JP2005159144A - シールドケース - Google Patents
シールドケース Download PDFInfo
- Publication number
- JP2005159144A JP2005159144A JP2003397645A JP2003397645A JP2005159144A JP 2005159144 A JP2005159144 A JP 2005159144A JP 2003397645 A JP2003397645 A JP 2003397645A JP 2003397645 A JP2003397645 A JP 2003397645A JP 2005159144 A JP2005159144 A JP 2005159144A
- Authority
- JP
- Japan
- Prior art keywords
- shield
- circuit board
- side plate
- shield case
- top plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005484 gravity Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 9
- 238000005286 illumination Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 2
- 241000135309 Processus Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003397645A JP2005159144A (ja) | 2003-11-27 | 2003-11-27 | シールドケース |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003397645A JP2005159144A (ja) | 2003-11-27 | 2003-11-27 | シールドケース |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005159144A true JP2005159144A (ja) | 2005-06-16 |
JP2005159144A5 JP2005159144A5 (enrdf_load_stackoverflow) | 2006-12-28 |
Family
ID=34722745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003397645A Pending JP2005159144A (ja) | 2003-11-27 | 2003-11-27 | シールドケース |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2005159144A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266024A (ja) * | 2006-03-27 | 2007-10-11 | Kyocera Corp | 電子機器及びシールドケース |
JP2007335672A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | シールド構造体 |
JP2008028342A (ja) * | 2006-07-25 | 2008-02-07 | Toshiba Corp | シールド構造及びシールド構造を備えた携帯端末 |
JP2008112903A (ja) * | 2006-10-31 | 2008-05-15 | Matsushita Electric Ind Co Ltd | 実装基板の製造方法、部品実装機 |
JP2008300472A (ja) * | 2007-05-30 | 2008-12-11 | Kyocera Corp | 電子機器用シールドケース及び電子機器 |
CN114023706A (zh) * | 2022-01-06 | 2022-02-08 | 江苏明芯微电子股份有限公司 | 一种可减少占用空间的电子芯片磁场屏蔽结构 |
US11686842B2 (en) | 2019-06-17 | 2023-06-27 | Aisin Corporation | Sonar unit |
-
2003
- 2003-11-27 JP JP2003397645A patent/JP2005159144A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266024A (ja) * | 2006-03-27 | 2007-10-11 | Kyocera Corp | 電子機器及びシールドケース |
JP2007335672A (ja) * | 2006-06-15 | 2007-12-27 | Murata Mfg Co Ltd | シールド構造体 |
JP2008028342A (ja) * | 2006-07-25 | 2008-02-07 | Toshiba Corp | シールド構造及びシールド構造を備えた携帯端末 |
JP2008112903A (ja) * | 2006-10-31 | 2008-05-15 | Matsushita Electric Ind Co Ltd | 実装基板の製造方法、部品実装機 |
JP2008300472A (ja) * | 2007-05-30 | 2008-12-11 | Kyocera Corp | 電子機器用シールドケース及び電子機器 |
US11686842B2 (en) | 2019-06-17 | 2023-06-27 | Aisin Corporation | Sonar unit |
CN114023706A (zh) * | 2022-01-06 | 2022-02-08 | 江苏明芯微电子股份有限公司 | 一种可减少占用空间的电子芯片磁场屏蔽结构 |
CN114023706B (zh) * | 2022-01-06 | 2022-03-18 | 江苏明芯微电子股份有限公司 | 一种可减少占用空间的电子芯片磁场屏蔽结构 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Effective date: 20061110 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061110 |
|
A977 | Report on retrieval |
Effective date: 20090422 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
A131 | Notification of reasons for refusal |
Effective date: 20090428 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A521 | Written amendment |
Effective date: 20090617 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A131 | Notification of reasons for refusal |
Effective date: 20090804 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A521 | Written amendment |
Effective date: 20090924 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A02 | Decision of refusal |
Effective date: 20091201 Free format text: JAPANESE INTERMEDIATE CODE: A02 |