JP2005135967A - Device and method for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that operation efficiency of a device is deteriorated since an operator periodically stops the device and manually moves a grinding wheel 4A and a polishing file, for preventing an end on the tip face of a thermo-compression bonding chip 1A from being irregularly cut at a step and from adversely affecting a thermo-compression bonding processing, since a use part is cut and an irregular step is formed with a part which is not used in the grinding stone 4A and the polishing file, in a manufacturing device and a manufacturing method of an electronic component, with which an outer electrode of the electronic component, a terminal of a winding or a terminal of a lead line are thermo-compression-bonded by the thermo-compression bonding chip and the file. <P>SOLUTION: A polishing mechanism 13 has a driving roller 13F and a winding roller 13C for moving sandpaper 13A while a thermo-compression bonding head 12 is operated and changing a polishing position as moving mechanisms. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method, and more specifically, thermocompression-treats an external electrode of an electronic component and a terminal of a winding or a terminal of a lead wire with a thermocompression-bonding chip or a rivet. The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method.

  As a conventional manufacturing apparatus of this type of electronic component, for example, an apparatus shown in FIGS. 4A and 4B is known. As shown in FIGS. 1A and 1B, the electronic component manufacturing apparatus includes a thermocompression bonding head 1 that can move in the vertical direction and the horizontal direction, and an electronic component (for example, a coiled coil component) 2. A winding chuck 3 to be held (see (b) in the figure) and a polishing mechanism 4 (see (a) in the figure) adjacent to the winding chuck 3 are provided. The wire coil component 2 is subjected to thermocompression treatment by the thermocompression bonding head 1.

  Thus, when the winding coil component 2 is subjected to the thermocompression bonding process, the winding coil component 2 in which the winding 2B is applied to the core 2A in the previous process is held by the winding chuck 3 while the winding coil component 2 is held. The thermocompression treatment is performed by thermocompression bonding the external electrode 2C formed on the flanges at both ends of the coil component 2 and the end 2D of the winding 2B with the thermocompression bonding chip 1A of the thermocompression bonding head 1 respectively. When this thermocompression treatment is repeated a predetermined number of times, the tip surface of the thermocompression bonding chip 1A is soiled by the insulating film of the winding 2B, and the heat transfer efficiency from the tip surface to the external electrode 2C and the winding terminal 2D is reduced. May cause poor crimping treatment. Therefore, the thermocompression bonding head 1 moves from the winding chuck 3 to the polishing mechanism 4 every predetermined period, and the front end surface of the thermocompression bonding tip 1A is reciprocated in a state of being pressed against the grindstone 4A of the polishing mechanism 4 to move the front end surface. Cleaning. In FIG. 4A, 1B is a power supply electrode, 1C is a heat dissipation block, and 4B is a grindstone holder.

  By the way, when performing the thermocompression treatment of the coiled coil component 2, the quality of the coiled coil component 2 is greatly affected by the parallelism between the coiled coil component 2 and the tip surface of the thermocompression bonding chip 1A. If the parallelism between the two is not obtained, an insulating film may remain on at least one of the winding terminals 2D of the wound coil component 2, or a connection failure between the external electrode 2C and the winding terminal 2D may occur. There is. One possible cause is cleaning of the tip surface of the thermocompression bonding chip 1A. For cleaning, a commercially available grindstone 4A is used. However, since such a grindstone 4A has poor thickness accuracy and inferior flatness of the polished surface, the thickness of the grindstone 4A is accurately measured at the time of use. A high-quality grindstone 4A is selected and used.

  Patent Document 1 discloses a technique for cleaning a soldering iron tip of a soldering apparatus with a polishing file. In this case, the tip of the soldering iron is in contact with the lead while being heated to a high temperature, causing uneven wear, and flux solids adhere to the tip, so the tip is polished. Polished with a file.

JP 2000-356650 A

  However, when the grindstone 4A and the polishing file are cleaned at a certain number of times in the same location, the irregularity step is formed between the grindstone 4A and the used portion of the polishing file. For this reason, there is a problem that the end of the tip surface of the thermocompression bonding chip 1A is irregularly cut at the stepped portion and adversely affects the thermocompression treatment. In order to prevent such an adverse effect, the operator periodically stops the apparatus and manually moves the grindstone 4A and the grinding file to change the polishing position. In this case, the operator changes the grindstone 4A. In addition, the apparatus must be stopped each time the polishing file is moved, and there is a problem that the operating rate of the apparatus is lowered.

