JP2005255438A - Molding die and its manufacturing method - Google Patents

Molding die and its manufacturing method Download PDF

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JP2005255438A
JP2005255438A JP2004067171A JP2004067171A JP2005255438A JP 2005255438 A JP2005255438 A JP 2005255438A JP 2004067171 A JP2004067171 A JP 2004067171A JP 2004067171 A JP2004067171 A JP 2004067171A JP 2005255438 A JP2005255438 A JP 2005255438A
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base material
processed layer
molding
layer
forming
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Kazuhiro Miyagawa
和裕 宮川
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding die in which the difference between the coefficient of linear expansion of a working layer and that of a base material is small and the strength of the base material is high and to provide a method for manufacturing the molding die. <P>SOLUTION: This method for manufacturing the molding die 1 used for press-forming a member comprises the steps of: forming a first working layer 20 by depositing an Ni film on the surface of the base material 10 consisting of SiC; heating the base material 10 and the first working layer 20 so that Ni constituting the first working layer 20 is diffused in SiC constituting the base material 10 and the compositional distribution near the interface between the base material 10 and the first working layer 20 is gradated; and forming a second working layer 40 by depositing an Ni-P film on the surface of the first working layer 20 and forming a molding surface 41 by cutting the surface of the second working layer 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はレンズ部材などをプレス成形するための成形用金型及びその製造方法に関し、より詳細には成形面が形成された加工層を母材表面に有する成形用金型及びその製造方法に関する。   The present invention relates to a molding die for press-molding a lens member or the like and a manufacturing method thereof, and more particularly to a molding die having a processed layer having a molding surface formed on a surface of a base material and a manufacturing method thereof.

従来、レンズ部材や回折格子などの光学部材は、表面に反転形状の成形面が形成された成形用金型を用いてプレス成形により製造することが一般的となっている。
このような成形用金型としては、例えば特許文献１に記載されているような、超硬合金や鋼材などからなる母材に対して、厚さ０．３ｍｍ程度のNi-P膜を成膜して加工層を形成し、このNi-Pからなる加工層に対してダイヤモンドバイトを用いて切削加工を行うことで成形面を形成した成形用金型がある。
特開平１１−１５７８５２号公報 Conventionally, an optical member such as a lens member or a diffraction grating is generally manufactured by press molding using a molding die having a molding surface with an inverted shape formed on the surface thereof.
As such a molding die, for example, a Ni-P film having a thickness of about 0.3 mm is formed on a base material made of cemented carbide or steel as described in Patent Document 1, for example. Then, there is a molding die in which a processed layer is formed, and a processed surface is formed by cutting the processed layer made of Ni-P using a diamond tool.
JP-A-11-157852

ところで、このような従来の成形用金型を用いてガラス製の光学部材を成形すると、成形用金型はガラスの成形温度である６００℃近くまで加熱され、成形後は室温近くまで冷却される。ここで母材が超硬合金の場合、Ni-Pと超硬合金との線膨張係数の差が大きいため、成形用金型を繰り返し使用すると、成形温度サイクルの繰り返しによってNi-Pからなる加工層に細かなクラックが発生し、それ以上成形が行なえなくなるという問題があった。
一方、母材が鋼材の場合、母材の強度が不十分であるため、成形用金型を繰り返し使用すると母材が微少変形してしまい、それ以上成形が行えなくなるという問題があった。 By the way, when a glass optical member is molded using such a conventional molding die, the molding die is heated to near 600 ° C., which is the glass molding temperature, and is cooled to near room temperature after molding. . Here, when the base material is cemented carbide, the difference in coefficient of linear expansion between Ni-P and cemented carbide is large. Therefore, if the molding die is used repeatedly, processing made of Ni-P by repeated molding temperature cycles There was a problem that fine cracks were generated in the layer and molding could not be performed any more.
On the other hand, when the base material is a steel material, the strength of the base material is insufficient. Therefore, when the molding die is repeatedly used, there is a problem that the base material is slightly deformed and further molding cannot be performed.

本発明は以上の問題点を鑑みてなされたものであり、加工層と母材との線膨張係数の差が小さく、かつ母材の強度が高い成形用金型及びその製造方法を提供することを目的とする。   The present invention has been made in view of the above problems, and provides a molding die having a small difference in linear expansion coefficient between a processed layer and a base material and a high strength of the base material, and a method for manufacturing the same. With the goal.

