JP2005251886A - Manufacturing management system of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, when a cleaning treatment tank becomes impossible to use due to a maintenance or a trouble in a semiconductor cleaning device having a plurality of treatment tanks, an operator intervenes, selects a cleaning recipe which does not use its treatment tank, and must perform a cleaning treatment. <P>SOLUTION: The manufacturing management system of a semiconductor device includes a configuration of informing the state of a treatment tank to a factory CIM and transferring the cleaning treatment recipe which can be treated from the factory CIM to a washing device even if the treatment tank whose treatment becomes impossible to treat in the semiconductor cleaning device having a plurality of cleaning treatment tanks exists. The manufacture management system of the semiconductor device can continue a cleaning production treatment using the treatment tank which can be fully automatically treated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a system for managing a manufacturing process in manufacturing a semiconductor device.

  A conventional semiconductor cleaning method and semiconductor cleaning apparatus have a plurality of processing tanks, and a plurality of cleaning processes are performed by a single cleaning apparatus. However, there are still many operator interventions, and it can be said that the maintenance and trouble control of the apparatus is particularly insufficient. In other semiconductor manufacturing apparatuses, automation is being promoted using feedback control between the apparatus and a factory CIM (Computer Integrated Manufacturing) that manages the apparatus (for example, see Patent Document 1).

  An example of the above-described conventional semiconductor device manufacturing management system will be described with reference to the drawings. FIG. 5 is a diagram showing a configuration of a conventional semiconductor device manufacturing management system. In FIG. 5, the processing tank state detection means 31 detects the state of the processing tank. The processing tank state display means 32 displays a state change when there is a change in the state of the processing tank. The cleaning process recipe transfer means 34 transfers a cleaning recipe for executing the cleaning process. The semiconductor cleaning means 35 is for cleaning the semiconductor substrate. The semiconductor cleaning device 36 has a plurality of processing tanks for executing the semiconductor cleaning means 35. The factory CIM 37 manages semiconductor manufacturing apparatuses including the semiconductor cleaning apparatus 36. FIG. 6 is a flowchart of a conventional semiconductor device manufacturing management system.

  The operation of the semiconductor cleaning method and the semiconductor cleaning apparatus configured as described above will be described below with reference to FIGS.

  First, the processing tank state detection means 31 detects whether the state of the processing tank is changed by the semiconductor cleaning device 36 (step 41). If there is no change, the cleaning processing recipe transfer means 34 converts the scheduled cleaning recipe into the semiconductor cleaning device. 36 (step 45) and the semiconductor substrate is cleaned by the semiconductor cleaning means 35 (step 46).

Further, the processing tank state detection means 31 detects the processing tank state, and if there is a change, the processing tank state display means 32 displays the state change (step 42), and the operator 33 performs processing of the semiconductor cleaning device 36. The state of the tank is confirmed (step 43), and a cleaning processing recipe that matches the state of the processing tank is selected (step 44).
Japanese Patent Laid-Open No. 11-345752

  However, in the above-described configuration, in a semiconductor cleaning apparatus having a plurality of processing tanks, when the cleaning processing tank becomes unusable due to maintenance or trouble, an operator intervenes and a cleaning recipe that does not use the processing tank is used. There was a problem that the cleaning process had to be selected.

  In view of the above-described problems, the present invention performs a cleaning production process using a processing tank that can be processed automatically even when there is a processing tank that cannot be processed by a semiconductor cleaning apparatus having a plurality of cleaning processing tanks. A semiconductor cleaning method and a semiconductor cleaning apparatus that can be continued are provided.

  In order to solve the above-described problems, the semiconductor cleaning method and the semiconductor cleaning apparatus of the present invention have a processing tank that cannot be processed by a semiconductor cleaning apparatus having a plurality of cleaning processing tanks. The system is configured to notify the state and transfer a cleaning process recipe that can be processed from the factory CIM to the cleaning apparatus.

  As described above, the present invention is provided with means for detecting and notifying the state of the processing tank from the semiconductor cleaning apparatus to the factory CIM, and means for selecting and transferring a cleaning processing recipe according to the processing tank state from the factory CIM to the cleaning apparatus. Thus, even when there is a processing tank that cannot be processed by a semiconductor cleaning apparatus having a plurality of cleaning processing tanks, the cleaning production process can be continued using a processing tank that can be processed automatically.

(Embodiment 1)
A semiconductor device manufacturing management system according to a first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing a configuration of a semiconductor device manufacturing management system according to Embodiment 1 of the present invention. FIG. 2 is a flowchart of the semiconductor device manufacturing management system according to the first embodiment of the present invention.

