JP2005104539A - Method and apparatus for manufacturing sheet with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stick numerous IC chips to a base sheet body comprising a wrapper or the like with predetermined intervals while positioning. <P>SOLUTION: The base sheet body 10 having a base sheet 11 is prepared, and the sheet body 10 is inserted between a forme cylinder 30 and an impression cylinder 31. The IC chips 20 are fed by an IC chip feed nozzle 37a to an upper part of the forme cylinder 30. A recess 31 is constituted of an IC chip storage 31a and a slope 31b extending from the surface 30a of the forme cylinder 30 to the IC chip storage 31a. The IC chip 20 is guided from the surface 30a of the cylinder 30 to a slope 30b and placed in the storage 31a. The IC chip 20 in the storage 31a of the recess 31 is transferred onto the base sheet body 10 by pressurizing the sheet body 10 between the forme cylinder 30 and the impression cylinder 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for a sheet with a non-contact IC tag that can exchange data without contact with an external reader / writer.

  Conventionally, a non-contact IC tag that exchanges data with an external reader / writer in a non-contact manner has an IC chip. Such a non-contact IC tag is used for products such as packaging materials (base sheet bodies). A large number of sheets are continuously attached, and thus a sheet with a non-contact IC tag is obtained.

  As described above, a large number of non-contact IC tags having IC chips are continuously attached to a packaging material or the like. In this case, the IC chip of the non-contact IC tag is required to be attached to a base sheet body such as a packaging material at a predetermined interval while being accurately arranged.

  The present invention has been made in consideration of the above points, and can attach a large number of IC chips to a base sheet body such as a packaging material while positioning them easily and accurately, which enables high quality. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus for a sheet with an IC tag, which can easily manufacture a sheet with an IC tag.

  The present invention includes a step of preparing a base sheet body having at least a base sheet, a step of supplying an IC chip to the surface of a plate cylinder having a recess formed on the surface, and a step of filling the IC chip into the recess. Inserting the base sheet body between the plate cylinder and the impression cylinder arranged to face the plate cylinder, and transferring the IC chip filled in the concave portion of the plate cylinder to the base sheet body; A method for producing a sheet with an IC tag, comprising:

  This invention is a manufacturing method of the sheet | seat with an IC tag characterized by a base material sheet body having an antenna circuit provided on the base material sheet.

  The present invention relates to a rotatable plate cylinder having recesses formed thereon, an impression cylinder that is disposed opposite to the plate cylinder and presses a substrate sheet body having at least a substrate sheet between the plate cylinder, and a plate cylinder IC chip supply means for supplying an IC chip to the surface of the plate, the concave portion is arranged to descend from the surface of the plate cylinder, and an IC chip storage portion for storing the IC chip, and from the surface of the plate cylinder to the IC chip storage portion The IC chip supplied to the surface of the plate cylinder is guided from the inclined part of the recess to the IC chip storage part, and the IC chip in the IC chip storage part of the recess is a base material. An apparatus for producing a sheet with an IC tag, wherein the sheet is transferred to a sheet body.

  The present invention is the apparatus for manufacturing a sheet with an IC tag, wherein the recess has a flat sector shape, and the IC chip storage portion is located at the base end of the sector shape.

  The present invention is the apparatus for manufacturing a sheet with an IC tag, wherein the IC chip storage portion of the recess is located behind the recess in the rotation direction of the plate cylinder.

  According to the present invention, a large number of IC chips can be affixed to a base sheet made of a packaging material or the like while accurately positioning at a predetermined interval. For this reason, a high quality sheet with an IC tag can be easily manufactured.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 6 are views showing an embodiment of a manufacturing method and a manufacturing apparatus for a sheet with an IC tag according to the present invention.

  First, the IC-tagged sheet will be described with reference to FIG. The IC tag-attached sheet 1 has a base material sheet body 10 composed of a base material sheet 11 such as a packaging material, an antenna circuit 14 provided on the surface of the base material sheet 11, and a printed pattern 5. An IC chip 20 is provided on the sheet body 10.

  Among these, the IC chip 20 and the antenna circuit 14 constitute an IC tag.

  The IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces thereof, and is connected to the antenna circuit 14 on the base sheet body 10 via conductive bumps or anisotropic conductive adhesive material 18.

  The IC chip 20 is accurately transferred to a predetermined position of the base sheet 11 as described later, and is securely connected to the antenna circuit 14 provided in advance on the surface of the base sheet 11.

