JP2005150199A - Substrate conveyance method and its equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten product turn around time (TAT) of a substrate. <P>SOLUTION: In a clean room, each processor A-D of substrate W is arranged to the order of process, and substrate delivery equipment Ea and Eb for performing delivery of substrate W through a main substrate cassette 1 are arranged in substrate delivery lines L<SB>1</SB>which are juxtaposed to each processor A-D. The substrate W is continuously processed for each sheet in the order of processes. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides a semiconductor manufacturing apparatus for forming a semiconductor element on a substrate through a number of processes in sequence, and transports the substrate along a processing apparatus group consisting of a large number of processing apparatuses arranged in the order of processes in order to process each process. The present invention relates to a method and an apparatus.

  Many semiconductor elements formed on a substrate are formed on a substrate in multiple layers through a plurality of identical or approximate step groups when a plurality of consecutive different steps are taken as one step group.

  For example, in the substrate W shown in FIG. 14, the surface of the substrate W is cleaned by the cleaning apparatus A, and then the oxide film 51 is formed on the surface by the CVD apparatus B. Thereafter, a photosensitizer 52 is applied to the oxide film 51 by the photo apparatus C, and is exposed and developed according to an exposure pattern. Next, portions other than the exposure pattern are melted by the etching apparatus D, and the photosensitive agent 52 is further removed. As a result, the first layer semiconductor element is formed on the surface of the substrate W. In some types of substrates W, semiconductor elements are formed on the surface over multiple layers, and the forming process of each layer may be different from that shown in FIG.

  For this reason, as shown in FIG. 15, among a plurality of process groups for forming each layer of the semiconductor element, a plurality of processing devices A to D that process the same or similar processes are arranged in parallel or in parallel. A plurality of “bays” corresponding to the number of steps in each layer are arranged in one place by collectively arranging a group of processing devices called “bays” that perform the same or approximate processing in each layer by arranging the ones arranged in a state. Are installed in different places (see, for example, Patent Document 1).

  Substrate transport is performed in a state where a large number of substrates are stored in a cassette, and the same processing (batch processing) is performed on all the substrates stored in the cassette in all steps. The movement of the substrate group (meaning a large number of substrates stored in the cassette) between the bays is performed by a dedicated transport vehicle connecting the bays. In order to form a semiconductor element with multiple layers on the substrate, the substrate group reciprocates between the bays in the successive steps for each layer. In FIG. 15, reference numeral 54 denotes a stocker for temporarily placing a cassette.

In this way, the above-mentioned “bay method” is a batch process that puts a large number of substrates into batches for each process. The time (product in-process time T ₁₂ ) including the entire standby time in the production line required until () becomes considerably long (see FIG. 10). As a result, a large number of work-in-progress products (unfinished products in the middle of production) are in inventory and stay in the production line. The lead time (delivery date), which is the period, becomes longer. For this reason, it is unsuitable for the manufacture of products with short delivery times. Further, that the product-process time T ₁₂ is long, unable reported as a product, the number of unfinished products staying just like a stock in the production line in order (work-in-progress inventory) is large, managerial The turnover rate (recovery rate) of invested capital will worsen. Furthermore, these problems have become more prominent recently because the substrate becomes larger and the cost increases accordingly. “Product in-process time” and “in-process inventory” are respectively called “TAT (Turn Around Time)” and “WIP (Work-in-process)”, and the former abbreviation “TAT” Used in the following description.
JP 2002-26106 A

  An object of the present invention is to reduce the product in-process time (TAT) of a substrate in a semiconductor manufacturing apparatus.

  The invention of claim 1 for solving the above-mentioned problem is a semiconductor manufacturing apparatus for forming a semiconductor element on a substrate through a number of processes in sequence, and comprises a number of processing devices arranged in the order of processes for performing each process. A method of transporting the substrate along a processing device group, wherein the substrate is temporarily placed on a first temporary placement table arranged between the processing devices, and then arranged corresponding to each processing device. It is characterized in that it is picked up by the substrate delivery apparatus and transported one by one to a processing apparatus in a subsequent process.

  According to the present invention, substantially the same function and effect as those of Claim 3 described later is achieved.

  According to a second aspect of the present invention, there is provided a semiconductor manufacturing apparatus for forming a semiconductor element on a substrate through a plurality of processes in sequence, along the processing apparatus group including a plurality of processing apparatuses arranged in the order of processes for processing each process. In the method of transporting a substrate, the transport route of the substrate is moved back through a first temporary placement table disposed between the processing apparatuses in order to sequentially process each process on the substrate. In order to perform an auxiliary process on the regular transfer path sequentially transferred to the process side and the substrate in the process, the first temporary table or the second temporary table and the auxiliary process different from the first temporary table And a bypass conveyance path for reciprocally conveying the substrate to and from the apparatus.

  According to the present invention, the same function and effect as those of Claim 5 described later are exhibited.

  According to a third aspect of the present invention, in a semiconductor manufacturing apparatus for forming a semiconductor element on a substrate through a plurality of processes in sequence, the processing apparatus group includes a plurality of processing apparatuses arranged in the order of processes for performing each process. A device for transporting a substrate, in order to temporarily place a substrate being transported, a number of first temporary placement tables arranged between the processing devices in charge of preceding and following processes, and a front process side After the substrate taken out from the first temporary placement table is processed by the processing apparatus, a large number of substrates are delivered to transport the substrate to another first temporary placement table on the post-process side adjacent to the first temporary placement table. And a substrate in the middle of processing one by one through the first temporary placement table one by one to the subsequent process side.

