JP2005210427A - Method and apparatus for manufacturing piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a piezoelectric device, with which the quantity of an adhesive applied onto an electrode is inspected. <P>SOLUTION: In the method of manufacturing a piezoelectric device 10, a piezoelectric vibrating piece is bonded to the electrode via an adhesive applied to the electrode formed on a package base. The image of the package base in which the adhesive is applied onto the electrode is acquired, the application diameter of the adhesive is obtained on the basis of the acquired image, the obtained application diameter is compared with a diameter reference range to determine whether the applied quantity is within the diameter reference range, and the piezoelectric vibration piece is arranged on the adhesive, when the applied quantity is within the diameter reference range. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method and apparatus for manufacturing a piezoelectric device, and more particularly to a method and apparatus for manufacturing a piezoelectric device suitable for inspecting the coating amount of an adhesive used for mounting a piezoelectric vibrating piece on a package base. It is.

  Piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators apply adhesive to electrodes such as mount electrodes and support electrodes formed on a package base using a dispenser, and piezoelectric vibrations are applied to the electrodes via the adhesive. It is manufactured by mounting a piece and bonding a lid to the upper surface of the package base.

  After applying the adhesive on the electrode, determination is performed using image recognition in order to determine whether or not the application amount satisfies the standard. That is, the package base to which the adhesive is applied is imaged, the captured image is displayed as binary data of black and white (binarized display), and the area (application area) of the adhesive is displayed in the displayed image. Set the area to be calculated and calculate the application area. If this area meets a preset standard, it is determined that an appropriate amount of adhesive has been applied on the electrode. It is determined that the amount of adhesive is not applied.

Further, as a determination of whether or not the application amount meets the standard, the package base to which the adhesive is applied is imaged, and the adhesive application area displayed in the captured image and a preset reference application area are determined. In comparison, there is an apparatus that determines that an appropriate amount of adhesive is applied if the application area satisfies the standard, and determines that an appropriate amount of adhesive is not applied on the electrode if the standard is not satisfied (patent) Reference 1).
Japanese Patent No. 3436233

  FIG. 8 shows an enlarged plan view of the mount electrode portion for explaining the state of the adhesive applied on the mount electrode. When the package base 101 is binarized and displayed, a display with a low light reflectance is displayed in white, and a display with a high light reflectance is displayed in black. Therefore, the adhesive 103 and the bottom surface of the package base 101 are displayed in white, and the mount electrode 102 and the seam ring 104 that joins the package base 101 and the lid are displayed in black. In the image recognition, since the white portion is recognized, it is necessary to display the adhesive 103 in white.

Since the conventional piezoelectric device has a package size of about 7 mm × 5 mm or 5 mm × 3 mm, the mount electrode 102 formed on the bottom surface of the package base 101 is sufficiently larger than the application diameter D ₁ of the adhesive 103. It was a thing. That is, even when the position of the adhesive 103 applied to the mount electrode 102 is shifted, the adhesive 103 does not protrude from the mount electrode 102 and is applied on the mount electrode 102 (FIG. 8A). reference). For this reason, when the package base 101 is binarized, since the adhesive 103 displayed in white is applied onto the mount electrode 102 displayed in black, the application area is accurately calculated.

  However, in recent years, as the piezoelectric device is miniaturized and the package size is about 3 mm × 2.5 mm, the area of the mount electrode 102 is also reduced. For this reason, the adhesive 103 may not be applied on the mount electrode 102 but may be applied by protruding from the mount electrode 102 (see FIG. 8B). At this time, when the package base 101 is binarized and displayed, the bottom surfaces of the adhesive 103 and the package base 101 are displayed in white. Therefore, the adhesive 103 and the package base 101 cannot be distinguished, and an accurate application area is determined. There is a problem that cannot be calculated. That is, even if it is determined that an appropriate amount of the adhesive 103 is applied on the mount electrode 102, since there are few portions of the adhesive 103 displayed in white, an appropriate amount of adhesive is attached on the mount electrode 102. There is a problem in that it is erroneously determined that the agent 103 is not applied.

