JP2005166743A - Visual inspection apparatus for stud bump - Google Patents

Visual inspection apparatus for stud bump Download PDF

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JP2005166743A
JP2005166743A JP2003400292A JP2003400292A JP2005166743A JP 2005166743 A JP2005166743 A JP 2005166743A JP 2003400292 A JP2003400292 A JP 2003400292A JP 2003400292 A JP2003400292 A JP 2003400292A JP 2005166743 A JP2005166743 A JP 2005166743A
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bump
flatness
stud bump
camera
inspection stage
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Tomohiro Abe
知広 阿部
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NEC TOHOKU SANGYO SYSTEM KK
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NEC TOHOKU SANGYO SYSTEM KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a visual inspection apparatus for a stud bump which can stably inspect the outer appearance of a bump with no dependency on the variation within a range of acceptable product at the time of bump formation by jointly using ring illumination as well as coaxial illumination. <P>SOLUTION: The bump formed on a semiconductor element 4 and electrode pad 5 is displayed on an image receptor 19 by means of an information processing apparatus 17 using a camera unit which is such that a camera 6 and a bright field objective lens 8 are attached to a microscope tube 7. By jointly using the ring illumination 9, erroneous detection due to the variation in imaged shapes inside the outline of a bump seating 1 due to the variation in shapes within a range of acceptable product of each bump, that is, erroneous detection due to the variation in qualities at the time of bump formation, can be suppressed. Since a depth of field is as shallow as several tens of μm due to the use of the objective lens 8, a degree of flatness of an X-Y inspection stage 13 is measured by a displacement sensor 16 and the result is stored in a storage device 18, and based on the stored degree of flatness, a Z axis 15 to which the camera 6 is attached is moved up and down by means of a motor 14 to keep the depth of field constant. Therefore, the variation in degrees of flatness of the X-Y inspection stage 13, in other words, defocusing of image due to the variation in mechanical precisions of equipment can be suppressed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ワイヤボンディング技術を用いたスタッドバンプ外観検査装置に関する。   The present invention relates to a stud bump appearance inspection apparatus using wire bonding technology.

従来、スタッドバンプの外観検査は、作業者による全数目視検査にて行っていた。しかしながら、このような検査方法は人手による作業であるため、作業者の経験や習熟度、或いは気分のむらや長時間労働による疲労等の体調変化により、誤選別等が発生し、歩留まりの低下及び次工程への不良品流出等が発生し得るという問題があった。   Conventionally, the appearance inspection of stud bumps has been performed by visual inspection of all the workers. However, since such an inspection method is manual work, misselection may occur due to changes in physical condition such as worker's experience and proficiency, or mood swings and fatigue due to long working hours. There was a problem that defective products could flow into the process.

このような検査における問題を解決するための従来技術として、例えば、スタッドバンプ不着、その他の外乱によるスタッドバンプの大きさの異常、同凸部形状の異常等のスタッドバンプ形成状態を的確に検証することが可能なバンプボンディング装置に関する発明がある。
この発明によれば、金線の先端に形成した金ボールをＩＣに圧接し、前記金線を引き上げてこれを断裂させ、ＩＣに電極となるスタッドバンプを形成するバンプボンディング装置に、前記スタッドバンプを撮像するカメラ装置と、その撮像軸と同軸の照射光軸を持つ照明装置とを更に加えたものであり、この照明装置より前記スタッドバンプに照射される照射光の反射光を検査することにより、前記スタッドバンプ形成状態を的確に検証することが可能である（特許文献１参照）。 As conventional techniques for solving such problems in inspection, for example, stud bump formation state such as stud bump non-adherence, other abnormalities in stud bump size due to other disturbances, abnormalities in the shape of the same convex portion, etc. are accurately verified. There is an invention related to a bump bonding apparatus capable of performing the above.
According to the present invention, a bump bonding apparatus for pressing a gold ball formed on the tip of a gold wire to an IC, pulling up the gold wire and tearing it, and forming a stud bump serving as an electrode on the IC, the stud bump And a lighting device having an irradiation optical axis that is coaxial with the imaging axis, and by examining the reflected light of the irradiation light irradiated to the stud bump from the lighting device. It is possible to accurately verify the stud bump formation state (see Patent Document 1).

