JP2005228493A - Organic el display device, organic el display panel substrate and manufacturing method for organic el display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL display device allowing easy recognition of the application amount of a sealing material and free from a sealing failure. <P>SOLUTION: The organic EL display device of the present invention comprises: an element substrate 10 provided with an organic EL element; a counter substrate 20 opposed to the element substrate 10; a sealing material 23 formed between the element substrate 10 and the counter substrate 20 such that it surrounds a display region made up of the organic EL element; and an indicator formed for checking the sealing condition on a surface of the element substrate 10 or the counter substrate 20 to which the sealing material is bonded. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an organic EL (Electro Luminescence) display device, an organic EL display panel substrate, and an organic EL display device manufacturing method.

  In recent years, organic EL (Electro Luminescence) displays have attracted attention as FPD (Flat Panel Display). An organic EL display has a wider viewing angle than liquid crystal display devices, has a high response speed, and is expected as a next-generation display device because of the variety of light-emitting properties of organic substances.

  For sealing the organic EL element, for example, an epoxy ultraviolet (UV) curable resin sealing material is used. Apply a sealant using a dispenser to draw the outer periphery of the area facing the organic EL element on the surface of the counter substrate where the water catching material is provided, and bond the two substrates together, and then irradiate with ultraviolet rays. Cure the sealing material.

  In order to prevent this sealing failure, a through hole is provided in the element substrate or the counter substrate, and after bonding, the two holes are sealed with another sealing material, or in a state where the pressure is reduced to a predetermined pressure. A method of bonding substrates is known (see, for example, Patent Document 1).

  In addition, there is also known a method in which when a sealing material is applied so as to have an opening (a deaeration port) and bonded, the sealing material is crushed to close the opening (see, for example, Patent Document 2). However, with this method, if the amount of the sealing material applied is small, even if the gaps of the substrates are bonded to a predetermined value, the opening may not be blocked and the element may come into contact with the outside air. If there is a large amount, the opening is closed before the gap of the substrate reaches a predetermined value. Thus, as described above, a seal puncture occurs and the element comes into contact with the outside air. Therefore, it is necessary to apply the sealing material in an appropriate application amount. However, conventionally, it has been difficult to grasp the appropriate application amount of the sealing material in advance, and there has been a problem that a sealing failure of the element is likely to occur. It was.

  Furthermore, when the sealing material is applied on the convex bank of the counter substrate, after sealing the element, the sealing material leaks to both sides of the bank, and the amount of the sealing material applied is accurately measured. There was also a problem that they could not.

JP 2000-36384 A JP 2002-25764 A

  As described above, the conventional method for manufacturing an organic EL display device has a problem that it is difficult to grasp in advance an appropriate coating amount of the sealing material, and a sealing failure of the element is likely to occur. Furthermore, there is also a problem that the amount of the sealing material applied cannot be accurately measured after sealing the element.

  The present invention has been made to solve such problems, and one object of the present invention is to grasp in advance an appropriate application amount of the sealing material and prevent a sealing failure. Another object of the present invention is to accurately measure the application amount of the sealing material with a simple configuration after sealing the element.

  An organic EL display device according to the present invention includes an element substrate provided with an organic EL element, a counter substrate facing the element substrate, and a sealing material formed so as to surround a display region including the organic EL element. And a mark formed on the bonding surface of the sealing material on the element substrate and / or the counter substrate. Thereby, the state of the sealing material can be measured. The mark may be a mark for measuring a gap between the element substrate and the counter substrate.

  Either one of the element substrate and the counter substrate includes a convex portion formed so as to surround the display area, and the sealing material is an opposing portion facing the top surface of the convex portion and the convex portion. It is preferable that the mark is formed on the facing portion. Thereby, the gap can be measured effectively. The mark may be a cross-shaped mark.

  An organic EL display device according to the present invention includes an element substrate including an organic EL element, a counter substrate facing the element substrate, a sealing material formed between the element substrate and the counter substrate, and the element substrate. And a scale for measuring the width of the sealing material formed at a position overlapping the sealing material. Thereby, the width of the sealing material can be easily measured.

  The organic EL display panel substrate includes a sealing material formed so as to surround the display region including the organic EL element, and a measurement material formed outside the display region separately from the sealing material. It is preferable that the scale is formed on an adhesive surface of the measurement sealing material. Alternatively, the organic EL display panel substrate includes a plurality of display regions made of the organic EL elements, a sealing material formed so as to surround each of the plurality of display regions, and the sealing material used for sealing. In addition, it is preferable that the measurement sealing material is formed outside the plurality of display regions, and the scale is formed on an adhesive surface of the measurement sealing material. Thereby, the width | variety of a sealing material can be measured effectively.

  It is preferable to further include a mark formed on the bonding surface of the sealing material in the element substrate or the counter substrate. As a result, the state of the sealing material can be measured more accurately. Alternatively, the element substrate further includes an auxiliary wiring for supplying a signal to the organic EL element, and the mark is preferably the same member as the auxiliary wiring. Thereby, manufacturing efficiency can be improved.

