JP2005257566A - Transfer equipment, surface mount device, ic handler, illumination level determination method, and threshold determination method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer equipment, a surface mount device, an IC mounter, an illumination level determination method, and a threshold determination method which can automatically set parameters of adequate part data. <P>SOLUTION: By using an electronic part which is actually mounted on a printed wiring board P, and by judging whether the electronic part is recognizable or not when a lighting apparatus 61 illuminates while the illumination levels thereof, which are divided into several steps, changes, the adequate illumination level of the lighting apparatus 61 for taking an image of the electronic part with a θ-degree line sensor 6 is automatically set. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a transfer device for transferring an electronic component from a predetermined position to another predetermined position by a head having a component suction nozzle, a surface mounter having the transfer device, an IC handler, and these devices. The present invention relates to a method for determining an applied illumination level and threshold value.

  2. Description of the Related Art Conventionally, there has been known a transfer device that sucks an electronic component such as an IC from a predetermined position and transfers it to another predetermined position by a head unit having a head that movably supports a component suction nozzle. ing. In addition, with such a transfer device, a surface mounter that mounts a component at a predetermined position on a printed circuit board, an IC handler that transfers a component along a predetermined path in an inspection area, and inspects the component are also known. It has been.

In these apparatuses, since there is some variation in the suction position of the component when the component is sucked by the nozzle, it is necessary to correct the shift of the suction position when the component is transferred. For this reason, conventionally, a part image is captured by an imaging means such as a line sensor to capture a component image, and the displacement of the suction position is corrected based on the captured image (see, for example, Patent Document 1).
In addition, for example, in the case of a part having a portion protruding from the main body such as a lead or a ball such as QFP (Quad Flat Package) or BGA (Ball Grid Array), It is common to measure flatness (coplanarity). For this reason, conventionally, in addition to the above-described line sensor, a line sensor having an optical axis angle different from that of the line sensor is provided, and the image of the lead of the component or the ball is captured by these line sensors to capture the images. A defective product is determined based on the captured image (see, for example, Patent Documents 2 and 3).
The applicant has not yet found prior art documents related to the present invention by the time of filing other than the prior art documents specified by the prior art document information described in this specification.
JP-A-12-299600 JP-A-7-151522 JP 2003-130619 A JP 2000-161916 A JP 2002-176300 A

There are a wide variety of parts transferred by the transfer device described above, and in particular, parts that measure coplanarity are also relatively expensive. Therefore, in order to transfer parts accurately, image capture by each line sensor is performed. It is important to properly perform image processing of captured images. For this purpose, it is necessary to appropriately set each parameter of the component data such as the illuminance level of the illumination and the image processing threshold value used when imaging the component.
However, conventionally, the parameters of the component data as described above can be set only by skilled workers. Moreover, even a skilled worker needs to repeat trial and error in order to set parameters appropriately. For this reason, there has been a demand for a transfer device or the like that can automatically set each parameter of appropriate component data.
Accordingly, the present invention has been made to solve the above-described problems, and a transfer device, a surface mounter, an IC mounter, and an illumination level determination capable of automatically setting appropriate component data parameters. It is an object to provide a method and a threshold determination method.

  In order to solve the problems as described above, a transfer apparatus according to the present invention includes a head having a nozzle for sucking parts, a plurality of imaging means for imaging the parts sucked by the nozzles, and these imaging means. Correspondingly provided, a plurality of illumination means for illuminating a part at an illumination level set for a predetermined part, and an image captured by the imaging means is processed using a threshold value, and image data is output. An image processing unit; a control unit that controls driving of the head based on the image data; and an illumination level determination unit that determines an illumination level for each of the illumination units. The illumination level determination unit is configured to perform predetermined illumination by the imaging unit. Recognize a given part from image data obtained by processing an image of a part captured at a level based on a predetermined threshold value, and recognize parts at different illumination levels. And determining the illumination level results.

  In the transfer apparatus, the illumination level determining means may set an intermediate value between the highest illumination level and the lowest illumination level when correctly recognized among a plurality of different illumination levels as the illumination level.

  In addition, another transfer apparatus according to the present invention is provided corresponding to a head having a component suction nozzle, a plurality of imaging means for imaging the component sucked by the nozzle, and a predetermined number of these imaging means. A plurality of illumination means for illuminating the part at an illumination level set for the part, an image processing means for processing an image captured by the imaging means using a threshold value, and outputting image data, and image data And a threshold value determining means for determining a threshold value of the image processing means for each of the imaging means. The threshold value determining means is predetermined by the imaging means. Recognize a specific part from image data obtained by processing an image of a part captured at an arbitrary illumination level based on a predetermined threshold, and determine a threshold from the recognition results of the parts at different thresholds. Characterized in that it constant.

  In the above transfer apparatus, the threshold value determining means may use an intermediate value between the highest threshold value and the lowest threshold value when a plurality of different threshold values are correctly recognized as the threshold value. Good.

  A surface mounting machine according to the present invention includes a holding unit that holds a substrate, and a transfer device that transfers a component at one position to a predetermined position on the substrate held by the holding unit. And a transfer apparatus is the said transfer apparatus, It is characterized by the above-mentioned.

  An IC handler according to the present invention is an IC handler including an inspection socket for inspecting a component and a transfer device for transferring a component at one position onto the inspection socket. It is a transfer device.

  An illumination level determination method according to the present invention includes a head having a nozzle for picking up components, a plurality of imaging means for imaging the components sucked by the nozzles, and corresponding to these imaging means. Illumination means for illuminating a component at a set illumination level, image processing means for processing an image captured by the imaging means using a threshold value, and outputting image data, and driving of the head based on the image data And an illumination level determination method for determining an illumination level for each of the illumination means, wherein an image of a part imaged at a predetermined illumination level by the imaging means is determined in advance. A predetermined part is recognized from the processed image data based on the given arbitrary threshold value, and the illumination level is determined from the recognition results of the parts at different illumination levels. And wherein the door.

