JP2005197621A - Csp removal device and method therefor - Google Patents
Csp removal device and method therefor Download PDFInfo
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- JP2005197621A JP2005197621A JP2004004815A JP2004004815A JP2005197621A JP 2005197621 A JP2005197621 A JP 2005197621A JP 2004004815 A JP2004004815 A JP 2004004815A JP 2004004815 A JP2004004815 A JP 2004004815A JP 2005197621 A JP2005197621 A JP 2005197621A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
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Abstract
Description
本発明はプリント配線基板に実装されたＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ；以下ＣＳＰと称す）を取り外し装置に関する。特に、本発明は、ＣＳＰ上面から機械的に削るＣＳＰ取り外し装置及び方法に関する。 The present invention relates to an apparatus for removing a CSP (Chip Size Package; hereinafter referred to as CSP) mounted on a printed wiring board. In particular, the present invention relates to a CSP removal apparatus and method for mechanically scraping from the top surface of a CSP.
図１０は本発明の前提となるプリント配線基板上に実装されるＣＳＰの配置の概略外観を示す平面図である。
本図に示すように、プリント配線基板１１０には複数のＣＳＰ１００が樹脂封止され実装され、各ＣＳＰ１００の周囲には複数の部品１０１が配置される。
図１１は図１０の線Ａ−Ａについての概略断面図である。本図に示すように、各ＣＳＰ１０１には複数の電極パッド１０３（ＰＡＤ）が設けられ、プリント配線基板１１０にも対向する複数の電極パッド（ＰＡＤ）１０３が設けられている。
FIG. 10 is a plan view showing a schematic appearance of the arrangement of CSPs mounted on a printed wiring board as a premise of the present invention.
As shown in the figure, a plurality of CSPs 100 are resin-sealed and mounted on a printed wiring board 110, and a plurality of components 101 are arranged around each CSP 100.
FIG. 11 is a schematic sectional view taken along line AA in FIG. As shown in the figure, each CSP 101 is provided with a plurality of electrode pads 103 (PAD), and the printed wiring board 110 is also provided with a plurality of electrode pads (PAD) 103 facing each other.
プリント配線基板１１０の電極パッド１０３とＣＳＰ１００の電極パッド１０３同士がはんだボール１０４によりボンディングされている。
このようにボンディングされたプリント配線基板１１０とＣＳＰ１０１の間に樹脂を封入し樹脂封止を行う樹脂封止部１０２が形成され、樹脂封止部１０２は上記のボンディングが外気にさらされないようにしている。
The electrode pads 103 of the printed wiring board 110 and the electrode pads 103 of the CSP 100 are bonded by solder balls 104.
A resin sealing portion 102 that encapsulates resin between the printed wiring board 110 and the CSP 101 bonded in this way and performs resin sealing is formed, and the resin sealing portion 102 prevents the bonding from being exposed to the outside air. Yes.
図１２は図１１における樹脂封止部１０２を加熱しプリント配線基板１１０からＣＳＰ１００を取り外す状態を示す概略断面図である。
本図に示すように、プリント配線基板１０１との間に樹脂封止された１つのＣＳＰ１００を取り外す際には、はんだボール１０４、樹脂封止部１０２を加熱することによって取り外す方法が用いられている。
FIG. 12 is a schematic cross-sectional view showing a state in which the resin sealing portion 102 in FIG. 11 is heated and the CSP 100 is removed from the printed wiring board 110.
As shown in this figure, when removing one CSP 100 that is resin-sealed between the printed wiring board 101 and the solder ball 104 and the resin-sealed portion 102 are heated, a method of removing the CSP 100 is used. .
図１３は図１２における加熱によるＣＳＰ１００を取り外した後の残渣処理を説明する概略断面図である。本図に示すように、ＣＳＰ１００を取り外した後、プリント配線基板１１０にははんだボール１０４のはんだ残渣１０４Ａ、樹脂封止部１０２の樹脂残渣部１０２Ａが残る。
プリント配線基板１０１からＣＳＰ１０２を取り除いた後に新たなＣＳＰ１０２を再実装する際には、ＣＳＰ１０２を取り除いた後にクリームはんだ印刷を行うため、できるだけ樹脂残渣部１０２Ａ、はんだ残渣１０４Ａを取り除く作業が必要となる。この作業には、樹脂残渣部１０２Ａ、はんだ残渣１０４Ａに熱風を加え、はんだこて１０８により加熱を行いながら、出来るだけ樹脂残渣部１０２Ａ、はんだ残渣１０４Ａを除去する方法が用いられている。
FIG. 13 is a schematic cross-sectional view for explaining the residue treatment after the CSP 100 is removed by heating in FIG. As shown in the figure, after the CSP 100 is removed, the solder residue 104A of the solder ball 104 and the resin residue portion 102A of the resin sealing portion 102 remain on the printed wiring board 110.
When re-mounting a new CSP 102 after removing the CSP 102 from the printed wiring board 101, cream solder printing is performed after the CSP 102 is removed. Therefore, it is necessary to remove the resin residue 102A and the solder residue 104A as much as possible. For this operation, a method is used in which hot air is applied to the resin residue portion 102A and the solder residue 104A, and the resin residue portion 102A and the solder residue 104A are removed as much as possible while heating with the soldering iron 108.