  According to the present invention, there is provided a method for manufacturing an organic EL display device including an element substrate including an organic EL element and a pair of substrates opposed to the element substrate, the sealing material between the element substrate and the counter substrate. A step of detecting a mark formed on an adhesive surface of the sealing material on the element substrate or the counter substrate, a step of detecting a surface of the substrate facing the mark, and the detected mark And determining a gap between the opposing surface. Thereby, the gap measurement can be easily performed.

  According to the present invention, a method of manufacturing an organic EL display device including a pair of substrates including an element substrate including an organic EL element and a counter substrate facing the element substrate includes the step of forming a scale on the element substrate or the counter substrate. A step of forming a sealing material between the element substrate and the counter substrate, a step of detecting the scale formed at the position where the sealing material overlaps, and a width of the sealing material by the detected scale. Determining. As a result, the seal width can be easily measured.

  A step of detecting a mark formed on an adhesive surface of the sealing material on the element substrate or the counter substrate; a step of detecting a surface of the substrate facing the mark; and the detected mark and the counter surface Preferably further comprising the step of determining a gap therebetween. Thereby, the state of the seal can be measured more accurately.

According to the present invention, there is provided a method of manufacturing an organic EL display device including an element substrate including an organic EL element and a counter substrate facing the element substrate, the display area including the organic EL element being a periphery of the display area, A first step of applying a sealing material on the surface of the element substrate and / or the counter substrate; a second step of overlapping the element substrate and the counter substrate via the sealing material; and the element A third step of curing the sealing material after forming a predetermined gap between the substrate and the counter substrate, and in the second step, an opening is provided in the sealing material in advance, and the element substrate and When the application of pressure between the opposing substrates is finished, the opening is closed by the spread of the sealing material. Thereby, the opening of the sealing material can be effectively blocked.
A scale is provided in advance on a surface substantially parallel to the substrate surface of the element substrate or the counter substrate, and in the second step, the degree of spread of the sealing material is measured with the scale, and based on the measured value or the measured value It is preferable to finish applying the pressure between the element substrate and the counter substrate according to the calculated result. Thereby, the opening of the sealing material can be closed more accurately.

  ADVANTAGE OF THE INVENTION According to this invention, the application quantity of a sealing material can be recognized easily and an organic electroluminescent display device without a sealing defect can be provided.

  Hereinafter, embodiments to which the present invention can be applied will be described. By the following description, this invention is not limited to the following embodiment. In order to clarify the explanation, the following description and drawings are omitted as appropriate. Further, those skilled in the art can easily change, add, and convert each element of the following embodiments within the scope of the present invention. In addition, what attached | subjected the same code | symbol in each figure has shown the same element, and abbreviate | omits description suitably.

  The organic EL display device according to this embodiment includes an organic EL display panel in which a plurality of organic EL elements serving as pixels are arranged. In addition, the organic EL display panel usually includes an element substrate on which an organic EL element is formed and a counter substrate disposed opposite to the element substrate for sealing the organic EL element.

  The organic EL element sealing method according to the present embodiment will be described with reference to FIG. FIG. 1 schematically shows an organic EL display panel before and after bonding an element substrate and a counter substrate. FIG. 1A-1 is a side view of the organic EL display panel before the substrates are bonded together. FIG. 1A-2 is a plan view of the counter substrate in FIG. FIG. 1B-1 is a side view of the organic EL display panel after the substrates are bonded together. FIG. 1B-2 is a plan view of the counter substrate in FIG. In FIG. 1, 10 is an element substrate, 20 is a counter substrate, 21 is a water catching material storage section, 23 is a sealing material for sealing, 23a is a deaeration port, and 40 is a stage.

  First, as illustrated in FIG. 1A-2, a sealing material 23 is applied to the surface of the counter substrate 20 that faces the element substrate 10. The sealing material 23 for sealing is applied with a predetermined width by moving the dispenser as shown by the arrows in the figure. The counter substrate 20 is provided with a bank which will be described later so as to surround the display area of the opposing element substrate 10, and the sealing material 23 for sealing is applied so as to have a deaeration port 23 a on the bank. Is done. In addition, the counter substrate 20 is provided with a water capturing material in the water capturing material storage portion 21 before being bonded together.

  As shown in FIG. 1A-1, the element substrate 10 is placed on the stage 40, and the position of the counter substrate 20 is aligned with the position facing the element substrate 10. In addition, an anode, an organic EL layer, a cathode, and the like are formed on the element substrate 10 before bonding.

  As shown in FIG. 1B-1, the element substrate 10 and the counter substrate 20 are bonded together by pressing from below the stage 40 in a nitrogen atmosphere. Thereby, an organic EL display panel substrate is formed. When the element substrate 10 and the counter substrate 20 are pressure-bonded to a predetermined gap, the width of the sealing material 23 for sealing is expanded by pressure. Then, as shown in FIG. 1B-2, the deaeration port 23a is closed while nitrogen gas is pushed out from the deaeration port, and the portion surrounded by the sealing material 23 for sealing is shut off from the outside air. . In this state, the sealing material 23 for sealing is irradiated with UV to be cured, and sealing is completed.

