JP2005107920A - Manufacturing method and manufacturing device for sheet with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To adhere a multiplicity of IC chips to a base material sheet body comprising a packaging material or the like while positioning them at predetermined intervals. <P>SOLUTION: The base material sheet body 10 having a base material sheet 11 is prepared, and the base material sheet body 10 is inserted between a form cylinder 30 and an impression cylinder 31. The IC chips 20 are supplied from an IC chip supply nozzle 37a in an upper part of the form cylinder 30. The IC chips 20 supplied to a surface 30a of the form cylinder 30 is smoothly drawn into a recessed part 31 maintained at a negative pressure by a suction source 35 and a suction tube 36. The IC chips 20 in the recessed part 31 are transferred to a base material sheet body 10 side by pressurizing the base material sheet body 10 between the form cylinder 30 and the impression cylinder 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for a sheet with a non-contact IC tag that can exchange data without contact with an external reader / writer.

  Conventionally, a non-contact IC tag that exchanges data with an external reader / writer in a non-contact manner has an IC chip. Such a non-contact IC tag is used for products such as packaging materials (base sheet bodies). A large number of sheets are continuously attached, and thus a sheet with a non-contact IC tag is obtained.

  As described above, a large number of non-contact IC tags having IC chips are continuously attached to a packaging material or the like. In this case, the IC chip of the non-contact IC tag is required to be attached to a base sheet body such as a packaging material at a predetermined interval while being accurately arranged.

  The present invention has been made in consideration of the above points, and can attach a large number of IC chips to a base sheet body such as a packaging material while positioning them easily and accurately, which enables high quality. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus for a sheet with an IC tag, which can easily manufacture a sheet with an IC tag.

  The present invention includes a step of preparing a base sheet body having at least a base sheet, a step of supplying an IC chip to the surface of the suction roll having a recess formed on the surface, and a step of filling the IC chip into the recess. Inserting the base sheet body between the suction roll and the impression cylinder arranged to face the suction roll, and transferring the IC chip filled in the concave portion of the suction roll to the base sheet body; A method for producing a sheet with an IC tag, comprising:

  This invention is a manufacturing method of the sheet | seat with an IC tag characterized by a base material sheet body having an antenna circuit provided on the base material sheet.

  The present invention relates to a rotatable suction roll formed with a recess, an impression cylinder that is disposed opposite to the suction roll and presses at least a base sheet having a base sheet between the suction roll and the suction roll. IC chip supply means for supplying an IC chip to the surface of the substrate, and an adsorption mechanism for making the inside of the concave portion of the suction roll have a negative pressure. The IC chip is filled while adsorbing in the concave portion of the suction roll, and the IC in this concave portion It is an apparatus for manufacturing a sheet with an IC tag, wherein a chip is transferred to a base sheet body.

  In the present invention, the suction mechanism is driven and controlled by the control unit. The control unit rotates the suction roll and the concave part reaches the impression cylinder from the vicinity of the IC chip supply means. The IC tag sheet manufacturing apparatus is characterized in that the suction mechanism is controlled so that the concave portion is opened to the atmosphere while reaching the IC chip supply means.

  According to the present invention, a large number of IC chips can be affixed to a base sheet made of a packaging material or the like while accurately positioning at a predetermined interval. For this reason, a high quality sheet with an IC tag can be easily manufactured.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 6 are views showing an embodiment of a manufacturing method and a manufacturing apparatus for a sheet with an IC tag according to the present invention.

  First, the IC-tagged sheet will be described with reference to FIG. The IC tag-attached sheet 1 has a base material sheet body 10 composed of a base material sheet 11 such as a packaging material, an antenna circuit 14 provided on the surface of the base material sheet 11, and a printed pattern 5. An IC chip 20 is provided on the sheet body 10.

  Among these, the IC chip 20 and the antenna circuit 14 constitute an IC tag.

  The IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces thereof, and is connected to the antenna circuit 14 on the base sheet body 10 through conductive bumps or anisotropic conductive adhesive material.

  The IC chip 20 is accurately transferred to a predetermined position of the base sheet 11 as described later, and is securely connected to the antenna circuit 14 provided in advance on the surface of the base sheet 11.

  Next, an apparatus for manufacturing a sheet with an IC tag will be described. This IC tag-attached sheet manufacturing apparatus has a plate cylinder (adsorption roll) 30 in which a plurality of recesses 31 are formed at a predetermined interval on a surface 30 a and is rotatably arranged, and is opposed to the plate cylinder 30. An impression cylinder 32 that pressurizes the substrate sheet 10 between the plate cylinder 30 and a pressure fixing that crimps the substrate sheet 10 and the IC chip 20 coming out between the plate cylinder 30 and the impression cylinder 32. A portion 33 and a crimping movable portion 34 are provided.

  A pair of doctors 37 is provided above the plate cylinder 30, and a large number of IC chips 20 are filled between the pair of doctors 37, 37 above the plate cylinder 30.

