JP2005149130A - Method and device for producing sheet with noncontact ic tag - Google Patents

Method and device for producing sheet with noncontact ic tag Download PDF

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Publication number
JP2005149130A
JP2005149130A JP2003385599A JP2003385599A JP2005149130A JP 2005149130 A JP2005149130 A JP 2005149130A JP 2003385599 A JP2003385599 A JP 2003385599A JP 2003385599 A JP2003385599 A JP 2003385599A JP 2005149130 A JP2005149130 A JP 2005149130A
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Prior art keywords
suction
sheet
chip
roll
tag
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Japanese (ja)
Inventor
Yuuki Nakanishi
西 祐 幾 中
Hideto Sakata
田 英 人 坂
Terunao Tsuchiya
屋 輝 直 土
Kiichi Shimomura
村 貴 一 下
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2003385599A priority Critical patent/JP2005149130A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/8485—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

<P>PROBLEM TO BE SOLVED: To stick a number of IC chips to a base material sheet body composed of a packaging material or the like while positioning it at predetermined intervals. <P>SOLUTION: The base material sheet body 10 having a base material sheet 11 is prepared, and the base material sheet body 10 is inserted between a plate drum 30 and a pressure drum 31. An IC chip 20 is supplied from a part feeder 40 to a recessed part 31 side of the plate drum 30. The IC chip 20 supplied to the recessed part 31 of the plate drum 30 is smoothly sucked to the recessed part 31 by an adsorption hole 41 kept in a negative pressure by an adsorption source 35 and an adsorption pipe 36. The IC chip 20 in the recessed part 31 is transferred to the base material sheet body 10 side by pressuring the base material sheet 10 between the plate drum 30 and the pressure drum 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、外部のリーダ・ライタと非接触でデータの授受を行うことができる非接触ＩＣタグ付シートの製造方法および製造装置に関する。   The present invention relates to a manufacturing method and a manufacturing apparatus for a sheet with a non-contact IC tag that can exchange data without contact with an external reader / writer.

従来より外部のリーダ・ライタと非接触でデータの授受を行う非接触ＩＣタグは、ＩＣチップを有しており、このような非接触ＩＣタグは包材等の製品（基材シート体）に多数連続して貼り付けられ、このようにして非接触ＩＣタグ付シートが得られる。   Conventionally, a non-contact IC tag that exchanges data with an external reader / writer in a non-contact manner has an IC chip. Such a non-contact IC tag is used for products such as packaging materials (base sheet bodies). A large number of sheets are continuously attached, and thus a sheet with a non-contact IC tag is obtained.

上述のように、ＩＣチップを有する非接触ＩＣタグは包材等に多数連続して貼り付けられる。この場合、非接触ＩＣタグのＩＣチップは包材等の基材シート体に所定間隔をおいて、精度良く配置しながら貼り付けることが求められている。   As described above, a large number of non-contact IC tags having IC chips are continuously attached to a packaging material or the like. In this case, the IC chip of the non-contact IC tag is required to be attached to a base sheet body such as a packaging material at a predetermined interval while being accurately arranged.

本発明はこのような点を考慮してなされたものであり、多数のＩＣチップを包材等の基材シート体に容易かつ精度良く位置決めしながら貼り付けることができ、このことにより品質の高い非接触ＩＣタグ付シートを容易に製造することができる非接触ＩＣタグ付シートの製造方法および製造装置を提供することを目的とする。   The present invention has been made in consideration of the above points, and can attach a large number of IC chips to a base sheet body such as a packaging material while positioning them easily and accurately, which enables high quality. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus for a sheet with a non-contact IC tag that can easily manufacture a sheet with a non-contact IC tag.

本発明は、少なくとも基材シートを有する基材シート体を準備する工程と、表面に吸着孔が形成された吸着ロールの表面に、パーツフィーダからＩＣチップを供給し、このＩＣチップを吸着孔より保持する工程と、基材シート体を吸着ロールと、吸着ロールに対向して配置された圧胴との間に挿入して、吸着ロールの吸着孔により保持されたＩＣチップを基材シート体に転写する工程と、を備えたことを特徴とする非接触ＩＣタグ付シートの製造方法である。   The present invention provides a process for preparing a base sheet body having at least a base sheet, and an IC chip is supplied from a parts feeder to the surface of an adsorption roll having an adsorption hole formed on the surface. The IC chip held by the suction hole of the suction roll is inserted into the base sheet body by inserting the holding sheet and the base sheet body between the suction roll and the impression cylinder arranged to face the suction roll. A non-contact IC tag-attached sheet manufacturing method, comprising: a transfer step.

