JP2005209785A - Electronic component mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounter that has high production efficiency and can pick up an image of an electronic component that is held by a suction nozzle on the way of movement for mounting after it is picked up. <P>SOLUTION: A plurality of component pick-up positions of a component supply unit 4, an installation position of a component recognition camera 25, a plurality of component mounting positions in a printed board 3, and a plurality of arrangement positions of suction nozzles 6 in a mounting head 5 are arranged on a single line, and the mounting head 5 is movable in one direction by an X-axis driving motor 7 and it is also made movable in a reciprocative manner between the component pick-up position in the component supply unit 4 and the component mounting position in the printed board 3. The suction nozzles 6 are used to pick up and mount the electronic component at the same time, and the image of the electronic component sucked and held by the suction nozzle 6 on the way of movement from picking up to mounting is picked up by the component recognition camera 25. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus in which a suction nozzle provided in a mounting head takes out an electronic component supplied from a component supply device and mounts the electronic component on a substrate.

This type of electronic component mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 2003-8293 (for example, see Patent Document 1).
JP 2003-8293 A

  However, since the electronic components supplied by the component supply device are mounted one by one on the substrate by the suction nozzle provided in the mounting head, the production efficiency is not high. In addition, it is necessary to bother passing the electronic component above the component recognition camera that images the electronic component held by the suction nozzle before taking it out and mounting it on the substrate.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that has high production efficiency and that can capture an image of an electronic component held by a suction nozzle while moving for mounting after taking out the electronic component.

  Therefore, according to the first aspect of the present invention, there is provided an electronic component mounting in which the suction nozzle provided in the mounting head takes out an electronic component supplied from a component supply apparatus having a plurality of component extraction positions in a row at a predetermined interval and mounts the electronic component on the substrate. In the apparatus, a plurality of suction nozzles are arranged in a row in the mounting head at the same intervals as the component pick-up positions of the component supply device, and the arrangement intervals of the suction nozzles are arranged on the substrate. Arranged to be an integral multiple of the mounting pitch to be mounted, a component recognition camera is disposed between the component supply device and the substrate, and electronic components are taken out and mounted simultaneously by a plurality of suction nozzles. The number of times is equal to the integer, and the electronic component picked up and held by each of the suction nozzles is picked up by the component recognition camera after the electronic component is taken out and mounted.

  According to a second aspect of the present invention, there is provided an electronic component mounting apparatus in which the suction nozzle provided in the mounting head takes out an electronic component supplied from a component supply device having a plurality of component extraction positions in a row at a predetermined interval and mounts the electronic component on the substrate. A plurality of mounting heads, and a plurality of suction nozzles arranged in a row in the mounting heads at the same intervals as the component take-out positions of the component supply device, and the spacing between the suction nozzles Are arranged so as to be an integral multiple of the mounting pitch at which electronic components are mounted on the substrate, and a component recognition camera is disposed between the component supply device and the substrate, and is simultaneously performed by a plurality of suction nozzles. Each of the mounting heads alternately takes out and mounts the electronic component as many times as the integer number and removes the electronic component and then mounts it on each suction nozzle with the component recognition camera before mounting. Wherein the imaging wearing holding electronic components.

  According to a third invention, in the first or second invention, the plurality of component pick-up positions of the component supply device, the arrangement position of the component recognition camera, the plurality of component mounting positions on the printed circuit board, and the mounting head A plurality of suction nozzles are arranged on a single line, and the mounting head can be moved in one direction, so that the component feeding device can move in one direction, and reciprocates between the component extraction position of the component supply device and the component mounting position on the printed circuit board. It is possible to do this.

