JP2005236232A - Connection substrate, method for fixing in position, method for manufacturing solid-type multi-layer substrate, press apparatus, and multi-layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer substrate where a plurality of connection substrates are laminated together and a solid-type multi-layer substrate where the multi-layer substrate is formed into solid efficiently and accurately in position. <P>SOLUTION: The manufacturing method includes a process to position the plurality of the connection substrates having at least an insulation resin layer, a connecting conductor formed to penetrate the insulation resin layer, and/or wiring, a process to adhere thermally the predetermined place of the plurality of the connection substrates positioned to fix in position, a process to heat-press the plurality of the connection substrates fixed in position to be joined together so as to form laminated layers, and a process to press the substrate joined together at a high temperature, sandwiching the substrate by dies with a desired shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a connection substrate, a positioning and fixing method, a manufacturing method of a three-dimensional multilayer substrate, a press apparatus, and a multilayer substrate.

  In recent years, the social environment surrounding us has changed greatly with the development of information and communication networks. Among them is the growth of mobile devices, and the market is expanding with miniaturization and high functionality. For this reason, further miniaturization of semiconductor packages and a multilayer wiring board capable of mounting them at high density are required, and interlayer connection capable of high-density wiring, that is, high-density multilayer technology is important.

  As a main multilayering method, there is a through-hole connection combining drilling and plating processes, which is widely known. However, since holes are formed in all layers, the wiring capacity is limited.

  Therefore, in order to reduce the hole volume of the connection part, a build-up technique that repeats formation of the insulating resin composition layer, drilling, and circuit formation is becoming mainstream. This build-up technology is roughly classified into a laser method and a photolitho method. The laser method performs laser irradiation to make a hole in the insulating resin composition layer, while the photolitho method uses an insulating resin composition. A photosensitive curing agent (photoinitiator) is used for the layer, a photomask is overlaid, exposed and developed to form holes.

  On the other hand, the development of high-density mounting technology for semiconductor packages is accelerating in response to the ever-increasing size and functionality of information and electronic devices. For this reason, not only a multilayer substrate but also a semiconductor mounting substrate is required to have a high-density wiring formation technique as well as to be thin. One of the requirements is the formation of a via structure directly above. The purpose of this is to improve the degree of freedom of wiring design corresponding to flip-chip mounting, and to improve the wire bonding property to the buildup layer (see Non-Patent Document 1).

  In view of these requirements, a collective stacking technique has attracted attention as a novel substrate manufacturing method. Collective lamination technology is a process in which a wiring layer is formed on an insulating resin layer and members with conductive connection parts are formed in the insulating resin layer. Conductive connection is made between the layers. With this technology, it is considered that not only the formation of the via structure directly above but also the reduction of the coreless thickness can be achieved. In terms of manufacturing, it can be expected to significantly shorten delivery times. For this reason, collective lamination technology has been announced by each company (see Non-Patent Documents 2 to 11).

  Looking at the main construction methods, a thermosetting resin or a thermoplastic resin is used for the insulating resin, and a conductive paste or a plated copper plated with solder is used for the conductive connection portion. A wiring layer is formed by etching from a metal layer previously provided on an insulating layer, and a method of transferring a wiring onto a conductive portion has been developed.

  The inventor has also invented a batch lamination method (see Patent Document 1) in which a drilling step necessary for forming an interlayer connection is omitted (see Patent Document 1), and a temporary fixing method for efficiently manufacturing a connection substrate and the connection substrate Invented a positioning and fixing method performed before the step of laminating a plurality of sheets (see Patent Document 2). Among these, a connection substrate using a liquid crystal polymer that is a thermoplastic resin will be taken as an example and described as a conventional technique.

  This connection substrate has electrodes exposed by polishing after a group of bumps formed by etching from a three-layer clad foil is embedded in a liquid crystal polymer. The opposite surface has a wiring layer formed by etching from a metal layer thinned by half etching, and a gold plating layer or the like is formed on the surface of the electrode and the wiring. By aligning these members and then laminating them at a high temperature, the resin can be re-melted, and the bumps and wirings or the surfaces of the bumps can be alloyed by solid-phase metal diffusion and conductively connected in the layer direction. Furthermore, after positioning a plurality of connection boards using a jig having a guide pin, fixing and fixing a predetermined location by heat melting, a plurality of connection boards can be stacked together with high positional accuracy by pressing them. it can.

In recent years, formation of three-dimensional circuits has attracted attention. Conventionally, a three-dimensional printed wiring board in which a three-dimensional circuit is formed and can correspond to various shapes is manufactured by forming a wiring after first three-dimensionally molding a resin. However, this method requires an expensive process device and limits applicable objects to single-sided or double-sided plates.
Japanese Patent Application No. 2001-391799 Japanese Patent Application No. 2002-370933 Itaya, 4 others, “Wire bonding of via post type build-up wiring board”, 7th Microelectronics Symposium, P157-160, October 1997 Tanokura, and one other, "It's not a printed circuit board yet. Part 2 is a single layer and includes only half-cost built-in components." Nikkei Electronics, P120-127, April 2002 Takenouchi and one other, “Development of Polyimide Film Multilayer Substrate, 10th Circuit Packaging Conference, P81-82, March 1996 Ishino, et al., “Development of multilayer wiring boards by batch lamination of tape-like films”, Journal of Electronics Packaging Society, Vol. 1, No. 2, P124-129, 1998 Enomoto and two others, “Development of all-layer IVH wiring board by batch lamination press method”, 13th Electronics Packaging Conference, P203-204, March 1999 Hayashi, “Batch cure multilayer wiring board and its application”, Electronics Packaging Society 2000 Special Seminar Text, P15-22, 2000 Oishi, “Low-cost technology for multilayer substrates, Sekisui Chemical develops new tape”, Nikkei Electronics, P26-27, March 2002 Okada and 4 others, “Batch multilayer and fine interlayer connection technology using lead-free solder”, Chemical Engineering Society 35th Autumn Meeting, B314, P74, September 2002 Kondo, “PALAP's Latest Technology Development Trends and Future Issues and Prospects”, PWB-10, Printed Wiring Board EXPO, January 2003 Karasawa, “Development of all-layer IVH structure wiring board by implant method”, PWB-10, Printed wiring board EXPO, January 2003 Enomoto, “Summary of the latest technology of all-layer IVH structure wiring board and future issues and prospects”, PWB-10, Printed wiring board EXPO, January 2003

  In view of the above, a main object of the present invention is to provide a multilayer substrate obtained by laminating a plurality of connection substrates at once, and a method for efficiently and accurately producing a three-dimensional multilayer substrate obtained by molding the multilayer substrate. Is to provide.

