JP2005087577A - Laminated structure body array, method of manufacturing the same, and method of manufacturing ultrasonic transducer array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily manufacture laminated structure body array with a plurality of laminated structure bodies such as piezoelectric transducers disposed in an arbitrary array. <P>SOLUTION: The method of manufacturing the laminated structure body array comprises steps S11-S13 for preparing a plurality of elements of the laminated structure bodies with electrodes formed in a piezoelectric material, a step S14 for manufacturing a substrate for disposing the plurality of elements by forming at least one metal material layer on a main surface of the material of the substrate, a step S15 for heating the substrate to a temperature at which at least one metal material layer softens, a step S16 for disposing the plurality of elements on the heated main surface of the substrate and temporarily fixing the elements, and a step S17 for fixing the plurality of elements on the substrate after the substrate is cooled by heating the substrate on which the plurality of elements are temporarily fixed to a temperature higher than a melting point of at least one metal material layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer structure array in which a plurality of elements of a multilayer structure in which electrodes are formed on a piezoelectric material are two-dimensionally arranged, and a method for manufacturing the same. The present invention also relates to a method of manufacturing an ultrasonic transducer array including such a laminated structure array and used in an ultrasonic diagnostic apparatus for medical use or nondestructive inspection.

  Piezoelectric ceramics represented by PZT (Pb (lead) zirconate titanate) and piezoelectric elements including polymer piezoelectric elements represented by PVDF (polyvinylidene difluoride) are used in various applications. It's being used. For example, when a voltage is applied to the piezoelectric element through the electrodes in a laminated structure in which electrodes are arranged at both ends of the piezoelectric element, the piezoelectric element expands and contracts due to the piezoelectric effect. Such a laminated structure is used in various applications such as a piezoelectric pump and a piezoelectric actuator. In particular, in the field related to MEMS (microelectromechanical system), along with the development of devices, miniaturization and integration of elements having such a laminated structure have been advanced.

  In the medical field, such a laminated structure is used as an element (ultrasonic transducer) that transmits or receives ultrasonic waves in an ultrasonic probe of an ultrasonic diagnostic apparatus. In recent years, in order to acquire a high-quality two-dimensional or three-dimensional image in real time, development of a two-dimensional sensor array capable of scanning a subject without mechanically moving a probe has been advanced.

Conventionally, in such a two-dimensional sensor array, a laminated structure in which electrodes are previously provided on piezoelectric elements is arranged on a substrate, or a piezoelectric material plate provided with electrodes is divided into two dimensions by dicing. Was manufactured by. In Patent Document 1, a two-dimensional array ultrasonic probe has a structure in which a printed circuit board for extracting a signal and a ground from each transducer is arranged in each column interval of elements arranged in a matrix. It is disclosed that a two-dimensional array transducer is configured by mounting a transducer array corresponding to one column on the top and then arranging printed circuit boards mounted with the transducers in a row direction. In Patent Document 2, after bonding a piezoelectric material on a sound absorbing material, a piezoelectric material is cut at a predetermined pitch with a dicing saw having a predetermined thickness to form an array vibrator, and a small amount is inserted into the cut groove. It is disclosed that an ultrasonic probe is manufactured by filling a polymer resin mixed with a hollow body. However, with the miniaturization and integration of ultrasonic transducers, it has become difficult to dispose elements one by one on a substrate. Further, according to the method of dividing the plate material, the elements can only be arranged in a two-dimensional matrix. However, in order to transmit an ultrasonic beam having a desired shape from the ultrasonic probe, there are cases in which elements are not limited to a two-dimensional matrix but may be arranged in various arrangements.
JP 2001-309493 A JP 9-238399 A

  In view of the above points, an object of the present invention is to easily produce a laminated structure array in which a plurality of laminated structures such as piezoelectric vibrators are arranged in an arbitrary arrangement. Moreover, an object of this invention is to provide the manufacturing method of the ultrasonic transducer array containing such a laminated structure array.

  In order to solve the above-described problem, a multilayer structure array manufacturing method according to a first aspect of the present invention includes a step (a) of preparing a plurality of elements of a multilayer structure in which electrodes are formed on a piezoelectric material, and a substrate material Forming a substrate for arranging a plurality of elements by forming at least one metal material layer on the main surface of the substrate, and heating the substrate to a temperature at which the at least one metal material layer softens (C), a step (d) of arranging and temporarily fixing a plurality of elements in a desired arrangement on the main surface of the heated substrate, and a substrate on which the plurality of elements are temporarily fixed to at least one metal A step (e) of fixing a plurality of elements to the substrate after the substrate is cooled by heating to a temperature equal to or higher than the melting point of the material layer.

