absence determination unit. When there is an operation command, each imaging unit transports a predetermined number of substrates arranged on the carrier film to a predetermined inspection area by transporting the carrier film at a predetermined pitch along the longitudinal direction. A plurality of imaging means for imaging each of a predetermined number of substrates conveyed by the conveying means to the inspection area from the arbitrary surface side of the carrier film, and imaging of the surface of the substrate corresponding to each imaging means When the imaging completion determination unit and the imaging completion determination unit determine that all of the imaging units have completed imaging of the corresponding substrate surface, the transfer unit Control means for commanding operation. The buffer means is provided between the image pickup units, and is capable of holding a length that is a part of the carrier film and that can arrange one or more substrates. When the transport means of the unit operates, the carrier film that is pitch transported by this transport means is received while holding the already held carrier film, and the transport means of the imaging unit downstream in the transport direction operates. In this case, the carrier film already held is transported to the imaging unit downstream in the transport direction without pulling the carrier film from the imaging unit upstream in the transport direction. The defect presence / absence determining means determines the presence / absence of a defect in each wiring pattern based on the image data obtained by each imaging means. Then, the imaging unit of one imaging unit images the front side of the substrate, and the imaging unit of the other imaging unit images the back side of the substrate.

  Therefore, in the wiring pattern inspection apparatus according to the third aspect of the present invention, by providing the buffer means as described above, when imaging by the imaging unit for imaging one surface of the predetermined number of substrates is completed, a predetermined number of Even when imaging by the imaging unit that images the other surface of the substrate is in progress, it is possible to shift to imaging of the next predetermined number of substrates without interfering with imaging by other imaging units. As a result, it is possible to increase the operating rate of each image pickup unit, thereby shortening the time required for the inspection of the entire carrier film.

  According to a fourth aspect of the present invention, in order to achieve the second object, in the wiring pattern inspection apparatus according to the third aspect of the present invention, the carrier film that has been pitch transported from the imaging unit upstream in the transport direction is folded back. The carrier film is conveyed to the imaging unit on the downstream side in the conveyance direction, so that the imaging means of the two imaging units are respectively in the same imaging direction from the front side and the back side of the carrier film, respectively. Is provided with a folding means that can take an image of

  Accordingly, in the wiring pattern inspection apparatus according to the fourth aspect of the present invention, as described above, the imaging directions of the imaging means of both imaging units can be made the same, so that they can be efficiently arranged.

  According to a fifth aspect of the present invention, in order to achieve the second object, in the wiring pattern inspection apparatus according to the third aspect of the present invention, the carrier film that has been pitch transported from the imaging unit upstream in the transport direction is folded back. The carrier film is conveyed to the imaging unit on the downstream side in the conveyance direction, so that the imaging means of the two imaging units are in the imaging directions so as to be opposite to each other, and the front side and the back side of the carrier film, respectively. Folding means is provided so that imaging can be performed from the side.

  Therefore, in the wiring pattern inspection apparatus according to the fifth aspect of the invention, by taking the above-described means, the image pickup directions of the image pickup means of both image pickup units can be reversed. Is possible.

  According to a sixth aspect of the present invention, in order to achieve the first or second object, in the wiring pattern inspection apparatus according to any one of the first to fifth aspects of the present invention, it is determined that there is a defect by the defect presence / absence determining means. A magnifying observation means for magnifying and observing a defective portion of the wiring pattern, and a punching means for making a punch hole in the substrate corresponding to the wiring pattern determined to be defective by the defect presence / absence determining means, or a mark for attaching a predetermined mark Any one of the provision means is provided.

  Therefore, in the wiring pattern inspection apparatus according to the sixth aspect of the present invention, by taking the above-described means, the punched holes are formed so that the wiring pattern determined to have a defect can be enlarged and observed or can be distinguished from the other. Can be opened or marked.

  According to a seventh aspect of the present invention, in order to achieve the first or second object, in the wiring pattern inspection apparatus according to any one of the first to sixth aspects, the defect presence / absence determining means determines that there is a defect. The identification information and the positional information are preliminarily attached to the substrate corresponding to the printed wiring pattern, the defect data collecting means for storing the positional information of the defective part on the substrate in the storage medium, and the identification information and the positional information from the storage medium via the communication network. Based on the acquired identification information and position information, magnified observation means for magnifying and observing the defect location, and the identification information is acquired from the storage medium via the communication network, and the defect location is determined based on the acquired identification information. Either a punching means for making a punch hole in an existing substrate or a mark providing means for giving a predetermined mark is provided.

  Therefore, in the wiring pattern inspection apparatus of the invention of claim 7, by taking the above-described means, only the functions necessary for the inspection can be integrated, and other functions can be remotely arranged. It becomes possible to reduce the size.

  According to an eighth aspect of the present invention, in order to achieve the first or second object, the wiring pattern inspection apparatus according to any one of the first to third aspects is used to detect a defect in a wiring pattern. This is a wiring pattern inspection method for determining the presence or absence.

  According to the present invention, in an apparatus that images a workpiece by a plurality of imaging units, the wiring pattern inspection apparatus and the inspection method in which imaging of a workpiece by a certain imaging unit does not interfere with imaging of the workpiece by another imaging unit. Can be realized.

  In addition, in an apparatus for imaging a workpiece by a plurality of imaging units, when imaging of a workpiece by a certain imaging unit is completed, even if the imaging of the workpiece by another imaging unit is in progress, By making it possible to shift to imaging of the next workpiece without interfering with imaging, the operation rate of each imaging means can be increased. Thereby, the wiring pattern inspection apparatus and inspection method which can shorten the time required for the inspection of the whole carrier film are realizable.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
A first embodiment of the present invention will be described.

  FIG. 1 is a system configuration diagram showing an example of a wiring pattern inspection apparatus to which the wiring pattern inspection method according to the first embodiment is applied.

  FIG. 2 is a plan view showing an example of a substrate disposed on the carrier film.

  That is, the wiring pattern inspection apparatus according to the present embodiment is formed on each of a plurality of substrates 12 such as a multilayer wiring substrate for a semiconductor package, which is arranged at a predetermined interval along the longitudinal direction of the workpiece 10 such as a carrier film. A wiring pattern inspection apparatus for optically inspecting a wiring pattern, including a workpiece unwinding unit 100, an inspection unit 110, an inspection unit 120, a review / punch unit 130, a workpiece winding unit 140, and a control unit 200. And buffer units 160, 170, 180, 190.

  The workpiece unwinding unit 100 includes a workpiece reel 101 on which the workpiece 10 is wound. The work reel 101 is set at the lower stage, and the wound work 10 is sent out to the buffer unit 160 via the guide roller 102 by the rotation of the reel shaft 101a.