  In order to transfer the substrate from the processing apparatus in the previous process to the processing apparatus in the subsequent process, the substrate is temporarily placed on a first temporary placement table disposed between the processing devices, and the first temporary placement table is interposed therebetween. Since the substrate is sequentially transferred to the subsequent process by the substrate transfer device, the tact time of each processing device (the time required for processing per substrate processed continuously in the processing device or the processing device corresponding to the processing device of the substrate processed continuously) Even if there is a slight deviation in the input time interval or the discharge time interval from the processing apparatus), each substrate transfer device is not synchronized with the movement of the substrate transfer device in successive steps (without being interlocked), The board can be transferred (transported) independently.

  Directly delivering a substrate in the middle of processing between each successive substrate delivery device (meaning that the process up to a specific process among all processes is left and the process of the remaining process is left) Although there is a problem that the substrate is damaged or the structure of the substrate delivery device is complicated, the substrate being processed is transported to a subsequent process via the first temporary placement table, so that the above problems are solved. .

  Since the multi-step processing is performed by flowing the substrates one by one along the processing apparatus group arranged in the process order, the product in-process time is shortened. For this reason, the product in-process time is remarkably shortened in the production line as compared with the “bay system” in which the same processing is performed after a large number of substrates are collectively processed in the same manner. Since the number of substrates that remain as work-in-progress (unfinished products) is also drastically reduced, the lead time (delivery date) is shortened, making it possible to cope with short delivery times or immediate delivery times. As a result, when the semiconductor manufacturing method characterized by the above-described substrate transfer method is viewed from the management side, the recovery (rotation) of invested capital becomes faster and the capital turnover rate (recovery rate) increases.

  According to a fourth aspect of the invention, on the premise of the invention of the third aspect, the first temporary placement table is capable of temporarily placing a plurality of substrates. In the present invention, in the case where the processing apparatus in the post process temporarily fails, these are not caused to stay in the processing apparatus or in the delivery apparatus in the processing apparatus or in the delivery apparatus after finishing the processing in the processing apparatus in the previous process. It can be temporarily put out from each device.

  According to a fifth aspect of the invention, on the premise of the invention of the fourth aspect, the first temporary placing table has a multi-stage storage structure, and is carried in and out by a first-in first-out method. In this invention, even if a plurality of substrates are temporarily placed on the first temporary placement table, only a specific substrate stays in the production line for a long time as compared with other substrates because it is loaded and unloaded by the first-in first-out method. It is possible to prevent the product quality from being degraded due to the above.

  According to a sixth aspect of the present invention, on the premise of any of the third to fifth aspects of the present invention, a second temporary provision dedicated to an auxiliary processing apparatus disposed separately from the first temporary placement table at a desired position on the regular transport path of the substrate. It is characterized by comprising a placing table and a substrate bypass transport vehicle for bypass transporting the substrate taken out from the second temporary placing table to the auxiliary processing apparatus.

  Substrates that are being processed are temporarily placed on the second temporary placement table by the substrate delivery device, then delivered to the substrate bypass transport vehicle and transported to the supplementary processing device via the bypass path. Are transported and temporarily placed by the substrate bypass transport vehicle to a second temporary placement table disposed at a position where the next process can be performed. After that, the substrate subjected to incidental processing is transported in the order of each unprocessed process through the regular transport path in the same manner as a normal substrate. Since the tact time of each process is set to be almost constant, the process before and after the above process with reference to the extracted process at the time of extraction and when the auxiliary process is completed and returned to the regular conveyance path. , By changing the tact time until a predetermined number of processes are completed (by shortening the tact time of the subsequent process when sampling, and by shortening the tact time of the previous process when returning to the original) After that, the original tact time is processed smoothly.

  Here, when another substrate is stocked on either the first or second temporary placement table arranged at the position where the sampling is performed due to a failure of a specific processing apparatus, etc. After the substrate is extracted, the substrate can be processed while maintaining the tact time of the subsequent step by transporting (flowing) another substrate that has completed the same processing as the substrate related to the extraction to the subsequent step.

  According to a seventh aspect of the present invention, on the premise of the sixth aspect of the invention, the substrate temporarily placed on the second temporary placement table is carried by transporting the second temporary placement table itself. Since there are many designs in which the carry-in port and the carry-out port of the substrate of the second temporary placement table are the same, and the second temporary placement table is disposed between the regular conveyance path and the bypass conveyance path, the second temporary placement table By transporting itself, there is no need to provide carry-in ports (carry-out ports) at two locations.

  The invention of claim 8 is based on the invention of any one of claims 3 to 7, and the processing device group consisting of a large number of processing devices is divided into two along the regular conveyance path, and is arranged oppositely. It is characterized by a bypass conveyance path between each processing device group. Since the bypass conveyance path corresponds to both the processing device groups on both sides, the length of the bypass conveyance path is halved compared to the case where the regular conveyance path is a straight line, and the substrate is incidentally processed by the substrate bypass conveyance vehicle. The time required for conveyance between the apparatus and the second temporary placing table is shortened.