  As shown in FIG. 1, the IC chip 20 is supplied from an IC chip supply nozzle (IC chip supply means) 37 a between a pair of doctors 37, 37 in the upper part of the plate cylinder 30.

  Next, the recess 31 of the plate cylinder 30 will be described in detail with reference to FIG. The concave portion 31 of the plate cylinder 30 is disposed so as to be lowered from the surface 30a of the plate cylinder 30, and the IC chip storage portion 31a in which the IC chip 20 is stored, and from the surface 30a of the plate cylinder 30 toward the IC chip storage portion 31a. And a flat inclined portion 31b extending.

  The recess 31 has a flat sector shape, and the IC chip storage portion 31a is located at the base end of the sector shape. The IC chip storage portion 31 a of the recess 31 is disposed behind the recess 31 in the rotation direction of the plate cylinder 30, and the fan-shaped shape of the recess 31 as a whole is subject to left and right with respect to the axis L perpendicular to the plate cylinder 30. It has become.

  Here, FIG. 3A is a cross-sectional view showing the concave portion 31 of the plate cylinder 30, and FIG. 3B is a plan view thereof.

  The IC chip 20 disposed in the IC chip storage portion 31a of the recess 31 is orthogonal to the axis L, but the direction of the IC chip 20 in the IC chip storage portion 31a is set to the axis L as shown in FIG. Alternatively, it may be inclined by 45 °.

  Further, as shown in FIG. 6, the shape of the recess 31 in the IC chip storage portion 31a may be rectangular.

  Further, as shown in FIG. 1, the plate cylinder (adsorption roll) 30 has an adsorption mechanism that can make the inside of the recess 31 negative pressure. This suction mechanism has a suction source 35 provided inside the plate cylinder 30, and a suction line 36 that connects the IC chip storage portion 31 a of each recess 31 and the suction source 35.

  In this case, the plate cylinder 30 includes a region A in which the concave portion 31 reaches the impression cylinder 32 from the doctor 37 provided in the vicinity of the IC chip supply nozzle 37 in the rotation direction of the plate cylinder 30, and the concave portion 31 extends from the impression cylinder 32 to the doctor. And a region B reaching 37.

  Each adsorption line 36 is provided with a control valve (not shown), and the control valve and the adsorption source 35 are controlled by a control unit 38. In this case, the control unit 38 opens the control valve of the suction line 36 corresponding to the recess 31 in the region A and closes the control valve of the suction line 36 corresponding to the recess 31 in the region B. In this way, the concave portion 31 in the region A is kept at a negative pressure, and the concave portion 31 in the region B is opened to the atmosphere.

  Next, the manufacturing method of a sheet | seat with an IC tag is demonstrated.

  First, the printed pattern 5 is formed on the surface of the base material sheet 11 such as a packaging material (FIG. 4A), and then the antenna circuit 14 is formed on the surface of the base material sheet 11 (FIG. 4B). )). In this way, the base sheet body 10 is produced. The base sheet body 10 is fed out from the sheet body supply unit 1, inserted between the plate cylinder (adsorption roll) 30 and the impression cylinder 32, and pressurized between the plate cylinder 30 and the impression cylinder 32. .

  During this time, a large number of IC chips 20 are supplied between the pair of doctors 37 and 37 above the plate cylinder 30 by the IC chip supply nozzle 37a.

  The IC chip 20 supplied to the upper part of the plate cylinder 30 is filled in each recess 31 of the plate cylinder 30, and then the IC chip 20 in the recess 31 is pressed between the plate cylinder 30 and the impression cylinder 32. It is transferred to the substrate sheet 10 side (see FIG. 4C).

  Next, the filling operation to the recess 31 of the IC chip 20 will be described. The IC chip 20 supplied to the upper portion of the plate cylinder 30 is scraped off by the doctor 37 as the plate cylinder 30 rotates as shown in FIGS. 3A and 3B, and is recessed from the surface 30 a of the plate cylinder 30. Is guided along the inclined portion 31b and led to the IC chip storage portion 31a.

  At this time, the recess 31 has a flat sector shape, and the IC chip storage portion 31 a is located at the base end of the sector shape, and is located behind the recess 31 in the rotation direction of the plate cylinder 30. Therefore, the IC chip 20 on the surface 30a of the plate cylinder 30 can be smoothly guided to the IC chip storage part 31a through the inclined part 31b, and the IC chip 20 can be stored in the IC chip storage part 31a with high accuracy. .

  Further, the IC chip storage portion 31a of the recess 31 communicates with the suction source 35 via the suction pipe 36, and the recess 31 in the region A of the plate cylinder 30 is always kept at a negative pressure by the suction source 35. The IC chip 20 supplied from the supply nozzle 37 a to the surface 30 a of the plate cylinder 30 can be more reliably drawn into the IC chip storage portion 31 a of the recess 31 while being scraped off by the doctor 37. Further, the IC chip 20 accommodated in the IC chip accommodating portion 31a can be securely held up to the impression cylinder 32.