When the package size is about 2 mm × 1.5 mm, the mount electrode 102 is further reduced and becomes thinner than the application diameter D ₂ of the adhesive 103 (see FIG. 8C). In this case, since the adhesive 103 is applied so as to protrude from the mount electrode 102, an accurate application area cannot be calculated as described above, and there is a problem in that it is erroneously determined.

The mount electrode 102 is formed by metallizing the package base 101 by thick film printing or the like, and thereafter, a metal for improving the adhesion between the metallized layer and the outermost surface layer and a metal of the outermost surface layer are formed by plating or the like. . Incidentally, there is a mount electrode 102 formed by laminating a plurality of metallized layers and raising the mount electrode. Since the edge of this mount electrode is inclined, when light hits the inclined portion, it is reflected in various directions. For this reason, a part of the reflected light is incident on an image pickup unit for picking up an image of the package base. When the picked-up image is binarized, the mount electrode is displayed separately in a portion for displaying white and a portion for displaying black. . When determination is made by applying an adhesive on the mount electrode, there is a problem that erroneous determination occurs due to the difference in the binary display of the mount electrode.
In the invention of Patent Document 1, there is a problem that it is impossible to measure whether or not an appropriate amount of the adhesive applied out of the mount electrode is applied.

  The present invention has been made to solve the above problems, and detects a coating amount of an adhesive applied on an electrode and applies a certain amount of adhesive to the electrode. The purpose is to provide.

  In order to achieve the above object, a method for manufacturing a piezoelectric device according to the present invention includes a method for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded onto an electrode via an adhesive applied to the electrode formed on a package base. The package base image obtained by applying the adhesive on the electrode is acquired, the application diameter of the adhesive is obtained based on the acquired image, and the obtained application diameter is compared with a diameter reference range. Then, it is determined whether or not the application amount is within the diameter reference range, and when the application amount is within the diameter reference range, the piezoelectric vibrating piece is disposed on the adhesive. In the captured image, the density of the electrode and the adhesive is displayed differently, so that a density difference occurs at the boundary between the electrode and the adhesive. The application diameter of the adhesive can be obtained by using this density difference. Then, by comparing the obtained coating diameter with the coating diameter (diameter reference range) when an appropriate amount of adhesive is applied on the electrode, it is determined whether or not the appropriate amount of adhesive is applied on the electrode. Can be determined. Therefore, even when the adhesive protrudes from the electrode, a difference in concentration occurs between the electrode and the adhesive, so that the application diameter can be obtained, and whether or not an appropriate amount of adhesive is applied on the electrode. Can be determined.

  In addition, the determination as to whether or not the coating amount is within the diameter reference range is performed by comparing the coating diameter with the diameter reference range and obtaining the area of the adhesive applied on the electrode based on the image. Compared to the area reference range, when the application diameter is within the diameter reference range or the obtained application area satisfies at least one of the area reference range, the application amount is determined to be within the reference range. It is characterized by that. Since the measurement comparing the application diameter of the adhesive applied on the electrode and the measurement comparing the application area of the adhesive is performed, even if it is erroneously determined on the one hand, it must be erroneously determined on the other hand. It can be determined that an appropriate amount of adhesive is applied on the electrode. Therefore, erroneous determination of measurement can be eliminated and measurement reliability can be improved.

  The piezoelectric device manufacturing apparatus according to the present invention is applied on the electrode based on the imaging unit that acquires a package-based image in which an adhesive is applied on the electrode, and the image acquired by the imaging unit. The application state detection unit for obtaining the application diameter of the adhesive and the application diameter obtained by the application state detection unit are compared with a diameter reference range to determine whether or not the application diameter is within the diameter reference range. An application amount detection unit that controls the mounting means when the application amount detection unit determines that the application diameter is within the diameter reference range, and places the piezoelectric vibrating piece on the adhesive; and It is characterized by having. Accordingly, it can be determined whether or not an appropriate amount of adhesive is applied on the electrode, and the piezoelectric vibrating piece can be mounted only on the package base to which the appropriate amount of adhesive is applied. Therefore, a piezoelectric device having a certain quality can be manufactured.