  The present invention has been made in order to solve the above-described problems, and provides an electronic component manufacturing apparatus and an electronic component manufacturing method that can always perform satisfactory thermocompression bonding and can increase the operating rate of equipment. It is intended to provide.

  The electronic component manufacturing apparatus according to claim 1 of the present invention is a movable thermocompression treatment that performs thermocompression treatment on a holding mechanism that holds the electronic component and an external electrode of the electronic component that is held by the holding mechanism. And a polishing mechanism having a polishing member for polishing a contact surface of the thermocompression bonding jig with the electronic component, and the polishing mechanism moves the polishing member during operation of the thermocompression bonding jig. And a moving mechanism for changing the polishing position.

  An electronic component manufacturing apparatus according to a second aspect of the present invention is the electronic component manufacturing apparatus according to the first aspect, wherein the polishing mechanism has a cover member that covers the polishing member.

  According to a third aspect of the present invention, there is provided the electronic component manufacturing apparatus according to the first or second aspect, wherein the polishing mechanism has means for sucking polishing debris. It is.

  According to a fourth aspect of the present invention, there is provided the electronic component manufacturing apparatus according to any one of the first to third aspects, wherein the abrasive member is made of abrasive paper. Is.

  According to a fifth aspect of the present invention, in the electronic component manufacturing apparatus according to the fourth aspect, the moving mechanism includes a roller that moves the polishing paper and the polishing that moves through the roller. And a take-up roller for winding paper.

  Moreover, the manufacturing method of the electronic component of Claim 6 of this invention is a thermocompression-bonding process to the external electrode of an electronic component using the electronic component manufacturing apparatus of any one of Claims 1-5. A method of manufacturing an electronic component, the step of thermocompression-bonding the external electrode of the electronic component using a thermocompression-bonding jig, the step of moving the thermocompression-bonding jig to a polishing mechanism, and the polishing of the polishing mechanism It comprises a step of polishing a contact surface of the thermocompression bonding jig with the electronic component by a member and a step of moving the polishing member during operation of the thermocompression bonding jig.

  According to a seventh aspect of the present invention, there is provided a method for manufacturing an electronic component according to the sixth aspect of the present invention, further comprising a step of removing polishing debris.

  According to the first to seventh aspects of the present invention, an electronic component manufacturing apparatus and an electronic device that can always perform a good thermocompression-bonding process and can prevent a reduction in operating rate of equipment. A method for manufacturing a component can be provided.

  In the present embodiment, an electronic component manufacturing apparatus and an electronic component manufacturing method according to the present invention will be described based on the respective examples shown in FIGS. 1 is a perspective view showing an embodiment of an electronic component manufacturing apparatus of the present invention, FIG. 2 is a side view showing a part of the electronic component manufacturing apparatus of the present invention, and FIG. FIG. 2 is an essential part cross-sectional view for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 1.

  The electronic component manufacturing apparatus 10 of the present embodiment, as shown in FIGS. 1 and 2, for example, holds the electronic component (for example, a coiled coil component) (see FIG. 3) 50 from the core level so as to be movable. A contact surface between the mechanism (for example, a winding chuck) 11, a thermocompression bonding process (for example, a thermocompression bonding head) 12 by thermocompression bonding of the winding coil component 50, and the winding coil component 50 of the thermocompression bonding head 12 ( (Hereinafter referred to as “tip surface”) and a polishing mechanism 13 for polishing, and the thermocompression bonding head 12 moves between the winding chuck 11 and the polishing mechanism 13 under the control of a control device (not shown). It is configured to perform a predetermined work at each place. The wound coil component 50 includes a core made of alumina or ferrite, a winding wound around the core portion of the core, and external electrodes formed on both flange portions of the core. The external electrodes located at both flange portions and both ends of the winding are subjected to a thermocompression treatment to become a final product.

  In the winding process, which is a pre-process of the thermocompression bonding process, the cores supplied one by one from the parts feeder are held by the winding chuck 11, and then the winding is wound around the core. For example, the winding method includes a spindle method and a flyer method. In the case of the spindle system, the winding is wound around the core while the winding chuck 11 rotates through the spindle. In the case of the flyer system, the winding is rotated around the core gripped by the winding chuck 11 to wind the winding around the core. When the winding is wound around the core, the winding chuck 11 moves from the winding process to the thermocompression bonding head 12 arranged in the thermocompression bonding process of the subsequent process. At this stage, the end of the winding and the external electrodes of both flange portions of the core are not connected and are not subjected to thermocompression treatment.

