JP2005123121A - Manufacturing method of electrooptic device, electrooptic device manufactured by the method, electronic equipment loading electrooptic device, and droplet discharging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrooptic device capable of improving a film-forming property in forming a film on a film substrate, an electrooptic device manufactured by the method, an electronic equipment loading the electrooptic device, and a droplet discharging device. <P>SOLUTION: The manufacturing method of the electrooptic device carrying out film forming on the film substrate includes a film absorption process of having the film substrate 10 absorbed to a porous plate 40, and a film-forming process of forming a film on the film substrate 10 absorbed to the porous plate 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device manufactured by the method for manufacturing an electro-optical device, an electronic apparatus including the electro-optical device, and a droplet discharge device. Electro-optical device manufacturing method for forming a film on a film substrate adsorbed on a plate and adsorbed on a porous plate, an electro-optical device manufactured by an electro-optical device manufacturing method, an electronic apparatus equipped with the electro-optical device, and The present invention relates to a droplet discharge device.

  Electro-optical devices mounted on electronic devices such as portable computers and mobile phones are required to be as inexpensive, lightweight, shock resistant and deformation resistant as possible. Therefore, recently, a substrate using a film is used in the electro-optical device. For example, in Patent Document 1, a plastic (polymer) film such as polycarbonate or polyethersulfone is used as a transparent substrate, and a transparent electrode serving as an anode, an organic functional layer, and a metal electrode serving as a cathode are sequentially laminated on the transparent substrate. An organic electroluminescence display device configured as described above is disclosed.

JP 2003-15545 A

  However, since the film substrate is bent and warped and it is difficult to ensure the flatness thereof, there is a problem that it is difficult to form a film uniformly in the surface or to perform substrate processing like a glass substrate. Further, since the film substrate is thin and lightweight, there is a problem that its handleability is poor. In particular, since the inkjet apparatus is configured to print droplets on a film substrate, flatness of the film substrate is particularly required for printing with high accuracy.

  The present invention has been made in view of the above problems, and is manufactured by an electro-optical device manufacturing method and an electro-optical device manufacturing method capable of improving the film forming property when forming a film on a film substrate. It is an object of the present invention to provide an electro-optical device, an electronic device equipped with the electro-optical device, and a droplet discharge device.

  In order to solve the above-described problems and achieve the object, the present invention provides a method for manufacturing an electro-optical device for forming a film on a film substrate, a film adsorption step for adsorbing the film substrate to a porous plate, and the porous A film forming step of forming a film on the film substrate adsorbed on the material plate.

  As a result, film formation can be performed on the film substrate with the film substrate adsorbed to the porous plate, flatness can be ensured by preventing the film substrate from bending and warping, and it can be handled in the same manner as a glass substrate. As in the case of the glass substrate, it is possible to form a uniform film within the surface or to perform substrate processing. As a result, it is possible to provide an electro-optical device manufacturing method capable of improving the film forming property when forming a film on a film substrate.

  According to a preferred aspect of the present invention, it is desirable that a silicon rubber in which a large number of holes are formed be interposed between the porous plate and the film substrate in the film adsorption step. Thereby, when adjusting the position of a film substrate, the position adjustment of a film substrate becomes possible by adjusting the position of a silicon rubber, and position adjustment can be performed easily.

  According to a preferred aspect of the present invention, it is desirable that a glass plate or a plastic plate is interposed between the porous plate and the silicon rubber in the film adsorption step. As a result, it is possible to prevent the silicon rubber from being completely adsorbed on the porous plate and difficult to adjust the position and peel off.

  According to a preferred aspect of the present invention, it is desirable to include a pressurizing step of pressurizing the plastic film substrate adsorbed on the porous plate to release the adsorbed state of the film substrate. Thereby, the adsorption state of the film substrate adsorbed on the porous plate can be easily released.

  According to a preferred aspect of the present invention, the film forming step is based on a detection step of detecting a distance from the film substrate adsorbed on the porous plate, and a distance detection result detected in the detection step. In the adjustment step of adjusting the distance between the droplet discharge head of the inkjet method and the film, after adjusting the distance between the droplet discharge head and the film in the adjustment step, from the droplet discharge head to the film substrate It is desirable to include a droplet discharge step of forming a film by discharging droplets. As a result, even when there are minute irregularities on the surface of the film substrate, the distance between the droplet discharge head and the film substrate can be made constant, and printing variations can be prevented.

  According to a preferred aspect of the present invention, the electro-optical device is an organic electroluminescence display device, and in the film formation step, the hole injection / transport layer and the light emitting layer are formed using an inkjet method. It is desirable to include a process. Thereby, when forming the hole injection / transport layer and the light emitting layer of the organic electroluminescence device on the film substrate, the film formability can be improved.

  According to a preferred aspect of the present invention, it is desirable that the electro-optical device is manufactured using the method for manufacturing the electro-optical device of the present invention. Thereby, an electro-optical device including a film substrate formed with high accuracy can be provided.

  Further, according to a preferred aspect of the present invention, it is desirable that the electronic apparatus is equipped with the electro-optical device of the present invention. Thereby, the electronic device provided with the film substrate formed into a film with high precision can be provided.

  In order to solve the above-described problems and achieve the object, the present invention provides a film substrate that is adsorbed to a porous plate in a droplet discharge device that forms a film on a substrate by discharging a droplet from a droplet discharge head. In addition, a film is formed by discharging droplets from the droplet discharge head.

  With the film substrate adsorbed to the porous plate, film formation can be performed on the film substrate, flatness can be ensured by preventing the film substrate from bending and warping, and it can be handled in the same way as a glass substrate. In the same manner as the glass substrate, the film can be uniformly formed in the surface. As a result, when forming a film on a film substrate, it is possible to provide a droplet discharge device capable of improving the film forming property.

  Further, according to a preferred aspect of the present invention, the apparatus includes a table on which a vacuum line for sucking from the upper surface thereof is formed, and suction means for sucking from the vacuum line of the table, It is preferable that the porous plate is placed on the upper surface of the table, and the film substrate is sucked to the porous plate by suction from the vacuum line in a state where the film substrate is placed on the porous plate. Thereby, a film substrate can be made to adsorb | suck with a simple structure to a porous plate.

