JP2005093845A - Apparatus for packaging electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus in which a mechanism for recognizing an electronic component is compact. <P>SOLUTION: The electronic component packaging apparatus for photographing the bottom of an electronic component sucked to suction nozzles and packaging the electronic component on a circuit board is provided with a reflection mirror which is oscillatorily supported under a first recognition camera 9 so that the optical axis of the first recognition camera 9 intersects with the center axis of oscillation, an oscillation motor 11 for oscillating the reflection mirror 13 and a control means 20 for controlling respective units so that the reflection mirror 13 is oscillated and images of the electronic components sucked to a plurality of suction nozzles are picked up and recognized by the first recognition camera. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus that sucks an electronic component with a suction nozzle provided in a mounting head and mounts the electronic component on a circuit board, and particularly relates to recognition of the electronic component sucked by the suction nozzle.

  2. Description of the Related Art Conventionally, an apparatus using a reflection mirror has been proposed for performing component recognition of an electronic component mounting apparatus. The apparatus described in Japanese Patent Application Laid-Open No. 2000-114787 is an example of this. This apparatus is composed of a plurality of mounting heads arranged in a straight line in the left-right direction in the figure, a suction nozzle individually provided on the mounting head, a reflection mirror and a camera arranged on the lower surface of the suction nozzle. . The reflection mirror and the camera are fixed to a mounting plate and linearly move along the left-right direction integrally by a motor, and the reflection mirror can sequentially face a plurality of suction nozzles.

  Due to the linear movement of the reflecting mirror and the camera, the image of the bottom surface of the electronic component sucked by the plurality of sucking nozzles is sequentially totally reflected by the reflecting mirror and picked up by the camera. The captured image is recognized by the component recognition device and used for mounting the electronic component on the circuit board.

JP 2000-114787 (FIG. 3)

  However, in the electronic component mounting apparatus, it is necessary to linearly move the reflection mirror and the camera fixed to the attachment body along the left-right direction below the suction nozzle. This required a large moving space. Further, it is necessary to provide a guide member for guiding the linear movement of the mounting plate. These have been a major obstacle to downsizing the apparatus.

  Further, since the reflecting mirror and the camera are linearly moved, if the moving distance becomes long, an error occurs and there is a possibility that the variation of component recognition becomes large.

  The present invention has been made to solve the above problem, and an object thereof is to provide an electronic component mounting apparatus having a compact mechanism for recognizing electronic components.

  It is another object of the present invention to provide an electronic component mounting apparatus that is less likely to cause errors when recognizing electronic components sucked by a plurality of suction nozzles.

In order to solve the above problem, the invention according to claim 1
A mounting head (3) provided with a plurality of suction nozzles for sucking electronic components;
Moving means (21, 22) for moving the mounting head in a horizontal direction;
Drive means (15) for moving the suction nozzle up and down;
Rotating means (16) for rotating the suction nozzle about its axis;
A first image pickup means (9) fixed to the mounting head and capable of picking up a lower image, picking up an image of the bottom surface of the electronic component sucked by the suction nozzle and recognizing the electronic component on a circuit board; In the electronic component mounting device to be mounted,
A reflection mirror (13) supported so as to be swingable below the first image pickup means, and arranged so that the optical axis of the first image pickup means and its swing center axis intersect;
Oscillating means (11) for oscillating the reflecting mirror;
Control means (20) for controlling the image pickup device to pick up and recognize the image of the electronic component sucked by the plurality of suction nozzles by swinging the reflection mirror. It was.

The invention according to claim 2 is the electronic component mounting apparatus according to claim 1,
The suction nozzle is disposed on a rotation locus surface of the reflection mirror, and
The control unit is configured to move the plurality of suction nozzles up and down to match the focal lengths from the first imaging unit to the electronic components via the reflection mirror.

The invention described in claim 3
A mounting head (3) provided with a plurality of suction nozzles for sucking electronic components;
Moving means (21, 22) for moving the mounting head in a horizontal direction;
Drive means (15) for moving the suction nozzle up and down;
Rotation means (16) for rotating the suction nozzle about its axis, and imaging and recognizing the bottom surface of the electronic component sucked by the suction nozzle and mounting the electronic component on the circuit board In electronic component mounting equipment,
A second imaging means (31) supported swingably below the mounting head;
Rocking means (11) for rocking the second imaging means;
Control means (20) for controlling the second imaging means to swing so that the image of the electronic component sucked by the plurality of suction nozzles is picked up and recognized by the second imaging means. The configuration.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the third aspect,
The suction nozzle is disposed on the swing locus surface of the second imaging means,
The control unit is configured to move the plurality of suction nozzles up and down to match the focal lengths from the second imaging unit to the electronic components.

