JP2005150513A - Inspection tool and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the inspection tool for semiconductor device which is suitable for reducing the cost for manufacturing the semiconductor device, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: The checking tool of the semiconductor device receives a laser element 14A (LDSM), obtained by connecting an LD 14 (laser diode) and a sub mount 13, and is provided with a resin 1 and a stem 7 as the body, and one or more pairs of contact pins 5, which are held deformable at the resin 1 (the body part) to detachably hold the laser element 14A between the stem 7 and a radiation part 4, to connect the electrodes of the sub mount 13 with the electrodes on an inspecting circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection jig for a semiconductor device and a method for manufacturing the semiconductor device, and more particularly to an inspection jig for a semiconductor device including a semiconductor laser element in which a laser diode and a submount are joined, and manufacture of the semiconductor device. Regarding the method.

  Examples of conventional semiconductor laser devices include those described in JP-A-6-5990 (conventional example 1) and JP-A-10-256649 (conventional example 2).

  In Conventional Example 1, a semiconductor laser chip, a photodiode for monitoring laser light emitted from this chip, and a photodiode for reading a signal of an optical disk are disposed on the same plate-like stem, A semiconductor laser package (semiconductor laser) characterized by a planar shape of the stem, in which a cap is attached to the stem so as to cover these optical elements, and a glass plate having a diffraction grating for light deflection formed on the upper surface of the cap. Apparatus).

  In Conventional Example 2, a laser chip for a light source and a light receiving element for signal reading are mounted on an island and electrically connected to a lead pin provided in a vertical direction on the island. There is disclosed a semiconductor laser unit (semiconductor laser device) in which a cover is installed so as to cover and a hologram pickup is configured together with a hologram element fixed to the upper surface portion of the package.

In the manufacturing process of the semiconductor laser device as described above, generally, a laser chip and other parts such as a main body (such as a stem and an island) and a light receiving element are coupled, and electrodes are wire-connected, and then light emission output and light emission are performed. Perform product inspections related to service life.
JP-A-6-5990 JP-A-10-256649

  However, the semiconductor laser device as described above has the following problems.

  In general, the quality of the product inspection described above largely depends on the performance of an LD (Laser Diode) included in the laser chip. Here, when it is determined that the product is defective due to the defect of the LD, it is difficult to separate and reuse the parts other than the LD already integrated with the LD. Therefore, even when those parts are not defective, they are discarded together with the defective LD. As a result, a reduction in manufacturing cost is suppressed.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device inspection jig suitable for reducing the manufacturing cost of a semiconductor device and a method of manufacturing the semiconductor device. There is.

  An inspection jig for a semiconductor device according to the present invention is an inspection jig for a semiconductor device that accepts a semiconductor laser element in which a laser diode and a submount are bonded, and is held in a deformable manner in the main body and the main body. The semiconductor laser device is detachably held between the main body and at least one pair of contact pins that connect the electrode of the submount and the electrode on the circuit board for inspection.

  Thereby, before the other components of the semiconductor device such as the main body are attached to the laser element, for example, an energization test of the laser element can be performed, so that the yield of the components can be improved. As a result, the manufacturing cost of the semiconductor device can be reduced.

  The contact pin of the inspection jig preferably includes an arcuate portion.

  Thereby, the contact pin is easily deformed, and the laser element is easily received.

  The main body of the inspection jig preferably has an outer shape that can be mounted on the same inspection device as the semiconductor device on which the semiconductor laser element is mounted and a terminal arrangement of contact pins.

  Thereby, since the inspection using the above-mentioned inspection jig can be performed using the conventional manufacturing equipment (inspection apparatus), the manufacturing cost can be reduced.

  It is preferable to have a tapered portion in the introduction portion that receives the semiconductor laser element of the main body portion of the inspection jig.

  This facilitates acceptance of the laser element into the main body.

  The main body portion of the inspection jig preferably has a heat radiating portion at a portion where the semiconductor laser element is pressed.

  The heat dissipating part can function as a heat dissipator when the LD emits light during inspection.

  The inspection jig preferably further includes a button mechanism for deforming the contact pin and releasing the pressing of the semiconductor laser element by the contact pin.

  This facilitates attachment of the laser element to the main body.

  The button mechanism preferably deforms all the contact pins simultaneously.

  Thereby, attachment to the main-body part of a laser element becomes still easier.