  The application state detection unit includes an application area calculation unit that calculates an area of the adhesive applied on the electrode based on the image, and the application amount detection unit is calculated by the application area calculation unit. Comparing the application area with an area reference range, and having an area comparison unit for determining whether the application area is within the reference range, the mounting means control unit, the application amount detection unit, the application diameter is When it is determined that the diameter reference range or the application area satisfies at least one of the area reference range, the mounting means is controlled to arrange the piezoelectric vibrating piece on the adhesive. It is characterized by that. Since both the comparison of the coating diameter and the comparison of the coating area are measured with respect to the amount of the adhesive applied on the electrode, more reliable measurement can be performed. Therefore, erroneous determination of measurement is eliminated, and a more constant quality piezoelectric device can be manufactured.

  Hereinafter, preferred embodiments of a method and an apparatus for manufacturing a piezoelectric device according to the present invention will be described. FIG. 1 shows a plan view of the package base. FIG. 2 shows a sectional view of the piezoelectric device. A piezoelectric device 10 such as a piezoelectric vibrator or a piezoelectric oscillator has a package base 16 having a flat bottom plate 12 and a side portion 14 formed by raising a side of the bottom plate 12. A seam ring 30 is joined to the upper surface of the side portion 14. An electrode composed of a pair of mount electrodes 18 and a support electrode 20 is formed on the bottom surface of the package base 16, that is, the top surface of the bottom plate 12. The mount electrode 18 corresponds to the position of the connection electrode 24 formed on the piezoelectric vibrating piece 22 mounted on the package base 16, and the support electrode 20 is formed to face the mount electrode 18. Depending on the form of the piezoelectric vibrating piece 22, the support electrode 20 may not be provided on the package base 16. The mount electrode 18 is electrically connected to the back surface of the package base 16, that is, the external electrode 26 formed on the bottom surface of the bottom plate 12 via a conduction portion (not shown).

  An adhesive 28 is applied on the mount electrode 18 and the support electrode 20 formed on the package base 16 by using an application means in which a needle is provided at the tip of the syringe. In this case, the adhesive 28 applied on the mount electrode 18 needs to have conductivity. The piezoelectric vibrating piece 22 is mounted on the mount electrode 18 and the support electrode 20 via the adhesive 28. At this time, the mount electrode 18 and the connection electrode 24 are electrically connected. When the piezoelectric oscillator is formed, an oscillation circuit is mounted on the package base 16 together with the piezoelectric vibrating piece 22. A lid 32 is bonded to the upper surface of the package base 16 on which the piezoelectric vibrating piece 22 is mounted, that is, the upper surface of the seam ring 30 to hermetically seal the inside of the piezoelectric device 10.

  In the process of manufacturing such a piezoelectric device 10, in order to check whether or not a desired amount of the adhesive 28 is applied on the electrode, the amount of application is determined using an image recognition method. . FIG. 3 shows a block diagram of the determination means. The determination means 40 for performing the determination includes an imaging unit 42 and a determination unit 44, and the imaging unit 42 is provided after the step of applying the adhesive 28 on the mount electrode 18 and the support electrode 20. It is provided in an arithmetic control unit 46 that controls a piezoelectric device manufacturing apparatus to be described later. The imaging unit 42 is provided above the package base 16 so as to image the package base 16 coated with the adhesive 28 on the mount electrode 18 and the support electrode 20.

  A determination unit 44 is connected to the output side of the imaging unit 42, and the determination unit 44 includes an image processing unit 50, an application state detection unit 52, an application amount detection unit 54, a posture calculation unit 56, and a mounting means control unit 58. It is. The image processing unit 50 is provided on the input side of the determination unit 44 and inputs image data captured by the imaging unit 42. The image processing unit 50 decomposes the image data into a plurality of gradations and binarizes the image data into a plurality of gradations. An application state detection unit 52 and a posture calculation unit 56 are connected to the image processing unit 50. The posture calculation unit 56 calculates the horizontal direction (posture) of the package base from the image data. The application state detection unit 52 measures the application area of the adhesive from the binarized image data, and measures the application diameter of the adhesive from the image data decomposed into a plurality of gradations. An application diameter measuring unit 62 is provided. An application amount detection unit 54 is connected to the output side of the application state detection unit 52. The application amount detection unit 54 includes a storage unit 64 and a plurality of comparison units 66 connected to the storage unit 64. One comparison unit 66 is connected to the application area measurement unit 60, and the other comparison unit 66 is connected to the application diameter measurement unit 62. The comparison unit 66 compares the application area and the application diameter of the adhesive measured by the application state detection unit 52 with the area reference range of the application area and the diameter reference range of the application diameter stored in the storage unit 64, respectively. is there. A mounting means control unit 58 is connected to the output side of the coating amount detection unit 54 and the posture calculation unit 56. The mounting means control unit 58 outputs the result of comparison between the package base posture calculated by the posture calculation unit 56 and the application amount detection unit 54 to the mounting means 80 described later.