上記の課題を解決するため本発明に係る成形用金型の製造方法は、部材のプレス成形に用いる成形用金型の製造方法において、セラミックスからなる母材の表面にNi膜を成膜して加工層を形成する工程と、上記母材と上記加工層を加熱し、上記加工層を構成するNiを上記母材を構成するセラミックス内に拡散させて上記母材と上記加工層の界面近傍の組成分布を傾斜させる工程と、上記加工層の表面に切削加工を施して成形面を形成する工程とを有することを特徴として構成されている。   In order to solve the above problems, a method for manufacturing a molding die according to the present invention is a method for manufacturing a molding die used for press molding of a member, in which a Ni film is formed on the surface of a base material made of ceramics. Forming a processed layer; heating the base material and the processed layer; diffusing Ni constituting the processed layer into ceramics forming the base material; and in the vicinity of an interface between the base material and the processed layer. The method includes a step of inclining the composition distribution, and a step of cutting the surface of the processed layer to form a molding surface.

また本発明に係る成形用金型の製造方法は、部材のプレス成形に用いる成形用金型の製造方法において、セラミックスからなる母材の表面にNi膜を成膜して第一加工層を形成する工程と、上記母材と上記第一加工層を加熱し、上記第一加工層を構成するNiを上記母材を構成するセラミックス内に拡散させて上記母材と上記第一加工層の界面近傍の組成分布を傾斜させる工程と、上記第一加工層の表面にNi-P膜を成膜して第二加工層を形成し、該第二加工層の表面に切削加工を施して成形面を形成する工程とを有することを特徴として構成されている。   Further, the manufacturing method of the molding die according to the present invention is the manufacturing method of the molding die used for press molding of the member, and forms a first processed layer by forming a Ni film on the surface of the base material made of ceramics. And heating the base material and the first processed layer, and diffusing Ni constituting the first processed layer into the ceramic constituting the base material to interface the base material and the first processed layer. A step of inclining the composition distribution in the vicinity, a Ni-P film is formed on the surface of the first processed layer to form a second processed layer, and the surface of the second processed layer is cut to form a molding surface And a step of forming the structure.

さらに本発明に係る成形用金型の製造方法は、上記セラミックスはSiCであることを特徴として構成されている。   Furthermore, the method for manufacturing a molding die according to the present invention is characterized in that the ceramic is SiC.

また本発明に係る成形用金型は、母材の表面に薄膜状の加工層を有し、該加工層の表面に成形面を形成してなる成形用金型において、上記母材はセラミックスからなると共に、上記加工層はNiからなり、上記母材と上記加工層は加熱処理により該加工層を構成するNiが上記母材を構成するセラミックス内に拡散して上記母材と上記加工層の界面近傍において組成分布が傾斜してなることを特徴として構成されている。   The molding die according to the present invention is a molding die having a thin film-like processed layer on the surface of a base material, and a molding surface is formed on the surface of the processed layer. In addition, the processed layer is made of Ni, and the base material and the processed layer are diffused into the ceramics forming the base material by heat treatment so that Ni forming the processed layer diffuses into the ceramics forming the base material. The composition is characterized in that the composition distribution is inclined near the interface.

また本発明に係る成形用金型は、母材の表面に薄膜状の加工層を有し、該加工層の表面に成形面を形成してなる成形用金型において、上記母材はセラミックスからなり、上記加工層は上記母材表面に形成されるNiからなる第一加工層と、該第一加工層表面に形成されるNi-Pからなる第二加工層から構成され、上記母材と上記第一加工層は加熱処理により該第一加工層を構成するNiが上記母材を構成するセラミックス内に拡散して上記母材と上記第一加工層の界面近傍において組成分布が傾斜してなり、上記第二加工層は表面に上記成形面が形成されてなることを特徴として構成されている。   The molding die according to the present invention is a molding die having a thin film-like processed layer on the surface of a base material, and a molding surface is formed on the surface of the processed layer. The processed layer is composed of a first processed layer made of Ni formed on the surface of the base material and a second processed layer made of Ni-P formed on the surface of the first processed layer, and the base material In the first processed layer, Ni constituting the first processed layer diffuses into the ceramic forming the base material by heat treatment, and the composition distribution is inclined near the interface between the base material and the first processed layer. Thus, the second processed layer is characterized in that the molding surface is formed on the surface.

