JP2005129677A5 - - Google Patents
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- Publication number
- JP2005129677A5 JP2005129677A5 JP2003362961A JP2003362961A JP2005129677A5 JP 2005129677 A5 JP2005129677 A5 JP 2005129677A5 JP 2003362961 A JP2003362961 A JP 2003362961A JP 2003362961 A JP2003362961 A JP 2003362961A JP 2005129677 A5 JP2005129677 A5 JP 2005129677A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- wiring
- forming
- hole
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362961A JP4278481B2 (ja) | 2003-10-23 | 2003-10-23 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362961A JP4278481B2 (ja) | 2003-10-23 | 2003-10-23 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005129677A JP2005129677A (ja) | 2005-05-19 |
JP2005129677A5 true JP2005129677A5 (ru) | 2006-11-30 |
JP4278481B2 JP4278481B2 (ja) | 2009-06-17 |
Family
ID=34642416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003362961A Expired - Fee Related JP4278481B2 (ja) | 2003-10-23 | 2003-10-23 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4278481B2 (ru) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4832807B2 (ja) | 2004-06-10 | 2011-12-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4786680B2 (ja) * | 2004-06-10 | 2011-10-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US8432037B2 (en) | 2004-06-10 | 2013-04-30 | Renesas Electronics Corporation | Semiconductor device with a line and method of fabrication thereof |
EP1970947B1 (en) * | 2005-12-02 | 2016-08-24 | Ulvac, Inc. | METHOD FOR FORMING Cu FILM |
US7488679B2 (en) * | 2006-07-31 | 2009-02-10 | International Business Machines Corporation | Interconnect structure and process of making the same |
KR101969291B1 (ko) * | 2010-02-26 | 2019-04-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
-
2003
- 2003-10-23 JP JP2003362961A patent/JP4278481B2/ja not_active Expired - Fee Related
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