As described above, according to the invention of claim 1,
An image of the electronic component reflected by the swing of the reflecting mirror is picked up by the first image pickup means and recognized. For this reason, since a big movement space, a guide member, etc. are not required, an apparatus can be made compact. Also, errors are less likely to occur when recognizing electronic components.

  According to the second aspect of the present invention, since the focal lengths from the first image pickup means to each electronic component are the same, the component recognition can be performed without performing the focus correction of the photographed image.

  According to the third aspect of the present invention, the image of the electronic component is picked up and recognized by the second image pickup means by the swing of the second image pickup means. For this reason, since a big movement space, a guide member, etc. are not required, an apparatus can be made compact. Also, errors are less likely to occur when recognizing electronic components.

  According to the fourth aspect of the present invention, since the focal lengths from the second image pickup unit to each electronic component are the same, the component recognition can be performed without correcting the focus of the photographed image.

A first embodiment of the present invention will be described with reference to FIGS.
The electronic component mounting apparatus 1 is provided with a set of board conveyance rails (not shown) along the board conveyance direction X on the apparatus main body base. A circuit board (hereinafter referred to as a board) 2 is placed on the board transport rail. The substrate 2 moves along the substrate transport rail, stops at a predetermined position, is held, and electronic components are mounted. A mounting head 3 is disposed above the substrate 2. The mounting head 3 is attached to the X-axis gantry 4 by an unillustrated X-axis moving mechanism (moving means) so that it can move in the X direction.

  Both ends of the X-axis gantry 4 are attached to the two Y-axis gantry 5 and 5 by a Y-axis moving mechanism (moving means) (not shown) so that the X-axis gantry 4 can move in the Y direction. The mounting head 3 is supported by the X-axis moving mechanism and the Y-axis moving mechanism so as to be movable in the horizontal direction. Further, an electronic component supply device 6 that supplies components to be mounted is arranged along the X direction of the apparatus main body base.

  As shown in FIG. 2, the mounting head 3 is composed of a head fixing portion 7 and four mounting heads 8. A head fixing portion 7 is disposed at the center of the mounting head 3. Two mounting heads 8 are fixed to the left and right sides of the head fixing portion 7. And these head fixing | fixed part 7 and the mounting head 8 are arrange | positioned so that the centerline may be linear along the X direction.

  The head fixing part 7 has a box shape, and a first recognition camera (first imaging means) 9 is fixed to the lower part thereof. The first recognition camera 9 is fixed so that its lens faces downward, and can capture a lower image. The optical axis 9 a of the first recognition camera 9 coincides with the center of the head fixing unit 7. The first recognition camera 9 includes a CCD camera, a CMOS camera, a line sensor camera, and the like.

  A support plate 10 is fixed to the back surface of the head fixing portion 7 in the Y direction. The support 10 is disposed along the vertical direction and extends downward from the first recognition camera 9. A swing motor (swing means) 11 is fixed to the rear side of the lower end of the support plate 10. The rotating rod 12 of the swing motor 11 extends to the front side along the Y direction in the figure. A plate-like reflection mirror 13 is fixed to the distal end side of the rotating rod 12. The central axes of the reflection mirror 13 and the rotating rod 12 overlap each other when viewed from above. And the optical axis 9a of the 1st recognition camera 9 and the rocking | fluctuation central axis 13a of the reflective mirror 13 are orthogonal. Further, since the suction nozzles 14a, 14b, 14c, and 14d are disposed on the swing locus surface of the reflection mirror 13, when the reflection mirror 13 swings, the image of the electronic component sucked by each suction nozzle is reflected. After being reflected by the mirror 13, the image is taken by the first recognition camera 9.

The mounting head 8 includes a main body portion 8a, a movable portion 8b, a Z-axis motor (driving means) 15, a θ-axis motor (rotating means) 16, a connecting member 17, a ball screw shaft 18, and the like.
The main body 8a is an inverted L-shaped plate member, and a guide groove 8c is formed along the vertical direction thereof. A protrusion (not shown) of the movable portion 8b engages with the guide groove 8c. The guide groove 8c guides the movable portion 8b along the vertical direction. The movable portion 8 b has a θ-axis motor (rotating means) 16 fixed on the upper surface thereof, and an adsorption rod 14 is fixed to the rotating shaft of the θ-axis motor 16. A connecting member 17 is fixed to the upper end protrusion of the movable portion 8b. The connecting member 17 is formed with a female screw penetrating along the vertical direction.

