JP2007273791A - Substrate processing apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method capable of preventing the occurrence of downtime in replacing chemicals in a reservoir tank, and maintaining the temperature of a chemical to be supplied to a substrate at a constant exact time. <P>SOLUTION: The substrate processing apparatus 100 includes the chemical reservoir tanks TA, TB. Chemical processing for the substrate W in cleaning processing units 5a-5d is executed using the chemical in the chemical reservoir TB when the chemical in the chemical reservoir tank TA is replaced, and chemical processing for the substrate W in cleaning processing units 5a-5d is executed using the chemical in the chemical reservoir TA when the chemical in the chemical reservoir tank TB is replaced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate.

  2. Description of the Related Art Conventionally, a substrate processing apparatus has been used to perform various processes on a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a glass substrate for an optical disk.

  2. Description of the Related Art Generally, a substrate processing apparatus that processes a substrate using a chemical solution is provided with a storage tank for storing the chemical solution and a temperature adjustment mechanism that adjusts the temperature of the chemical solution. When processing a substrate, a chemical is supplied from the storage tank to the processing unit through a temperature control mechanism. The chemical used for processing the substrate is discarded or collected. The processing liquid collected from the processing unit is returned again to the storage tank and reused for processing the substrate.

  However, if the chemical solution is repeatedly reused over a long period of time, the chemical solution in the storage tank deteriorates due to contamination of impurities. Therefore, it is necessary to exchange the chemical | medical solution in a storage tank regularly. In that case, a down time for temporarily interrupting the processing of the substrate occurs. Thereby, the throughput decreases.

  In order to prevent the occurrence of such downtime, two storage tanks are provided, and the connection of the storage tank to the processing unit is switched alternately. In this case, it is possible to prevent a decrease in throughput by supplying the chemical liquid from the other storage tank to the processing unit during the period of exchanging the chemical liquid in one storage tank.

For example, Patent Document 1 describes a substrate processing apparatus including a first preliminary tank for storing a processing liquid, a second preliminary tank for storing a processing liquid, a first temperature control mechanism, and a second temperature control mechanism.
JP 2002-75946 A

  In the substrate processing apparatus described in Patent Document 1, when the processing liquid is supplied from the first preliminary tank to the processing tank (processing unit) through the first temperature control mechanism, the processing liquid in the second preliminary tank is replaced. be able to. Conversely, when the processing liquid is supplied from the second preliminary tank to the processing tank through the second temperature control mechanism, the processing liquid in the second preliminary tank can be replaced.

  Here, in a substrate processing apparatus that processes a substrate using a chemical solution, it is necessary to keep the temperature of the chemical solution supplied to the substrate constant in order to prevent variations in substrate processing accuracy.

  However, as described above, when the chemical solution is selectively supplied from a plurality of sets of storage tanks and temperature control mechanisms, the temperature of the chemical solution supplied to the substrate is accurately and constant due to variations in the characteristics of the individual temperature control mechanisms. Difficult to keep. For this reason, it is impossible to reliably prevent variations in processing accuracy of the substrate.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of preventing the occurrence of downtime during replacement of a chemical solution in a storage tank and maintaining the temperature of the chemical solution supplied to the substrate accurately and constant. It is to be.

  (1) A substrate processing apparatus according to a first aspect of the present invention is a processing unit that performs processing using a processing liquid on a substrate, a first storage tank for storing the processing liquid, and a first storage tank for storing the processing liquid. 2 storage tanks, a first temperature adjusting means for adjusting the temperature of the processing liquid, a second temperature adjusting means for adjusting the temperature of the processing liquid, the processing section, the first and second storage tanks, and the first And a processing liquid path forming means for forming a processing liquid path between the second temperature control means, and the processing liquid path forming means is configured to perform the processing at the time of processing of the processing section during operation of the first storage tank. The first storage tank, the first temperature adjustment means, and the first circulation path for circulating the processing liquid in the processing unit are formed, and the second storage tank and the second temperature adjustment means are operated when the first storage tank is in operation. A second circulation path that circulates the treatment liquid in the second storage tank, the first storage tank during the processing of the processing unit during operation of the second storage tank, A fourth circulation path is formed to circulate the processing liquid in the temperature control means and the processing unit, and the processing liquid is circulated through the first storage tank and the second temperature control means during operation of the second storage tank. This forms a circulation path.

  In the substrate processing apparatus according to the first aspect of the present invention, the processing using the processing liquid is performed on the substrate in the processing unit. The processing liquid used for processing the substrate is stored in the first and second storage tanks. Further, the temperature of the processing liquid is adjusted by the first and second temperature control means.

  During processing of the processing unit during operation of the first storage tank, the processing liquid path forming unit forms a first circulation path for circulating the processing liquid to the first storage tank, the first temperature control unit, and the processing unit. Is done. Further, when the first storage tank is in operation, the processing liquid path forming means forms a second circulation path for circulating the processing liquid to the second storage tank and the second temperature control means.

  During processing of the processing unit during operation of the second storage tank, a third circulation path for circulating the processing liquid to the second storage tank, the first temperature control means, and the processing unit is formed by the processing liquid path forming unit. Is done. In addition, during operation of the second storage tank, a fourth circulation path for circulating the processing liquid to the first storage tank and the second temperature control means is formed by the processing liquid path forming means.

  In this way, different circulation paths are formed by the processing liquid path forming means when the first storage tank is in operation and when the second storage tank is in operation. Therefore, when the first storage tank is in operation, the processing liquid in the first storage tank is supplied to the processing unit, and the processing liquid in the second storage tank is not supplied to the processing unit. Further, when the second storage tank is in operation, the processing liquid in the first storage tank is not supplied to the processing unit, and the processing liquid in the second storage tank is supplied to the processing unit.

  In this case, the processing liquid in the second storage tank is exchanged when the first storage tank is in operation, and the processing liquid in the first storage tank is exchanged when the second storage tank is in operation. Occurrence of downtime at the time of replacement can be prevented. Thereby, throughput can be improved.

  Further, during the operation of the first storage tank and the operation of the second storage tank, the temperature of the processing liquid used for processing the substrate in the processing unit is adjusted by the common first temperature control means.

  In this case, since a temperature difference due to variations in the characteristics of the temperature control means does not occur, the processing liquid used for substrate processing is accurately and constant during the operation of the first storage tank and the second storage tank. Can be adjusted to temperature. Thereby, the dispersion | variation in the processing precision of a board | substrate can be prevented reliably.

  Further, when the first storage tank is in operation, the processing liquid in the second storage tank is circulated through the second circulation path, and when the second storage tank is in operation, the processing liquid in the first storage tank is circulated in the fourth circulation path. Circulated through the path.

  In this case, the temperature of the processing liquid in the storage tank that is not operating is adjusted by the second temperature adjusting means. Therefore, by setting the temperature adjusted by the second temperature adjusting means equal to the temperature adjusted by the first temperature adjusting means, the temperature of the processing liquid in the operating storage tank is not operating. The temperature of the processing liquid in the storage tank can be made equal.

  Thereby, it shifted from the state at the time of operation of the 1st storage tank to the state at the time of operation of the 2nd storage tank, or the state at the time of operation of the 2nd storage tank to the state at the time of operation of the 1st storage tank. Immediately after that, the temperature of the processing liquid used for processing the substrate can be quickly and easily adjusted to a predetermined temperature by the first temperature control means.

  (2) The processing liquid path forming means forms a fifth circulation path that circulates the processing liquid to the first storage tank and the first temperature control means during standby of the processing unit during operation of the first storage tank. And the 6th circulation path which circulates a process liquid to the 2nd storage tank and the 1st temperature control means may be formed at the time of waiting of a treating part at the time of operation of the 2nd storage tank.

  In this case, the processing liquid in the first storage tank is maintained at a predetermined temperature by the first temperature control means during standby of the processing unit during operation of the first storage tank. Further, during the standby of the processing unit during operation of the second storage tank, the processing liquid in the second storage tank is maintained at a predetermined temperature by the first temperature control means.

  Thereby, the processing liquid adjusted to a predetermined temperature can be supplied to the substrate at an arbitrary timing.