さらに本発明に係る成形用金型は、上記セラミックスはSiCであることを特徴として構成されている。   Furthermore, the molding die according to the present invention is characterized in that the ceramic is SiC.

本発明に係る成形用金型の製造方法によれば、SiCからなる母材の表面にNi膜を成膜して加工層を形成する工程と、母材と加工層を加熱してNiをSiC内に拡散させて母材と加工層の界面近傍の組成分布を傾斜させる工程と、加工層の表面に切削加工を施して成形面を形成する工程とを有することから、このようにして製造された成形用金型は母材の耐熱性、耐圧性が十分確保される。また母材から加工層にかけて線膨張係数が徐々に変化するので、成形加工時の加熱により加工層にクラックが入ることもない。   According to the method for manufacturing a molding die according to the present invention, a step of forming a Ni film on the surface of a base material made of SiC to form a processed layer, and heating the base material and the processed layer to convert Ni into SiC Produced in this way because it has a step of diffusing inwardly to incline the composition distribution in the vicinity of the interface between the base material and the processed layer and a step of cutting the surface of the processed layer to form a molding surface. In addition, the molding die ensures sufficient heat resistance and pressure resistance of the base material. Further, since the linear expansion coefficient gradually changes from the base material to the processed layer, the processed layer is not cracked by heating during the forming process.

また本発明に係る成形用金型の製造方法によれば、SiCからなる母材の表面にNi膜を成膜して第一加工層を形成する工程と、母材と第一加工層を加熱してNiをSiC内に拡散させて母材と第一加工層の界面近傍の組成分布を傾斜させる工程と、第一加工層の表面にNi-P膜を成膜して第二加工層を形成し、第二加工層の表面に切削加工を施して成形面を形成する工程とを有することから、このようにして製造された成形用金型は母材の耐熱性、耐圧性が十分確保される。また母材から第一加工層にかけて線膨張係数が徐々に変化するので、成形加工時の加熱により第一加工層にクラックが入ることもない。さらに、Ni-PはNiに比べて硬度が高く、バイトによる精密切削加工に適しているため、Ni-Pからなる第二加工層を第一加工層の表面に形成することで、より微細な形状の成形面を形成することが可能となる。   Further, according to the method for manufacturing a molding die according to the present invention, a step of forming a first processed layer by forming a Ni film on the surface of a base material made of SiC, and heating the base material and the first processed layer Then, Ni is diffused into the SiC to incline the composition distribution in the vicinity of the interface between the base material and the first processed layer, and a Ni-P film is formed on the surface of the first processed layer to form the second processed layer. And forming the molding surface by cutting the surface of the second working layer, the molding die manufactured in this way has sufficient heat resistance and pressure resistance of the base material. Is done. In addition, since the linear expansion coefficient gradually changes from the base material to the first processed layer, the first processed layer is not cracked by heating during the forming process. Furthermore, since Ni-P has a higher hardness than Ni and is suitable for precision cutting with a bite, forming a second machining layer made of Ni-P on the surface of the first machining layer makes it finer. It becomes possible to form a shaped molding surface.