  In addition, since a plurality of IC chip storage portions 31a of the recesses 31 provided on the surface 30a of the plate cylinder 30 are formed at a predetermined interval, the IC chips 20 are accurately spaced at a predetermined interval toward the base sheet 10 side. Transfer can be performed while positioning well.

  The IC chip 20 transferred to the base sheet body 10 side is then crimped and heated by the crimping fixing part 33 and the crimping movable part 34. Thereby, the IC chip 20 is firmly bonded to the antenna circuit 14 by the bumps or the anisotropic conductive adhesive film 18.

  Since the IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces, an additional antenna circuit 14a can be provided on the IC chip 20 by printing, transferring, or pasting (FIG. 4D). And FIG. 8).

  In this way, the IC tag-attached sheet 1 constituted by the base sheet 10 composed of the base sheet 11, the antenna circuit 14, and the printed pattern 5 and the IC chip 20 is obtained. The IC-tagged sheet 1 obtained in this way is designed to exchange data without contact with an external reader / writer.

  The IC tag-attached sheet 1 is then sent to a non-illustrated post-bonding main press-bonding section, where it is finally press-bonded, and the IC chip 20 is securely bonded to the base sheet 11 of the IC tag-attached sheet 1. The

  As described above, according to the present embodiment, it is possible to transfer a large number of IC chips 20 to the base sheet body 10 having the base sheet 11 while accurately positioning the chip chips 20 at a predetermined interval, and the quality is high. A sheet with an IC tag can be easily manufactured.

  Next, a modification of the present invention will be described with reference to FIGS.

  As shown in FIGS. 7A and 7B, when the base sheet body 10 includes the base sheet 11 and the pattern 5 and does not include the antenna circuit 14, it is necessary to connect the IC chip 20 to the antenna circuit 14. Absent. In this case, the IC chip 20 has an antenna function instead of the antenna circuit. At this time, as shown in FIGS. 7 (a) and 7 (b), the base sheet body 10 includes a base sheet 11 and a pattern 5 (FIG. 7 (a)). The IC chip 20 is transferred from the recess 31 of the plate cylinder 30 and mounted.

  Further, as shown in FIG. 8, after the electrode 21 on the bottom surface of the IC chip 20 and the antenna circuit 14 of the base sheet 10 are connected, an additional antenna circuit 14a is provided on the IC chip 20 by printing or transferring. The antenna circuit 14 a may be connected to the bump 21 on the upper surface of the IC chip 20. In this case, the electrodes 21 and 21 of the IC chip 20 are bonded to the antenna circuit 14 and the additional antenna circuit 14a via the anisotropic conductive adhesive materials 18 and 18, respectively.

Schematic which shows the manufacturing method and manufacturing apparatus of a sheet | seat with an IC tag by this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in a base material sheet body. The figure which shows the recessed part of a printing cylinder. The figure which shows the state which transfers and mounts an IC chip on a base material sheet body. The perspective view which shows the recessed part of a printing cylinder. The perspective view which shows the recessed part of a printing cylinder. The figure which shows the state which transcribe | transfers and mounts an IC chip on the base material sheet | seat body which shows the modification of this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in the base material sheet | seat body which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC tag attached sheet 10 Base sheet body 11 Base sheet 14 Antenna circuit 14a Additional antenna circuit 18 Anisotropic conductive adhesive film 20 IC chip 21 Electrode 30 Plate cylinder 31 Recess 32 Impression cylinder 35 Suction source 36 Suction tube 37 Doctor 37a IC chip supply nozzle 38 control unit

Claims (4)

Preparing a base sheet body having at least a base sheet;
Supplying the IC chip to the surface of the suction roll having a recess formed on the surface, and filling the IC chip into the recess;
Inserting the base sheet body between the suction roll and the impression cylinder disposed opposite the suction roll, and transferring the IC chip filled in the concave portion of the suction roll to the base sheet body. A method for producing a sheet with an IC tag, comprising:   The method for producing a sheet with an IC tag according to claim 1, wherein the base sheet body has an antenna circuit provided on the base sheet. A rotatable suction roll formed with a recess,
An impression cylinder that is arranged opposite to the adsorption roll and presses the base sheet body having at least the base sheet between the adsorption roll and
IC chip supply means for supplying an IC chip to the surface of the suction roll;
An adsorption mechanism that creates a negative pressure in the recess of the adsorption roll,
An IC tag sheet manufacturing apparatus, wherein an IC chip is filled while adsorbing in a recess of an adsorption roll, and the IC chip in the recess is transferred to a base sheet member.   The suction mechanism is driven and controlled by the control unit. The control unit rotates the suction roll and the concave part reaches the impression cylinder from the vicinity of the IC chip supply means. 4. The apparatus for producing a sheet with an IC tag according to claim 3, wherein the suction mechanism is controlled so that the concave portion is opened to the atmosphere during the period of time.

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