  The present invention enables a mounting head having a plurality of suction nozzles to reciprocate between a plurality of component extraction positions of a component supply device and a component mounting position on a printed circuit board, and simultaneously extracts a plurality of electronic components from the component supply device. In addition, since it is possible to mount on the printed circuit board at the same time and the electronic component sucked and held by the suction nozzle can be captured by the component recognition camera in the middle of moving for mounting, the structure has a simple production efficiency. A high electronic component mounting apparatus can be provided. Further, the plurality of component pick-up positions of the component supply device, the arrangement position of the component recognition camera, the plurality of component mounting positions on the printed circuit board, and the arrangement position of the plurality of suction nozzles on the mounting head are arranged in a line. Since the mounting head can be moved in one direction and can be moved back and forth between the component pick-up position of the component supply device and the component mounting position on the printed circuit board, the moving mechanism of the mounting head is simplified. Further, the manufacturing cost can be reduced, and the production efficiency can be further improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 is a plan view of the electronic component mounting apparatus 1, and FIG. 2 is a front view of the apparatus 1. Reference numeral 2 denotes a guide rail for the printed circuit board 3, and a continuous film-like printed circuit board 3 is mounted by a conveying device (not shown) on the mounting area (in FIG. 1, five are described, and each mounting area is cut after mounting the electronic component. Then, it becomes a printed circuit board as each product.) It is guided when transporting by unit (1 pitch) or by transporting 4 mounting areas (4 pitches).

  As shown in FIG. 1, for example, 50 electronic components are mounted on each mounting area 3 </ b> A to 3 </ b> E of the printed circuit board 3 in a row at predetermined equal intervals. Reference numeral 4 denotes a component supply unit that stores electronic components and supplies them one by one to the component extraction position P. For example, 10 components are arranged in a line at a predetermined interval, and 10 component extraction positions P are arranged in a line. . In addition, although the component supply device 4A having a plurality of component extraction positions is configured by the plurality of component supply units 4, the present invention is not limited to this embodiment, and a plurality of component supply units 4 are mounted on each storage portion of the tray. The electronic component may be moved to the component extraction position.

  Reference numerals 5 and 5 denote mounting heads provided with ten suction nozzles 6 at the same intervals as the plurality of component supply units 4, and screw shafts 8 are driven above the guide rails 2 by driving an X-axis drive motor 7. Is configured to reciprocate along a pair of guides 10 provided on a mounting plate 9 fixed to the apparatus main body. Further, a vertical axis drive motor 12 is fixed to the head body 11 of the mounting head 5, and the attachment body in which the suction nozzle 6 is provided along the pair of guides 14 by the rotation of the screw shaft 13 by the drive of the drive motor 12. 15 is configured to be movable up and down.

  Then, an opening is provided in the support plate 16 fixed to the mounting body 15 so that the upper part of each suction nozzle 6 can be moved up and down, and via a belling 18 disposed in a guide 17 fixed to the support plate 16. The intermediate portion can be moved up and down, and a coil spring 20 is disposed between the support portion 19 fixed to the guide 17 and the support plate 16 with the suction nozzle 6 inserted (inserted). The

  Reference numeral 21 denotes 10 blocking members that block (regulate) the lowering of the suction nozzles 6 and are composed of cylinders 23 fixed to a mounting plate 22 fixed to the apparatus main body. The cylinders 23 operate. Thus, the rod comes into contact with the support portion 19 lowered by the vertical axis drive motor 12, and the lowering is restricted at the upper position of the printed circuit board 3.

  The interval between the suction nozzle 6 and the mounting head 5 is set to be an integral multiple (5 times in the present embodiment) of the mounting pitch for mounting the electronic component on the substrate. That is, 50 electronic components can be mounted in a row in each mounting area of the printed circuit board 3, and each mounting head 5 is provided with, for example, 10 suction nozzles 6; The ten electronic components taken out and mounted simultaneously by the nozzle 6 are shifted by one pitch and performed five times, which is the same number as the integer.

  Two component recognition cameras 25 are provided corresponding to each mounting head 5, and this component recognition camera 25 drives 10 electronic components held by 10 suction nozzles 6 by driving an X-axis drive motor 7. While the mounting head 5 is moving, an image is captured by a so-called fly view (fly recognition) method. That is, the electronic component is imaged while moving, and each component recognition camera 25 is disposed at an intermediate position between the component supply unit 4 and the corresponding mounting area of the printed circuit board 3.

  As described above, the arrangement direction of the ten component supply units 4, the arrangement direction of the ten suction nozzles 6 in the mounting head 5, and the moving direction of the mounting head 5 are made the same, and the printed circuit board 3. In order to mount the electronic component, a component recognition camera 25 that captures an image of the electronic component held by each suction nozzle 6 while the mounting head 5 moves is disposed at a position in the middle of the movement.