  The present invention provides a semiconductor manufacturing apparatus for forming a semiconductor element on a substrate through a number of processes in sequence, and transports the substrate along a processing apparatus group consisting of a large number of processing apparatuses arranged in the order of processes in order to process each process. In this method, the substrate is temporarily placed on a first temporary placement table arranged between the processing apparatuses, and then taken out by a substrate delivery apparatus arranged corresponding to each processing apparatus. It is characterized in that it is conveyed one by one to this processing apparatus. For this reason, even if there is a slight shift in the tact time of each processing apparatus, each substrate transfer apparatus does not synchronize (does not synchronize) with the movement of the substrate transfer apparatus in successive steps, and independently of the substrate. Delivery (conveyance) can be performed. In addition, since the substrate is flowed one by one along a group of processing devices arranged in the order of processes and the process is performed in multiple steps, the product in-process time is shortened and the in-process product (unprocessed in the production line) Since the number of substrates staying in the finished product) is drastically reduced, the lead time (delivery date) is shortened, and it becomes possible to cope with short delivery time or immediate delivery time.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail with reference to the best examples of the present invention. 1 is an overall plan view of the semiconductor manufacturing apparatus U, FIG. 2 is a front view of the same, FIG. 3 is a plan view showing the flow of the substrate W in the regular transport path in the first group of processing apparatuses A to D, and FIG. 1 is a plan view of the cleaning apparatus A ₁₁ and the CVD apparatus B ₁ , FIG. 5 is a front sectional view showing a state in which the substrate W is unloaded from the main substrate cassette 1, and FIG. 6 is a bypass transfer in the first group of processing apparatuses A to D. It is a top view which shows the flow of the board | substrate W of a path | route.

First, the overall configuration of the semiconductor manufacturing apparatus U will be described. As shown in FIG. 1, this semiconductor manufacturing apparatus U is for forming a semiconductor element on a substrate W over five layers, from the first layer forming step P ₁ to the fifth layer forming step P _5. The processing apparatuses A to D constituting the five process groups are divided into two groups in consideration of the design efficiency of the clean room. That is, the processing devices A to D arranged in the order of the processes are divided into two groups, the first and second groups, corresponding to the size of the clean room. They are arranged in two rows in a divided state. In the first layer forming step P ₁ , a first cleaning device A ₁₁ , a CVD device B ₁ , a second cleaning device A ₁₂ , a photo device C ₁ , and an etching device D ₁ are arranged in the device arrangement direction Q in the order of processing steps. It is arrange | positioned on the substantially straight line along. Similarly, in the second layer forming step P ₂ , the first cleaning device A ₂₁ , the first CVD device B ₂₁ , the second CVD device B ₂₂ , the second cleaning device A ₂₂ , the photo device C ₂ , and the etching device are sequentially processed. D ₂ is provided. In the third layer forming step P ₃ , the first cleaning device A ₃₁ , the CVD device B ₃ , the second cleaning device A ₃₂ , the photo device C ₃ , and the etching device D ₃ are arranged in the order of processing steps. It is arranged across each group. In the fourth layer forming step P ₄ , a cleaning device A ₄ , a CVD device B ₄ , a photo device C ₄ , and an etching device D ₄ are arranged in the order of the processing steps. In the fifth layer forming step P ₅ , a cleaning device A ₅ , a CVD device B ₅ , a photo device C ₅ , and an etching device D ₅ are arranged in the order of the processing steps. Between the processing apparatus groups facing each other, along the apparatus arrangement direction Q, two substrate delivery rows L ₁ , two temporary substrate placement rows L ₂ , and one bypass transport row L _{3 are} arranged. And are provided. Each inspection device Ma, Mb, which is an example of an accessory processing device, is disposed at the end of each group.

That is, each substrate delivery row L ₁ is provided in the vicinity of the opposing processing devices A to D, and substrate delivery devices Ea and Eb corresponding to the processing devices A to D are provided. Each substrate temporary placement table row L ₂ is disposed inside the substrate delivery row L ₁ , and the main substrate cassette 1 (first temporary placement table) is disposed between the processing apparatuses A to D, respectively. It is installed in a fixed state. The main substrate cassette 1 is for temporarily storing and temporarily placing the substrate W in order to transfer the substrate W being processed to the processing apparatuses A to D in the next process. For this reason, a large number of substrates W can be stored in multiple stages, and any substrate W can be loaded and unloaded by a first-in first-out method (described later). Here, “in the middle of processing” means a state in which processing up to a specific step among all the steps is finished and the processing of the remaining steps is left.

Further, in each of the temporary substrate placement tables L ₂ , a part corresponding to a specific processing apparatus A to D is used for an inspection for storing the substrate W in order to perform a sampling inspection of the substrate W being processed. A substrate cassette 2 (second temporary placement table) is placed. The testing board cassette 2, the bypass transport vehicle 3 which is provided in the bypass transport column L _3, and is conveyed inspection device Ma of the first and second respective group, in Mb (described later). Furthermore, a transfer substrate cassette 4 for storing the substrate W transferred from the previous process and the substrate W transferred to the next process is placed on the start end and the end of the temporary substrate stand L _2. Is done. In FIG. 1, each main substrate cassette 1 is hatched, each inspection substrate cassette 2 is diagonally lined, and each transfer substrate cassette 4 is hatched in the opposite direction to the main substrate cassette 1. To distinguish them.

A bypass conveyance row L ₃ is provided between the _two substrate temporary placement table rows L ₂ arranged opposite to each other, and a bypass conveyance vehicle 3 capable of self-propelling along the device arrangement direction Q is disposed. Has been. Each substrate transfer device Ea is attached to the substrate transfer sequence L ₁ of the two mentioned above, Eb, each substrate temporary base sequence L ₂ each substrate cassette provided 1, 2, 4, and the bypass conveying column L ₃ A substrate transfer device S is formed by the provided bypass transfer vehicle 3. In FIG. 1, Ma is an inspection apparatus for the substrate W in the first group, and Mb is an inspection apparatus for the substrate W in the second group. Further, Mc is an inspection apparatus for the substrate W after completion of the final process (fifth layer forming process P ₅ ). Here, the plurality of inspection substrate cassettes 2 installed corresponding to the inspection apparatuses Ma and Mb transport the substrates W extracted in the middle of the processing apparatuses A to D, and send them to the inspection apparatuses Ma and Mb. Shown in the state of delivery.