  In the work unwinding unit 100, the spacer tape reel 103 is set on the upper stage of the work reel 101. The spacer tape reel 103 winds up the protective spacer tape 14 wound around the work reel 101 together with the work 10 by the rotation of the reel shaft 103a.

  The buffer unit 160 includes a dancer roller 161, and the work 10 is sent to the inspection unit 110 side after passing through the lower half circumference so as to hold the dancer roller 161. Since the dancer roller 161 is configured to be freely movable in the vertical direction, when the workpiece 10 is conveyed from the workpiece unwinding unit 100 to the buffer unit 160 having such a configuration, the position of the dancer roller 161 is lowered. On the contrary, when the workpiece 10 is conveyed to the inspection unit 110 side, the position of the dancer roller 161 is increased.

  Further, the buffer unit 160 includes an upper / lower limit sensor 162. The upper / lower limit sensor 162 detects the position of the dancer roller 161 in the vertical direction, and transmits the detection result to the integrated control unit 202 of the control unit 200. As a result, the integrated control unit 202 grasps the position of the dancer roller 161 in the buffer unit 160, indirectly grasps the state of the work 10, and the vertical position of the dancer roller 161 indicates a predetermined upper limit value or lower limit value. The workpiece unwinding unit 100 and the inspection unit 110 are controlled so as not to exceed the values.

  Each unit 110, 120, 130 includes a pair of tape transport drive rollers 50 as transport means for transporting the workpiece 10. The pair of tape transport drive rollers 50 (for example, tape transport drive rollers 50a and 50b) transport the workpiece 10 at a predetermined pitch with high accuracy and stability when an operation instruction is issued from the integrated control unit 202. . Various conditions such as the size of the workpiece 10 or the substrate 12 to be inspected and the predetermined pitch to be conveyed are set in the integrated control unit 202 in advance via the input device 201 of the control unit 200.

  The workpiece 10 in the buffer unit 160 is thus transported at a predetermined pitch by the tape transport drive rollers 50a and 50b of the inspection unit 110, whereby the substrate 12 to be inspected is placed on the inspection table 60. I am doing so. The inspection unit 110 inspects the odd-numbered substrates 12 arranged on the carrier film, and the inspection unit 120 inspects the even-numbered substrates 12. Accordingly, odd-numbered substrates 12 are arranged on the inspection table 60.

  Each unit 110, 120, and 130 includes an alignment mark reading camera 117, 127, and 137, respectively. When the odd-numbered substrates 12 are arranged on the inspection table 60, the alignment mark reading camera 117 is located at the center of the work 10 (exposure batch center) and at both ends of the work 10 as shown in FIG. The alignment mark 15 is recognized by reflection optics, and a correction amount of XYθ with respect to a preset reference position is obtained for both alignment marks 15. A supplementary description will be given below of the reflective optical recognition of the alignment mark and the calculation method of the correction amount of XYθ.

  FIG. 3 is an enlarged view of the alignment mark 15 shown in FIG. That is, each alignment mark 15 is provided with a light-reflective circular mark 15a and a mark 15b which is a circular hole in a rectangle. When light is irradiated to the alignment mark 15 from the front side, the light traveling state is as shown in FIG. 4 is a cross-sectional view of the alignment mark 15 shown in FIG. 3 as viewed from the thickness direction. The vertical direction in FIG. 4 corresponds to the paper surface direction in FIG. The alignment mark reading camera 117 irradiates the alignment mark 15 with light. Then, as shown in FIG. 4, the light reaching the mark 15b becomes transmitted light T and is transmitted to the opposite side, while the light reaching the mark 15a is reflected by the mark 15a and reflected light R and Then, the camera returns to the alignment mark reading camera 117 side. The alignment mark reading camera 117 images the reflected light R and outputs the imaging result to the image processing unit 203 that is a part of the control unit 200. The image processing unit 203 grasps the traveling direction of the reflected light R based on the imaging result. Then, from this traveling direction, as shown in FIG. 5, the deviations X ′, Y ′, θ of the substrate 12 arranged on the inspection table 60 are grasped, and correction amounts ΔX (= X′−X), ΔY (= Y′−Y) and θ are obtained, and the results are output to the integrated control unit 202.

  Thereafter, the suction plate 118 whose suction force increases from the center of the exposure batch toward the outside performs suction on the inspection table 60 of the workpiece 10 and also clamps 119 for reducing the influence of warping of the end of the workpiece 10. Descends to fix the workpiece 10. Adsorption is preferably 5 or more pipes. Further, it is desirable that the pressing pressure can be varied according to the thickness of the workpiece 10.

  Each unit 110, 120, 130 includes CCD cameras 111, 121, 131, imaging cameras 114, 124, 134, image processing / drive control units 115, 125, 135, stage controllers 116, 126, 136, and sensors. / Adsorption / clamp / lighting control units 113, 123, 133 and sequencers 112, 122, 132 are provided.

  The image processing / drive control units 115, 125, and 135 control drive on the XY planes of the CCD cameras 111, 121, and 131 and the imaging cameras 114, 124, and 134, image processing and integration of image data captured by these cameras. Necessary data is exchanged with the control unit 202. Stage controllers 116, 126, and 136 perform drive control of drive stage axes in these cameras.

  The sequencers 112, 122, and 132 perform overall control such as various sensors, suction clamps, and lighting.

  Sensors / adsorption / clamp / lighting control units 113, 123, 133 include sensor functions necessary for stable operation, functions for controlling the adsorption functions of the adsorption plates 118, 128, 138, and clamps 119, 129, 139. A function to control and a function to adjust the illumination intensity on the inspection table 60, 62, 64 side are provided.

  In the inspection unit 110, when the workpiece 10 is fixed to the inspection table 60, the CCD camera 111 manages the management code 16 (for example, managing identification information of the workpiece 10) formed at a predetermined position on the workpiece 10 as shown in FIG. And the read management code information is transmitted to the integrated control unit 202 via the image processing / drive control unit 115.

  Then, the integrated control unit 202 outputs correction amounts ΔX, ΔY, θ to the image processing / drive control unit 115. The image processing / drive control unit 115 calculates an imaging start position according to the correction amount, and moves the imaging camera 114 to the imaging start position. Then, as shown in FIG. 14, the wiring pattern formed on the substrate 12 is imaged by scanning (line sensing) along the surface of the workpiece 10 so as to draw an S-shape, and the captured image data is imaged. The data is output to the processing / drive control unit 115.