  The method for manufacturing a multilayer structure array according to the second aspect of the present invention includes a step (a) of preparing a plurality of elements of a multilayer structure in which electrodes are formed on a piezoelectric material, and a main surface of a substrate material. A step (b) of forming a substrate for arranging a plurality of elements by forming a partition wall surrounding a plurality of predetermined areas, and arranging the plurality of elements in the plurality of areas respectively; (C) which fixes an element to a board | substrate.

  Furthermore, the method of manufacturing an ultrasonic transducer array according to the first aspect of the present invention includes a step of preparing a plurality of elements of a laminated structure in which a first electrode is formed on a piezoelectric material, and a main surface of a substrate material. Forming a substrate for arranging a plurality of elements by forming at least one metal material layer; heating the substrate to a temperature at which the at least one metal material layer softens; and heating the substrate A step of arranging a plurality of elements on the main surface in a desired arrangement and temporarily fixing the substrate, and heating the substrate on which the plurality of elements are temporarily fixed to at least the melting point of at least one metal material layer. A step of fixing the plurality of elements to the substrate after being cooled; a step of fixing the plurality of elements by filling the liquid resin material between the plurality of elements and then solidifying the liquid resin material; resin Removing at least the substrate from the plurality of elements fixed by the material, and forming a metal layer on the second surface opposite to the first surface of the plurality of elements exposed by removing the substrate. And a step of providing a second electrode.

  The method for manufacturing an ultrasonic transducer array according to the second aspect of the present invention includes a step of preparing a plurality of elements of a laminated structure in which a first electrode is formed on a piezoelectric material, and a main surface of a substrate material. A step of manufacturing a substrate for arranging a plurality of elements by forming a partition wall surrounding a plurality of predetermined areas, and arranging the plurality of elements in the plurality of areas, respectively, and arranging the plurality of elements on the substrate Fixing a plurality of elements by filling a liquid resin material between a plurality of elements and then solidifying the liquid resin material, and a plurality of elements fixed by the resin material The second electrode is provided by forming a metal layer on the second surface opposite to the first surface of the plurality of elements exposed by removing at least the substrate and removing the substrate. Process and To Bei.

  Furthermore, the laminated structure array according to the present invention is a laminated structure in which a substrate, a partition wall provided on a main surface of the substrate, surrounding a plurality of predetermined regions on the main surface, and electrodes are formed on a piezoelectric material. And a plurality of elements respectively bonded to a plurality of regions surrounded by the partition walls.

  ADVANTAGE OF THE INVENTION According to this invention, the laminated structure array by which the element of the several laminated structure is arrange | positioned by arbitrary arrangement | sequences can be produced easily. Further, according to the present invention, an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an arbitrary arrangement can be easily manufactured.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. The same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 1 is a flowchart showing a manufacturing method of a laminated structure array according to the first embodiment of the present invention. Moreover, FIG. 2 is a figure for demonstrating the manufacturing method of the laminated structure array which concerns on this embodiment.

In steps S11 to S13 of FIG. 1, an element having a laminated structure is manufactured. In the present embodiment, an ultrasonic transducer used for transmitting and receiving ultrasonic waves in an ultrasonic probe is manufactured as an element of a laminated structure.
First, in step S11, as shown in FIG. 2A, a piezoelectric material plate 11 having a predetermined thickness is prepared. As a piezoelectric material, a piezoelectric ceramic represented by PZT (Pb (lead) zirconate titanate) or a polymer piezoelectric element represented by PVDF (polyvinylidene difluoride) can be used. . In this embodiment, PZT is used. Such a plate of piezoelectric material is processed to a predetermined thickness by polishing or the like. The thickness of the plate material is defined by the following equation in order to obtain a desired oscillation frequency.
Thickness t (m) = frequency constant (m · Hz) / oscillation frequency f (Hz)
Here, the frequency constant is a value representing the characteristics of the piezoelectric material. For example, when a piezoelectric vibrator having an oscillation frequency of 5 MHz is manufactured using a PZT plate material having a frequency constant of 2285 m · Hz, the thickness of the PZT plate material may be set to 457 μm. The thickness of the plate (element height) is generally 400 μm to 700 μm.