  The method of manufacturing a semiconductor device according to the present invention includes a step of bonding a laser diode and a submount, wire-connecting to form a semiconductor laser element, and attaching the semiconductor laser element to a removable inspection jig and energizing Each of the step of performing the test, the step of attaching the semiconductor laser element removed from the inspection jig after the current test to the main body, the step of attaching the light receiving element to the main body, and each of the semiconductor laser element, the main body and the light receiving element A step of wire-connecting the electrodes, and a step of attaching the protective member and the hologram element on the semiconductor laser element and the light receiving element.

  Thereby, before the other components of the semiconductor device such as the main body are attached to the laser element, for example, an energization test of the laser element can be performed, so that the yield of the components can be improved. As a result, the manufacturing cost of the semiconductor device can be reduced.

  According to the present invention, the yield of components attached to the semiconductor laser element can be improved, and as a result, the manufacturing cost of the semiconductor device can be reduced.

  Embodiments of a semiconductor device inspection jig and a method of manufacturing the semiconductor device according to the present invention will be described below with reference to FIGS.

  1A and 1B are views showing an inspection jig of a semiconductor device according to the present embodiment, wherein FIG. 1A shows a top view and FIG. 1B shows a side view. 2 is a cross-sectional view taken along the line II-II in FIG.

  As shown in FIGS. 1 and 2, an inspection jig for a semiconductor device according to the present embodiment includes a laser element 14A (LDSM) in which an LD 14 (laser diode) and a submount 13 (SM; SubMount) are joined. An inspection jig for a semiconductor device to be received, which is held by a resin part 1 and a stem 7 as a main body part, and is deformably held by the resin part 1 (main body part), and the laser element 14A is connected to the heat radiation part 4 of the stem 7 At least one pair of contact pins 5 (5A, 5B) is provided which is detachably held between the electrodes and connects the electrodes of the submount 13 and the electrodes on the circuit board for inspection.

  As the resin part 1 and the stem 7, for example, the same material as that of the stem in the conventional semiconductor laser element can be used. As the contact pin 5, for example, a conductive material such as a copper alloy subjected to gold plating can be used. The contact pins 5 are fixed in an elastically deformable state by being molded with the resin portion 1, and a pair of contact pins 5A and 5B are connected to the anode electrode and the cathode electrode of the laser element 14A, respectively. The The lead terminal 3 which is the other end of the pin 5 is connected to an electrode on the inspection circuit.

  The laser element 14 </ b> A is pressed by the heat radiating part 4 of the stem 7. The contact pin 5 presses and holds the surface of the laser element 14 </ b> A opposite to the side on which the LD 14 is installed against the heat radiating unit 4. The heat dissipating part 4 functions as a heat dissipator when the LD 14 emits light at the time of inspection. As the heat dissipating part 4, a metal substrate such as Cu or Fe subjected to a plating treatment such as Ni or Au is used. It is done.

  As for such a heat radiating body, as will be described later, a semiconductor device that actually mounts the laser element 14A is also provided with a similar one (heat sink 16A), and a similar heat radiating portion 4 is provided on the inspection jig. By providing, it is possible to perform a light emission inspection under the same conditions as light emission in an actual semiconductor laser device.

  Further, the inspection jig is provided with a button 2 (button mechanism) for deforming the contact pin 5 and releasing the pressing of the laser element 14A by the contact pin 5. The button 2 preferably deforms all contact pins (contact pins 5A and 5B in this embodiment) at the same time.

  2A shows a state where the button 2 is not pushed in, and FIG. 2B shows a state where the contact pin 5 is deformed by pushing the button 2 so that the laser element 14A can be inserted.

  When actually mounting the laser element 14A on the inspection jig, first, the button 2 is pushed in to the state shown in FIG. 2 (b), and the laser element 14A is inserted in the direction of the arrow in FIG. 2 (b). Thereafter, the push of the button 2 is released. Thereby, the contact pin 5 presses the laser element 14 </ b> A against the heat radiating part 4 in an attempt to return to the state of FIG. As a result, the laser element 14 </ b> A is held between the contact pin 5 and the heat radiating part 4. Further, the laser element 14A can be removed from the inspection jig by pressing the button 2 again and releasing the pressing by the contact pin 5.

  Here, as the button 2, for example, the same material (resin) as the resin portion 1 and the stem 7 can be used.