以下、本発明の実施の形態について、図面を参照しつつ詳細に説明する。図１は本発明の実施形態における成形用金型の側面図、図２は本発明の実施形態における成形用金型の製造工程を示す図である。
本実施形態における成形用金型１は、ガラス製のレンズ部材のプレス成形に用いられるものであり、図１に示すように、母材１０、第一加工層２０、及び第二加工層４０からなる。
母材１０はセラミックス、具体的にはSiCに切削、研磨等の加工を施して所望の形状に形成されたものであり、図２ａに示すように端面１１が平面状に形成される。
第一加工層２０はこの母材１０の端面１１にNi膜を成膜して形成されたものである。そして、母材１０と第一加工層２０との界面近傍には、お互いの組成であるSiCとNiの組成分布が傾斜した組成傾斜部３０が形成されている。つまり、この組成傾斜部３０においては、母材１０側から第一加工層２０側に向けて、SiCからNiへ連続的に組成が変化している。
そして、第二加工層４０は第一加工層２０の表面にNi-P膜を成膜して形成されたものである。この第二加工層４０の表面には切削加工により成形面４１が形成されており、この成形面４１によりレンズ部材を成形する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view of a molding die in an embodiment of the present invention, and FIG. 2 is a diagram showing a manufacturing process of the molding die in an embodiment of the present invention.
The molding die 1 in this embodiment is used for press molding of a glass lens member. As shown in FIG. 1, from the base material 10, the first processed layer 20, and the second processed layer 40. Become.
The base material 10 is formed in a desired shape by cutting or polishing ceramics, specifically SiC, and the end surface 11 is formed in a flat shape as shown in FIG. 2a.
The first processed layer 20 is formed by forming a Ni film on the end surface 11 of the base material 10. In the vicinity of the interface between the base material 10 and the first processed layer 20, a composition gradient portion 30 in which the composition distribution of SiC and Ni, which are the compositions of each other, is slanted is formed. That is, in the composition gradient portion 30, the composition continuously changes from SiC to Ni from the base material 10 side toward the first processed layer 20 side.
The second processed layer 40 is formed by forming a Ni—P film on the surface of the first processed layer 20. A molding surface 41 is formed on the surface of the second processed layer 40 by cutting, and the lens member is molded by the molding surface 41.

このように、母材１０としてSiCを用いることで、耐熱性、耐圧性を十分確保できる。すなわち、SiCは共有結合性の最も強い化合物の一つであるので、熱的に極めて安定しており、また、ビッカース硬度が2800×10MN/m2、ヤング率が370×105MN/m2と十分な強度を持つため、鋼材の場合のように強度不足による成形加工時の不具合が発生しない。
また、NiをSiC内に拡散させて組成分布を傾斜させていることから、母材１０から第一加工層２０にかけて線膨張係数が徐々に変化するので、ガラス成形加工時の加熱により第一加工層２０にクラックが入ることもない。
なお、NiはSiCに対して非常に拡散しやすく、組成傾斜部３０を形成しやすいことから、第一加工層２０をNiにより形成することとしたが、第一加工層２０を他の金属材料により形成するようにしてもよい。 Thus, by using SiC as the base material 10, heat resistance and pressure resistance can be sufficiently secured. That is, since SiC is one of the strongest covalently bonded compounds, it is thermally extremely stable, and has a Vickers hardness of 2800 × 10MN / m 2 and a Young's modulus of 370 × 10 5 MN / m 2. Therefore, there is no problem during molding due to insufficient strength as in the case of steel.
In addition, since the composition distribution is inclined by diffusing Ni into SiC, the linear expansion coefficient gradually changes from the base material 10 to the first processed layer 20, so that the first processing is performed by heating during glass forming processing. The layer 20 is not cracked.
In addition, since Ni easily diffuses with respect to SiC and easily forms the composition gradient portion 30, the first processed layer 20 is formed of Ni, but the first processed layer 20 is made of another metal material. You may make it form by.

さらに、Niからなる第一加工層２０の表面にNi-Pからなる第二加工層４０を形成することで、より微細な形状の切削加工を可能している。すなわち、Ni-PはNiに比べて硬度が高く、バイトによる精密切削加工に適しているため、Ni-Pからなる第二加工層４０を第一加工層２０の表面に形成することで、第一加工層２０に切削加工を加える場合に比べ、より微細な形状の成形面４１を形成することが可能となる。また、Ni-PとNiは線膨張係数の差が小さいため、ガラス成形加工時の加熱によっても第一加工層２０、第二加工層４０にクラックが入ることもない。
ただし、Niも十分硬度は高く、切削加工性はよいので、成形面４１を微細な形状に形成する必要がなければ、第二加工層４０を形成せずに直接第一加工層２０に切削加工を施すようにしてもよい。 Further, by forming the second processed layer 40 made of Ni-P on the surface of the first processed layer 20 made of Ni, cutting with a finer shape is possible. That is, since Ni-P has a higher hardness than Ni and is suitable for precision cutting with a cutting tool, the second processed layer 40 made of Ni-P is formed on the surface of the first processed layer 20 to form the first processed layer 20. Compared with the case where cutting is applied to one processed layer 20, it is possible to form a molding surface 41 having a finer shape. Moreover, since the difference in linear expansion coefficient between Ni-P and Ni is small, the first processed layer 20 and the second processed layer 40 are not cracked by heating during glass forming.
However, since Ni is also sufficiently hard and has good machinability, if it is not necessary to form the molding surface 41 in a fine shape, the first machining layer 20 is directly cut without forming the second machining layer 40. May be applied.