  The inventor positions and stacks a plurality of connection boards in advance with a positioning jig or the like, and positions and fixes them by heat fusion, thereby performing batch multi-layering and three-dimensional molding by subsequent high-temperature pressing. As a result, the multilayer substrate and the three-dimensional multilayer substrate can be manufactured efficiently and with high positional accuracy, and the multilayer substrate and the three-dimensional multilayer substrate can be more efficiently used by using a press device described later during high-temperature pressing. The inventors have found that it can be produced, and have come to make the present invention.

  That is, the present invention is characterized by the following descriptions (1) to (12).

  (1) A connection substrate including at least an insulating resin layer, a connecting conductor formed so as to penetrate the insulating resin layer, and / or a wiring, wherein the insulating resin is made of a thermosetting resin and / or a thermoplastic resin. A connection board characterized by that.

  (2) The connection board according to (1), wherein the connection conductor and / or the wiring contains rolled copper.

  (3) After aligning a plurality of the connection substrates described in the above (1) or (2), when fixing a plurality of predetermined portions by thermal fusion, in order to prevent the entire substrate from moving relatively in advance, A positioning and fixing method, wherein a hole is formed in the connection substrate.

  (4) a step of aligning a plurality of connection substrates each including at least an insulating resin layer, a connecting conductor formed so as to penetrate the insulating resin layer, and / or a wiring; and the plurality of aligned connection substrates A step of heat-bonding a predetermined portion and positioning and fixing, a step of heating and pressing the plurality of connection substrates that have been positioned and fixed, and stacking and integrating, and a substrate having a desired shape is sandwiched between molds And a high-temperature pressing step for manufacturing a three-dimensional multilayer substrate.

  (5) The method for producing a three-dimensional multilayer substrate according to the above (4), wherein the heat source of the heat fusion is a heated metal or laser.

  (6) The method for producing a three-dimensional multilayer substrate according to (4) or (5) above, wherein the connecting conductor and / or the wiring contains rolled copper.

  (7) A stage having a first cavity having an opening on the upper side and a second cavity having an opening on the lower side at a position facing the opening of the first cavity are formed in the vertical direction. A press apparatus comprising: an operable chamber; and a press body which is installed in the first and second cavities and whose pressing surface is a hot platen.

  (8) The press apparatus according to (7), wherein the press surface of the press body has a desired three-dimensional shape.

  (9) During pressing, the chamber is lowered so that the first and second cavities form one closed system, and in the closed system, the both sides of the press body are almost covered by the press body under reduced pressure. The press apparatus according to (7) or (8) above, wherein high-temperature pressing is performed simultaneously.

  (10) A method for producing a multilayer substrate, comprising using the pressing device according to any one of (7) to (9) above.

  (11) A multilayer substrate produced by the production method described in (10) above.

  (12) The multilayer substrate according to (11), which is a three-dimensional multilayer substrate.

  According to the present invention, it is possible to efficiently and accurately position a plurality of connection boards, in particular, a multilayer board on which three or more layers of connection boards are stacked, and a three-dimensional multilayer board formed by molding the same. Can be manufactured well. Moreover, it becomes possible to manufacture a multilayer board | substrate and a three-dimensional multilayer board | substrate more efficiently by using a specific press apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto.

  First, the manufacturing method of the connection board used for this invention is demonstrated.

  A composite metal layer including at least a second metal layer serving as a carrier and a first metal layer having a different removal condition from the second metal layer is provided on one side or both sides of a support base. It arrange | positions so that it may become the said support base material side, and heat-presses and temporarily fixes. In FIG. 1 (a), as the support base material, a support base material 45 arranged in the order of a release base material 451, an adhesive resin 452, and a release base material 451 is used. As the composite metal layer, a first metal layer 41, a second metal layer 42, a third metal layer 41 located between the first metal layer 41 and the second metal layer 42 and having different removal conditions. It is the figure which has arrange | positioned the composite metal layer 4 of 3 layers which consists of these metal layers 43. FIG. FIG. 1B is a diagram showing a state in which the composite metal layer 4 and the support base 45 in FIG.

  As the support base material 45, for example, as shown in FIG. 1 (a), it is possible to use a material that is arranged in the order of a release base material 451, an adhesive resin 452, and a release base material 451. As the mold release substrate, for example, electrolytic copper foil, rolled copper foil or the like can be used, and the area is made smaller than that of the composite metal layer and the adhesive resin. By doing in this way, the composite metal plate 4 can be adhere | attached by fusion | melting of adhesive resin around a mold release base material. In addition, as the adhesive resin, a semi-cured and / or cured thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used.

  Examples of the thermosetting resin include epoxy resin, bismaleimide triazine resin, polyimide resin, cyanoacrylate resin, phenol resin, unsaturated polyester resin, melamine resin, urea resin, polyisocyanate resin, furan resin, resorcinol resin, xylene. One or more selected from resin, benzoguanamine resin, diallyl phthalate resin, aramid resin, epoxy-modified polyimide resin, silicone-modified epoxy resin, silicone-modified polyamideimide resin, benzocyclobutene resin, and, if necessary, What mixed the hardening | curing agent, the hardening accelerator, etc. and heated and made it semi-hardened, or what hardened | cured can be used.

  Examples of the photocurable resin include one or more selected from unsaturated polyester resins, polyester acrylate resins, urethane acrylate resins, silicone acrylate resins, epoxy acrylate resins, and the like, and if necessary, the light. What mixed the initiator, the hardening | curing agent, the hardening accelerator, etc. into the semi-hardened state by exposure or heating, or what hardened | cured can be used.

  Examples of the thermoplastic resin include polycarbonate resin, polysulfone resin, polyetherimide resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, vinyl chloride resin, and polyethylene resin. , Polyamideimide resin, polyphenylene sulfide resin, polyoxybenzoate resin, wholly aromatic polyester resin, liquid crystal polymer, etc., and if necessary, the curing agent, curing accelerator, etc. were mixed A semi-cured or heated product can be used.

  These resins may be a resin composition composed of a mixture of different kinds of resins, and may further contain an inorganic filler such as silica or metal oxide as a filler. As the inorganic filler, for example, conductive particles such as nickel, gold, silver, or resin particles plated with these metals can be used. Alternatively, a glass woven fabric or non-woven fabric impregnated with an adhesive resin and semi-cured or cured may be used. However, when a filler is added, it is important that the rigidity of the resin composition and the adhesion between the resin composition and the composite metal layer be maintained.