  According to a preferred aspect of the present invention, there is provided a table in which the porous plate is formed on at least a part of the upper surface, and a vacuum line for sucking from the porous plate is formed, and the table A suction means for sucking from the vacuum line, wherein the suction means sucks from the vacuum line in a state where the film substrate is placed on the porous plate formed on the table, and the film is placed on the porous plate. It is desirable to adsorb the substrate. Thereby, a film substrate can be made to adsorb | suck with a simple structure to a porous plate.

  According to a preferred aspect of the present invention, it is desirable to interpose a silicon rubber having a large number of holes formed between the porous plate and the film substrate. Thereby, when adjusting the position of a film substrate, the position adjustment of a film substrate becomes possible by adjusting the position of a silicon rubber, and position adjustment can be performed easily.

  According to a preferred aspect of the present invention, it is desirable that a glass plate or a plastic plate is interposed between the porous plate and the silicon rubber. As a result, it is possible to prevent the silicon rubber from being completely adsorbed on the porous plate and difficult to adjust the position and peel off.

  According to a preferred aspect of the present invention, the film substrate further includes a pressurizing unit that pressurizes through the vacuum line of the table, and the pressurizing unit pressurizes from the vacuum line and is adsorbed on the porous plate. It is desirable to release the adsorption state. Thereby, the adsorption state of the film substrate adsorbed on the porous plate can be easily released.

  According to a preferred aspect of the present invention, the droplet discharge head is based on a detection means for detecting a distance from the film substrate adsorbed on the porous plate, and a distance detection result detected by the detection means. And a distance adjusting means for adjusting the distance between the films. Even when there are minute irregularities on the surface of the film substrate, the distance between the droplet discharge head and the film substrate can be made constant, and printing variations can be prevented.

  Hereinafter, the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art or those that are substantially the same. In the following embodiments, an organic electroluminescence device will be described as an example of an electro-optical device. However, the electro-optical device of the present invention is not limited to this.

[Configuration of Inkjet Device]
FIG. 1 is a schematic perspective view showing the overall configuration of a droplet discharge apparatus 1 according to the present invention. The droplet discharge device 1 forms a film on a film substrate adsorbed on a porous plate. As shown in FIG. 1, the droplet discharge device 1 is a distance measuring device that detects a distance between a droplet discharge head 11 that discharges a coating liquid 2 such as an organic EL material onto the surface of a film substrate 10 and the film substrate 10. A droplet discharging means 13 having a means 12; a moving means 14 for relatively moving the positions of the droplet discharging head 11, the distance measuring means 12 and the film substrate 10; and a porous material placed on a table 16. A suction pressurizing means 25 for adsorbing the film substrate 10 to the plate 40, a droplet discharge means 13, a moving means 14, and a control means 15 for controlling the suction pressurizing means 25 are provided. In the figure, for convenience of explanation, the droplet discharge head 11 and the distance measuring means 12 are shown enlarged.

  A porous plate 40 and a silicon rubber 41 are placed on the table 16, and the film substrate 10 is placed on the silicon rubber 41. The moving means 14 supports the droplet discharge head 11 downward on the upper side of the film substrate 10 placed on the table 16 and moves in the X-axis direction by a movable stage 18. 17 and a stage drive unit 19 that moves the plastic film substrate 10 in the Y-axis direction together with the table 16 with respect to the upper droplet discharge head 11.

  The head support portion 17 is a mechanism such as a linear motor that can move and position the droplet discharge head 11 and the distance measuring means 12 with respect to the plastic film substrate 10 in the vertical axis direction (Z axis) at an arbitrary moving speed. And a mechanism such as a stepping motor that can be set at an arbitrary angle with respect to the lower film substrate 10 by rotating the droplet discharge head 11 about the vertical axis.

  The stage driving unit 19 rotates the table 16 about the vertical axis to set the θ axis stage 20 that can be set at an arbitrary angle with respect to the upper droplet discharge head 11 and the table 16 to the droplet discharge head 11. On the other hand, a stage 21 that moves and positions in the horizontal direction (Y direction) is provided. The θ-axis stage 20 is composed of a stepping motor or the like, and the stage 21 is composed of a linear motor or the like.

  The droplet discharge means 13 includes a droplet discharge head 11 and a tank 23 connected to the droplet discharge head 11 via a tube 22. The tank 23 stores the coating liquid 2 and supplies the coating liquid 2 to the droplet discharge head 11 via the tube 22. As the coating solution 2, an organic EL material can be used. With such a configuration, the droplet discharge means 13 discharges the coating liquid 2 stored in the tank 23 from the droplet discharge head 11 and applies it onto the film substrate 10.

  The droplet discharge head 11 compresses a liquid chamber by, for example, a piezo element and discharges droplets (liquid material) with the pressure, and has a plurality of nozzles (nozzle holes) arranged in one or a plurality of rows. doing. The configuration of the droplet discharge head 11 will be described in detail with reference to FIG. FIG. 2A is an exploded perspective view of the droplet discharge head 11, and FIG. 2B is a cross-sectional view of the droplet discharge head 11. As shown in FIGS. 2A and 2B, the droplet discharge head 11 includes, for example, a stainless steel nozzle plate 31 and a vibration plate 32, and both are joined via a partition member (reservoir plate) 33. Is. A plurality of spaces 34 and a liquid reservoir 35 are formed between the nozzle plate 33 and the diaphragm 32 by a partition member. Each space 34 and the inside of the liquid reservoir 35 are filled with the coating liquid 2 (not shown), and each space 34 and the liquid reservoir 35 communicate with each other via a supply port 36. In addition, the nozzle plate 31 is formed with minute hole nozzles 37 for injecting the coating liquid 2 from the spaces 34. On the other hand, a hole 37 a for supplying the coating liquid 2 to the liquid reservoir 35 is formed in the vibration plate 32.

  A piezoelectric element (piezo element) 38 is bonded to the surface of the diaphragm 32 opposite to the surface facing the space, as shown in FIGS. 2-1 and 2-2. As shown in FIG. 2B, the piezoelectric element 38 is positioned between a pair of electrodes 39, 39, and is bent so that when energized, it protrudes outward. The diaphragm 32 to which the piezoelectric element 38 is bonded in such a configuration is integrally bent with the piezoelectric element 38 and bends outward at the same time, whereby the internal volume of the space 34 is increased. Is increasing. Accordingly, the coating liquid 2 corresponding to the increased volume in the space 34 flows from the liquid reservoir 35 through the supply port 36. Further, when the energization to the piezoelectric element 38 is released from such a state, both the piezoelectric element 38 and the diaphragm 32 return to their original shapes. Therefore, since the space 34 also returns to its original volume, the pressure of the coating liquid 2 inside the space increases, and spray droplets of the coating liquid 2 are discharged from the nozzle 37 toward the film substrate 10.