  When the image processing / drive control unit 115 receives the image data, the wiring pattern data obtained by extracting the characteristics of the wiring pattern from the wiring pattern formed on the substrate 12 based on the image data; Comparison processing with normal design wiring pattern data stored in advance in a memory (not shown) is performed to determine whether the wiring pattern is good or bad. When the image processing / drive control unit 115 receives the image data, the image processing / drive control unit 115 determines that the imaging by the imaging camera 114 is completed. Then, the suction function of the suction plate 118 is released via the sensors / suction / clamp / lighting control unit 113, and the suppression function by the clamp 119 is released. Further, the pass / fail determination result and the imaging completion signal are output to the integrated control unit 202.

  When the integrated control unit 202 acquires the pass / fail determination result and the imaging completion signal in this manner, the integrated control unit 202 sends an operation instruction to the tape transport drive rollers 50a and 50b based on the imaging completion signal. As a result, the tape transport driving rollers 50a and 50b are driven, the next odd-numbered substrate 12 is transported from the buffer unit 160 side, placed on the inspection table 60, and the work 10 that has been inspected is moved to the buffer unit 170 side. And carry. The substrate 12 placed on the inspection table 60 in this way is also transported to the buffer unit 170 side after the presence or absence of a defect is determined by the same procedure as described above.

  The buffer unit 170 has the same configuration as the buffer unit 160. The dancer roller 171 loosens the carrier film to a position lower than the inspection tables 60 and 62 so that the workpiece 10 including the plurality of substrates 12 is secured in advance on the downstream side of the inspection unit 110. Then, the inspection unit 120 takes in the even-numbered substrates 12 from the buffer unit 170 side by driving the tape transport driving rollers 50 c and 50 d and places them on the inspection table 62. Then, the inspection unit 120 also operates in the same manner as the inspection unit 110 to inspect the substrate 12 for defects, and after completion of the inspection, it is transported to the buffer unit 180 side.

  Therefore, by providing such a buffer unit 170, when the tape transport drive rollers 50a and 50b of the inspection unit 110 are operated, the work 10 that is transported by this is retained. It can be received without forcibly sending it to the inspection unit 120 side. Further, when the tape transport driving rollers 50c and 50d of the inspection unit 120 are operated, the even-numbered substrates 12 are already inspected from the work 10 already held without pulling the work 10 from the inspection unit 110 side. The inspection unit 110 and the inspection unit 120 are capable of independently inspecting the substrate 12 for defects.

  Similarly to the buffer unit 160, the buffer unit 170 also includes an upper / lower limit sensor 172. The upper / lower limit sensor 172 detects the position of the dancer roller 171 in the vertical direction and transmits the detection result to the integrated control unit 202. To do. Thereby, the integrated control unit 202 grasps the position of the dancer roller 171 in the buffer unit 170, indirectly grasps the state of the workpiece 10, and the vertical position of the dancer roller 171 indicates a predetermined upper limit value or lower limit value. The inspection unit 110 and the inspection unit 120 are controlled so as not to exceed the values.

  When the inspection by the inspection unit 120 is completed, the substrate 12 placed on the inspection table 62 is also transported to the buffer unit 180 side after the presence or absence of a defect is determined by the same procedure as described above. .

  As a result, only the inspected substrate 12 is held in the buffer unit 180. The buffer unit 180 also includes a dancer roller 181 and an upper / lower limit sensor 182, and has the same configuration as the buffer units 160 and 170. When the tape transport driving rollers 50c and 50d of the inspection unit 120 are operated, the work 10 transported by this is forcibly sent to the inspection unit 130 side while the work 10 already held is held. You can receive without. In addition, when the tape transport drive rollers 50e and 50f of the review / punch unit 130 are operated, the substrate 12 is removed from the workpiece 10 already held without forcibly pulling the workpiece 10 from the inspection unit 120 side. Since they are sequentially conveyed to the review / punch unit 130, the defect inspection by the inspection unit 120 and the operation by the review / punch unit 130 can be performed independently of each other.

  In the review / punch unit 130, the image processing / drive control unit 135 receives the quality determination result output from the integrated control unit 202. Then, by driving the tape transport drive rollers 50e and 50f based on the pass / fail determination result, the substrate 12 determined to have a defect is placed on the inspection table 64. The method of fixing the placed substrate 12 on the inspection table 64 and the position correction method are the same as those of the inspection units 110 and 120. Then, the management code 16 placed on the inspection table 64 is read by the CCD camera 131, and it is confirmed that the placed substrate 12 is determined to be defective.

  When the substrate 12 that is not determined to be defective is erroneously placed, the work 10 is transported to the buffer unit 190 side by driving the tape transport driving rollers 50e and 50f.

  When it is confirmed that an object determined to have a defect has been placed on the inspection table 64, the imaging camera 134 enables the defect portion to be enlarged and observed. Thereafter, the defective substrate 12 is released from the inspection table 64 and conveyed to the punching jig 63 by the tape conveying drive rollers 50e and 50f.

  The punching jig 63 performs punching (drilling) on the substrate 12 with defects thus transported. The punched substrate 12 is again conveyed to the buffer unit 190 side by the tape conveying drive rollers 50e and 50f. Note that a marking means (not shown) may be provided instead of the punch jig 63, and the marking means may be used to mark the substrate 12 as a defect.

  Note that, as described above, not only punching or marking of the defective substrate 12 but also the entire number of the substrates 12 supplied from the buffer unit 180 side is imaged by the imaging camera 134 and the image processing / drive control unit 135 is performed. It is also possible to confirm the excessive quality level of the wiring pattern. This confirmation result is output from the image processing / drive control unit 135 to the integrated control unit 202.

  Further, the review / punch unit 130 may be provided with a length measuring function for an arbitrary part such as a wiring pattern or a defective part. As a result, regular information on the pattern width of one reel can be grasped, and this contributes to immediate feedback into the process.

  After the processing in the review / punch unit 130 is completed, the work 10 is transported to the work take-up unit 140 via the buffer unit 190 by the tape transport drive rollers 50e and 50f. The buffer unit 190 includes a dancer roller 191 and an upper / lower limit sensor 192, and has the same configuration as the buffer units 160, 170, and 180.

  The work winding unit 140 includes a spacer tape reel 142 on the upper stage and a work reel 141 on the lower stage. The work reel 141 takes up the work 10 by rotating the reel shaft 141a. At this time, the work 10 is wound around the work reel 141 together with the protective spacer tape 14 supplied from the spacer tape reel 142. The state information of the workpiece 10 in the workpiece winding unit 140 is transmitted to the integrated control unit.

  The control unit 200 includes a display device 204 and an output device 205 in addition to the input device 201, the integrated control unit 202, and the image processing unit 203. The display device 204 displays the operating state and information held by the integrated control unit 202. Further, the output device 205 appropriately outputs the information held by the integrated control unit 202 in response to an output request made through the input device 201.