  (3) The processing liquid path forming unit includes a first path switching unit that selectively guides the processing liquid from either one of the first storage tank and the second storage tank to the first temperature control unit, and a processing unit. Second path switching means for selectively returning the processing liquid to any one of the first storage tank and the second storage tank, and the first storage tank and the second storage tank from the first temperature control means A third path switching unit that selectively guides the processing liquid to either one of the first storage tank and the second storage tank, and selectively guides the processing liquid to the second temperature control unit. A fourth path switching means, a fifth path switching means for selectively guiding the processing liquid from the second temperature adjusting means to either the first storage tank or the second storage tank, and the first and second Control means for controlling the second, third, fourth and fifth path switching means, wherein the control means is a process during operation of the first storage tank. The first and second path switching means are set so that the first circulation path is formed during the processing of the first section, and the fifth circulation path is set during the standby of the processing section during the operation of the first storage tank. The third path switching means is set so as to be formed, and the fourth and fifth path switching means are set so that the second circulation path is formed when the first storage tank is in operation. The first and second path switching means are set so that the third circulation path is formed during processing of the processing section when the storage tank is in operation, and the processing section waits during operation of the second storage tank. Sometimes, the third path switching means is set so that the sixth circulation path is formed, and the fourth and fifth paths are formed so that the fourth circulation path is formed when the second storage tank is operated. Switching means may be set.

  In this case, the first and second path switching means are set so that the first circulation path is formed during processing of the processing unit during operation of the first storage tank. The third path switching means is set so that the fifth circulation path is formed during standby of the processing unit during operation of the first storage tank. During the operation of the first storage tank, the fourth and fifth path switching means are set so that the second circulation path is formed.

  At the time of processing of the processing unit during operation of the second storage tank, the first and second path switching means are set so that the third circulation path is formed, and processing during operation of the second storage tank The third path switching means is set so that the sixth circulation path is formed during the standby of the unit. During the operation of the second storage tank, the fourth and fifth path switching means are set so that the fourth circulation path is formed.

  As described above, the first, second, third, fourth, and fifth path switching means are controlled by the control means, so that the processing unit is processing and waiting during operation of the first storage tank, and Different circulation paths are formed during processing and operation of the processing section during operation of the second storage tank.

  Therefore, when the first storage tank is in operation, the processing liquid in the first storage tank is supplied to the processing unit, and the processing liquid in the second storage tank is not supplied to the processing unit. Further, when the second storage tank is in operation, the processing liquid in the first storage tank is not supplied to the processing unit, and the processing liquid in the second storage tank is supplied to the processing unit.

  In this case, the processing liquid in the second storage tank is exchanged when the first storage tank is in operation, and the processing liquid in the first storage tank is exchanged when the second storage tank is in operation. Occurrence of downtime during replacement is prevented. Thereby, the throughput is improved.

  Further, during the operation of the first storage tank and the operation of the second storage tank, the temperature of the processing liquid used for processing the substrate in the processing unit is adjusted by the common first temperature control means.

  In this case, the processing liquid used for processing the substrate in the processing unit can be accurately adjusted to a constant temperature when the first storage tank is in operation and when the second storage tank is in operation. Therefore, variations in substrate processing accuracy can be reliably prevented.

  Further, when the first storage tank is in operation, the processing liquid in the second storage tank is circulated through the second circulation path, and when the second storage tank is in operation, the processing liquid in the first storage tank is circulated in the fourth circulation path. Circulated through the path.

  In this case, the temperature of the processing liquid in the storage tank that is not operating is adjusted by the second temperature adjusting means. Therefore, by setting the temperature adjusted by the second temperature adjusting means equal to the temperature adjusted by the first temperature adjusting means, the temperature of the processing liquid in the operating storage tank is not operating. The temperature of the processing liquid in the storage tank can be made equal.

  Thereby, it shifted from the state at the time of operation of the 1st storage tank to the state at the time of operation of the 2nd storage tank, or the state at the time of operation of the 2nd storage tank to the state at the time of operation of the 1st storage tank. Immediately after that, the temperature of the processing liquid used for processing the substrate can be quickly and easily adjusted to a predetermined temperature by the first temperature control means.

  Further, during the standby of the processing unit during the operation of the first storage tank, the processing liquid in the first storage tank is maintained at a predetermined temperature by the first temperature control means, and during the operation of the second storage tank. During the standby of the processing unit, the processing liquid in the second storage tank is maintained at a predetermined temperature by the first temperature adjusting means.

  Thereby, the processing liquid adjusted to a predetermined temperature can be supplied to the substrate at an arbitrary timing.

  (4) The substrate processing apparatus includes a first detector that detects the replacement timing of the processing liquid in the first storage tank, and a second detector that detects the replacement timing of the processing liquid in the second storage tank. And the control means controls the first, second, third, fourth and fifth path switching means based on the detection results from the first detector and the second detector. Also good.

  In this case, the first, second, third, fourth and fifth paths are based on the replacement timing of the processing liquid in the first and second storage tanks detected by the first and second detectors. The switching means is controlled. Thereby, the transition from the operating state of the first storage tank to the operating state of the second storage tank, or from the operating state of the second storage tank to the operating state of the first storage tank. Can be performed automatically and smoothly.

  (5) The second temperature adjusting means may include a temperature controller common to the first and second storage tanks.

  In this case, the temperature of the processing liquid in the second storage tank during operation of the first storage tank and the temperature of the processing liquid in the first storage tank during operation of the second storage tank are accurately constant. Maintained at a temperature of

  Therefore, when the state of the first storage tank is changed from the state when the second storage tank is operated, or when the state of the second storage tank is changed to the state when the first storage tank is operated, the first It becomes easier to accurately adjust the processing liquid supplied from the storage tank or the second storage tank to the processing unit to a predetermined temperature.

  (6) The second temperature adjustment means includes a first temperature controller corresponding to the first storage tank and a second temperature controller corresponding to the second storage tank, and the second circulation path. Circulates the treatment liquid to the second storage tank and the second temperature controller when the first storage tank is in operation, and the fourth circulation path is the first storage tank when the second storage tank is in operation. The treatment liquid may be circulated through the tank and the first temperature controller.

  In this case, the arrangement and design of the treatment liquid supply system are provided by independently providing the first temperature controller corresponding to the first storage tank and the second temperature controller corresponding to the second storage tank. The degree of freedom is improved.

  (7) A substrate processing method according to a second aspect of the present invention includes a processing unit that performs processing using a processing liquid on a substrate, first and second storage tanks for storing the processing liquid, and the temperature of the processing liquid. A substrate processing method using first and second temperature control means for adjusting, wherein the first storage tank, the first temperature control means, and the first processing tank during processing of the processing unit during operation of the first storage tank A step of circulating the treatment liquid to the processing unit, a step of circulating the treatment liquid to the second storage tank and the second temperature control means during operation of the first storage tank, and a time of operation of the second storage tank A step of circulating the treatment liquid through the second storage tank, the first temperature control means and the processing section during the processing of the processing section; and a first storage tank and a second temperature control during operation of the second storage tank. And a step of circulating the treatment liquid through the means.

  In the substrate processing method according to the second aspect of the present invention, the processing liquid is circulated through the first storage tank, the first temperature control means, and the processing section during processing of the processing section during operation of the first storage tank. When the first storage tank is in operation, the processing liquid is circulated through the second storage tank and the second temperature control means.

  Further, during the processing of the processing unit during operation of the second storage tank, the processing liquid is circulated through the second storage tank, the first temperature control means, and the processing unit. When the second storage tank is in operation, the treatment liquid is circulated through the first storage tank and the second temperature control means.

  Thus, when the first storage tank is in operation, the processing liquid in the first storage tank is supplied to the processing section, and the processing liquid in the second storage tank is not supplied to the processing section. Further, when the second storage tank is in operation, the processing liquid in the first storage tank is not supplied to the processing unit, and the processing liquid in the second storage tank is supplied to the processing unit.

  In this case, the processing liquid in the second storage tank is exchanged when the first storage tank is in operation, and the processing liquid in the first storage tank is exchanged when the second storage tank is in operation. Occurrence of downtime at the time of replacement can be prevented. Thereby, throughput can be improved.

  Further, during the operation of the first storage tank and the operation of the second storage tank, the temperature of the processing liquid used for processing the substrate in the processing unit is adjusted by the common first temperature control means.

  In this case, since a temperature difference due to variations in the characteristics of the temperature control means does not occur, the processing liquid used for substrate processing is accurately and constant during the operation of the first storage tank and the second storage tank. Can be adjusted to temperature. Thereby, the dispersion | variation in the processing precision of a board | substrate can be prevented reliably.