  Next, an apparatus for manufacturing a sheet with an IC tag will be described. The IC tag sheet manufacturing apparatus includes a plate cylinder 30 in which a plurality of concave portions 31 are formed at a predetermined interval on a surface 30 a and is rotatably arranged. The plate cylinder 30 is provided to face the plate cylinder 30. The pressure drum 32 that presses the base sheet 10 between the pressure drum, the pressure belt 35 that presses the base sheet 10 inserted between the plate cylinder 30 and the pressure drum 32, and the pressure belt 35 are stretched over. Crimping rolls 33 and 34 are provided.

  A pair of doctors 37 is provided above the plate cylinder 30, and a large number of IC chips 20 are filled between the pair of doctors 37, 37 above the plate cylinder 30.

  As shown in FIG. 1, the IC chip 20 is supplied from an IC chip supply nozzle (IC chip supply means) 37 a between a pair of doctors 37, 37 in the upper part of the plate cylinder 30.

  Next, the recess 31 of the plate cylinder 30 will be described in detail with reference to FIG. The concave portion 31 of the plate cylinder 30 is disposed so as to be lowered from the surface 30a of the plate cylinder 30, and the IC chip storage portion 31a in which the IC chip 20 is stored, and from the surface 30a of the plate cylinder 30 toward the IC chip storage portion 31a. And a flat inclined portion 31b extending.

  The recess 31 has a flat sector shape, and the IC chip storage portion 31a is located at the base end of the sector shape. The IC chip storage portion 31 a of the recess 31 is disposed behind the recess 31 in the rotation direction of the plate cylinder 30, and the sector shape of the recess 31 as a whole is symmetrical with respect to the axis L perpendicular to the plate cylinder 30. It has become.

  Here, FIG. 3A is a cross-sectional view showing the concave portion 31 of the plate cylinder 30, and FIG. 3B is a plan view thereof.

  The IC chip 20 disposed in the IC chip storage portion 31a of the recess 31 is orthogonal to the axis L, but the direction of the IC chip 20 in the IC chip storage portion 31a is set to the axis L as shown in FIG. Alternatively, it may be inclined by 45 °.

  Further, as shown in FIG. 6, the shape of the recess 31 in the IC chip storage portion 31a may be rectangular.

  Next, the manufacturing method of a sheet | seat with an IC tag is demonstrated.

  First, the printed pattern 5 is formed on the surface of the base material sheet 11 such as a packaging material (FIG. 4A), and then the antenna circuit 14 is formed on the surface of the base material sheet 11 (FIG. 4B). )). In this way, the base sheet body 10 is produced. The base sheet body 10 is supplied from a base sheet body supply unit (not shown), inserted between the plate cylinder 30 and the impression cylinder 32, and pressurized between the plate cylinder 30 and the impression cylinder 32. .

  During this time, a large number of IC chips 20 are supplied between the pair of doctors 37 and 37 above the plate cylinder 30 by the IC chip supply liquid nozzle 37a.

  The IC chip 20 supplied to the upper part of the plate cylinder 30 is filled in each recess 31 of the plate cylinder 30, and then the IC chip 20 in the recess 31 is pressed between the plate cylinder 30 and the impression cylinder 32. It is transferred to the substrate sheet 10 side (see FIG. 4C).

  Next, the filling operation to the recess 31 of the IC chip 20 will be described.

  The IC chip 20 supplied to the upper part of the plate cylinder 30 is scraped off by the doctor 37 as the plate cylinder 30 rotates as shown in FIGS. 3A and 3B, and is recessed from the surface 30 a of the plate cylinder 30. Is guided along the inclined portion 31b and led to the IC chip storage portion 31a. At this time, the recess 31 has a flat sector shape, and the IC chip storage portion 31 a is located at the base end of the sector shape, and is located behind the recess 31 in the rotation direction of the plate cylinder 30. Therefore, the IC chip 20 on the surface 30a of the plate cylinder 30 can be smoothly and accurately stored in the IC chip storage portion 31a through the inclined portion 31b.

  In addition, since a plurality of IC chip storage portions 31a of the recesses 31 provided on the surface 30a of the plate cylinder 30 are formed at a predetermined interval, the IC chips 20 are accurately spaced at a predetermined interval toward the base sheet 10 side. Transfer can be performed while positioning well.

  The IC chip 20 transferred to the base sheet 10 side is pressed by a pressure belt 35 that is stretched around the pressure rollers 33 and 34, and in some cases, is heated by a heater (not shown) near the pressure belt 35. Thereby, the IC chip 20 is firmly bonded to the antenna circuit 14 by the bumps or the anisotropic conductive adhesive film 18.

