JP2005217365A5 - - Google Patents

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Publication number
JP2005217365A5
JP2005217365A5 JP2004025581A JP2004025581A JP2005217365A5 JP 2005217365 A5 JP2005217365 A5 JP 2005217365A5 JP 2004025581 A JP2004025581 A JP 2004025581A JP 2004025581 A JP2004025581 A JP 2004025581A JP 2005217365 A5 JP2005217365 A5 JP 2005217365A5
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JP
Japan
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JP2004025581A
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JP4439935B2 (ja
JP2005217365A (ja
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Priority to JP2004025581A priority Critical patent/JP4439935B2/ja
Priority claimed from JP2004025581A external-priority patent/JP4439935B2/ja
Priority to US10/942,828 priority patent/US7238592B2/en
Publication of JP2005217365A publication Critical patent/JP2005217365A/ja
Publication of JP2005217365A5 publication Critical patent/JP2005217365A5/ja
Application granted granted Critical
Publication of JP4439935B2 publication Critical patent/JP4439935B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004025581A 2004-02-02 2004-02-02 半導体装置の製造方法 Expired - Fee Related JP4439935B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004025581A JP4439935B2 (ja) 2004-02-02 2004-02-02 半導体装置の製造方法
US10/942,828 US7238592B2 (en) 2004-02-02 2004-09-17 Method of manufacturing a semiconductor device having an alignment mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004025581A JP4439935B2 (ja) 2004-02-02 2004-02-02 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005217365A JP2005217365A (ja) 2005-08-11
JP2005217365A5 true JP2005217365A5 (ja) 2006-10-05
JP4439935B2 JP4439935B2 (ja) 2010-03-24

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ID=34805805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004025581A Expired - Fee Related JP4439935B2 (ja) 2004-02-02 2004-02-02 半導体装置の製造方法

Country Status (2)

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US (1) US7238592B2 (ja)
JP (1) JP4439935B2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053255A (ja) * 2005-08-18 2007-03-01 Oki Electric Ind Co Ltd アライメントマークの形成方法
KR100630768B1 (ko) 2005-09-26 2006-10-04 삼성전자주식회사 캡핑층을 구비한 얼라인먼트 키 형성방법 및 이를 이용한반도체 장치의 제조방법
US9000525B2 (en) 2010-05-19 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for alignment marks
US9165889B2 (en) * 2013-06-28 2015-10-20 Infineon Technologies Ag Alignment mark definer
CN106783803B (zh) * 2016-11-30 2019-01-25 武汉新芯集成电路制造有限公司 一种减少光刻标记图形损失的方法和半导体结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128118A (ja) 1985-11-29 1987-06-10 Nec Corp 半導体装置
JP2660405B2 (ja) 1987-06-10 1997-10-08 三菱電機株式会社 マスクアライメント方法
JP3174786B2 (ja) * 1991-05-31 2001-06-11 富士通株式会社 半導体装置の製造方法
US6307273B1 (en) * 1996-06-07 2001-10-23 Vanguard International Semiconductor Corporation High contrast, low noise alignment mark for laser trimming of redundant memory arrays
JP3447231B2 (ja) 1998-11-20 2003-09-16 セイコーインスツルメンツ株式会社 半導体集積回路の製造方法
JP2001307999A (ja) 2000-04-27 2001-11-02 Oki Electric Ind Co Ltd アライメントマークの構造およびその製造方法
JP3665275B2 (ja) 2001-05-28 2005-06-29 沖電気工業株式会社 位置合わせマークの形成方法
JP2003100861A (ja) * 2001-09-20 2003-04-04 Mitsubishi Electric Corp 半導体装置の製造方法
JP2003332270A (ja) * 2002-05-15 2003-11-21 Renesas Technology Corp 半導体装置およびその製造方法

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