  As described above, the laser element 14A can be easily attached to and detached from the inspection jig by pushing the button 2 and releasing it.

  The contact pin 5 includes an arcuate portion 6 as shown in FIG. Thereby, the contact pin 5 is easily deformed, and the laser element 14A is easily received.

  A taper portion 8 is provided in the introduction portion for receiving the laser element 14A of the main body portion. This facilitates acceptance of the laser element into the main body.

  By attaching the inspection jig holding the laser element 14A by the above procedure to an inspection apparatus having an inspection circuit, the laser element 14A and the inspection circuit are connected by the contact pin 5, and the element 14A Product inspection can be performed. This inspection is a burn-in inspection, in which an energization test of the LD 14 is performed in a high temperature state of about 70 ° C. or more and 80 ° C. or less to inspect the light emission output, light emission life, and the like.

  Here, the main body of the inspection jig has an outer shape such as a stem 7 equivalent to the outer shape of the semiconductor device on which the laser element 14A is actually mounted, and the arrangement of the lead terminals 3 of the contact pins 5. It is preferable that the semiconductor device can be mounted on the same inspection apparatus.

  Thereby, since the inspection using the above-mentioned inspection jig can be performed using the conventional manufacturing equipment (inspection apparatus), the manufacturing cost can be reduced.

  3A and 3B are diagrams showing the laser element 14A, where FIG. 3A is a plan view and FIG. 3B is a side view.

  As shown in FIG. 3, the semiconductor device 14 </ b> A includes an anode electrode 9 and a cathode electrode 10, and has an abutting portion 11 with which the contact pin 5 abuts at least one place on each of the electrodes 9 and 10.

  Here, as shown in FIG. 3A, the contact portion 11 is positioned symmetrically in the central portion of the laser element 14A. Thereby, the contact pin 5 can press the laser element 14 </ b> A equally to the left and right.

  Next, a method for manufacturing a semiconductor device using the above inspection jig will be described.

  4 to 10 are diagrams showing each step of the semiconductor device manufacturing method according to the present embodiment.

  In the method of manufacturing a semiconductor device according to the present embodiment, as shown in FIGS. 4 to 10, the LD 14 (laser diode) and the submount 13 are joined and connected by the wire 15 to form the laser element 14A. (FIGS. 4 and 5), a step of attaching the laser element 14A to a detachable inspection jig and conducting an energization test, and the laser element 14A removed from the inspection jig after the energization test (device ( A step of attaching the light receiving element 17 to the stem 16 (main part) of the semiconductor device (FIG. 6), a step of attaching the light receiving element 17 to the heat sink 16A of the stem 16 (FIG. 7), and the electrodes of the laser element 14A, stem 16 and light receiving element 17 A wire connection process using a wire 18 (FIG. 8), a cap 19 as a protective member and a hologram element on the laser element 14A and the light receiving element 17 Step attaching the 20 (FIG. 9, FIG. 10) and a.

  Below, each said process is demonstrated in detail.

  FIG. 4 is a view showing a state where the LD 14 and the submount 13 are joined. For example, the submount 13 is improved in bonding accuracy when the laser element 14A is mounted on the stem 16, stress relaxation to the LD 14 when the temperature changes, heat generated in the LD 14 is quickly transmitted to the heat sink 16A, and the heat is dissipated. As the material, for example, SiC, AlN, Si, or the like is used. The submount 13 may have a light receiving function for monitoring the light emission amount of the LD 14. In this case, for example, Si is used as the material.

  As a bonding material between the LD 14 and the submount 13, for example, Ag paste, AuSn, In, or the like is used.

  FIG. 5 is a diagram showing a state in which the joined LD 14 and the submount 13 are connected by the conductive wire 15. Thereby, the laser element 14A to be mounted on the semiconductor device is formed.

  FIG. 6 is a view showing a state in which the laser element 14A is bonded to the stem 16 of the semiconductor device. As this bonding material, for example, Ag paste, In, or the like is used. The laser element 14A is bonded to the heat sink 16A of the stem 16. The heat sink 16A, together with the submount 13, functions as a heat dissipator for heat generated when the LD 14 emits light. For example, a structure similar to the heat dissipating part 4 in the inspection jig described above can be applied.