  Further, when the first storage tank is in operation, the processing liquid in the second storage tank is circulated through the second circulation path, and when the second storage tank is in operation, the processing liquid in the first storage tank is circulated in the fourth circulation path. Circulated through the path.

  In this case, the temperature of the processing liquid in the storage tank that is not operating is adjusted by the second temperature adjusting means. Therefore, by setting the temperature adjusted by the second temperature adjusting means equal to the temperature adjusted by the first temperature adjusting means, the temperature of the processing liquid in the operating storage tank is not operating. The temperature of the processing liquid in the storage tank can be made equal.

  Thereby, it shifted from the state at the time of operation of the 1st storage tank to the state at the time of operation of the 2nd storage tank, or the state at the time of operation of the 2nd storage tank to the state at the time of operation of the 1st storage tank. Immediately after that, the temperature of the processing liquid used for processing the substrate can be quickly and easily adjusted to a predetermined temperature by the first temperature control means.

  According to the present invention, it is possible to prevent the occurrence of downtime at the time of replacement of the processing liquid, and it is possible to accurately adjust the processing liquid used for processing the substrate to a constant temperature.

  Hereinafter, a substrate processing method and a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  The chemical solution is, for example, an aqueous solution such as BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia, or a mixed solution thereof. Say.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 has processing areas A and B, and a transfer area C between the processing areas A and B.

  In the processing region A, a control unit 4, fluid box units 2a and 2b, and cleaning processing units 5a and 5b are arranged.

  1 are pipes, joints, valves, flow meters, regulators, pumps for supplying chemicals and rinse liquids to the cleaning processing units 5a and 5b and for waste liquids from the cleaning processing units 5a and 5b, respectively. Houses fluid-related equipment such as temperature controllers and processing liquid storage tanks.

  In the cleaning processing units 5a and 5b, a cleaning process using a chemical solution (hereinafter referred to as a chemical process) and a cleaning process using a rinse liquid (hereinafter referred to as a rinse process) are performed.

  In the processing region B, fluid box portions 2c and 2d and cleaning processing portions 5c and 5d are arranged. Each of the fluid box portions 2c and 2d and the cleaning processing portions 5c and 5d has the same configuration as the fluid box portions 2a and 2b and the cleaning processing portions 5a and 5b, and the cleaning processing portions 5c and 5d are the cleaning processing portion 5a. , 5b.

  Hereinafter, the cleaning processing units 5a, 5b, 5c, and 5d are collectively referred to as processing units. In the transfer area C, a substrate transfer robot CR is provided.

  An indexer ID for carrying in and out the substrate W is arranged on one end side of the processing areas A and B, and the indexer robot IR is provided inside the indexer ID. The carrier 1 that stores the substrate W is placed on the indexer ID. In the present embodiment, a FOUP (Front Opening Unified Pod) that accommodates the substrate W in a sealed state is used as the carrier 1. However, the present invention is not limited to this, and a SMIF (Standard Mechanical Inter Face) pod is used. OC (Open Cassette) or the like may be used.

  The indexer robot IR with the indexer ID moves in the direction of the arrow U, takes out the substrate W from the carrier 1 and passes it to the substrate transport robot CR, and conversely receives the substrate W subjected to a series of processing from the substrate transport robot CR. Return to carrier 1.

  The substrate transfer robot CR transfers the substrate W delivered from the indexer robot IR to the designated processing unit, or transfers the substrate W received from the processing unit to another processing unit or the indexer robot IR.

  In the present embodiment, after the chemical processing and the rinsing processing are performed on the substrate W in any of the cleaning processing units 5a to 5d, the substrate W is unloaded from the cleaning processing units 5a to 5d by the substrate transport robot CR, and the indexer It is carried into the carrier 1 via the robot IR.

  The control unit 4 includes a computer including a CPU (Central Processing Unit) and the like. The operation of each processing unit in the processing areas A and B, the operation of the substrate transfer robot CR in the transfer area C, and the operation of the indexer robot IR of the indexer ID. To control.

  Further, in the substrate processing apparatus 100, a circulation system box portion 2B is provided so as to be adjacent to one end side of the processing regions A and B. Two chemical tanks are provided in the circulation box 2B. Details of the circulation system box 2B will be described later.

(2) Configuration of Cleaning Processing Unit FIG. 2 is a view for explaining the configuration of the cleaning processing units 5a to 5d of the substrate processing apparatus 100 according to the embodiment of the present invention.

  The cleaning processing units 5a to 5d in FIG. 2 perform a rinsing process after removing impurities such as organic substances attached to the substrate W by a chemical process.

  As shown in FIG. 2, the cleaning processing units 5 a to 5 d include a spin chuck 21 for holding the substrate W horizontally and rotating the substrate W around a vertical rotation axis passing through the center of the substrate W. The spin chuck 21 is fixed to the upper end of the rotation shaft 25 rotated by the chuck rotation drive mechanism 36.

  The substrate W is rotated while being held horizontally by the spin chuck 21 when performing the chemical treatment and the rinsing treatment. As shown in FIG. 2, in this embodiment, a spin chuck that holds the peripheral edge of the substrate W is used.

  A motor 60 is provided outside the spin chuck 21. A rotation shaft 61 is connected to the motor 60. An arm 62 is connected to the rotation shaft 61 so as to extend in the horizontal direction, and a surface chemical solution nozzle 50 is provided at the tip of the arm 62.

  The rotation shaft 61 is rotated by the motor 60 and the arm 62 is rotated, so that the surface chemical nozzle 50 moves above the substrate W held by the spin chuck 21.

  A processing supply pipe 104 is provided so as to pass through the motor 60, the rotation shaft 61 and the arm 62. The processing supply pipe 104 is connected to a chemical solution distribution mechanism 300 (FIG. 3 described later).

  A chemical solution is supplied to the surface chemical solution nozzles 50 of the cleaning processing units 5a to 5d from a chemical solution storage tank described later through a chemical solution distribution mechanism 300 (FIG. 3 described later) and a processing supply pipe 104. Thereby, the chemical solution can be supplied to the surface of the substrate W.

  A motor 71 is provided outside the spin chuck 21. A rotation shaft 72 is connected to the motor 71. An arm 73 is connected to the rotation shaft 72 so as to extend in the horizontal direction, and a surface rinse nozzle 70 is provided at the tip of the arm 73.

  The rotation shaft 72 is rotated by the motor 71 and the arm 73 is rotated, so that the surface rinse nozzle 70 moves above the substrate W held by the spin chuck 21.

  A rinse liquid supply pipe 74 is provided so as to pass through the motor 71, the rotation shaft 72 and the arm 73. The rinse liquid supply pipe 74 is connected to a rinse liquid supply system (not shown).

  The rinse liquid is supplied from the rinse liquid supply system through the rinse liquid supply pipe 74 to the surface rinse nozzles 70 of the cleaning processing units 5a to 5d. Thereby, the rinse liquid can be supplied to the surface of the substrate W. For example, pure water is used as the rinse liquid. In addition to pure water, hot pure water, ionic water, reduced water in which hydrogen is dissolved (including electrolytically reduced water), carbonated water, functional water such as magnetic water, or dilute (for example, about 1 ppm) ammonia water, ammonia Super water, hydrochloric acid or the like can be used.

  When supplying a chemical solution to the surface of the substrate W, the surface chemical solution nozzle 50 is positioned above the substrate W, and when supplying a rinse solution to the surface of the substrate W, the surface chemical solution nozzle 50 is retracted to a predetermined position. Is done.

  Further, when supplying the rinsing liquid to the surface of the substrate W, the surface rinsing nozzle 70 is positioned above the substrate W, and when supplying the chemical liquid to the surface of the substrate W, the surface rinsing nozzle 70 is at a predetermined position. Is evacuated.

  The rotation shaft 25 of the spin chuck 21 is a hollow shaft. A processing supply pipe 105 and a rinsing processing supply pipe 92 are inserted into the rotary shaft 25. One end of the processing supply pipe 105 extends to a position close to the back surface of the substrate W held by the spin chuck 21, and the other end is connected to a chemical solution distribution mechanism 300 (FIG. 3 described later). One end of the rinsing treatment supply pipe 92 extends to a position close to the back surface of the substrate W held by the spin chuck 21, and the other end is connected to a rinsing liquid supply system (not shown).

