JP2005206854A - Inline type film deposition apparatus, and unit for film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inline type film deposition apparatus where time and cost taken for designing and production are reduced, and to provide a unit to be used for the film deposition apparatus. <P>SOLUTION: In the inline type film deposition apparatus comprising an outward run part 100, a return part 200, connection parts 1 and 10 connecting each toe and termination of the outward run part 100 and return part 200, and a plurality of treatment chambers 2a to 9a for film deposition arranged at the outward run part 100, the outward run part 100 is divided into sub-outward run parts 13a corresponding to the plurality of treatment chambers 2a to 9a, further, the return part 200 is divided into sub-return parts 13b corresponding to each sub-outward run part 13a, and mutually corresponding each treatment chamber 2a to 9a, the sub-outward run part 13a and the sub-return part 13b are integrated as units 2 to 9 for film deposition, thus the units 2 to 9 for film deposition are connected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an in-line type film forming apparatus and a unit for a film forming apparatus used therefor.

A conventional film forming apparatus for forming a film on the surface of a base material carries the base material to be formed into a vacuum chamber of the film forming device, and performs film formation by a sputtering apparatus or the like in the vacuum chamber. After that, the substrate is unloaded from the vacuum chamber. In addition, in a conventional in-line type film forming apparatus, a substrate is mounted on a carrier, and the carrier is sequentially transported to a processing chamber such as a vacuum tank in the forward path to perform a film forming operation. The mounted substrate is collected (see Patent Document 1).
JP-A-5-33134

  However, in such a conventional in-line type film forming apparatus, simultaneously with the design of the forward path part according to the film forming conditions such as the number and thickness of the film forming layers, the carrier after the substrate recovery is returned to the start part of the forward path part again. The design of the return path is also required, which increases the time and cost for designing and manufacturing the in-line type film forming apparatus.

  The present invention has been made to solve the above-described problems, and by designing and manufacturing the forward path part and the return path part, the time and cost for designing and manufacturing the in-line type film forming apparatus can be reduced. An object of the present invention is to provide a reduced in-line type film forming apparatus and a film forming apparatus unit used therefor.

  In order to solve the above problems, an inline-type film forming apparatus according to the present invention includes a forward end portion, a return passage portion, a start end side connection portion connecting the end of the return passage portion to a start end of the forward pass portion, and a termination of the forward pass portion. A terminal-side connecting portion connected to a starting end of the return path portion, a carrier transport path for transporting the carrier so as to circulate through each portion, and a film forming film disposed so that the carrier sequentially passes through the forward path portion In an in-line type film forming apparatus that includes a plurality of processing chambers, and deposits a substrate on the carrier and sequentially passes through the processing chamber, the forward path section includes the plurality of processing chambers. And the return path section is divided into sub return path sections corresponding to the sub-outward path sections, corresponding to the processing chambers, the sub-outward path sections, and the sub-path sections corresponding to each other. The return path unit is Integrated as the portion corresponding to the forward portion and backward portion are connected each deposition apparatus for units is formed (claim 1). With such a configuration, by connecting the film forming apparatus unit, the forward path part and the return path part can be constructed at the same time, so the design of the in-line type film forming apparatus can be standardized, and the design and manufacture of the in-line type film forming apparatus. Time and cost can be reduced.

  The forward path part and the return path part may be arranged in a vertical plane (Claim 2). With such a configuration, since it can be accommodated within the installation area of the forward path part or the return path part, it is possible to reduce the space required for the installation of the in-line type film forming apparatus.

  The return path section may be disposed below the forward path section (Claim 3).

  The plurality of processing chambers may constitute an inlet tank, a front vacuum tank, a sputtering tank, a polymerization tank, a rear vacuum tank, and an outlet tank.

  A substrate mounting chamber may be disposed at the top of the plurality of processing chambers, and a substrate recovery chamber may be disposed at the rearmost of the plurality of processing chambers.