次に、このような成形用金型１の製造方法について説明する。まず、SiCに切削、研磨等の加工を施して所望の形状に形成した母材１０を用意し、この母材１０の端面１１にNi膜を成膜して第一加工層２０を形成する(図２a）。
そして、母材１０と第一加工層２０を７００度以上に加熱する。これにより、第一加工層２０を構成するNiの熱運動が促進され、母材１０と第一加工層２０との界面近傍のNiが母材１０を構成するSiC内に拡散し、母材１０と第一加工層２０との界面近傍には母材１０側から第一加工層２０側に向けて、SiCからNiへ連続的に組成が変化する組成傾斜部３０が形成される（図２ｂ）。 Next, a method for manufacturing such a molding die 1 will be described. First, a base material 10 formed in a desired shape by cutting or polishing SiC is prepared, and a Ni film is formed on the end surface 11 of the base material 10 to form a first processed layer 20 ( Figure 2a).
And the base material 10 and the 1st process layer 20 are heated to 700 degree | times or more. Thereby, the thermal motion of Ni constituting the first processed layer 20 is promoted, Ni in the vicinity of the interface between the base material 10 and the first processed layer 20 diffuses into the SiC constituting the base material 10, and the base material 10. In the vicinity of the interface between the first processed layer 20 and the first processed layer 20, a composition gradient portion 30 whose composition continuously changes from SiC to Ni is formed from the base material 10 side toward the first processed layer 20 side (FIG. 2 b). .

次に、第一加工層２０の表面にNi-P膜を成膜して第二加工層４０を形成し(図２ｃ）、この第二加工層４０の表面に対してダイヤモンドバイト２により切削加工を施して成形面４１を形成し、図１に示す成形用金型１が完成する。
なお、ここでは第二加工層４０を形成してこの第二加工層４０に切削加工を施すこととしたが、上述したように、第二加工層４０を形成せずに第一加工層２０に直接切削加工を施すようにしてもよい。 Next, a Ni—P film is formed on the surface of the first processed layer 20 to form a second processed layer 40 (FIG. 2 c), and the surface of the second processed layer 40 is cut by the diamond cutting tool 2. To form the molding surface 41, and the molding die 1 shown in FIG. 1 is completed.
Here, the second processed layer 40 is formed and the second processed layer 40 is cut. However, as described above, the second processed layer 40 is not formed and the first processed layer 20 is formed. Direct cutting may be performed.

以上、本発明の実施形態について説明した。上記実施形態においてはガラス素材からなるレンズ部材を成形するための成形用金型を例に挙げて説明したが、本発明は特にこれに限られることなく、他の材料によりレンズ部材をプレス成形するための成形用金型についても広く適用可能である。また成形する部材についても、レンズ部材に限られず、回折格子など他の成形部材であってもよい。   The embodiment of the present invention has been described above. In the above embodiment, the molding die for molding a lens member made of a glass material has been described as an example. However, the present invention is not limited to this, and the lens member is press-molded with other materials. Therefore, the present invention can be widely applied to a mold for molding. Further, the member to be molded is not limited to the lens member, and may be another molded member such as a diffraction grating.

本発明の実施形態における成形用金型の側面図である。It is a side view of the metal mold | die in embodiment of this invention. 本発明の実施形態における成形用金型の製造工程を示す図である。It is a figure which shows the manufacturing process of the metal mold | die for embodiment in embodiment of this invention.