  A back surface chemical nozzle 81 and a back surface rinse nozzle 91 that discharge the chemical liquid and the rinsing liquid toward the center of the back surface of the substrate W are provided at one end of the processing supply pipe 105 and the rinse processing supply pipe 92. .

  By discharging the chemical liquid from the back surface chemical liquid nozzle 81 to the back surface of the substrate W, the back surface of the substrate W is processed with the chemical liquid. Further, the back surface of the substrate W is rinsed by discharging a rinsing liquid from the back surface rinsing nozzle 91 to the back surface of the substrate W.

  The spin chuck 21 is accommodated in the processing cup 23. A cylindrical partition wall 33 is provided inside the processing cup 23. Further, a waste liquid space 31 for collecting and discarding the rinse liquid used for the rinse treatment of the substrate W is formed so as to surround the periphery of the spin chuck 21. The waste liquid space 31 is formed in a ring shape and a groove shape along the outer periphery of the spin chuck 21.

  Further, a recovery liquid space 32 is provided between the processing cup 23 and the partition wall 33 so as to surround the waste liquid space 31 and collect the chemical liquid used for the chemical processing of the substrate W and circulate it in the substrate processing apparatus 100. Is formed. The recovered liquid space 32 is formed in an annular and groove shape along the outer periphery of the waste liquid space 31.

  The waste liquid space 31 is connected to a waste liquid pipe 34 for guiding the processing liquid to a waste liquid processing apparatus (not shown). In the recovery liquid space 32, the chemical liquid is supplied to chemical liquid storage tanks TA and TB (FIG. 3) described later. A collection pipe 35 for guiding is connected.

  A splash guard 24 is provided above the processing cup 23 to prevent the chemical liquid or the rinse liquid from the substrate W from splashing outward. The splash guard 24 has a rotationally symmetric shape with respect to the rotation shaft 25. On the inner surface of the upper end portion of the splash guard 24, a waste liquid guide groove 41 having a square cross section is formed in an annular shape.

  Further, a recovery liquid guide portion 42 is formed on the inner surface of the lower end portion of the splash guard 24. The recovery liquid guide portion 42 has an inclined surface that is inclined outward and downward. A partition wall storage groove 43 for receiving the partition wall 33 of the processing cup 23 is formed in the vicinity of the upper end of the recovered liquid guide portion 42.

  The splash guard 24 is supported by a guard lifting / lowering drive mechanism 37 configured by a ball screw mechanism or the like. The guard lifting / lowering driving mechanism holds the splash guard 24 in the carry-in / carry-out position where the upper end of the splash guard 24 is substantially the same as or lower than the upper end of the spin chuck 21, and the recovered liquid guide 42 is held by the spin chuck 21. The circulating position facing the outer peripheral end face of the substrate W and the waste liquid guiding groove 41 are moved up and down between the waste liquid position facing the outer peripheral end face of the substrate W held by the spin chuck 21.

  When the substrate W is loaded onto the spin chuck 21 and when the substrate W is unloaded from the spin chuck 21, the splash guard 24 is positioned at the loading / unloading position.

  When the splash guard 24 is in the circulation position, the chemical liquid splashed outward from the substrate W is guided to the recovery liquid space 32 by the recovery liquid guide section 42, and will be described later as chemical storage tanks TA and TB (see FIG. 3).

  On the other hand, when the splash guard 24 is at the waste liquid position, the rinse liquid splashed outward from the substrate W is guided to the waste liquid space 31 by the waste liquid guide groove 41 and discarded through the waste liquid pipe 34.

(3) Piping system of substrate processing apparatus Next, the piping system of the substrate processing apparatus 100 will be described. Here, the piping system regarding a chemical | medical solution is demonstrated. Description of the piping system related to the rinse liquid is omitted.

  FIG. 3 is a diagram showing a piping system related to the chemical solution of the substrate processing apparatus 100 of FIG. As shown in FIG. 3, the substrate processing apparatus 100 includes chemical storage tanks TA and TB. In the chemical storage tanks TA and TB, chemicals used for the chemical processing of the substrate are stored. The chemical solution storage tanks TA and TB are provided in the circulation system box portion 2B of FIG.

  Further, a concentration sensor SE1 for detecting the concentration of the chemical solution in the chemical solution storage tank TA is attached to the chemical solution storage tank TA. Similarly, a concentration sensor SE2 for detecting the concentration of the chemical solution in the chemical solution storage tank TB is attached to the chemical solution storage tank TB. Details of the density sensors SE1, SE2 will be described later.

  A supply pipe 101 is connected to the chemical solution storage tank TA. The supply pipe 101 branches into a processing supply pipe 102 and a standby pipe 103. A valve 90 is inserted in the processing supply pipe 102, and a valve 91 is inserted in the standby pipe 103.

  A supply pipe 111 is connected to the chemical solution storage tank TB. The supply pipe 111 branches into a processing supply pipe 112 and a standby pipe 113. A valve 92 is inserted in the processing supply pipe 112, and a valve 93 is inserted in the standby pipe 113.

  The processing supply pipes 102 and 112 are connected to a processing supply pipe 110 that extends to the chemical liquid distribution mechanism 300. A temperature regulator 210, a pump P1, and a filter F are interposed in the processing supply pipe 110.

  The chemical solution distribution mechanism 300 is connected to a processing supply pipe 104 extending to the front surface chemical solution nozzle 50 and a processing supply pipe 105 extending to the back surface chemical solution nozzle 81 of each of the cleaning processing units 5a to 5d. A valve 191 is inserted in each processing supply pipe 104, and a valve 192 is connected to each processing supply pipe 105.

  In practice, four sets of processing supply pipes 104 and 105 and four sets of valves 191 and 192 corresponding to the cleaning processing units 5a to 5d are provided. However, in FIG. Only one set of processing supply pipes 104, 105 and one set of valves 191, 192 are shown. The same applies to the drawings described below.

  A pipe 77 is connected to the processing supply pipe 104 between the chemical solution branching mechanism 300 and the valve 191. The pipe 77 is connected to the pipe 76, and the pipe 76 branches into a pipe 76a extending to the chemical liquid storage tank TA and a pipe 76b extending to the chemical liquid storage tank TB. A valve 108 is inserted in the pipe 77, a valve 94 is inserted in the pipe 76a, and a valve 95 is inserted in the pipe 76b.

  A pipe 78 is connected to the processing supply pipe 105 between the chemical solution diversion mechanism 300 and the valve 192. The pipe 78 is connected to the pipe 76. A valve 109 is inserted in the pipe 78.

  On the other hand, a standby pipe 103 extending from the supply pipe 101 and a standby pipe 113 extending from the supply pipe 111 are connected to one end of the standby pipe 120. A temperature regulator 220, a pump P2, and a filter F are inserted in the standby pipe 120.

  The other end of the standby pipe 120 branches into a standby pipe 106 extending to the chemical solution storage tank TA and a standby pipe 107 extending to the chemical solution storage tank TB. A valve 96 is inserted in the standby pipe 106, and a valve 97 is inserted in the standby pipe 107.

  Further, a recovery pipe 35 is connected to the recovery liquid space 32 in the processing cup 23 of the cleaning processing units 5a to 5d. The recovery pipe 35 branches into a recovery pipe 35a extending to the chemical liquid storage tank TA and a recovery pipe 35b extending to the chemical liquid storage tank TB. A valve 98, a filter F, a pump P3, and a filter F are inserted into the recovery pipe 35a in this order from the recovery pipe 35 side. A valve 99, a filter F, a pump P4, and a filter F are inserted into the recovery pipe 35b in this order from the recovery pipe 35 side.

(4) Chemical Solution Circulation Path In the present embodiment, the control unit 4 in FIG. 1 uses the chemical solution in the chemical solution storage tank TB when the chemical solution in the chemical solution storage tank TA is replaced by the substrate W in the cleaning processing units 5a to 5d. Valves 90 to 99, so that the chemical processing of the substrate W in the cleaning processing units 5a to 5d is performed using the chemical solution in the chemical solution storage tank TA when the chemical solution in the chemical solution storage tank TB is replaced. The opening / closing of 108, 109, 191, 192 is controlled. As a result, the occurrence of downtime at the time of replacement of the chemical liquid in the chemical liquid storage tanks TA and TB is prevented, and a decrease in throughput is prevented.