また、例えば、スタッドバンプのバンプ台座部とバンプ頭頂部の位置ずれ、形状不良及び寸法不良などの欠陥を確実に検出して、スタッドバンプの良否を正確に判定することが可能なバンプ検査方法に関する発明がある（特許文献２参照）。
特開平８−５５８５４号公報 特開平１０−２４２２１９号公報 Further, for example, the present invention relates to a bump inspection method capable of accurately detecting defects such as misalignment, shape defect and dimension defect between a bump pedestal part and a bump top part of a stud bump, and accurately determining whether or not a stud bump is good. There is an invention (see Patent Document 2).
JP-A-8-55854 Japanese Patent Laid-Open No. 10-242219

しかしながら、上記特許文献１で示した発明においては、スタッドバンプの台座外径の形状に異常があったものしか検出できないという問題があった。
図７は、スタッドバンプの形状について説明した図である。
例えば、本図に示すように、スタッドバンプ台座１の外径の内側での凸部形状異常とは、バンプボンディング後に引きちぎられた金線３が真っ直ぐ上方向に立つのではなく、うなだれた形になっている状態のことである。
この金線３がセカンドバンプ２よりも外側にはみ出した場合に、凸部形状異常となる。つまり、本図の（ａ）は正常状態で、本図の（ｂ）が凸部形状異常になる。
このようなバンプ凸部形状異常は、作業者による全数目視検査により選別しており、作業者の習熟度或いは体調の変化などにより誤選別等が発生し、歩留まりの低下及び次工程への不良品流出等が発生していた。 However, in the invention shown in Patent Document 1, there is a problem that only those in which the shape of the pedestal outer diameter of the stud bump is abnormal can be detected.
FIG. 7 is a diagram illustrating the shape of the stud bump.
For example, as shown in the figure, the convex shape abnormality inside the outer diameter of the stud bump pedestal 1 means that the gold wire 3 torn after the bump bonding does not stand straight upward but in a nod shape. It is a state that has become.
When the gold wire 3 protrudes outside the second bump 2, a convex shape abnormality occurs. That is, (a) in this figure is in a normal state, and (b) in this figure is abnormal in convex shape.
Such bump convex shape abnormalities are selected by visual inspection by the operator, and misselection occurs due to changes in the worker's proficiency level or physical condition, resulting in a decrease in yield and failure to the next process. Outflow of non-defective products occurred.

また、一般的に存在するバンプ自動検査装置は、同軸照明のみの使用でバンプ全体が黒い画像になり、バンプ以外が白い画像になるように撮影している。そのため、バンプ台座１の外径の形状異常を検査することは可能であるが、バンプ台座１の外径の内側での凸部形状異常は選別困難である。   In addition, generally existing bump automatic inspection apparatuses are photographed so that the entire bump becomes a black image by using only the coaxial illumination, and a portion other than the bump becomes a white image. Therefore, although it is possible to inspect the shape abnormality of the outer diameter of the bump pedestal 1, it is difficult to select the shape abnormality of the convex portion inside the outer diameter of the bump pedestal 1.

また、一般的に存在するバンプ自動検査装置は、超高精度のＸ−Ｙ検査ステージを使用することにより被写界深度を一定に保ち、撮像画像の焦点がずれるのを抑える構成になっている。すなわち、Ｘ−Ｙ検査ステージは極限まで平らになっている。そのため非常に高価である。
また、Ｘ−Ｙ検査ステージに多少の傷がついたり、或いは検査環境の変化で、例えば温度の変化で、Ｘ−Ｙ検査ステージに歪みが発生することにより、撮像画像の焦点ズレが発生し、検査の品質が落ちてしまう。したがって、検査装置の取り扱いには十分な注意が必要である。 Moreover, generally existing bump automatic inspection apparatuses are configured to keep the depth of field constant by using an ultra-high precision XY inspection stage and to prevent the focus of the captured image from deviating. . That is, the XY inspection stage is flattened to the limit. Therefore, it is very expensive.
Further, the XY inspection stage is slightly damaged, or due to a change in the inspection environment, for example, due to a change in temperature, distortion occurs in the XY inspection stage, thereby causing a focus shift of the captured image, The quality of the inspection will be reduced. Therefore, sufficient care is required in handling the inspection apparatus.