  FIG. 7 is a view showing a state in which the light receiving element 17 is mounted on the heat sink 16 </ b> A in the stem 16. The light receiving element 17 has a function of converting light emitted from the laser element 14A and reflected by the disk into a signal. For this bonding, for example, a photo-curing adhesive such as UV (Ultraviolet Radiation) resin is used.

  8A and 8B are diagrams showing a state in which the electrodes of the semiconductor laser element 14A, the stem 16 and the light receiving element 17 are connected by the wire 18, where FIG. 8A shows a top view and FIG. 8B shows a side view. By this wire connection, the members 14A, 16, and 17 are electrically connected. The electrode on the stem 16 is electrically connected to the lead terminal 16B.

  Then, as shown in FIG. 9 ((a) shows a top view and (b) shows a side view), a cap 19 is mounted on the stem 16, and FIG. 10 (a) shows a top view. (B) shows a side view) By mounting the hologram element 20 on the upper surface of the cap 19, the semiconductor laser package (semiconductor device) according to the present embodiment is completed.

  As described above, in the inspection jig for a semiconductor device and the method for manufacturing the semiconductor device according to the present embodiment, the laser element 14A is provided with the laser before attaching other components of the semiconductor device such as the main body 1 to the laser element 14A. Since the energization test of the element 14A can be performed, the yield of the above components can be improved. As a result, the manufacturing cost of the semiconductor device can be reduced.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure which shows the test jig | tool of the semiconductor device which concerns on one embodiment of this invention, (a) is a top view, (b) is a side view. It is the figure which showed the II-II cross section in FIG. 1, (a) is the figure which showed the state which does not push in a button, (b) deform | transforms a contact pin by pushing in a button, and inserts a laser element. It is the figure which showed the state. It is the figure which showed the semiconductor laser element, (a) is a top view, (b) is a side view. It is the perspective view which showed the 1st process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention. It is the perspective view which showed the 2nd process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention. It is the perspective view which showed the 3rd process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention. It is the perspective view which showed the 4th process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention. It is the figure which showed the 5th process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention, (a) is a top view, (b) is a side view. It is the figure which showed the 6th process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention, (a) is a top view, (b) is a side view. It is the figure which showed the 7th process of the manufacturing method of the semiconductor device which concerns on one embodiment of this invention, (a) is a top view, (b) is a side view.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Resin part, 2 button, 3 lead terminal, 4 thermal radiation part, 5, 5A, 5B contact pin, 6 arc-shaped part, 7 stem (inspection jig), 8 taper part, 9 anode electrode, 10 cathode electrode, 11 Contact part, 13 submount, 14 LD (laser diode), 14A laser element, 15, 18 wires, 16 stem (semiconductor device), 16A heat sink, 16B lead terminal, 17 light receiving element, 19 cap, 20 hologram element.

Claims (8)

An inspection jig for a semiconductor device that accepts a semiconductor laser element in which a laser diode and a submount are joined,
The main body,
At least one pair of contacts which are held in the main body so as to be deformable, hold the semiconductor laser element so as to be detachable from the main body, and connect the electrodes of the submount and the electrodes on the circuit board for inspection. A semiconductor device inspection jig provided with a pin.   The inspection jig according to claim 1, wherein the contact pin includes an arcuate portion.   3. The inspection jig according to claim 1, wherein the main body has an outer shape that can be attached to the same inspection device as the semiconductor device on which the semiconductor laser element is mounted and a terminal arrangement of contact pins.   The inspection jig according to claim 1, further comprising a tapered portion in an introduction portion that receives the semiconductor laser element of the main body portion.   The inspection tool according to claim 1, wherein the main body portion has a heat radiating portion at a portion where the semiconductor laser element is pressed.   The inspection jig according to any one of claims 1 to 5, further comprising a button mechanism that deforms the contact pin and releases the pressing of the semiconductor laser element by the contact pin.   The inspection tool according to claim 6, wherein the button mechanism simultaneously deforms all the contact pins. Bonding a laser diode and a submount and wire-connecting to form a semiconductor laser element;
Attaching the semiconductor laser element to a detachable inspection jig and conducting an energization test;
After the energization test, the step of attaching the semiconductor laser element removed from the inspection jig to the main body,
Attaching a light receiving element to the main body;
Wire connecting each electrode of the semiconductor laser element, the main body and the light receiving element;
And a step of attaching a protective member and a hologram element on the semiconductor laser element and the light receiving element.

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