  Next, the operation of the wiring pattern inspection apparatus to which the wiring pattern inspection method according to this embodiment configured as described above is applied will be described with reference to the flowcharts of FIGS.

  First, the work 10 is fed from the work reel 101 on which the work 10 is wound up to the buffer unit 160 through the guide roller 102 by the rotation of the reel shaft 101a (S1). At this time, the protective spacer tape 14 wound around the work reel 101 together with the work 10 is wound around the spacer tape reel 103 by the rotation of the reel shaft 103a. The work 10 is sent to the inspection unit 110 side after passing through the lower half circumference so as to hold the dancer roller 161.

  Since the dancer roller 161 is configured to be freely movable in the vertical direction, when the work 10 is conveyed, the position of the dancer roller 161 is lowered. On the contrary, when the workpiece 10 is conveyed to the inspection unit 110 side, the position of the dancer roller 161 is increased. However, the upper and lower limit sensor 162 is provided in the buffer unit 160, and the upper and lower limit sensor 162 detects the position of the dancer roller 161 in the vertical direction, and the detection result is transmitted to the integrated control unit 202 of the control unit 200. . Accordingly, the integrated control unit 202 grasps the position of the dancer roller 161 in the buffer unit 160, grasps the state of the workpiece 10, and the vertical position of the dancer roller 161 has a predetermined upper limit value or lower limit value. The workpiece unwinding unit 100 and the inspection unit 110 are controlled so as not to exceed (S2).

  The workpiece 10 in the buffer unit 160 is pitch-transported to the inspection unit 110 by operating the pair of tape transport drive rollers 50a and 50b in accordance with an operation instruction from the integrated control unit 202 (S3). On the inspection table 60, the odd-numbered substrates 12 arranged on the carrier film are arranged (S4).

  When the odd-numbered substrates 12 are arranged on the inspection table 60, the alignment mark reading camera 117 causes both the workpieces 10 located at the center of the workpiece 10 (exposure batch center) and at both ends of the workpiece 10 as shown in FIG. The alignment mark 15 is recognized by reflection optics (S5).

  Based on the recognition result, the image processing unit 203 obtains the correction amount of XYθ with respect to the reference position set in advance for both alignment marks 15 and outputs the result to the integrated control unit 202 (S6). .

  Thereafter, the suction plate 118, whose suction force increases from the center of the exposure batch toward the outside, suctions the work 10 to the inspection table 60, and clamps to reduce the influence of warping of the end of the work 10 119 descends and the workpiece 10 is fixed (S7).

  When the workpiece 10 is fixed to the inspection table 60 in this way, the management code 16 formed at a predetermined position on the workpiece 10 is read by the CCD camera 111 as shown in FIG. Then, it is transmitted to the integrated control unit 202 via the image processing / drive control unit 115 (S8).

  Then, the correction amounts ΔX, ΔY, θ are output from the integrated control unit 202 to the image processing / drive control unit 115. The image processing / drive control unit 115 calculates the imaging start position according to the correction amount, and moves the imaging camera 114 to the imaging start position (S9).

  Then, as shown in FIG. 14, scanning (line sensing) is started so as to draw an S shape along the surface of the workpiece 10. As a result, the wiring pattern formed on the substrate 12 is imaged (S10). The captured image data is output to the image processing / drive control unit 115.

  In the image processing / drive control unit 115, wiring pattern data obtained by extracting the characteristics of the wiring pattern formed on the substrate 12 based on the image data, and a memory (not shown) are stored in advance. Comparison processing with normal design wiring pattern data is performed, and the quality of the wiring pattern is determined (S12).

  Further, when receiving this image data, the image processing / drive control unit 115 determines that the imaging by the imaging camera 114 has been completed. Then, the suction function of the suction plate 118 is released by the sensors / suction / clamp / lighting control unit 113, and the suppression function by the clamp 119 is also released. Then, the pass / fail determination result and the imaging completion signal are output to the integrated control unit 202 (S13).

  On the other hand, the integrated control unit 202 sends an operation instruction to the tape transport drive rollers 50a and 50b based on the imaging completion signal (S14). As a result, the tape transport driving rollers 50a and 50b are driven, the next odd-numbered substrate 12 is transported from the buffer unit 160 side, placed on the inspection table 60, and the work 10 that has been inspected is moved to the buffer unit 170 side. (S15).

  The substrate 12 thus placed on the inspection table 60 is also transported to the buffer unit 170 side after the presence / absence of a defect is determined by the same procedure as in steps S5 to S15.

  Since the buffer unit 170 is configured in the same manner as the buffer unit 160, the integrated control unit 202 grasps the position of the dancer roller 171 in the buffer unit 170, grasps the state of the workpiece 10, and moves the dancer roller 171 up and down. The inspection unit 110 and the inspection unit 120 are controlled so that the direction position does not exceed a predetermined upper limit value or lower limit value (S16).

  In such a buffer unit 170, the carrier film is slackened to a position lower than the inspection tables 60 and 62, whereby the workpiece 10 including the plurality of substrates 12 is secured in advance on the downstream side of the inspection unit 110.

  Therefore, by providing such a buffer unit 170, when the tape transport drive rollers 50a and 50b of the inspection unit 110 are operated, the work 10 that is transported by this is retained. It can be received without being sent to the inspection unit 120 side. Further, when the tape transport driving rollers 50c and 50d of the inspection unit 120 are operated, the even-numbered substrates 12 are already inspected from the work 10 already held without pulling the work 10 from the inspection unit 110 side. It is conveyed to 120. In this way, the inspection unit 110 and the inspection unit 120 independently perform defect inspection on the substrate 12.

  Then, when the inspection unit 120 drives the tape transport driving rollers 50c and 50d, the even-numbered substrates 12 are taken from the buffer unit 170 side and placed on the inspection table 62 (S17). The inspection unit 120 is also transported to the buffer unit 180 side after the presence / absence of a defect is determined by the same procedure as in steps S5 to S15 (S18).

  As a result, only the inspected substrate 12 is held in the buffer unit 180. Since the buffer unit 180 is also configured in the same manner as the buffer unit 160, the integrated control unit 202 grasps the position of the dancer roller 181 in the buffer unit 180, grasps the state of the workpiece 10, and determines the state of the dancer roller 181. The inspection unit 120 and the review / punch unit 130 are controlled so that the vertical position does not exceed a predetermined upper limit value or lower limit value (S19).

