JP2005260079A5 - - Google Patents
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- Publication number
- JP2005260079A5 JP2005260079A5 JP2004071294A JP2004071294A JP2005260079A5 JP 2005260079 A5 JP2005260079 A5 JP 2005260079A5 JP 2004071294 A JP2004071294 A JP 2004071294A JP 2004071294 A JP2004071294 A JP 2004071294A JP 2005260079 A5 JP2005260079 A5 JP 2005260079A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- wiring layer
- main surface
- via hole
- pad electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004071294A JP4282514B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004071294A JP4282514B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005260079A JP2005260079A (ja) | 2005-09-22 |
JP2005260079A5 true JP2005260079A5 (de) | 2007-04-19 |
JP4282514B2 JP4282514B2 (ja) | 2009-06-24 |
Family
ID=35085497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004071294A Expired - Fee Related JP4282514B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4282514B2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101697573B1 (ko) | 2010-11-29 | 2017-01-19 | 삼성전자 주식회사 | 반도체 장치, 그 제조 방법, 및 상기 반도체 장치를 포함하는 반도체 패키지 |
FR2970119B1 (fr) * | 2010-12-30 | 2013-12-13 | St Microelectronics Crolles 2 Sas | Puce de circuits integres et procede de fabrication. |
FR2970118B1 (fr) | 2010-12-30 | 2013-12-13 | St Microelectronics Crolles 2 | Puce de circuits integres et procede de fabrication. |
CN102592982B (zh) * | 2011-01-17 | 2017-05-03 | 精材科技股份有限公司 | 晶片封装体的形成方法 |
SE538058C2 (sv) * | 2012-03-30 | 2016-02-23 | Silex Microsystems Ab | Metod att tillhandahålla ett viahål och en routing-struktur |
CN115084082B (zh) * | 2022-07-19 | 2022-11-22 | 甬矽电子(宁波)股份有限公司 | 扇出型封装结构和扇出型封装方法 |
-
2004
- 2004-03-12 JP JP2004071294A patent/JP4282514B2/ja not_active Expired - Fee Related
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