  A threshold value determining method according to the present invention includes a head having a nozzle for picking up a component, a plurality of imaging units for imaging a component sucked by the nozzle, and a predetermined component provided corresponding to these imaging units. Illuminating means for illuminating a component at an illumination level set for the image, an image processing means for processing an image captured by the imaging means using a threshold value, and outputting image data, and a head based on the image data And a threshold value determination method for determining a threshold value of the image processing means for each of the imaging means, wherein the transfer means includes a control means for controlling driving. Recognize a given part from image data obtained by processing an image of a part imaged at a threshold based on a given threshold, and determine a threshold from the recognition results of the parts at different thresholds It is characterized in.

  According to the present invention, since the illumination level or threshold value is determined from the recognition results of components at different illumination levels or different threshold values, each parameter of the component data such as the illumination level and threshold value is appropriate. As a result, appropriate part data can be automatically created.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a plan view of a surface mounter according to the present embodiment, FIG. 2 is a side view of the surface mounter according to the present embodiment, and FIG. 3 is an electrical diagram of the surface mounter according to the present embodiment. It is a block diagram which shows a structure.
The surface mounter according to the present embodiment is disposed on the base 1 along the longitudinal direction (X-axis direction) of the base 1 having a substantially rectangular shape in plan view and transports the printed circuit board P. Conveyor 2, provided on both sides of the conveyor 2, a component supply unit 3 for supplying electronic components, and provided above the base 1. The electronic components of the component supply unit 3 are placed on the printed circuit board P on the conveyor 2. The head mechanism 4 to be transferred, the 0-degree line sensor 5 that is provided on the base 1 and images the electronic components conveyed by the head mechanism 4, and the θ-degree line sensor 6 that images the electronic components conveyed by the head mechanism 4. And a control device 7 for controlling the operation of the surface mounter.

  The conveyor 2 moves the printed circuit board P in the X-axis direction. As a result, the conveyor 2 carries in the carry-in operation for carrying the printed circuit board P into the surface mounter from a printing device or the like provided continuously or continuously, and stops holding the loaded printed circuit board P at a predetermined mounting work position. Operation, carrying out operation of carrying out the printed circuit board P on which electronic components are mounted to another surface mounter or reflow furnace or outside the surface mounter are performed.

  The component supply unit 3 includes a mounting seat 31 disposed in parallel with the conveyor 2 and a plurality of tape feeders 32 for supplying various components fixed in a state of being parallel to and positioned in the mounting seats 31. Have. The tape feeder 32 is configured such that small electronic components such as ICs, transistors and capacitors are stored at predetermined intervals, and the held tape is led out from the reel, and a feeding mechanism is provided at the tape feeding end. The tape is intermittently sent out as a part is picked up by a nozzle 46 described later.

  The head mechanism 4 includes a rail 41 whose longitudinal direction is fixed along the Y-axis direction (direction orthogonal to the moving direction of the conveyor 2) in the vicinity of both ends in the X-axis direction on the base 1, and the longitudinal direction is the X-axis. The support member 42 is disposed so as to be movable in the Y-axis direction by being supported at both ends by the rail 41, a guide 43 provided in the longitudinal direction of the support member 42, and along the guide. And a head unit 44 that is movably supported. Such a head mechanism 4 picks up an electronic component from the component supply unit 3, conveys the electronic component to the printed circuit board P, and performs a series of electronic component transfer operations of mounting the conveyed electronic component on the printed circuit board P. Do.

The head unit 44 is mounted with a component suction head 45, and in the present embodiment, eight heads 45 are arranged in a line in the X-axis direction. Further, the head 45 is moved and nozzles in the Z-axis direction (direction perpendicular to the X-axis and Y-axis) with respect to the head unit 44 by the Z-axis servomotor 47 and the R-axis servomotor 48 shown in FIG. The rotation around the central axis (R axis) of 46 is possible. The Z-axis servo motor 47 and the R-axis servo motor 48 are provided with position detectors 47a and 48a each composed of an encoder or the like.
A nozzle 46 is provided at the lower end in the Z-axis direction of each head 45, and a negative pressure is supplied from a negative pressure supply means (not shown) to the nozzle 46 at the time of component adsorption, and the component is adsorbed by the suction force of this negative pressure. Is done.
The head 45 may be provided with a plurality of nozzles 46.

  Such a head unit 44 includes a ball screw 41a provided along the rail 41, and a Y-axis servo motor 41b attached to one end of the ball screw 41a to rotate the ball screw 41a. Movement in the Y-axis direction is enabled by moving in the Y-axis direction. The head unit 44 is moved in the X-axis direction by a ball screw 42a provided along the support member 42 and an X-axis servomotor 42b attached to one end of the ball screw 42a and rotating the ball screw 42a. Can be moved. The Y-axis servo motor 41b and the X-axis servo motor 42b are provided with position detectors 41c and 42c each composed of an encoder or the like.

FIG. 4 is a side view of the 0 degree line sensor 5 and the θ degree line sensor 6.
The 0 degree line sensor 5 and the θ degree line sensor 6 are each composed of a CCD line sensor, and are provided in the vicinity of the component supply unit 3 on the base 1 within the moving range of the head unit 44, and are adsorbed by the nozzle 46 described above. The lower surface of the processed component is imaged and the image signal is output to the control device 7. Such 0 degree line sensor 5 and θ degree line sensor 6 are not limited to CCD line sensors, and various imaging means such as a CCD area sensor can be applied.
Note that two 0 degree line sensors 5 and two θ degree line sensors 6 are provided as shown in FIG.