  Further, when the tape transport driving rollers 50c and 50d of the inspection unit 120 are operated, the work 10 transported thereby is forcibly sent to the inspection unit 120 side while holding the work 10 already held. Can be received without. Further, when the tape transport drive rollers 50e and 50f of the review / punch unit 130 are operated, the substrate 12 is sequentially moved from the workpiece 10 already held without being pulled from the inspection unit 120 side. It is conveyed to the review / punch unit 130. Thus, the defect inspection by the inspection unit 120 and the operation by the review / punch unit 130 are performed independently.

  The image processing / drive control unit 135 of the review / punch unit 130 receives the pass / fail determination result output from the integrated control unit 202 (S20). Then, the tape transport drive rollers 50e and 50f are driven based on the pass / fail determination result, and the substrate 12 determined to have a defect is placed on the inspection table 64 (S21). The method of fixing the placed substrate 12 on the inspection table 64 and the position correction method are the same as those of the inspection units 110 and 120.

  Then, the management code 16 placed on the inspection table 64 is read by the CCD camera 131, and it is confirmed that the placed substrate 12 is determined to have a defect (S22). When the substrate 12 that is not determined to be defective is erroneously placed, the work 10 is transported to the buffer unit 190 side by driving the tape transport driving rollers 50e and 50f. The

  In the substrate 12 determined to have a defect in step S22, the defect portion is magnified and observed by the imaging camera 134 (S23). Thereafter, the defective substrate 12 is released from the inspection table 64 and conveyed to the punching jig 63 by the tape conveying drive rollers 50e and 50f. Then, the defective substrate 12 conveyed to the punch jig 63 is punched (punched) by the punch jig 63. The punched substrate 12 is again conveyed to the buffer unit 190 side by the tape conveying drive rollers 50e and 50f (S24). Note that a marking means (not shown) may be provided instead of the punch jig 63, and the marking means may be used to mark the substrate 12 as a defect.

  In addition, not only punching or marking, but the entire number of the substrates 12 supplied from the buffer unit 180 side is imaged by the imaging camera 134, and the image processing / drive control unit 135 also applies to the substrates 12 having no defects. It is also possible to check the excessive quality level of the wiring pattern. When this confirmation is performed, the result is output from the image processing / drive control unit 135 to the integrated control unit 202.

  Further, the review / punch unit 130 may be provided with a length measuring function for an arbitrary part such as a wiring pattern or a defective part. As a result, regular information on the pattern width of one reel can be grasped, and it is also used for prompt feedback to the process.

  Thereafter, the workpiece 10 is conveyed to the workpiece winding unit 140 by the tape conveying driving rollers 50e and 50f via the buffer unit 190 having the same configuration as the buffer units 160, 170 and 180. In the work take-up unit 140, the work 10 is taken up on the work reel 141 together with the protective spacer tape 14 supplied from the spacer tape reel 142 (S25). The state information of the workpiece 10 in the workpiece winding unit 140 is transmitted to the integrated control unit.

  The operation state as described above and information held by the integrated control unit 202 are appropriately displayed from the display device 204. Further, the output device 205 appropriately outputs information held by the integrated control unit 202 in response to an output request made via the input device 201.

  As described above, in the wiring pattern inspection apparatus to which the wiring pattern inspection method according to the present embodiment is applied, the two inspection units 110 and 120 and the review / punch unit 130 are independent of each other due to the above-described action. Can be operated. That is, even if the progress speeds of the units 110, 120, and 130 are different, a wiring pattern inspection apparatus and inspection method that do not cause a significant delay in the time required to complete the entire inspection work are realized. It becomes possible to do.

(Second Embodiment)
A second embodiment of the present invention will be described.

  The wiring pattern inspection apparatus configured as shown in FIG. 1 is based on a unit configuration. For example, it can be easily added and removed in units such as adding inspection units to improve processing speed, and in a clean environment. The structure and configuration are also taken into account. Further, the conveyance of the workpiece 10 and the configuration thereof are not limited to the above-described form. For example, the conveyance is not vertical conveyance but vertical conveyance, the workpiece unwinding unit 100 and the workpiece winding unit 140 are both provided on the same side, or the like. Is also possible.

  A wiring pattern inspection apparatus to which the wiring pattern inspection method according to the present embodiment is applied is a modification of the wiring pattern inspection apparatus having the configuration shown in FIG. A system configuration diagram showing an example thereof is shown in FIG. 9, the same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  That is, in the configuration shown in FIG. 9, only the review / punch unit 130 ′ is remotely located from the main unit 40. The review / punch unit 130 ′ includes a work unwinding unit 100 ′ having the same function as the work unwinding unit 100 and a work winding unit having the same function as the work winding unit 140. 140 '.

  That is, in this case, the main unit 40 does not have the function of the review / punch unit 130, and the work 10 is directly transferred from the buffer unit 180 to the work reel 141 by the work take-up unit 140, and the protective spacer tape. 14 is wound together.

  The integrated control unit 202 of the main unit 40 and the image processing / drive control unit 135 of the review / punch unit 130 ′ are connected via a communication network 30 such as the Internet.

  When the winding onto the work reel 141 is completed, the work reel 141 is removed from the work winding unit 140 and attached to the work unwinding unit 100 'of the review / punch unit 130'.

  The workpiece unwinding unit 100 ′ operates in the same manner as the workpiece unwinding unit 100, thereby feeding the workpiece 10 while winding the protective spacer tape 14 around the spacer tape reel 103.

  In the review / punch unit 130 ′, the image processing / drive control unit 135 receives the pass / fail judgment result output from the integrated control unit 202 via the communication network 30. Then, by driving the tape transport drive rollers 50e and 50f based on the pass / fail determination result, the substrate 12 determined to have a defect is placed on the inspection table 64. The processing performed thereafter by the review / punch unit 130 ′ is the same as the processing performed by the review / punch unit 130.

  After that, the substrate 12 is transported to the work take-up unit 140 ′ by driving the tape transport drive rollers 50 e and 50 f, and taken up on the work reel 143 together with the protective spacer tape 14.

  Instead of connecting the integrated control unit 202 and the image processing / drive control unit 135 via the communication network 30, the pass / fail judgment result stored in the memory (not shown) of the integrated control unit 202 is stored in the floppy (registered trademark). The information may be stored in a storage medium such as a disk, carried from the main unit 40 to the review / punch unit 130 ′, and the information stored in the image processing / drive control unit 135 may be read.

  Even with this configuration, the same operational effects as those of the first embodiment can be obtained.

(Third embodiment)
A third embodiment of the present invention will be described.

  FIG. 10 is a system configuration diagram showing an example of a wiring pattern inspection apparatus to which the wiring pattern inspection method according to the third embodiment is applied.