  The method of the droplet discharge head 11 may be a method other than the piezo jet type using the piezoelectric element as described above, and vibration is applied or pressure is applied to the tank by an ultrasonic motor, a linear motor, or the like. The application liquid 2 may be ejected from the nozzle 37 by application.

  The control means 15 is composed of a CPU such as a microprocessor for controlling the entire apparatus, a computer having an input / output function for various signals, and the like as shown in FIG. Are electrically connected to the moving means 14 and the suction pressurizing means 25, respectively, and the discharging operation by the droplet discharging means 13, the moving operation by the moving means 14, and the suction / pressurizing operation by the suction pressurizing means 25 are performed. Control. With such a configuration, the discharge condition of the liquid discharge liquid is adjusted, and the coating amount of the thin film to be formed is controlled.

  That is, the control means 15 has a control function for adjusting the discharge interval of the liquid discharge liquid with respect to the film substrate 10 as a function for controlling the coating amount, a control function for adjusting the discharge amount of the liquid discharge liquid per dot, It has a control function for adjusting the angle (θ) between the nozzle arrangement direction and the movement direction by the movement mechanism, and a control function for setting discharge conditions in each area by dividing the substrate into a plurality of areas.

  Furthermore, the control means 15 is a control mechanism for adjusting the discharge interval, and a control function for adjusting the discharge interval by adjusting the relative movement speed between the film substrate 10 and the droplet discharge head 11, and the film substrate 10. And adjusting the distance between the droplet discharge heads 11 to adjust the discharge interval by adjusting the control function of making the gap between the two constant when discharging the coating liquid 2 and the discharge time interval in the moving means 14. A control function and a control function for adjusting a discharge interval by arbitrarily setting nozzles that simultaneously discharge the coating liquid 2 among a plurality of nozzles are provided.

FIG. 3 is a diagram for explaining a detailed configuration of the table 16, FIG. 3A is a cross-sectional view of the table 16, and FIG. 3B is a plan view of the table 16. As shown in FIG. 3A, a porous plate 40 having an outer shape larger than that of the film substrate 10 is placed on the table 16. The porous plate 40 has a porous portion 40a formed of sintered metal or the like. The porous part 40 a has the same size as the film substrate 10. On the porous plate 40, a silicon rubber 41 having the same size as the porous plate 40 is placed. The silicon rubber 41 has a large number of holes formed in an area larger than the outer shape of the film substrate 10, and guides (alignment marks) for placing the film substrate 10 are formed. The film substrate 10 is placed on the silicon rubber 41 in accordance with the position of the guide formed on the silicon rubber 41. The film substrate 10 may be either a thermoplastic resin film or a thermosetting resin film. For example, polyethylene, polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA). ), Polyolefin, cyclic polyolefin, modified polyolefin, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, polyarylate, triacetyl cellulose, acrylic resin, polymethyl methacrylate, acrylic-styrene copolymer Copolymer (AS resin), butadiene-styrene copolymer, ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene Polyester such as phthalate (PEN) and polycyclohexanedimethylene terephthalate (PCT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyether sulfone (PES), polyacetal (POM) , Polyphenylene oxide, modified polyphenylene oxide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, amorphous polyolefin (APO), other fluororesins, styrene, polyolefin, polyvinyl chloride Various thermoplastic elastomers such as polyurethane, fluororubber, chlorinated polyethylene, epoxy resin, phenol resin, urea resin, melamine resin, unsaturated polyester, Recone resins, copolymers and polyurethanes, and the like, or these main, it is possible to use a blend, a polymer alloy or the like film. The plastic film substrate 10 may be configured as a laminated film having a multilayer structure, for example, by combining one or more of these resin materials. Further, an inorganic film may be used. For example, aluminum (Al), aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), oxide film (SiO ₂ , SiOx), nitride film (SiN, SiON), ITO, IZO Glass or the like can be used. One or more inorganic materials may be combined with a resin material to form a multilayer film having a multilayer structure. Here, the silicon rubber 41 is sandwiched between the porous plate 40 and the film substrate 10 and the film substrate 10 is indirectly adsorbed to the porous plate 40, but the porous plate 40 is not sandwiched between the porous plate 40 and the film substrate 10. Alternatively, the film substrate 10 may be directly adsorbed to 40.

  As shown in FIG. 3A, U-shaped grooves 16 a, 16 b, and 16 c are formed on the upper surface of the table 16 symmetrically. The grooves 16a, 16b, and 16c are for suction from the upper surface of the table 16 with a uniform suction pressure. Further, as shown in FIGS. 3A and 3B, the table 16 has a vacuum line for suctioning from the surface of the table 16 with a plurality of branches 16a, 16b, and 16c as openings. 16d is formed. The vacuum line 16 is connected to the suction and pressurizing means 25. By sucking the vacuum line 16 with the suction and pressurizing means 25, the vacuum line 16 is sucked from the grooves 16a, 16b, and 16c of the table 16, and the silicon rubber 41 is drawn. Thus, the film substrate 101 can be adsorbed and held on the porous plate 40. Thereby, the flatness of the film substrate 10 can be ensured.

  Here, even when the suction of the suction and pressurizing means 25 is turned off, the silicon rubber 41 may be completely adsorbed on the porous plate 40 and it may be difficult to move the silicon rubber 41 by hand. Therefore, in the present embodiment, the suction pressurizing means 25 releases the suction state of the silicon rubber 41 with respect to the porous plate 40 by applying pressure after turning off the suction of the vacuum line 16. Thereby, the adsorption state of the film substrate 10 is also released. In this state, it is possible to adjust the alignment by moving the film substrate 10 together with the silicon rubber 41. Even when the silicon rubber 41 is not sandwiched between the film substrate 10 and the porous plate 40, the film substrate 10 may be completely adsorbed on the porous plate 40 and may not be moved by hand. In order to cancel the state, the suction and pressurizing unit 25 applies pressure after the suction of the vacuum line 16 is turned off.