本発明は、基材シート体は、基材シート上に設けられたアンテナ回路を有することを特徴とする非接触ＩＣタグ付シートの製造方法である。   This invention is a manufacturing method of the sheet | seat with a non-contact IC tag characterized by a base material sheet body having an antenna circuit provided on the base material sheet.

本発明は、表面に吸着孔が形成された回転自在の吸着ロールと、吸着ロールに対向して配置され、吸着ロールとの間で少なくとも基材シートを有する基材シート体を加圧する圧胴と、吸着ロールの表面に設けられた吸着孔にＩＣチップを供給するパーツフィーダと、吸着ロールの吸着孔を負圧とする吸着機構とを備え、ＩＣチップを吸着ロールの吸着孔に吸着しながら供給し、この吸着孔により保持されたＩＣチップを基材シート体へ転写することを特徴とする非接触ＩＣタグ付シートの製造装置である。   The present invention includes a rotatable suction roll having suction holes formed on a surface thereof, an impression cylinder that is disposed so as to face the suction roll and presses a base sheet body having at least a base sheet therebetween. , Equipped with a parts feeder that supplies IC chips to the suction holes provided on the surface of the suction roll, and a suction mechanism that uses the suction holes of the suction roll as a negative pressure, and supplies the IC chips while being sucked into the suction holes of the suction roll Then, a non-contact IC tag-attached sheet manufacturing apparatus is characterized in that the IC chip held by the suction hole is transferred to a base sheet body.

本発明は、吸着機構は、制御部により駆動制御され、制御部は吸着ロールが回転して吸着孔がパーツフィーダから圧胴に達する間、当該吸着孔を負圧とし、吸着孔が圧胴からパーツフィーダに達する間、当該吸着孔を大気開放とするよう吸着機構を制御することを特徴とする非接触ＩＣタグ付シートの製造装置である。   In the present invention, the suction mechanism is driven and controlled by the control unit. The control unit sets the suction hole to a negative pressure while the suction roll rotates and the suction hole reaches the impression cylinder from the parts feeder. A non-contact IC tag-attached sheet manufacturing apparatus, wherein the suction mechanism is controlled so that the suction hole is opened to the atmosphere while reaching the parts feeder.

本発明は、吸着ロールの外周表面に凹部が形成され、吸着孔はこの凹部内に形成されていることを特徴とする非接触ＩＣタグ付シートの製造装置である。   The present invention is an apparatus for manufacturing a sheet with a non-contact IC tag, characterized in that a recess is formed on the outer peripheral surface of the suction roll, and the suction hole is formed in the recess.

本発明によれば、包材等からなる基材シート体に、多数のＩＣチップを所定間隔をおいて精度良く位置決めしながら、貼り付けることができる。このため品質の高い非接触ＩＣタグ付シートを容易に製造することができる。   According to the present invention, a large number of IC chips can be affixed to a base sheet made of a packaging material or the like while accurately positioning at a predetermined interval. For this reason, a high quality non-contact IC tag attached sheet can be easily manufactured.

以下、図面を参照して本発明の実施の形態について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１乃至図３は、本発明による非接触ＩＣタグ付シートの製造方法および製造装置の実施の形態を示す図である。   1 to 3 are diagrams showing an embodiment of a manufacturing method and a manufacturing apparatus for a non-contact IC tag-attached sheet according to the present invention.

まず図２により、非接触ＩＣタグ付シートについて説明する。非接触ＩＣタグ付シート１は、包材等の基材シート１１と、基材シート１１の表面に設けられたアンテナ回路１４と、印刷絵柄５とからなる基材シート体１０を有し、この基材シート体１０にＩＣチップ２０が設けられている。   First, the non-contact IC tag-attached sheet will be described with reference to FIG. The non-contact IC tag-attached sheet 1 includes a base material sheet 10 made of a base material sheet 11 such as a packaging material, an antenna circuit 14 provided on the surface of the base material sheet 11, and a printed pattern 5. An IC chip 20 is provided on the base sheet 10.

このうちＩＣチップ２０とアンテナ回路１４とにより非接触ＩＣタグが構成される。   Among these, the IC chip 20 and the antenna circuit 14 constitute a non-contact IC tag.

