JP2005141567A - Ic card and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contactless IC card and a manufacturing method thereof that can improve card quality by preventing the formation of bubbles about an IC chip. <P>SOLUTION: The contactless IC card 20, in which a first facing sheet material 21 and a second facing sheet material 22 are laminated via an adhesive material layer 23 of cured adhesives 23A and 23B, and a circuit board 24 provided with antenna wiring and the IC chip 25 mounted thereon are embedded in the adhesive material layer 23, has vents 30 about the portion of the circuit board 24 mounted with the IC chip 25. When the first facing sheet material 21 is stacked, air G present about the chip-mounted portion can be evacuated to the back side of the circuit board 24 via the vents 30 to prevent the formation of bubbles about the chip-mounted portion after the sheet lamination. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides a circuit board in which a first sheet material and a second sheet material are bonded together through an adhesive material layer obtained by curing an adhesive, and an antenna wiring is formed on the adhesive material layer. More particularly, the present invention relates to a non-contact IC card capable of preventing the generation of bubbles during sheet lamination and a method for manufacturing the same.

  Non-contact IC cards are public telephones, mainly for transportation applications such as railway ticket gates and automatic highway toll collection systems, because they can be exchanged by simply placing the card on a card reader or holding it over the card reader. It has been applied in various fields such as prepaid cards, electronic payments, security systems, and product management systems in factories.

  The non-contact IC card is configured by sandwiching an antenna module mounted with a communication antenna and a semiconductor chip (IC chip) between card configuration sheets. As a configuration example of the antenna module, a metal foil attached on an insulating film material is patterned into a predetermined shape to form a conductor pattern, and a semiconductor chip is mounted thereon.

  In this type of non-contact IC card, as shown in FIGS. 4A to 4C, the first exterior sheet material 11 and the second exterior sheet material 12 cure the adhesive 13A and the adhesive 13B. A structure having a structure in which a circuit board 14 on which antenna wiring is formed and an IC chip 15 mounted on the circuit board 14 is bonded to the adhesive material layer 13 is known.

  The IC chip 15 on the circuit board 14 is sealed with a sealing resin 16A, and the strength of the IC chip 15 is improved by sticking a metal reinforcing plate 17A on the sealing layer. Note that a reinforcing plate 17B is attached to the chip non-mounting surface side of the circuit board 14 via a sealing resin 16B so as to sandwich the IC chip 15 as necessary.

  The non-contact IC card 10 having such a structure is made into a product by punching out a predetermined card size from a sheet laminate obtained by curing the adhesive material layer 13.

Japanese Patent Laid-Open No. 62-134296 JP-A-2-235699 JP 2002-216090 A

  However, in the configuration of the conventional non-contact IC card 10, when the first exterior sheet material 11 is bonded to the chip mounting surface of the circuit board 14 via the adhesive 3 </ b> A, bubbles 18 are formed around the mounting portion of the IC chip 15. There is a problem that occurs. In particular, the mounting portion of the IC chip 15 causes a large step on the circuit board 14, and the air G around the chip mounting portion is difficult to escape to the outside when the adhesive 3A is applied.

  If bubbles 18 are present in the adhesive material layer 3, the flatness of the surface of the exterior sheet materials 11 and 12 is impaired. In particular, when the surface of the exterior sheet material is composed of a rewritable layer, a spacing loss is generated between the thermal head and a card appearance defect such as missing printing is induced.

  In addition, the presence of the bubbles 18 causes the adhesion failure of the exterior sheet material 11, and there is a problem that the card quality is impaired due to the deterioration of the peel strength.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a non-contact IC card and a method for manufacturing the same that can prevent the generation of bubbles in the peripheral portion of the IC chip and improve the card quality.

  In solving the above problems, the non-contact IC card of the present invention is characterized in that a deaeration hole is provided around the chip mounting portion of the circuit board.

  The non-contact IC card manufacturing method of the present invention includes a step of mounting an IC chip on a circuit board having a deaeration hole formed around the IC chip mounting site, and an adhesive on the IC chip mounting surface of the circuit board. A step of bonding the first sheet material, and a step of bonding the second sheet material to the other surface of the circuit board via an adhesive.

  With this configuration, when the first sheet material is bonded to the chip mounting surface of the circuit board via an adhesive, the air remaining around the IC chip is transferred to the chip non-mounting surface side of the circuit board via the deaeration hole. It is possible to escape, and it is possible to prevent the generation of bubbles at the periphery of the chip.