  The Z-axis motor (driving means) 15 is fixed to the upper part of the main body 8a. A ball screw 18 is connected to the rotation shaft of the Z-axis motor 15. The ball screw 18 extends downward and is screwed into the female screw of the connecting member 17. The suction nozzle 14 moves up and down when the Z-axis motor 15 is driven, and rotates around the nozzle center axis when the θ-axis motor 16 is driven. The Z-axis motor 15 and the θ-axis motor 16 are independent from each other, and can move up and down or rotate regardless of the operation of other mounting heads. Since the ball screw 18 has a predetermined amount of length, the lower end of the suction nozzle 13 can move further downward beyond the reflection mirror 13 fixed to the mounting head 3.

  FIG. 3 shows the configuration of the control system of the electronic component mounting apparatus 1. Reference numeral 20 denotes a controller (control means), which includes a microcomputer (CPU) for controlling the entire apparatus, RAM, ROM, and the like. The controller 20 is connected to the following input / output mechanisms and controls each of them.

  The X-axis motor (moving means) 21 is a drive source for the X-axis moving mechanism of the mounting head 3. The X-axis motor 21 moves the mounting head 3 in the X direction along the X-axis gantry 4. The Y-axis motor (moving means) 22 is a drive source for the Y-axis moving mechanism of the mounting head 3. The Y-axis motor 22 moves the X-axis gantry 4 in the Y direction along the Y-axis gantry 5. The mounting head 3 can move in the horizontal direction by driving the X-axis motor 21 and the Y-axis motor 22.

  The Z-axis motor (driving means) 15 is a drive source of an elevating mechanism that moves the suction nozzle 14 up and down, and moves the suction nozzle 11 up and down in the vertical direction. The θ-axis motor 16 is a drive source for the rotation mechanism of the suction nozzle 14 and rotates the suction nozzle 11 about the nozzle central axis. In FIG. 3, only one Z-axis motor 15 and θ-axis motor 16 are shown, but there are as many as the number of suction nozzles 14 to be mounted.

  The vacuum mechanism 23 generates a vacuum, and generates a negative vacuum pressure on the suction nozzle 23 via a vacuum switch (not shown). As many vacuum mechanisms as the number of suction nozzles 14 are provided.

  The image recognition device 25 performs image recognition of the electronic component 24 sucked by each of the suction nozzles 14, and includes an A / D converter 25a, a memory 25b, and a CPU 25c. Then, an analog image signal output from the first recognition camera 9 that images the picked-up electronic component 24 is converted into a digital signal of image data by the A / D converter 25a and stored in the memory 25b. Based on the image data, a displacement amount and a suction angle displacement (hereinafter referred to as a displacement amount including both) of the suction position of the component 24 sucked are calculated.

  The keyboard 28 and mouse 29 are used for inputting data such as component data.

  The storage device 26 is configured by a flash memory or the like, and is used to store component data input by a keyboard 28 and a mouse 29 or component data supplied from a host computer (not shown). The component data includes component supply position data for each tape feeder of the electronic component supply apparatus 6 including a plurality of tape feeders, and vertical, horizontal, and height dimensions of the electronic components stored in the component supply position data. Is applicable.

  The monitor 27 displays component data, calculation data, an image of the component 24 captured by the first recognition camera 9 and the like.

  The operation of the first embodiment will be described. The following operations are performed under the control of the controller (control means) 20.

  First, the mounting head 3 is moved in the horizontal direction by driving the X-axis motor 21 and the Y-axis motor 22, and the suction nozzle 14 a is positioned on the electronic component supply device 6.

Next, the Z-axis motor 15 is driven to lower the suction nozzle 14a, and the vacuum mechanism 23 is driven to suck the electronic component 24.
Next, the Z-axis motor 23 is driven to raise the suction nozzle 14a to the reference position W, and the component suction operation is completed. This component suction operation is sequentially performed for the remaining suction nozzles 14b, 14c, and 14d.

  Next, it is assumed that a circle 30 having a radius r intersects with the vertical movement locus of each suction nozzle 14 around the swing center 13a of the reflection mirror 13. Then, the Z-axis motor 15 is driven to move the suction nozzles 14a, 14b, 14c, and 14d so that the circle 30 and the vertical movement trajectories of the suction nozzles 14a, 14b, 14c, and 14d intersect each other. This state is shown in FIG. Each suction nozzle 14 a, 14 b, 14 c, 14 d is located on a concentric circle 30 centered on the swing center of the reflection mirror 13.

  Next, the oscillating motor 11 is driven to oscillate the reflection mirror 13, and the images of the electronic components 24 adsorbed by the respective suction nozzles 14a, 14b, 14c, 14d are sequentially sent to the first recognition camera 9. . The sent video is captured by the first recognition camera.