  Next, the operation of the determination unit 40 will be described. In the determination unit 40, first, an exposure time for imaging the package base 16 is set in the imaging unit. Thereafter, the package base 16 is imaged, and the captured image is output to the image processing unit 50 provided in the determination unit 44. After the image data is processed by the image processing unit 50, binary center-of-gravity area measurement in which the application area of the adhesive 28 is measured by the application area measurement unit 60 of the application state detection unit 52, and the adhesive 28 in the application diameter measurement unit 62. The density edge width measurement for measuring the coating diameter is performed, and the coating amount of the adhesive 28 applied on the mount electrode 18 and the support electrode 20 is measured. Note that, depending on the form of the determination means 40, only the gray edge width measurement may be performed.

  Here, the measurement of the shading edge width will be described. In the image, the density of the electrode and the adhesive 28, that is, the gradation value is different. The density edge measurement is to measure the position where the density changes at the boundary between the electrode and the adhesive 28. FIG. 4 is an enlarged plan view of the mount electrode 18 portion for explaining the measurement of the grayscale edge width. FIG. 4 shows an image displayed by the imaging unit 42 displayed. An image obtained by imaging the package base 16 to which the adhesive 28 is applied is input to the determination unit 44. At this time, the density change of the image is divided into a plurality of gradations, for example, 100 gradations. In this image, a measurement range 34 for measuring the gray edge width is set in each of the mount electrodes 18 and the support electrodes 20. The measurement range 34 is positioned with reference to the outer periphery of the seam ring 30.

  Thereafter, the determination unit 44 determines that a portion where the gradation value of the image satisfies a preset reference gradation value in the measurement range 34 is a portion where the adhesive 28 is applied. The reference gradation value is appropriately adjusted according to the influence of the light amount and direction of light illuminating the package base 16, that is, the environment in which the determination unit 40 is installed. If does not change, there is no need to readjust. In order to determine the edge of the applied adhesive 28, first, the gradation value is measured from the right end to the left end of the measurement range 34, and the portion where the gradation value satisfies the reference gradation value is adhered. The right end of the agent 28 is determined.

  Further, the same measurement as described above is performed from the left end to the right end of the measurement range 34 to determine the left end of the adhesive 28. The right end and the left end are assumed to be both ends of the portion where the adhesive 28 is applied, and a line connecting the both ends is the diameter of the adhesive 28 in the imaging unit 42. The application diameter of the adhesive 28 is calculated by multiplying this diameter by the magnification at the time of imaging. Then, a diameter reference range of the application diameter is set in the determination unit 44. If the calculated application diameter is within the diameter reference range, it is determined that an appropriate amount of the adhesive 28 is applied, and outside the diameter reference range. If there is, it is determined that the appropriate amount of adhesive 28 is not applied.

  This determination is performed for each of the mount electrodes 18 and the support electrodes 20. Further, in the measurement of the shade edge width, not only when the adhesive 28 is applied without protruding from the electrode (see FIG. 4A), even when the adhesive 28 is applied protruding from the electrode, The application diameter is calculated within the measurement range 34 (see FIGS. 4B and 4C).

  Next, binary centroid area measurement will be described. FIG. 5 shows an enlarged plan view of the mount electrode 18 portion for explaining binary centroid area measurement. FIG. 5 shows a display of an image captured by the imaging unit 42. An image obtained by imaging the package base 16 to which the adhesive 28 is applied is input to the determination unit 44 and displayed as a binarized image. That is, the density change of the image is divided into a plurality of gradations, and is displayed in white if the gradation value of the image is higher than the threshold value with reference to a preset gradation value threshold value. If the tone value of is low, it is displayed in black. Accordingly, the adhesive 28 and the bottom surface of the package base 16 are displayed in white, and the mount electrode 18, the support electrode 20, and the seam ring 30 are displayed in black. Since the binarized image can be adjusted by changing the threshold value, the adhesive 28 may be adjusted to a threshold value that is most easily recognized on the image.