Moreover, as FIG.1 and FIG.2 shows, each processing apparatus AD of 1st group and each processing apparatus AD of 2nd group are apparatus of each processing apparatus AD in planar view. They are connected by a rail transport vehicle 5 provided along a direction orthogonal to the arrangement direction Q. The rail transport vehicle 5 has a function of delivering the transport substrate cassette 4 between the start end portion or the end portion of each temporary substrate stand L ₂ . The substrate W that has been subjected to the predetermined processing by the first group of processing apparatuses A to D is delivered to the rail transport vehicle 5 while being stored in the transport substrate cassette 4. Then, it is conveyed to the processing apparatus A~D second group is placed on the leading end of the substrate temporary placement table columns L _2.

  The semiconductor manufacturing apparatus U of the present embodiment is in a form (single-wafer processing) in which the substrates W are flowed and processed one by one in the manufacturing line [In contrast, the conventional bay method has a large number of substrates. W is a form (batch process) that is processed together]. That is, as shown in FIG. 3, one substrate W is transferred between the processing apparatuses A to D by the substrate transfer apparatus S. The substrate W processed by the specific processing apparatuses A to D is unloaded from the processing apparatuses A to D by the substrate transfer apparatuses Ea and Eb arranged corresponding to the processing apparatuses A to D. It is stored in the substrate cassette 1 and temporarily placed temporarily. The substrate W temporarily placed in the main substrate cassette 1 is transported to the processing apparatuses A to D by the substrate transfer apparatuses Ea and Eb arranged corresponding to the processing apparatuses A to D in the next process. By repeating this action, the substrate W is subjected to a predetermined process. Each arrow in FIG. 3 indicates a flow of processing (flow line) performed on one substrate W. In the present specification, the transport path of the substrate W described above is referred to as a “regular transport path”.

The regular transport path in the substrate transport apparatus S described above will be described in detail. Here, the action of the substrate transfer apparatus S between the processing apparatuses A to D in the _first to fifth layer forming steps P _{1 to} P ₅ (the substrate W between the processing apparatuses A to D and the substrate delivery apparatus E). The delivery action of the substrate W is almost the same in any process, and therefore, in this specification, the delivery action of the substrate W in the first layer forming process P ₁ will be described. As shown in FIG. 4, the substrate transfer row L ₁ in the substrate transfer apparatus S of the present embodiment includes _one of two types of substrate transfer apparatuses Ea and Eb corresponding to the processing apparatuses A to D. Is arranged. Here, which substrate transfer device Ea, Eb is used for each of the processing devices A to D is determined by the processing devices A to D. That is, when the substrate W is processed in a normal atmosphere like the cleaning device A or the photo device C, the substrate delivery device Ea is used, and the substrate W is vacuumed like the CVD device B or the etching device D. When processing is performed in an atmosphere, it is necessary to close the loading / unloading opening during the processing, and thus the substrate delivery device Eb is used. For this reason, in the first layer forming step P ₁ , the substrate delivery device Ea is provided corresponding to each of the first and second cleaning devices A ₁₁ , A ₁₂ and the photo device C ₁ , and is also the substrate delivery device. Eb is provided corresponding to the CVD apparatus B ₁ and the etching apparatus D ₁ (see FIG. 3).

  As shown in FIGS. 2 and 4, each board transfer device Ea, Eb is guided by a pair of guide rails 11 laid on the floor surface, and can self-run along the device arrangement direction Q. Moreover, the bases 6a and 6b can be rotated in a horizontal plane and can be raised and lowered. The base 6a constituting the substrate delivery device Ea includes a vacuum suction device 7 for sucking and loading the substrate W, and a plurality of support rollers 8 for supporting the loaded and unloaded substrate W. Is provided. The vacuum suction device 7 is advanced and retracted, for example, by driving and rotating a ball screw. A pair of support arms 9 for lifting the substrate W and carrying it in and out is provided on the base 6b constituting the substrate delivery device Eb.

As shown in FIGS. 3 and 4, the substrate delivery device Ea provided corresponding to the first cleaning device A ₁₁ unloads (pulls out) the substrate W stored in the transfer substrate cassette 4. together is carried into the first cleaning device a _11, the substrate W cleaning process is completed, it is unloaded from the first cleaning device a _11, which is placed between the first cleaning device a ₁₁ and the CVD device B ₁ main It has a function of being stored in the substrate cassette 1. Then, the substrate delivery device Eb arranged corresponding to the CVD device B ₁ unloads the substrate W stored in the main substrate cassette 1 and loads it into the CVD device B _1, and at the same time, the CVD device B _1. the substrate W which processing has been completed in, and unloaded from the CVD device B _1, has a function that is stored in the installed main substrate cassettes 1 between the CVD device B ₁ and the second cleaning device a ₁₂ Yes. For this reason, the travel ranges Ra and Rb of the substrate transfer device Ea and the substrate transfer device Eb are overlapped in the main substrate cassette 1 portion.

  As described above, the substrate W stored in the main substrate cassette 1 is unloaded by any of the substrate transfer devices Ea and Eb and is loaded into the processing apparatuses A to D. Further, the substrate W that has been processed by each of the processing apparatuses A to D is unloaded by any of the substrate transfer apparatuses Ea and Eb and is stored in the main substrate cassette 1 on the subsequent process side. Hereinafter, the processing by the processing apparatuses A to D is performed on the substrate W by repeating the above steps. For this reason, the number of substrates W stored in the main substrate cassette 1 is one in a normal case (in other words, when the processing apparatuses A to D are operating smoothly).