図１４はプリント配線基板１０１における電極パッド１０３の剥がれを説明する上面図である。本図（ａ）、（ｂ）に示すように、プリント配線基板１０１の電極パッド１０３の周囲にはソルダーレジスト１０７が設けられており、本図（ｂ）に示すように他端子が接続される接続部１０６が設けられている場合、加熱による熱ストレスがあっても、電極パッド１０３の剥がれが起こりにくいが、本図（ａ）に示すように、他端子との接続がない単独の電極パッド１０３では剥がれが生じ易い。この場合、プリント配線基板１０１からの電極パッド１０３の剥がれにより、ＣＳＰ１０２の再実装ができなくなり、プリント配線基板１０１を破棄しなければならないという問題がある。 FIG. 14 is a top view for explaining peeling of the electrode pad 103 on the printed wiring board 101. As shown in FIGS. 4A and 4B, a solder resist 107 is provided around the electrode pad 103 of the printed circuit board 101, and other terminals are connected as shown in FIG. In the case where the connecting portion 106 is provided, the electrode pad 103 is unlikely to peel off even if there is a thermal stress due to heating, but as shown in FIG. In 103, peeling easily occurs. In this case, there is a problem that the CSP 102 cannot be re-mounted due to the peeling of the electrode pad 103 from the printed wiring board 101, and the printed wiring board 101 must be discarded.
従来のベアチップのリペア方法では、接着剤によって基板に固着されたベアチップを該基板から取り外すベアチップのリペア方法と装置に関し、基板を損傷させることなくベアチップの取外しが行えるようにすることを目的として、接着材の固着によって基板に実装されたベアチップを該基板から取外しを行うベアチップのリペア方法であって、所定の温度に加熱されるヒートカッタによって前記接着剤のフィレット部を切削除去するフィレット切削工程と、前記ベアチップを回動ハンドによって挟持すると共に、該ベアチップを所定の温度に加熱し、該ベアチップの中央部を中心として該回動ハンドを回動することで該ベアチップと該接着剤との境界面を剥離する剥離工程と、前記基板に残留した該接着剤を研削カッタによって研削することで該接着剤を除去する除去工程とを順次行うように構成している（例えば、特許文献１参照）。 The conventional bare chip repair method relates to a bare chip repair method and apparatus for removing a bare chip fixed to a substrate with an adhesive from the substrate, and is intended to enable the removal of the bare chip without damaging the substrate. A bare chip repair method for removing a bare chip mounted on a substrate by fixing the material from the substrate, a fillet cutting step of cutting and removing the fillet portion of the adhesive by a heat cutter heated to a predetermined temperature; The bare chip is sandwiched by a rotating hand, the bare chip is heated to a predetermined temperature, and the rotating hand is rotated around the central portion of the bare chip to thereby change the boundary surface between the bare chip and the adhesive. A peeling process for peeling, and the adhesive remaining on the substrate is ground by a grinding cutter. In it is configured to sequentially perform a removal step of removing the adhesive (e.g., see Patent Document 1).
従来の半導体チップの交換方法では、プリント配線板にフェイスダウン実装された半導体チップを、交換する方法に関わり、半導体チップを接続信頼性を損なうことなく、交換を行うため、半導体チップを、厚さを少し残した状態に切削加工によってプリント配線板から除去し、プリント配線板上の薄く残した前記半導体と封止樹脂とバンプとを加熱によって除去し、露出したフットプリントに、別の半導体チップを実装している（例えば、特許文献２参照）。 The conventional semiconductor chip replacement method relates to a method for replacing a semiconductor chip mounted face-down on a printed wiring board. In order to replace the semiconductor chip without impairing the connection reliability, the thickness of the semiconductor chip is reduced. Is removed from the printed wiring board by cutting, leaving the semiconductor, sealing resin and bumps on the printed wiring board thinly removed by heating, and another semiconductor chip is placed on the exposed footprint. It is mounted (see, for example, Patent Document 2).
従来の半導体チップの交換方法では、フェイス・ダウン・ボンデイングされた樹脂封止半導体チップを簡単に且つ信頼性を低下させずに交換するために、フェイス・ダウン・ボンデイングされ、樹脂によって封止された半導体チップ４を切削用エンド・ミルで切削し、基板から除去する。次に、基板上に残った樹脂およびバンプ電極を仕上げ用のエンド・ミルで元の高さのほぼ半分の高さまで研削し、平坦化する。バンプ電極を有する別のチップを基板上のバンプ電極と位置合わせして、フェイスダウン・ボンデイングする。最後に、チップと基板との間の隙間およびチップの回りに樹脂を流し、封止している（例えば、特許文献３参照）。 In the conventional semiconductor chip replacement method, the face-down bonded resin-encapsulated semiconductor chip is simply face-down bonded and sealed with resin in order to replace the chip without reducing reliability. The semiconductor chip 4 is cut with a cutting end mill and removed from the substrate. Next, the resin and the bump electrode remaining on the substrate are ground to a height approximately half of the original height by a finishing end mill, and are flattened. Another chip with bump electrodes is aligned with the bump electrodes on the substrate and face down bonded. Finally, a resin is poured around the gap between the chip and the substrate and the chip and sealed (for example, see Patent Document 3).