  More specifically, the component take-out position P of the ten component supply units 4 arranged side by side, the arrangement position of the component recognition camera 25, a plurality of component mounting positions on the printed circuit board 3, and 10 in the mounting head 5. The arrangement positions of the suction nozzles 6 are arranged on a line, the mounting head 5 can be moved in one direction, the component extraction position P of the component supply unit 4 and the component mounting position on the printed circuit board 3. The component recognition camera 25 captures an image while the electronic component sucked and held by the suction nozzle 6 is moved at a midway position.

  Next, a control block diagram of the electronic component mounting apparatus 1 in FIG. 8 will be described. Reference numeral 30 denotes a CPU as a control device that performs overall control of operations related to taking out and mounting of the electronic components of the electronic component mounting apparatus, 31 is a RAM (random access memory) as a storage device, and 32 is a ROM (read only memory).・ Memory). Then, based on the data stored in the RAM 31, the CPU 30 performs X-axis driving via the interface 33 and the drive circuit 34 for operations related to taking out and mounting the electronic component of the electronic component mounting apparatus in accordance with the program stored in the ROM 32. The motor 7 and the vertical axis drive motor 12 are controlled in an integrated manner.

  In the RAM 31, mounting data including X coordinates, Y coordinates, mounting angles, component arrangement numbers in the component supply unit 4, etc. for each step number (mounting order), X size, Y size, and use suction for each electronic component. Parts including the number of the nozzle 18 and the like are stored.

  A recognition processing device 35 is connected to the CPU 30 via the interface 33. The recognition processing device 35 performs recognition processing of an image captured and captured by the component recognition camera 25. Is sent out. That is, the CPU 30 instructs the recognition processing device 35 to recognize an image captured by the component recognition camera 25 (for example, whether there is a defective mark attached to the electronic component or whether the electronic component is cracked or chipped). In addition to outputting, the recognition processing result is received from the recognition processing device 35.

  With the above configuration, the operation will be described below. The printed circuit board 3 is transported along a guide rail 2 by a transport device (not shown), and the stop position of the printed circuit board 3 shown in FIG. 1 is the initial position, and is positioned and fixed by positioning means (not shown). Each component supply unit 4 supplies electronic components one by one to the component extraction position P, the right mounting head 5 is driven by its X-axis drive motor 7 to rotate the screw shaft 8, and a pair of guides 10. Are moved to an upper position of the ten component supply units 4 arranged in parallel.

  Then, the vertical shaft drive motor 12 is driven to rotate the screw shaft 13, the attachment body 15 provided with the suction nozzle 6 is lowered along a pair of guides 14, and the ten suction nozzles 6 are ten pieces. At the same time, the electronic components are picked up from the component supply unit 4 and taken out.

  Thereafter, the suction nozzle 6 is moved upward by the drive of the X-axis drive motor 7 while being moved upward by the drive of the vertical axis drive motor 12 and above the mounting area 3 </ b> A on the printed board 6.

  In the middle of this movement, the electronic component sucked and held by each suction nozzle 6 by the right component recognition camera 25 is picked up by the component recognition camera 25 while moving, and recognized by a recognition processing device (not shown). It is determined whether or not the part is a defective part.

  When each suction nozzle 6 moves above the mounting area 3A, the vertical axis drive motor 12 is driven, each suction nozzle 6 descends, and ten suction nozzles 6 place ten electronic components on the printed circuit board 3. Attach to the same time.

  In this case, when the recognition processing device 35 determines that the component is a defective component, for example, an electronic component with a defect mark, a broken electronic component, or a partially missing electronic component, the CPU 30 performs a recognition process. Based on the recognition processing result of the device 35, the corresponding cylinder 23 of the blocking member 21 is operated, and the rod comes into contact with the support portion 19 lowered by the vertical axis drive motor 12. regulate. Thereby, it is possible to prevent the defective part from being mounted on the printed circuit board 3.

  In addition, each suction nozzle 6 of the right mounting head 5 moves upward above the mounting area 3A on the printed circuit board 6 while sucking and lifting the electronic component, and when left from each component supply unit 4, the left The mounting head 5 is moved to the upper position of each component supply unit 4 that supplies the electronic components one by one up to the component take-out position P by driving the X-axis drive motor 7. Thereafter, the vertical axis drive motor 12 is driven to lower the mounting body 15 provided with the suction nozzle 6, and the ten suction nozzles 6 of the left mounting head 5 are moved from the ten component supply units 4 to the electronic components. Are simultaneously adsorbed and removed.