  Thus, as shown in FIGS. 1 and 2, the thermocompression bonding head 12 has a thermocompression bonding tip 12A, a power feeding electrode 12B, and a heat dissipation block 12C, and is horizontally disposed through a drive mechanism (not shown). The winding coil component 50 is thermocompression-bonded in the winding chuck 11 by moving in the direction and the vertical direction. The tip surface of the thermocompression bonding chip 12A is formed as a flat surface and comes into contact with the external electrodes at both ends of the winding coil component 50 held by the winding chuck 11 with equal pressing force. When the thermocompression bonding by the thermocompression bonding head 12 is repeated, wrinkles such as an insulating film of the winding adhere to the front end surface of the thermocompression bonding tip 12A and are contaminated, and the front end surface and the external electrode of the winding coil component 50 In other words, the heat transfer efficiency from the distal end surface of the thermocompression bonding tip 12A to the external electrode and the end of the winding decreases. Therefore, the thermocompression bonding head 12A moves from the winding chuck 11 side to the polishing mechanism 13 in order to polish (clean) the tip surface of the thermocompression bonding chip 12A. The polishing time is calculated based on the number of wound coil components 50 to be processed and set in advance in the control device.

  As shown in FIGS. 1 and 2, the polishing mechanism 13 includes a polishing paper roll 13B wound with a polishing paper 13A, a take-up roller 13C that winds up the polishing paper 13A from the polishing paper roll 13B, and both of these 13B, And an abrasive paper holder 13D that is disposed approximately in the middle of 13C and holds the abrasive paper 13A horizontally. A guide roller 13E and a driving roller 13F for feeding the abrasive paper 13A to the upper surface of the abrasive paper holder 13D are disposed on the upstream side and the downstream side of the abrasive paper holder 13D, respectively, and these rollers 13E are provided on the back side of the abrasive paper holder 13A. The plates 13G and 13H are arranged in elastic contact with the 13F. These plates 13G and 13H are in elastic contact with the guide roller 13E and the drive roller 13F via respective elastic mechanisms 13I and 13J.

  As shown in FIGS. 1 and 2, a driving motor 13L is connected to the driving roller 13F via an endless belt 13K, and the winding roller 13C is connected to the driving roller 13F via an endless belt 13M. Are connected. Accordingly, the drive roller 13F and the take-up roller 13C are simultaneously rotated via the drive motor 13M, and the abrasive paper 13A is taken up from the abrasive paper roller 13B to the take-up roller 13C.

  Since a thin abrasive layer is formed on the surface of the polishing paper 13A, the polishing ability decreases when polishing is repeated. Therefore, the drive motor 13M is periodically driven under the control of the control device to wind the polishing paper 13A around the take-up roller 13C and automatically move the polishing position of the polishing paper 13A. Since the timing of the movement varies depending on the degree of contamination of the tip surface of the thermocompression bonding tip 12A, it can be set as necessary. In this case, for example, the polishing position may be changed for each polishing. However, since the amount of consumption of the polishing paper 13A increases, it is preferable to polish a plurality of times at the same polishing position. Further, since the abrasive paper 13A has a thin abrasive layer, there is no formation of unevenness such as a step to scrape the end of the tip surface of the thermocompression bonding tip 12A as in the case of a grindstone or a polishing file, The parallelism between the tip surface and the coiled coil component 50 can always be maintained.

  As shown in FIGS. 1 and 2, a cover 13N is attached to the polishing paper holder 13D so as to be openable and closable, and the cover 13N covers the polishing paper 13A so that polishing debris does not scatter around. A long window 13O extending in the width direction is formed in the cover 13N, and the front end surface of the thermocompression bonding head 13 enters the cover 13N from the long window 13O and presses against the polishing paper 13A.

  As shown in FIGS. 2 and 3, the polishing paper holder 13D is formed with an exhaust passage 13P penetrating the polishing paper holder 13D, and a suction device (not shown) is connected to the exhaust passage 13P via an exhaust pipe 13Q. Is connected. Accordingly, during polishing, the suction device is automatically driven under the control of the control device, and the polishing debris generated in the cover 13N is discharged through the exhaust passage 13P and the exhaust pipe 13Q as shown by the arrows in FIGS. I have to do it.