  In order to perform the binary center-of-gravity area measurement, first, a range (measurement range 36) for measuring the area where the adhesive 28 is applied (application area) is set. That is, the measurement range 36 of the application area of the adhesive 28 is set in each of the mount electrodes 18 and the support electrodes 20. The measurement range 36 is positioned with reference to the outer periphery of the seam ring 30 and set in each of the mount electrodes 18 and the support electrodes 20. Since the seam ring 30 is formed by pressing, the dimensional accuracy is high. Therefore, when the outer periphery of the seam ring 30 is used as a reference, the measurement range 36 can be accurately set on the package base 16. Note that the measurement range 34 can be accurately positioned even in the case of the gray edge width measurement. Within this measurement range 36, the application area of the adhesive 28 is calculated. That is, in the binary center-of-gravity area measurement, the white area on the image is recognized and the application area is measured. Therefore, the area of the white area in the measurement range 36 is calculated, and this area is used as the adhesive 28. The coating area is as follows.

  After the binary centroid area measurement, the area reference range of the application area stored in advance in the application amount detection unit 54 is compared with the calculated application area, and if the application area is within the area reference range, it is appropriate. It is determined that an amount of the adhesive 28 is applied, and if it is outside the area reference range, it is determined that an appropriate amount of the adhesive 28 is not applied.

  Then, the determination unit 44 performs the above-described binary center-of-gravity area measurement and light / dark edge width measurement, and if the reference range is satisfied in either or both of the measurements, the adhesive 28 is applied on the electrode in an appropriate amount. judge.

  As described above, if the measurement range 34 has a boundary between the adhesive 28 and the electrode, the density edge width measurement can measure the position of the boundary based on the density change in the image, and the application diameter of the adhesive 28 can be determined from this measurement. Can be sought. By comparing this application diameter with the diameter reference range, it can be determined whether or not an appropriate amount is applied. Therefore, even if the adhesive 28 is applied outside the electrode, the determination can be made if the application diameter can be measured in the measurement range 34. In the determination method according to the related art, even if the package base is erroneously determined as not being applied with an appropriate amount, the determination method according to the present embodiment determines that an appropriate amount of adhesive 28 is applied. can do.

  Further, in the present embodiment, since the application diameter of the adhesive 28 is directly measured, the application amount of the adhesive 28 can be made constant even when the workers are different. Accordingly, there is no variation in the application amount of the adhesive 28, and the piezoelectric device 10 having a certain quality can be manufactured.

  Then, by performing both the measurement of the density edge width measurement and the binary center-of-gravity area measurement, it is possible to eliminate the erroneous determination of the measurement that has occurred in each, and to improve the measurement reliability.

  Next, a description will be given of a piezoelectric device manufacturing apparatus provided with the above-described determination means 40 for determining the amount of adhesive applied. FIG. 6 shows a plan view of a piezoelectric device manufacturing apparatus. FIG. 7 shows a flow for manufacturing a piezoelectric device. The piezoelectric device manufacturing apparatus 70 includes an index table 72 that rotates in a horizontal plane with a central portion as a center. Around the index table 72, supply means 74 for placing the package base on the index table 72, application position measuring means 76 for measuring the position at which the adhesive is applied to the package base, and application of the adhesive to the package base Applying means 78, determining means 40 described above, mounting means 80 for mounting the piezoelectric vibrating piece on the package base, inspection means 82 for inspecting the mounting position of the piezoelectric vibrating piece, and package base on which the piezoelectric vibrating piece is mounted Storage means 84 for storing the product in the tray and product remaining detection means 86 for detecting the package base remaining on the index table 72 without being stored in the tray are provided in order along the rotation direction of the index table 72. . The index table 72, the supply unit 74, the application position measuring unit 76, the application unit 78, the determination unit 40, the mounting unit 80, the inspection unit 82, the storage unit 84, and the remaining product detection unit 86 are connected to the calculation control unit 46. , Each controlled. The calculation control unit 46 is connected to a display unit 87 that displays an image captured by the determination unit 40 or the like. In FIG. 6, the rotation direction of the index table 72 is a direction that rotates clockwise with respect to the drawing.