  When the film substrate 10 is adsorbed to the porous plate 40, the unevenness of the adsorbing force causes minute irregularities on the surface of the film substrate 10, and the distance between the droplet discharge head 11 and the film substrate 10 is increased. There is a possibility that printing becomes uneven due to non-uniformity. Furthermore, when the unevenness of the surface of the film substrate 10 is large, the film substrate 10 and the droplet discharge head 11 may come into contact with each other. Therefore, in this embodiment, the distance to the plastic film substrate 10 adsorbed to the porous plate 40 is detected by the distance measuring means 12 shown in FIG. 1, and the control means 15 detects the liquid based on the distance measurement result. Control is performed so that the distance (gap) between the droplet discharge head 11 and the film substrate 10 is always constant.

  FIG. 4 is a schematic diagram for explaining a method of making the distance between the droplet discharge head 11 and the film substrate 10 constant. As shown in FIG. 1, the droplet discharge head 11 and the distance measuring means 12 are arranged in parallel on the head support portion 17. The droplet discharge head 11 performs printing in the printing direction shown in FIG. In this case, the head support unit 17 moves the droplet discharge head 11 and the distance measuring unit 12 in the X-axis direction and the Z-axis direction according to the control of the control unit 15, and the stage driving unit 19 controls the control unit 15. In accordance with the control, the table 16 on which the film substrate 10 is placed is moved in the Y-axis direction.

  The distance measuring means 12 emits laser light to the film substrate 10, detects the reflected light to detect the distance from the plastic substrate 10, and outputs the distance detection result to the control unit 15. Based on the distance detection result input from the distance measuring means 12, the control means 15 moves the head support portion 17 in the Z direction so that the distance between the droplet discharge head 11 and the film substrate 10 is a predetermined distance (a constant gap). Adjust so that Thereafter, droplets are ejected toward the film substrate 10 by the droplet ejection head 11. Thereby, it is possible to discharge droplets onto the film substrate 10 while the distance between the droplet discharge head 11 and the film substrate 10 is constant.

  FIG. 5 shows a schematic processing flow of film formation of the droplet discharge device 1. First, the porous plate 40, the silicon rubber 41, and the plastic film substrate 10 are placed in order on the upper surface of the table 16 (step S1). Next, the suction pressurizing means 25 sucks from the vacuum line 16d of the table 16 and sucks the film substrate 10 onto the porous plate 40 via the silicon rubber 41 (step S2). Then, the distance measuring means 12 detects the distance from the film substrate 10 in a state where the film substrate 10 is adsorbed to the porous plate 40 (step S3). The control means 15 moves the head support portion 17 in the Z direction based on the distance detection result of the distance measurement means 12, and the distance (gap) between the droplet discharge head 11 and the film substrate 10 is a predetermined distance (a constant gap). (Step S4). Thereafter, a droplet is ejected onto the film substrate 10 by the droplet ejection head 11 to form a film (step S5). The processes in steps S3 to S5 are performed at each printing position on the film substrate 10. After the film formation is completed, the suction pressurizing means 25 turns off the suction, and then pressurizes from the vacuum line 16d of the table 16 to release the suction state of the film substrate 10 (step S6).

[Manufacturing method of organic electroluminescence device]
A method for manufacturing an organic electroluminescent device according to an embodiment of the present invention will be described with reference to FIG. The manufacturing method of the organic electroluminescence device includes (1) a partition formation step, (2) a plasma treatment step, (3) a hole injection / transport layer formation step, (4) a surface modification step, and (5). It comprises a light emitting layer forming step, (6) a cathode forming step, and (7) a sealing step. All the following steps are preferably performed in a state where the film substrate 10 is adsorbed to the porous plate 40, and at least a step ((3) a hole injection / transport layer formation step, a step performed using an inkjet method, and ( The 4) surface modification step and the (5) light emitting layer forming step) are performed in a state in which the film substrate 10 is adsorbed to the porous plate 40 to ensure flatness.

(1) Partition Formation Step As shown in FIG. 6A, in the partition formation step, transparent made of ITO or the like formed on a plastic film substrate 10 provided with TFTs (not shown) in advance as necessary. On the electrode 101, an inorganic bank layer 102a and an organic bank layer 102b are sequentially stacked to form a bank portion (partition wall) 102 that separates the pixel regions.

The inorganic bank layer 102a is formed by forming an inorganic film such as SiO ₂ , TiO ₂ or SiN on the entire surface of the film substrate 10 and the transparent electrode 101 by, for example, CVD, sputtering, vapor deposition, etc., and then etching the inorganic film Then, patterning is performed to form an opening 103 a in the pixel region on the transparent electrode 101.

  Next, the organic bank layer 102b is formed on the entire surface of the film substrate 10, the transparent electrode 101, and the inorganic bank layer 102a. The organic bank layer 102b is formed by applying an organic resin such as an acrylic resin or a polyimide resin dissolved in a solvent by spin coating, dip coating, or the like. Then, the organic bank layer 102b is etched by a photolithography technique or the like to provide the opening 103b. The opening 103b of the organic bank layer 102b is preferably formed slightly wider than the opening 103a of the inorganic bank layer 102a, as shown in FIG. Thereby, an opening 103 penetrating the inorganic bank layer 102a and the organic bank layer 102b is formed on the transparent electrode 101.

(2) Plasma Processing Step Next, in the plasma processing step, a region showing ink repellency is formed on the surface of the bank portion 102. This plasma treatment process is an ink repellent process for making the organic bank layer 102b ink repellent.

In the ink repellent step, plasma treatment (CF ₄ plasma treatment) using tetrafluoromethane (carbon tetrafluoride) as a reactive gas is performed in an air atmosphere. Specifically, the plastic film substrate 10 including the bank unit 102 is placed on a sample stage, and this is irradiated with plasma tetrafluoromethane (carbon tetrafluoride). The CF ₄ plasma treatment is performed under the conditions of, for example, a plasma power of 100 to 1000 W, a tetrafluoromethane (carbon tetrafluoride) gas flow rate of 50 to 200 SCCM, a substrate temperature of 40 to 50 ° C., and a degree of vacuum of 1 mmTorr. The heating by the sample stage is mainly performed for keeping the preheated film substrate 10 warm. The processing gas is not limited to tetrafluoromethane (carbon tetrafluoride), and other fluorocarbon gases can be used. By CF ₄ plasma treatment, fluorine groups are introduced into the organic bank layer 102b and ink repellency is imparted. Organic substances such as an acrylic resin and a polyimide resin constituting the organic bank layer 102b can be easily made ink-repellent by irradiating plasma fluorocarbon with hydroxyl groups replaced with fluorine groups. On the other hand, the exposed surfaces of the transparent electrode 101 and the inorganic bank layer 102a are also somewhat affected by the CF ₄ plasma treatment, but do not affect the affinity. Next, as a cooling process, the film substrate 10 heated for plasma processing is cooled to room temperature.