また、上記特許文献２で示した発明においては、バンプ凸部形状異常までは検出できないという問題があった。   Moreover, in the invention shown in the above-mentioned Patent Document 2, there is a problem that even bump bump shape abnormalities cannot be detected.

本発明は上記事情を鑑みてなされたものであり、同軸照明の他にリング照明を併用することにより、バンプ形成時の良品範囲内でのばらつきに左右されずに安定して検査をすることが可能であり、更に、精度の劣る安価なＸ−Ｙ検査ステージでも、検査ステージ平面度のばらつきに左右されずに安定して検査することが可能なスタッドバンプ外観検査装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, and by using ring illumination together with coaxial illumination, it is possible to inspect stably without being influenced by variation within the non-defective range at the time of bump formation. An object of the present invention is to provide a stud bump appearance inspection apparatus that can be stably inspected even with an inexpensive XY inspection stage with inferior accuracy, regardless of variations in inspection stage flatness. To do.

前記課題を解決するために、請求項１記載の発明は、スタッドバンプを撮像する撮像手段と、スタッドバンプに対して、前記撮像手段と同軸の方向から光を照射する第１の照射手段と、スタッドバンプに対して、前記第１の照射手段とは異なる方向から光を照射する第２の照射手段と、前記撮像手段で撮像したスタッドバンプを映し出す出力手段と、前記同軸の方向に対して垂直である、スタッドバンプを設置するためのＸ−Ｙ検査ステージとを有することを特徴とする。   In order to solve the above-mentioned problem, the invention according to claim 1 includes: an imaging unit that images a stud bump; a first irradiation unit that irradiates light to the stud bump from a direction coaxial with the imaging unit; Second irradiation means for irradiating light from a direction different from the first irradiation means with respect to the stud bump, output means for projecting the stud bump imaged by the imaging means, and perpendicular to the coaxial direction And an XY inspection stage for installing stud bumps.

請求項２記載の発明は、前記Ｘ−Ｙ検査ステージ及びモータ制御が可能なＺ軸を含み構成される検査ステージと、前記Ｘ−Ｙ検査ステージの検査ステージ平面度を計測する平面度計測手段とを有することを特徴とする。   The invention according to claim 2 is an inspection stage configured to include the XY inspection stage and a Z axis capable of motor control, and flatness measuring means for measuring the inspection stage flatness of the XY inspection stage, It is characterized by having.

請求項３記載の発明は、前記平面度計測手段は、前記Ｘ−Ｙ検査ステージを、Ｘ方向及びＹ方向に等ピッチずつ移動させ、前記カメラ装置の撮像軸上のＸ−Ｙ検査ステージの平面度を計測する第２の平面度計測手段を有することを特徴とする。   According to a third aspect of the present invention, the flatness measuring means moves the XY inspection stage at equal pitches in the X direction and the Y direction, and the plane of the XY inspection stage on the imaging axis of the camera device. It has the 2nd flatness measurement means which measures a degree, It is characterized by the above-mentioned.

請求項４記載の発明は、前記第２の平面度計測手段にて計測した平面度と、前記平面度に対応する前記Ｘ−Ｙ検査ステージのＸ位置及びＹ位置とを記憶する平面度データ記憶手段を有することを特徴とする。   According to a fourth aspect of the present invention, the flatness data storage stores the flatness measured by the second flatness measuring means and the X and Y positions of the XY inspection stage corresponding to the flatness. It has the means.