ＩＣチップ２０はその上面および底面に電極２１，２１を有し、導電性バンプあるいは、異方性導電接着材料を介して、基材シート体１０上のアンテナ回路１４に接続されている。   The IC chip 20 has electrodes 21 and 21 on its top and bottom surfaces, and is connected to the antenna circuit 14 on the base sheet body 10 via conductive bumps or anisotropic conductive adhesive material.

なお、ＩＣチップ２０は後述のようにして基材シート１１の所定位置に精度良く転写され、基材シート１１の表面に予め設けられたアンテナ回路１４に確実に接続されるようになっている。   The IC chip 20 is accurately transferred to a predetermined position of the base sheet 11 as described later, and is securely connected to the antenna circuit 14 provided in advance on the surface of the base sheet 11.

次に非接触ＩＣタグ付シートの製造装置について図１乃至図３により説明する。この非接触ＩＣタグ付シートの製造装置は、外周表面３０ａに所定間隔をおいて複数の凹部３１が形成され回転自在に配置された版胴（吸着ロール）３０と、版胴３０に対して対向して設けられ版胴３０との間で基材シート体１０を加圧する圧胴３２と、版胴３０と圧胴３２との間から出てくる基材シート体１０およびＩＣチップ２０を圧着する圧着固定部３３および圧着可動部３４とを備えている。
図３（ａ）（ｂ）に示すように、凹部３１は版胴３０の外周表面３０ａの略中央部に連続的に形成されている。 Next, an apparatus for manufacturing a sheet with a non-contact IC tag will be described with reference to FIGS. This non-contact IC tag-attached sheet manufacturing apparatus is opposed to the plate cylinder 30 and a plate cylinder (adsorption roll) 30 in which a plurality of recesses 31 are formed on the outer peripheral surface 30a at predetermined intervals and are rotatably arranged. A pressure cylinder 32 that pressurizes the substrate sheet 10 between the plate cylinder 30 and the substrate sheet 10 and the IC chip 20 that come out between the plate cylinder 30 and the impression cylinder 32. A crimping fixing portion 33 and a crimping movable portion 34 are provided.
As shown in FIGS. 3 (a) and 3 (b), the recess 31 is continuously formed at a substantially central portion of the outer peripheral surface 30 a of the plate cylinder 30.

また版胴３０の外周表面３０ａのうち、圧胴３２と反対側部分にはＩＣチップ２０を凹部３１内へ供給するパーツフィーダ４０が設けられている。すなわち、図３（ａ）（ｂ）に示すように、版胴３０の下方には、上方が開口するとともにＩＣチップ２０を連続的に供給するパーツフィーダ４０が設けられている。またパーツフィーダ４０の上方開口は先端部分４０ａを残してカバー４３により覆われている。このため、後述のように版胴３０に設けられた吸着孔４１により、パーツフィーダ４０の先端部分４０ａのＩＣチップ２０のみが吸着されて版胴３０側へ供給され、パーツフィーダ４０の他の部分のＩＣチップ２０はカバー４３により版胴３０側へ移行しないようになっている。   A part feeder 40 for supplying the IC chip 20 into the recess 31 is provided on the outer surface 30 a of the plate cylinder 30 on the opposite side of the impression cylinder 32. That is, as shown in FIGS. 3A and 3B, a parts feeder 40 is provided below the plate cylinder 30. The parts feeder 40 has an upper opening and continuously supplies the IC chip 20. Further, the upper opening of the parts feeder 40 is covered with a cover 43 leaving a tip end portion 40a. For this reason, as will be described later, only the IC chip 20 at the tip portion 40a of the parts feeder 40 is sucked by the suction holes 41 provided in the plate cylinder 30 and supplied to the plate cylinder 30 side. The IC chip 20 is prevented from moving toward the plate cylinder 30 by the cover 43.

また図１および図３（ａ）（ｂ）に示すように、版胴（吸着ロール）３０の各凹部３１内には吸着孔４１が形成されている。さらに版胴３０は凹部３１内の吸着孔４１を負圧とすることが可能な吸着機構を有している。この吸着機構は版胴３０内部に設けられた吸着源３５と、各凹部３１の吸着孔４１と吸着源３５とを連結する吸着ライン３６とを有している。   As shown in FIGS. 1 and 3A and 3B, suction holes 41 are formed in the respective recesses 31 of the plate cylinder (suction roll) 30. Further, the plate cylinder 30 has a suction mechanism capable of setting the suction hole 41 in the recess 31 to a negative pressure. This suction mechanism includes a suction source 35 provided inside the plate cylinder 30, and a suction line 36 that connects the suction holes 41 of the respective recesses 31 and the suction source 35.