  FIG. 2 is an explanatory view showing a state of being bonded by the method of FIG. FIG. 2A-1 is a cross-sectional view of a portion with the bank 25 in the organic EL display panel before the substrates are bonded together. FIG. 2A-2 is a cross-sectional view when the substrates of FIG. FIG. 2B-1 is a cross-sectional view of a portion without the bank 25 in the organic EL display panel before the substrates are bonded together. FIG. 2B-2 is a cross-sectional view when the substrates of FIG. 2B-1 are bonded together.

  The bank 25 is formed so as to surround the display area of the element substrate 10 in order to secure a gap between the element substrate 10 and the counter substrate 20. The bank 25 is formed in a portion where the organic EL display panel is not formed. Not formed. The bank 25 may be formed on the element substrate 10 or may be formed on the counter substrate 20. The bank 25 is formed together with the water catching material storage part 21 by etching or the like, for example.

  As shown in FIG. 2A-1, a convex bank 25 is formed on the counter substrate 20 so as to surround the display area of the element substrate 10, and the inside of the bank 25 becomes the water catching material storage unit 21. . A sealing material 23 for sealing is applied on the bank 25. When the sealing material 23 for sealing is applied, the cross section becomes a semicircular shape. Then, when the substrates are bonded together, as shown in FIG. 2A-2, the sealing seal material 23 is crushed by the surface of the element substrate 10 facing the counter substrate 20, and the crushed seal material is the bank 25. Leaks on both sides. In the present embodiment, in order to easily measure the gap of the substrate in this state, a gap measurement mark 14 to be described later is attached to a portion of the element substrate 10 facing the counter substrate 20 where the sealing material 23 for sealing is bonded. (See FIG. 4A).

  In addition, when the sealing material leaks to both side surfaces of the bank 25 in this way, it is difficult to easily measure the width of the sealing material, so it is impossible to grasp the amount of the sealing material applied. For this reason, as shown in FIG. 2B-1, the sealing material 23 for sealing is applied to a flat portion without the bank 25 on the surface of the counter substrate 20. Then, as shown in FIG. 2B-2, when the substrates are bonded together, the sealing material 23 for sealing is crushed, and the crushed sealing material spreads in the width direction of the sealing material 23 for sealing. In this state, since the sealing material does not leak, the expansion of the width of the sealing material 23 for sealing can be measured.

  In the present embodiment, in order to easily measure the seal width of the sealing material 23 for sealing in this state, a portion of the element substrate 10 facing the counter substrate 20 is bonded to a portion where the sealing material 23 for sealing is bonded. A seal width measurement scale 15 (see FIG. 4B) described later is provided. The cross-sectional area of the sealing material 23 for sealing can be calculated by measuring the gap and the seal width of the substrate in the state after the element is sealed.

  In addition, by measuring the cross-sectional area when the sealing material 23 for sealing is applied in advance before sealing, it is possible to predict the expansion of the width of the sealing material 23 when bonded. it can. From the cross-sectional area of the sealing material 23 for sealing and the gap of the substrate, the expansion of the width of the sealing material 23 for sealing in the gap is calculated, and this expansion is used as the width of the deaeration port 23a. 23a can be properly blocked.

  The configuration of the element substrate according to the present embodiment will be described with reference to FIG. FIG. 3 is a plan view of the surface of the element substrate 10 on which the organic EL elements and the like are formed. In the figure, 11 is a display area, 12 is an auxiliary wiring, 13 is a display area for inspection, 14 is a gap measurement scale 15 and a seal width measurement mark.

  FIG. 3 shows the element substrate 10 in a state before bonding. For example, the element substrate 10 is a glass substrate having an orientation flat and a diameter of about 150 mm. The element substrate 10 is provided with six display areas 11 and four inspection display areas. The display area 11 has a size of 50 mm × 25 mm, and the inspection display area 13 has a size of 15 mm × 10 mm. After the element substrate 10 is bonded and sealed with the counter substrate 20, the organic EL display panel substrate is cut into six organic EL display panels and four inspection panels. The inspection panel is for measuring element characteristics. It should be noted that values such as the shape and size of the element substrate 10 and the shape and size of the display region can be set arbitrarily according to the organic EL display panel to be manufactured.

  In the display region 11, an anode, an organic EL layer, a cathode, and the like are formed. The anode and the cathode are connected to the auxiliary wiring 12. In the organic EL layer, for example, a hole injecting and transporting layer, a light emitting layer, and an electron injecting and transporting layer are stacked. When a current is supplied to the organic EL layer through the anode and the cathode, the light emitting layer of the organic EL layer emits light.