  That is, the wiring pattern inspection apparatus according to the present embodiment is a modification of the wiring pattern inspection apparatus according to the first embodiment, and enables defect inspection on both the front side and the back side of the workpiece 10. The workpiece unwinding unit 100, the inspection unit 110 ′, the buffer unit 170, the inspection unit 120 ′, and the workpiece winding unit 140 are arranged in this order along the flow in which the workpiece 10 is conveyed. Moreover, the control unit 200 which controls these whole operation | movement is provided. In FIG. 10, portions that perform the same operations as those in FIGS. 1 and 9 are given the same reference numerals, and detailed descriptions thereof are omitted.

  The inspection unit 110 ′ includes an inspection table 60 (60a to 60f), an alignment mark reading camera 117 (117a to 117f), a suction plate (not shown), a clamp 119, a CCD camera 111 (111a to 111f), and an imaging camera 114. There are six sets of parts (114a to 114f). As a result, image data from the surface side of the six substrates 12 can be captured at a time.

  When each of the imaging cameras 114 a to 114 f captures image data from the surface side of the substrate 12, the captured image data is output to the image processing / drive control unit 115.

  When the image processing / drive control unit 115 receives this image data, the wiring pattern data obtained by extraction processing from the characteristics of the image data and a normal design wiring pattern stored in advance in a memory (not shown). Comparison processing with data is performed to determine whether the wiring pattern is good or bad. When the image processing / drive control unit 115 receives the image data, the image processing / drive control unit 115 determines that the imaging by the imaging camera 114 is completed. When it is determined that imaging by all of the imaging cameras 114 of the imaging cameras 114a to 114f is completed, the inspection tables 60a to 60f in the inspection tables 60a to 60f are connected via the sensors / adsorption / clamp / light adjustment control unit 113. The suction function of the suction plate (not shown) is released, and the suppression function by the clamp 119 is released. Further, the pass / fail determination result and the imaging completion signal are output to the integrated control unit 202.

  When the integrated control unit 202 acquires the pass / fail determination result and the imaging completion signal in this manner, the integrated control unit 202 sends an operation instruction to the tape transport drive rollers 50a to 50d based on the imaging completion signal. As a result, the tape conveyance drive rollers 50a to 50d are driven, the next six substrates 12 are conveyed from the tape unwinding unit 100 side, placed on the inspection tables 60a to 60f, respectively, and the six workpieces that have been inspected. 10 is conveyed to the buffer unit 170 side. The next six substrates 12 placed on the inspection table 60 in this way are also collectively transported to the buffer unit 170 side after the six substrates 12 are collectively determined for the presence or absence of defects by the same procedure as described above. To be.

  The substrate 12 sent to the buffer unit 170 in this manner is finally subjected to the same method for determining defects on the back side in the inspection unit 120 '. By providing the buffer unit 170, the substrate 12 that has been inspected for defects by the inspection unit 110 ′ is not continuously conveyed to the inspection unit 120 ′ as it is, so that the inspection time by the inspection unit 110 ′, the inspection unit 120 Even when there is a difference in the inspection time due to ', both the inspection units 110' and 120 'can be independently inspected for defects without being affected by the other unit.

  Next, the operation of the wiring pattern inspection apparatus to which the wiring pattern inspection method according to the present embodiment configured as described above is applied will be described with reference to the flowcharts of FIGS.

  First, from the work reel 101 on which the work 10 has been wound, the work 10 is sent to the inspection unit 110 'via the guide roller 102 by the tape transport driving rollers 50a to 50d (S31). At this time, the protective spacer tape 14 wound around the work reel 101 together with the work 10 is wound around the spacer tape reel 103 by the rotation of the reel shaft 103a.

  Then, the substrates 12 arranged on the carrier film are arranged on the six inspection tables 60a to 60f of the inspection unit 110 '(S32). That is, in the inspection unit 110 ′, the surface sides of the six substrates 12 are inspected at a time.

  As shown in FIG. 2, the substrates 12 arranged on the inspection tables 60a to 60f are present at the center of the work 10 (exposure batch center) and at both ends of the work 10 by the alignment mark reading cameras 117a to 117f. Both alignment marks 15 to be recognized are recognized by reflection optics (S33).

  Based on the recognition result, the image processing unit 203 a calculates the correction amount of XYθ with respect to the reference position set in advance for both alignment marks 15 of each substrate 12, and outputs the result to the integrated control unit 202. (S34).

  Thereafter, the workpiece 10 is attracted to the inspection tables 60a to 60f by a suction plate (not shown) whose suction force increases from the center of the exposure batch toward the outside, and at the end of the workpiece 10. The clamp 119 for reducing the warping effect is lowered, and each workpiece 10 is fixed (S35).

  When the workpieces 10 are fixed to the inspection tables 60a to 60f in this way, the management codes 16 formed at predetermined positions on the workpieces 10 are read by the CCD cameras 111a to 111f as shown in FIG. Then, the read management code information is transmitted to the integrated control unit 202 via the image processing / drive control unit 115 (S36).

  Then, the correction amounts ΔX, ΔY, θ are output from the integrated control unit 202 to the image processing / drive control unit 115. In the image processing / drive control unit 115, the imaging start position is calculated according to the correction amount, and each of the imaging cameras 114a to 114f is moved to the imaging start position (S37).

  Then, as shown in FIG. 14, the surfaces of the workpieces 10 are scanned (line-sensing) so as to draw an S-shape by the imaging cameras 114 a to 114 f, thereby imaging the wiring patterns of the substrates 12. (S38). The captured image data is output to the image processing / drive control unit 115.

  In the image processing / drive control unit 115, the wiring pattern formed on each substrate 12 is optically revealed based on the image data (S39). Then, a comparison process is performed between the wiring pattern data obtained by extracting the characteristic features of each exposed wiring pattern and normal design wiring pattern data stored in advance in a memory (not shown). The quality of the wiring pattern is determined (S40).

  Further, when the image processing / drive control unit 115 receives this image data, it is determined that the imaging by the transmission source imaging camera 114 (imaging cameras 114a to 114f) has been completed. When it is determined that the imaging of all of the imaging cameras 114a to 114f has been completed, the suction function of the suction plate is canceled by the sensors / suction / clamp / lighting control unit 113, and the suppression function by the clamp 119 is also released. The And the quality determination result of each wiring pattern and the imaging completion signal by all the imaging cameras 114a-114f are output to the integrated control part 202 (S41).

  On the other hand, the integrated control unit 202 sends an operation instruction to the tape transport drive rollers 50a to 50d based on the imaging completion signal (S42). As a result, the tape transport driving rollers 50a to 50d are driven, and the next six substrates 12 are transported from the tape unwinding unit 100 side, placed on the inspection tables 60a to 60f, and the six workpieces that have been inspected. 10 is conveyed to the buffer unit 170 side (S43).