  In step S12, as shown in FIG. 2B, the metal material 12 to be an electrode is formed on both surfaces of the piezoelectric material plate material 11 by sputtering. FIG. 2C is an enlarged view showing the metal material 12. The metal material 12 has a three-layer structure including a gold (Au) layer used as a conductive layer, and a platinum (Pt) layer and a titanium (Ti) layer for improving adhesion between the conductive layer and the piezoelectric material. Have. Here, the gold layer has a thickness of about 2 μm because it is also used for bonding the laminated structure element to the substrate. The platinum layer and the titanium layer have a thickness of about 100 nm and about 50 nm, respectively.

  In step S13, the plate material 12 on which the metal material 12 is formed is cut using a dicer. That is, as shown in FIG. 2D, first, the plate 12 is cut into rods at intervals of, for example, 300 μm, and the rod-like laminated structure is formed into a longitudinal shape as shown in FIG. For example, cutting is performed at intervals of 300 μm in a direction perpendicular to the direction. Thereby, the laminated structure element 13 including the piezoelectric material layer 13a and the metal material 13b is manufactured.

  Next, in step S <b> 14, as shown in FIG. 3A, the metal substrate 22 is formed on the substrate material 21, thereby manufacturing the array substrate 23 for arraying the stacked structure elements. As the substrate material 21, for example, a material having heat resistance of about 300 ° C. and good planarity, such as silicon (Si) or glass, is used. Further, the thickness of the substrate material 21 is preferably not excessively thick because the substrate may be removed and used when mounting the produced laminated structure array. For this reason, it is appropriate to set the thickness of the substrate material to about 0.2 to 0.5 t from the relationship with the height t of the laminated structure element.

  FIG. 3B is an enlarged view showing the metal material 22. The metal material 22 includes an indium (In) layer used as a bonding material, and a platinum layer and a titanium layer for improving the adhesion between the bonding material and the substrate. Here, in this embodiment, both indium formed on the substrate side and gold formed on the laminated structure element side are alloyed to bond them together. Therefore, it is desirable that the thickness of the indium layer of the metal material 22 is approximately the same as the thickness of the gold layer in the metal material 12 of the multilayer structure element. Therefore, the thickness of the indium layer is about 2 μm. The platinum layer and the titanium layer have a thickness of about 100 nm and about 50 nm, respectively. Note that the bonding material is not limited to indium, and bonding material including general solder, metal, or alloy may be used.

Next, in steps S15 to S17, the laminated structure element is arranged and fixed on the array substrate.
That is, in step S15, the array substrate is heated to about 125 ° C., which is lower than about 156 ° C. which is the melting point of indium, and at which indium softens. Next, in step S16, the laminated structure element is arranged on the array substrate using a bonder (two-dimensional positioning device). Here, in the bonder, it is assumed that coordinates for arranging the laminated structure elements are set in advance. As shown in FIG. 4, the laminated structure element 13 is attracted and conveyed to a predetermined coordinate position using a bonder collet 20, and the laminated structure element 13 is pressed against the array substrate 23. As a result, the multilayer structure element 13 is temporarily fixed by the softened indium. Similarly, all the laminated structure elements 13 are arranged and temporarily fixed. Next, in step S17, the temperature of the array substrate is raised to about 180 ° C. higher than the melting point of indium to melt indium, and after about 30 seconds, the arrangement substrate is cooled to solidify indium. Thereby, the laminated structure element 13 is fixed on the array substrate.

  In this manner, a stacked structure array in which a plurality of stacked structure elements are arranged on the substrate is manufactured. FIG. 5 is a plan view showing the arrangement of the stacked structure elements in the stacked structure array. As the arrangement of the laminated structure elements 13, as shown in FIG. 5A, a plurality of laminated structure elements 13 may be arranged concentrically, as shown in FIG. The density of the stacked structural element 13 may be changed according to the position on the array substrate 23. Alternatively, as shown in FIG. 5C, the structural elements 13 may be randomly arranged on the array substrate 23. According to the present embodiment, the structural elements can be arbitrarily arranged in this way.

Next, the manufacturing method of the laminated structure array which concerns on the 2nd Embodiment of this invention is demonstrated, referring FIGS. FIG. 6 is a flowchart showing the manufacturing method of the laminated structure array according to this embodiment.
First, in steps S11 to S13, a laminated structure element is manufactured. The manufacturing method of the laminated structure element is the same as that described in the first embodiment of the present invention.