  The composite metal layer is preferably a composite metal layer including at least a second metal layer serving as a carrier and a first metal layer having a different removal condition from the second metal layer. It is more economically preferable to use a composite metal layer 4 having three layers as shown in FIG.

  This is because copper or rolled copper is preferably used for the first metal layer for economic reasons, and nickel or an alloy thereof is preferably used for the second metal layer having different etching removal conditions from the copper. Although considered, nickel and its alloys are more expensive than copper. However, when the composite metal layer is composed of two layers, a high mechanical strength is required for the second metal layer that supports the connection conductor formed from the first metal layer. It is necessary to use a lot of expensive metal. In that respect, as the third metal layer, a three-layer composite metal layer obtained by forming a relatively thin expensive metal layer having different etching removal conditions from the first and second metal layers between them is Since the second metal layer can be the same inexpensive copper or rolled copper as the first metal layer, it is economical and excellent in mechanical strength.

  The thickness of the third metal layer of such a composite metal layer composed of three layers is preferably thin as described above, and is preferably in the range of 0.05 to 5 μm. If the thickness is less than 0.05 μm, the plating film forming the layer of nickel or an alloy thereof is thin enough to be covered with the plating film because it is thin, so-called pits (plating defects) occur, and the first When the metal layer is removed by etching, the second metal layer may be eroded or the etching solution may remain, which may reduce connection reliability. Even if it exceeds 5 μm, there is no problem in the process, but the cost of the material becomes high and it is not economical.

  The first metal layer is preferably formed thicker than the desired insulating layer thickness in order to form a connecting conductor. The degree must be determined according to the amount by which the first metal layer is polished and removed in the step of polishing the insulating resin composition layer, but is preferably in the range of 5 to 100 μm. If the thickness is less than 5 μm, the distance of the conductor circuit to be connected may be reduced and the insulation may be reduced. If the thickness exceeds 100 μm, unnecessary portions of the metal foil may be removed by etching. Processing accuracy is lowered, which is not preferable. More preferably, it is the range of 20-80 micrometers.

  The thickness of the second metal layer is preferably in the range of 5 to 100 μm. If the thickness is less than 5 μm, the mechanical strength decreases, and the first metal layer is easily bent or bent when the first metal layer is removed by etching. If the thickness exceeds 100 μm, it takes time to remove the second metal layer thereafter. Cost and not economical. More preferably, it is the range of 10-80 micrometers.

  Next, the first metal layer is partially removed to form a connection conductor. When the composite metal layer 4 including three layers is used as shown in FIG. 1, the first metal layer 41 is used. Then, the etching resist is removed, and then the third metal layer 43 is partially removed. FIG. 1C is a view showing a state in which an etching resist 44 is formed at a location where the connection conductor is formed in the composite metal layer 4 temporarily fixed on both surfaces of the support base 45. ) Is a diagram showing a state in which the first metal layer 41 and the third metal layer 43 are partially removed sequentially to form the connection conductor 13.

  Next, as illustrated in FIG. 1E, one or more insulating resin composition layers 121 are formed so as to cover at least the periphery of the connection conductor 13.

  This insulating resin composition layer is a layer obtained by semi-curing and / or curing a composition containing at least an insulating resin such as a thermosetting resin, a photocurable resin, or a thermoplastic resin.

  Examples of the thermosetting resin include epoxy resin, bismaleimide triazine resin, polyimide resin, cyanoacrylate resin, phenol resin, unsaturated polyester resin, melamine resin, urea resin, polyisocyanate resin, furan resin, resorcinol resin, xylene. One or more selected from resin, benzoguanamine resin, diallyl phthalate resin, aramid resin, epoxy-modified polyimide resin, silicone-modified epoxy resin, silicone-modified polyamideimide resin, benzocyclobutene resin, etc. What mixed the hardening | curing agent, the hardening accelerator, etc. was heated and made into the semi-hardened state, or what hardened | cured can be used.

  Examples of the photocurable resin include one or more selected from unsaturated polyester resins, polyester acrylate resins, urethane acrylate resins, silicone acrylate resins, epoxy acrylate resins, and the like, and if necessary, the light. What mixed the initiator, the hardening | curing agent, the hardening accelerator, etc. into the semi-hardened state by exposure or heating, or what hardened can be used.

  Examples of the thermoplastic resin include polycarbonate resin, polysulfone resin, polyetherimide resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, vinyl chloride resin, and polyethylene resin. One or more selected from polyamideimide resin, polyphenylene sulfide resin, polyoxybenzoate resin, (total) aromatic polyester resin, liquid crystal polymer, and the like can be used. Furthermore, a film obtained by heating, molding and cooling at least one of the above thermoplastic resins can be used.

  In the insulating resin composition layer of the present invention, the insulating resin as described above may be used alone, or a mixture of different kinds of insulating resins may be used, and a material containing an inorganic filler as a filler may be used. Good. As the inorganic filler, conventionally known ones can be used, and are not particularly limited. Examples thereof include conductive particles such as nickel, gold, and silver, silica, metal oxide, or resin particles obtained by metal plating these. . Further, a glass woven fabric or non-woven fabric impregnated with an insulating resin and semi-cured or cured can also be used. Desirably, in order to ensure the insulation of the insulating resin composition, a non-conductive material is preferable.

  In addition, it is preferable that the insulating resin composition used for the connection substrate of the present invention contains a thermoplastic resin because it can save the trouble of applying the resin to the surface of the substrate anew when multilayering. More preferably, it is an insulating resin composition containing a liquid crystal polymer which is a thermoplastic resin. When an insulating resin composition containing a liquid crystal polymer is used, its linear expansion coefficient can be brought close to the linear expansion coefficient of copper, which is effective for laminating the insulating resin composition at the same time as connecting the connection conductors. is there. The liquid crystal polymer used in the present invention preferably has a phase transition temperature from a smectic phase to a nematic phase of 180 ° C. or higher, more preferably 280 ° C. or higher because it can withstand the reflow processing temperature of leadless solder. Specifically, Xydar SRT-300, SRT-500, FSR-315, RC-210, FC-110, FC-120, FC-130 (above, Nippon Petrochemical Co., Ltd., trade name), Econol E2000 (Commercial name, manufactured by Sumitomo Chemical Co., Ltd.) Series, Econol E6000 (Product name, manufactured by Sumitomo Chemical Co., Ltd.) Series, Vectra A950, Vectra A130, Vectra C130, Vectra A230, Vectra A410 (above, Polyplastics (Trade name), EPE-240G30 (trade name, manufactured by Mitsubishi Kasei Co., Ltd.), Rod Run LC-5000H (trade name, manufactured by Unitika Ltd.), Novacurate E322G30, E335G30, EPE-240G30 (and above) , Manufactured by Mitsubishi Chemical Corporation, trade name), BIAC (Japan Gore-Tex Co., Ltd.) Ltd., trade name), and the like.