  Hereinafter, when chemical processing of the substrate W in the cleaning processing units 5a to 5d is performed using the chemical in the chemical storage tank TA (hereinafter referred to as TA operation), and cleaning processing is performed using the chemical in the chemical storage tank TB. A chemical solution circulation path in the case where the chemical treatment of the substrate W in the units 5a to 5d is performed (hereinafter referred to as TB operation) will be described.

  FIG. 4 shows the open / closed state of the valves 90 to 99, 108, 109, 191, and 192 during the TA operation and the TB operation. 5 and FIG. 6 schematically show the circulation path of the chemical solution during the TA operation, and FIGS. 7 and 8 schematically show the circulation route of the chemical solution during the TB operation.

(4-1) At the time of TA operation First, the circulation path of the chemical solution at the time of TA operation will be described.

  As shown in FIG. 4, during the TA operation, the valves 90, 93, 94, 97, 98 are opened, and the valves 91, 92, 95, 96, 99 are closed. The valves 108, 109, 191, and 192 are each switched between open and closed according to the processing process of the substrate W, as will be described later.

  When the valves 90 to 99 are set as described above, the temperature of the chemical in the chemical storage tank TA is adjusted by the operation of the pump P1 via the supply pipe 101 and the processing supply pipes 102 and 110 as shown in FIG. Guided to the vessel 210 and the filter F, and further guided to the processing supply pipes 104 and 105 via the chemical solution branching mechanism 300. Thereby, the chemical solution in the chemical solution storage tank TA is adjusted to a predetermined temperature by the temperature controller 210 and purified by the filter F.

  Here, when the valves 108 and 192 are closed and the valves 109 and 191 are opened, the chemical solution guided from the chemical solution distribution mechanism 300 to the processing supply pipe 104 is the surface chemical solution nozzle 50 of the cleaning processing units 5a to 5d. Led to. Further, the chemical liquid guided from the chemical liquid branching mechanism 300 to the processing supply pipe 105 is returned to the chemical liquid storage tank TA via the pipes 78, 76, and 76a.

  Thereby, the chemical solution is supplied from the surface chemical solution nozzle 50 to the surface of the substrate W, and the chemical solution treatment of the surface of the substrate W is performed.

  Further, when the valves 109 and 191 are closed and the valves 108 and 192 are opened, the chemical solution guided from the chemical solution diversion mechanism 300 to the processing supply pipe 104 is supplied to the chemical solution storage tank via the pipes 77, 76, and 76 a. Returned to TA. Further, the chemical liquid guided from the chemical liquid branching mechanism 300 to the processing supply pipe 105 is guided to the back surface chemical liquid nozzle 81 of the cleaning processing units 5a to 5d.

  Thereby, the chemical liquid is supplied from the back surface chemical liquid nozzle 81 to the back surface of the substrate W, and the chemical liquid treatment of the back surface of the substrate W is performed.

  Further, when the valves 108 and 109 are closed and the valves 191 and 192 are opened, the chemical solution is supplied from the chemical solution distribution mechanism 300 through the processing supply pipes 104 and 105 to the surface chemical solution nozzles 50 of the cleaning processing units 5a to 5d. And it is guided to the back surface chemical nozzle 81.

  Thereby, the chemical solution is supplied from the front surface chemical solution nozzle 50 and the back surface chemical solution nozzle 81 to the front surface and the back surface of the substrate W, and the front surface and the back surface of the substrate W are processed.

  The chemical liquid supplied to the front or back surface of the substrate W in the cleaning processing units 5a to 5d is returned to the chemical liquid storage tank TA via the recovery pipe 35 and the recovery pipe 35a by the operation of the pump P3.

  As described above, during the period in which at least one chemical treatment of the front surface and the back surface of the substrate W is performed in the cleaning processing units 5a to 5d, the chemical solution storage tank TA guides the temperature regulator 210 and the filter F, and then stores the chemical solution. Hereinafter, the circulation path of the chemical liquid returned to the tank TA is referred to as a circulation path R1 (see FIGS. 5A, 5B, and 6A).

  When the valves 108 and 109 are opened and the valves 191 and 192 are closed, the chemical liquid is guided from the processing supply pipes 104 and 105 to the pipes 77, 78, 76, and 76a and returned to the chemical liquid storage tank TA.

  As described above, the chemical treatment tank 5 is guided from the chemical solution storage tank TA to the temperature controller 210 and the filter F during the period when neither the chemical treatment of the front surface nor the back surface of the substrate W is performed in the cleaning processing units 5a to 5d. Hereinafter, the circulation path of the chemical solution returned to the tank TA is referred to as a circulation path R2 (see FIG. 6B).

  During a period when the chemical liquid is not supplied to the substrate W from the front chemical nozzle 50 and the back chemical nozzle 81, the chemical circulates in the circulation path R2. When a chemical solution is supplied from at least one of the front surface chemical solution nozzle 50 and the back surface chemical solution nozzle 81 to the substrate W, each valve is switched so that the chemical solution circulates in the circulation path R1. Thereby, during the period when the chemical solution is not supplied to the substrate W, the temperature of the chemical solution is always controlled by the temperature controller 210, and when the chemical solution is supplied to the substrate W, the chemical solution adjusted to a predetermined temperature immediately becomes the substrate. Supplied to W.

  Even when the chemical liquid is supplied to the substrate W from any one of the front surface chemical nozzle 50 and the back surface chemical liquid nozzle 81, the path of the nozzle that does not supply the chemical liquid to the substrate W is the temperature controller 210 and the filter. It returns to the chemical | medical solution storage tank TA via F. As a result, the flow rate of the pump P1 is constant between when the chemical liquid is supplied from both the front chemical liquid nozzle 50 and the back chemical nozzle 81 and when the chemical liquid is supplied from either the front chemical nozzle 50 or the back chemical nozzle 81. Can be.

  On the other hand, the chemical in the chemical storage tank TB is guided to the temperature controller 220 and the filter F through the supply pipe 111 and the standby pipes 113 and 120 by the operation of the pump P2. Thereby, the chemical solution in the chemical solution storage tank TB is adjusted to a predetermined temperature by the temperature controller 220 and purified by the filter F. Note that the temperature adjusted by the temperature controller 220 is set to be substantially equal to the temperature adjusted by the temperature controller 210.

  Thereafter, the chemical solution is returned to the chemical solution storage tank TB through the standby pipes 120 and 107.

  As described above, the circulation path of the chemical liquid guided from the chemical liquid storage tank TB to the temperature controller 220 and the filter F and returned to the chemical liquid storage tank TB is hereinafter referred to as a circulation path R3 (FIG. 5A and FIG. 5). (See (b), FIG. 6 (a) and FIG. 6 (b)).

  Thus, during the TA operation, the chemical solution in the chemical solution storage tank TA is circulated through the circulation path R1 or the circulation route R2, and the chemical solution in the chemical solution storage tank TB is circulated through the circulation route R3.

(4-1) At the time of TB operation Next, the circulation route of the chemical solution at the time of TB operation will be described.

  As shown in FIG. 4, during the TB operation, the valves 91, 92, 95, 96, 99 are opened, and the valves 90, 93, 94, 97, 98 are closed. The valves 108, 109, 191, and 192 are each switched between open and closed according to the processing process of the substrate W, as will be described later.

  When the valves 90 to 99 are set as described above, as shown in FIG. 3, the chemical solution in the chemical solution storage tank TA is supplied to the temperature controller via the supply pipe 101 and the standby pipes 103 and 120 by the operation of the pump P2. 220 and filter F. Thereby, the chemical solution in the chemical solution storage tank TA is adjusted to a predetermined temperature by the temperature controller 220 and purified by the filter F.

  Thereafter, the chemical solution is returned to the chemical solution storage tank TA through the standby pipes 120 and 106.

  As described above, the circulation path of the chemical liquid guided from the chemical liquid storage tank TA to the temperature controller 220 and the filter F and returned to the chemical liquid storage tank TA is hereinafter referred to as a circulation path R4 (FIGS. 7A and 7). (B), see FIG. 8 (a) and FIG. 8 (b)).

  On the other hand, the chemical solution in the chemical solution storage tank TB is guided to the temperature controller 210 and the filter F through the supply pipe 111 and the processing supply pipes 112 and 110 by the operation of the pump P1, and further processed through the chemical solution distribution mechanism 300. To the supply pipes 104 and 105. Thereby, the chemical solution in the chemical solution storage tank TB is adjusted to a predetermined temperature by the temperature controller 210 and purified by the filter F.