  The main substrate cassette 1 will be described. As shown in FIG. 5, the main substrate cassette 1 of this embodiment has a rectangular parallelepiped frame shape, and in order to load and unload the substrates W, the surfaces facing the substrate transfer devices Ea and Eb are opened. A plurality of wires 12 are attached in a tensioned state along the width direction (device arrangement direction Q). These wires 12 are attached at a predetermined interval in the height direction, and substrate storage shelves 13 having the wires 12 as shelf plates are formed at each stage. As a result, a plurality of substrates W can be stored in multiple stages in one main substrate cassette 1. Moreover, the main substrate cassette 1 is a first-in first-out system. That is, by moving the elevating arm 14 into and out of the main substrate cassette 1 from the side, the substrate W stored in the substrate storage shelf 13 at an arbitrary stage can be slightly detached from each wire 12. . For this reason, it is possible to carry in / out an arbitrary substrate W. As a result, even if two or more substrates W are stored in the main substrate cassette 1 due to some cause (failure of each processing apparatus A to D, etc.), the substrate W that has been processed first can be taken out first. In addition, it is possible to prevent a decrease in product quality that occurs when the substrate W being processed is left for a long time. As described above, the main substrate cassette 1 according to the present invention not only has a function of temporarily placing the delivered substrate W temporarily, but also in the case where each of the processing apparatuses A to D breaks down. The substrate W staying in the process is separated from the flow of the production line and temporarily stored, that is, the production line has a buffering function.

  On the other hand, the inspection substrate cassette 2 and the transfer substrate cassette 4 are examples of a sequential method. As shown in FIG. 2, similarly to the main substrate cassette 1 described above, the substrate storage shelves 13 are provided in multiple stages by the wires 12 and can be moved up and down directly below the substrate cassettes 2 and 4. A roller-equipped frame 15 is provided. When loading / unloading the substrates W stored in these substrate cassettes 2 and 4, the frame 15 with rollers is lifted to detach the substrates W stored in the lowermost substrate storage shelf 13 from the wires 12. Let In this state, the substrate W is carried in and out by the vacuum suction device 7 or the support arm 9 constituting the substrate delivery devices Ea and Eb. In the case of the substrate cassettes 2 and 4 having this configuration, there is an advantage that the configuration of the means for raising the substrate W (frame 15 with a roller) is simplified. Further, the inspection substrate cassette 2 may be a substrate cassette of the same system (first-in first-out system) as the main substrate cassette 1, and in this case, random access in the inspection process of the substrate W becomes possible.

Next, the bypass conveyance path in the substrate conveyance apparatus S will be described. In the semiconductor manufacturing apparatus U, in order to perform a sampling inspection of the substrate W, the substrate W being processed may be extracted from a predetermined process. The bypass transport path is for transporting the extracted substrate W to each group of inspection apparatuses Ma and Mb. For example, in the first layer forming step P ₁ of the present embodiment, as shown in FIG. 6, the temporary substrate placement table L ₂ corresponding to the photo device C ₁ and the etching device D ₁ in the first layer forming step P ₁ . In this portion, an inspection substrate cassette 2 for storing the extracted substrates W is installed. This is because, in the first layer forming process P _{1 of} this embodiment, a sampling inspection is performed on the substrate W that has been processed by the photo device C ₁ or the substrate W that has been processed by the etching device D _1. Means.

As shown in FIG. 2, a pair of guide rails 16 are laid along the apparatus arrangement direction Q in the bypass conveyance row L ₃ constituting the bypass conveyance path, and the bypass conveyance vehicle 3 is disposed on the guide rails 16. It is arranged. The bypass conveyance vehicle 3 is guided by the guide rail 16 and can be self-propelled. In addition, the bypass delivery vehicle 3 is provided with a cassette delivery device 17 for receiving the inspection substrate cassette 2 containing the extracted substrate W and delivering it to the inspection devices Ma and Mb. It has the function of performing the reverse action.

Each arrow in FIG. 6 indicates a flow of processing (flow line) for the extracted substrate W. As shown in FIG. 6, the substrate W to be sampled and inspected is stored in the inspection substrate cassette 2 by one of the substrate delivery devices Ea and Eb. The inspection substrate cassette 2 in which the substrate W is stored is transferred to the bypass conveyance vehicle 3 as it is. Then, the bypass transport vehicle 3 transports the substrate temporary placement table row L _{2 to} the proximity position of the inspection apparatus Ma, and places it on the proximity position portion of the temporary substrate placement table row L ₂ . The substrate W is carried into the inspection device Ma by the substrate delivery device Ea disposed corresponding to the inspection device Ma. The substrate W that has been inspected by the inspection device Ma is stored in the inspection substrate cassette 2, and is again transported to the position of the next process after the extracted process by the bypass transport vehicle 3, and the temporary substrate placement table array It is placed on the L _2.

Next, the operation of the substrate transfer apparatus S will be described. Here, a description will be given only transfer action of the substrate W between the CVD device B ₁ from the first cleaning device A _11. As shown in FIG. 7, the substrate delivery device Ea disposed corresponding to the first cleaning device A ₁₁ is moved and disposed opposite to the transfer substrate cassette 4. The substrate W stored in the transfer substrate cassette 4 is unloaded from the transfer substrate cassette 4 by the vacuum suction device 7 provided in the substrate transfer device Ea and placed on the base 6a of the substrate transfer device Ea. . Then, the base 6a is rotated 180 ° in a horizontal plane. In this state, the substrate transfer device Ea is moved to the downstream side (post-process side), it is opposed to the loading opening 18 of the first cleaning device A _11. Substrate W by the action of the vacuum suction device 7 provided in the substrate delivery device Ea, through the loading opening 18 of the first cleaning device A ₁₁ is carried within the device A _11, the cleaning process is performed, the It is unloaded from the unloading opening 19.