  Further, the film forming apparatus unit according to the present invention includes an outgoing path portion, a return path portion, a starting end side connecting portion that connects a terminal end of the return path portion to a starting end of the forward path portion, and a terminal end of the forward path portion as a starting end of the return path portion. A carrier transport path that transports the carrier so as to circulate through each section, and a plurality of film forming process chambers that are arranged so that the carrier sequentially passes through the forward path section. A film forming apparatus unit for constructing an in-line type film forming apparatus for forming a film on the substrate by sequentially mounting the substrate on the carrier and sequentially passing through the processing chamber. A common processing chamber capable of constructing a processing chamber, a sub-outward part obtained by dividing the forward part corresponding to the plurality of processing chambers, and a sub obtained by dividing the return part corresponding to the sub-outward part The return path part is integrated (Claim 6). With such a configuration, by connecting the film forming apparatus unit, the forward path part and the return path part can be constructed at the same time, so the design of the in-line type film forming apparatus can be standardized, and the design and manufacture of the in-line type film forming apparatus. Time and cost can be reduced.

  The sub outward path part and the sub return path part may be arranged in a vertical plane. With such a configuration, since it can be accommodated within the installation area of the forward path part or the return path part, it is possible to reduce the space required for the installation of the in-line type film forming apparatus.

  The sub return path section may be disposed below the sub forward path section (claim 8).

  As described above, the present invention can standardize the design and manufacture of the forward path part and the return path part, and thus has the effect of reducing the time and cost required for the design and manufacture of the in-line type film forming apparatus.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(Embodiment)
FIG. 1 is a schematic diagram showing an overall configuration of an inline-type film forming apparatus according to an embodiment of the present invention, and FIG. 2 is a common structure of film forming apparatus units 2 to 9 according to the embodiment of the present invention. FIG. 3 is a perspective view schematically showing a configuration of a film forming apparatus unit 20 having a structure, and FIG. 3 shows a lift-up block (starting end side connecting portion) 1 and a head of the in-line type film forming apparatus according to the embodiment of the present invention. FIG. 4 is a perspective view schematically showing a configuration of the film forming apparatus unit 2 positioned at FIG. 4, and FIG. 4 is a cross-sectional view showing a cross section taken along line IV-IV in FIG.

  In FIG. 1, the in-line type film forming apparatus according to the present embodiment includes a lift-up block 1 that connects the end of the forward path 100, the return path 200, and the return path 200 to the start end of the forward path 100, and the end of the forward path 100. A carrier transport path is formed which has a lift-down block (terminal-side connection part) 10 connected to the starting end of the return path part 200 and circulates through each part. Moreover, it has the several process chamber 2a-9a for the film-forming arrange | positioned so that the carrier C may pass sequentially in the outward path part 100. FIG. The forward path part 100 and the return path part 200 are arranged in a vertical plane. Further, the return path unit 200 is disposed below the forward path unit 100.

  Further, the film forming apparatus units 2 to 9 formed by integrating the sub outward path portion 13a corresponding to each of the processing chambers 2a to 9a and the sub return path portion 13b include opening / closing means 11a to 11g between the processing chambers 2a to 9a. The lift-up block 1 and the lift-down block 10 are provided at both ends thereof.

  Here, a common structure of the film forming apparatus units 2 to 9 will be described. In FIG. 2, the film forming apparatus unit 20 includes a common processing chamber 20a, a sub-outward path portion 13a, and a sub-return path portion 13b. The sub return path portion 13b includes sub return path housings 2b to 9b. This is provided for dust prevention of the carrier C passing through the sub return path portion 13b. The sub return path 13b may have an opening structure instead of a housing structure. Further, in the present embodiment, the sub outward path portion 13a and the sub return path portion 13b are arranged in a vertical plane. Further, the sub return path portion 13b is disposed below the sub forward path portion 13a. However, the film forming apparatus unit 20 only needs to be disposed so that the sub-outward path portion 13a and the sub-return path portion 13b are adjacent to each other in the vertical and horizontal directions. This is because it is sufficient that portions corresponding to the forward path portion 100 and the backward path portion 200 are formed when the film forming apparatus units 20 are connected to each other.