Next, in steps S21 and S22, an array substrate for arraying the stacked structure elements is manufactured. This array substrate has a partition for supporting the laminated structure element.
In step S21, as shown in FIG. 7A, a DFR layer 32 is formed on the substrate material 31 by bonding a dry film resist (DFR) 32a using a laminator. As the substrate material 31, a material having good flatness such as silicon, glass, or plastic is used, and the thickness of the substrate material is set to 0.2 t to 0.5 t in relation to the height t of the laminated structure element. It is desirable to make it about. The DFR layer 32 constitutes a partition wall of the array substrate. Therefore, it is desirable that the height of the partition wall, that is, the thickness of the DFR layer 32, be about 50 μm to about 500 μm so that the laminated structure element (height of about 400 μm to about 700 μm) supported by the partition wall stands upright. . By repeating step S21, the dry film resist 32a is laminated until a predetermined thickness is reached. In the present embodiment, the thickness of the DFR layer 32 is about 300 μm.

  Alternatively, in step S21, a thick photoresist layer may be formed instead of the DFR layer. The thick film photoresist is a photoresist film that is thicker than a general photoresist film, and has a thickness of about 10 μm. Such a thick film photoresist can be formed using a photoresist material having a high viscosity.

  In step S22, the DFR layer 32 is patterned by using a photolithography method. That is, the DFR layer 32 is exposed using a mask in which the arrangement pattern of the laminated structure elements is formed in advance, and development, washing with water, and drying are performed. As a result, as shown in FIG. 7B, the region 33 where the stacked structure element is disposed in the DFR layer 32 is removed, and the partition wall 34 for supporting the stacked structure element is formed on the substrate material 31. Is done. Here, the size of the region 33 in which the multilayer structure element is arranged is set to be slightly larger than the bottom surface of the multilayer structure element. In the present embodiment, an area of 330 μm × 330 μm is formed for a laminated structure element having a bottom surface of 300 μm × 300 μm. The width of the partition wall 34 corresponds to the arrangement interval between adjacent stacked structure elements. In the present embodiment, the width of the partition wall 34 is 20 μm.

  Next, in step S23, the laminated structure element is arranged and fixed on the array substrate using a bonder. Here, in the bonder, it is assumed that the pattern of the partition formed in the DFR layer, that is, the coordinates for arranging the laminated structure are set in advance. As shown in FIG. 8, the laminated structure element 13 is adsorbed using a collet 20 of a bonder, and is transported and inserted into a region 34 located at a predetermined coordinate. At that time, the instantaneous adhesive 35 is injected into the bottom of the region 34 by using the micro pipettor 30. Thereby, the laminated structure element 13 is fixed to the region 34. By repeating such step S23, the laminated structure array shown in FIG. 9 is manufactured.

  In this embodiment, the width of the partition wall for supporting the laminated structure element is made uniform, but this width may be changed according to the position on the substrate. Thereby, it becomes possible to change the arrangement pitch of the laminated structure elements according to the position on the substrate. Also in this embodiment, various arrangements as shown in FIGS. 5A to 5C may be used.

  Further, as a modification of the present embodiment, an array substrate for arraying stacked structure elements may be manufactured using a glass partition material. That is, instead of steps S21 and S22 of FIG. 6, for example, a glass partition material for a plasma display panel is disposed on the substrate by screen printing, and the glass partition material is patterned using a sandblast method. Thereby, the partition for supporting a laminated structure element can be formed.

  In the first and second embodiments of the present invention described above, a single-layer laminated structure element produced by forming electrodes on both surfaces of a piezoelectric material plate is used. It is also possible to use a multilayer structure element having a plurality of layers produced by alternately stacking layers. Moreover, you may arrange | position the several laminated structure element from which a kind differs on one board | substrate.

  A plurality of ultrasonic transducers are arranged in an arbitrary array by further processing the stacked structure array manufactured using the manufacturing method of the stacked structure array according to the first and second embodiments of the present invention. A two-dimensional ultrasonic transducer array can be manufactured. Next, a method for manufacturing an ultrasonic transducer array according to an embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a flowchart showing a method for manufacturing the ultrasonic transducer array according to the present embodiment. FIG. 11 is a diagram for explaining a method of manufacturing the ultrasonic transducer array according to the present embodiment. In the following description, the multilayer structure array manufactured according to the first embodiment will be described. However, the multilayer structure array manufactured according to the second embodiment may be used.