請求項５記載の発明は、前記平面度データ記憶手段に記憶されたデータの組（平面度、Ｘ位置、Ｙ位置）に基づいて、カメラ位置を上下方向に調整するカメラ位置調整手段と、前記カメラ位置調整手段でカメラの位置を調整した後、被写体を撮像する撮像手段とを有することを特徴とする。   The invention according to claim 5 is a camera position adjusting means for adjusting the camera position in the vertical direction based on a set of data (flatness, X position, Y position) stored in the flatness data storage means, An image pickup means for picking up an image of a subject after adjusting the position of the camera by the camera position adjustment means.

請求項６記載の発明は、前記撮像手段は、顕微鏡鏡筒と、カメラと、明視野対物レンズにより構成されるカメラ装置であることを特徴とする。   The invention described in claim 6 is characterized in that the imaging means is a camera device including a microscope barrel, a camera, and a bright field objective lens.

請求項７記載の発明は、前記撮像手段は、カメラと、同軸落射レンズにより構成されるカメラ装置であることを特徴とする。   The invention described in claim 7 is characterized in that the image pickup means is a camera device including a camera and a coaxial incident lens.

本発明によれば、スタッドバンプを撮像する撮像手段と、スタッドバンプに対して、前記撮像手段と同軸の方向から光を照射する第１の照射手段と、スタッドバンプに対して、前記第１の照射手段とは異なる方向から光を照射する第２の照射手段と、前記撮像手段で撮像したスタッドバンプを映し出す出力手段と、前記同軸の方向に対して垂直である、スタッドバンプを設置するためのＸ−Ｙ検査ステージとを有することにより、自動検査でのバンプ台座の外径の内側でのバンプ凸部形状異常検出が可能となる。   According to the present invention, the imaging means for imaging the stud bump, the first irradiation means for irradiating the stud bump with light from the direction coaxial with the imaging means, and the first against the stud bump A second irradiating means for irradiating light from a direction different from the irradiating means; an output means for projecting the stud bump imaged by the imaging means; and a stud bump that is perpendicular to the coaxial direction. By having the XY inspection stage, it is possible to detect the bump convex shape abnormality inside the outer diameter of the bump pedestal in the automatic inspection.

本発明は、撮像において良品のばらつきによる検査品質の低下と、Ｘ−Ｙ検査ステージが、一般的に非常に高価であるという２つの問題を解決している。そのため、これらの２つの問題を同時に解決することが可能なスタッドバンプ検査装置が、最良の実施形態である。   The present invention solves the two problems that the quality of inspection is deteriorated due to non-defective product variations in imaging and that the XY inspection stage is generally very expensive. Therefore, a stud bump inspection apparatus that can solve these two problems simultaneously is the best embodiment.

次に、添付図面を参照しながら、本発明の実施形態を説明する。   Next, embodiments of the present invention will be described with reference to the accompanying drawings.

（実施例１の構成）
図１は、第１の実施例におけるスタッドバンプ外観検査装置の構成を示す図である。
スタッドバンプ外観検査装置は、顕微鏡鏡筒７、カメラ６、及び明視野対物レンズ８により構成されるカメラ装置と、同軸照明用光源１１からの光がハーフミラー１０にてカメラと同軸になる同軸照明及びリング照明９、リング照明用光源１２により構成される照明装置と、Ｘ−Ｙ検査ステージ１３及びモータ１４で制御可能なＺ軸１５による検査ステージと、検査ステージ平面度を計測する変位センサ１６から構成されている。
更に、前記カメラ装置により、半導体素子４及び電極パッド５に形成されたバンプを映し出すための、パーソナルコンピュータやワークステーション等の情報処理装置１７、及び受像器１９を有する。 (Configuration of Example 1)
FIG. 1 is a diagram showing a configuration of a stud bump appearance inspection apparatus in the first embodiment.
The stud bump appearance inspection apparatus is a coaxial illumination in which the light from the coaxial illumination light source 11 is coaxial with the camera by the camera apparatus including the microscope barrel 7, the camera 6, and the bright field objective lens 8. And an illumination device including a ring illumination 9 and a ring illumination light source 12, an inspection stage using a Z axis 15 that can be controlled by an XY inspection stage 13 and a motor 14, and a displacement sensor 16 that measures the inspection stage flatness It is configured.
Further, the camera device includes an information processing device 17 such as a personal computer or a workstation and a receiver 19 for projecting bumps formed on the semiconductor element 4 and the electrode pad 5.