  In the common processing chamber 20a and the return path housing 20b, a pair of openings 20d and 20d and openings 20e and 20e are formed so that the carrier C can pass in the front and rear directions of the carrier C, respectively.

  The common processing chamber 20a is configured to have a sealed structure when the openings 20d and 20d are sealed, and is configured such that a predetermined apparatus can be disposed. The predetermined apparatus is an apparatus necessary for the film forming process, for example, a vacuum apparatus, a sputtering apparatus, or a plasma polymerization apparatus. Further, a flange 20f is provided on the peripheral surface of the openings 20d and 20d. This is because an opening / closing means is attached to the opening so that the opening can be sealed.

  The sub-outward path portion 13a and the sub-return path portion 13b are configured with a carrier C transport roller 13 disposed therein. In FIG. 4, the roller 13 is provided with a guide flange 13c. This is to guide the mounting position of the carrier C. In FIG. 2, the guide flange 13c is omitted. The rollers 13 are arranged so as to support the carrier C at intervals equal to or less than a predetermined interval in the horizontal direction. Here, the predetermined interval is an interval at which the carrier C is conveyed so as to be transferred between the film forming apparatus units 2 to 9. Specifically, the predetermined interval is always in the entire length of the carrier C in the advancing / retreating direction. The interval at which the two or more rollers 13 support the carrier C. In particular, the roller 13 is disposed in consideration of the thickness of the opening / closing means 11a to 11g interposed between the film forming housings when connected (see FIG. 3). In the sub-outward path portion 13a and the sub-return path portion 13b, the transport directions 101 and 102 of the carrier C are parallel and opposite to each other.

  The roller 13 is an example of a conveying unit, and another conveying unit can be used instead of the roller 13. For example, a belt conveyor or a rack and pinion mechanism can be used.

  Here, each process chamber 2a-9a constructed | assembled from the common process chamber 20a is demonstrated. In FIG. 1, a substrate W before film formation is externally transferred to a processing chamber 2a (substrate mounting chamber) of the film formation device unit 2 located at the head of the connected film formation device units 2 to 9. A base material inlet 2c is formed on the side surface of the processing chamber 2a so that it can be mounted on C.

  A vacuum apparatus 3c is disposed in the processing chamber 3a (inlet tank) 3a of the film forming apparatus unit 3 connected to the film forming apparatus unit 2.

  A vacuum apparatus 4 c is disposed in the processing chamber 4 a (pre-vacuum chamber) of the film forming apparatus unit 4 connected to the film forming apparatus unit 3.

  A vacuum chamber 5 c and a sputtering device 5 d are disposed in a processing chamber 5 a (sputtering tank) of the film forming device unit 5 connected to the film forming device unit 4. The sputtering apparatus 5d includes means for performing sputtering such as a target and a power source for discharge.

  A vacuum chamber 6 c and a plasma polymerization apparatus 6 d are disposed in a processing chamber 6 a (polymerization tank) of the film formation apparatus unit 6 connected to the film formation apparatus unit 5. The plasma polymerization apparatus 6d includes means for performing plasma polymerization, such as a power source for plasma generation, an electrode, and a reaction gas supply means.

  A vacuum apparatus 7 c is disposed in a processing chamber 7 a (rear vacuum chamber) of the film forming apparatus unit 7 connected to the film forming apparatus unit 6.

  A vacuum apparatus 8 c is disposed in the processing chamber 8 a (exit tank) of the film forming apparatus unit 8 connected to the film forming apparatus unit 7. Here, the vacuum devices 3c to 8c are provided with means for decompressing the processing chamber such as an exhaust pump.