  Since the IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces, an additional antenna circuit 14a can be provided on the IC chip 20 by printing, transferring, or pasting (FIG. 4D). And FIG. 8).

  In this way, the IC tag-attached sheet 1 constituted by the base sheet 10 composed of the base sheet 11, the antenna circuit 14, and the printed pattern 5 and the IC chip 20 is obtained. The IC-tagged sheet 1 obtained in this way is designed to exchange data without contact with an external reader / writer.

  The IC tag-attached sheet 1 is then sent to a non-illustrated post-bonding main press-bonding section, where it is finally press-bonded, and the IC chip 20 is securely bonded to the base sheet 11 of the IC tag-attached sheet 1. The

  As described above, according to the present embodiment, it is possible to transfer a large number of IC chips 20 to the base sheet body 10 having the base sheet 11 while accurately positioning the chip chips 20 at a predetermined interval, and the quality is high. A sheet with an IC tag can be easily manufactured.

  Next, a modification of the present invention will be described with reference to FIGS.

  As shown in FIGS. 7A and 7B, when the base sheet body 10 includes the base sheet 11 and the pattern 5 and does not include the antenna circuit 14, it is necessary to connect the IC chip 20 to the antenna circuit 14. Absent. In this case, the IC chip 20 has an antenna function instead of the antenna circuit. At this time, as shown in FIGS. 7 (a) and 7 (b), the base sheet body 10 includes a base sheet 11 and a pattern 5 (FIG. 7 (a)). The IC chip 20 is transferred from the recess 31 of the plate cylinder 30 and mounted.

  Further, as shown in FIG. 8, after connecting the electrode 21 on the bottom surface of the IC chip 20 and the antenna circuit 14 of the base sheet 10, an additional antenna circuit 14 a is provided on the IC chip 20 by printing or transferring. An additional antenna circuit 14 a may be connected to the electrode 21 on the upper surface of the IC chip 20. In this case, the electrodes 21 and 21 of the IC chip 20 are bonded to the antenna circuit 14 and the additional antenna circuit 14a via the anisotropic conductive adhesive materials 18 and 18, respectively.

Schematic which shows the manufacturing method and manufacturing apparatus of a sheet | seat with an IC tag by this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in a base material sheet body. The figure which shows the recessed part of a printing cylinder. The figure which shows the state which transfers and mounts an IC chip on a base material sheet body. The perspective view which shows the recessed part of a printing cylinder. The perspective view which shows the recessed part of a printing cylinder. The figure which shows the state which transcribe | transfers and mounts an IC chip on the base material sheet | seat body which shows the modification of this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in the base material sheet | seat body which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet | seat 10 with an IC tag Base material body 11 Base material sheet 14 Antenna circuit 14a Additional antenna circuit 18 Anisotropic conductive adhesive film 20 IC chip 21 Electrode 30 Plate cylinder 31 Recessed part 31a IC chip storage part 31b Inclined part 32 Impression cylinder 33 , 34 Crimp roll 35 Crimp belt 37 Doctor 37a IC chip supply nozzle

Claims (5)

Preparing a base sheet body having at least a base sheet;
Supplying an IC chip to the surface of the plate cylinder having a recess formed on the surface, and filling the IC chip into the recess;
Inserting the base sheet body between the plate cylinder and the impression cylinder arranged to face the plate cylinder, and transferring the IC chip filled in the concave portion of the plate cylinder to the base sheet body. A method for producing a sheet with an IC tag, comprising:   The method for producing a sheet with an IC tag according to claim 1, wherein the base sheet body has an antenna circuit provided on the base sheet. A rotatable printing cylinder with a recess,
An impression cylinder that is disposed to face the plate cylinder and pressurizes the base sheet body having at least the base sheet between the plate cylinder;
IC chip supply means for supplying an IC chip to the surface of the plate cylinder,
The concave portion has an IC chip storage portion that is arranged to descend from the surface of the plate cylinder and stores an IC chip, and an inclined portion that extends from the surface of the plate cylinder toward the IC chip storage portion,
The IC chip supplied to the surface of the plate cylinder is guided and stored from the inclined portion of the recess to the IC chip storage portion, and the IC chip in the IC chip storage portion of the recess is transferred to the base sheet body. IC tag sheet manufacturing equipment.   4. The apparatus for producing a sheet with an IC tag according to claim 3, wherein the recess has a flat sector shape, and the IC chip storage portion is located at the base end of the sector shape.   5. The apparatus for manufacturing a sheet with an IC tag according to claim 4, wherein the IC chip storage portion of the recess is located behind the recess in the rotation direction of the plate cylinder.

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