As shown in FIG. 8, while the substrate W is being cleaned, the substrate transfer device Ea is moved to the subsequent process side along the device arrangement direction Q, and the unloading opening of the first cleaning device A ₁₁ is moved. 18 is disposed opposite to the main body. By almost the same operation as described above, the substrate W carried out from the first cleaning device A _{11 is} transferred again to the substrate transfer device Ea and is moved to a position facing the main substrate cassette 1 as it is. The substrate W is stored in the main substrate cassette 1. The substrate delivery device Ea is moved to a position facing the transfer substrate cassette 4 and the above-described operation is repeated.

Then, as shown in FIG. 9, when the substrate W is stored in the main substrate cassette 1 and the substrate delivery device Ea is retracted, the substrate delivery device Eb disposed corresponding to the CVD device B ₁ is moved. The main substrate cassette 1 is disposed opposite to the main substrate cassette 1. The substrate W is carried out of the main substrate cassette 1 by the action of the support arm 9 provided in the substrate delivery device Eb. The substrate W is moved to the post-process side while being placed on the substrate delivery device Eb, and is further rotated by a predetermined angle in the horizontal plane, and is disposed opposite to the loading opening 21 of the CVD device B ₁ . Then, it is carried into the CVD apparatus B _1.

The substrate W which processing has been completed in the CVD apparatus B ₁ represents, by the substrate transfer device Eb, is housed in the main substrate cassette 1 in the next step. Thereafter, almost the same operation is performed for the second cleaning device A ₁₂ , the photo device C ₁ , and the etching device D ₁ . Then, as shown in FIG. 3, of the processing apparatus A~D first group, the substrate W taken out from the CVD apparatus B ₃ disposed most downstream portion, for conveying the substrate transfer apparatus Eb is stored in the substrate cassette 4, by a bypass transport vehicle, once, after being placed in position near the rail guided vehicle 5 in the substrate temporary base sequence L _2, by the rail transport vehicle 5, the second group of processing devices a To D. Further, almost the same operation is performed in the second group of processing apparatuses A to D.

Next, the processing time of the substrate W in the regular transport path described above will be described in comparison with the conventional bay method. FIG. 10 is a schematic time chart showing the flow of the substrate W when the substrate W being processed is normally processed by single wafer processing and batch processing. 10 to 12 are schematic time charts for understanding the normal flow of the substrate W, and therefore do not correspond to the processing steps of the above-described embodiment, and the number of steps is reduced. It is. Hereinafter, when one substrate W is shown, the suffixes “ ₁ ” to “n” are attached to the reference numerals. The processing time (tact time) of each processing apparatus is set to be substantially the same.

In the single wafer processing according to the present invention, each of the substrates (W _{1 to} Wn) is put into the processing apparatus of step (a) at the set tact time (T ₁ ) and processed, and then the main substrate cassette 1 (first 1 (temporary placement table) is introduced into the processing apparatus in step (b) and processed. Further, the substrate W taken out from the processing apparatus in the step (b) is put into the processing apparatus in the step (c) via the main substrate cassette 1 and processed. In this way, in the case of normal processing in which a substrate W in the middle of processing is not extracted for inspection or a specific processing apparatus does not have a failure, each substrate (W _{1 to} Wn) is assigned to each main substrate. Once temporarily placed in the substrate cassette 1, it does not remain stored in the main substrate cassette 1, but sequentially flows to downstream processes. In each process, substantially the same set tact time (T ₁ ) Is processed.

The above will be specifically described. In the case of the present invention, as shown in FIG. 10, when the first substrate W ₁ is put into the process (A), a predetermined process is performed on the substrate W ₁ by the processing apparatus in the process (A). Is done. When this processing is completed, the substrate W ₁ is put into the processing apparatus in step (b) via the main substrate cassette 1 (first temporary placement table). Along with this, the second substrate W ₂ is put into the processing apparatus of step (ii). As described above, in the present invention, the substrates W _{1 to} W ₃ are respectively put into the respective steps (a), (b), and (c) and processed (single wafer processing). On the other hand, in the conventional bay method, since a large number of substrates W are processed together for each process, the processing time for each process becomes long. However, in the case of the present invention, the TAT (T ₂ ) of each of the substrates W _{1 to} W ₃ is extremely shorter than the TAT (T ₁₂ ) in the case of the bay method. Also, the tact time T ₁ of each of the substrates W _{1 to} W ₃ of the present invention is shorter than the tact time T ₁₁ of the bay method.

Further, the graph shown in FIG. 11 shows the relationship of the number of processed substrates W with respect to the time between the single wafer processing and the batch processing according to the present invention. In this figure, the solid line 22 shows the case of the single wafer processing of the present invention, and the two-dot chain line 23 shows the case of the conventional bay system. However, this figure is based on the assumption that the total processing time per substrate W required from when the substrate W is introduced to the production line until it is taken out as a finished product is the same for the single wafer processing and the batch processing. is there. In the conventional bay system, for example, 20 substrates W are processed together, so that the finished substrate W cannot be obtained unless the TAT (T ₁₂ ) has elapsed. However, in the present invention, since the processing is performed one by one, one substrate W is produced when one TAT (T ₂ ) has elapsed.

  As a result of the above, the number of substrates W (in-process inventory) that remain as work-in-process (unfinished products) in the production line is reduced, and working capital can be reduced. There are accounting advantages such as a good capital turnover rate. In addition, since the in-process inventory is reduced, the storage space for the substrate W in the production line can be reduced, so that there is an advantage that the construction cost of the clean room is reduced. In particular, recently, the size of the substrate W is increasing, and the unit price per substrate W is also high. Therefore, the above-mentioned shortening of TAT and reduction of in-process inventory will generate a large profit. Become. Furthermore, the lead time (delivery date) is shortened, and it becomes possible to cope with short delivery time or immediate delivery date.

