JP2005178356A - 平面状樹脂材料接合装置 - Google Patents
平面状樹脂材料接合装置 Download PDFInfo
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- JP2005178356A JP2005178356A JP2004218694A JP2004218694A JP2005178356A JP 2005178356 A JP2005178356 A JP 2005178356A JP 2004218694 A JP2004218694 A JP 2004218694A JP 2004218694 A JP2004218694 A JP 2004218694A JP 2005178356 A JP2005178356 A JP 2005178356A
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- laser beam
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- planar resin
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- 239000011347 resin Substances 0.000 title claims abstract description 25
- 229920005989 resin Polymers 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000005304 joining Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000009423 ventilation Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 14
- 239000011521 glass Substances 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
- B29C65/1658—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning once, e.g. contour laser welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/024—Thermal pre-treatments
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
【解決手段】平面状の樹脂材料を接合する装置であって、レーザー光線の案内機構を収納する操作ヘッド及び加圧下で結合する材料層にレーザー光線を伝達する機構を備え、操作ヘッド1に集光機構7,8を備え、レーザー光線に対して透明な回転ローラ10にて、材料層を押圧する。また、複数の操作ヘッドにより装置を構成し、生産性を上げるようにした。
【選択図】図1A
Description
2 収納箱
3 空洞
4 孔
5 光ファイバー
6 ピストン/シリンダー機構
7 レンズ(光学素子)
8 光学素子
9 空洞
10 ガラス製ローラ
11 レーザー光線
12 通気路
13、14 樹脂条
15 スペーサ
16 案内棒
Claims (5)
- レーザー源に面する上部の材料層はレーザー光線に対して透明な材料で構成し、下部の材料層はレーザー光線を吸収する材料で構成することにより、互いに隣接する二つの材料層の接触面が溶融し、それに続く冷却時に加圧下において互い接合するように構成したレーザー照射による平面状樹脂材料を接合する装置であって、
該装置はレーザー光線の案内機構を収納する操作ヘッド及び加圧下で結合する材料層にレーザー光線を伝達する伝達機構を備え、
前記操作ヘッド(1)に集光機構(7,8)を備え、且つレーザー光線に対して透明な回転ローラ(10)を材料層(13,14)に面する出口端に備え、
焦点面の設定時に前記集光機構(7,8)、特に統合レンズ系が前記透明回転ローラ(10)と相互に作用し、且つ接合時に前記ヘッド(1)が材料層を押圧するように押圧機構(6)を備えたことを特徴とする平面状樹脂材料接合装置。 - 前記操作ヘッド(1)に前記ローラ(10)を取付けのための通気路(12)を設けたことを特徴とする請求項1記載の平面状樹脂材料接合装置。
- 前記操作ヘッド(1)が複数個互いに接して配置されていることを特徴とする請求項1記載の平面状樹脂材料接合装置。
- 前記操作ヘッド(1)間で且つ各操作ヘッド(1)の下に位置する上部の材料層(13)の間にスペーサ(15)を配置したことを特徴とする請求項3記載の平面状樹脂材料接合装置。
- 前記操作ヘッド(1)が狭い伸張した収納箱(2)を有し、該収納箱の側壁にピストン/シリンダー機構(6)を配置していることを特徴とする請求項1記載の平面状樹脂材料接合装置。
Applications Claiming Priority (1)
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EP03019039A EP1508428A1 (de) | 2003-08-22 | 2003-08-22 | Vorrichtung zum Verbinden von flächigen Kunststoffmaterialien |
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US (1) | US20050039855A1 (ja) |
EP (1) | EP1508428A1 (ja) |
JP (1) | JP2005178356A (ja) |
CN (1) | CN1590077A (ja) |
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US20050039855A1 (en) | 2005-02-24 |
CN1590077A (zh) | 2005-03-09 |
EP1508428A1 (de) | 2005-02-23 |
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