  In step S31 of FIG. 10, as shown in FIG. 11A, a removable protective material 41 is provided on the upper surface (opposite side of the substrate) of the plurality of stacked structure elements 13 arranged in the stacked structure array. Affix. This prevents the resin material or the like from adhering to the upper surface of the multilayer structure element 13 in a later step. Specifically, the protective material 41 is a sealing material capable of reversibly bonding and peeling, and for example, a polyimide tape can be used. The polyimide tape is an adhesive tape used for solder masking, heat-resistant temporary fixing, and the like, and is composed of a polyimide substrate and an acrylic or silicon adhesive.

  Next, in step S <b> 32, as shown in FIG. 11B, an adhesive such as an epoxy resin is filled between the plurality of laminated structure elements 13 and solidified. For this purpose, for example, a stacked structure array in which elements are fixed in step S31 is put into a container filled with a liquid resin material, and the container is evacuated. As a result, a liquid resin material enters between the plurality of laminated structure elements 13.

  Next, in step S33, the polyimide tape on the upper surface of the multilayer structure array is peeled off, and the lower surface of the multilayer structure array is polished until the piezoelectric material is exposed. Thereby, as shown in FIG. 11C, the substrate 21, the metal material 22, and the one metal material 13 b of the multilayer structure element 13 are removed.

  In step S34, a common electrode 43 is formed by sequentially forming a titanium (Ti) layer and a platinum (Pt) layer using a sputtering method on the surface (lower surface) of the multilayer structure element 13 from which the metal material has been removed. To do. Thereby, as shown to (d) of FIG. 11, a laminated structure array (1-3 composite) is produced.

  Further, in step S35, wiring is performed on each stacked structure element by disposing the wiring board 44 on which predetermined wiring is formed on the metal material 13b side. In addition, the acoustic matching layer 45 is disposed in front of the common electrode 43, and the backing layer 45 is disposed behind the wiring substrate 44. As a material of the acoustic matching layer 46, Pyrex (registered trademark) glass that easily transmits ultrasonic waves, an epoxy resin containing metal powder, or the like is used. Moreover, as a material for the backing layer, an epoxy resin containing metal powder, rubber containing ferrite powder, or the like is used. Thereby, an ultrasonic transducer array is produced as shown in FIG.

  According to this embodiment, a plurality of ultrasonic transducers can be arbitrarily arranged in the two-dimensional ultrasonic transducer array. Thereby, an annular array in which a plurality of ultrasonic transducers are concentrically arranged or a sparse array in which ultrasonic transducers are sparsely arranged can be produced. Further, the arrangement method and the arrangement density of the ultrasonic transducers may be changed between ultrasonic transmission and reception. As a result, an ultrasonic beam having a desired shape and an ultrasonic beam with suppressed side lobes can be formed, and crosstalk between a plurality of ultrasonic transducers can be reduced, and a detection signal having a high S / N ratio. Can be obtained. Furthermore, different ultrasonic transducers may be used for ultrasonic transmission and reception. By using an ultrasonic transducer having an optimal composition, physical properties, and structure according to the reception and transmission functions, it is possible to increase the reception sensitivity of ultrasonic waves and improve the image quality of ultrasonic images.

It is a flowchart which shows the manufacturing method of the laminated structure array which concerns on the 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the laminated structure array which concerns on the 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the laminated structure array which concerns on the 1st Embodiment of this invention. It is a figure which shows a mode that a laminated structure element is arrange | positioned on an arrangement | sequence board | substrate. It is a top view which shows the arrangement | sequence of the laminated structure in a laminated structure array. It is a flowchart which shows the manufacturing method of the laminated structure array which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the laminated structure array which concerns on the 2nd Embodiment of this invention. It is a figure which shows a mode that a laminated structure element is arrange | positioned on an arrangement | sequence board | substrate. It is a perspective view which shows the laminated structure array manufactured using the manufacturing method of the laminated structure array shown in FIG. It is a flowchart which shows the manufacturing method of the ultrasonic transducer array which concerns on one Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the ultrasonic transducer array which concerns on one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Plate material 12 of piezoelectric material 12, 13a, 22 Metal material 13 Laminated structure element 13a Piezoelectric material layer 20 Collet 21, 31 Substrate material 23 Array substrate 30 Micro pipettor 32 Dry film resist (DFR) layer 32a Dry film resist 33 Area 34 Partition 35 Instant adhesive 41 Protective material (Polyimide tape)
42 resin material 43 common electrode 44 wiring board 45 acoustic matching layer 46 backing layer