  In addition, as a method of forming the insulating resin composition layer, the insulating resin composition can be formed by directly applying the insulating resin composition to the substrate surface on which the connection conductor is formed, but a plastic film such as a polyethylene terephthalate film or copper Foil, metal foil such as aluminum foil is used as a carrier, the insulating resin composition is applied to the surface, the adhesive sheet made into a dry film by heating and drying is cut to the required size, and a conductor for connection is formed It can also be formed by laminating or pressing the substrate.

  Moreover, it is preferable that the thickness of the insulating resin composition layer is in the range of 1 to 100 μm. If the thickness is less than 1 μm, it is difficult to form the insulating resin composition with a uniform thickness to such an extent that the adhesive strength does not decrease, and if it exceeds 100 μm, it becomes difficult to expose the connecting conductor. More preferably, it is the range of 3-70 micrometers.

  Moreover, since it is not preferable in terms of connection reliability that bubbles are entrained in the insulating resin composition layer covering the connection conductor, it is more preferable that bubbles do not exist as much as possible.

  Further, the insulating resin composition layer may be one layer or two or more layers, but forming two or more layers alleviates thermal stress generated on the substrate surface in the process of pressing, polishing, etc. This is preferable because warpage of the film can be reduced. In addition, when forming two or more insulating resin composition layers, not only the type of insulating resin composition to be used, but also the hardness of the resin after molding, the thickness of the resin after molding, the difference in molecular orientation, the filler It is preferable to distinguish them depending on the presence or absence of the filler, the type or content of the filler, the average particle diameter of the filler, the particle shape of the filler, the specific gravity of the filler, and the like. In addition, when a liquid crystal polymer is used to make the insulating resin composition layer a multi-layer structure as described above, the liquid crystal polymer can be formed by utilizing the property that it easily forms a multi-layer structure based on molecular orientation when molded. It can be used alone to form a multilayer structure.

  In addition, before the insulating resin composition layer is formed (see FIG. 1D), the surface of the exposed second metal layer is roughened to improve the adhesion strength with the insulating resin composition. ,preferable.

  The insulating resin composition layer is preferably formed using an adhesive sheet made of an insulating resin composition, and a plurality of different or similar sheets may be used in a stacked manner.

  Next, as shown in FIG. 1 (f), after polishing the insulating resin composition layer 121 so that the connecting conductor 13 is exposed, the connecting conductor 13 penetrates in the thickness direction of the insulating resin composition layer 121. By peeling the composite metal layer 4 thus formed from the support base material 45, a connection substrate 11 as shown in FIG. 1 (g) can be obtained. Further, by partially removing the second metal layer 42, a connection substrate having a conductor circuit 103 as shown in FIG. Here, it is important that the connecting conductor is formed so as to penetrate the insulating resin composition layer in the thickness direction at least at a location where the conductor circuit is connected.

  Further, the surface of the connecting conductor exposed by polishing the insulating resin composition layer and / or the surface of the conductor circuit formed on the surface of the connecting conductor is further overlaid with metal foil, metal plating, etching, etc. By performing this process, a conductor circuit can be additionally formed or a metal film can be applied. FIG. 1I is a diagram in which a metal film 21 is formed on the connection conductor surface 13 and the conductor circuit 103 of the connection substrate 11 in FIG. For example, the metal film 21 may be formed by applying electroless copper plating after applying palladium, vacuum film forming method such as copper sputtering or chromium base copper sputtering, metal paste printing such as silver paste, displacement gold plating, nickel / gold electrolysis or the like. It can be formed by plating such as electroless plating, electrolysis of nickel / palladium / gold plating or electroless plating, or electroless plating of tin or a tin alloy.

  Further, a protruding conductor called a bump may be formed on a conductor circuit connected to the connection conductor. In order to form the bumps on the connection substrate of the present invention, portions other than the relatively thick conductor protrusions are half-etched in the thickness direction to form protrusions, and the conductor circuit portions and protrusions further thinned. It can be formed by etching away other parts while leaving In another method, after the circuit is formed, only the connection terminal portion is thickened by plating.

  The exposed state of the connecting conductor may protrude from the surface of the insulating resin composition layer, or may enter the inside from the surface of the insulating resin composition layer. The former can be protruded by adding a new metal layer after being polished flat, as will be described later. The latter is possible, for example, by etching back with an etching solution.

  The thickness of the connecting conductor is preferably in the range of 5 to 100 μm. When the thickness is less than 5 μm, the interlayer distance of the conductor circuit to be connected may be reduced and the insulation may be lowered. When the thickness exceeds 100 μm, unnecessary portions of the metal foil are removed by etching. This is not preferable because the processing accuracy is reduced. More preferably, it is the range of 20-80 micrometers.

  In addition, since the composite metal layer is not bonded to the support substrate, the connection substrate is separated from the support substrate by cutting so that the entire surface of the support base material in contact with the second metal layer becomes the release base material. It can be easily detached and the connection board can be manufactured very efficiently.

  Next, a method for producing the multilayer substrate and the three-dimensional multilayer substrate of the present invention using a plurality of connection substrates obtained as described above will be described.

  FIG. 2 is a view showing a state in which guide holes 22 are formed in some of the connection conductors of the connection board of FIG.

  This guide hole 22 is for passing a guide pin and aligning it when multilayering the connection substrate 11 using a jig described later. Of course, the guide hole 22 may be provided in addition to the connection conductor 13, but by forming the guide hole 22 in the connection conductor 13 as described above, the guide hole 22 can be reinforced and the alignment accuracy can be improved. ,preferable. When the guide hole 22 is formed in the connection conductor 13, it is necessary to make the hole area of the guide hole smaller than the area of the connection conductor 13 exposed from the insulating resin composition layer 121. The formation is not particularly limited, but it is preferable to use an NC drill that can image a land portion of a wiring layer provided in contact with the connection conductor 13 and drill a hole at an accurate position. If there are many guide holes, it is necessary to first form two guide holes, place a guide pin there, then place an NC drill on the basis of this and form other guide holes. Position accuracy can be improved, which is preferable.