  The broken line in the figure is a portion to which the sealing material 23 for sealing applied to the counter substrate 20 adheres when the counter substrate 20 is bonded. The periphery of the display area 11 and the display area for inspection 13 and the portion where the seal width measurement scale 15 where the organic EL display panel is not formed are bonded portions.

  Two gap measurement marks 14 are provided in a portion where the sealing material 23 for sealing around the display area 11 is bonded. FIG. 4A shows an example of the gap measurement mark 14. The gap measurement mark 14 is formed in a cross shape having a size of 2 mm, for example, and is formed by forming a metal material in the same manner as the auxiliary wiring 12. The gap between the sealed substrates can be measured using the microscope with the gap measurement mark 14. In measuring the gap, first, the focus of the microscope is set to the center of the gap measurement mark 14, and then the focus is moved to the upper surface of the bank of the counter substrate 20, and the gap between the substrates is measured by the movement amount of the focus. can do.

  As described above, the gap measurement mark 14 can easily measure the gap between the substrates without using a micrometer. The gap measurement mark 14 is not limited to the cross shape, but may be other shapes as long as the focus of the microscope can be adjusted. The number of gap measurement marks 14 is not limited to two around the display area 11, and any number may be provided, and it is only necessary that the gap measurement mark 14 be formed on a surface that adheres to the sealing material 23 other than the periphery of the display area 11. . For example, it may be provided around the display area 13 for inspection.

  The seal width measurement scale 15 is a scale formed at a predetermined interval in the width direction of the seal material, and is formed at a position overlapping the seal material. FIG. 4B shows an example of the seal width measurement scale 15. The seal width measurement scale 15 is, for example, a scale of 9 mm, and the seal material is perpendicularly overlapped with the center of the scale to measure the width of the seal material. The scale interval of the seal width measurement scale 15 is, for example, 0.1 mm. Here, four seal width measurement scales 15 are formed in a region other than the display region. As with the gap measurement mark 14, the seal width measurement scale 15 is formed by depositing a metal material. By directly measuring the scale of the seal width measurement scale 15 with the scale, the seal width can be measured in a sealed state. In this way, the seal width measurement scale 15 can measure the width of the seal without applying a measure. In addition to the display panel manufactured as a product, the substrate in the region where the seal width measurement scale 15 is formed can be stored. The seal width measurement scale 15 is not limited to four areas other than the display area, and an arbitrary number may be provided.

  The configuration of the counter substrate according to the present embodiment will be described with reference to FIG. FIG. 5 is a plan view of the surface of the counter substrate 20 to which the sealing material is applied. The counter substrate 20 is a substrate that is bonded to the element substrate 10 shown in FIG. 3 and seals the element. The counter substrate 20 is formed by digging a recess in a region facing the display region 11 and the inspection display region 13 of the element substrate 10 so as to become the water catching material storage unit 21. A convex bank 25 is formed without digging in the place where the sealing material is applied. For example, the width of the bank 25 is 2.0 mm as shown in (a) in the figure and 1.4 mm as shown in (b) in the figure, and the height of the bank 25 is 0.5 mm. The broken line in the figure is a portion where the sealing material 23 for sealing is applied.

  The portions where the sealing material 23 for sealing is applied are the portions on the bank 25 and the seal width measurement scale 15 of the element substrate 10. In the present embodiment, the sealing material 23 for sealing is applied on the bank 25 so as to have the deaeration port 23a shown in FIG.

  The manufacturing method of the organic EL display device according to the present embodiment will be described in detail with reference to FIG. FIG. 6 is a flowchart showing manufacturing steps of the organic EL display device. First, the manufacturing method of an element substrate provided with an organic EL element is demonstrated. For example, a glass substrate having a thickness of 0.7 mm to 1.1 mm is used as the element substrate (step S101). As the glass substrate, alkali-free glass (for example, AN100 manufactured by Asahi Glass Co., Ltd.) or alkali glass (ASA manufactured by Asahi Glass Co., Ltd.) can be used.

  ITO, which is an anode electrode material, is formed on the glass substrate (step S102). ITO can be formed on the entire surface of the glass substrate with good uniformity by sputtering or vapor deposition. Here, the film is formed with a film thickness of 150 nm by a DC sputtering method. An ITO pattern is formed by photolithography and etching (step S103). This ITO pattern becomes the anode. A phenol novolac resin is used as the resist, and exposure development is performed. Etching may be either wet etching or dry etching. Here, ITO was patterned using a mixed aqueous solution of hydrochloric acid and nitric acid. Monoethanolamine was used as the resist stripping material.