しかしながら、上記特許文献１では残渣を研削で取り除くが、プリント配線基板の製造工程で生じる個々の厚さのばらつき、製造工程に加え使用中の経時変化に伴うプリント配線基板の反りがある場合には、クリームはんだ印刷を行えるほどに研削を行うとプリント配線基板１０１の面を研削するおそれがあるという問題がある。
また、上記特許文献２では半導体チップを切削加工により取り除き、残渣を加熱して除去しており、本発明の前提の説明で前述したように、この加熱による熱ストレスによりプリント配線基板の電極パッドが剥がれるおそれがあるという問題がある。
However, in Patent Document 1, the residue is removed by grinding. However, in the case where there is a variation in individual thicknesses produced in the manufacturing process of the printed wiring board, and warping of the printed wiring board due to a change over time during use in addition to the manufacturing process. If grinding is performed to such an extent that cream solder printing can be performed, there is a problem that the surface of the printed wiring board 101 may be ground.
In Patent Document 2, the semiconductor chip is removed by cutting and the residue is removed by heating. As described above in the description of the premise of the present invention, the electrode pads of the printed wiring board are caused by the thermal stress caused by the heating. There is a problem that it may be peeled off.
また、上記特許文献３では、バンプ電極の高さの半分ほどまでしか研削しないため、樹脂残渣、はんだ残渣が除去されない。このため、プリント配線基板のＣＳＰの取り除き後に従来のようにクリームはんだ印刷が有効であるか否かを判断するのが困難であるという問題がある。
したがって、本発明は上記問題点に鑑みて、プリント配線基板からのＣＳＰ取り外し時にプリント配線基板の電極パッドが剥がれにくく、プリント配線基板からのＣＳＰ取り外した後にクリームはんだ印刷が可能になるように樹脂残渣、はんだ残渣を可能な限り除去するＣＳＰ取り外し装置及び方法を提供することを目的とする。
Moreover, in the said patent document 3, since it grinds only to about half of the height of a bump electrode, a resin residue and a solder residue are not removed. For this reason, there is a problem that it is difficult to determine whether or not cream solder printing is effective as in the prior art after removing the CSP of the printed wiring board.
Therefore, in view of the above-described problems, the present invention provides a resin residue so that the electrode pad of the printed wiring board is not easily peeled off when the CSP is removed from the printed wiring board, and cream solder printing is possible after the CSP is removed from the printed wiring board. An object of the present invention is to provide a CSP removing apparatus and method for removing solder residue as much as possible.
本発明は前記問題点を解決するために、電極パッド同士のはんだボールによるボンディング、樹脂封入でプリント配線基板に実装されるＣＳＰ１００を取り外す装置において、取り外すべきＣＳＰを囲むように被される筒部と、前記筒部により被された前記ＣＳＰの周囲で部品のない位置を選択して前記プリント配線基板を押さえ前記プリント配線基板の反りを矯正する複数のプリント配線基板押さえ部と、前記複数のプリント配線基板押さえ部で押さえられた前記プリント配線基板の周辺で部品の無い平らな部分のスキャンを行うレーザスキャナと、水平方向、高さ方向に移動し、前記筒部で囲まれたＣＳＰを切削し、前記ＣＳＰの切削後前記複数のプリント配線基板押さえ部による前記プリント配線基板の反りの矯正、前記レーザスキャナによる前記プリント配線基板の反りの補正に基づき前記プリント配線基板の面の切削を防止し樹脂残渣、はんだ残渣を切削するエンドミルとを備えることを特徴とするＣＰＳ取り外し装置を提供する。 In order to solve the above-mentioned problems, the present invention provides an apparatus for removing a CSP 100 mounted on a printed wiring board by bonding with electrode pads between solder balls and encapsulating a resin, A plurality of printed wiring board holding portions for selecting a position where there is no component around the CSP covered by the cylindrical portion and holding the printed wiring board to correct warping of the printed wiring board; and the plurality of printed wirings A laser scanner that scans a flat part without components around the printed circuit board pressed by the board pressing part, and moves in a horizontal direction and a height direction, and cuts the CSP surrounded by the cylindrical part; After the cutting of the CSP, the printed circuit board is warped by the plurality of printed circuit board pressing portions, and the laser scan is performed. Prevent cutting surface of the printed wiring board based on the correction of the warp of the printed wiring board by a resin residue, to provide a CPS extraction device, characterized in that it comprises a mill for cutting a solder residue.
さらに、前記プリント配線基板押さえ部は、エアを含む動力源とする圧力により、前記筒部で被せられた前記ＣＳＰの周囲の前記プリント配線基板の４隅を上から押さえる。
さらに、前記プリント配線基板押さえ部は、前記筒部の内側又は外側の前記プリント配線基板の４隅を上から押さえる。
さらに、前記筒部に切削くず取出し部を取り付け、前記切削くず取出し部はエンドミルが切削した切削くずを吸引し、前記筒部の外に取り出す。
Further, the printed wiring board pressing portion presses the four corners of the printed wiring board around the CSP covered by the cylinder portion from above with a pressure as a power source including air.
Further, the printed wiring board pressing portion presses four corners of the printed wiring board inside or outside the cylinder portion from above.