  The substrate W after film formation is connected to the processing chamber 9a (base material recovery chamber) of the film formation apparatus unit 9 connected to the film formation apparatus unit 8 and located at the end of the film formation apparatus units 2 to 9. The substrate recovery port 9c is formed on the side surface of the substrate recovery chamber 9a so that the substrate can be recovered from the carrier C to the outside.

  In this way, in the in-line type film forming apparatus according to the present invention, the film forming apparatus unit 20 can meet the required film forming conditions such as the type of film forming layer, the number of stacked layers, and the layer thickness. This can be dealt with by selecting the number of connections and selecting the devices arranged in the common processing chamber 20a. Thereby, the forward path part 100 according to film-forming conditions can be formed, and the return path part 200 corresponding to the forward path part 100 can also be formed simultaneously.

  Next, a connection structure of the film forming apparatus units 2 to 9 will be described. In FIG. 3, the film forming apparatus unit 2 and the film forming apparatus unit 3 are such that the opening 3d of the inlet tank 3a faces the opening 2d of the substrate mounting chamber 2a, and the opening of the return path housing 2b. The opening 3e of the return path housing 3b is opposed to 2e, and the opening / closing means 11a is interposed between the opposed opening 2d and the opening 3d. The other film forming apparatus units 3 to 9 are connected in the same manner.

  Here, the openable / closable means 11a to 11g are sealable openable / closable means. For example, a door valve, a gate valve, etc. can be used.

  Note that the processing chamber 20a may incorporate opening / closing means in the openings 20d and 20d. With this structure, the processing chamber 20a can be made a sealed structure alone. In this case, the opening / closing means 11a to 11g are not necessary for the connection of the film forming unit 20.

  The lift-up block 1 has an ascending lift mechanism, and the lift-down block 10 has a descending lift function. For example, in FIG. 3, the lift-up block 1 is configured to have a lifter 1a and an extrusion device 1b. The lifter 1a receives the carrier C that has been transported along the return path section 200, and is arranged to lift the carrier C to the position of the forward path section 100. The extrusion device 1b transfers the lifted carrier C to the forward path section. A roller 13 is disposed so as to be pushed out. The lifter 1a has a structure in which a guide roller (not shown) provided on the lifter 1a is driven up and down by a chain 1d while following the guide rail 1c. Similarly, the lift-down block 10 is configured to lift the carrier C (not shown).

  FIG. 5 is a perspective view schematically showing a method of mounting the substrate W on the carrier C of the inline-type film forming apparatus according to the embodiment of the present invention. On the carrier C, the jig J is installed by fitting the fitting convex portions Ca and the fitting concave portions Ja. And the engagement convex part Jb of the jig J and the engagement recessed part Wa of the base material W engage, and the base material W is attached to the jig J.

  Next, the operation of the in-line type film forming apparatus according to the embodiment of the present invention configured as described above will be described.

  The opening / closing means 11a to 11g are closed. That is, the processing chambers 3 to 8 are in a sealed state.

  A plurality of carriers C on which the jig J is placed stand by on the forward path unit 100, the return path unit 200, the lift-up block 1 or the lift-down block 10.

  The carrier C on which the jig J is placed is sequentially driven by the roller 13 and conveyed to the substrate mounting chamber 2a. Here, a pair of base material W is attached to the jig J from the base material inlet 2c (see FIG. 3) (see FIG. 5). Next, the opening / closing means 11a is opened, and the carrier C carrying the substrate W is conveyed to the inlet tank 3a, and the opening / closing means 11a is closed. Thereby, the inlet tank 3a is sealed. And it is vacuum-evacuated by the vacuum device 3c.

  After the vacuum roughing, the opening / closing means 11b connected to the inlet tank 3a is opened, the carrier C carrying the substrate W is conveyed to the next previous vacuum tank 4a, and the opening / closing means 11b is closed. Thereby, the front vacuum chamber 4a is sealed. Then, vacuuming (main drawing) is performed by the vacuum device 4c, whereby the substrate W is degassed or the like.