この場合、版胴３０は、凹部３１が版胴３０の回転方向に向ってパーツフィーダ４０の先端部分４０ａから圧胴３２に達する領域Ａと、凹部３１が圧胴３２からパーツフィーダ４０の先端部分４０ａに達する領域Ｂとを有している。   In this case, the plate cylinder 30 includes a region A in which the concave portion 31 reaches the impression cylinder 32 from the tip portion 40 a of the parts feeder 40 in the rotation direction of the plate cylinder 30, and Region B reaching 40a.

また各吸着ライン３６には制御弁（図示せず）が設けられ、この制御弁と吸着源３５は制御部３８により制御される。この場合、制御部３８は領域Ａにある凹部３１に対応する吸着ライン３６の制御弁を開、領域Ｂにある凹部３１に対応する吸着ライン３６の制御弁を閉とする。このようにして領域Ａにある凹部３１の吸着孔４１を負圧に保ち、領域Ｂにある凹部３１の吸着孔４１を大気開放するようになっている。   Each adsorption line 36 is provided with a control valve (not shown), and the control valve and the adsorption source 35 are controlled by a control unit 38. In this case, the control unit 38 opens the control valve of the suction line 36 corresponding to the recess 31 in the region A and closes the control valve of the suction line 36 corresponding to the recess 31 in the region B. In this way, the suction hole 41 of the recess 31 in the region A is kept at a negative pressure, and the suction hole 41 of the recess 31 in the region B is opened to the atmosphere.

次に非接触ＩＣタグ付シートの製造方法について説明する。   Next, the manufacturing method of a non-contact IC tag attached sheet will be described.

まず包材等の基材シート１１の表面に印刷により印刷絵柄５が形成され、次に基材シート１１表面に印刷によりアンテナ回路１４が形成され、このようにして基材シート体１０が作製される。この基材シート体１０は、シート体供給部１０ａから繰り出され、版胴（吸着ロール）３０と圧胴３２との間に挿入され、版胴３０と圧胴３２との間で加圧される。   First, the printed pattern 5 is formed on the surface of the base material sheet 11 such as a packaging material, and then the antenna circuit 14 is formed on the surface of the base material sheet 11 by printing. Thus, the base material sheet body 10 is produced. The The base sheet body 10 is fed out from the sheet body supply unit 10 a, inserted between the plate cylinder (adsorption roll) 30 and the impression cylinder 32, and pressurized between the plate cylinder 30 and the impression cylinder 32. .

この間、多数のＩＣチップ２０が、連続的にパーツフィーダ４０の先端部分４０ａから版胴３０の凹部３１内に吸着孔４１の吸着作用により供給される。この場合、パーツフィーダ４０は先端部分４０ａを除いてカバー４３により覆われているため、パーツフィーダ４０の先端部分４０ａに位置するＩＣチップ２０のみを吸着孔４１の吸着作用により凹部３１内へ供給することができる。   During this time, a large number of IC chips 20 are continuously supplied from the front end portion 40 a of the parts feeder 40 into the recess 31 of the plate cylinder 30 by the suction action of the suction holes 41. In this case, since the parts feeder 40 is covered with the cover 43 except for the tip portion 40a, only the IC chip 20 located at the tip portion 40a of the parts feeder 40 is supplied into the recess 31 by the suction action of the suction holes 41. be able to.

版胴３０の凹部３１内に供給されたＩＣチップ２０は、版胴３０の回転に伴なって基材シート体１０側へ送られる。次に凹部３１内のＩＣチップ２０は版胴３０と圧胴３２との間に挿入された基材シート体１０側へ転写される。   The IC chip 20 supplied into the recess 31 of the plate cylinder 30 is sent to the base sheet body 10 side as the plate cylinder 30 rotates. Next, the IC chip 20 in the recess 31 is transferred to the base sheet 10 inserted between the plate cylinder 30 and the impression cylinder 32.

次にＩＣチップ２０の凹部３１への充てん作用について述べる。パーツフィーダ４０によってＩＣチップ２０を連続的に版胴３０の凹部３１内へ確実に供給することができる。   Next, the filling operation to the recess 31 of the IC chip 20 will be described. The IC chip 20 can be continuously and reliably supplied into the recess 31 of the plate cylinder 30 by the parts feeder 40.