  An auxiliary wiring material is deposited on the ITO pattern (step S104). The auxiliary wiring material can be formed by sputtering or vapor deposition using a low-resistance metal material such as Al, Al alloy, Ag, or Ag alloy. Further, in order to improve adhesion to the base or to prevent corrosion, a barrier layer made of TiN, Cr, Mo, Mo alloy or the like may be formed on the lower layer or upper layer of the Al film to form the auxiliary wiring in a laminated structure. . This barrier layer can also be formed by vapor deposition or sputtering. Here, a Cr / Al / Cr laminated film having a total thickness of 450 nm or a Mo—Nb / Al / Mo—Nb laminated film is formed as an auxiliary wiring material by DC sputtering. When a Mo alloy such as Mo—W, Mo—Nb, Mo—V, Mo—Ta, or the like is used rather than Mo, the corrosion resistance can be improved. In addition to the DC sputtering method, the auxiliary wiring material can be formed by a physical vapor deposition method (PVD) such as a vacuum deposition method or an ion plating method, or a plating method such as electrolytic plating or electroless plating ( (See WO03 / 086022).

  The auxiliary wiring material is patterned by photolithography and etching to form auxiliary wiring patterns and marks (step S105). For the etching, an etching solution made of a mixed aqueous solution of phosphoric acid, acetic acid, nitric acid or the like can be used. It is also possible to form the anode material and the auxiliary wiring material in order, and then pattern the auxiliary wiring material and the anode material in order. A signal is supplied to the anode or the cathode by the auxiliary wiring pattern. Simultaneously with the formation of the auxiliary wiring pattern, the gap measurement mark 14 and the seal width measurement scale 15 are formed.

  Next, an opening insulating film is formed (step S106). As the insulating film, photosensitive polyimide is spin-coated, patterned after a photolithography process, and then cured to form an opening insulating film having a pixel opening in a pixel. At the same time, a contact hole between the cathode and the auxiliary wiring is formed. For example, the pixel opening is formed with about 300 μm × 300 μm, and the contact hole between the cathode and the auxiliary wiring is formed with about 200 μm × 200 μm.

  Next, a cathode barrier is formed (step S107). For the cathode partition, for example, novolac resin is used. A novolak resin is spin-coated, patterned by a photolithography process, and then photoreacted to form cathode barrier ribs. It is preferable to use a negative type photosensitive resin so that the cathode partition has an inversely tapered structure. When a negative photosensitive resin is used, when light is irradiated from above, the photoreaction becomes insufficient at deeper locations. As a result, when viewed from above, the cross-sectional area of the cured portion has a structure that is narrower on the lower side than on the upper side. This means that it has an inverted taper structure. With such a structure, the cathodes can be separated from each other because the portions that are shaded when viewed from the vapor deposition source during vapor deposition of the cathodes do not reach the vapor deposition. Further, oxygen plasma or ultraviolet light may be irradiated in order to modify the surface of the ITO layer in the opening.

  Next, an organic EL element is formed on the pixel opening (step S108). For example, an organic EL layer and a cathode are deposited using a deposition apparatus. The organic EL layer often includes an interface layer, a hole transport layer, a light emitting layer, an electron injection layer, and the like as constituent elements. However, it may have a different layer structure. The thickness of the organic EL layer is usually about 100 to 300 nm. Copper phthalocyanine (CuPc) is 10 nm thick as the interface layer, and N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine (α-NPD) is 60 nm thick as the hole transport layer, Alq is deposited to a thickness of 50 nm as a light emitting layer, and LiF is deposited to a thickness of 0.5 nm as an electron injection layer. In the above structure, a triphenylamine-based material such as triphenyldiamine (TPD) can be used for the hole transport layer instead of α-NPD.

  Al is often used for the cathode, but alkali metals such as Li, Ag, Ca, Mg, Y, In, and alloys containing them can also be used. The thickness of the cathode is usually about 50 to 300 nm, and here it is Al having a thickness of 200 nm. In addition, the cathode can be formed by physical vapor deposition (PVD) such as sputtering or ion plating. Thereby, an organic EL element is formed.

  Through these steps, an element substrate on which a plurality of organic EL elements are formed is manufactured. Usually, a plurality of organic EL display panels having a plurality of organic EL elements are formed on a single substrate. Then, by cutting and separating each organic EL display panel, a plurality of organic EL display panels can be obtained from one mother glass. This process will be described later. The manufacturing process of the organic EL element substrate described above is an example of a manufacturing process of an element substrate used in a typical organic EL display device, and is not limited to the manufacturing process described above.

  Next, a manufacturing process of the counter substrate for sealing the organic EL element will be described. Since the organic EL element deteriorates due to moisture in the air, it is sealed using a counter substrate. A glass substrate having a thickness of 0.7 to 1.1 mm is used as the counter substrate (step S201), and the same substrate as the element substrate can be used. Then, the counter substrate is processed to provide a water catching material storage unit for placing a water catching material that captures moisture (step S202). The water catching material storage part is formed, for example, by digging a part of the counter substrate by etching or sandblasting. At this time, a bank is further formed so as to surround the water catching material storage portion. A water catching material is disposed in the water catching material storage unit (step S203). As the water catching material, calcium oxide powder, water catching tape or the like is used.