  After the evacuation, the opening / closing means 11c is opened, and the carrier C on which the substrate W is mounted is conveyed to the next sputtering tank 5a, and the opening / closing means 11c is closed. Thereby, the sputter tank 5a is sealed. Then, the inside of the sputtering chamber 5a is adjusted to a predetermined degree of vacuum by the vacuum device 5c, and then a sputtering film is formed on the film formation surface of the substrate W by the sputtering device 5d (see FIG. 4).

  After the sputtered film is formed and evacuated again by the vacuum device 5c, the opening / closing means 11d is opened, the carrier C carrying the substrate W is conveyed to the next polymerization tank 6a, and the opening / closing means 11d is closed. Thereby, the polymerization tank 6a is sealed. Then, the inside of the polymerization tank 6a is adjusted to a predetermined degree of vacuum by the vacuum device 6c, and then a polymer film is formed on the film formation surface of the substrate W by the plasma polymerization device 6d.

  After the formation of the polymer film, it is evacuated again by the vacuum device 6c, the opening / closing means 11e is opened, the carrier C carrying the substrate W is conveyed to the next rear vacuum tank 7a, and the opening / closing means 11e is closed. Thereby, the rear vacuum chamber 7a is sealed. Then, vacuuming after film formation is performed by the vacuum device 7c.

  After evacuation after film formation, the opening / closing means 11f is opened, the carrier C on which the substrate W is mounted is conveyed to the next outlet tank 8a, and the opening / closing means 11f is closed. Thereby, the exit tank 8a is sealed. Then, the atmosphere is introduced into the outlet tank 8a.

  After the introduction of the atmosphere, the opening / closing means 11g is opened, the carrier C carrying the substrate W is conveyed to the substrate recovery chamber 9a, and the opening / closing means 11g is closed. As a result, the vacuum evacuation is performed by the vacuum device 8c in the outlet tank 8a that is sealed in the absence of the carrier C. This is to prepare for the opening of the opening / closing means 11f for carrying the carrier C from the next rear vacuum chamber 7a.

  In the base material recovery chamber 9a, the base material W is recovered from the carrier C through the base material recovery port 9c.

  The carrier C on which the base material W is not mounted is transported to the lift-down block 10 and is moved down to the return path unit 200.

  The carrier C transferred to the return path unit 200 is transported through the return path unit 200 to the lift-up block 1 and is moved up to the forward path unit 100 and transferred.

  The carrier C transferred to the forward path portion 100 is transported to the substrate mounting portion 2a and circulated.

  The operation of the inline-type film forming apparatus according to the embodiment of the present invention is performed by the controller 300 on the roller 13, the opening / closing means 11a to 11g, the lift-up block 1, the lift-down block 10, and the processing chambers 3a to 8a. By controlling the operation of the devices to be connected, for example, the vacuum devices 3c to 8c, the sputtering device 5d, and the plasma polymerization device 6d, the carrier C can be intermittently conveyed at a predetermined tact (for example, at intervals of 40 seconds). Further, in the control of the tact, by designing the tact so that the opening / closing timings of the opening / closing means 11c to 11e are synchronized, the carriers C in the high vacuum environment of the front vacuum tank 4a, the sputter tank 5a, and the polymerization tank 6a are provided. Can be operated so as to be simultaneously transported to the next processing layer. Further, it is preferable that a detector is provided in the forward path unit 100 to detect the position of the carrier C and to use it as control information for the control device 300.

  The present invention is useful as an in-line type film forming apparatus capable of reducing the time and cost required for designing and manufacturing an in-line type film forming apparatus and a unit for the film forming apparatus used therefor.