すなわち、凹部３１の吸着孔４１は吸着源３５に吸着管３６を介して連通し、版胴３０の領域Ａにある凹部３１の吸着孔４１は吸着源３５により常時負圧に保たれているので、パーツフィーダ４０から版胴３０側に順次供給されたＩＣチップ２０は、パーツフィーダ４０のうちカバー４３によって覆われていない先端部分４０ａから凹部３１内へ確実に引込まれる。さらに、凹部３１内に収納されたＩＣチップ２０を圧胴３２まで確実に保持することができる。   That is, the suction hole 41 of the recess 31 communicates with the suction source 35 via the suction pipe 36, and the suction hole 41 of the recess 31 in the region A of the plate cylinder 30 is always kept at a negative pressure by the suction source 35. The IC chips 20 sequentially supplied from the parts feeder 40 to the plate cylinder 30 side are surely drawn into the recess 31 from the front end portion 40a of the parts feeder 40 that is not covered by the cover 43. Further, the IC chip 20 accommodated in the recess 31 can be securely held up to the impression cylinder 32.

また版胴３０に設けられた凹部３１は、所定の間隔をおいて複数形成され、凹部３１内の吸着孔４１も所定間隔をおいて形成されているため、基材シート１０側へＩＣチップ２０を所定間隔をおいて精度良く位置決めしながら転写することができる。   In addition, a plurality of recesses 31 provided in the plate cylinder 30 are formed with a predetermined interval, and the suction holes 41 in the recess 31 are also formed with a predetermined interval. Can be transferred while accurately positioning at a predetermined interval.

基材シート体１０側へ転写されたＩＣチップ２０はその後、圧着固定部３３および圧着可動部３４によって圧着され加熱される。このことにより、ＩＣチップ２０は、バンプあるいは異方性導電接着フィルム１８により、アンテナ回路１４に対して強固に接合される。   The IC chip 20 transferred to the base sheet body 10 side is then crimped and heated by the crimping fixing part 33 and the crimping movable part 34. Thus, the IC chip 20 is firmly bonded to the antenna circuit 14 by the bumps or the anisotropic conductive adhesive film 18.

なお、ＩＣチップ２０はその上面および底面に電極２１，２１が設けられているため、ＩＣチップ２０上に追加のアンテナ回路１４ａを印刷あるいは転写や貼りつけにより設けることができる（図５）。   Since the IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces, an additional antenna circuit 14a can be provided on the IC chip 20 by printing, transferring, or pasting (FIG. 5).

このようにして基材シート１１とアンテナ回路１４と印刷絵柄５とからなる基材シート体１０と、ＩＣチップ２０とにより構成された非接触ＩＣタグ付シート１が得られる。このようにして得られた非接触ＩＣタグ付シート１は、外部のリーダ・ライタと非接触でデータの授受を行うようになっている。   In this way, the non-contact IC tag-attached sheet 1 constituted by the base material sheet body 10 including the base material sheet 11, the antenna circuit 14, and the printed pattern 5 and the IC chip 20 is obtained. The non-contact IC-tagged sheet 1 obtained in this way is designed to exchange data with an external reader / writer in a non-contact manner.

非接触ＩＣタグ付シート１は、その後図示しない後工程の本圧着部に送られ、この本圧着部において本圧着され、非接触ＩＣタグ付シート１の基材シート１１に対してＩＣチップ２０が確実に接着される。   The non-contact IC tag-attached sheet 1 is then sent to a non-illustrated post-bonding main press-bonding section, where the non-contact IC tag-attached sheet 1 is finally press-bonded. Adhered securely.

以上のように本実施の形態によれば、基材シート１１を有する基材シート体１０に、多数のＩＣチップ２０を所定間隔をおいて精度良く位置決めしながら転写することができ、品質の高いＩＣタグ付シートを容易に製造することができる。   As described above, according to the present embodiment, it is possible to transfer a large number of IC chips 20 to the base sheet body 10 having the base sheet 11 while accurately positioning the chip chips 20 at a predetermined interval, and the quality is high. A sheet with an IC tag can be easily manufactured.

次に図４および図５により、本発明の変形例について説明する。   Next, a modification of the present invention will be described with reference to FIGS.