  Here, when the valves 108 and 192 are closed and the valves 109 and 191 are opened, the chemical solution guided from the chemical solution distribution mechanism 300 to the processing supply pipe 104 is the surface chemical solution nozzle 50 of the cleaning processing units 5a to 5d. Led to. Further, the chemical liquid guided from the chemical liquid branching mechanism 300 to the processing supply pipe 105 is returned to the chemical liquid storage tank TB via the pipe 78 and the pipes 76 and 76b.

  Thereby, the chemical solution is supplied from the surface chemical solution nozzle 50 to the surface of the substrate W, and the chemical solution treatment of the surface of the substrate W is performed.

  Further, when the valves 109 and 191 are closed and the valves 108 and 192 are opened, the chemical solution guided from the chemical solution diversion mechanism 300 to the processing supply pipe 104 is supplied to the chemical solution storage tank via the pipes 77, 76, and 76 a. Returned to TB. Further, the chemical liquid guided from the chemical liquid branching mechanism 300 to the processing supply pipe 105 is guided to the back surface chemical liquid nozzle 81 of the cleaning processing units 5a to 5d.

  Thereby, the chemical liquid is supplied from the back surface chemical liquid nozzle 81 to the back surface of the substrate W, and the chemical liquid treatment of the back surface of the substrate W is performed.

  Further, when the valves 108 and 109 are closed and the valves 191 and 192 are opened, the chemical solution is supplied from the chemical solution distribution mechanism 300 through the processing supply pipes 104 and 105 to the surface chemical solution nozzles 50 of the cleaning processing units 5a to 5d. And it is guided to the back surface chemical nozzle 81.

  Thereby, the chemical solution is supplied from the front surface chemical solution nozzle 50 and the back surface chemical solution nozzle 81 to the front surface and the back surface of the substrate W, and the front surface and the back surface of the substrate W are processed.

  The chemical liquid supplied to the front or back surface of the substrate W in the cleaning processing units 5a to 5d is returned to the chemical liquid storage tank TB via the recovery pipe 35 and the recovery pipe 35b by the operation of the pump P4.

  As described above, during the period in which at least one chemical treatment of the front surface and the back surface of the substrate W is performed in the cleaning processing units 5a to 5d, the chemical solution storage tank TB guides the temperature controller 210 and the filter F, and then stores the chemical solution. Hereinafter, the circulation path of the chemical solution returned to the tank TB is referred to as a circulation path R5 (see FIGS. 7A, 7B, and 8A).

  When the valves 108 and 109 are opened and the valves 191 and 192 are closed, the chemical liquid is guided from the processing supply pipes 104 and 105 to the pipes 77, 78, 76, and 76b and returned to the chemical liquid storage tank TB.

  As described above, the chemical treatment tank 5 leads to the temperature regulator 210 and the filter F during the period when neither the chemical treatment of the front surface nor the back surface of the substrate W is performed in the cleaning processing sections 5a to 5d, and then stores the chemical solution. The chemical liquid circulation path returned to the tank TB is hereinafter referred to as a circulation path R6 (see FIG. 8B).

  During the period when the chemical liquid is not supplied to the substrate W from the front chemical nozzle 50 and the back chemical nozzle 81, the chemical circulates in the circulation path R6. When a chemical solution is supplied from at least one of the front surface chemical solution nozzle 50 and the back surface chemical solution nozzle 81 to the substrate W, each valve is switched so that the chemical solution circulates in the circulation path R5. Thereby, during the period when the chemical solution is not supplied to the substrate W, the temperature of the chemical solution is always controlled by the temperature controller 210, and when the chemical solution is supplied to the substrate W, the chemical solution adjusted to a predetermined temperature immediately becomes the substrate. Supplied to W.

  Even when the chemical liquid is supplied to the substrate W from any one of the front surface chemical nozzle 50 and the back surface chemical liquid nozzle 81, the path of the nozzle that does not supply the chemical liquid to the substrate W is the temperature controller 210 and the filter. It is returned to the chemical solution storage tank TB via F. As a result, the flow rate of the pump P1 is constant between when the chemical liquid is supplied from both the front chemical liquid nozzle 50 and the back chemical nozzle 81 and when the chemical liquid is supplied from either the front chemical nozzle 50 or the back chemical nozzle 81. Can be.

  Thus, during the TB operation, the chemical solution in the chemical solution storage tank TA is circulated through the circulation path R4, and the chemical solution in the chemical solution storage tank TB is circulated through the circulation route R5 or the circulation route R6.

(5) Control System As described above, in the present embodiment, the valves 90 to 99, 108, 109, 191, and 192 are controlled by the control unit 4 of FIG. Hereinafter, the control operation of the control unit 4 will be described.

  FIG. 9 is a block diagram for explaining a control system of the substrate processing apparatus 100.

  As shown in FIG. 9, the concentration sensor SE1 detects the concentration of the chemical solution in the chemical solution storage tank TA (FIG. 3), and gives the detection result to the control unit 4 as a concentration signal L1. The concentration sensor SE2 detects the concentration of the chemical solution in the chemical solution storage tank TB (FIG. 3), and gives the detection result to the control unit 4 as a concentration signal L2.

  The control unit 4 determines whether or not the chemical solution in the chemical solution storage tanks TA and TB is deteriorated based on the concentration signals L1 and L2, and the valves 90 to 99, 108, 109, 191, and 192 based on the valve signal V1. Controls the opening and closing of.

  Furthermore, the control unit 4 gives a warning signal CI to the warning mechanism 200 to give a warning to the operator. The warning mechanism 200 includes, for example, a warning buzzer or a warning lamp.

  Here, the valve control processing by the control unit 4 will be described. FIG. 10 is a flowchart illustrating an example of valve control processing by the control unit 4.

  As shown in FIG. 10, the control unit 4 sets the valves 90 to 99, 108, 109, 191, and 192 to an initial state (step S1). Here, the initial state is set to the state during the TA operation (FIG. 4).

  Subsequently, based on the concentration signal L1 given from the concentration sensor SE1, the control unit 4 sets the concentration of the chemical solution in the chemical solution storage tank TA (hereinafter referred to as the chemical concentration a) within a predetermined value range. It is determined whether or not there is (step S2).

  When the chemical solution concentration a is within the range of the specified value, the chemical solution in the chemical solution storage tank TA is not deteriorated and it is considered that there is no need for replacement. In this case, the control unit 4 repeats the determination in step S2.

  When the chemical solution concentration a is not within the range of the specified value, the chemical solution in the chemical solution storage tank TA has deteriorated and is considered to need replacement. In this case, the control unit 4 switches the valves 90 to 99, 108, 109, 191, and 192 to the state during the TB operation (FIG. 4) (step S3).

  Subsequently, the control unit 4 issues a warning to the operator by operating the warning mechanism 200 (step S4). The operator replaces the chemical solution in the chemical solution storage tank TA according to the warning. Note that the operation of the warning mechanism 200 means, for example, issuing a warning buzzer or lighting a warning lamp.

  Subsequently, based on the concentration signal L2 given from the concentration sensor SE2, the control unit 4 sets the concentration of the chemical solution in the chemical solution storage tank TB (hereinafter referred to as the chemical concentration b) within a predetermined range of the preset value. It is determined whether or not there is (step S5).

  When the chemical solution concentration b is within the specified value range, the chemical solution in the chemical solution storage tank TB is not deteriorated and it is considered that there is no need for replacement. In this case, the control unit 4 repeats the determination in step S5.

  When the chemical liquid concentration b is not within the range of the specified value, the chemical liquid in the chemical liquid storage tank TB has deteriorated and is considered to need to be replaced. In this case, the control unit 4 switches the valves 90 to 99, 108, 109, 191, and 192 to the state during the TA operation (step S6).

  Subsequently, the control unit 4 issues a warning to the operator by operating the warning mechanism 200 (step S6). The operator replaces the chemical solution in the chemical solution storage tank TB according to the warning. Then, the control part 4 repeats the process of step S2-step S7.