Next, the captured image is taken into the image recognition device 25 and displayed on the monitor 27.
Next, due to the difference in the suction nozzle position, the captured image of the electronic component has an oblique distortion. This distortion is corrected.

  Next, based on the corrected image, the difference between the center position of each suction nozzle 14 that has been measured and stored in advance and the center position of the sucked electronic component is calculated, and the deviation amount of the component suction position And a suction angle shift (hereinafter referred to as a shift amount including both) are calculated.

  Next, when calculation of the shift amount with respect to the center position is completed for all electronic components, the X-axis motor 21 and the Y-axis motor 22 are driven to move the sucked electronic components to the mounting position on the substrate. At this time, the X-axis motor 21, the Y-axis motor 22, and the θ-axis motor 23 are driven to correct the deviation amount with respect to the previously obtained center position so that the electronic component can be mounted at the correct mounting position on the board. To do.

  Next, after the suction nozzle 14 is lowered, the suction of the vacuum mechanism 23 is cut off, and electronic components are mounted on the substrate.

  According to the first embodiment, the image of the reflected electronic component is captured by the first recognition camera 9 and recognized by the 13 swings of the reflecting mirror. For this reason, since a big movement space, a guide member, etc. are not required, an apparatus can be made compact. Also, errors are less likely to occur when recognizing electronic components.

  Further, each suction nozzle 14 is arranged on the swing locus surface of the reflection mirror 13. Further, each suction nozzle 14 is moved up and down to position each suction nozzle 14 on a concentric circle 30 centered on the center of oscillation of the reflection mirror 13. At this time, the focal distances from the first recognition camera 9 to the respective electronic components are the same, and component recognition can be performed without correcting the focus of the captured image.

A second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, instead of the reflection mirror 13 of the first embodiment, the second recognition camera 31 is directly swung to image and recognize the electronic components sucked by the suction nozzles 14. . The same components as those in the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  A support 10 is fixed to the head fixing portion 7. A swing motor (swing means) 11 is provided at the lower end of the support 10. The rotating rod 12 of the swing motor 11 extends to the front side along the Y direction in the figure. A second recognition camera (second imaging unit) 31 is fixed to the distal end side of the rotating rod 12. The second recognition camera 31 is a CCD camera, a CMOS camera, a line sensor camera, or the like. The second recognition camera 31 is fixed so that its lens faces upward. The suction nozzles 14a, 14b, 14c, and 14d are sequentially arranged from the right side on the swing locus surface above the second recognition camera 31. When the swing motor 11 is driven and the second recognition camera 31 is swung, the respective suction nozzles 14 and the electronic components 24 sucked by the suction nozzles arranged on the swing locus surface can be sequentially imaged. it can.

  The control system of the second embodiment includes the motors 21, 22, 23, 11, 15, 16 and the image recognition device 25 and the like, similar to that shown in the first embodiment, and is controlled by the controller (control means) 20. To match. However, the difference is that the second recognition camera 31 is swung by the swing motor 11 and the second recognition camera 31 is connected to the image recognition device 25.

The operation of the second embodiment is controlled by the controller 20.
As shown in FIG. 6, after each suction nozzle 14a, 14b, 14c, 14d sucks the electronic component 24, as in the first embodiment, the Z-axis motor 15 is driven, and each suction nozzle 14a, 14b, 14c and 14d are moved on a concentric circle 32 having a radius r centered on the swing center 31a of the second recognition camera 31. Next, the swing motor 11 is driven to swing the second recognition camera 31. Then, the second recognition camera 31 captures images of the electronic components sucked by the suction nozzles 14a, 14b, 14c, and 14d. After correcting the captured image, the shift amount with respect to the center position is calculated for all electronic components. When the calculation of the deviation amount is completed, the X-axis motor 21 and the Y-axis motor 22 are driven to move the sucked electronic component to the mounting position on the substrate. At this time, the X-axis motor 21, the Y-axis motor 22, and the θ-axis motor 23 are driven to correct the deviation amount with respect to the previously obtained center position, and the electronic component is mounted at the correct mounting position on the board.

  According to the second embodiment, the second recognition camera 31 captures and recognizes an image of the electronic component by swinging the second recognition camera 31. For this reason, since a big movement space, a guide member, etc. are not required, an apparatus can be made compact. Also, errors are less likely to occur when recognizing electronic components.

  Further, each suction nozzle 14 is disposed on the swing locus surface of the second recognition camera 31. Further, each suction nozzle 14 is moved up and down to position each suction nozzle 14 on a concentric circle 32 centered on the swing center of the second recognition camera 31. For this reason, the focal distances from the second recognition camera 31 to the respective electronic components are the same, and the components can be recognized without correcting the focus of the captured image.