  The 0 degree line sensor 5 is arranged so that the optical axis 5a coincides with the Z-axis direction, as well shown in FIG. The 0 degree line sensor 5 is provided with an illumination 51 for illuminating a component adsorbed by the nozzle 46. In the present embodiment, the illumination 51 is provided with two illuminations having the configuration shown in FIG. 4A. However, if the illumination 51 is an illumination that illuminates a component adsorbed by the nozzle 46, FIG. It is not limited to the structure and quantity of illumination shown to (a), It can set freely suitably.

As shown well in FIG. 4B, the θ-degree line sensor 6 is disposed such that the optical axis 6a has a predetermined angle with respect to the Z axis, and is a mirror 62 provided on the optical axis 6a. By changing the angle of the optical axis 6a, the optical axis 6a is arranged to have a predetermined angle θ with respect to the Z axis. Such a θ-degree line sensor 6 is provided with an illumination 61 that illuminates the component adsorbed by the nozzle 46.
Note that the angle θ of the optical axis 6a of the θ-degree line sensor 6 can be set freely as appropriate, for example, 40 degrees. Further, the θ-degree line sensor 6 is not limited to the one that changes the angle θ of the optical axis 6a by the mirror 6a as shown in FIG. 4B, but is arranged so as to have a predetermined angle θ with respect to the Z-axis. If so, various CCD line sensors can be applied.
Further, in the present embodiment, the illumination 61 is provided with two illuminations having the configuration as shown in FIG. 4B. However, if the illumination 61 is an illumination that illuminates a component adsorbed by the nozzle 46, FIG. It is not limited to the structure and quantity of illumination shown in (b), and can be set freely as appropriate.

  The control device 7 includes an arithmetic device such as a CPU, a storage device such as a memory and an HDD (Hard Disc Drive), an input device that detects input of information from the outside such as a keyboard, a mouse, a pointing device, a button, and a touch panel; A computer or controller having an I / F device for sending and receiving information to and from the outside, a display device such as a CRT (Cathode Ray Tube), LCD (Liquid Crystal Display), or FED (Field Emission Display), and the computer or controller And the program installed on the computer. That is, the hardware device and software cooperate to control the hardware resources by a program. The axis control unit (driver) 71, the image processing unit 72, the storage unit 73, the display unit 74, and the input shown in FIG. The unit 75 and the main calculation unit 76 are realized.

  The axis control unit 71 includes a Y-axis servo motor 41b, an X-axis servo motor 42b, an R-axis servo motor 47 and a Z-axis servo motor 48 provided for each head 45, and a position detection unit 41c provided in these servo motors. , 42c, 47a, and 48a are connected, and drive control of the servo motors 41b, 42b, 47, and 48 is performed based on the detection values of these position detection units.

  The image processing unit 72 is connected to the 0 degree line sensor 5 and the θ degree line sensor 6, and performs predetermined image processing based on the component data stored in the storage unit 73 on the captured images of these line sensors. The image data generated by the processing is sent to the main calculation unit 76. Further, the illumination 51 and the illumination 61 are connected to the image processing unit 72, and each is based on the component data stored in the storage unit 73 in conjunction with the imaging of the 0 degree line sensor 5 or the θ degree line sensor 6. Turn on with illumination.

The storage unit 73 stores a program relating to the operation of the surface mounter according to the present embodiment, mounting data relating to the shape of the printed circuit board P and the type and shape of electronic components mounted on the printed circuit board P, the 0 degree line sensor 5 and the θ degree. It stores component data relating to various parameters related to imaging by the line sensor 6, information relating to printed circuit boards and electronic components transferred in the past, component data created in the past, and the like. Here, the component data includes an illumination level that is a parameter relating to illuminance, which is a degree of brightness of the illumination 51 and the illumination 61 that are turned on when imaging is performed by the 0-degree line sensor 5 and the θ-degree line sensor 6, and 0 degrees. It includes at least a gradation threshold value when binarizing the image captured by the line sensor 5 and the θ-degree line sensor 6, and each parameter is set in association with each part. Such component data is set before the electronic component is actually mounted on the printed circuit board P.
Various data stored in the storage unit 73 can also be stored in a known storage medium such as a CD (Compact Disk) or a DVD (Digital Video Disk). As a result, various data created by other devices can be introduced into the storage unit 73 via the storage medium.

The display unit 74 includes an image captured by the 0 degree line sensor 5 and the θ degree line sensor 6, image data subjected to image processing by the image processing unit 72, and component data stored in the storage unit 73. Various data relating to various operations of the surface mounter according to the present embodiment, such as various data, are displayed.
The input unit 75 detects various operation inputs related to the operation of the surface mounter by the user. The detected information is sent to the main calculation unit 76.

The main calculation unit 76 controls the servo motors 41b, 42b, 47, 48, the line sensors 5, 6 and the illuminations 51, 61 via the axis control unit 71 and the image processing unit 72, thereby providing a component supply unit. 3. Adsorption of components from 3 (adsorption operation), movement of the head unit 44 on the 0 degree line sensor 5 and the θ degree line sensor 6, imaging of the components adsorbed on the nozzle 46 (recognition operation), printing after recognition of the components The head unit 44 is moved and mounted (mounting operation) on the substrate P in sequence, and the component adsorption position displacement amount is obtained based on the recognition result by the image processing unit 72 during the recognition operation, and the displacement amount during the mounting operation. To adjust the mounting position (positions in the X, Y, and R directions).
Further, the main operation unit 76 creates component data used during the recognition operation (component data creation operation) before performing the transfer operation with the surface mounter according to the present embodiment. Thereby, the main calculation part 76 functions as an illumination level determination means or a threshold value determination means.

Next, with reference to FIGS. 5 and 6, an operation of creating component data of the surface mounter according to the present embodiment will be described. 5 and 6 are flowcharts showing the operation of creating component data of the surface mounter according to this embodiment.
First, when the user designates an electronic component for creating part data, or when the main computation unit 76 designates one of the electronic components included in the mounting data, the main computation unit 76 receives each of the electronic components via the axis control unit 71. The servo motors 41b, 42b, 47, and 48 are controlled, and the electronic component designated by the printed circuit board P is picked up from the component supply unit 3 (step S501).