  The six substrates 12 thus placed on the inspection table 60 are also transported to the buffer unit 170 side after the presence or absence of a defect is determined by the same procedure as in step S33 to step S43.

  In the buffer unit 170, the dancer roller 171 is configured to be freely movable in the vertical direction. Therefore, when the workpiece 10 is conveyed, the position of the dancer roller 171 is lowered. Conversely, when the workpiece 10 is transported to the inspection unit 120 'side, the position of the dancer roller 171 increases. However, the buffer unit 170 is provided with an upper / lower limit sensor 172, the upper / lower limit sensor 172 detects the position of the dancer roller 171 in the vertical direction, and the detection result is transmitted to the integrated control unit 202 of the control unit 200. . As a result, the integrated control unit 202 grasps the position of the dancer roller 171 and grasps the state of the workpiece 10, and the vertical position of the dancer roller 171 does not exceed a predetermined upper limit value or lower limit value. The inspection unit 110 ′ and the inspection unit 120 ′ are controlled (S44).

  Therefore, by providing such a buffer unit 170, when the tape transport driving rollers 50a to 50d of the inspection unit 110 ′ are operated, the work 10 that is transported by this is retained. As is, it can be received without being sent to the inspection unit 120 ′ side. In addition, when the tape transport driving rollers 50e to 50g of the inspection unit 120 ′ are operated, the six substrates from the workpieces 10 that are already held without forcibly pulling the workpiece 10 from the inspection unit 110 ′ side. 12 is conveyed to the inspection unit 120 ′. As described above, the inspection unit 110 ′ and the inspection unit 120 ′ independently inspect the defect of the substrate 12.

  Then, the inspection unit 120 ′ drives the tape transport driving rollers 50e to 50g to take in the six substrates 12 from the buffer unit 170 side, and inspects the back surfaces of the substrates 12 toward the imaging cameras 124a to 124f. They are placed on the tables 62a to 62f, respectively (S45). The inspection unit 120 ′ also determines the presence / absence of defects on the back surfaces of the six substrates 12 by the same procedure as in steps S <b> 33 to S <b> 42. Thereafter, the workpiece 10 is conveyed to the workpiece winding unit 140 by the tape conveying drive rollers 50e to 50g. Then, in the work take-up unit 140, the work 10 is taken up on the work reel 141 together with the protective spacer tape 14 supplied from the spacer tape reel 142 (S46). The state information of the workpiece 10 in the workpiece winding unit 140 is transmitted to the integrated control unit.

  The operation state as described above and information held by the integrated control unit 202 are appropriately displayed from the display device 204. Further, the output device 205 appropriately outputs information held by the integrated control unit 202 in response to an output request made via the input device 201.

  As described above, in the wiring pattern inspection apparatus to which the wiring pattern inspection method according to the present embodiment is applied, surface defects can be obtained even when performing double-sided inspection on one substrate 12 due to the above-described action. An inspection unit 100 ′ that performs inspection and an inspection unit 120 ′ that performs defect inspection on the back surface are provided independently, and each of the inspection units 110 ′ and 120 ′ includes a large number of imaging cameras 114a to 114f and 124a to 124f. As a result, the time required for defect inspection can be shortened.

  Furthermore, by providing the buffer unit 170 between the two inspection units 110 ′ and 120 ′, the inspection unit 110 ′ and the inspection unit 120 ′ can be operated independently, thereby preventing a decrease in inspection efficiency. Is possible.

  Furthermore, the inspection unit 110 ′ and the inspection unit 120 ′ can be arranged to face each other by folding the workpiece 10 conveyed from the inspection unit 110 ′ so as to be conveyed to the inspection unit 120 ′. In spite of using a large number of imaging cameras 114a to 114f and 124a to 124f, it is possible to save space.

(Fourth embodiment)
A fourth embodiment of the present invention will be described.

  FIG. 13 is a system configuration diagram showing an example of a wiring pattern inspection apparatus to which the wiring pattern inspection method according to the fourth embodiment is applied.

  That is, the wiring pattern inspection apparatus according to the present embodiment is a modification of the wiring pattern inspection apparatus according to the third embodiment, and includes an inspection unit 110 ′ that performs defect inspection on the front side of the workpiece 10, and a back surface. Are arranged so that the imaging directions of the imaging cameras 114 and 124 are the same.

  Therefore, the surface of the workpiece 10 facing the upper side in the drawing in the inspection unit 110 ′ is inverted by the tape transport drive rollers 50b to 50f so as to face the lower side in the drawing in the inspection unit 120 ′. .

  Even with this configuration, it is possible to achieve the same operational effects as the third embodiment.

  The best mode for carrying out the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to such a configuration. Within the scope of the invented technical idea of the scope of claims, a person skilled in the art can conceive of various changes and modifications. The technical scope of the present invention is also applicable to these changes and modifications. It is understood that it belongs to.

1 is a system configuration diagram showing an example of a wiring pattern inspection apparatus to which a wiring pattern inspection method according to a first embodiment is applied. The top view which shows an example of the board | substrate arrange | positioned at the carrier film. The enlarged view of the alignment mark 15 shown in FIG. Sectional drawing which looked at the alignment mark 15 shown in FIG. 3 from the thickness direction. The figure for demonstrating the reflective optical recognition of an alignment mark, and the calculation method of the correction amount of XY (theta). The flowchart (the 1) which shows operation | movement of the wiring pattern inspection apparatus to which the wiring pattern inspection method which concerns on 1st Embodiment is applied. 7 is a flowchart (part 2) illustrating the operation of the wiring pattern inspection apparatus to which the wiring pattern inspection method according to the first embodiment is applied. 7 is a flowchart (part 3) illustrating the operation of the wiring pattern inspection apparatus to which the wiring pattern inspection method according to the first embodiment is applied. The system configuration figure showing an example of the wiring pattern inspection device to which the wiring pattern inspection method concerning a 2nd embodiment is applied. The system configuration figure showing an example of the wiring pattern inspection device to which the wiring pattern inspection method concerning a 3rd embodiment is applied. The flowchart (first half) which shows operation | movement of the wiring pattern inspection apparatus to which the wiring pattern inspection method which concerns on 3rd Embodiment is applied. The flowchart (latter half) which shows operation | movement of the wiring pattern inspection apparatus to which the wiring pattern inspection method which concerns on 3rd Embodiment is applied. The system configuration figure showing an example of the wiring pattern inspection device to which the wiring pattern inspection method concerning a 4th embodiment is applied. The conceptual diagram explaining the concept of the line sensing by a camera.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Work, 12 ... Board | substrate, 14 ... Protection spacer tape, 15 ... Alignment mark, 16 ... Management code, 30 ... Communication network, 40 ... Main unit, 50 ... Drive roller for tape conveyance, 60, 62, 64 ... Inspection Table, 63 ... Punch jig, 100 ... Work unwinding unit, 101 ... Work reel, 101a, 103a ... Reel shaft shaft, 102 ... Guide roller, 103 ... Spacer tape reel, 110, 120 ... Inspection unit, 111, 121 , 131 ... CCD camera, 112, 122 ... sequencer, 113, 123 ... illumination control unit, 114, 124, 134 ... imaging camera, 115, 125, 135 ... drive control unit, 116.126 ... stage controller, 117, 127... Alignment mark reading camera, 118,1 8 ... suction plate, 119, 129 ... clamp, 130 ... review / punch unit, 140 ... take-up unit, 141, 143 ... work reel, 141a ... reel shaft, 142 ... spacer tape reel, 160, 170, 180, 190 ... Buffer unit, 161, 171, 181, 191 ... Dancer roller, 162, 172, 182, 192 ... Upper / lower limit sensor, 200 ... Control unit, 201 ... Input device, 202 ... Integrated control unit, 203 ... Image processing unit, 204 ... Display device, 205 ... Output device