Further, a cutting scrap removing portion is attached to the cylindrical portion, and the cutting scrap extracting portion sucks the cutting scrap cut by the end mill and takes it out of the cylindrical portion.
さらに、予め、はんだに浸透しやすい樹脂で前記プリント配線基板の電極パッドを強固に固める。
さらに、前記エンドミルは、前記ＣＰＳの切削から前記樹脂残渣、はんだ残渣の切削になったときに、回転スピード、送りスピードを落とす。
さらに、前記エンドミルは前記プリント配線基板から３０μｍ程度まで前記樹脂残渣、はんだ残渣の切削を行う。
Further, the electrode pads of the printed wiring board are firmly hardened in advance with a resin that easily penetrates into the solder.
Further, the end mill reduces the rotation speed and the feeding speed when the resin residue and the solder residue are cut from the cutting of the CPS.
Further, the end mill cuts the resin residue and the solder residue from the printed wiring board to about 30 μm.
さらに、本発明は、電極パッド同士のはんだボールによるボンディング、樹脂封入でプリント配線基板に実装されるＣＳＰ１００を取り外す方法において、取り外すべきＣＳＰを囲むように筒を被せる工程と、前記筒部により被された前記ＣＳＰの周囲で部品のない位置を選択して前記プリント配線基板を押さえ前記プリント配線基板の反りを矯正する工程と、抑えられた前記プリント配線基板の周辺で部品の無い平らな部分をレーザスキャナでスキャンする工程と、水平方向、高さ方向に移動し、前記筒部で囲まれたＣＳＰをエンドミルで切削する工程と、前記ＣＳＰの切削後に前記プリント配線基板の反りの矯正、前記プリント配線基板の反りの補正に基づき前記プリント配線基板の面の切削を防止し樹脂残渣、はんだ残渣を切削する工程とを備えることを特徴とするＣＰＳ取り外し装置を提供する。 Furthermore, the present invention relates to a method of removing a CSP 100 mounted on a printed wiring board by bonding with solder balls between electrode pads and encapsulating a resin, covering the CSP to be removed, and covering the CSP. Further, a step of selecting a position where there is no component around the CSP and pressing the printed wiring board to correct the warp of the printed wiring board, and a laser on a flat portion without the component around the suppressed printed wiring board. A step of scanning with a scanner, a step of moving in a horizontal direction and a height direction, cutting a CSP surrounded by the cylindrical portion with an end mill, correction of warping of the printed wiring board after the cutting of the CSP, and the printed wiring A process for cutting resin residue and solder residue by preventing cutting of the surface of the printed circuit board based on the correction of the warp of the substrate. Providing CPS extraction device, characterized in that it comprises and.
以上説明したように、本発明によれば、プリント配線基板からのＣＳＰ取り外し時にプリント配線基板の電極パッドが剥がれにくく、プリント配線基板からのＣＳＰ取り外した後にクリームはんだ印刷が可能になるように樹脂残渣、はんだ残渣を可能な限り除去することが可能になった。 As described above, according to the present invention, when the CSP is removed from the printed wiring board, the electrode pad of the printed wiring board is hardly peeled off, and the resin residue can be printed after the CSP is removed from the printed wiring board. The solder residue can be removed as much as possible.
図１は本発明に係るＣＳＰ取り外し装置の概略構成を示す平面図であり、図２は図１の線Ｂ−Ｂについての概略断面図である。
本図１、２に示すように、エンドミル切削の前に、図１１のプリント配線基板１１０を前提として、筒部２００が設けられ、筒部２００は取り外すべきＣＳＰ１００を囲うように被せられ、エンドミルによる切削くずが飛び散らないにする。筒部２００の吸着穴には切削くず取出し部２０１が設けられ、切削くず取出し部２０１はエンドミルによる切削くずを外部に取出す。
FIG. 1 is a plan view showing a schematic configuration of a CSP removing device according to the present invention, and FIG. 2 is a schematic sectional view taken along line BB in FIG.
As shown in FIGS. 1 and 2, a tube part 200 is provided on the premise of the printed wiring board 110 in FIG. 11 before the end mill cutting, and the tube part 200 is covered so as to surround the CSP 100 to be removed. Prevent cutting waste from splashing. A cutting waste extraction unit 201 is provided in the suction hole of the cylindrical portion 200, and the cutting waste extraction unit 201 takes out the cutting waste generated by the end mill to the outside.
さらに、ＣＳＰ取り外し装置として、プリント配線基板押さえ部２０３、２０４、２０５、２０６が設けられ、プリント配線基板押さえ部２０３、２０４、２０５、２０６は、エンドミルの切削前に、プリント配線基板１１０上の部品の無い位置を選択し、取り外すＣＳＰ１００の周囲の４点を、動力源としてエアー等の圧力により、上から押さえつける。この圧力によってプリント配線基板１１０に反りがある場合に高さ方向の矯正を行う。 Further, as a CSP removing device, printed circuit board holding parts 203, 204, 205, 206 are provided, and the printed circuit board holding parts 203, 204, 205, 206 are components on the printed circuit board 110 before cutting the end mill. Select a position with no air and press the four points around the CSP 100 to be removed from above with the pressure of air or the like as a power source. When the printed wiring board 110 is warped by this pressure, correction in the height direction is performed.