  Preferably, the IC chip is sealed with a sealing resin on the circuit board, and a reinforcing plate is attached to the upper part thereof, and the deaeration holes are formed directly on the sealing resin sealing the IC chip. Provided in the outward position.

  A configuration in which a plurality of deaeration holes according to the present invention are arranged so as to surround the chip mounting portion is preferable from the viewpoint of efficiently eliminating air remaining in the periphery of the chip. Further, the size and shape of the deaeration holes are not particularly limited, and can be appropriately changed according to the type of adhesive used (viscosity, etc.), the number of arrangement of deaeration holes, the arrangement location, and the like.

  As described above, according to the present invention, since a non-contact IC card can be configured without generating bubbles in the adhesive material layer, the flatness of the surface of the exterior sheet material is improved and the printability is improved. In addition, deterioration of the peel strength can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a non-contact IC card (hereinafter referred to as “IC card”) according to an embodiment of the present invention.

  In the IC card 20 of the present embodiment, a first exterior sheet material 21 and a second exterior sheet material 22 are bonded together via an adhesive material layer 23, and antenna wiring is formed on the adhesive material layer 23. The circuit board 24 and the IC chip 25 mounted on the circuit board 24 are built in.

  The first and second exterior sheet materials 21 and 22 constitute the front and back surfaces of the IC card 20, for example, PET (polyethylene terephthalate), PBT (polybutyl terephthalate), PEG (polyethylene glycol), and oriented PET. PC-PBT (polycarbonate and polybutyl terephthalate) and other organic films.

  The adhesive material layer 23 is formed by curing an adhesive, and seals the circuit board 24 and simultaneously bonds the first and second exterior sheet materials 21 and 22 together. As the adhesive, a known heat reaction curable resin, ultraviolet curable resin, or the like is used.

  In the present embodiment, a heat reaction curable resin is used as an adhesive constituting the adhesive material layer 23. Specifically, phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, acrylic reaction resin, mixture of polyester resin and polyisocyanate prepolymer, mixture of polyester polyol and polyisocyanate, urethane and polyisocyanate Examples thereof include a mixture with an isocyanate.

  Among these, a two-component epoxy adhesive is used in the present embodiment. The two-component epoxy adhesive generally refers to an adhesive that is bonded by a curing reaction by mixing an epoxy group-containing compound (main agent) with a curing agent containing amines or acid anhydrides. .

  Examples of the compound containing an epoxy group include bisphenol A type, hydrogenated bisphenol A type, novolac type, bisphenol F type, brominated epoxy resin, cycloaliphatic epoxy resin, glycidylamine resin, glycidyl ester resin, and the like. .

  On the other hand, curing agents containing amines and acid anhydrides include aliphatic primary and secondary amines (triethylenetetramine, dipropyltriamine, etc.), aliphatic tertiary amines (triethanolamine, aliphatic primary and primary amines). Secondary amine and epoxy reaction products), aliphatic polyamines (diethylenetriamine, tetraethylenepentamine, bis (hexamethylene) triamine, etc.), aromatic amines (metaphenylenediamine, diaminodiphenylmethane, diaminophenylsulfone, etc.), amines Examples include adducts (reaction products of polyamines and epoxy groups, etc.), aromatic acid anhydrides (trimellitic anhydride, pyromellitic anhydride, etc.), dicyandiamide and derivatives thereof, and imidazoles.

  Next, FIG. 2 is a plan view showing a configuration example of the circuit board 24.

  The circuit board 24 is a double-sided circuit board in which conductor patterns 27 and 28 made of a metal such as aluminum or copper are formed on the front and back surfaces of an insulating film material 26 as an insulating layer, and an IC chip 25 is formed on the surface. It is installed.

  The insulating film material 26 can be composed of a resin film such as PEN (polyethylene naphthalate), PET (polyethylene terephthalate), or PI (polyimide).

  The conductor pattern 27 formed on the surface of the insulating film material 26 is composed of a spiral antenna pattern 27A serving as an antenna wiring and a comb-like electrode pattern 27B constituting one electrode of a tuning capacitor. Has been. On the other hand, the conductor pattern 28 formed on the back surface of the insulating film material 26 includes a bridge pattern 28A for routing the outer peripheral side end of the antenna pattern 27A to the inner peripheral side, and an electrode constituting the other electrode of the tuning capacitor Pattern 28B.