  Next, an embodiment of a method for manufacturing an electronic component of the present invention will be described with reference to FIGS. First, the electronic component manufacturing apparatus 10 is operated under the control of the control device, and the winding chuck 11 grips the coiled coil component 50 before the thermocompression treatment from the winding process of the preceding process. Move to the position where it was placed. At this time, the unprocessed winding coil component 50 is held by the winding chuck 11 with the external electrodes and the ends of the windings formed on the bottom surfaces (mounting surfaces) of both flange portions of the core facing upward. .

  Next, the thermocompression bonding head 12 is driven under the control of the control device, moves in the horizontal direction from the initial position toward the winding chuck 11, and the tip surface of the thermocompression bonding tip 12 </ b> A is an external electrode of the winding coil component 50. Stops at the position facing. Subsequently, when the thermocompression bonding head 12 is lowered and the thermocompression bonding tip 12A presses the winding coil component 50 with a preset pressure, the outer electrode and winding of the winding coil component 50 are wound by the tip surface of the thermocompression bonding tip 12A. The end of the wire is heated to a predetermined temperature and both are thermocompression bonded. After the thermocompression bonding, the thermocompression bonding head 12 rises from the winding coil component 50, then moves in the horizontal direction, retreats from the winding chuck 11 to a predetermined position, and waits for the subsequent winding coil component 50. When the subsequent winding coil component 50 is held in the winding chuck 11, the thermocompression bonding head 12 repeats the above operation to thermocompression bond the external electrode of the winding coil component 50 and the end of the winding.

  When the polishing time of the thermocompression bonding head 12 is reached, the thermocompression bonding head 12 automatically moves in the horizontal direction from the winding chuck 11 side toward the polishing mechanism 13 as shown in FIG. After reaching directly above the long window 13O of the cover 13N of the polishing mechanism 13, the thermocompression bonding head 12 descends, the tip surface of the thermocompression bonding tip 12A enters the cover 13N from the long window 13O, and the polishing paper 13A and After being brought into pressure contact with a predetermined pressure, the thermocompression bonding tip 12A is reciprocated in the long window 13O, and the leading end surface is polished by the polishing paper 13A. The polished thermocompression bonding head 12 moves from the polishing mechanism 13 to the winding chuck 11 side and restarts the thermocompression bonding processing of the wound coil component 50.

  On the other hand, if the polishing of the front end surface of the thermocompression bonding tip 12A is repeated a plurality of times, the abrasive particles are peeled off from the polishing paper 13A every time polishing is performed. However, the abrasive layer that forms the polished surface is extremely thin, so even if the abrasive grains peel and the polishing ability decreases, it does not form a step with other unused abrasive layers, but thermocompression bonding There is no risk of scraping off the end portion of the tip surface of the chip 12A, and the tip surface can always be maintained as a flat surface. Accordingly, the parallelism between the tip surface of the thermocompression bonding chip 12A and the external electrode of the coiled coil component 50 can be always maintained, and the external electrode of the coiled coil component 50 and the end of the coil are always accurately and reliably. Can be thermocompression-bonded.

  When the polishing ability of the polishing paper 13A decreases, the thermocompression bonding head 12 moves from the polishing mechanism 13 to the winding chuck 11 side under the control of the control device, and during this time, the driving roller 13F and the winding via the driving motor 13L. The take-up roller 13C is automatically driven to take up a fixed amount of the abrasive paper 13A from the abrasive paper roller 13B, and moves the abrasive surface located in the long window 13O of the cover 13N to update the abrasive surface. Accordingly, the polishing surface of the polishing paper 13A can be renewed without stopping the electronic component manufacturing apparatus 10, and the operating rate of the electronic component manufacturing apparatus 10 is markedly higher than in the conventional case using a grindstone. Can be increased.

  As described above, according to the present embodiment, the polishing mechanism 13 moves the polishing paper 13A while the thermocompression bonding head 12 moves from the polishing mechanism 13 to the winding chuck 11 side, and the polishing surface (polishing position). ) Is automatically changed, the electronic component manufacturing apparatus 10 can be operated even during the movement of the polishing paper 13A to increase the operating rate, and the polishing paper 13A. Since no step is formed in the abrasive layer, the end portion of the tip surface of the thermocompression bonding tip 12A is not damaged, and the parallelism between the tip surface and the external electrode of the wound coil component 50 can always be maintained. As a result, the external electrode and the end of the winding can be thermocompression-bonded accurately and reliably.