この場合、プリント配線基板押さえ部２０３、２０４、２０５、２０６は、筒部２００の内側又は外側のいずれに配置してもよい。取り外すＣＳＰ１００の周囲の４点を押さえつけさえできればよいためである。
さらに、エンドミルの切削前に、本図１に示す方向Ｃに、３次元測定を行うレーザスキャナにより、プリント配線基板押さえ部２０３、２０４、２０５、２０６で固定されたプリント配線基板１１０の周辺で部品の無い平らな部分のスキャンを行い、レーザの光路差によりプリント配線基板１１０を測長しプリント配線基板１１０の反りを検出する。プリント配線基板１１０の反りの検出結果は、保存され、エンドミルの切削にフィードバックされる。
In this case, the printed wiring board pressing portions 203, 204, 205, and 206 may be disposed either inside or outside the cylinder portion 200. This is because it is only necessary to press the four points around the CSP 100 to be removed.
Further, before cutting the end mill, the parts around the printed wiring board 110 fixed by the printed wiring board holding portions 203, 204, 205, and 206 by a laser scanner that performs three-dimensional measurement in the direction C shown in FIG. A flat portion without a blank is scanned, and the printed wiring board 110 is measured by the optical path difference of the laser to detect the warp of the printed wiring board 110. The detection result of the warpage of the printed wiring board 110 is stored and fed back to the cutting of the end mill.
例えば、プリント配線基板１１０の製造過程で生じる個々の厚さ方向のばらつきがある場合、プリント配線基板押さえ部２０３、２０４、２０５、２０６によりプリント配線基板１１０の反りが完全に矯正されない場合、検出された反り等に追従して、エンドミルによる切削が補正される。
なお、３次元測定を行うレーザスキャナ自体は周知技術であるので、詳細な説明は省略する。
For example, when there are variations in individual thickness directions that occur in the manufacturing process of the printed wiring board 110, it is detected when the warp of the printed wiring board 110 is not completely corrected by the printed wiring board pressing portions 203, 204, 205, 206. Following the warp or the like, the cutting by the end mill is corrected.
Since the laser scanner itself that performs three-dimensional measurement is a well-known technique, detailed description thereof is omitted.
このようにして、プリント配線基板１１０の厚さ方向に対してエンドミルの正確な切削加工を可能にする。
プリント配線基板１１０の製造時に、樹脂封止部１０２として、電極パッド１０３に浸透しやすい樹脂が用いられる。プリント配線基板１１０に対して電極パッド１０３を強固に固め、エンドミルの切削に対して電極パッド１０３が剥がれないようにするためである。
In this manner, the end mill can be accurately cut in the thickness direction of the printed wiring board 110.
When the printed wiring board 110 is manufactured, a resin that easily penetrates the electrode pad 103 is used as the resin sealing portion 102. This is because the electrode pad 103 is firmly solidified with respect to the printed wiring board 110 so that the electrode pad 103 is not peeled off when the end mill is cut.
図３はエンドミルによるＣＳＰの切削動作を説明する概略断面図である。本図に示すように、エンドミル２０７は、水平方向（ｘ、ｙ方向）、高さ方向（ｚ方向）に移動可能である。
エンドミル２０７は筒部２００内のＣＳＰ１００を上面から切削し、さらに、ＣＳＰ１００の下面からプリント配線基板１１０の上面までの間にある厚さ２５０μｍのＣＳＰ１００の電極パッド１０３、はんだボール１０４、プリント配線基板１１０の電極パッド１０３に対して、プリント配線基板１１０の上面から一定高さ（３０μｍ）まで切削する。
FIG. 3 is a schematic sectional view for explaining the CSP cutting operation by the end mill. As shown in the figure, the end mill 207 is movable in the horizontal direction (x, y direction) and the height direction (z direction).
The end mill 207 cuts the CSP 100 in the cylindrical portion 200 from the upper surface, and further, the electrode pad 103 of the CSP 100 having a thickness of 250 μm between the lower surface of the CSP 100 and the upper surface of the printed wiring board 110, the solder balls 104, and the printed wiring board 110. The electrode pad 103 is cut from the upper surface of the printed wiring board 110 to a certain height (30 μm).
ＣＳＰ１００の切削時にエンドミル２０７の回転スピードが、例えば、２０００ｒｐｍ以上で、送りスピードが、例えば、６５ｍｍ／ｍｉｎ以上である。
ＣＳＰ１００の切削から樹脂残渣、はんだ残渣の切削になる時、エンドミル２０７の回転スピードは２０００ｒｐｍ以下の低速度にし、エンドミル２０７の送りスピードは６５ｍｍ／ｍｉｎ程度の低速度にし落とす。このように、回転スピード、送りスピードを落とし制限することにより、プリント配線基板１１０の電極パッド１０３にかかる応力を低減することが可能になる。なお、ＣＳＰ１００の切削から樹脂残渣、はんだ残渣への切削の変化はエンドミル２０７にかかる負荷の変化により検出可能である。
When the CSP 100 is cut, the rotation speed of the end mill 207 is, for example, 2000 rpm or more, and the feed speed is, for example, 65 mm / min or more.