  The inner peripheral end of the antenna pattern 27A and the electrode pattern 27B are connected to one terminal of the IC chip 25, and the outer peripheral end of the antenna pattern 27A is connected to the bridge pattern 28A via the interlayer connection 29a. Yes. The bridge pattern 28A and the electrode pattern 28B are connected to the other terminal of the IC chip 25 via the interlayer connection portion 29b.

  The IC chip 25 is sealed with a sealing resin 32A as shown in FIG. 1, and the strength is improved by sticking a metal reinforcing plate 33A on the sealing layer. ing. In addition, a reinforcing plate 33B is attached to the non-chip mounting surface side of the circuit board 24 via a sealing resin 32B so as to sandwich the IC chip 25.

  At this time, the step between the surface of the insulating film material 26 and the reinforcing plate 33A on the upper surface of the IC chip 25 is, for example, about 350 μm. Therefore, if the adhesive is applied to the first exterior sheet material 21 and the first exterior sheet material 21 is bonded, bubbles may be generated around the chip mounting portion of the circuit board 24 and the flatness of the card surface may be impaired.

  Therefore, in the present embodiment, the deaeration holes 30 are provided around the chip mounting portion of the circuit board 24. This prevents the generation of bubbles due to the stepped portion of the chip mounting portion of the circuit board 24 and ensures the flatness of the card surface.

  The deaeration holes 30 are provided to allow air accumulated at the step of the chip mounting portion on the surface of the circuit board 24 to escape to the back side of the circuit board 24. The size, shape, number of formations, and location of the deaeration holes 30 Etc. are not particularly limited.

  In the present embodiment, a plurality (four in the figure) of the deaeration holes 30 are arranged so as to surround the chip mounting portion of the circuit board 24. Thereby, the efficient deaeration effect | action of the air around a chip | tip mounting site | part can be obtained. In addition, the formation space | interval of a deaeration hole is not specifically limited, An equal interval or an unequal interval may be sufficient.

  The size of the deaeration hole 30 can be selected according to the wiring mode of the conductor patterns 27 and 28 on the circuit board 24. However, the larger the hole area, the higher the deaeration effect. In the present embodiment, the diameter is 0.5 mm to 2 mm. It should be noted that if the deaeration holes are larger than necessary, the strength of the circuit board 24 is reduced.

  The shape of the deaeration hole 30 may be any of a circle, an ellipse, a long hole, a rectangle, and the like. In the present embodiment, the deaeration holes 30 are formed in an elliptical shape.

  The formation mode of these deaeration holes 30 is appropriately selected according to the type of adhesive (particularly viscosity) constituting the adhesive material layer 23 and the positions where the conductor patterns 27 and 28 are formed.

  Further, the deaeration hole 30 is located on the surface of the circuit board 24 at a position corresponding to the skirt portion of the ridge line of the sealing resin 32A and the sealing resin 32B for sealing the IC chip 25, that is, outside the reinforcing plate 33A. On the other side, it is provided at a position directly outside the sealing resins 32A and 32B. This is because this range is the region where air is most likely to accumulate.

  For example, the chip size of the IC chip 25 is about 4 mm square, the diameter of the reinforcing plate 33A (33B) is about 7 mm, and the periphery of the sealing resin 32A (32B) is about 1 mm outward from the periphery of the reinforcing plate 33A (33B). When formed so as to be extended, the deaeration hole 30 is preferably formed at a position of 5 mm to 7 mm from the mounting center point of the IC chip 25.

  As described above, according to the IC card 20 of the present embodiment, air can be efficiently deaerated at the stepped portion of the chip mounting portion of the circuit board 24, and the stepped portion of the chip mounting portion of the circuit board 24 can be formed. It is possible to prevent the generation of bubbles due to this and to ensure the flatness of the card surface.

  Next, a method for manufacturing the IC card 20 of the present embodiment configured as described above will be described. 3A to 3C are process cross-sectional views illustrating the manufacturing process of the IC card 20.

  First, the circuit board 24 in which the deaeration holes 30 are formed is manufactured. Then, after the IC chip 25 is mounted on the chip mounting portion of the circuit board 24, the pair of reinforcing plates 33A and 33B are attached via the sealing resins 32A and 32B so as to sandwich the IC chip 25, respectively.

  Next, as shown in FIG. 3A, an adhesive 23A is applied to the front surface side (chip mounting surface side) of the circuit board 24, and the first exterior sheet material 21 is bonded thereon.