  Next, a plurality of connection boards are sandwiched using an alignment jig in which guide holes are accurately provided. FIG. 4A is a diagram showing a state in which four connection substrates are sandwiched between alignment jigs.

  As shown in FIG. 3A, the positioning jig used in the present invention includes a pedestal 31 to which a guide pin 311 is welded, a position correcting intermediate plate 32 having a guide hole through which the guide pin 311 passes, and a backing sheet. 33, an upper sheet 34, and a holding jig 35, and a plurality of connection boards are sandwiched between the lower sheet 33 and the upper sheet 34 to perform alignment. Here, the intermediate plate 32 for position correction is used to correct the positional accuracy error caused by the guide pin fluctuation and repeated use, and the upper sheet 34 and the holding jig 35 are shown in FIG. And as shown in FIG.3 (c), it has the notch part 36 in each square side.

  Next, in the state shown in FIG. 4A with the four connection substrates 11 sandwiched therebetween, in the cutout portion 36 (see FIGS. 3B and 3C) formed in the upper sheet 34 and the holding jig 35, After the four connection boards are heat-sealed using a soldering iron or the like (FIG. 4B), this is removed from the alignment jig, and as shown in FIG. A plurality of connection substrates that are positioned and fixed by the portion 444 can be obtained.

  Here, a soldering iron is used as an example, but other than this, a heated metal rod, a heat source such as a laser can be used, and it is possible to heat not only above the connection board but also from below or both above and below. it can.

Furthermore, a release film such as a polyimide film is placed on both surfaces of the plurality of connection substrates obtained as described above, and is heated and pressurized to be laminated at once, and then the release film is peeled off, whereby FIG. The multilayer substrate 10 of the present invention as shown in FIG. Furthermore, after the collective laminating step, a three-dimensional multilayer substrate of the present invention can be obtained by placing molds having a desired three-dimensional shape on both sides of the multilayer substrate 10 and performing high-temperature pressing. In addition, when batch stacking, for example, as shown in FIG. 5 (b), there may be a case where a connecting structure of each layer has a crank-like structure that is not on an extension line passing through the connection board. The conductor circuit may be deformed and the stability of the connection resistance may be impaired. Therefore, it is preferable to use an insulating resin composition having a high elastic modulus for the insulating resin composition layer of the connection substrate that is inside the multilayer substrate. When the insulating resin composition layer is composed of two or more layers, it is desirable that the resin layer in contact with the conductor circuit has a high elastic modulus. The specific value of the elastic modulus is preferably 0.0001 GPa or higher at the heating temperature,
It is more preferably 01 GPa or more, and particularly preferably 0.01 GPa or more. The dynamic elastic modulus of the insulating resin composition can be measured by using ARES (parallel plate, temperature rising at a frequency of 1 Hz, 5 ° C./min.) Manufactured by Rheometric.

  In addition, a multilayer substrate may be manufactured by collectively laminating a substrate having a conductor circuit and / or a metal foil together with a connection substrate. Furthermore, an outer layer circuit may be formed on the outermost layer of the multilayer substrate by plating or etching after batch lamination.

  Moreover, it is preferable to use the insulating resin composition containing a thermoplastic resin for the insulating resin composition layer used as the outermost layer of a multilayer substrate, and it is more preferable that it contains a liquid crystal polymer.

  When a multi-layer substrate is manufactured by positioning and fixing up to four layers of connection substrates as described above and heating and pressurizing the connection substrates, it can be laminated with high positional accuracy by the above method, and gold-gold, Conductive connection due to alloying of gold-tin and tin-tin can be confirmed, but if a multi-layer board having five or more layers is manufactured by the same method, there is a hole in the board when the connection board is heat-sealed. In some cases, there may be a problem that the heat treatment is not sufficiently performed to the lower layer, and stable positioning and fixing cannot be performed.

  Therefore, an improvement method was examined by taking this four-layer prototype as an example. That is, the number of layers of the heat-sealed portion is set to 4 layers or less, and a hole is selectively drilled in advance with an NC drill drilling machine or the like so as to be positioned and fixed over all the layers. did. By performing such drilling, five or more layers at the same place are not thermally fused at the same time, and all the layers can be positioned and fixed stably. FIG. 6 shows an example of a plurality of connection boards in which such holes are drilled and four connection boards are positioned and fixed. Basically, this method can be used even when the number of layers is four or less, and here, the cross section is shown with the total number of layers being four.

  In FIG. 6A, a hole 611 is provided in advance at a selected portion of the A layer 61, and the three layers, the B layer 62, the C layer 63, and the D layer 64, which are the lower part thereof, are thermally fused. The size of the hole to be drilled in advance is not particularly limited as long as it is larger in diameter than the heat source used when heat-sealing. Furthermore, in order to position and fix all the layers, it is necessary to heat-fuse at least a predetermined portion of the A layer other than the above and a predetermined portion of the other layer. In FIG. 6A, the predetermined portions of the four layers of the A layer, the B layer, the C layer, and the D layer are thermally fused.

  In addition, when there is a connection substrate whose insulating resin composition layer is a thermosetting resin between the connection substrates to be laminated, it is preferable to selectively drill holes from the connection substrate. For example, when the B layer is a connection board using a thermosetting resin, as shown in FIG. 6B, a hole is made in a selected portion of the B layer 66, and the A layer 65 positioned above and below the hole. The predetermined portions of the three layers of the C layer 67 and the D layer 68 are thermally fused. Of course, in order to position and fix all the layers, it is necessary to heat-seal at least other portions of the B layer and other layers. In FIG. 6B, the A layer and the B layer are thermally fused.

  By such a method, it is possible to stably position and fix a connection substrate of 5 layers or more as well as up to 4 layers, and it is possible to manufacture a multilayer substrate with high positional accuracy.

  Next, a press apparatus according to the present invention capable of producing a multilayer substrate by efficiently laminating a plurality of positioning substrates fixedly bonded together as compared with the prior art will be described.

  In the press device of the present invention, a stage in which a first cavity having an opening portion is formed on the upper side, and a second cavity having an opening portion on the lower side are formed at a position facing the opening portion of the first cavity, It is characterized by comprising at least a chamber that can be operated in the vertical direction and a press body that is installed in the first and second cavities and whose pressing surface is a hot platen. Thus, it is preferable that the first and second cavities form one closed system, and in the closed system, both sides of the press body are pressed at a high temperature almost simultaneously with the press body under reduced pressure. By using this press apparatus at the time of batch lamination or three-dimensional molding, it is possible to manufacture a multilayer substrate efficiently.