（実施例１の動作）
変位センサ１６をＺ軸１５に固定し、Ｘ−Ｙ検査ステージ１３をＸ方向およびＹ方向に等ピッチずつ動かしたときのカメラ６の軸上のＸ−Ｙ検査ステージ１３の平面度を計測する。
平面度計測を行う際、Ｚ軸１５は上下動作させずに停止したままで行う。Ｘ−Ｙ検査ステージ１３のＸ位置およびＹ位置情報と計測した平面度を記憶装置１８に記憶させる。Ｚ軸１５をモータ１４にて上下移動させてカメラ装置の位置を調整し、バンプの金線３の根元、つまりセカンドバンプ２の上面に焦点を合わせた位置を基準位置として、Ｘ−Ｙ検査ステージ１３を移動させたときの位置と、基準位置でのＸ−Ｙ検査ステージ１３平面度との差分だけＺ軸１５を上下させることにより、Ｘ−Ｙ検査ステージ１３移動位置でのセカンドバンプ２の上面の焦点を合わせることができる。 (Operation of Example 1)
The displacement sensor 16 is fixed to the Z axis 15, and the flatness of the XY inspection stage 13 on the axis of the camera 6 is measured when the XY inspection stage 13 is moved at equal pitches in the X and Y directions.
When measuring the flatness, the Z-axis 15 is stopped without moving up and down. The X and Y position information of the XY inspection stage 13 and the measured flatness are stored in the storage device 18. The position of the camera device is adjusted by moving the Z-axis 15 up and down by the motor 14, and the base position of the gold wire 3 of the bump, that is, the position focused on the upper surface of the second bump 2 is used as the reference position for the XY inspection stage. The upper surface of the second bump 2 at the movement position of the XY inspection stage 13 by moving the Z axis 15 up and down by the difference between the position when the movement 13 is moved and the flatness of the XY inspection stage 13 at the reference position. Can be focused.

セカンドバンプ２の上面に焦点が合った状態でバンプを撮像する。図２に示すように、バンプ台座１の外側およびセカンドバンプ２の外側、及び金線３の傾斜が急な箇所では、カメラ６と同軸に射出した光が図２の（ｂ）で示す光路のように、正反射せずカメラ６に戻ってくる光の本数が少なくなる。
また、バンプ台座１の上面部、及びセカンドバンプ２の上面部、電極パッド５、半導体素子４の表面は、傾斜が緩いため、カメラ６と同軸に射出した光が図２の（ａ）で示す光路のように、正反射しやすいため、カメラ６に戻ってくる光の本数が多くなる。 The bump is imaged with the top surface of the second bump 2 in focus. As shown in FIG. 2, at the outside of the bump base 1 and the outside of the second bump 2, and at the place where the inclination of the gold wire 3 is steep, the light emitted coaxially with the camera 6 is in the optical path shown in FIG. As described above, the number of lights returning to the camera 6 without regular reflection is reduced.
Further, since the upper surface portion of the bump pedestal 1, the upper surface portion of the second bump 2, the electrode pad 5, and the surface of the semiconductor element 4 are loosely inclined, the light emitted coaxially with the camera 6 is shown in FIG. Like the optical path, since regular reflection is easy, the number of lights returning to the camera 6 increases.