符号の説明Explanation of symbols

１ 成形用金型
２ ダイヤモンドバイト
１０ 母材
１１ 端面
２０ 第一加工層
３０ 組成傾斜部
４０ 第二加工層
４１ 成形面 DESCRIPTION OF SYMBOLS 1 Mold for shaping | molding 2 Diamond bit 10 Base material 11 End surface 20 1st process layer 30 Composition inclination part 40 2nd process layer 41 Molding surface

Claims (6)

部材のプレス成形に用いる成形用金型の製造方法において、
セラミックスからなる母材の表面にNi膜を成膜して加工層を形成する工程と、
上記母材と上記加工層を加熱し、上記加工層を構成するNiを上記母材を構成するセラミックス内に拡散させて上記母材と上記加工層の界面近傍の組成分布を傾斜させる工程と、
上記加工層の表面に切削加工を施して成形面を形成する工程とを有することを特徴とする金型の製造方法。 In the manufacturing method of the molding die used for press molding of the member,
Forming a Ni film on the surface of the base material made of ceramic to form a processed layer;
Heating the base material and the processing layer, diffusing Ni constituting the processing layer into ceramics constituting the base material, and inclining a composition distribution in the vicinity of the interface between the base material and the processing layer;
And a step of cutting the surface of the processed layer to form a molding surface. 部材のプレス成形に用いる成形用金型の製造方法において、
セラミックスからなる母材の表面にNi膜を成膜して第一加工層を形成する工程と、
上記母材と上記第一加工層を加熱し、上記第一加工層を構成するNiを上記母材を構成するセラミックス内に拡散させて上記母材と上記第一加工層の界面近傍の組成分布を傾斜させる工程と、
上記第一加工層の表面にNi-P膜を成膜して第二加工層を形成し、該第二加工層の表面に切削加工を施して成形面を形成する工程とを有することを特徴とする金型の製造方法。 In the manufacturing method of the molding die used for press molding of the member,
Forming a first processed layer by forming a Ni film on the surface of a base material made of ceramic;
Composition distribution in the vicinity of the interface between the base material and the first processed layer by heating the base material and the first processed layer and diffusing Ni constituting the first processed layer into the ceramic constituting the base material Tilting the
Forming a second processed layer by forming a Ni-P film on the surface of the first processed layer, and cutting the surface of the second processed layer to form a molding surface. A method for manufacturing a mold. 上記セラミックスはSiCであることを特徴とする請求項１または２記載の金型の製造方法。   3. The method for manufacturing a mold according to claim 1, wherein the ceramic is SiC. 母材の表面に薄膜状の加工層を有し、該加工層の表面に成形面を形成してなる成形用金型において、
上記母材はセラミックスからなると共に、上記加工層はNiからなり、
上記母材と上記加工層は加熱処理により該加工層を構成するNiが上記母材を構成するセラミックス内に拡散して上記母材と上記加工層の界面近傍において組成分布が傾斜してなることを特徴とする成形用金型。 In a molding die having a thin film-like processed layer on the surface of the base material and forming a molding surface on the surface of the processed layer,
The base material is made of ceramics, and the processed layer is made of Ni,
In the base material and the processed layer, Ni constituting the processed layer diffuses into the ceramic forming the base material by heat treatment, and the composition distribution is inclined in the vicinity of the interface between the base material and the processed layer. A mold for molding. 母材の表面に薄膜状の加工層を有し、該加工層の表面に成形面を形成してなる成形用金型において、
上記母材はセラミックスからなり、上記加工層は上記母材表面に形成されるNiからなる第一加工層と、該第一加工層表面に形成されるNi-Pからなる第二加工層から構成され、
上記母材と上記第一加工層は加熱処理により該第一加工層を構成するNiが上記母材を構成するセラミックス内に拡散して上記母材と上記第一加工層の界面近傍において組成分布が傾斜してなり、
上記第二加工層は表面に上記成形面が形成されてなることを特徴とする成形用金型。 In a molding die having a thin film-like processed layer on the surface of the base material and forming a molding surface on the surface of the processed layer,
The base material is made of ceramic, and the processing layer is composed of a first processing layer made of Ni formed on the surface of the base material and a second processing layer made of Ni-P formed on the surface of the first processing layer. And
In the base material and the first processed layer, Ni constituting the first processed layer is diffused in the ceramic forming the base material by heat treatment, and the composition distribution is near the interface between the base material and the first processed layer. Is inclined,
The molding die, wherein the molding surface is formed on a surface of the second processed layer. 上記セラミックスはSiCであることを特徴とする請求項４または５記載の成形用金型。 6. The molding die according to claim 4, wherein the ceramic is SiC.
JP2004067171A 2004-03-10 2004-03-10 Molding die and its manufacturing method Withdrawn JP2005255438A (en)

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