  Below the supply means 74 is a tray 88 in which the package bases are arranged and stored. The supply means 74 sucks the package base in the tray 88 using a suction nozzle and is near the outer edge on the index table 72. (S100). When the package base is placed on the index table 72, the index table 72 rotates and the package base moves below the application position measuring means 76.

  The application position measuring unit 76 images the package base from above (S102) and outputs data to the arithmetic control unit 46. Then, the captured image is recognized to determine whether the package base is a non-defective product (S104). The determination data is output to the storage means 84, and the subsequent work is not performed on the package base determined to be defective. The orientation of the package base in the horizontal direction, that is, the position of each mount electrode and support electrode provided on the package base is recognized from the captured image, and the position where the adhesive is applied is measured (S106). The measured data is output to the coating unit 78. Then, the index table 72 rotates and the package base moves below the coating means 78.

  Based on the data measured by the application position measurement means 76, the application means 78 moves the syringe provided with a needle at the tip, and applies the adhesive on the mount electrode and the support electrode (S108). If the package base is not provided with a support electrode, the adhesive is applied only to the mount electrode. The adjustment of the application amount when applying the adhesive is performed, for example, by changing the discharge time of the adhesive. If the discharge time is increased, the application amount of the adhesive increases and the application diameter also increases. When the application of the adhesive is completed, the index table 72 rotates and the package base moves below the determination means 40.

  The determination unit 40 images the package base to which the adhesive is applied (S110), and outputs the image data to the arithmetic control unit 46. Then, the binary centroid area measurement (S112) and the gray edge width measurement (S114) described above are performed to determine whether or not an appropriate amount of adhesive is applied (S116), and the index table is applied by applying the adhesive. Since the position of the package base may move with respect to 72, the attitude of the package base is recognized again. This recognition is performed in the same manner as the application position measuring means 76. If it is determined that an appropriate amount of adhesive has not been applied, determination data is output to the application unit 78 to adjust the application amount, and determination data is output to the storage unit 84. Further, the subsequent work is not performed on the package base determined to be not the proper amount. Further, the data that recognizes the orientation of the package base in the horizontal direction is output to the mounting means 80. Thereafter, the index table 72 rotates and the package base moves below the mounting means 80.

  The mounting means 80 includes a tray in which piezoelectric vibrating pieces are arranged and stored. The mounting means 80 uses a suction nozzle to suck the piezoelectric vibrating pieces in the tray and mount them on the package base. ing. Specifically, the piezoelectric vibrating piece is imaged to determine whether the piezoelectric vibrating piece has a defect such as a scratch, and the direction of the piezoelectric vibrating piece, that is, the position of the connection electrode is recognized. Then, the position and orientation of the piezoelectric vibrating piece mounted on the package base is calculated from the data recognizing this position and the package base posture data recognized by the determining means 40, and only the piezoelectric vibrating piece determined to be non-defective is calculated. It is mounted on the package base (S118). At this time, the connection electrode provided on the mount electrode and the piezoelectric vibrating piece is electrically and mechanically connected. The piezoelectric vibrating piece determined to be defective is placed in a defective product tray provided in the mounting means 80. After the piezoelectric vibrating piece is mounted on the package base, the index table 72 rotates and the package base moves below the inspection means 82.

  The inspection unit 82 images the package base on which the piezoelectric vibrating piece is mounted from above (S120), and outputs data to the arithmetic control unit 46. The amount of displacement of the piezoelectric vibrating piece with respect to the package base is recognized from the captured image, and the mounting position of the piezoelectric vibrating piece is inspected (S122). This inspection data is output to the storage means 84. After the inspection is completed, the index table 72 is rotated, and the package on which the piezoelectric vibrating piece is mounted moves below the storage unit 84.