つまり、図３−（ａ）で示すように、受像器１９には、バンプ台座１の輪郭部およびセカンドバンプ２の輪郭部が暗くなり、その他は明るい画像が表示される。この撮像した画像を２値化処理すると、バンプはきれいな二重丸画像となる。しかし、バンプ凸部形状が異常な場合には、図３−（ｂ）で示すように、２値化処理後の画像はきれいな二重丸にはならない。
この差により、バンプ凸部形状異常を検出する。
ただし、照明が同軸照明のみの場合、図４のに示すように、バンプ良品範囲内のばらつきでバンプ台座１の上面に細かな凹凸があった場合、細かな凹凸部分でカメラ６と同軸に射出した光とが乱反射するため、カメラ６に戻ってくる光の本数が少なくなる。このため、バンプ台座１の上面の細かな凹凸部分が暗くなってしまい、２値化処理後の画像はきれいな二重丸にならなくなり、あたかもバンプ凸部形状異常と誤判定してしまう。 That is, as shown in FIG. 3- (a), on the receiver 19, the contour portion of the bump pedestal 1 and the contour portion of the second bump 2 are darkened, and a bright image is displayed on the rest. When this captured image is binarized, the bump becomes a beautiful double circle image. However, when the bump convex shape is abnormal, the image after the binarization process does not become a clean double circle as shown in FIG.
Based on this difference, a bump convex shape abnormality is detected.
However, when the illumination is only coaxial illumination, as shown in FIG. 4, when there is a fine unevenness on the upper surface of the bump pedestal 1 due to variations within the bump good product range, the light is emitted coaxially with the camera 6 at the fine unevenness portion. Since the reflected light is irregularly reflected, the number of light returning to the camera 6 is reduced. For this reason, the fine uneven part on the upper surface of the bump base 1 becomes dark, and the image after the binarization process does not become a beautiful double circle, and it is erroneously determined that the bump convex part shape is abnormal.

そこで、リング照明９を同軸照明と併用すると、図５に示すように、リング照明９の光がバンプ台座１の上面の細かな凹凸部で反射することで、カメラと同軸の反射光としてカメラに戻ってくる光の本数が多くなり、細かな凹凸部が明るく撮像される。
よって、２値化処理後もきれいな二重丸の画像となり、誤判定しなくなる。 Therefore, when the ring illumination 9 is used together with the coaxial illumination, as shown in FIG. 5, the light of the ring illumination 9 is reflected by the fine irregularities on the upper surface of the bump pedestal 1, so that the reflected light coaxial with the camera is reflected on the camera. The number of returning light increases, and fine irregularities are brightly imaged.
Therefore, even after the binarization process, a beautiful double circle image is obtained, and no erroneous determination is made.

図６は、第２の実施例におけるスタッドバンプ外観検査装置の構成を示す図である。
図６に示すように、カメラ装置が顕微鏡および対物レンズの組み合わせでなく、同軸落射レンズ２０によるカメラ装置でも可能である。
また、検査対象として、半導体素子の傷、クラック等の半導体素子外観状態、および半導体素子が前工程で不良と判定された際に半導体素子に塗布される不良素子マークの有無も検出可能である。また、バンプ台座１の輪郭とセカンドバンプ２の輪郭の抽出が可能なためバンプ台座１の位置とセカンドバンプ２の位置の位置ズレ検出も可能である。 FIG. 6 is a diagram showing the configuration of the stud bump appearance inspection apparatus in the second embodiment.
As shown in FIG. 6, the camera apparatus is not limited to a combination of a microscope and an objective lens, but can be a camera apparatus using a coaxial incident lens 20.
In addition, as an inspection object, it is possible to detect the appearance of a semiconductor element such as a scratch or crack on the semiconductor element, and the presence or absence of a defective element mark applied to the semiconductor element when the semiconductor element is determined to be defective in the previous process. Further, since it is possible to extract the contour of the bump pedestal 1 and the contour of the second bump 2, it is possible to detect a positional deviation between the position of the bump pedestal 1 and the position of the second bump 2.