Next, a case where the substrate W in the middle of processing is extracted will be described. FIG. 12 is a schematic time chart for understanding the flow of the substrate W when the substrate W being processed is sampled and inspected. The set tact time of each process (A), (B), and (C) is T ₁ , and the fourth substrate W ₄ from the start of loading is extracted after the process (A) is completed, and the inspection time. In this example, after passing through T ₃ , the substrate W (nm-4) is inserted next to the process (b). In this way, when the substrate W (n-4) is inserted into the process (b), a plurality of (two in the illustrated example) substrates W (nm-3) and W (nm-) The tact time (T ₁ + α), which is the input interval for the step (b) in 2), is larger than the set tact time T ₁ , and the substrate W (nm-1) and W (nm) immediately after that are is introduced under the tact time T ₁ to the processing device of step (b), thereafter, the substrate W in set tact time T ₁ in the entire process Yuku is processed smoothly. In this way, when the substrate W _{4 that} has undergone the sampling inspection is made longer than the set tact time T ₁ in the insertion interval (tact time) in the process (A) of several substrates immediately after interrupting from the process (B), Thereafter, processing is performed with a normal tact time in all steps.

On the other hand, if the substrate W ₄ is extracted after the process (A) is completed, the substrate is not put into the processing apparatus in charge of the subsequent processes (B) and (C). ), The substrate discharge interval (tact time) is doubled, and the production efficiency is lowered. Therefore, in the present invention, the step (b) is applied to the main substrate cassette 1 (first temporary placement table) or the inspection substrate cassette 2 (second temporary placement table) disposed in the vicinity of the processing apparatus in step (b). In the case where a substrate that does not flow through the production line is temporarily stored (when it is temporarily stored, it will be described later), this substrate W (n−m + 1) is processed (b). ), Even if the substrate W ₄ is extracted from the regular transport path for sampling inspection, the tact time of the subsequent process becomes the set tact time T ₁ immediately after that and the production efficiency is not lowered.

Next, a case where a specific processing apparatus fails will be described. FIG. 13 is a schematic time chart for understanding the flow of the substrate W when a specific processing apparatus temporarily fails. This is a case in which the processing apparatus in the step (b) fails after finishing the processing of the substrate W ₃ in the step (b). Even after the failure, several (four) substrates W _{4 to} W ₇ are set. The process (A) is processed at the tact time T ₁ , and the following several (3) substrates W _{8 to} W ₁₀ are set to the tact time set for process adjustment by stopping the processing apparatus in the process (B). Processing is performed with a tact time (T ₁ + β) longer than T ₁ . These multiple substrates W ₄ to _W-10, the subsequent substrates (e.g., substrates W ₅ for the substrate W ₄₎ even after finishing the process of step (a), charged in Step (b) Since it cannot be performed, it is sequentially carried into and stored in the main substrate cassette 1 between the steps (A) and (B).

After the stop time T ₄ has elapsed since the third substrate W ₃ finished the process (b), when the processing apparatus in the process (b) resumes, a plurality of substrates stored in the main substrate cassette 1 W _{4 to} W ₁₀ are sequentially unloaded from the previously loaded substrate, and are loaded into the processing apparatus (b) at the set tact time T ₁ . Then, the next subsequent substrate includes a substrate W ₁₂ of the substrate W ₁₁ put into the step (b) with a large tact time (T ₁ + beta) than the set final tact time T ₁ is sequentially set tact time is put into step (a) with T _1, it is continuously processed smoothly in the entire process.

In the substrate transfer apparatus S of the present embodiment, the bypass transfer row L ₃ corresponds to both of the processing apparatuses A to D arranged separately on both sides thereof. For this reason, the travel distance of the bypass conveyance vehicle 3 can be shortened, and the conveyance time of the board | substrate W by the bypass conveyance vehicle 3 can be shortened.

In the substrate transfer apparatus S of the embodiment described above, the main substrate cassette 1 is installed in a fixed state to the substrate temporary placement table columns L _2. Therefore, in this embodiment, an inspection substrate cassette 2 is provided separately from the main substrate cassette 1, and the extracted substrate W is stored in the inspection cassette 2, and the inspection substrate cassette is bypassed by the bypass transport vehicle 3. 2 itself is conveyed to the inspection devices Ma and Mb. As a result, there is an advantage that the substrate W in the inspection substrate cassette 2 has only one entrance or exit, and the configuration is simplified.

  In the substrate transport apparatus S of the present embodiment, the substrate W extracted for inspection is stored in the main substrate cassette 1 instead of the inspection substrate cassette 2, and the substrate W is transferred to the bypass transport vehicle 3. It is difficult. However, for example, when the main substrate cassette 1 is rotatably provided in a horizontal plane, the substrate W to be inspected can be transferred from the substrate cassette 1 to the bypass transport vehicle 3. This eliminates the need for the inspection substrate cassette 2 and has the advantage that the configuration of the substrate transfer apparatus S is simplified.

  Further, in this embodiment, the extracted substrate W is delivered to the bypass transport vehicle 3 together with the inspection substrate cassette 2 in a state of being accommodated in the inspection substrate cassette 2. However, the substrate W may not be stored in the inspection substrate cassette 2 but may be transferred to the bypass transport vehicle 3 as a single substrate W. This has the advantage that the inspection substrate cassette 2 is not required.

  In the substrate transfer apparatus S of the present embodiment, the substrate W is delivered via one of the substrate delivery devices Ea and Eb via the main substrate cassette 1 (first temporary placement table). However, the substrate transfer devices Ea and Eb may be configured to directly transfer the substrate W. In this case, the time required for delivery of the substrate W is greatly shortened, and the TAT can be further shortened.