  And a sealing material is apply | coated to the surface which provided the water catching material accommodating part of the opposing board | substrate using dispenser (step S204). A sealing material is provided on the bank around the water catching material storage part so as to have an opening. As the sealing seal, a photosensitive epoxy resin is preferable. For example, a cationic photopolymerization type epoxy resin can be used and functions as an adhesive for bonding the element substrate and the counter substrate. A sealing substrate (counter substrate) is manufactured by the above manufacturing process. The above manufacturing process is a typical example, and the present invention is not limited to this.

  Next, the element substrate and the counter substrate are bonded together to seal the organic EL element (step S109). The subsequent steps will be described with reference to FIGS. FIG. 7 is a plan view showing a method for sealing a substrate, and FIG. 8 is a cross-sectional view showing the configuration of the substrate after sealing. The element substrate 10 described here is the same as that shown in FIG. 3, and the counter substrate 20 is the same as that shown in FIG.

  The element substrate 10 includes a display region 11 formed by the above-described steps S101 to S108 and including a plurality of organic EL elements, and an auxiliary wiring 12 for supplying a signal to each element. For example, as shown in FIG. 3, the element substrate 10 is provided with six organic EL display regions 11, and an organic EL display panel is formed by cutting and separating the substrate. On the counter substrate 20 slightly smaller than the element substrate 10, a water catching material storage portion 21 is formed for each display region 11, and a water catching material 22 is arranged. The counter substrate 20 is provided with a sealing material 23 for sealing that surrounds each display region 11.

  In FIG. 7, 50 is a light shielding substrate, and 60 is a sealing jig. The light shielding substrate 50 is a light shielding mask for preventing UV light from hitting an organic EL element other than the sealing material when the sealing material is cured. As shown in FIG. 7A, the element substrate 10, the counter substrate 20, and the light shielding substrate 50 are placed on the sealing jig 60. The sealing jig 60 is disposed at a position in contact with the four outer peripheral sides of the element substrate 10, the counter substrate 20, and the light shielding substrate 50, and has stepped steps for placing each substrate. The element substrate 10, the counter substrate 20, and the light shielding substrate 50 are placed on this stage for alignment.

  As shown in FIG. 7B, the stage 40 is pressed from below and the element substrate 10 is pushed up. The element substrate 10 and the counter substrate 20 are in close contact with each other, and the counter substrate 20 and the light shielding substrate 60 are in close contact with each other. A substrate for preventing the light shielding substrate 60 from being pushed up is disposed on the light shielding substrate 60, and a spring is provided on the substrate. Pressure is applied to the element substrate 10 and the counter substrate 20 by the force of pressing the stage 40 and the force of the spring to form a predetermined gap.

  In a state where a predetermined gap is reached, the sealing material is irradiated with UV light from above via the light shielding substrate 50. As a result, the two substrates are bonded as shown in FIG. Each display region 11 provided on the element substrate 10 is surrounded by a sealing material 23 for sealing as shown in FIG. The water catching material 22 is disposed in a space surrounded by both substrates and the sealing material 23 for sealing, and the deterioration of the organic EL element due to moisture remaining or entering the sealed space is prevented. The organic EL element is sealed with a pair of substrates including the element substrate 10 and the counter substrate 20. Since the auxiliary wiring 12 is connected to an external drive circuit, a part of the sealing material 23 for sealing is bonded across the auxiliary wiring 12.

  Further, the outer surfaces of the element substrate 10 and the counter substrate 20, that is, the opposite surface of the element substrate 10 on which the organic EL element is provided and the opposite surface of the counter substrate 20 on which the water capturing material 22 is provided are polished. Accordingly, the substrate may be thinned. For example, when each substrate is thinned to a thickness of 0.5 mm, an organic EL display panel having a total thickness of 1.0 mm is obtained.

  The sealed substrate is cut to separate each organic EL display panel (step S110). For example, the cutting position is different between the element substrate 10 and the counter substrate 20. The counter substrate 20 is cut so as to surround the periphery of the sealing material 23 for sealing. The element substrate 10 is cut so as to surround the periphery of the sealing material 23 for sealing and the end portion of the auxiliary wiring 12. Therefore, the element substrate 10 is cut outside the organic EL display region 11 from the counter substrate 20 by the amount of the auxiliary wiring 12 provided outside the sealing material 23 for sealing. Thereby, it can divide | segment into each organic EL display panel.

  Next, a drive circuit and the like are mounted (step S111). On the element substrate 10, the auxiliary wiring 12 is extended outside from the region surrounded by the sealing material 23 for sealing. A terminal portion is formed at the outer end portion of the auxiliary wiring 12, and an anisotropic conductive film (ACF) is attached to the terminal portion to connect a TCP (Tape Carrier Package) provided with a drive circuit. Specifically, ACF is temporarily crimped to the terminal portion. ACF uses Hitachi Chemical Anisolm 7106U. The temporary pressure bonding temperature is 80 ° C., the pressure bonding pressure is 1.0 MPa, and the pressure bonding time is 5 seconds. Next, the TCP with the built-in drive circuit is finally bonded to the terminal portion. The main pressure bonding temperature is 170 degrees, the pressure bonding pressure is 2.0 MPa, and the pressure bonding time is 20 seconds. Thus, the drive circuit is mounted. This organic EL display panel is attached to the housing, and the organic EL display device is completed (step S112).