In the above plasma treatment step, the organic bank layer 102b and the inorganic bank layer 102a of different materials are sequentially subjected to O ₂ plasma treatment and CF ₄ plasma treatment, whereby the bank layer 102 has an ink-philic region and a repellent property. An ink-based region can be easily provided.

(3) Hole Injection / Transport Layer Formation Step In the hole injection / transport layer formation step, the ink composition 105 containing the hole injection / transport layer material is applied onto the transparent electrode 101 by the inkjet method using the droplet discharge device 1. After discharging into the opening 103, drying treatment and heat treatment are performed to form the hole injection / transport layer. In addition, after this hole injection / transport layer formation process, it is preferable to carry out in inert gas atmospheres, such as a nitrogen atmosphere and argon atmosphere without a water | moisture content and oxygen. As shown in FIG. 3B, the droplet discharge head 11 is filled with an ink composition 105 containing a hole injection / transport layer material, the nozzle 37 of the droplet discharge head 11 is made to face the opening 103, and the droplet is discharged. While relatively moving the discharge head 11 and the film substrate 10, the ink composition 105 in which the liquid amount per droplet is controlled is discharged from the droplet discharge head 101 onto the transparent electrode 101.

  As the ink composition 105 used here, for example, an ink composition in which a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) is dissolved in a polar solvent can be used. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate And glycol ethers such as butyl carbitol acetate. The viscosity of the ink composition is preferably about 2 to 20 Ps, particularly about 7 to 10 cPs. By using the above ink composition, the nozzle 37 of the droplet discharge head 11 can be stably discharged without clogging. Note that the material of the hole injection / transport layer 106 may be the same for the R, G, and B light emitting layers, or may be changed for each light emitting layer.

  The ejected ink composition 105 spreads over the transparent ink 101 and the inorganic bank layer 102a that have been subjected to the ink-philic treatment in the opening 103. Even if the ink composition 105 deviates from the predetermined discharge position and is discharged onto the organic bank layer 102b, the organic bank layer 102b does not get wet with the ink composition 105, and the repelled ink composition 105 opens. Roll into part 103.

  The discharge amount of the ink composition 105 is determined by the size of the opening 103, the thickness of the hole injection / transport layer to be formed, the concentration of the hole injection / transport layer material in the ink composition 105, and the like. . Further, the ink composition 105 may be ejected to the same opening 103 not only once but also in several times. In this case, the amount of the ink composition 105 may be the same each time, and the ink amount may be changed each time. Furthermore, the ink composition 105 may be discharged not only to the same location in the same opening 103 but also to a different location in the opening 103 each time.

Next, as shown in FIG. 6C, the hole injection / transport layer 106 is formed by drying the discharged ink composition 105 to evaporate the polar solvent contained in the ink composition 105. This drying process is performed, for example, in a nitrogen atmosphere at a room temperature and a pressure of about 133.3 Pa (1 Torr). If the pressure is too low, the ink composition 105 will suddenly boil, which is not preferable. In addition, the ink composition 105 remains on the peripheral wall surface of the bank portion 102 to a slight extent, but when the temperature exceeds room temperature, the evaporation rate of the polar solvent increases, and this residual adhesion amount becomes excessive. Therefore, it is preferable that the temperature of the drying treatment is room temperature or lower. After the drying treatment, the polarity remaining in the hole injecting / transporting layer 106 is preferably performed by heating in a vacuum (13.33 mPa (10 ⁻⁴ Torr) or less) at room temperature to 50 ° C. for 72 hours or more. It is preferable to remove the solvent and water. However, in the case where an adhesive material whose adhesive strength is reduced by heating is used, drying is performed at room temperature in a vacuum.

  In the hole injection / transport layer forming step, the ejected ink composition 105 is adapted to the exposed surface portions of the ink-philic transparent electrode 101 and the inorganic bank layer 102a, while the organic bank layer 102b subjected to ink repellent treatment. Therefore, even when the ink composition 105 is accidentally ejected onto the organic bank layer 102b, the ink composition 105 is repelled and rolls onto the exposed surface portions of the transparent electrode 101 and the inorganic bank layer 102a. Thereby, the hole injection / transport layer 106 can be reliably formed on the transparent pixel electrode electrode 101.

(4) Surface Modification Step Next, a surface modification step is performed prior to the light emitting layer formation step. That is, in the light emitting layer forming step, in order to prevent re-dissolution of the hole injecting / transporting layer 106, it is insoluble in the hole injecting / transporting layer 106 as a solvent for the ink composition used for forming the light emitting layer. A nonpolar solvent is used. On the other hand, since the hole injection / transport layer 106 has a low affinity for a nonpolar solvent, the hole injection / transport layer 106 is ejected even when the ink composition of the light emitting layer containing the nonpolar solvent is ejected onto the hole injection / transport layer 106. The ink composition is repelled by the / transport layer 106 and the hole injection / transport layer 106 and the light emitting layer cannot be adhered to each other, or the light emitting layer may not be applied uniformly. Therefore, in order to increase the affinity of the surface of the hole injection / transport layer 106 with respect to the nonpolar solvent, it is preferable to perform a surface modification step before forming the light emitting layer.

  In the surface modification step, hole injection is performed by a surface modification solvent that is the same solvent as or similar to the non-polar solvent of the ink composition used for forming the light emitting layer by an inkjet method, a spin coating method, or a dip method. / It is carried out by drying after coating on the transport layer 106. In the application by the ink jet method, the droplet discharge head 11 is filled with a surface modifying solvent, the nozzle 37 of the droplet discharge head 11 is opposed to the hole injection / transport layer 106, and the droplet discharge head 11 and the film substrate 10 are coated. The surface modifying solvent is discharged onto the hole injecting / transporting layer 106 while relatively moving. In addition, the application by spin coating is performed by placing the film substrate 10 on, for example, a rotating stage, dropping the surface modifying solvent onto the film substrate 10 from above, and then rotating the film substrate 10 to remove the surface modifying solvent. This is performed by spreading the whole hole injection / transport layer 106 on the film substrate 10. The surface modifying solvent temporarily spreads on the ink-repelled organic bank layer 102b, but is blown off by the centrifugal force due to rotation, and is applied only to the hole injection / transport layer 106. Further, the application by the dip method is performed by immersing the plastic film substrate 10 in, for example, a surface modification solvent and then pulling it up to spread the surface modification solvent over the whole hole injection / transport layer 106. Also in this case, the surface modifying solvent temporarily spreads on the organic bank layer 102b subjected to the ink repellent treatment. However, the surface modifying solvent is repelled from the organic bank layer 102b during the pulling up, and a hole injection / transport layer is formed. 106 only.