It is a schematic diagram which shows the whole structure of the in-line type film-forming apparatus which concerns on embodiment of this invention. It is a perspective view which shows roughly the structure of the unit for film-forming apparatuses which has the common structure of the unit for film-forming apparatuses which concerns on embodiment of this invention. It is a perspective view which shows roughly the structure of the lift-up block of the in-line type film-forming apparatus which concerns on embodiment of this invention, and the unit for film-forming apparatuses located in the head. It is sectional drawing which shows the IV-IV sectional view of FIG. It is a perspective view which shows roughly the mounting structure of the base material to the carrier of the in-line type film-forming apparatus which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lift up block 1a Lifter 1b Extruder 1c Guide rail 1d Chain 2-9 Unit 2a for film-forming apparatus Processing chamber (base material mounting chamber)
2b-9b Return path housing 2c Base material inlet 2d Opening 3a Processing chamber (inlet tank)
3c-8c Vacuum apparatus 4a Processing chamber (pre-vacuum chamber)
5a Processing chamber (sputtering tank)
5d Sputtering device 6a Processing chamber (polymerization tank)
6d Plasma polymerization apparatus 7a Processing chamber (rear vacuum chamber)
8a Processing chamber (exit tank)
9a Processing chamber (base material recovery chamber)
9c Substrate recovery port 10 Lift-down blocks 11a to 11g Opening / closing means 12 Closing body 13 Roller 13a Sub-outward path part 13b Sub-return path part 13c Guide flange 20 Deposition unit 20a Common processing chamber 20b Return path housing 20d Opening part 20e Opening part 20f Flange 100 Outward part 200 Return part 300 Control device C Carrier Ca Fitting convex part J Jig Ja Fitting concave part Jb Engaging convex part W Substrate Wa Engaging concave part

Claims (8)

A forward end part, a return path part, a start end side connection part that connects the end of the return path part to the start end of the forward path part, and a termination side connection part that connects the end of the forward path part to the start end of the return path part, and circulates each part. A carrier transport path for transporting the carrier and a plurality of film formation chambers arranged so that the carrier sequentially passes in the forward path portion, and a substrate is mounted on the carrier In an in-line type film forming apparatus for forming a film on the substrate by sequentially passing through a processing chamber,
The forward path part is divided into sub-outward parts corresponding to the plurality of processing chambers, and the return path part is divided into sub-inward path parts corresponding to the sub-outward path parts, and the processing chambers corresponding to each other and the An in-line type film forming apparatus in which each sub outward path part and each sub return path part are integrated as a film forming apparatus unit, and each film forming apparatus unit is connected.   The in-line type film forming apparatus according to claim 1, wherein the forward path part and the return path part are arranged in a vertical plane.   The in-line type film forming apparatus according to claim 2, wherein the return path part is disposed below the forward path part.   The in-line type film forming apparatus according to claim 1, wherein the plurality of processing chambers constitute an inlet tank, a front vacuum tank, a sputtering tank, a polymerization tank, a rear vacuum tank, and an outlet tank.   The first processing chamber among the plurality of processing chambers is configured as a base material mounting chamber, and the last processing chamber among the plurality of processing chambers is configured as a base material recovery chamber. Inline type deposition system. A forward end part, a return path part, a start end side connection part that connects the end of the return path part to the start end of the forward path part, and a termination side connection part that connects the end of the forward path part to the start end of the return path part, and circulates each part. A carrier transport path for transporting the carrier and a plurality of film formation chambers arranged so that the carrier sequentially passes in the forward path portion, and a substrate is mounted on the carrier A film forming apparatus unit for constructing an in-line type film forming apparatus for forming a film on the substrate by sequentially passing through a processing chamber,
A common processing chamber capable of constructing the processing chambers, a sub-outward part obtained by dividing the forward part corresponding to the plurality of processing chambers, and a return part corresponding to the sub-outward part A unit for a film forming apparatus, which is formed by integrating a sub-return section.   The film forming apparatus unit according to claim 6, wherein the sub outward path portion and the sub return path portion are arranged in a vertical plane. The film forming apparatus unit according to claim 7, wherein the sub return path unit is disposed below the sub forward path unit.

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