  In this manner, by providing the gap measurement mark 14 and the seal width measurement scale 15 on the substrate, the gap of the substrate and the width of the seal material can be easily measured even after sealing, and an organic EL display The quality control of the apparatus can be performed efficiently.

  Moreover, by calculating the width of the deaeration port in advance from the cross-sectional area of the sealing material, the element can be sealed with high accuracy and sealing failure can be prevented.

  Embodiments according to the present invention will be described with reference to FIGS. FIG. 9 is a graph showing the relationship between the gap of the substrate and the seal width. 10 and 11 are graphs showing a gap at the deaeration port of the organic EL display panel.

  In FIG. 9, the horizontal axis indicates the gap of the substrate, and the vertical axis indicates the spread of the seal width. Calculation examples 1 and 2 are calculated values of the seal width in the gap from the cross-sectional area of the sealing material and the seal width, and measurement examples 1, 2, and 3 perform the sealing by the above-described method and determine the gap and the seal width of the substrate. It is a measured value.

In Calculation Example 1, first, a sealing material was applied to the counter substrate, and a cross-sectional area and a seal width were measured with a laser-type measuring instrument. The sealing material is a UV curable resin, specifically, 30Y437 manufactured by ThreeBond. This sealing material is applied using a seal dispenser (manufactured by Musashi Engineering Co., Ltd.). The application conditions are as follows: the inner diameter of the needle for discharging the resin is 0.5 mm, the distance between the needle tip and the substrate is 0.15 mm, and the syringe pressure is 0. 0.05 MPa and the coating speed was 6 mm / s. The height of the sealing material after application was about 0.1 mm. At this time, the cross-sectional area of the sealing material was 65600 μm ² , and the seal width was 837 μm.

Here, assuming that the cross-sectional shape of the applied sealing material is a rectangle, the value of the cross-sectional area / gap is the seal width in the gap. Further, (cross-sectional area / gap) − (initial seal width) is the spread of the seal width in the gap. In calculation example 1, a unit of (65600 μm ² / gap) −837 μm is converted to mm. The target gap when the substrates are bonded is 0.02 mm to 0.03 mm. From the graph, the spread of the seal width when the gap is 0.02 mm is 2.44 mm, and when the gap is 0.03 mm, it is 1.35 mm. Therefore, if the width of the deaeration port is set in the range of 1.35 to 2.44 mm, the deaeration port is closed and normal bonding can be performed within the target gap range.

  In measurement example 1, the same application conditions as in calculation example 1 are applied, a sealing material is applied with a degassing port of 1.9 mm based on calculation example 1, and the gap measurement mark and the seal width measurement mark described above are attached. The substrate gap and seal width were measured. The measurement example 1 was close to the calculation example 1, and the deaeration port was properly blocked under this condition.

In Calculation Example 2, only the coating speed was set to 12 mm / s under the same coating conditions as in Calculation Example 1. At this time, the cross-sectional area of the sealing material was 33600 μm ² , and the seal width was 603 μm. From the graph, the spread of the seal width when the gap is 0.02 mm is 1.07 mm, and when the gap is 0.03 mm, it is 0.51 mm. Therefore, if the width of the deaeration port is set in the range of 0.51 to 1.07 mm, the deaeration port is closed and normal bonding can be performed within the target gap range.

  Measurement examples 2 and 3 are the same application conditions as calculation example 2, with the application rate being only 14 mm / s, applying a sealing material, bonding, and using the gap measurement mark and seal width measurement mark described above, the gap of the substrate And the seal width was measured. In the measurement examples 2 and 3, the syringe pressure is different. Measurement Examples 2 and 3 were close to Calculation Example 2.

  10 and 11, the horizontal axis indicates the substrate, the vertical axis indicates the gap, and A, B, C, and D indicate the display panel in the substrate. In FIG. 10, an organic EL display panel that emits green light is manufactured by the above-described manufacturing method. The application conditions of the sealing material and the width of the deaeration port are the same as those in Calculation Example 1 and Measurement Example 1 in FIG. The gap was measured using the above-described gap measurement mark. In FIG. 11, as in FIG. 10, an organic EL display panel that emits blue light was manufactured and the gap was measured. 10 and 11, the gap is in the range of approximately 0.01 mm to 0.03 mm.