  Examples of the surface modifying solvent used here include cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene and the like as the nonpolar solvent of the ink composition. Examples of the polar solvent include toluene, xylene and the like. In particular, when applying by the ink jet method, it is preferable to use dihydrobenzofuran, trimethylbenzene, tetramethylbenzene, cyclohexylbenzene, or a mixture thereof, particularly the same solvent mixture as the ink composition. When using the method, toluene, xylene and the like are preferable.

  In the case of applying by the ink jet method, it is preferable to dry the surface modifying solvent by placing the film substrate 10 on a hot plate and heating it at a temperature of 200 ° C. or lower. The film substrate 10 is preferably dried by blowing nitrogen or rotating the substrate to generate an air flow on the surface of the film substrate 10.

  The surface modification solvent is applied after the drying process in the hole injection / transport layer layer forming step, and after the surface modification solvent is dried, the hole injection / transport layer formation step is performed. The heat treatment may be performed. By performing such a surface modification step, the surface of the hole injection / transport layer 106 becomes easily compatible with the nonpolar solvent. In the subsequent step, the ink composition containing the light-emitting layer material is injected with the hole injection / transport. The layer 106 can be applied uniformly.

(5) Light-Emitting Layer Formation Step Next, in the light-emitting layer formation step, ink compositions 107a, 107b, and 107c (107c are not shown) composed of a solute component such as an organic electroluminescent material and a solvent are described later by an inkjet method. In accordance with this order, the light emitting layers 108a, 108b and 108c are sequentially formed by discharging onto the hole injecting / transporting layer 106 after the surface modification, followed by drying and heat treatment.

  Organic electroluminescent materials include fluorene polymer derivatives, (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, and other benzene derivatives. Soluble low-molecular organic EL materials, high-molecular organic EL materials, and the like can also be used.

  As the nonpolar solvent, those insoluble in the hole injection / transport layer 106 are preferable. For example, cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene and the like can be used. By using such a nonpolar solvent for the ink composition of the light emitting layer, the ink composition can be applied without re-dissolving the hole injection / transport layer 106. In addition to the organic electroluminescence material, the solute component may appropriately include a binder, a surfactant, a viscosity modifier, and the like.

  As shown in FIG. 6-4, the droplet discharge head 11 is filled with the ink composition 107a, the nozzle 37 of the droplet discharge head 11 is made to face the hole injection / transport layer 106, and the droplet discharge head 101 and While moving relative to the plastic film substrate 10, ink droplets are ejected from the nozzle 37 as ink droplets with a controlled liquid amount per droplet, and the ink composition 107 a is ejected onto the hole injection / transport layer 106. In this case, the ejected ink composition 107a spreads on the hole injection / transport layer 16 and conforms, but hardly adheres to the ink-repellent treated organic bank layer 102b. Even when the ink composition 107a is accidentally ejected onto the layer 102b, the ink composition 107a is repelled and rolls onto the hole injection / transport layer 106. Thereby, the layer of the ink composition 107 a can be formed in close contact with the hole injection / transport layer 106.

  The amount of the ink composition 107a is determined by the thickness of the light emitting layer 108a to be formed, the concentration of the light emitting layer material in the ink composition, and the like. Further, the ink composition 107a may be dropped on the same hole injection / transport layer 106 not only once but also in several times. In this case, the amount of ink droplets at each time may be the same, and the ink amount may be changed every time. Furthermore, ink droplets may be ejected not only to the same location on the hole injection / transport layer 106 but also to different locations within the hole injection / transport layer 106 each time.

  Next, the non-polar solvent contained in the ink composition is evaporated by drying the ejected ink composition 107a to form the light emitting layer 108a as shown in FIG. 6-5. The drying conditions can be, for example, a condition in which a pressure is set to about 133.3 Pa (1 Torr) at room temperature in a nitrogen atmosphere for 5 to 10 minutes, or a condition in which nitrogen is blown at 40 ° C. for 5 to 10 minutes. . Examples of other drying means include a far-infrared irradiation method and a high-temperature nitrogen gas spraying method.

  Subsequently, as shown in FIG. 6-6, in the same manner as in the case of the ink composition 107a, the ink composition 107b is dropped and dried to form the light emitting layer 108b, and finally the ink composition 107c is dropped and dried. Then, a light emitting layer 108c is formed, and a substrate on which three types of light emitting layers 108a, 108b, and 108c are formed as shown in FIGS. 6-7.

(6) Cathode Formation Step Next, in the cathode formation step, the cathode 109 is formed on the entire surface of the light emitting layers 108a, 108b, 108c and the organic bank layer 102b. The cathode 109 may be formed by stacking a plurality of materials. For example, it is preferable to use a material having a small work function on the side close to the light emitting layer. For example, Ca, Ba or the like can be used. Depending on the material, it may be preferable to form a thin LiF layer. is there. Also, the upper side (sealing side) preferably has a higher work function than the lower side (light emitting layer side) cathode layer, and is preferably made of, for example, an Al film, an Ag film, a Mg / Ag laminated film, or the like. The thickness is preferably in the range of, for example, 100 to 1000 nm, particularly about 200 to 500 nm. These cathodes (cathode layers) are preferably formed by, for example, a vapor deposition method, a sputtering method, a CVD method, or the like. Particularly, the vapor deposition method can prevent damage to the light emitting layers 108a, 108b, and 108c due to heat. Is preferable. Further, lithium fluoride may be formed only on the light emitting layers 108a, 108b, and 108c, or may be formed only on any one of the specific light emitting layers. In this case, the other light emitting layer is in contact with a cathode made of calcium. Further, a protective layer such as SiO, SiO ₂ or SiN may be provided on the reflective layer to prevent oxidation.