  The storage means 84 chucks the package base whose mounting position is determined to be normal based on the inspection data output from the inspection means 82, and stores the package base in alignment with the tray 90 (S124). The package base determined to have an abnormal mounting position is placed in the defective product tray 92 (S126). Further, the package base that is determined to be defective by the application position measuring unit 76 and the package base that is determined by the determination unit 40 that the adhesive amount is not an appropriate amount are also chucked and placed on the tray 92 for defective products. (S126).

  The product remaining detection means 86 detects the package base that cannot be chucked by the storage means 84 and remains on the index table 72.

Such a piezoelectric device manufacturing apparatus 70 can perform operations simultaneously in each means, and can continuously mount the piezoelectric vibrating reeds on the package base.
And by using the determination means 40 mentioned above, the package base mistakenly determined as defective can be eliminated. Moreover, since the application diameter of an adhesive agent can be measured, the application amount of an adhesive agent can be adjusted based on this application diameter. Therefore, it is possible to manufacture a constant quality piezoelectric device.

  The determination means 40 described above can be used not only for manufacturing a piezoelectric device but also for a manufacturing apparatus for mounting an electronic component on an electrode using an adhesive.

It is a top view of the package base which concerns on this Embodiment. It is sectional drawing of the piezoelectric device which concerns on this Embodiment. It is a block diagram of a determination means. It is the top view which expanded the mount electrode part for demonstrating light / dark edge width measurement. It is the top view to which the mount electrode part was expanded for demonstrating binary gravity center area measurement. The top view of the manufacturing apparatus of the piezoelectric device which concerns on this Embodiment is shown. It is a flow which manufactures a piezoelectric device. It is a figure which concerns on a prior art and is a figure explaining the state of the adhesive agent apply | coated on the mount electrode.

Explanation of symbols

10 ......... Piezoelectric device, 16 ......... Package base, 18 ......... Mount electrode, 20 ......... Support electrode, 22 ......... Piezoelectric vibrating piece, 28 ......... Adhesive, 30 ......... Seam ring, 32 ......... Lid, 34, 36 ......... Measurement range, 40 ......... Determining means, 42 ......... Imaging section, 44 ......... Determining section, 50 ......... Image processing section, 52 ......... Application state Detection unit 54... Application amount detection unit 56... Posture calculation unit 58... Mounting means control unit 70.

Claims (4)

A method of manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded onto the electrode via an adhesive applied to an electrode formed on a package base,
Obtaining an image of the package base with the adhesive applied on the electrodes;
Determine the application diameter of the adhesive based on the acquired image, compare the determined application diameter with a diameter reference range to determine whether the application amount is within the diameter reference range,
Disposing the piezoelectric vibrating piece on the adhesive when the coating amount is within a diameter reference range;
A method for manufacturing a piezoelectric device. Determining whether the coating amount is within the diameter reference range,
While comparing the coating diameter with the diameter reference range,
Find the area of the adhesive applied on the electrode based on the image and compare with the area reference range,
When the application diameter is within the diameter reference range, or the obtained application area satisfies at least one of the area reference range, the application amount is determined to be within the reference range.
The method for manufacturing a piezoelectric device according to claim 1. An imaging unit for acquiring a package-based image in which an adhesive is applied on the electrode;
Based on the image acquired by the imaging unit, an application state detection unit for obtaining an application diameter of the adhesive applied on the electrode;
A coating amount detection unit that compares the coating diameter obtained by the coating state detection unit with a diameter reference range and determines whether or not the coating diameter is within the diameter reference range;
A mounting means control section for controlling the mounting means to dispose the piezoelectric vibrating piece on the adhesive when the coating amount detection unit determines that the coating diameter is within the diameter reference range;
An apparatus for manufacturing a piezoelectric device, comprising: The application state detection unit has an application area calculation unit for obtaining an area of the adhesive applied on the electrode based on the image,
The application amount detection unit has an area comparison unit that compares the application area obtained by the application area calculation unit with an area reference range and determines whether the application area is within the area reference range,
The mounting means control unit, when the coating amount detection unit determines that the coating diameter satisfies at least one of the diameter reference range and the coating area within the area reference range, Controlling the means to place the piezoelectric vibrating piece on the adhesive;
The apparatus for manufacturing a piezoelectric device according to claim 3.

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