図３（ａ）（ｂ）において、版胴３０に凹部３１を設け、この凹部３１内に吸着孔４１を形成した例を示したが、これに限らず版胴３０に凹部３１を設けることなく、図４に示すように、版胴３０の外周表面３０ａに所定間隔をおいて吸着孔４１を設けてもよい。この場合、パーツフィーダ４０から供給されるＩＣチップ２０は、版胴３０の外周表面３０ａ側へ吸着孔４１により吸着されて保持される。   3 (a) and 3 (b), an example in which the plate cylinder 30 is provided with the recess 31 and the suction hole 41 is formed in the recess 31 is shown, but the present invention is not limited to this, and the plate cylinder 30 is not provided with the recess 31. As shown in FIG. 4, suction holes 41 may be provided on the outer peripheral surface 30 a of the plate cylinder 30 at a predetermined interval. In this case, the IC chip 20 supplied from the parts feeder 40 is sucked and held by the suction holes 41 toward the outer peripheral surface 30 a side of the plate cylinder 30.

また図５に示すようにＩＣチップ２０の底面の電極２１と基材シート体１０のアンテナ回路１４とを接続した後、ＩＣチップ２０上に追加のアンテナ回路１４ａを印刷あるいは転写により設け、この追加のアンテナ回路１４ａをＩＣチップ２０の上面のバンプ２１に接続してもよい。この場合、ＩＣチップ２０の電極２１，２１は異方性導電性接着材料１８，１８を介してアンテナ回路１４および追加のアンテナ回路１４ａに接合される。   Further, as shown in FIG. 5, after the electrode 21 on the bottom surface of the IC chip 20 and the antenna circuit 14 of the base sheet 10 are connected, an additional antenna circuit 14a is provided on the IC chip 20 by printing or transferring. The antenna circuit 14 a may be connected to the bump 21 on the upper surface of the IC chip 20. In this case, the electrodes 21 and 21 of the IC chip 20 are bonded to the antenna circuit 14 and the additional antenna circuit 14a via the anisotropic conductive adhesive materials 18 and 18, respectively.

本発明による非接触ＩＣタグ付シートの製造方法および製造装置を示す概略図。Schematic which shows the manufacturing method and manufacturing apparatus of the sheet | seat with a non-contact IC tag by this invention. 基材シート体にＩＣチップを設けてなる非接触ＩＣタグ付シートを示す図。The figure which shows the sheet | seat with a non-contact IC tag which provides an IC chip in a base material sheet body. 非接触ＩＣタグ付シートの製造装置を示す斜視図。。The perspective view which shows the manufacturing apparatus of a sheet | seat with a non-contact IC tag. . 本発明の変形例を示す版胴の概略図。The schematic of the plate cylinder which shows the modification of this invention. 本発明の変形例を示す基材シート体にＩＣチップを設けてなるＩＣタグ付シートを示す図。The figure which shows the sheet | seat with an IC tag which provides an IC chip in the base material sheet | seat body which shows the modification of this invention.

符号の説明Explanation of symbols

１ ＩＣタグ付シート
１０ 基材シート体
１１ 基材シート
１４ アンテナ回路
１４ａ 追加アンテナ回路
１８ 異方性導電接着フィルム
２０ ＩＣチップ
２１ 電極
３０ 版胴
３１ 凹部
３２ 圧胴
３５ 吸着源
３６ 吸着管
３８ 制御部
４０ パーツフィーダ
４１ 吸着孔
４３ カバー DESCRIPTION OF SYMBOLS 1 Sheet with IC tag 10 Base sheet body 11 Base sheet 14 Antenna circuit 14a Additional antenna circuit 18 Anisotropic conductive adhesive film 20 IC chip 21 Electrode 30 Plate cylinder 31 Recess 32 Impression cylinder 35 Suction source 36 Suction tube 38 Control unit 40 Parts feeder 41 Suction hole 43 Cover

Claims (5)