  FIG. 7A is a cross-sectional view showing a preferred embodiment of the press device, which is a stage 711, a first cavity 712 formed on the stage 711 and having an opening on the upper side, installed in the cavity 712, and Lower mold press body having a mold heat plate 713 and a lower mold heat insulating portion 714 for preventing the lower mold heat plate 713 from contributing to the temperature rise of the stage, and an operating unit and heat supply connected to the lower mold press body 715, a transport unit 716 that transports the press body on the stage 711, a chamber 721 positioned above the stage 711, a second cavity 722 formed in the chamber 721 and having an opening below, inside the cavity 722 And an upper mold heat plate 723 and an upper mold heat insulating portion 724 for preventing the upper mold heat plate 723 from contributing to the temperature rise of the chamber 721. An upper press body, a heat supply unit 725 connected to the upper press body, a pressure reducing via hole 726 for reducing the pressure in one closed system formed by lowering the chamber, and atmospheric pressure in the system A leak hole 727 for returning to the inside and a seal portion 717 for keeping the inside of the system in a sealed state are provided.

  Moreover, the to-be-pressed body 731 mounted on the transport unit 716 includes at least a plurality of connection substrates that are positioned and fixed and insulating resin composition layers such as polyimide films on both surfaces thereof. A three-dimensional multilayer substrate according to the present invention can be obtained by arranging molds having a desired three-dimensional shape on both sides of the press body 731 and heating and pressing them with the press body. In addition, for example, a metal plate such as a SUS plate, or a material in which a cushion material is disposed outside the SUS plate (732), and a material including a jig for fixing them may be disposed on both sides of the pressed body. Further, when the press surface of the press body has a desired three-dimensional shape, it is not necessary to sandwich the pressed body with a separate mold as described above, and the three-dimensional multilayer substrate of the present invention can be manufactured more efficiently. Is possible.

  As shown in FIG. 7 (a), which shows the movement of the pressed body from the side, the chamber is on the side wall and is not opened, but the chamber is lowered from above, and the stage below is the chamber. As shown in FIG. 7B as viewed from the direction of movement of the pressed body, the pressed body is heated almost simultaneously by a press body having a hot platen whose temperature has already been raised. It has a mechanism to be pressurized. Thereby, the heating time of the press body can be deleted from the process time. This configuration also greatly reduces the volume of the chamber itself, and greatly improves the time to reach the degree of vacuum and the time to return to atmospheric pressure.

  Next, with reference to FIG. 8, a process of heating and pressurizing a plurality of connection substrates, which are positioned and fixed, using the press apparatus of FIG. 7 as a press body will be described.

  FIG. 8A shows a state in which the pressed body 731 to be inserted from the left is waiting. As shown in FIG. 8 (b), the press body 731 is carried onto the conveyance unit in the first cavity 712 by the conveyance unit 716. As shown in FIG. 7B, the transport unit 716 has a transport unit shaft 7161, which can be interlocked with the standby transport unit.

  Next, as shown in FIG. 8C, the chamber 721 is lowered to form a system in which the second cavity 722 and the first cavity 712 are closed. At this time, if the thickness of the pressed body 731 is determined in advance between the pressed body and the upper mold heating plate 723, the pressed body 731 can be brought into a short distance so as not to contact. The periphery of the chamber is pressed against the seal portion 717 of the stage. After the closed system is formed, the pressure is reduced from the pressure reducing via hole 726 by a rotary pump or the like. The rotary pump is always operated, and the pressure reduction can be started with the electromagnetic valve when the lowering of the chamber is completed. In conventional press devices, it took 10 minutes or more to achieve a vacuum of 13.3 Pa even after roughing with a rotary pump and high vacuuming with a mechanical pump. According to the apparatus, since the volume of vacuum is small, it is possible to reach the degree of vacuum of 13.3 Pa in about 60 seconds with only a small rotary pump.

  Next, as shown in FIG. 8 (d), the working unit / heat supply unit 715 rises, lifts the pressed body from the transport unit, and presses it against the upper mold hot platen 723. Heat and pressurize.

  Next, as shown in FIG. 8 (e), after the heating and pressurization is completed, the working unit / heat supply unit 715 is lowered to sequentially separate the pressed bodies from the upper mold heating plate 723, and to place the conveyance unit. It can be separated from the lower heating platen 713. Thereby, although there is a time lag, heating and pressurization can be completed almost simultaneously.

  Next, as shown in FIG. 8 (f), the leakage solenoid valve connected to the leak hole 727 is operated in conjunction with the end of the lowering of the working / heat supply unit 715, and the cavity is closed. The system is returned to atmospheric pressure, and the chamber is raised to the original position in conjunction with the leak time or pressure gauge. According to this apparatus, as described above, since the volume of the decompressed portion is small, it can be returned to atmospheric pressure in about 1 minute.

  Finally, as shown in FIG. 8G, in conjunction with the end of the chamber rise, the in-stage chamber transport unit and the transport unit in the unloading direction are operated to unload the pressed body. At this time, since the pressed body is still hot, a heat-resistant member is used for the conveyance unit in the carry-out direction. Further, a mechanism may be provided in which the press body is automatically stored in the cooling revolver and naturally cooled first from the conveying section in the carry-out direction.

  According to this press apparatus, it is possible to greatly reduce the time from when the press body to be heated and pressed is put into the press apparatus to when it is carried out. Specifically, what took 3 hours to 4 hours can be reduced to 10 minutes or less.

  According to the manufacturing method as described above, a multilayer substrate and a three-dimensional multilayer substrate can be manufactured efficiently and with high positional accuracy. In addition, 1) drilling steps such as through-hole formation can be omitted. 2) A strong filled via structure can be formed. 3) Since it is a batch lamination, it can be made thinner. 4) It can cope with fine wiring circuits. 5) Warpage can be suppressed. 6) Cost can be reduced. 7) The dimensional stability can be improved. 8) The initial thickness in the wiring layer of the composite foil can be reduced. 9) Roughening on the wiring layer side can be prevented in the roughening treatment step before forming the insulating resin. 10) Multi-layering with high position accuracy is possible. 11) The wiring is transferred to the insulating resin, and the insulation between the wirings is improved. 12) Since the structure is uniform, the disconnection caused by the thermal history can be drastically reduced. 13) Effects such as excellent high frequency characteristics can be obtained.