  As described above, when the chemicals in the chemical storage tanks TA and TB deteriorate and need to be replaced, the valves 90 to 99, 108, 109, 191, and 192 are switched. Thereby, when the chemical solution in the chemical solution storage tank TA is replaced, the chemical solution processing of the substrate W in the cleaning processing units 5a to 5d is performed using the chemical solution in the chemical solution storage tank TB, and at the time of replacement of the chemical solution in the chemical solution storage tank TB. The chemical solution processing of the substrate W is performed in the cleaning processing units 5a to 5d using the chemical solution in the storage tank TA.

(6) Effects of the present embodiment In the present embodiment, when the chemical solution in the chemical solution storage tank TA is replaced, the chemical solution processing of the substrate W is performed in the cleaning processing units 5a to 5d using the chemical solution in the chemical solution storage tank TB. When the chemical solution in the chemical solution storage tank TB is exchanged, the chemical solution processing of the substrate W is performed in the cleaning processing units 5a to 5d using the chemical solution in the chemical solution storage tank TA.

  As a result, the occurrence of downtime at the time of replacement of the chemical liquid in the chemical liquid storage tanks TA and TB is prevented, and a decrease in throughput is prevented.

  In addition, when the chemical solution processing of the substrate W is performed using the chemical solution in the chemical solution storage tank TA and when the chemical solution processing of the substrate W is performed using the chemical solution in the chemical solution storage tank TB, both are performed by the common temperature controller 210. The temperature-adjusted chemical solution is supplied to the substrate W.

  In this case, since there is no temperature difference due to machine difference (variation in characteristics) of the temperature controller, the chemical solution supplied from the chemical solution storage tank TA to the substrate W and the chemical solution supplied from the chemical solution storage tank TB to the substrate W are separated. It can be accurately adjusted to a constant temperature. Thereby, the dispersion | variation in the processing precision of a board | substrate can be prevented reliably.

  In the present embodiment, the chemical solution in the chemical solution storage tank TB is circulated through the circulation path R3 during the TA operation, and the chemical solution in the chemical solution storage tank TA is circulated through the circulation route R4 during the TB operation. That is, of the chemical liquids in the chemical liquid storage tanks TA and TB, the chemical liquid in the chemical liquid storage tank that is not used for the chemical liquid processing of the substrate W is guided to the temperature controller 220 and the temperature is adjusted.

  Here, the temperature adjusted by the temperature controller 220 is set substantially equal to the temperature adjusted by the temperature controller 210. Therefore, the chemical solution supplied from the chemical solution storage tank TA or the chemical solution storage tank TB to the substrate W immediately after switching from the TA operation state to the TB operation state or from the TB operation state to the TA operation state. The temperature controller 210 can quickly and easily adjust the temperature to a predetermined temperature.

  In addition, in the circulation path R3 and the circulation path R4, the temperature of the chemical solution is adjusted by the common temperature controller 220, so that there is no temperature difference due to the machine difference of the temperature controller. Thereby, the temperature of the chemical solution in the chemical solution storage tank TB during the TA operation and the temperature of the chemical solution in the chemical solution storage tank TA during the TB operation are maintained at a constant temperature.

  Therefore, the chemical solution supplied from the chemical solution storage tank TA and the chemical solution storage tank TB to the substrate W when the state is switched from the TA operation state to the TB operation state or from the TB operation state to the TA operation state. It is easier to accurately adjust the temperature to a predetermined temperature.

  In the present embodiment, the chemical solution in the chemical solution storage tank TA is circulated through the circulation path R2 during a period when the chemical solution is not supplied to the substrate W during the TA operation. Further, the chemical solution in the chemical solution storage tank TB is circulated through the circulation path R6 during a period when the chemical solution is not supplied to the substrate W during the TB operation.

  In this case, the chemical solution in the chemical solution storage tanks TA and TB is always maintained at a predetermined temperature by the temperature controller 210. Thereby, the chemical liquid adjusted to a predetermined temperature can be supplied to the substrate W at an arbitrary timing.

(7) Other embodiments (7-1)
The substrate processing apparatus 100 may have the following configuration. FIG. 11 is a diagram for explaining another configuration example of the substrate processing apparatus 100. A difference between the substrate processing apparatus 100 of FIG. 11 and the above embodiment will be described.

  As shown in FIG. 11, the supply pipe 101 connected to the chemical liquid supply tank TA branches into a processing supply pipe 102 and a standby pipe 103a. The processing supply pipe 102 is connected to the processing supply pipe 110 as in the above embodiment.

  The standby pipe 103a extends to the chemical solution supply tank TA. A valve 91a, a temperature controller 220a, a pump P2a, and a filter F are inserted in the standby pipe 103a.

  The supply pipe 111 connected to the chemical liquid supply tank TB branches into a processing supply pipe 112 and a standby pipe 113a. The processing supply pipe 112 is connected to the processing supply pipe 110 as in the above embodiment.

  The standby pipe 113a extends to the chemical liquid supply tank TB. A valve 93a, a temperature controller 220b, a pump P2b, and a filter F are inserted in the standby pipe 113a.

  During the TA operation, the valve 91a is closed and the valve 93a is opened. Further, the valves 90, 92, 94, 95, 98, 99, 108, 109, 191, 192 are set in the same manner as in the TA operation of the above embodiment (see FIG. 4).

  In this case, the chemical solution in the chemical solution storage tank TB is guided to the temperature controller 220b and the filter F through the supply pipe 111 and the standby pipe 113a. Thereby, the chemical solution in the chemical solution storage tank TB is adjusted to a predetermined temperature by the temperature controller 220b and purified by the filter F. Thereafter, the chemical liquid is returned to the chemical liquid storage tank TB through the standby pipe 113a.

  Further, during the TA operation, the chemical solution in the chemical solution storage tank TA is circulated through the circulation path R1 or the circulation path R2 as in the above embodiment (see FIG. 5).

  During the TB operation, the valve 91a is opened and the valve 93a is closed. Further, the valves 90, 92, 94, 95, 98, 99, 108, 109, 191, 192 are set in the same manner as in the TB operation of the above embodiment (see FIG. 4).

  In this case, the chemical solution in the chemical solution storage tank TA is guided to the temperature controller 220a and the filter F through the supply pipe 101 and the standby pipe 103a. Thereby, the chemical solution in the chemical solution storage tank TA is adjusted to a predetermined temperature by the temperature controller 220a and purified by the filter F. Thereafter, the chemical liquid is returned to the chemical liquid storage tank TA through the standby pipe 103a.

  Further, during the TB operation, the chemical solution in the chemical solution storage tank TB is circulated through the circulation path R5 or the circulation path R6 as in the above embodiment (see FIG. 6).

  As described above, in the substrate processing apparatus 100 of FIG. 11, the temperature of the chemical solution in the chemical solution storage tank TB is adjusted by the temperature controller 220b during the TA operation, and the temperature of the chemical solution in the chemical solution storage tank TA is adjusted by the temperature controller 220a during the TB operation. Adjusted.

  The temperature adjusted by the temperature regulators 220a and 220b is set to be substantially equal to the temperature adjusted by the temperature regulator 210.

  As a result, immediately after switching from the TA operating state to the TB operating state, or from the TB operating state to the TA operating state, the substrate W is supplied from the chemical storage tank TA or the chemical storage tank TB. The temperature of the chemical solution can be quickly and easily adjusted to a predetermined temperature by the temperature controller 210.

  Further, a common temperature controller is provided by separately providing a temperature controller 220a for adjusting the temperature of the chemical solution in the chemical solution storage tank TA and a temperature controller 220b for adjusting the temperature of the chemical solution in the chemical solution storage tank TB. Compared to the case, the configuration of the piping system is simplified. Thereby, the freedom degree of design of the substrate processing apparatus 100 is improved.

  Also in the substrate processing apparatus 100 of FIG. 11, similarly to the substrate processing apparatus 100 of the above-described embodiment, when the chemical liquid processing of the substrate W is performed using the chemical liquid in the chemical liquid storage tank TA, and in the chemical liquid storage tank TB When the chemical liquid processing of the substrate W is performed using the chemical liquid, the chemical liquid whose temperature is adjusted by the common temperature controller 210 is supplied to the substrate W.

(7-2)
In the above embodiment, the state of each valve is switched by the control unit 4 when the concentration of the chemical solution in the chemical solution storage tanks TA and TB deviates from the predetermined range of the preset value. Not exclusively. For example, the time required until the chemical solution in the chemical solution storage tanks TA and TB immediately after replacement is deteriorated due to the contamination of impurities is calculated in advance, and the state of each valve is switched by the control unit 4 every time the required time elapses. May be.