  In the present specification, the case of the sampling inspection has been described as an incidental process performed on the substrate W being processed. However, the incidental processing may be processing other than sampling inspection. For example, when the processing pattern is not as designed, there is an example of bypass conveyance to a repair device for repairing a defective portion.

In the two substrate temporary placement table L ₂ in each of the first and second groups of the present embodiment, a space other than the portion to which the main substrate cassette 1 is attached is used as a substrate cassette containing the substrate W being processed. It can be used as a storage space for stocking. Thereby, when a specific processing apparatus A to D breaks down or maintenance of the entire production line is performed, more substrates W can be temporarily removed from the production line and stored. That is, an effect of increasing the “buffer function of the production line” by the temporary substrate placement table L ₂ is achieved.

1 is an overall plan view of a semiconductor manufacturing apparatus U. FIG. It is also a front view. It is a top view which shows the flow of the board | substrate W of the regular conveyance path in 1st group processing apparatus AD. The first is a plan view of the cleaning device A ₁₁ and the CVD device B _1. FIG. 3 is a front cross-sectional view showing a state where a substrate W is unloaded from the main substrate cassette 1. It is a top view which shows the flow of the board | substrate W of the bypass conveyance path in 1st group processing apparatus AD. Substrate W accommodated in the transport substrate cassette 4 is an operation explanatory view of a state that is carried into the first cleaning device A _11. FIG. 10 is an operation explanatory diagram of a state in which the substrate W discharged from the first cleaning apparatus A ₁₁ is stored in the main substrate cassette 1. Substrate W accommodated in the main substrate cassette 1 is an explanatory diagram of the operation of the condition to be carried into the CVD apparatus B _1. It is a typical time chart which shows the flow of the board | substrate W in case the board | substrate W in the middle of a process is processed normally by the single wafer process and a batch process. It is a figure which shows the relationship of the process number of the board | substrate W with respect to the time of the single wafer process and batch process which concern on this invention. It is a typical time chart which shows the flow of substrate W when substrate W in the middle of processing is extracted. It is a typical time chart which shows the flow of the board | substrate W when a specific processing apparatus fails. 5 is a diagram illustrating a process of forming a semiconductor element on a substrate W. FIG. It is a whole top view of the semiconductor manufacturing apparatus U by the conventional bay system.

Explanation of symbols

A: Cleaning device (processing device)
B: CVD equipment (processing equipment)
C: Photo device (processing device)
D: Etching device (processing device)
Ea, Eb: Board delivery device
L ₁ : Board delivery line (regular transport path)
L ₂ : Substrate temporary table (regular transport path)
L ₃ : Bypass transport line (bypass transport path)
Ma, Mb: Inspection device (accessory processing device)
U: Semiconductor manufacturing equipment
W: Substrate
1: Main board cassette (first temporary storage stand)
2: Inspection substrate cassette (second temporary table)
3: Bypass carrier vehicle (substrate bypass carrier vehicle)

Claims (8)

In a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate through a number of processes in sequence, the substrate is transported along a processing apparatus group consisting of a large number of processing apparatuses arranged in the order of processes in order to perform each process. And
The substrate is temporarily placed on a first temporary placement table arranged between the processing apparatuses, and then taken out by a substrate delivery apparatus arranged corresponding to each processing apparatus, and then one substrate is processed in a post-processing apparatus. A substrate carrying method characterized by carrying each piece. In a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate through a number of processes in sequence, the substrate is transported along a processing apparatus group consisting of a large number of processing apparatuses arranged in the order of processes in order to perform each process. And
The substrate transport path is a regular transport that is sequentially transported to a subsequent process side via a first temporary placement table disposed between the processing apparatuses in order to sequentially perform the processes of the processes on the substrate. Road,
In order to perform an incidental process on a substrate in the middle of processing, the substrate is reciprocally conveyed between the first temporary table or the second temporary table different from the first temporary table and an auxiliary processing apparatus. A substrate carrying method comprising: a path. In a semiconductor manufacturing apparatus for forming semiconductor elements on a substrate through a number of processes in sequence, the apparatus transports the substrate along a processing apparatus group consisting of a large number of processing apparatuses arranged in the order of processes in order to perform the processes of each process. And
In order to temporarily place the substrate being transported, a number of first temporary placement tables arranged between the processing apparatuses in charge of the preceding and following processes;
A number of substrates for transporting a substrate to another first temporary placement table on the post-process side adjacent to the first temporary placement table after the substrate taken out from the first temporary placement table on the previous process side is processed by the processing apparatus. And a substrate delivery device of
A substrate transfer apparatus, wherein substrates in the middle of processing are sequentially transferred to a subsequent process side one by one through the first temporary placement table. The substrate transport apparatus according to claim 3, wherein the first temporary placement table can temporarily place a plurality of substrates. 5. The substrate transfer apparatus according to claim 4, wherein the first temporary placement table has a multistage storage structure and is carried in and out by a first-in first-out method. A second temporary placement table dedicated to the auxiliary processing apparatus disposed separately from the first temporary placement table at a desired position on the normal transfer path of the substrate, and a substrate taken out from the second temporary placement table by-pass transfer to the auxiliary processing apparatus A substrate transfer apparatus according to claim 3, further comprising a substrate bypass transfer vehicle. The substrate transport apparatus according to claim 6, wherein the substrate temporarily placed on the second temporary placement table is performed by transporting the second temporary placement table itself. The processing device group consisting of a large number of processing devices is divided into two along the regular transport path and arranged opposite to each other, and a bypass transport path is formed between each of the two processing device groups. The substrate transfer apparatus according to any one of 3 to 7.

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