[Lighting level setting operation of θ degree line sensor 6]
First, the main calculation unit 76 sets the illumination level of the illumination 61 when the designated electronic component is imaged by the θ-degree line sensor 6.
The main calculation unit 76 sets a threshold value when performing image processing on an image captured by the θ-degree line sensor 6 to a default value (step S502). For this default value, for example, part data of an electronic part having a shape similar to that of the electronic part for which part data is created this time among electronic parts for which part data has been created in the past is used, or by the user via the input unit 75 An input value or the like can be used.

  When the default value is set, the main calculation unit 76 controls the Y-axis servo motor 41b, the X-axis servo motor 42b, and the R-axis servo motor 47 via the axis control unit 71, and the R-axis direction of the nozzle 46 every time. The head unit 44 is passed three times above the θ-degree line sensor 6 at different angles, and the illumination 61 is turned on at the same illumination level each time, and the lower surface of the electronic component is imaged by the θ-degree line sensor 6 (step S503). ).

FIG. 7 is a schematic diagram for explaining an operation of creating component data in the θ-degree line sensor 6. As well shown in FIG. 7, the main calculation unit 76 moves the head unit 44 that has attracted the electronic component for creating the component data in the direction in which the head unit 44 is moved during the actual recognition operation (imaging direction). The θ-degree line sensor 6 passes through the optical axis 6a, and the θ-degree line sensor 6 images the electronic component. Although this imaging is performed three times, the main calculation unit 76 moves the head unit 44 three times in the moving direction above the θ degree line sensor 6 (positive direction of the Z axis) as indicated by an arrow in FIG. By reciprocating, it passes on the optical axis 6 a of the θ-degree line sensor 6.
Here, if the angle in the R-axis direction of the nozzle 46 when the electronic component is picked up is 0 °, the main calculation unit 76 sets the R of the nozzle 46 before passing the head unit 44 over the θ-degree line sensor 6. The angle in the axial direction is set to 0 °, + 5 °, or −5 °, and the angle is changed to a different angle each time an image is taken, and the θ-degree line sensor 6 takes an image. Thereby, it is possible to capture images of the lower surface of the electronic component irradiated with the illumination 61 from different angles in the R-axis direction.
The illumination level is obtained by appropriately dividing the brightness range of the illuminance of the illumination 61 into several stages such as 8 stages. When performing the process of step 503 for the first time, the main calculating part 76 makes the illumination 61 light at the brightest level or the darkest level, for example.
Note that the number of times of imaging by the θ-degree line sensor 6, the magnitude of the angle when changing the angle of the nozzle 46 in the R-axis direction, and the number of stages for dividing the illumination level illuminance are arbitrarily set as appropriate. be able to.

When the image is captured by the θ-degree line sensor 6, the main calculation unit 76 causes the image processing unit 72 to perform image processing on the image with the threshold value set in S <b> 502, and generates electronic data from all the generated image data. It is determined whether or not the component can be recognized (step S504).
The main calculation unit 76 detects, for example, leads or balls at both ends of each side of the electronic component from the image data, and extracts the contour of the electronic component from these leads or balls. Then, the information on the shape and size of the electronic component extracted from the image data and the information on the shape of the electronic component stored in advance in the storage unit 73 are respectively expressed as vectors, and the electronic component is recognized by taking the inner product. Determine if you can. Here, the vector expression can be set freely as appropriate.
The recognition of electronic components is not limited to the above-described vector expression, and various methods such as a method using cross-correlation can be used freely as appropriate.

When the electronic component can be recognized from all the image data (step S504: YES), the main calculation unit 76 stores the illumination level of the illumination 61 when the image that is the basis of the image data is captured in the storage unit 73. (Step S505).
When there is image data that cannot recognize the electronic component (step S504: NO), the main calculation unit 76 does not store the illumination level of the illumination 61 when the image that is the basis of the image data is captured, step S506. Move on to processing.

When the processing in steps S503 to S505 described above is performed for all the illumination levels (step S506: YES), the main calculation unit 76 calculates an intermediate value among the illumination levels stored in the storage unit 73 in step S505 as θ. The illumination level of the line sensor 6 is determined and recorded in the component data (step S508).
For example, an intermediate value between the highest illumination level and the lowest illumination level stored in the storage unit 73 in step S505 is determined as the illumination level of the θ-degree line sensor 6. Here, the highest illumination level means the illumination level with the highest illuminance, and the lowest illumination level means the illumination level with the lowest illuminance.
Note that the average of the illumination levels stored in the storage unit 73 in step S505 may be calculated, and the calculated value may be determined as the illumination level of the θ-degree line sensor 6.

  When there is an illumination level that has not been subjected to the processing in steps S503 to S505 described above (step S506: NO), the main calculation unit 76 does not use the illumination level yet in the processing in steps S503 to S505. (Step S507), and the process returns to step S503. In this way, the processing in steps S503 to S505 is performed for all illumination levels.

  As described above, according to the present embodiment, the electronic components actually mounted on the substrate are used, and the illumination 61 is turned on at each illumination level while changing the illumination level divided into a plurality of stages, and the electronic components are appropriately operated. It is possible to automatically set an appropriate illumination level of the illumination 61 when the electronic component is imaged by the θ-degree line sensor 6.

[Threshold setting operation of θ degree line sensor 6]
Next, the main calculation unit 76 sets a threshold value used when the image processing unit 72 performs image processing on the image of the designated electronic component captured by the θ-degree line sensor 6.
First, the main calculation unit 76 sets the illumination level to the illumination level set in step S508.