The present invention is not limited to the first and second embodiments and can be variously modified.
For example, in the above embodiment, a plurality of suction nozzles that suck electronic components are moved simultaneously on the concentric circles 30 and 32 centered on the swing center of the reflection mirror 13 or the swing center of the second recognition camera 31. It was. Then, the reflecting mirror 13 and the second recognition camera were swung to take an image. Instead of this, it is also conceivable to pick up images by moving them one by one on a concentric circle.

  In the above embodiment, the four suction nozzles 14 are arranged in a line on the swing locus surface of the reflection mirror 13 or the second recognition camera 31. Instead, the swing locus surface is arranged in the Y direction. It is also possible to easily extend it to 4 * 2 rows. It is assumed that the suction nozzles are linearly arranged on each swing trajectory plane in the arrangement of plural * 1 rows or plural * plural rows.

  Moreover, in the said Example, the bottom face of the electronic component adsorbed by the adsorption nozzle was imaged and recognized, and the deviation | shift amount was correct | amended. Instead of this, it is also easy to inspect the presence or absence of nozzles, nozzle type, nozzle mounting height, etc. by imaging and recognizing the suction nozzle using this device before the electronic component mounting operation. It is done.

  In the above embodiment, the reflection mirror 13 or the second recognition camera is fixed to the support plate 10 of the head fixing portion 7 of the mounting head 3. That is, it was fixed to the mounting head 3 and moved together with the mounting head 3. Instead, the reflecting mirror 13 or the second recognition camera is fixed on the table of the apparatus main body, and after moving the mounting head so that each suction nozzle is arranged on the swing locus surface, It is easily conceivable to perform imaging and recognition of the suction nozzle.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the whole electronic component mounting apparatus of 1st Example. It is a perspective view which shows the structure of the mounting head of 1st Example. It is a block diagram which shows the structure of the control system of 1st Example. It is explanatory drawing for making the focal distance of 1st Example correspond. It is a perspective view which shows the structure of the mounting head of 2nd Example. It is explanatory drawing for making the focal distance of 2nd Example correspond.

Explanation of symbols

3... Installation head 21 .. X-axis motor (moving means)
22..Y-axis motor (moving means)
23..Z-axis motor (drive means)
16. ・ θ-axis motor (turning means)
9 ... 1st recognition camera (1st imaging means)
13. ・ Reflection mirror 20 ・ ・ Controller (control means)
11. Swing motor (swing means)
31 .. Second recognition camera (second imaging means)

Claims (4)

A mounting head provided with a plurality of suction nozzles for sucking electronic components;
Moving means for moving the mounting head in a horizontal direction;
Drive means for moving the suction nozzle up and down;
Rotating means for rotating the suction nozzle about its axis;
An first image pickup unit fixed to the mounting head and capable of picking up a lower image, picking up and recognizing the bottom surface of the electronic component sucked by the suction nozzle and mounting the electronic component on a circuit board In component mounting equipment,
A reflection mirror that is swingably supported below the first image pickup means and that is arranged so that the optical axis of the first image pickup means intersects with the swing center axis thereof;
Oscillating means for oscillating the reflecting mirror;
Control means for controlling the image pickup device to pick up and recognize the image of the electronic component sucked by the plurality of suction nozzles by swinging the reflection mirror. Electronic component mounting device. The electronic component mounting apparatus according to claim 1,
The suction nozzle is disposed on a swing locus surface of the reflection mirror,
The control means moves the plurality of suction nozzles up and down to match the focal lengths from the first recognition means to the electronic parts via the reflection mirror. A mounting head provided with a plurality of suction nozzles for sucking electronic components;
Moving means for moving the mounting head in a horizontal direction;
Drive means for moving the suction nozzle up and down;
A rotating means for rotating the suction nozzle about its axis, and imaging the bottom surface of the electronic component sucked by the suction nozzle, recognizing and mounting the electronic component on a circuit board In the device
A second imaging means supported swingably below the mounting head;
Rocking means for rocking the second imaging means;
And a control means for controlling the second imaging means to swing so that the image of the electronic component sucked by the plurality of suction nozzles is picked up and recognized by the second imaging means. An electronic component mounting apparatus. In the electronic component mounting apparatus according to claim 3,
The suction nozzle is disposed on the swing locus surface of the second imaging means,
The electronic component mounting apparatus, wherein the control means moves the plurality of suction nozzles up and down to match the focal lengths from the second recognition means to the electronic components.

Images