When the cutting of the resin residue and the solder residue is changed from the cutting of the CSP 100, the rotational speed of the end mill 207 is set to a low speed of 2000 rpm or less, and the feeding speed of the end mill 207 is reduced to a low speed of about 65 mm / min. As described above, it is possible to reduce the stress applied to the electrode pads 103 of the printed wiring board 110 by reducing and limiting the rotation speed and the feeding speed. Note that a change in cutting from the cutting of the CSP 100 to a resin residue and a solder residue can be detected by a change in load applied to the end mill 207.
図４はエンドミルによるＣＳＰの切削くずの吸引動作を説明する概略断面図である。本図に示すように、ＣＳＰ１００の切削時に発生したＣＳＰ切削くず１００Ａは、筒部２００の切削くず取出し部２０１により筒部２００の外部に吸引される。ＣＳＰ１０３の切削後、樹脂封止部１０２の切削くずである樹脂残渣部１０２Ａ、ＣＳＰ１００の電極パッド１０３の切削くず１０３Ａ、はんだボール１０４の切削くずであるはんだ残渣１０４Ａは、筒部２００の切削くず取出し部２０１により筒部２００の外部に吸引される。
これらの切削くずの中には、はんだ、Ａｌの材料が含まれ、これらは導電性のため切削時、切削後に周辺部品へ切削くずとして飛び散ると、ショートなどの電気的な問題となる。
FIG. 4 is a schematic cross-sectional view for explaining the suction operation of CSP cutting waste by the end mill. As shown in the figure, the CSP cutting waste 100A generated during the cutting of the CSP 100 is sucked to the outside of the cylindrical portion 200 by the cutting waste extracting portion 201 of the cylindrical portion 200. After the cutting of the CSP 103, the resin residue 102A which is a cutting waste of the resin sealing portion 102, the cutting waste 103A of the electrode pad 103 of the CSP 100, and the solder residue 104A which is a cutting waste of the solder ball 104 are taken out of the cutting waste of the cylindrical portion 200. The part 201 is sucked outside the cylinder part 200.
These cutting scraps include solder and Al materials, and since these are conductive, if they are scattered as cutting scraps to peripheral parts after cutting during cutting, an electrical problem such as a short circuit occurs.
また、製品にはボタン等の接触端子があるため、これらの部分に切削くずが飛び散った場合にも、導通不良等の問題となる。
このため、切削時に筒部２００により周辺に飛び散らないようにし、切削くず取出し部２０１により、切削くずを吸着して筒部２００の外部に吸引することにより、上記問題を解決することができる。
In addition, since the product has contact terminals such as buttons, problems such as poor continuity occur even when cutting chips are scattered in these parts.
For this reason, the above-mentioned problem can be solved by preventing the cylindrical portion 200 from being scattered around the periphery during cutting, and by attracting the cutting waste by the cutting waste extracting portion 201 and sucking it to the outside of the cylindrical portion 200.
図５はエンドミルによるＣＳＰ取り出し後の状態を示す概略断面図である。本図に示すように、レーザスキャンで得た情報を基に高さ方向の補正を行うことにより、エンドミルはプリント配線基板１１０の反りに合わせて自動的に高さ方向を可変してＣＳＰ１００を切削し、さらに、プリント配線基板１１０の電極パッド１０３を切削しない程度、すなわち、プリント配線基板１１０の上面から一定の高さ（３０μｍ）まで、樹脂残渣部１０２Ａ、はんだ残渣１０４Ａを切削する。 FIG. 5 is a schematic sectional view showing a state after the CSP is taken out by the end mill. As shown in this figure, by correcting the height direction based on the information obtained by laser scanning, the end mill automatically changes the height direction according to the warp of the printed wiring board 110 and cuts the CSP 100. Furthermore, the resin residue 102A and the solder residue 104A are cut to such an extent that the electrode pads 103 of the printed wiring board 110 are not cut, that is, from the upper surface of the printed wiring board 110 to a certain height (30 μm).
このようにして、樹脂残渣部１０２Ａ、はんだ残渣１０４Ａを可能な限り除去でき、プリント配線基板からのＣＳＰ取り外した後にクリームはんだ印刷が可能になる。
図６はプリント配線基板１１０にある凹型の反りを矯正できる場合のエンドミル２０７の切削例を示す概略断面図である。
本図（ａ）に示すように、プリント配線基板１１０に反りがある場合、エンドミル２０７はそのまま水平方向に動くとＣＳＰ１００の両端のプリント配線基板１１０の面の浮いた部分を切削してしまう。
In this manner, the resin residue portion 102A and the solder residue 104A can be removed as much as possible, and cream solder printing can be performed after the CSP is removed from the printed wiring board.
FIG. 6 is a schematic cross-sectional view showing a cutting example of the end mill 207 when the concave warpage in the printed wiring board 110 can be corrected.
As shown in FIG. 5A, when the printed wiring board 110 is warped, if the end mill 207 moves in the horizontal direction as it is, the floating portions of the surface of the printed wiring board 110 at both ends of the CSP 100 are cut.