  Subsequently, the main calculation unit 76 controls the Y-axis servo motor 41b and the X-axis servo motor 42b via the axis control unit 71 to pass the head unit 44 over the θ-degree line sensor 6 and set the illumination. The illumination 61 is turned on at the level, and the lower surface of the electronic component is imaged by the θ-degree line sensor 6, and the captured image is caused to be image-processed three times by the image processing unit 72 with the same threshold value (step S509).

The main calculation unit 76 moves the head unit 44 that has attracted an electronic component for creating component data in the imaging direction and passes it over the optical axis 6 a of the θ-degree line sensor 6, and images the electronic component by the θ-degree line sensor 6. I do. This imaging is performed once at the set illumination level. The image captured by the θ-degree line sensor 6 is binarized by the image processing unit 72. The threshold value used for the binarization processing is, for example, a gradation value for every 10 gradations from 50 to 200 gradations when the captured image has 256 gradations. When performing the process of step S509 for the first time, the main calculating part 76 performs an image process with the threshold value with the smallest numerical value of a gradation, or a threshold value with the largest numerical value, for example.
The image processing unit 72 performs image processing three times with the same threshold value on the image captured by the θ degree line sensor 6 to generate three image data.
It should be noted that the gradation width used for the threshold value, the number of the gradation widths to be engraved, and the number of times image processing is performed with the same threshold value can be set as appropriate.

When the image data is generated, the main calculation unit 76 determines whether or not the electronic component can be recognized from all the generated image data (step S510). This recognition is performed by a method equivalent to the method described in the process of step S504 described above.
When the electronic component can be recognized from all the image data (step S510: YES), the main calculation unit 76 stores the threshold value used when generating the image data in the storage unit 73 (step S511).
If there is image data that cannot recognize the electronic component (step S510: NO), the main calculation unit 76 proceeds to the process of step S512 without storing the threshold value used when generating the image data.

When the processing of step S509 to step S511 described above is performed for all threshold values (step S512: YES), the main calculation unit 76 determines an intermediate value among the threshold values stored in the storage unit 73 in step S511. Is set as the threshold value of the θ-degree line sensor 6 and recorded in the component data (step S514).
For example, an intermediate value between the highest threshold value and the lowest threshold value stored in the storage unit 73 in step S511 is determined as the illumination level of the θ-degree line sensor 6. Here, the highest threshold value means the threshold value with the largest gradation value, and the lowest threshold value means the threshold value with the smallest gradation value.
Note that the average value of the threshold gradation values stored in the storage unit 73 in step S511 may be calculated, and the calculated value may be determined as the threshold value of the θ-degree line sensor 6.

  When there is a threshold value for which the processing in steps S509 to S511 described above is not performed (step S512: NO), the main calculation unit 76 does not use the threshold value in the processing in steps S509 to S511. The level is changed (step S513), and the process returns to step S509. In this way, the processing from step S509 to step S511 is performed for all threshold values.

  As described above, according to the present embodiment, electronic components that are actually mounted on a board are used, and image processing is performed at each threshold while changing the threshold divided into a plurality of stages, thereby appropriately performing electronic processing. By determining whether or not the component can be recognized, it is possible to automatically set an appropriate threshold value used when image processing is performed on the image of the electronic component captured by the θ-degree line sensor 6.

[Lighting level setting operation of 0 degree line sensor 5]
Next, the main calculation unit 76 sets the illumination level of the illumination 51 when the designated electronic component is imaged by the 0 degree line sensor 5.
First, the main calculation unit 76 sets a threshold value for performing image processing on an image captured by the 0 degree line sensor 5 to a default value (step S601). For this default value, for example, part data of an electronic part having a shape similar to that of the electronic part for which part data is created this time among electronic parts for which part data has been created in the past is used, or by the user via the input unit 75 An input value or the like can be used.

  When the default value is set, the main calculation unit 76 controls the Y-axis servo motor 41b, the X-axis servo motor 42b, and the R-axis servo motor 47 via the axis control unit 71, and the R-axis direction of the nozzle 46 every time. And the head unit 44 is passed through the 0 degree line sensor 3 three times, the illumination 51 is turned on at the same illumination level every time, and the lower surface of the electronic component is imaged by the 0 degree line sensor 5 (step S602). ).

FIG. 8 is a schematic diagram for explaining the operation of creating component data in the 0-degree line sensor 5. As shown in FIG. 8, the main calculation unit 76 moves the head unit 44 that has attracted the electronic component for creating the component data in the imaging direction to pass through the optical axis 5a of the 0 ° line sensor 5 to 0 An image of the electronic component is taken by the degree line sensor 5. Although this imaging is performed three times, the main calculation unit 76 moves the head unit 44 three times in the movement direction above the line sensor 5 (positive direction of the Z axis) as shown by an arrow in FIG. By reciprocating, it passes through the optical axis 5a of the 0 degree line sensor 5.
Here, if the angle in the R-axis direction of the nozzle 46 when the electronic component is picked up is 0 °, the main calculation unit 76 sets the R of the nozzle 46 before passing the head unit 44 over the line sensor 5 by 0 °. The angle in the axial direction is set to 0 °, + 5 °, or −5 °, and the line sensor 5 changes the angle every time an image is taken, and causes the line sensor 5 to take an image. As a result, it is possible to capture images of the lower surface of the electronic component irradiated with the illumination 51 from different angles in the R-axis direction.
The illumination level is obtained by dividing the brightness range of the illumination 51 appropriately into several stages, for example, eight stages. When performing the process of step 503 for the first time, the main calculating part 76 lights the illumination 51, for example with the brightest level or the darkest level.
It should be noted that the number of times the image is picked up by the 0 degree line sensor 5, the magnitude of the angle when changing the angle of the nozzle 46 in the R-axis direction, and the number of stages for dividing the illuminance of the illumination level are set as appropriate. be able to.

  When the image is captured by the 0-degree line sensor 5, the main calculation unit 76 causes the image processing unit 72 to perform image processing on the image with the threshold value set in S502, and from all the generated image data, It is determined whether or not the component can be recognized (step S603). This recognition is performed by a method equivalent to the method described in the process of step S504 described above.