Claims (8)

In a wiring pattern inspection apparatus for optically inspecting each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film,
When there is an operation command, a transport means for transporting a predetermined number of substrates arranged on the carrier film to a predetermined inspection area by transporting the carrier film at a predetermined pitch along the longitudinal direction. When,
A plurality of imaging means for imaging each of the predetermined number of substrates conveyed to the inspection area by the conveying means from one side or both sides of the carrier film;
Imaging completion determination means for determining whether or not each imaging means has completed imaging of the surface of the corresponding substrate,
When it is determined by the imaging completion determination means that all of the imaging means have completed imaging of the corresponding substrate surfaces, a control means for instructing the transport means to operate,
A wiring pattern inspection apparatus comprising: a defect presence / absence determination unit that determines the presence / absence of a defect in each wiring pattern based on imaging data obtained by each imaging unit. In a wiring pattern inspection apparatus for optically inspecting each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film,
When there is an operation command, by conveying the carrier film at a predetermined pitch along the longitudinal direction, a conveying means for conveying the substrate disposed on the carrier film to a predetermined inspection area,
Imaging means for imaging the substrate transported to the inspection area by the transport means from a predetermined surface side of the carrier film;
When a predetermined surface of the substrate is imaged by the imaging means, a plurality of imaging units comprising: a control means for commanding the transport means;
It is provided between each of the imaging units and is capable of holding a length that is a part of the carrier film and that can arrange one or more substrates. When the transport means is operated, the carrier film transported by the transport means is received while holding the already held carrier film, and when the transport means of the imaging unit downstream in the transport direction is operated, A buffer means configured to transport the already held carrier film to the imaging unit downstream in the transport direction without pulling a carrier film from the imaging unit upstream in the transport direction;
A wiring pattern inspection apparatus comprising: a defect presence / absence determination unit that determines the presence / absence of a defect in each wiring pattern based on imaging data obtained by each imaging unit. In a wiring pattern inspection apparatus for optically inspecting each wiring pattern formed on a plurality of substrates arranged at predetermined intervals along the longitudinal direction of the carrier film,
When there is an operation command, a transport means for transporting a predetermined number of substrates arranged on the carrier film to a predetermined inspection area by transporting the carrier film at a predetermined pitch along the longitudinal direction. When,
A plurality of imaging means for imaging each of the predetermined number of substrates transported to the inspection area by the transport means from an arbitrary surface side of the carrier film;
Imaging completion determination means for determining whether or not each imaging means has completed imaging of the surface of the corresponding substrate,
When the imaging completion determining unit determines that all of the imaging units have completed imaging of the corresponding substrate surface, the control unit instructs the transfer unit to perform an operation. An imaging unit;
It is provided between each of the imaging units and is capable of holding a length that is a part of the carrier film and that can arrange one or more substrates. When the conveying means is operated, the carrier film that is pitch-conveyed by the conveying means is received while holding the already held carrier film, and when the conveying means of the imaging unit downstream in the conveying direction is operated. Buffer means for transporting the already held carrier film to the imaging unit downstream in the transport direction without pulling a carrier film from the imaging unit upstream in the transport direction;
Defect presence / absence determination means for determining the presence / absence of a defect in each wiring pattern based on image data obtained by the respective image pickup means,
A wiring pattern inspection apparatus in which an imaging unit of one imaging unit images the front side of the substrate and an imaging unit of the other imaging unit images the back side of the substrate. In the wiring pattern inspection apparatus according to claim 3,
Each of the two imaging units is folded by folding the carrier film pitch-fed from the imaging unit on the upstream side in the transport direction and transporting the folded carrier film to the imaging unit on the downstream side in the transport direction. A wiring pattern inspection apparatus provided with folding means that allows imaging from the front side and the back side of the carrier film, respectively, while the imaging units are in the same imaging direction. In the wiring pattern inspection apparatus according to claim 3,
Each of the two imaging units is folded by folding the carrier film pitch-fed from the imaging unit on the upstream side in the transport direction and transporting the folded carrier film to the imaging unit on the downstream side in the transport direction. A wiring pattern inspection apparatus provided with folding means that enables imaging from the front side and the back side of the carrier film in imaging directions in which the imaging units are in opposite directions. In the wiring pattern inspection apparatus according to any one of claims 1 to 5,
Magnification observation means for magnifying and observing the defect portion of the wiring pattern determined to be defective by the defect presence / absence determination means,
A wiring pattern inspection apparatus comprising either a punching means for punching holes in a substrate corresponding to a wiring pattern determined to have a defect by the defect presence / absence determining means, or a mark providing means for attaching a predetermined mark . In the wiring pattern inspection apparatus according to any one of claims 1 to 6,
Preliminary identification information of the substrate corresponding to the wiring pattern determined to have a defect by the defect presence / absence determining unit, defect data collecting unit for storing the position information of the defective part on the substrate in a storage medium,
Magnification observation means for obtaining the identification information and position information from the storage medium via a communication network, and magnifying and observing the defect location based on the obtained identification information and position information;
The identification information is acquired from the storage medium via a communication network, and based on the acquired identification information, a punching means for punching holes in the substrate on which the defective portion exists, or a mark providing means for attaching a predetermined mark A wiring pattern inspection apparatus comprising any one of the above.   A wiring pattern inspection method using the wiring pattern inspection apparatus according to claim 1 to determine the presence or absence of a defect in the wiring pattern.

Images