本図（ｂ）に示すように、プリント配線基板押さえ部２０３、２０４、２０５、２０６でＣＳＰ１００の周辺に位置する４隅のプリント配線基板１１０を抑えることにより、反りが矯正される。このようにして、本図（ａ）に示すようなプリント配線基板１１０の面の切削を防ぐことが可能になる。
図７はプリント配線基板１１０にある凹型の反りを矯正できない場合のエンドミル２０７の切削例を示す概略断面図である。
As shown in this figure (b), the warp is corrected by suppressing the printed wiring board 110 at the four corners located around the CSP 100 with the printed wiring board holding portions 203, 204, 205, 206. In this way, it becomes possible to prevent cutting of the surface of the printed wiring board 110 as shown in FIG.
FIG. 7 is a schematic cross-sectional view showing a cutting example of the end mill 207 when the concave warpage in the printed wiring board 110 cannot be corrected.
本図（ａ）に示すように、プリント配線基板押さえ部２０３、２０４、２０５、２０６でプリント配線基板１１０の反りが矯正できない場合、エンドミル２０７はそのまま水平方向に動くとＣＳＰ１００の両端のプリント配線基板１１０の面の浮いた部分を切削してしまう。
本図（ｂ）に示すように、レーザスキャンによるプリント配線基板１１０の反り測定に基づき、エンドミル２０７の水平方向の移動に対して高さ方向の移動の補正を行う。このようにして、本図（ａ）に示すようなプリント配線基板１１０の面の切削を防ぐことが可能になる。
As shown in this figure (a), when the printed wiring board holding section 203, 204, 205, 206 cannot correct the warp of the printed wiring board 110, the end mill 207 moves in the horizontal direction as it is, and the printed wiring boards at both ends of the CSP 100 are moved. The part which the surface of 110 floated will be cut.
As shown in FIG. 7B, the movement in the height direction is corrected with respect to the horizontal movement of the end mill 207 based on the measurement of the warp of the printed wiring board 110 by laser scanning. In this way, it becomes possible to prevent cutting of the surface of the printed wiring board 110 as shown in FIG.
図８はプリント配線基板１１０にある凸型の反りを矯正できる場合のエンドミル２０７の切削例を示す概略断面図である。
本図（ａ）に示すように、プリント配線基板１１０に反りがある場合、エンドミル２０７はそのまま水平方向に動くとＣＳＰ１００の中央でプリント配線基板１１０の面の浮いた部分を切削してしまう。
FIG. 8 is a schematic cross-sectional view showing a cutting example of the end mill 207 when the convex warpage on the printed wiring board 110 can be corrected.
As shown in FIG. 5A, when the printed wiring board 110 is warped, if the end mill 207 moves in the horizontal direction as it is, the floating portion of the surface of the printed wiring board 110 is cut at the center of the CSP 100.
本図（ｂ）に示すように、プリント配線基板押さえ部２０３、２０４、２０５、２０６でＣＳＰ１００の周辺に位置する４隅のプリント配線基板１１０を抑えることにより、反りが矯正される。このようにして、本図（ａ）に示すようなプリント配線基板１１０の面の切削を防ぐことが可能になる。
図９はプリント配線基板１１０にある凸型の反りを矯正できない場合のエンドミル２０７の切削例を示す概略断面図である。
As shown in this figure (b), the warp is corrected by suppressing the printed wiring board 110 at the four corners located around the CSP 100 with the printed wiring board holding portions 203, 204, 205, 206. In this way, it becomes possible to prevent cutting of the surface of the printed wiring board 110 as shown in FIG.
FIG. 9 is a schematic cross-sectional view showing a cutting example of the end mill 207 when the convex warpage on the printed wiring board 110 cannot be corrected.
本図（ａ）に示すように、プリント配線基板押さえ部２０３、２０４、２０５、２０６でプリント配線基板１１０の反りが矯正できない場合、エンドミル２０７はそのまま水平方向に動くとＣＳＰ１００の中央でプリント配線基板１１０の面の浮いた部分を切削してしまう。
本図（ｂ）に示すように、レーザスキャンによるプリント配線基板１１０の反り測定に基づき、エンドミル２０７の水平方向の移動に対して高さ方向の移動の補正を行う。このようにして、本図（ａ）に示すようなプリント配線基板１１０の面の切削を防ぐことが可能になる。
As shown in this figure (a), when the printed wiring board holding section 203, 204, 205, 206 cannot correct the warp of the printed wiring board 110, the end mill 207 moves in the horizontal direction as it is, and the printed wiring board is centered in the CSP 100. The part which the surface of 110 floated will be cut.
As shown in FIG. 7B, the movement in the height direction is corrected with respect to the horizontal movement of the end mill 207 based on the measurement of the warp of the printed wiring board 110 by laser scanning. In this way, it becomes possible to prevent cutting of the surface of the printed wiring board 110 as shown in FIG.