(7) Sealing Step In the sealing step, the sealing layer 120 is formed by applying a sealing material made of a thermosetting resin or an ultraviolet curable resin over the entire surface of the cathode 109. Further, a sealing film (not shown) is laminated on the sealing layer 120. The sealing film may be either a thermoplastic resin film or a thermosetting resin film. For example, polyethylene, polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA). ), Polyolefin, cyclic polyolefin, modified polyolefin, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, polyarylate, triacetyl cellulose, acrylic resin, polymethyl methacrylate, acrylic-styrene copolymer Copolymer (AS resin), butadiene-styrene copolymer, ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphth Polyester such as rate (PEN) and polycyclohexanedimethylene terephthalate (PCT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyether sulfone (PES), polyacetal (POM) , Polyphenylene oxide, modified polyphenylene oxide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, amorphous polyolefin (APO), other fluororesins, styrene, polyolefin, polyvinyl chloride Various thermoplastic elastomers such as polyurethane, fluororubber, chlorinated polyethylene, epoxy resin, phenol resin, urea resin, melamine resin, unsaturated polyester, silica Over down resin, a copolymer of a polyurethane or the like, or these main, it is possible to use a blend, a polymer alloy or the like film. The plastic film substrate 10 may be configured as a laminated film having a multilayer structure, for example, by combining one or more of these resin materials. Further, an inorganic film may be used. For example, aluminum (Al), aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), oxide film (SiO ₂ , SiOx), nitride film (SiN, SiON), ITO, IZO Glass or the like can be used. One or more inorganic materials may be combined with a resin material to form a multilayer film having a multilayer structure. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. It is not preferable to perform in the atmosphere since defects such as pinholes are generated in the reflective layer because water or oxygen may enter the cathode 109 from the defective portion and the cathode 109 may be oxidized. In this way, an organic electroluminescence device as shown in FIGS. 6-8 is obtained.

  As described above, according to the present embodiment, the film substrate 10 is adsorbed to the porous plate 40 by the suction and pressurizing means 25, and the film is formed on the film substrate 10 adsorbed to the porous plate 40. Therefore, film formation can be performed on the film substrate 10 while the film substrate 10 is adsorbed to the porous plate 40, flatness can be ensured by preventing the film substrate 10 from being bent or warped, and glass. It can be handled in the same manner as a substrate, and can be uniformly formed or processed in the same manner as a glass substrate. As a result, it is possible to provide an electro-optical device manufacturing method and a droplet discharge device capable of improving the film forming property when forming a film on a film substrate.

  Further, according to the present embodiment, since the silicon rubber 41 having a large number of holes formed between the porous plate 40 and the film substrate 10 is sandwiched, the silicon rubber 41 is adjusted when the position of the film substrate 10 is adjusted. By adjusting the position, the position of the film substrate 10 can be adjusted, and the position can be adjusted easily.

  Further, according to the present embodiment, when the suction state of the film substrate 10 is released, the pressure is applied by the suction pressurizing means 25, so that the suction state of the film substrate 10 can be easily released.

  In addition, according to the present embodiment, the distance measuring unit 12 detects the distance from the film substrate 10 adsorbed to the porous plate 40, and the control unit 15 determines the droplet discharge head based on the distance measurement result. 11 and the film substrate 10 are controlled so that the distance (gap) is always constant. Therefore, even when the surface of the film substrate 10 is uneven, the distance between the droplet discharge head 11 and the film substrate 10 is It can be made constant, and variations in printing can be prevented.

  FIG. 7 is a diagram for explaining the table 16 of the droplet discharge device 1 according to the second embodiment. FIG. 7-1 is a cross-sectional view of the table 16 according to the second embodiment, and FIG. A plan view of the table 16 is shown. In Example 1 (see FIG. 3), the porous plate 40 is placed on the table 16. On the other hand, in the second embodiment, as shown in FIG. 7, a porous plate portion 16e is formed on the upper surface of the table 16, and a vacuum line 16d is formed on the lower side of the porous plate portion 16e. . With this configuration, it is not necessary to separately place a porous plate on the table 16, and the configuration in the case where the film substrate 10 is adsorbed can be simplified.

  FIG. 8 is a cross-sectional view of the table 16 of the droplet discharge device 1 according to the third embodiment. In the first embodiment, the suction pressurizing unit 25 releases the suction state of the silicon rubber 41 with respect to the porous plate 40 by applying the pressure after the suction of the vacuum line 16 is turned off. On the other hand, in the third embodiment, as shown in FIG. 8, a porous plate of the silicon rubber 41 is formed by sandwiching a glass plate or a plastic plate 50 between the porous plate 40 and the silicon rubber 41 without providing a pressurizing means. This is a configuration in which the degree of adsorption to the quality plate 40 is weakened. Thereby, the silicon rubber 41 can be prevented from being completely adsorbed to the porous plate 40. When adjusting the position of the film substrate 10, the suction of the suction means 100 is turned off, and then the position of the film substrate 10 is adjusted by moving the silicon rubber 41.

(Application example to electro-optical device)
The manufacturing method of the electro-optical device of the present invention can be used for manufacturing various electro-optical devices in addition to the organic EL electroluminescence device, for example, a liquid crystal display device, an organic TFT device, a plasma display device, an electrophoretic display. It can be widely applied to devices, electron emission display devices (Field Emission Display, Surface-Conduction Electoron-Emitter Display, etc.), LED (Light Emitting Diode) display devices, electrochromic glass devices, electronic paper devices and the like.

(Application example to electronic equipment)
Next, specific examples of electronic devices to which the electro-optical device according to the invention can be applied will be described with reference to FIG. FIG. 9A is a perspective view illustrating an example in which the electro-optical device according to the present invention is applied to the display unit of a portable personal computer (so-called notebook personal computer) 200. As shown in the figure, the personal computer 200 includes a main body unit 202 including a keyboard 201 and a display unit 203 to which the electro-optical device according to the invention is applied. FIG. 9B is a perspective view illustrating an example in which the electro-optical device according to the invention is applied to the display unit of the mobile phone 300. As shown in the figure, the mobile phone 300 includes a plurality of operation buttons 301, a receiving mouth 302, a mouthpiece 303, and a display unit 304 to which the electro-optical device according to the invention is applied.

  The electro-optical device according to the present invention includes a portable information device called PDA (Personal Digital Assistants), a personal computer, a workstation, a digital still camera, an in-vehicle monitor, a digital video camera, in addition to the above-described cellular phone and notebook computer. Can be widely applied to electronic devices such as liquid crystal televisions, viewfinder type, monitor direct view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, and POS terminals. .