少なくとも基材シートを有する基材シート体を準備する工程と、
表面に吸着孔が形成された吸着ロールの表面に、パーツフィーダからＩＣチップを供給し、このＩＣチップを吸着孔より保持する工程と、
基材シート体を吸着ロールと、吸着ロールに対向して配置された圧胴との間に挿入して、吸着ロールの吸着孔により保持されたＩＣチップを基材シート体に転写する工程と、を備えたことを特徴とする非接触ＩＣタグ付シートの製造方法。 Preparing a base sheet body having at least a base sheet;
A step of supplying an IC chip from a parts feeder to the surface of an adsorption roll having an adsorption hole formed on the surface, and holding the IC chip from the adsorption hole;
Inserting the base sheet body between the suction roll and an impression cylinder disposed opposite the suction roll, and transferring the IC chip held by the suction hole of the suction roll to the base sheet body; A method for producing a sheet with a non-contact IC tag, comprising: 基材シート体は、基材シート上に設けられたアンテナ回路を有することを特徴とする請求項１記載の非接触ＩＣタグ付シートの製造方法。   The method for producing a sheet with a non-contact IC tag according to claim 1, wherein the base sheet body has an antenna circuit provided on the base sheet. 表面に吸着孔が形成された回転自在の吸着ロールと、
吸着ロールに対向して配置され、吸着ロールとの間で少なくとも基材シートを有する基材シート体を加圧する圧胴と、
吸着ロールの表面に設けられた吸着孔にＩＣチップを供給するパーツフィーダと、
吸着ロールの吸着孔を負圧とする吸着機構とを備え、
ＩＣチップを吸着ロールの吸着孔に吸着しながら供給し、この吸着孔により保持されたＩＣチップを基材シート体へ転写することを特徴とする非接触ＩＣタグ付シートの製造装置。 A rotatable suction roll with suction holes formed on the surface;
An impression cylinder that is disposed opposite to the adsorption roll and presses the substrate sheet body having at least the substrate sheet with the adsorption roll;
A parts feeder for supplying IC chips to the suction holes provided on the surface of the suction roll;
With a suction mechanism that makes the suction hole of the suction roll negative pressure,
An apparatus for producing a sheet with a non-contact IC tag, wherein an IC chip is supplied while being adsorbed to an adsorption hole of an adsorption roll, and the IC chip held by the adsorption hole is transferred to a base sheet member. 吸着機構は、制御部により駆動制御され、制御部は吸着ロールが回転して吸着孔がパーツフィーダから圧胴に達する間、当該吸着孔を負圧とし、吸着孔が圧胴からパーツフィーダに達する間、当該吸着孔を大気開放とするよう吸着機構を制御することを特徴とする請求項３記載の非接触ＩＣタグ付シートの製造装置。   The suction mechanism is driven and controlled by the control unit, and while the suction roll rotates and the suction hole reaches the impression cylinder from the parts feeder, the suction hole is set to a negative pressure, and the suction hole reaches the parts feeder from the impression cylinder. The apparatus for producing a sheet with a non-contact IC tag according to claim 3, wherein the suction mechanism is controlled so that the suction hole is opened to the atmosphere. 吸着ロールの外周表面に凹部が形成され、吸着孔はこの凹部内に形成されていることを特徴とする請求項３記載の非接触ＩＣタグ付シートの製造装置。   4. The apparatus for producing a sheet with a non-contact IC tag according to claim 3, wherein a recess is formed on the outer peripheral surface of the suction roll, and the suction hole is formed in the recess.
JP2003385599A 2003-11-14 2003-11-14 Method and device for producing sheet with noncontact ic tag Withdrawn JP2005149130A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027551A (en) * 2005-07-20 2007-02-01 Fujitsu Ltd Ic chip packaging method
GB2549250A (en) * 2016-02-15 2017-10-18 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
GB2563600A (en) * 2017-06-19 2018-12-26 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
CN112017988A (en) * 2019-05-31 2020-12-01 云谷（固安）科技有限公司 Transfer apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027551A (en) * 2005-07-20 2007-02-01 Fujitsu Ltd Ic chip packaging method
JP4616719B2 (en) * 2005-07-20 2011-01-19 富士通株式会社 IC chip mounting method
GB2549250A (en) * 2016-02-15 2017-10-18 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
US10811383B2 (en) 2016-02-15 2020-10-20 Pragmatic Printing Ltd. Apparatus and method for manufacturing plurality of electronic circuits
GB2549250B (en) * 2016-02-15 2021-06-30 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
GB2563600A (en) * 2017-06-19 2018-12-26 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
US11177145B2 (en) 2017-06-19 2021-11-16 Pragmatic Printing Ltd. Apparatus and method for manufacturing plurality of electronic circuits
GB2563600B (en) * 2017-06-19 2022-05-11 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
CN112017988A (en) * 2019-05-31 2020-12-01 云谷（固安）科技有限公司 Transfer apparatus
CN112017988B (en) * 2019-05-31 2024-03-19 成都辰显光电有限公司 Transfer apparatus

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