（効果）
以上の説明から明らかなように、本発明に係るスタッドバンプ外観検査装置は、以下に記する効果を有する。
第１の効果は、自動検査でのバンプ台座１の外径の内側でのバンプ凸部形状異常検出が可能となる。
つまり、人手による全数目視検査から開放される効果を有する。 (effect)
As is clear from the above description, the stud bump appearance inspection device according to the present invention has the following effects.
The first effect is that it is possible to detect the bump convex shape abnormality inside the outer diameter of the bump pedestal 1 in automatic inspection.
That is, it has the effect of being free from manual inspection of all the parts.

第２の効果は、被写界深度が数十μｍと非常に浅い対物レンズ８の使用でも、Ｘ−Ｙ検査ステージ１３の平面度計測により、Ｘ−Ｙ検査ステージ１３内の被写界深度を確保することが可能となる。
つまり、超高精度で高価なＸ−Ｙステージを使用しなくとも、安価なＸ−Ｙステージの使用が可能なことである。 The second effect is that the depth of field in the XY inspection stage 13 can be reduced by measuring the flatness of the XY inspection stage 13 even when the objective lens 8 having a very shallow depth of field of several tens of μm is used. It can be secured.
That is, an inexpensive XY stage can be used without using an ultra-high precision and expensive XY stage.

スタッドバンプ外観検査装置の構成を示す図である（実施例１）。It is a figure which shows the structure of a stud bump external appearance inspection apparatus (Example 1). スタッドバンプへの同軸光の入射及び反射について説明した図である。It is a figure explaining incidence and reflection of coaxial light to a stud bump. スタッドバンプの撮像及び２値化について説明した図である。It is a figure explaining imaging and binarization of a stud bump. ばらつきのあるスタッドバンプでの同軸光の乱反射について説明した図である。It is a figure explaining the irregular reflection of the coaxial light by the stud bump with dispersion | variation. ばらつきのあるスタッドバンプでのリング光の反射について説明した図である。It is a figure explaining reflection of the ring light by a stud bump with variation. スタッドバンプ外観検査装置の構成を示す図である（実施例２）。(Example 2) which is a figure which shows the structure of a stud bump external appearance inspection apparatus. スタッドバンプの形状について説明した図である。It is a figure explaining the shape of a stud bump.

符号の説明Explanation of symbols

１ スタッドバンプ台座
２ セカンドバンプ
３ 金線
４ 半導体素子
５ 電極パッド
６ カメラ
７ 顕微鏡鏡筒
８ 明視野対物レンズ
９ リング照明
１０ ハーフミラー
１１ 同軸照明用光源
１２ リング照明用光源
１３ Ｘ−Ｙ検査ステージ
１４ モータ
１５ Ｚ軸
１６ 変位センサ
１７ 情報処理装置
１８ 記憶装置
１９ 受像器
２０ 同軸落射レンズ DESCRIPTION OF SYMBOLS 1 Stud bump base 2 Second bump 3 Gold wire 4 Semiconductor element 5 Electrode pad 6 Camera 7 Microscope barrel 8 Bright field objective lens 9 Ring illumination 10 Half mirror 11 Light source for coaxial illumination 12 Light source for ring illumination 13 XY inspection stage 14 Motor 15 Z-axis 16 Displacement sensor 17 Information processing device 18 Storage device 19 Receiver 20 Coaxial incident lens

Claims (7)