  The method for manufacturing an electro-optical device according to the present invention can be widely used when a film is formed on a plastic film substrate mounted on the electro-optical device. The electro-optical device according to the present invention includes an organic EL electroluminescence, a liquid crystal display device, an organic TFT device, a plasma display device, an electrophoretic display device, an electron emission display device (Field Emission Display, Surface-Conduction Electoron-Emitter Display, etc. ), LED (light emitting diode) display devices, electrochromic glass devices, and electro-optical devices of electronic paper devices. The electronic device according to the present invention includes a mobile phone, a portable information device called PDA (Personal Digital Assistants), a portable personal computer, a personal computer, a workstation, a digital still camera, an in-vehicle monitor, a digital video camera, and a liquid crystal display. It can be widely used in electronic devices such as televisions, viewfinder type, monitor direct view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, and POS terminals.

1 is a schematic perspective view illustrating an overall configuration of a droplet discharge device according to Embodiment 1. FIG. 2 is an exploded perspective view of a droplet discharge head according to Embodiment 1. FIG. 1 is a cross-sectional view of a droplet discharge head according to Embodiment 1. FIG. FIG. 3 is a plan view of the table according to the first embodiment. FIG. 3 is a cross-sectional view of the table according to the first embodiment. The schematic diagram for demonstrating the method to make constant the distance between a droplet discharge head and a plastic film board | substrate. FIG. 4 is a diagram illustrating a schematic processing flow of film formation of the droplet discharge device according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. FIG. 6 is an explanatory diagram for explaining a manufacturing process of the EL substrate according to the first embodiment. Sectional drawing of the table which concerns on Example 2. FIG. FIG. 6 is a plan view of a table according to the second embodiment. Sectional drawing of the table which concerns on Example 3. FIG. 1 is a perspective view of a personal computer equipped with an electro-optical device according to an embodiment. 1 is a perspective view of a mobile phone including an electro-optical device according to an example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Droplet discharge apparatus, 2 Coating liquid, 10 Film substrate, 11 Droplet discharge head 12 Distance measuring means, 13 Droplet discharge means, 14 Moving means, 15 Droplet discharge means, 16 Substrate stage, 17 Head support part 18 Stage , 19 stage drive unit, 20 θ axis stage, 21 stage, 22 tube, 23 tank, 31 nozzle plate, 32 vibration plate, 33 partition member (reservoir plate), 34 space, 35 liquid reservoir, 36 supply port, 37 nozzle, 37a hole, 38 piezoelectric element (piezo element), 39 electrode, 40 porous plate, 41 silicon rubber, 101 transparent electrode, 102 bank part (partition), 102a inorganic bank layer, 102b organic bank layer, 103, 103a, 103b opening Part, 104 droplet discharge head, 105 ink composition, 06 Hole injection / transport layer, 107a, 107b, 107c Ink composition, 108a, 108b, 108c Light-emitting layer, 109 Cathode, 120 Sealing layer, 200 Personal computer, 201 Keyboard, 202 Main body, 203 Display, 300 Mobile Telephone, 301 operation buttons, 302 earpiece, 303 mouthpiece, 304 display unit

Claims (15)

In the method of manufacturing an electro-optical device that forms a film on a film substrate,
A film adsorption process for adsorbing the plastic film substrate to a porous plate;
A film forming step of forming a film on the film substrate adsorbed on the porous plate;
A method for manufacturing an electro-optical device.   2. The method of manufacturing an electro-optical device according to claim 1, wherein, in the film adsorption step, silicon rubber having a large number of holes is interposed between the porous plate and the film substrate.   3. The method of manufacturing an electro-optical device according to claim 2, wherein a glass plate or a plastic plate is interposed between the porous plate and the silicon rubber in the film adsorption step.   The electro-optical device according to claim 1, further comprising a pressurizing step of pressurizing the film substrate adsorbed on the porous plate to release the adsorbed state of the film substrate. Production method. The film forming step includes
A detection step of detecting a distance from the film substrate adsorbed on the porous plate;
Based on the distance detection result detected in the detection step, an adjustment step of adjusting the distance between the droplet discharge head of the inkjet method and the film,
A droplet discharge step of forming a film by discharging droplets from the droplet discharge head to the film substrate after adjusting the distance between the droplet discharge head and the film in the adjustment step;
The method of manufacturing an electro-optical device according to claim 1, wherein The electro-optical device is an organic electroluminescence display device,
6. The electro-optic according to claim 1, wherein the film forming step includes a step of forming a hole injection / transport layer and a light emitting layer using an ink jet method. Device manufacturing method.   An electro-optical device manufactured by the method for manufacturing an electro-optical device according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 7. In a droplet discharge device that discharges droplet liquid from a droplet discharge head and forms a film on a substrate,
A droplet discharge apparatus, wherein a film is formed by discharging droplets from the droplet discharge head onto a film substrate adsorbed by a porous plate. A table on which a vacuum line for suction from the upper surface is formed;
Suction means for sucking from the vacuum line of the table;
With
The suction means places the porous plate on the upper surface of the table, and sucks from the vacuum line in a state where the film substrate is placed on the porous plate. The droplet discharge device according to claim 9, wherein the substrate is adsorbed. A table in which the porous plate is formed on at least a part of the upper surface, and a vacuum line for sucking from the porous plate is formed;
Suction means for sucking from the vacuum line of the table;
With
The suction unit sucks from the vacuum line in a state where the film substrate is placed on a porous plate formed on the table, and sucks the film substrate onto the porous plate. The droplet discharge device according to 1.   The liquid droplet ejection apparatus according to claim 9, wherein a silicon rubber having a large number of holes is interposed between the porous plate and the film substrate.   The liquid droplet ejection apparatus according to claim 12, wherein a glass plate or a plastic plate is interposed between the porous plate and the silicon rubber. Pressurizing means for pressurizing through the vacuum line of the table,
The liquid according to any one of claims 9 to 12, wherein the pressurizing unit pressurizes the vacuum line to release the adsorption state of the film substrate adsorbed on the porous plate. Drop ejection device. Detecting means for detecting a distance from the film substrate adsorbed on the porous plate;
Based on the distance detection result detected by the detection means, distance adjustment means for adjusting the distance between the droplet discharge head and the film;
The liquid droplet ejection apparatus according to claim 9, further comprising:

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