  Thereafter, the suction nozzle 6 of the left mounting head 5 is moved upward by the driving of the X-axis driving motor 7 while the suction nozzle 6 of the left mounting head 5 is raised by the driving of the vertical axis driving motor 12. Thus, the electronic component sucked and held by each suction nozzle 6 by the left component recognition camera 25 is imaged by the component recognition camera 25 while moving, and is recognized by the recognition processing device 35.

  As described above, except for the suction nozzle 6 that sucks the electronic component determined to be a defective part by the recognition processing device 35, the vertical nozzle drive motor 12 is driven so that each suction nozzle 6 reaches the printed board 3. It is lowered and mounted on the printed circuit board 3 at the same time.

  Next, each suction nozzle 6 of the left mounting head 5 moves upward above the mounting area 3D on the printed circuit board 6 while picking up and lifting the electronic component. The mounting head 5 moves to an upper position of each component supply unit 4 that supplies the electronic components one by one to the component take-out position P, takes out the electronic components, and moves to above the printed circuit board 3 to mount the electronic components. The electronic components are taken out and mounted alternately by the ten suction nozzles of the left and right mounting heads 5.

  In this case, the interval between the suction nozzles 6 on the mounting head 5 is set to be five times the mounting pitch at which the electronic components are mounted on the substrate. Thus, the mounting of 10 electronic components performed simultaneously is shifted 5 times by 1 pitch. As a result, 50 electronic components are mounted on the mounting area 3A of the printed circuit board 3 by the suction nozzle 6 of the right mounting head 5 and on the mounting area 3D by the suction nozzle 6 of the left mounting head 5, respectively. It will be.

  If there is a defective part, the cylinder 23 of the corresponding blocking member 21 is operated to prevent the defective part from being mounted on the printed circuit board 3 as described above. After the mounting operation on the printed circuit board 3, during the upward movement of the component supply unit 4, a plurality of component extraction positions of the component supply unit 4, the arrangement positions of the component recognition cameras 25, The defective parts are discarded in a disposal box 29 disposed on a line in the same manner as the plurality of component mounting positions and the plurality of suction nozzles 6 are disposed.

  Then, only the electronic component corresponding to the number of defective components is taken out from the component supply unit 4 by the corresponding suction nozzle 6 and after the component recognition process, only the non-defective product is mounted at the position in the corresponding printed circuit board 3. If there are a plurality of defective parts, a plurality of defective parts are picked up and mounted simultaneously. In this case, the suction nozzle 6 that is not used is controlled to move down by the cylinder 23 of the corresponding blocking member 21, and the electronic component take-out operation and mounting operation are not performed.

  When the mounting of all the electronic components in the mounting areas 3A and 3D is finished, as shown in FIG. 6, the printed circuit board 3 is moved rightward by one mounting area by the transport device along the guide rail 2, and this time 50 electronic components are mounted on the mounting area 3B of the printed circuit board 3 by the suction nozzle 6 of the right mounting head 5 and on the mounting area 3E by the suction nozzle 6 of the left mounting head 5, respectively. .

  When all the electronic components have been mounted in the mounting areas 3B and 3E, as described above, the printed circuit board 3 is moved rightward by one mounting area, and this time, the mounting area 3C of the printed circuit board 3 is moved to the mounting area 3C. In the mounting area 3F, 50 electronic components are mounted by the suction nozzle 6 in the right mounting head 5 and by the suction nozzle 6 in the left mounting head 5, respectively.

  In this way, when electronic components are mounted from the mounting areas 3A to 3F, the printed circuit board 3 is moved to the right by the mounting area along the guide rail 2 by the conveying device 2, and thereafter the left and right mountings are similarly performed. The mounting of ten electronic components by the suction nozzle 6 of the head 5 is performed five times with a pitch shift. After that, the electronic component is moved to the right by one mounting area, and the electronic component mounting is shifted one pitch at a time and repeated five times. This is repeated twice, that is, when the entire six mounting areas are mounted, printing is performed as described above. This is repeated such that the substrate 3 is moved to the right by 4 mounting areas (see FIG. 6), and the description is omitted hereinafter.

  Next, as shown in FIG. 7, the transporting area 3 </ b> B of the printed circuit board 3 is mounted so that electronic components are mounted by reciprocating movement between the suction nozzle 6 of the left mounting head 5 and the component supply unit 4. Another embodiment of the conveyance relationship in which the apparatus conveys the initial position will be described.