When the electronic component can be recognized from all the image data (step S603: YES), the main calculation unit 76 stores the illumination level of the illumination 51 when the image that is the basis of the image data is captured in the storage unit 73. (Step S604).
If there is image data that cannot recognize the electronic component (step S603: NO), the main calculation unit 76 does not store the illumination level of the illumination 51 when the image that is the basis of the image data is captured, step S605. Move on to processing.

When the processes in steps S602 to S604 described above are performed for all the illumination levels (step S605: YES), the main calculation unit 76 sets the intermediate value among the illumination levels stored in the storage unit 73 in step S604 to 0. This is set as the illumination level of the line sensor 5 and recorded in the component data (step S607).
For example, an intermediate value between the highest illumination level and the lowest illumination level stored in the storage unit 73 in step S604 is determined as the illumination level of the 0 degree line sensor 5. Here, the highest illumination level means the illumination level with the highest illuminance, and the lowest illumination level means the illumination level with the lowest illuminance.
Note that the average of the illumination levels stored in the storage unit 73 in step S604 may be calculated, and the calculated value may be determined as the illumination level of the 0 degree line sensor 5.

  When there is an illumination level that has not been subjected to the processing of steps S602 to S604 described above (step S605: NO), the main calculation unit 76 does not use the illumination level yet in the processing of steps S602 to S604. (Step S606), and the process returns to step S602. In this way, the processes in steps S602 to S604 are performed for all illumination levels.

  As described above, according to the present embodiment, the electronic components that are actually mounted on the substrate are used, and the illumination 51 is turned on at each illumination level while changing the illumination level divided into a plurality of stages, and the electronic components are appropriately operated. It is possible to automatically set an appropriate illumination level of the illumination 51 when the electronic component is imaged by the 0 degree line sensor 5.

[0-degree line sensor 5 threshold setting operation]
Next, the main calculation unit 76 sets a threshold value used when the image processing unit 72 performs image processing on the image of the designated electronic component captured by the 0 degree line sensor 5.
First, the main calculation unit 76 sets the illumination level to the illumination level set in step S607.

  Subsequently, the main calculation unit 76 controls the Y-axis servo motor 41b and the X-axis servo motor 42b via the axis control unit 71 to pass the head unit 44 over the 0 degree line sensor 5 and set the illumination. The illumination 51 is turned on at the level, and the lower surface of the electronic component is imaged by the 0 degree line sensor 5, and this captured image is caused to be image-processed three times by the image processing unit 72 with the same threshold value (step S 608).

The main calculation unit 76 moves the head unit 44 that has attracted an electronic component for creating component data in the imaging direction to pass through the optical axis 5a of the 0 degree line sensor 5, and the 0 degree line sensor 5 images the electronic component. I do. This imaging is performed once at the set illumination level. The image captured by the 0 degree line sensor 5 is binarized by the image processing unit 72. The threshold value used for the binarization processing is, for example, a gradation value for every 10 gradations from 50 to 200 gradations when the captured image has 256 gradations. When performing the process of step S509 for the first time, the main calculating part 76 performs an image process with the threshold value with the smallest numerical value of a gradation, or a threshold value with the largest numerical value, for example.
The image processing unit 72 performs image processing three times with the same threshold value on the image captured by the 0 degree line sensor 5 to generate three image data.
It should be noted that the gradation width used for the threshold value, the number of the gradation widths to be engraved, and the number of times image processing is performed with the same threshold value can be set as appropriate.

When the image data is generated, the main calculation unit 76 determines whether or not the electronic component can be recognized from all the generated image data (step S609). This recognition is performed by a method equivalent to the method described in the process of step S504 described above.
If the electronic component can be recognized from all the image data (step S609: YES), the main calculation unit 76 stores the threshold value used when generating the image data in the storage unit 73 (step S610).
If there is image data that cannot recognize the electronic component (step S609: NO), the main calculation unit 76 proceeds to the process of step S611 without storing the threshold value used when generating the image data.

When the processing of step S608 to step S610 described above is performed for all threshold values (step S611: YES), main processing unit 76 determines an intermediate value among the threshold values stored in storage unit 73 in step S610. Is set as the threshold value of the 0-degree line sensor 5 and recorded in the component data (step S613).
For example, an intermediate value between the highest threshold value and the lowest threshold value stored in the storage unit 73 in step S610 is determined as the illumination level of the 0 degree line sensor 5. Here, the highest threshold value means the threshold value with the largest gradation value, and the lowest threshold value means the threshold value with the smallest gradation value.
Note that the average value of the threshold gradation values stored in the storage unit 73 in step S610 may be calculated, and the calculated value may be determined as the threshold value of the 0-degree line sensor 5.

  When there is a threshold value for which the processing in steps S608 to S610 described above is not performed (step S611: NO), the main calculation unit 76 does not use the threshold value in the processing in steps S608 to S610. The level is changed (step S612), and the process returns to step S608. In this way, the processing from step S608 to step S610 is performed for all threshold values.

  As described above, according to the present embodiment, electronic components that are actually mounted on a board are used, and image processing is performed at each threshold while changing the threshold divided into a plurality of stages, thereby appropriately performing electronic processing. By determining whether or not the component can be recognized, it is possible to automatically set an appropriate threshold value used when image processing of the electronic component image captured by the 0 degree line sensor 5 is performed.

  The illumination levels and threshold values of the 0-degree line sensor 5 and the θ-degree line sensor 6 set in steps S508, S514, S607, and S613 and stored in the storage unit 73 are the component data of the designated electronic component. Each of them is stored in the storage unit 72 in a state of being associated (step S614). When the component data of the designated electronic component is created in this way, the main calculation unit 76 performs the processes of steps S501 to S514 and S601 to S614 described above for all the electronic components mounted on the printed circuit board P. Thereby, the component data of all the electronic components transferred to the printed circuit board P by the surface mounter according to the present embodiment is completed. This component data is used in a recognition operation when a designated component is transferred in the surface mounter.