(7-3)
In the above embodiment, the operator replaces the chemical liquid in the chemical liquid storage tanks TA and TB, but may automatically replace the chemical liquid in the chemical liquid storage tanks TA and TB.

  In this case, for example, a chemical solution supply device and a chemical waste solution device are provided outside the substrate processing apparatus 100. The chemical solution supply device supplies the chemical solution to the chemical solution storage tanks TA and TB according to a command from the control unit 4. Further, the chemical liquid waste apparatus discards the chemical liquid in the chemical liquid storage tanks TA and TB according to a command from the control unit 4. Thereby, the chemical solution in the chemical solution storage tanks TA and TB can be exchanged.

(8) Correspondence between each component of claim and each part of embodiment The following describes an example of the correspondence between each component of the claim and each part of the embodiment. It is not limited.

  In the above embodiment, the cleaning processing units 5a to 5d correspond to the processing unit, the chemical solution storage tank TA corresponds to the first storage tank, the chemical solution storage tank TB corresponds to the second storage tank, and the temperature adjustment The device 210 corresponds to the first temperature control means, and the temperature controller 220 corresponds to the second temperature control means.

  Also, supply pipes 101 and 111, processing supply pipes 102, 104, 105, 110, and 112, pipes 76, 76a, and 76b, recovery pipes 35, 35a, and 35b, standby pipes 103, 106, 107, 113, 120, And valves 90 to 99, 108, 109, 191, and 192 correspond to the treatment liquid path forming means, the circulation path R1 corresponds to the first circulation path, the circulation path R3 corresponds to the second circulation path, and the circulation. The route R5 corresponds to the third circulation route, the circulation route R4 corresponds to the fourth circulation route, the circulation route R2 corresponds to the fifth circulation route, and the circulation route R6 corresponds to the sixth circulation route. The valves 90 and 92 correspond to the first path switching means, the valves 98 and 99 correspond to the second path switching means, the valves 94 and 95 correspond to the third path switching means, and the valves 91 and 93 Is the fourth route switch It corresponds to stage, valves 96 and 97 corresponds to the fifth path switching means.

  Further, the control unit 4 corresponds to the control means, the concentration sensor SE1 corresponds to the first detector, the concentration sensor SE2 corresponds to the second detector, and the temperature regulator 220a serves as the first temperature controller. The temperature controller 220b corresponds to the second temperature controller.

  The substrate processing apparatus and the substrate processing method according to the present invention can be used for manufacturing substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, and glass substrates for optical disks.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is a figure for demonstrating the structure of the cleaning process part of the substrate processing apparatus which concerns on one embodiment of this invention. It is a figure which shows the piping system regarding the chemical | medical solution of the substrate processing apparatus of FIG. It is a figure which shows the open / close state of the valve | bulb at the time of TA operation | movement and TB operation. It is a figure which shows roughly the circulation path | route of the chemical | medical solution at the time of TA operation | movement. It is a figure which shows roughly the circulation path | route of the chemical | medical solution at the time of TA operation | movement. It is a figure which shows roughly the circulation path | route of the chemical | medical solution at the time of TB operation. It is a figure which shows roughly the circulation path | route of the chemical | medical solution at the time of TB operation. It is a block diagram for demonstrating the control system of a substrate processing apparatus. It is a flowchart which shows an example of the valve control processing by a control part. It is a figure for demonstrating the other structural example of a substrate processing apparatus.

Explanation of symbols

4 control unit 5a to 5d cleaning processing unit 35, 35a, 35b recovery pipe 50 surface chemical solution nozzle 76, 76a, 76b, 77, 78 piping 81 back surface chemical solution nozzle 90 to 99, 108, 109, 191, 192 valve 100 substrate processing apparatus 101, 111 Supply pipe 102, 104, 105, 110, 112 Processing supply pipe 103, 106, 107, 113, 120 Standby pipe 210, 220 Temperature controller R1, R2, R3, R4, R5, T6 Circulation path SE1 , SE2 Concentration sensor TA, TB Chemical storage tank

Claims (7)

A processing unit that performs processing using a processing liquid on the substrate;
A first storage tank for storing the processing liquid;
A second storage tank for storing the processing liquid;
First temperature adjusting means for adjusting the temperature of the treatment liquid;
A second temperature adjusting means for adjusting the temperature of the treatment liquid;
A treatment liquid path forming means for forming a treatment liquid path between the treatment section, the first and second storage tanks, and the first and second temperature control means;
The treatment liquid path forming means includes
Forming a first circulation path for circulating a treatment liquid to the first storage tank, the first temperature control means, and the processing unit at the time of processing of the processing unit during operation of the first storage tank; Forming a second circulation path for circulating the treatment liquid to the second storage tank and the second temperature control means during operation of the first storage tank;
Forming a third circulation path for circulating the treatment liquid to the second storage tank, the first temperature control means, and the processing unit during the processing of the processing unit during operation of the second storage tank; 4. A substrate processing apparatus, wherein a fourth circulation path is formed to circulate a processing liquid through the first storage tank and the second temperature control means during operation of the second storage tank. The treatment liquid path forming means includes
Forming a fifth circulation path for circulating a treatment liquid to the first storage tank and the first temperature control means during standby of the processing unit during operation of the first storage tank; The sixth circulation path for circulating the processing liquid to the second storage tank and the first temperature control means is formed during standby of the processing unit during operation of the storage tank. Substrate processing equipment. The treatment liquid path forming means includes
First path switching means for selectively introducing a processing liquid from either one of the first storage tank and the second storage tank to the first temperature control means;
Second path switching means for selectively returning the processing liquid from the processing unit to either the first storage tank or the second storage tank;
Third path switching means for selectively guiding the processing liquid from the first temperature control means to either the first storage tank or the second storage tank;
A fourth path switching means for selectively introducing a processing liquid from either one of the first storage tank and the second storage tank to the second temperature control means;
A fifth path switching means for selectively guiding the processing liquid from the second temperature control means to either the first storage tank or the second storage tank;
Control means for controlling the first, second, third, fourth and fifth path switching means,
The control means includes
The first and second path switching means are set so that the first circulation path is formed during processing of the processing unit during operation of the first storage tank. The third path switching means is set so that the fifth circulation path is formed during standby of the processing unit during operation, and when the first storage tank is in operation, the second circulation path is The fourth and fifth path switching means are set so as to be formed, and the third circulation path is formed so that the third circulation path is formed during processing of the processing unit during operation of the second storage tank. 1 and 2 path switching means are set, and the third path switching means is set so that the sixth circulation path is formed when the processing unit is on standby during operation of the second storage tank. When the second storage tank is in operation, the fourth circulation path is formed. It said fourth and fifth substrate processing apparatus according to claim 2, wherein the setting the path switching means as. A first detector for detecting the replacement time of the processing liquid in the first storage tank;
A second detector for detecting the replacement time of the treatment liquid in the second storage tank,
The control means controls the first, second, third, fourth and fifth path switching means based on detection results from the first detector and the second detector. The substrate processing apparatus according to claim 3, wherein: The substrate processing apparatus according to claim 1, wherein the second temperature adjustment unit includes a temperature controller common to the first and second storage tanks. The second temperature adjustment means includes a first temperature controller corresponding to the first storage tank, and a second temperature controller corresponding to the second storage tank,
The second circulation path is:
During operation of the first storage tank, a treatment liquid is circulated through the second storage tank and the second temperature controller,
The fourth circulation path is
5. The substrate processing apparatus according to claim 1, wherein a processing liquid is circulated through the first storage tank and the first temperature controller during operation of the second storage tank. A processing unit that performs processing using the processing liquid on the substrate, first and second storage tanks for storing the processing liquid, and first and second temperature control means that adjust the temperature of the processing liquid are used. A substrate processing method,
Circulating the treatment liquid to the first storage tank, the first temperature control means, and the processing unit during the processing of the processing unit during operation of the first storage tank;
Circulating the treatment liquid to the second storage tank and the second temperature control means during operation of the first storage tank;
Circulating the treatment liquid to the second storage tank, the first temperature control means, and the processing unit during the processing of the processing unit during operation of the second storage tank;
And a step of circulating a processing liquid through the first storage tank and the second temperature control means during operation of the second storage tank.

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