  Further, according to the present embodiment, the polishing mechanism 13 has the cover 13N that covers the polishing paper 13A, so that polishing scraps generated at the time of polishing do not scatter around and the winding coil component 50 of the winding chuck 11 is formed. There is no risk of contamination by polishing debris. Further, since the polishing mechanism 13 has means for sucking the polishing scraps, the polishing scraps are removed from the polishing paper 13A to keep the polishing paper 13A always clean, and the tip of the thermocompression bonding tip 12A is held by the polishing scraps. There is no risk of contamination.

  In addition, this invention is not restrict | limited at all to the said embodiment, The design change of each component of this invention can be suitably carried out as needed. For example, in the embodiment described above, the winding chuck 11 grips only one winding coil component 50, but a plurality of winding coil components may be gripped. In this case, the thermocompression bonding head 12 is pitch-fed to sequentially perform the thermocompression treatment on the plurality of wound coil components 50. The thermocompression-bonding jig may be a scissor or the like as long as it is used for the thermocompression-bonding process, and is not limited to the thermocompression-bonding head 12. Moreover, although the said embodiment demonstrated and demonstrated the example of the thermocompression-bonding process of the external electrode of the coiled coil components 50 and a coil | winding terminal, it is the thermocompression-bonding process of electronic components other than a coiled coil component, for example, the electronic which has a lead wire The present invention can also be applied to the case where the external electrode of the component and the end of the lead wire are subjected to thermocompression treatment. In short, in the polishing mechanism, the polishing position of the polishing member must be adjusted while the thermocompression bonding jig is in operation, such as while the thermocompression bonding jig moves from the polishing mechanism to the holding mechanism or during the thermocompression bonding process. The present invention includes any electronic device manufacturing apparatus and electronic component manufacturing method that can be changed.

  The present invention can be suitably used when performing thermocompression processing of electronic components.

1 is a perspective view showing an embodiment of an electronic component manufacturing apparatus according to the present invention. It is a side view which shows the manufacturing apparatus of the electronic component shown in FIG. It is explanatory drawing for demonstrating operation | movement of the principal part of the manufacturing apparatus of the electronic component shown in FIG. It is a figure which shows the manufacturing apparatus of the conventional electronic component, (a) is explanatory drawing which shows the state which grind | polishes the chip | tip for thermocompression bonding, (b) is description which shows the state which thermocompression-bonds a coiled coil component with the chip | tip for thermocompression bonding. FIG.

Explanation of symbols

10 Electronic parts manufacturing equipment 11 Winding chuck (holding mechanism)
12 Thermocompression bonding head (thermocompression bonding jig)
12A chip for thermocompression bonding 13 polishing mechanism 13A polishing paper (abrasive member)
13C Winding roller (moving mechanism)
13D Abrasive paper holder 13F Driving roller (Roller that moves abrasive paper, moving mechanism)
13N Cover (cover member)
13P Exhaust passage (suction means)

Claims (7)

  A holding mechanism for holding the electronic component, a movable thermocompression bonding jig for thermocompression-bonding the external electrode of the electronic component held by the holding mechanism, and a contact surface of the thermocompression bonding jig with the electronic component And a polishing mechanism having a polishing member that polishes the polishing member, and the polishing mechanism has a moving mechanism that moves the polishing member and changes its polishing position during operation of the thermocompression bonding jig. Parts manufacturing equipment.   The apparatus for manufacturing an electronic component according to claim 1, wherein the polishing mechanism includes a cover member that covers the polishing member.   3. The electronic component manufacturing apparatus according to claim 1, wherein the polishing mechanism has means for sucking polishing scraps.   The said polishing member consists of abrasive paper, The manufacturing apparatus of the electronic component of any one of Claims 1-3 characterized by the above-mentioned.   5. The electronic component manufacturing apparatus according to claim 4, wherein the moving mechanism includes a roller for moving the abrasive paper and a take-up roller for winding the abrasive paper moving through the roller.   A method for manufacturing an electronic component, wherein the electronic component manufacturing apparatus according to any one of claims 1 to 5 is thermocompression-bonded to an external electrode of the electronic component, wherein the thermocompression-bonding jig is used to manufacture the electronic component. Polishing the contact surface of the thermocompression bonding jig with the electronic component with a polishing member of the polishing mechanism, a step of performing thermocompression treatment on an external electrode of the electronic component, a step of moving the thermocompression bonding jig to a polishing mechanism An electronic component manufacturing method comprising: a step; and a step of moving the polishing member during operation of the thermocompression bonding jig. The method of manufacturing an electronic component according to claim 6, further comprising a step of removing polishing waste.

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