１００…ＣＳＰ
１００Ａ…ＣＳＰの切削くず
１０１…部品
１０２…樹脂封止部
１０２Ａ…樹脂残渣部
１０３…電極パッド
１０３Ａ…ＣＳＰの電極パッドの切削くず
１０４…はんだボール
１０４Ａ…はんだ残渣部
１１０…プリント配線基板
２００…筒部
２０１…切削くず取出し部
２０３、２０４、２０５、２０６…プリント配線基板押さえ部
２０７…エンドミル
100 ... CSP
DESCRIPTION OF SYMBOLS 100A ... CSP cutting waste 101 ... Component 102 ... Resin sealing part 102A ... Resin residue part 103 ... Electrode pad 103A ... CSP electrode pad cutting waste 104 ... Solder ball 104A ... Solder residue part 110 ... Printed wiring board 200 ... Tube Numeral 201 ... Cutting chip removal parts 203, 204, 205, 206 ... Printed circuit board pressing part 207 ... End mill
Claims (8)
取り外すべきＣＳＰを囲むように被される筒部と、
前記筒部により被された前記ＣＳＰの周囲で部品のない位置を選択して前記プリント配線基板を押さえ前記プリント配線基板の反りを矯正する複数のプリント配線基板押さえ部と、
前記複数のプリント配線基板押さえ部で押さえられた前記プリント配線基板の周辺で部品の無い平らな部分のスキャンを行うレーザスキャナと、
水平方向、高さ方向に移動し、前記筒部で囲まれたＣＳＰを切削し、前記ＣＳＰの切削後前記複数のプリント配線基板押さえ部による前記プリント配線基板の反りの矯正、前記レーザスキャナによる前記プリント配線基板の反りの補正に基づき前記プリント配線基板の面の切削を防止して樹脂残渣、はんだ残渣を切削するエンドミルとを備えることを特徴とするＣＰＳ取り外し装置。 In an apparatus for removing a CSP mounted on a printed circuit board by bonding with solder balls between electrode pads and encapsulating a resin,
A cylinder part which is covered so as to surround the CSP to be removed;
A plurality of printed wiring board pressing portions for selecting a position where there is no component around the CSP covered by the cylindrical portion and pressing the printed wiring board to correct warping of the printed wiring board;
A laser scanner that scans a flat part without components around the printed wiring board held by the plurality of printed wiring board holding parts;
It moves in the horizontal direction and the height direction, cuts the CSP surrounded by the cylindrical portion, corrects the warp of the printed wiring board by the plurality of printed wiring board pressing portions after the cutting of the CSP, and the laser scanner A CPS detaching apparatus comprising: an end mill for cutting a resin residue and a solder residue by preventing cutting of the surface of the printed wiring board based on correction of warpage of the printed wiring board.
取り外すべきＣＳＰを囲むように筒を被せる工程と、
前記筒部により被された前記ＣＳＰの周囲で部品のない位置を選択して前記プリント配線基板を押さえ前記プリント配線基板の反りを矯正する工程と、
抑えられた前記プリント配線基板の周辺で部品の無い平らな部分をレーザスキャナでスキャンする工程と、
水平方向、高さ方向に移動し、前記筒部で囲まれたＣＳＰをエンドミルで切削する工程と、
前記ＣＳＰの切削後に前記プリント配線基板の反りの矯正、前記プリント配線基板の反りの補正に基づき前記プリント配線基板の面の切削を防止して樹脂残渣、はんだ残渣を切削する工程とを備えることを特徴とするＣＰＳ取り外し装置。 In the method of removing the CSP mounted on the printed wiring board by bonding with the solder balls between the electrode pads and encapsulating the resin,
A step of covering the CSP around the CSP to be removed;
Selecting a position where there is no component around the CSP covered by the cylindrical portion and holding the printed wiring board to correct warping of the printed wiring board;
A step of scanning a flat part without components around the suppressed printed wiring board with a laser scanner;
A step of moving in a horizontal direction, a height direction, and cutting the CSP surrounded by the cylindrical portion with an end mill;
Correcting the warpage of the printed wiring board after cutting the CSP, and cutting the resin residue and the solder residue by preventing the cutting of the surface of the printed wiring board based on the correction of the warpage of the printed wiring board. A featured CPS removal device.
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| JP2004004815A JP4047818B2 (en) | 2004-01-09 | 2004-01-09 | CSP removal apparatus and method |
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| JP2004004815A JP4047818B2 (en) | 2004-01-09 | 2004-01-09 | CSP removal apparatus and method |
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| JP4047818B2 JP4047818B2 (en) | 2008-02-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013048171A (en) * | 2011-08-29 | 2013-03-07 | Fujitsu Semiconductor Ltd | Semiconductor device manufacturing method and semiconductor device |
| WO2016194931A1 (en) * | 2015-06-02 | 2016-12-08 | 並木精密宝石株式会社 | In-situ observation device of substrate warpage and crystal growth apparatus |
| WO2019168902A1 (en) * | 2018-02-28 | 2019-09-06 | Raytheon Company | A system and method for reworking a flip chip mounted on an electronic device using a mill to remove the chip and replacing the chip with a new chip in the milled area |
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2004
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013048171A (en) * | 2011-08-29 | 2013-03-07 | Fujitsu Semiconductor Ltd | Semiconductor device manufacturing method and semiconductor device |
| WO2016194931A1 (en) * | 2015-06-02 | 2016-12-08 | 並木精密宝石株式会社 | In-situ observation device of substrate warpage and crystal growth apparatus |
| WO2019168902A1 (en) * | 2018-02-28 | 2019-09-06 | Raytheon Company | A system and method for reworking a flip chip mounted on an electronic device using a mill to remove the chip and replacing the chip with a new chip in the milled area |
| US11330746B2 (en) | 2018-02-28 | 2022-05-10 | Raytheon Company | Device and method for reworking flip chip components |
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