スタッドバンプを撮像する撮像手段と、
スタッドバンプに対して、前記撮像手段と同軸の方向から光を照射する第１の照射手段と、
スタッドバンプに対して、前記第１の照射手段とは異なる方向から光を照射する第２の照射手段と、
前記撮像手段で撮像したスタッドバンプを映し出す出力手段と、
前記同軸の方向に対して垂直である、スタッドバンプを設置するためのＸ−Ｙ検査ステージとを有することを特徴とするスタッドバンプ外観検査装置。 An imaging means for imaging the stud bump;
A first irradiating means for irradiating light to the stud bump from a direction coaxial with the imaging means;
A second irradiation means for irradiating light from a direction different from the first irradiation means to the stud bump;
Output means for projecting the stud bump imaged by the imaging means;
A stud bump appearance inspection apparatus comprising: an XY inspection stage for installing stud bumps, which is perpendicular to the coaxial direction. 前記Ｘ−Ｙ検査ステージ及びモータ制御が可能なＺ軸を含み構成される検査ステージと、
前記Ｘ−Ｙ検査ステージの検査ステージ平面度を計測する平面度計測手段とを有することを特徴とする請求項１記載のスタッドバンプ外観検査装置。 An inspection stage configured to include the XY inspection stage and a Z axis capable of motor control;
The stud bump appearance inspection apparatus according to claim 1, further comprising a flatness measuring unit that measures the inspection stage flatness of the XY inspection stage. 前記平面度計測手段は、前記Ｘ−Ｙ検査ステージを、Ｘ方向及びＹ方向に等ピッチずつ移動させ、前記カメラ装置の撮像軸上のＸ−Ｙ検査ステージの平面度を計測する第２の平面度計測手段を有することを特徴とする請求項２記載のスタッドバンプ外観検査装置。   The flatness measuring unit moves the XY inspection stage at equal pitches in the X direction and the Y direction, and measures the flatness of the XY inspection stage on the imaging axis of the camera device. The stud bump appearance inspection apparatus according to claim 2, further comprising a degree measuring unit. 前記第２の平面度計測手段にて計測した平面度と、前記平面度に対応する前記Ｘ−Ｙ検査ステージのＸ位置及びＹ位置とを記憶する平面度データ記憶手段を有することを特徴とする請求項３に記載のスタッドバンプ外観検査装置。   Flatness data storage means for storing the flatness measured by the second flatness measuring means and the X position and Y position of the XY inspection stage corresponding to the flatness. The stud bump appearance inspection apparatus according to claim 3. 前記平面度データ記憶手段に記憶されたデータの組（平面度、Ｘ位置、Ｙ位置）に基づいて、カメラ位置を上下方向に調整するカメラ位置調整手段と、
前記カメラ位置調整手段でカメラの位置を調整した後、被写体を撮像する撮像手段とを有することを特徴とする請求項４記載のスタッドバンプ外観検査装置。 Camera position adjusting means for adjusting the camera position in the vertical direction based on a set of data (flatness, X position, Y position) stored in the flatness data storage means;
The stud bump appearance inspection apparatus according to claim 4, further comprising an imaging unit that images a subject after adjusting the position of the camera by the camera position adjusting unit. 前記撮像手段は、顕微鏡鏡筒と、カメラと、明視野対物レンズにより構成されるカメラ装置であることを特徴とする請求項１〜５のいずれか１項に記載のスタッドバンプ外観検査装置。   The stud bump appearance inspection apparatus according to claim 1, wherein the imaging unit is a camera device configured by a microscope barrel, a camera, and a bright field objective lens. 前記撮像手段は、カメラと、同軸落射レンズにより構成されるカメラ装置であることを特徴とする請求項１〜５のいずれか１項に記載のスタッドバンプ外観検査装置。   The stud bump appearance inspection device according to claim 1, wherein the imaging unit is a camera device including a camera and a coaxial incident lens.
JP2003400292A 2003-11-28 2003-11-28 Visual inspection apparatus for stud bump Pending JP2005166743A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100856115B1 (en) 2008-04-15 2008-09-02 정진우 A sensing device for welding burr in a frame and method for operation the same
WO2012165030A1 (en) * 2011-05-31 2012-12-06 株式会社村田製作所 Bump position derivation method, bump forming position correction method, bump bonder, and bump appearance inspection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100856115B1 (en) 2008-04-15 2008-09-02 정진우 A sensing device for welding burr in a frame and method for operation the same
WO2012165030A1 (en) * 2011-05-31 2012-12-06 株式会社村田製作所 Bump position derivation method, bump forming position correction method, bump bonder, and bump appearance inspection device
JPWO2012165030A1 (en) * 2011-05-31 2015-02-23 株式会社村田製作所 Bump position derivation method, bump formation position correction method, bump bonder, and bump appearance inspection apparatus

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