  In FIG. 1, the processing tank state detection means 11 detects the state of a processing tank. The processing tank state display means 12 displays a state change when there is a change in the state of the processing tank. The processing tank state notification means 13 notifies the factory CIM of the state change of the processing tank. The cleaning process recipe selecting unit 14 selects a cleaning recipe according to the state of the processing tank notified from the processing tank state notifying unit 13. The cleaning process recipe transfer means 15 transfers a cleaning recipe for executing the cleaning process. The semiconductor cleaning means 16 is for cleaning the semiconductor substrate. The semiconductor cleaning device 17 has a plurality of processing tanks for executing the semiconductor cleaning means 16. The factory CIM 18 manages semiconductor manufacturing apparatuses including the semiconductor cleaning apparatus 17.

  The operation of the semiconductor cleaning method and semiconductor cleaning apparatus configured as described above will be described below with reference to FIGS.

  First, the processing tank state detecting means 11 detects whether the state of the processing tank is changed by the semiconductor cleaning device 17 (step 21). If there is no change, the cleaning processing recipe transfer means 15 converts the scheduled cleaning recipe into the semiconductor cleaning device. 17 (step 25), and the semiconductor substrate is cleaned by the semiconductor cleaning means 16 (step 26).

  Further, the processing tank state detection means 11 detects the processing tank state. If there is a change, the processing tank state display means 12 displays the state change (step 22), and the processing tank state notification means 13 displays the processing tank state. The state change is notified to the factory CIM (step 23), and the cleaning process recipe selection means 14 selects a cleaning process recipe that matches the processing tank state notified from the processing tank state notification means 13 (step 24).

(Embodiment 2)
FIG. 3 is a diagram showing the configuration of the semiconductor cleaning apparatus according to Embodiment 2 of the present invention. FIG. 4 is a diagram showing a procedure executed by the semiconductor cleaning apparatus in the second embodiment of the present invention.

  In FIG. 3, a semiconductor cleaning device 51 performs a cleaning process on a semiconductor substrate. The transport means 52 transports the semiconductor substrate 53 in the semiconductor cleaning apparatus 51. The processing tank 54 performs a cleaning process of the process A on the semiconductor substrate 53. The processing tank 55 performs the same processing A as the processing tank 54. The processing tank 56 performs the process B. The processing tank 57 executes the processing C. The device controller 58 controls the semiconductor cleaning device 51. The processing tank state detecting means 59 is in the apparatus controller 58 and detects the state of the processing tank 54 to the processing tank 57. The processing tank state display means 60 displays a state change when there is a change in the state of the processing tank 54 to the processing tank 57. The processing tank state notification means 61 notifies the factory CIM of a change in the state of the processing tank 57 from the processing tank 54. The factory CIM 62 manages semiconductor manufacturing apparatuses including the semiconductor cleaning apparatus 51. The cleaning process recipe selecting means 63 is located in the factory CIM 62 and selects a cleaning recipe according to the state of the processing tank notified from the processing tank state notifying means 61. The cleaning process recipe transfer means 64 transfers a cleaning recipe for executing the cleaning process. The LAN 65 enables communication between the semiconductor cleaning device 51 and the factory CIM 62.

  FIG. 6 is a recipe showing a procedure for performing a cleaning process in the semiconductor cleaning apparatus of the present invention. In FIG. 6, the recipe 71 executes process A for 30 minutes in the process tank 54, then executes process A for 30 minutes in the process tank 55, and then executes process B for 10 minutes in the process tank 56. Next, the process C is performed in the process tank 57 for 10 minutes. In the recipe 72, the process A is performed for 60 minutes in the process tank 54, the process B is performed for 10 minutes in the process tank 56, and then the process C is performed for 10 minutes in the process tank 57. The recipe 73 is to execute the process A in the processing tank 55 for 60 minutes, then execute the process B in the processing tank 56 for 10 minutes, and then execute the process C in the processing tank 57 for 10 minutes. The recipe 71, the recipe 72, and the recipe 73 are the same in the effect of processing the semiconductor substrate except that the time of the process A is different.

  The operation of the semiconductor cleaning apparatus configured as described above will be described below with reference to FIGS.

  First, the processing tank state detection means 59 detects whether there is any change in the state of the processing tanks 54 to 57, and if there is no change, the cleaning process recipe transfer means 64 transfers the recipe 71 to the semiconductor cleaning device 51, and the semiconductor. The semiconductor substrate 53 is cleaned by the procedure of the recipe 71 for the substrate.