(Example 1)
<Manufacture of connection board>
As shown in FIG. 1A, the first metal layer 41 is copper having a thickness of 70 μm, the third metal layer 43 is nickel having a thickness of 0.2 μm, and the second metal layer 42 is thick. A composite metal layer 4 made of 18 μm thick copper, with the first metal layer 41 on the outside, and an electrolytic copper foil YGP-18R (product name) 451 as a mold release substrate, Three pieces of liquid crystal polymer BIAC film 100 μm (trade name, manufactured by Japan Gore-Tex Corporation) 452 are arranged in the order of electrolytic copper foil YGP-18R (trade name, manufactured by Nippon Electrolytic Co., Ltd.) 451 as a release substrate. At this time, the electrolytic copper foil 451 had a smooth surface outside. Moreover, as shown in the figure, the electrolytic copper foil 451 is made smaller in size than the composite foil. A polyimide film (manufactured by Ube Industries, not shown) on both sides of such a structure is temporarily fixed by applying a temperature of 333 ° C. and a pressure of 4 MPa for 5 minutes so as to include at least these structures, and heating and pressurizing. After that, the polyimide film was peeled off by hand to obtain a structure as shown in FIG.

Next, as shown in FIG. 1C, an etching resist 44 was formed on the surface of the first metal layer 41 in the shape of the connection conductor 13. The etching resist 44 is a resist NCP225 or NIT225 (trade name, manufactured by Nichigo Morton Co., Ltd.), laminated with a resist at a roll temperature of 110 ° C. and a roll speed of 0.6 m / min. The film was baked under an exposure condition of / cm ² , developed with a sodium carbonate solution, and post-exposed at 200 mJ / cm ² in order to ensure adhesion of the resist.

  Next, an alkali etching A process solution (trade name, manufactured by Meltex Co., Ltd.), which is an etching solution that does not erode nickel, is sprayed and sprayed to partially remove the first metal layer 41, thereby connecting conductors 13. Formed. Thereafter, the etching resist 44 was stripped and removed with a sodium hydroxide solution. Next, the third metal layer 43 is removed by etching using Melstrip N950 (trade name, manufactured by Meltex Co.), which is a nickel etching solution, and the surface treatment liquid CPE900 (manufactured by Mitsubishi Gas Chemical Company) is sprayed. Then, the exposed copper surface was roughened to obtain a structure in which the composite metal layer 46 on which the connection conductor 13 shown in FIG. 1D was formed was temporarily fixed on both surfaces. In this structure, since the temporarily fixed base material absorbs water, it is necessary to dry at 120 ° C. for 30 minutes or more to eliminate moisture.

  Next, a 75 μm thick liquid crystal polymer BIAC sheet (manufactured by Japan Gore-Tex) as an insulating resin composition is placed on both sides of the composite metal layer 46, and a polyimide film (manufactured by Ube Industries) is placed on the liquid crystal polymer sheet. Is applied so that a temperature of 333 ° C. and a pressure of 4 MPa are applied from both sides for 5 minutes to heat and pressurize, and then the polyimide film is peeled off by hand, as shown in FIG. A structure in which the insulating resin composition layer 121 was formed was obtained.

Thereafter, the structure shown in FIG. 1 (e) was polished by passing through both surfaces at once by adjusting the load and the rotational speed of the gap between the rotating polishing rolls 47 as shown in FIG. 1 (f). Polishing was performed under conditions of thickness reduction of 4 μm per pass, and the tip of the connection conductor 13 was exposed on the whole surface in 4 to 5 passes. Therefore, the polishing amount was 20 μm on each side. After polishing, the connection substrate was detached from the interface of the support substrate by cutting the inner side from the electrolytic copper foil which is the release base material in the configuration. Thereby, as shown in FIG.1 (g), the connection board | substrate which conducted with the metal layer and incorporated the connection conductor was able to be obtained. Thereafter, the second metal layer 42 was selectively etched to obtain a connection substrate on which a conductor circuit 103 as shown in FIG. 1 (h) was further formed. Furthermore, a metal coating 21 is formed in the order of electroless nickel, electroless palladium, and electroless gold plating on the surface of the connection conductor 13 and the surface of the conductor circuit 103 of the connection substrate of FIG. A connection substrate shown in (i) was obtained.

(Example 2)
<Positioning and fixing of multiple connection boards>
As shown in FIG. 2, guide holes 22 having a diameter of 3.0 mm were formed in some of the connecting conductors of the connection substrate shown in FIG. 1 (i) obtained in Example 1. Here, an automatic alignment drilling machine (TN-750, manufactured by Ono Sokki Co., Ltd.) that enables accurate drilling by image processing the land portion on the wiring layer provided in contact with the connecting conductor having the guide hole formed therein. ) Was used to make a hole.

  Next, as shown in FIG. 4A, the guide pin 311 welded to the pedestal 31 is connected to the correction intermediate plate 32, the lower receiving sheet 33, the four connection boards obtained above, and the upper sheet 34. Then, the holding jig 35 was stacked in the order of the holding jig 35 through the guide holes formed therein. Here, each of the lower sheet 33 and the upper sheet 34 is a Teflon (registered trademark) substrate having a thickness of 0.1 mm, and has a hole slightly larger than 0.3 mm. Further, while the lower receiving sheet 33 is a square, the upper sheet 34 and the pressing jig 35 have notches as shown in FIGS. 3B and 3C.

  As shown in FIG. 4 (b), the tip of the soldering iron heated to 265 ° C. in the cutout portions of the upper sheet 34 and the holding jig 35 where the connection substrate is exposed is placed at several places for several seconds. They were pressed and fixed between the connection substrates by thermal melting.

  Thereafter, as shown in FIG. 4 (c), the holding jig 35 is removed, the top is lifted from the receiving sheet 33, and the four connecting boards are aligned with high accuracy from the positioning jig, And the some connection board by which the predetermined location was positioned and fixed by thermal fusion was removed. Next, a polyimide film (manufactured by Ube Industries) is placed on both surfaces of the plurality of connection substrates so as to cover the insulating resin composition layer, and at least 333 ° C. from both sides of the structure so as to include these components. A pressure of 4 MPa was applied for 5 minutes, and the layers were integrated by heating and pressurization. Thereafter, the polyimide film was peeled off by hand to obtain a four-layer multilayer substrate shown in FIG. Further, it was also possible to produce a conductor in which the connecting conductors are not connected on the same straight line but are conductively connected in a crank shape as shown in FIG.