  As described above, according to the present embodiment, when setting each parameter of the component data such as the illumination level and the threshold divided into a plurality of steps, the actual electronic component is used and the step of each parameter is set. Since it is possible to set appropriate values for each parameter of the component data by determining whether or not the electronic component can be recognized for all stages while changing, appropriate component data is automatically created can do.

In addition, according to the present embodiment, since actual electronic components are used when creating component data, more appropriate component data can be created.
Furthermore, according to the present embodiment, by setting the illumination level while changing the angle of the nozzle 46 around the R-axis direction, it is possible to irradiate the electronic component with illumination from different angles. Even when the electronic component 46 is rotating in the R-axis direction when the electronic component is attracted, the image of the electronic component can be recognized properly. Therefore, a more appropriate illumination level can be set.

In the present embodiment, component data is created from the 0 degree line sensor 5, but component data may be created from the 0 degree line sensor 5.
In this embodiment, the threshold value is set after setting the illumination level. However, the illumination level may be set after setting the threshold value.

FIG. 10 shows a transfer device realized by the head mechanism 4 and the control device 7 of the surface mounter according to the present embodiment described above, and a method of creating component data of electronic components transferred by the transfer device. It can also be applied to an IC handler as shown. FIG. 10 is a plan view showing the configuration of the IC handler.
The IC handler 100 includes a base 101 having a substantially rectangular shape in plan view, a cassette installation mechanism 110 provided at a predetermined position on one side surface parallel to the X-axis direction of the base 101, and a Y axis on the base 101. A transfer mechanism 120 having a head 122 arranged to be movable in the Y-axis direction by a rail 121 extending in the direction and a pair of rails 131 and 132 extending in the X-axis direction so as to be movable in the X-axis direction. The head mechanism 130 having the installed head units 133 and 134, the collection unit 140 for collecting the electronic components, the imaging units 151 and 152 for imaging the electronic components transferred by the head mechanism, and the overall operation of the IC handler are controlled. And a control device (not shown).

  The cassette installation mechanism 110 is provided at a predetermined position on one side surface parallel to the X-axis direction of the base 101 and the cassette 111 storing the wafer Wa on which the electronic parts are diced in the upper and lower stages, and the cassette 111 is mounted. And a cassette installation unit 112. The cassette 111 is transported to a position below the opening 102 formed near the rail 121 of the base 101 by a transport mechanism (not shown).

The transport mechanism 120 is driven in the Y-axis direction along the Y axis direction on the base 101 and has one end disposed in the vicinity of the opening 102, and drives the Y axis direction along the rail 121 and sucks electronic components. And at least a component standby portion 123 that is disposed between the rails 131 and 132 near the other end of the rail 121 and stores electronic components.
The head 122 picks up an electronic component from the cassette 111 conveyed to a position below the opening 102 and places it on the component standby unit 123.

The head mechanism 130 corresponds to the head mechanism 4 in the surface mounter described above, and is along a pair of rails 131 and 132 extending on the base 101 at a predetermined distance and extending in the Y-axis direction, and the rails 131 and 132, respectively. And at least a pair of head units 133 and 134 that are driven. An inspection socket 103 is disposed between the rails 131 and 132 and on the base 101 near one end of the rails 131 and 132.
The head units 133 and 134 are provided with inspection heads 133a and 134a each provided with a nozzle for sucking an electronic component, arranged in a line in the X-axis direction. The heads 133a and 134a are moved in the Z-axis direction (direction perpendicular to the X-axis and Y-axis) and the central axis of the nozzle by the Z-axis servo motor and the R-axis servo motor, respectively. Rotation around (R axis) is possible.

  Such a head mechanism 130 picks up an electronic component housed in the component standby unit 123, conveys it to the inspection socket 103 on the base 101, and places it on the inspection socket 103. Further, the head mechanism 130 picks up an electronic component that is determined to be a non-defective product by the inspection socket 103, conveys it to the collection unit 140, and places it on the collection unit 140. Further, the head mechanism 130 picks up an electronic component determined to be defective by the inspection socket 103 from the inspection socket 103, and is defective between the rails 131 and 132 and provided between the component standby unit 123 and the inspection socket 103. Then, it is transported to the tray 104 and placed on the defective product tray 104. By performing these operations, the head mechanism 130 realizes a function as a transfer device.

  The collection unit 140 includes a storage unit 141 provided in the vicinity of the other ends of the rails 131 and 132, and a base tape 142 for a tape feeder that extends in the Y-axis direction and a part thereof is disposed on the storage unit 141. Have. The electronic components conveyed by the head units 133 and 134 are accommodated in the base tape 142, and a cover tape (not shown) is attached to the base tape 142.

  The imaging units 151 and 152 have the same configuration as the 0-degree line sensor 5 and the θ-degree line sensor 6 in the surface mounter described above, and are equipped with illuminations that illuminate the electronic components sucked by the head units 133 and 134, respectively. , Provided between the component standby unit 123 on the base 101 and the inspection socket 103, and the head units 133 and 134 that are attracted to the head units 133 and 134 by moving on the imaging units 151 and 152. The electronic component is imaged while illuminating the illumination.

  The control device has a configuration equivalent to that of the control device 7 in the surface mounter described above, and creates component data used during a recognition operation when a designated electronic component is transferred before performing the transfer operation.

  Even in such an IC handler 100, at least the illumination level of the imaging units 151 and 152 and the threshold value used in the image processing unit included in the control device are determined by the component data creation method described with reference to FIGS. The part data including the part is created, and the electronic part is transferred based on the part data. In this way, in the IC handler 100, by applying the component data creation method described above, it is possible to set appropriate values for each parameter of the component data, so that appropriate component data is automatically created. be able to.