Claims (13)

Preparing a plurality of elements of a laminated structure in which electrodes are formed on a piezoelectric material;
Forming a substrate on which the plurality of elements are arranged by forming at least one metal material layer on a main surface of the substrate material (b);
Heating the substrate to a temperature at which the at least one metal material layer softens;
A step (d) of temporarily disposing and arranging the plurality of elements in a desired arrangement on the main surface of the heated substrate;
(E) fixing the plurality of elements to the substrate after the substrate is cooled by heating the substrate on which the plurality of elements are temporarily fixed to a melting point or higher of the at least one metal material layer; ,
The manufacturing method of the laminated structure array which comprises this.   After the step (b) forms the first metal material layer on the main surface of the substrate material, at least a second metal material layer for bringing the first metal material layer and the substrate material into close contact is formed. The manufacturing method of the laminated structure array of Claim 1 including forming.   The step (d) includes disposing the plurality of elements using a two-dimensional positioning device in which coordinates for disposing the plurality of elements on the main surface of the substrate are preset. Manufacturing method of the laminated structure array of Preparing a plurality of elements of a laminated structure in which electrodes are formed on a piezoelectric material;
Forming a substrate for arranging the plurality of elements by forming a partition wall surrounding a plurality of predetermined regions on a main surface of the substrate material (b);
Placing the plurality of elements in the plurality of regions, respectively, and fixing the plurality of elements to the substrate (c);
The manufacturing method of the laminated structure array which comprises this.   Step (b) forms the partition by patterning the dry film resist layer or the thick film photoresist layer using a photolithography method after forming the dry film resist layer or the thick film photoresist layer on the substrate material. The manufacturing method of the laminated structure array of Claim 4 including doing.   The manufacturing method of the laminated structure array of Claim 4 in which a process (b) includes forming the said partition by patterning the said glass partition material by sandblasting, after forming a glass partition material in a board | substrate material.   The step (c) includes disposing the plurality of elements using a two-dimensional positioning device in which coordinates for disposing the plurality of elements on the main surface of the substrate are set in advance. The manufacturing method of the laminated structure array of any one of Claims 1. Preparing a plurality of elements of a laminated structure in which a first electrode is formed on a piezoelectric material;
Forming a substrate for arranging the plurality of elements by forming at least one metal material layer on a main surface of the substrate material;
Heating the substrate to a temperature at which the at least one metal material layer softens;
Arranging and temporarily fixing the plurality of elements in a desired arrangement on the main surface of the heated substrate;
Fixing the plurality of elements to the substrate after the substrate is cooled by heating the substrate on which the plurality of elements are temporarily fixed to a melting point or higher of the at least one metal material layer;
A step of fixing the plurality of elements by filling the liquid resin material between the plurality of elements and then solidifying the liquid resin material;
Removing at least the substrate from the plurality of elements fixed by the resin material;
Providing a second electrode by forming a metal layer on a second surface opposite to the first surface of the plurality of elements exposed by removing the substrate;
A method of manufacturing an ultrasonic transducer array comprising: Preparing a plurality of elements of a laminated structure in which a first electrode is formed on a piezoelectric material;
Forming a partition for arranging the plurality of elements by forming a partition wall surrounding a plurality of predetermined regions on the main surface of the substrate material; and
Arranging the plurality of elements in the plurality of regions, and fixing the plurality of elements to the substrate;
A step of fixing the plurality of elements by filling the liquid resin material between the plurality of elements and then solidifying the liquid resin material;
Removing at least the substrate from the plurality of elements fixed by the resin material;
Providing a second electrode by forming a metal layer on a second surface opposite to the first surface of the plurality of elements exposed by removing the substrate;
A method of manufacturing an ultrasonic transducer array comprising: A substrate,
A partition wall provided on a main surface of the substrate and surrounding a plurality of predetermined regions on the main surface;
A plurality of elements each including a laminated structure in which electrodes are formed on a piezoelectric material, each bonded to a plurality of regions surrounded by the partition;
A laminated structure array comprising:   The stacked structure array according to claim 10, wherein the plurality of elements are concentrically arranged on a main surface of the substrate.   The stacked structure array according to claim 10, wherein the plurality of elements are arranged on the main surface of the substrate so that an arrangement interval or an arrangement density differs depending on a position on the main surface.   The multilayer structure array according to claim 10, wherein the plurality of elements are randomly arranged on a main surface of the substrate.

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