  Furthermore, the conductive connection by the gold-gold alloying of the obtained multilayer substrate was confirmed. Further, even when electroless tin plating (replacement type or reduction type) was used for surface plating on the connection substrate, a multilayer substrate could be similarly produced. In addition, electroless nickel, electroless palladium, and electroless gold plating were used for the surface plating of the outermost connection board, and electroless tin plating (substitution type or reduction type) was used for the surface plating of the inner connection board. A multi-layer substrate can be produced in the same manner even when a connection substrate having a different type of surface plating is used, and conduction connection due to gold-tin or tin-tin alloying can be confirmed at the connection portion. Moreover, the wiring of the outermost layer was transferred to the insulating resin composition layer, and a smooth surface without a step was confirmed on the surface of the substrate. The present invention is a specific structure that has been specifically implemented and confirmed.

  In addition, with respect to a multi-layer substrate having five or more layers, a multi-layer substrate with high positional accuracy similar to the case of the above-described four layers is obtained by selectively drilling and fixing in advance from the heat-sealed portion of the connection substrate. I was able to.

(Example 3)
In Examples 1 and 2, the composite metal layer 4 in which the first metal layer 41 was rolled copper and the second metal layer was also rolled copper was used. Moreover, tin cobalt alloy plating, tin silver alloy plating, and tin copper alloy plating were performed as a metal film on the surface of the connection conductor 13 and the surface of the conductor circuit 103 of the connection substrate in FIG. Also in this case, the conductive connection was confirmed as in Examples 1 and 2. In addition, the connection reliability passed 1000 cycles in a thermal cycle test in which a cycle of standing at -65 ° C for 15 minutes and standing at 150 ° C for 15 minutes was one cycle.

Example 4
The multilayer substrates obtained in Examples 1 to 3 were subjected to three-dimensional molding by placing each mold shown in Table 1 as shown in FIG. The temperature at the time of pressing is in the range of 190 ° C to 300 ° C. As a result of investigating the connection reliability of the obtained three-dimensional multilayer substrate, in a thermal cycle test in which a cycle of standing at -65 ° C for 15 minutes and standing at 150 ° C for 15 minutes was all, 1000 cycles were cleared. Also, three-dimensional molding can be performed by pressing rolled copper on one connection board on the side where the connection conductor is exposed, and then pressing the circuit-formed double-sided board in the same way. And similar connection reliability was obtained. Similar results could be obtained even when the above double-sided board was used in the multilayer substrate of FIG.

It is sectional drawing for demonstrating the manufacturing method of the connection board used for this invention. It is a figure which shows the state which formed the guide hole in the connection conductor of the connection board obtained in FIG. It is sectional drawing and the top view which show the outline of the alignment jig | tool used for this invention. FIG. 4 is a cross-sectional view showing a process of manufacturing a multilayer substrate of the present invention by positioning and fixing four connection substrates using the alignment jig of FIG. 3. It is sectional drawing which shows one form of the multilayer substrate of this invention. It is sectional drawing which shows the state in which the four connection boards containing the connection board drilled previously are positioned and fixed. It is sectional drawing for demonstrating the preferable form of a press apparatus. It is sectional drawing for demonstrating the process which heat-presses a press body using the press apparatus of FIG. FIG. 6 is a layout view of molds in Example 4.

Explanation of symbols

10: Multilayer substrate 11: Connection substrate 121: Insulating resin composition layer 13: Connection conductor 101, 102: Metal foil 103: Conductor circuit 21: Metal coating 22: Guide hole 31: Base 311: Guide pin 32: For position correction Intermediate plate 33: Lower receiving sheet 34: Upper sheet 35: Holding jig 36: Notch portion 4: Composite metal layer 41: First metal layer 42: Second metal layer 43: Third metal layer 44: Etching Resist 444: heat-bonding portion 45: support base 451: release base 452: adhesive resin 46: composite metal foil 47: polishing roll 61: A layer 611: hole 62: B layer 63: C layer 64: D layer 65: A layer 66: B layer 661: Hole 666: Thermal fusion part 67 of A layer and B layer 67: C layer 68: D layer 711: Stage 712: Cavity 713: Lower mold hot platen 714: Lower mold heat insulation part 715 : Operation unit / heat supply unit 716: Conveying unit 161: Conveying section shaft 717: Sealing section 721: Chamber 722: Cavity 723: Upper mold heat plate 724: Upper mold heat insulating section 725: Heat supply section 726: Depressurized via hole 727: Leak hole 731: Press body 732: Metal plate Or cushion material

Claims (12)

  A connection substrate comprising at least an insulating resin layer, a connecting conductor formed so as to penetrate the insulating resin layer, and / or wiring, wherein the insulating resin is made of a thermosetting resin and / or a thermoplastic resin. Connection board.   The connection board according to claim 1, wherein the connection conductor and / or the wiring contains rolled copper.   After aligning a plurality of connection substrates according to claim 1 or 2, when fixing a plurality of predetermined portions by heat fusion, holes are formed in any of the connection substrates so that the entire substrate does not move relatively in advance. A positioning and fixing method, characterized by opening the wire. A step of aligning a plurality of connecting substrates including at least an insulating resin layer, a connecting conductor formed so as to penetrate the insulating resin layer, and / or wiring;
A step of thermally fixing and fixing a predetermined portion of the plurality of aligned connection substrates; and
A step of stacking and integrating the plurality of connection substrates that are positioned and fixed by heating and pressing; and
A step of high-temperature pressing the laminated and integrated substrate between molds of a desired shape;
A method for producing a three-dimensional multilayer substrate, comprising:   The method for manufacturing a three-dimensional multilayer substrate according to claim 4, wherein the heat source of the heat fusion is a heated metal or a laser.   6. The method for manufacturing a three-dimensional multilayer substrate according to claim 4, wherein the connecting conductor and / or the wiring contains rolled copper. A stage on which a first cavity having an opening is formed;
A second cavity having an opening below the first cavity at a position facing the opening of the first cavity, and a chamber operable in a vertical direction;
A press body which is installed in the first and second cavities and whose pressing surface is a hot platen;
The press apparatus characterized by including at least.   The press apparatus according to claim 7, wherein a press surface of the press body has a desired three-dimensional shape.   During the pressing, the chamber is lowered, and the first and second cavities form a closed system. In the closed system, both sides of the press body are hot-pressed almost simultaneously by the press body under reduced pressure. The press apparatus according to claim 7 or 8, characterized in that:   A method for producing a multilayer substrate, comprising using the pressing device according to any one of claims 7 to 9.   A multilayer substrate manufactured by the manufacturing method according to claim 10.   12. The multilayer substrate according to claim 11, wherein the multilayer substrate is a three-dimensional multilayer substrate.

Images