It is a top view of the surface mounter concerning this embodiment. It is a side view of the surface mounting machine concerning this embodiment. It is a block diagram which shows the electric constitution of the surface mounter concerning this Embodiment. It is a side view of the 0 degree line sensor 5 and the 0 degree line sensor 5. It is a flowchart which shows the preparation operation | movement of the component data of the surface mounter concerning this Embodiment. It is a flowchart which shows the preparation operation | movement of the component data of the surface mounter concerning this Embodiment. FIG. 6 is a schematic diagram for explaining a component data creation operation in the θ-degree line sensor 6. FIG. 6 is a schematic diagram for explaining the operation of creating component data in the 0 degree line sensor. It is a top view which shows the structure of IC handler.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Conveyor, 3 ... Component supply part, 4 ... Head mechanism, 5 ... 0 degree line sensor, 5a ... Optical axis, 6 ... (theta) degree line sensor, 6a ... Optical axis, 7 ... Control apparatus, 41 ... rail, 41a, 42a ... ball screw, 41b ... Y-axis servo motor, 41c, 42c, 47a, 48a ... position detector, 42 ... support member, 42b ... X-axis servo motor, 43 ... guide, 44 ... head unit, 45 ... Head, 46 ... Nozzle, 47 ... Z-axis servo motor, 48 ... R-axis servo motor, 51 ... Illumination, 61 ... Illumination, 62 ... Mirror, 7 ... Control device, 71 ... Axis control unit, 72 ... Image processing unit , 73 ... Storage section, 74 ... Display section, 75 ... Input section, 76 ... Main calculation section, 81, 82, 83 ... Electronic components, 100 ... IC handler, 101 ... Base, 102 ... Opening section, 103 ... Inspection socket 104: Defective product Tray, 110 ... cassette setting mechanism, 111 ... cassette, 112 ... cassette setting unit, 120 ... transport mechanism, 121 ... rail, 122 ... head, 123 ... parts standby unit, 130 ... head mechanism, 131, 132 ... rail, 133 134: head unit, 133a, 134a: inspection head, 140: collection unit, 151, 152: imaging unit.

Claims (8)

A head having a nozzle for sucking parts;
A plurality of imaging means for imaging the component adsorbed by the nozzle;
A plurality of illumination means provided corresponding to these imaging means and illuminating the component at an illumination level set for a predetermined component;
An image processing means for processing an image picked up by the image pickup means using a threshold value and outputting image data;
Control means for controlling the driving of the head based on the image data;
Illumination level determination means for determining an illumination level for each of the illumination means, and
The illumination level determining means includes
Recognizing a predetermined component from image data obtained by processing an image of a component imaged at a predetermined illumination level by the imaging unit based on a predetermined threshold value, and recognizing the component at a plurality of different illumination levels The said transfer level is determined from a result. The transfer apparatus characterized by the above-mentioned. The transfer device according to claim 1, wherein the illumination level determination unit sets an intermediate value between the highest illumination level and the lowest illumination level when the illumination level is correctly recognized among a plurality of different illumination levels as the illumination level. . A head having a nozzle for sucking parts;
A plurality of imaging means for imaging the component adsorbed by the nozzle;
A plurality of illumination means provided corresponding to these imaging means and illuminating the component at an illumination level set for a predetermined component;
An image processing means for processing an image picked up by the image pickup means using a threshold value and outputting image data;
Control means for controlling the driving of the head based on the image data;
Threshold value determining means for determining the threshold value of the image processing means for each of the imaging means,
The threshold value determining means includes
A predetermined component is recognized from image data obtained by processing an image of a component captured at an arbitrary illumination level determined in advance by the imaging unit based on a predetermined threshold value, and the component at a plurality of different threshold values is recognized. The transfer device, wherein the threshold value is determined from a recognition result. The threshold value determination means uses the intermediate value between the highest threshold value and the lowest threshold value when correctly recognized among a plurality of different threshold values as the threshold value. The transfer apparatus described. Holding means for holding the substrate;
A surface mounting machine comprising: a transfer device that transfers a component at one position to a predetermined position on a substrate held by the holding means;
5. The surface mounter according to claim 1, wherein the transfer device is the transfer device according to claim 1. Inspection socket for inspecting parts,
An IC handler comprising: a transfer device for transferring a component at one position onto the inspection socket;
5. The IC handler according to claim 1, wherein the transfer device is the transfer device according to claim 1. A head having a nozzle for sucking parts;
A plurality of imaging means for imaging the component adsorbed by the nozzle;
Illumination means provided corresponding to these imaging means, and illuminating the component at an illumination level set for a predetermined component;
An image processing means for processing an image picked up by the image pickup means using a threshold value and outputting image data;
In a transfer apparatus comprising control means for controlling the driving of the head based on the image data,
An illumination level determination method for determining an illumination level for each of the illumination means,
Recognizing a predetermined part from image data obtained by processing an image of a part captured by the imaging unit at a predetermined illumination level based on a predetermined threshold value, and recognizing the part at a plurality of different illumination levels An illumination level determination method, wherein the illumination level is determined from a result. A head having a nozzle for sucking parts;
A plurality of imaging means for imaging the component adsorbed by the nozzle;
Illumination means provided corresponding to these imaging means, and illuminating the component at an illumination level set for a predetermined component;
An image processing means for processing an image picked up by the image pickup means using a threshold value and outputting image data;
In a transfer apparatus comprising control means for controlling the driving of the head based on the image data,
A threshold value determination method for determining the threshold value of the image processing means for each of the imaging means,
Recognizing a predetermined component from image data obtained by processing an image of a component imaged at an arbitrary threshold predetermined by the imaging unit based on the predetermined threshold, the component at a plurality of different thresholds The threshold value is determined from the recognition result of the threshold value.

Images