  At this initial position, as described above, first, the left mounting head 5 is reciprocated five times with the component supply unit 4 to mount 50 electronic components in the mounting area 3B. When this mounting is completed, the transport device moves the mounting board to the right by two mounting areas. This time, the mounting area 3A of the printed circuit board 3 is moved to the mounting area 3D by the suction nozzle 6 in the right mounting head 5. In the left mounting head 5, 50 electronic components are mounted by the suction nozzle 6 respectively. In other words, the mounting of 10 electronic components by the suction nozzles 6 of the left and right mounting heads 5 is alternately performed 5 times with a pitch shift, and the electronic components are mounted in the mounting areas 3A and 3D.

  Next, it is moved to the right by two mounting areas by the transport device, and mounting of 10 electronic components by the suction nozzles 6 of the left and right mounting heads 5 is shifted one pitch at a time and alternately performed five times. Electronic parts are mounted in the areas 3C and 3F.

  In the same manner, the electronic device is moved to the right by two mounting areas by the transport device, and mounting of the ten electronic components by the suction nozzles 6 of the left and right mounting heads 5 is alternately performed 5 times with a shift of 1 pitch. The electronic components are mounted on the mounting areas 3E and 3H.

  Thereafter, the electronic components are mounted while moving to the right by the two mounting areas, such as moving to the right by two mounting areas and mounting the electronic components to the mounting areas 3G and 3J. The following is omitted. Note that the component recognition processing in the other embodiments is the same as that in the first embodiment, and will be omitted.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a front view of an electronic component mounting apparatus. It is a side view in the standby position of the adsorption nozzle of a mounting head. It is a side view in the lowered position of the suction nozzle of the mounting head. It is a side view of a state where the lowering of the suction nozzle of the mounting head is blocked by the blocking member. It is a schematic diagram for demonstrating conveyance of a printed circuit board. It is a schematic diagram of other embodiment for demonstrating conveyance of a printed circuit board. It is a control block diagram of an electronic component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Printed circuit board 3A, 3B Mounting area 4 Component supply unit 4A Component supply apparatus 5 Mounting head 6 Suction nozzle 7 X-axis drive motor 21 Blocking member 23 Cylinder 25 Component recognition camera 35 Recognition processing apparatus P Component extraction position

Claims (3)

  An electronic component mounting apparatus for picking up and mounting electronic components supplied from a component supply device having a plurality of component extraction positions in a row at a predetermined interval by a suction nozzle provided on the mounting head. A plurality of suction nozzles are arranged in a row in the mounting head at the same interval as each component pick-up position, and the interval between the suction nozzles is an integral multiple of the mounting pitch at which the electronic components are mounted on the substrate. The component recognition camera is disposed between the component supply device and the substrate, and electronic components are taken out and mounted simultaneously by a plurality of suction nozzles as many times as the integer and An electronic component mounting apparatus for picking up an image of an electronic component sucked and held by each of the suction nozzles by the component recognition camera after taking out the electronic component and before mounting.   In an electronic component mounting apparatus for picking up electronic components supplied from a component supply device having suction nozzles provided on the mounting head at a predetermined interval and having a plurality of component extraction positions in a row and mounting them on a substrate, the plurality of mounting heads In addition, a plurality of suction nozzles are arranged in a row in the mounting heads at the same intervals as the component take-out positions of the component supply device, and the arrangement intervals of the suction nozzles place electronic components on the substrate. The component recognition camera is disposed between the component supply device and the substrate, and the electronic components are picked up and mounted simultaneously by a plurality of suction nozzles. The mounting heads alternately perform the same number of times as the integer and take out the electronic components and then mount the electrons sucked and held by the suction nozzles with the component recognition camera before mounting. An electronic component mounting apparatus characterized by imaging the article. A plurality of component pick-up positions of the component supply device, an arrangement position of the component recognition camera, a plurality of component mounting positions on the printed circuit board, and a plurality of suction nozzles on the mounting head are arranged in a line. 3. The apparatus according to claim 1, wherein the mounting head is configured to be movable in one direction so as to be capable of reciprocating between a component pick-up position of the component supply device and a component mounting position on the printed circuit board. The electronic component mounting apparatus described in 1.

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