  At this time, the air G existing around the chip mounting portion is discharged to the back side of the substrate through the deaeration holes 30 of the circuit substrate 24. Note that the adhesive 30 </ b> A may enter or be filled in the deaeration holes 30.

  Next, as shown in FIG. 3B, an adhesive 30B having the same configuration as the adhesive 30A is applied to the back side (chip non-mounting surface) of the circuit board 24, and the second exterior sheet material 22 is bonded. Thereafter, the laminated body of the first and second exterior sheet materials 21 and 22 is supplied between the pressure rolls, and at the same time, the adhesives 30A and 30B are subjected to a heat curing reaction. Then, the IC card 20 of the present invention is manufactured by punching into a single card size (FIG. 3C).

  According to the present embodiment, when the first exterior sheet material 21 is bonded, it is possible to prevent the occurrence of air accumulation around the chip mounting portion of the circuit board 24, so that air bubbles around the chip mounting portion after sheet stacking can be prevented. Generation | occurrence | production can be avoided and the surface flatness of IC card 20 can be improved by this. As a result, even if the exterior sheet materials 21 and 22 are made of a rewritable sheet, the occurrence of printing defects such as print leakage can be suppressed and the card appearance quality can be improved.

  According to the experiments by the present inventors, while the conventional IC card had an irregularity on the card surface of about 100 μm, many IC cards of the present invention in which the deaeration holes 30 having the above-described configuration were formed were manufactured. As a result of extracting 15 samples from the sample and measuring the amount of irregularities on the card surface, it was confirmed that it was able to relax to about 47 μm to 56 μm. For measuring the unevenness, a non-contact type three-dimensional measuring instrument was used for both the conventional and the IC cards of the present invention.

  In addition, according to the present embodiment, since the generation of air bubbles inside the card can be avoided, the deterioration of the peel strength of the first exterior sheet material 21 can be prevented, thereby ensuring the strength reliability of the card. .

  The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

  For example, in the above embodiment, the deaeration holes 30 are formed only around the chip mounting portion of the circuit board 24. In addition to this, the deaeration holes may be formed in other portions on the circuit board. Good. As a result, it is possible to prevent the generation of bubbles not only in the vicinity of the chip mounting part but also in other parts, and to prevent deterioration of the card surface flatness other than in the chip mounting part.

It is a schematic sectional side view of the non-contact IC card 20 by embodiment of this invention. 2 is a schematic plan view showing a configuration example of a circuit board 24 constituting the non-contact IC card 20. FIG. 5 is a process cross-sectional view illustrating a method for manufacturing the non-contact IC card 20. FIG. It is process sectional drawing explaining the structure of the conventional non-contact IC card 10, and its manufacturing method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 20 ... Non-contact IC card, 21 ... 1st exterior sheet material, 22 ... 2nd exterior sheet material, 23 ... Adhesive material layer, 23A, 23B ... Adhesive, 24 ... Circuit board, 25 ... IC chip, 26 ... Insulating film material, 27, 28 ... conductor pattern, 27A ... antenna pattern, 30 ... deaeration hole, 32A, 32B ... sealing resin, 33A, 33B ... reinforcing plate.

Claims (4)

The first sheet material and the second sheet material are bonded together via an adhesive material layer formed by curing an adhesive, and the circuit board on which antenna wiring is formed is mounted on the adhesive material layer. In a contactless IC card with a built-in IC chip,
A non-contact IC card, wherein a deaeration hole is provided around the IC chip mounting portion of the circuit board. The non-contact IC card according to claim 1, wherein a plurality of the deaeration holes are arranged so as to surround the IC chip mounting portion. The IC chip is sealed with a sealing resin on the circuit board, and a reinforcing plate is attached to the top thereof.
The non-contact IC card according to claim 1, wherein the deaeration hole is provided at a position directly outside a sealing resin that seals the IC chip in a plane of the circuit board. The first sheet material and the second sheet material are bonded together via an adhesive material layer formed by curing an adhesive, and the circuit board on which antenna wiring is formed is mounted on the adhesive material layer. In a method of manufacturing a non-contact IC card with a built-in IC chip,
Mounting the IC chip on a circuit board having deaeration holes formed around the IC chip mounting site;
Bonding the first sheet material to the IC chip mounting surface of the circuit board via the adhesive;
And a step of bonding the second sheet material to the other surface of the circuit board via the adhesive.

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