It is the side view and top view of a board | substrate which show the sealing method of the organic electroluminescence display which concerns on this embodiment. It is explanatory drawing which shows the sealing method of the organic electroluminescence display which concerns on this embodiment. It is a top view which shows the element substrate before bonding which concerns on this embodiment. It is a top view which shows the counter substrate before bonding which concerns on this embodiment. It is a schematic diagram which shows the mark which concerns on this embodiment. It is a flowchart which shows the manufacturing method of the organic electroluminescence display which concerns on this embodiment. It is sectional drawing about the sealing method of the organic electroluminescence display which concerns on this embodiment. It is sectional drawing which shows the structure of the organic electroluminescence display which concerns on this embodiment. It is a graph which shows the relationship between the gap which concerns on a present Example, and seal width. It is a graph which shows the relationship between the organic electroluminescence display which concerns on a present Example, and a gap. It is a graph which shows the relationship between the organic electroluminescence display which concerns on a present Example, and a gap.

Explanation of symbols

10 element substrate 11 display area 12 auxiliary wiring 13 inspection display area 14 gap measurement mark 15 seal width measurement scale 20 counter substrate,
21 Water catching material storage part 22 Water catching material 23 Sealing sealing material 23a Deaeration port 25 Bank

Claims (15)

An element substrate including an organic EL element;
A counter substrate facing the element substrate;
A sealing material formed so as to surround the display region including the organic EL element;
A mark formed on an adhesive surface of the sealing material in the element substrate and / or the counter substrate;
An organic EL display device comprising:   The organic EL display device according to claim 1, wherein the mark is a mark for measuring a gap between the element substrate and the counter substrate. Either one of the element substrate and the counter substrate includes a convex portion formed so as to surround the display region,
The sealing sealing material is formed between an upper surface of the convex portion and a facing portion facing the convex portion,
The mark is formed on the facing portion,
The organic EL display device according to claim 1.   The organic EL display device according to claim 1, wherein the mark is a cross-shaped mark. An element substrate including an organic EL element;
A counter substrate facing the element substrate;
A sealing material formed between the element substrate and the counter substrate;
A scale for measuring the width of the sealing material formed at a position overlapping the sealing material on the element substrate;
An organic EL display panel substrate provided with The organic EL display panel substrate includes a sealing material formed so as to surround the display region including the organic EL element, and a measurement material formed outside the display region separately from the sealing material. With sealing material,
The scale is formed on the bonding surface of the sealing material for measurement,
The organic EL display panel substrate according to claim 5. The organic EL display panel substrate includes a plurality of display areas composed of the organic EL elements,
A sealing material formed so as to surround each of the plurality of display regions;
In addition to the sealing material for sealing, the sealing material for measurement formed outside the plurality of display regions,
The scale is formed on the bonding surface of the sealing material for measurement,
The organic EL display panel substrate according to claim 5.   The organic EL display panel substrate according to claim 5, further comprising a mark formed on an adhesive surface of the sealing sealant in the element substrate or the counter substrate. The element substrate further includes an auxiliary wiring for supplying a signal to the organic EL element,
The organic EL display device according to claim 1, wherein the mark is the same member as the auxiliary wiring. The element substrate further includes an auxiliary wiring for supplying a signal to the organic EL element,
The organic EL display panel substrate according to claim 5, wherein the scale is the same member as the auxiliary wiring. A method for manufacturing an organic EL display device comprising a pair of substrates comprising an element substrate comprising an organic EL element and a counter substrate facing the element substrate,
Forming a sealing material between the element substrate and the counter substrate;
Detecting a mark formed on an adhesive surface of the sealing material on the element substrate or the counter substrate;
Detecting a surface of the substrate facing the mark;
Determining a gap between the detected landmark and the opposing surface;
The manufacturing method of the organic electroluminescence display which has this. A method for manufacturing an organic EL display device comprising a pair of substrates comprising an element substrate comprising an organic EL element and a counter substrate facing the element substrate,
Forming a scale on the element substrate or the counter substrate;
Forming a sealing material between the element substrate and the counter substrate;
Detecting the scale formed at a position overlapping the sealing material;
Determining a width of the sealant according to the detected scale;
The manufacturing method of the organic electroluminescence display which has this. Detecting a mark formed on an adhesive surface of the sealing material on the element substrate or the counter substrate;
Detecting a surface of the substrate facing the mark;
Determining a gap between the detected landmark and the opposing surface;
The method for producing an organic EL display device according to claim 12, further comprising: A method of manufacturing an organic EL display device comprising an element substrate including an organic EL element and a counter substrate facing the element substrate,
A first step of applying a sealing material on a surface of the element substrate and / or the counter substrate around the display region including the organic EL element;
A second step of superimposing the element substrate and the counter substrate via the sealing material;
A third step of curing the sealing material after the element substrate and the counter substrate form a predetermined gap; and
In the second step,
An opening is provided in the sealing material in advance, and when the application of pressure between the element substrate and the counter substrate is finished, the opening is closed by the spread of the sealing material.
A method for manufacturing an organic EL display device. A scale is provided in advance on a surface substantially parallel to the substrate surface of the element substrate or the counter substrate,
In the second step, the degree of spread of the sealing material is measured with the scale,
Depending on the measured value or the result calculated based on the measured value,
The method for manufacturing an organic EL display device according to claim 13, wherein the application of pressure between the element substrate and the counter substrate is terminated.

Images