  Next, the processing tank state detection means 59 detects whether there is any change in the state of the processing tanks 54 to 57, and if there is a change that the processing tank 54 is under maintenance, the processing tank state display means 60 detects the processing tank. 54 indicates that maintenance is in progress, and the state change of the processing tank 54 is notified to the factory CIM 62 through the LAN 65 by the processing tank state notification means 61. In accordance with the state in which the processing tank 54 notified from the processing tank state notifying unit 61 is under maintenance by the cleaning processing recipe selecting unit 63, the recipe 73 for executing the process A only in the processing tank 55 is selected, and the cleaning process is performed. The recipe transfer means 64 transfers the recipe 73 to the semiconductor cleaning device 51, and the semiconductor substrate 53 is cleaned by the procedure of the recipe 73.

  Next, the processing tank state detection means 59 detects whether there is any change in the state of the processing tanks 54 to 57, and if there is a change that the processing tank 55 is in trouble, the processing tank state display means 60 detects the processing tank. 55 indicates that a trouble is occurring, and the processing tank state notification means 61 notifies the factory CIM 62 of the state change of the processing tank 55 through the LAN 65. In accordance with the state in which the processing tank 55 notified from the processing tank state notifying unit 61 is in trouble by the cleaning process recipe selecting unit 63, the recipe 72 for executing the process A only in the processing tank 54 is selected, and the cleaning process is performed. The recipe 72 is transferred to the semiconductor cleaning device 51 by the recipe transfer means 64, and the semiconductor substrate 53 is cleaned by the procedure of the recipe 72.

  As described above, according to the present embodiment, when there is a processing bath that cannot be processed by the semiconductor cleaning apparatus having a plurality of cleaning processing baths by providing the processing bath state notifying unit and the cleaning processing recipe selecting unit. However, the cleaning production process can be continued using a fully automatic processing tank.

  In addition to the cleaning treatment tank, the present invention can also be applied to a cassette loader unit, a substrate heating unit, a substrate cooling unit, and a rotary drying unit having a plurality of processing units. Further, the present invention can be applied to a semiconductor substrate manufacturing apparatus other than a semiconductor cleaning apparatus, such as a chemical solution coating unit in a coating exposure developing machine, a developing unit, and a film forming unit in a CVD apparatus.

  The semiconductor cleaning method and the semiconductor cleaning apparatus of the present invention select and transfer means for detecting and notifying the state of the processing tank from the semiconductor cleaning apparatus to the factory CIM, and the cleaning processing recipe according to the processing tank state from the factory CIM to the cleaning apparatus. And is useful as a semiconductor cleaning method and a semiconductor cleaning apparatus in a substrate cleaning process in semiconductor manufacturing. Also, it can be applied to uses such as liquid crystal panel substrate cleaning.

The figure which shows the structure of the manufacturing management system of the semiconductor device in Embodiment 1 of this invention. Flowchart of semiconductor device manufacturing management system in Embodiment 1 of the present invention The figure which shows the structure of the semiconductor cleaning apparatus in Embodiment 2 of this invention. The figure which shows the procedure performed with the semiconductor cleaning apparatus in Embodiment 2 of this invention. The figure which shows the structure of the manufacturing management system of the conventional semiconductor device Conventional semiconductor device manufacturing management system flowchart

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Processing tank state detection means 12 Processing tank state display means 13 Processing tank state notification means 14 Cleaning process recipe selection means 15 Cleaning process recipe transfer means 16 Semiconductor cleaning means 17 Semiconductor cleaning apparatus 18 Factory CIM
DESCRIPTION OF SYMBOLS 51 Semiconductor cleaning apparatus 52 Conveyance means 53 Semiconductor substrate 54 Processing tank 55 Processing tank 56 Processing tank 57 Processing tank 58 Apparatus controller 59 Processing tank state detection means 60 Processing tank state display means 61 Processing tank state notification means 62 Factory CIM
63 Cleaning process recipe selection means 64 Cleaning process recipe transfer means 65 LAN

Claims (2)

Processing unit state detection means for detecting the state of the processing unit of the semiconductor manufacturing apparatus;
Processing unit status display means for displaying a status change of the processing unit;
Processing unit status notification means for notifying the factory CIM of the status change of the processing unit;
A processing recipe selecting means for selecting a processing recipe in accordance with the notified state change of the processing unit;
A semiconductor device manufacturing management system comprising processing recipe transfer means for transferring the selected processing recipe to a semiconductor manufacturing apparatus. 2. The semiconductor device manufacturing management system according to claim 1, wherein the semiconductor manufacturing apparatus includes a plurality of processing units capable of performing desired processing.

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