JP2007095991A - Laminate structure, laminate structure array and their manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminate structure having a first electrode layer and a second electrode layer on both faces of a piezoelectric layer, and capable of easily manufacturing an insulation film on a side face or an electrode on a side face. <P>SOLUTION: The laminate structure constituted by laminating a plurality of structures. Each of the plurality of structures includes the piezoelectric layer having a first notch formed at an end of a first principal plane, and a second notch formed at the other end of a second principal plane opposite to the first principal plane; the first electrode layer formed on the first principal plane of the piezoelectric layer; the second electrode layer formed on the second principal plane of the piezoelectric layer; a first lead out electrode electrically connected with the first electrode layer in the first notch of the piezoelectric layer; and a second lead out electrode electrically connected with the second electrode layer in the second notch of the piezoelectric layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laminated structure and a laminated structure array in which a piezoelectric layer and an electrode layer are laminated, and a manufacturing method thereof.

  Piezoelectric elements in which electrode layers are formed above and below a piezoelectric layer are used in various applications such as piezoelectric pumps, piezoelectric actuators, and ultrasonic transducers in addition to multilayer capacitors. With the recent development of MEMS (micro electro mechanical system) related devices, miniaturization and integration of elements having such a laminated structure are progressing.

  If such a piezoelectric element is simply miniaturized, the capacitance between the electrodes decreases as the area of the element decreases, and the electrical impedance of the element increases. Therefore, impedance matching with a signal circuit for driving the piezoelectric element is possible. There was a problem that power could not be supplied, and the performance of the piezoelectric element deteriorated. Therefore, in order to increase the capacitance between the electrodes while miniaturizing the element, a plurality of piezoelectric layers and a plurality of electrode layers are alternately stacked.

  In such a laminated structure, wiring is performed from the side of the laminated structure in order to connect a plurality of internal electrode layers to each other. FIG. 14 is a cross-sectional view for explaining a general wiring method of the laminated structure. The laminated structure 100 includes a plurality of piezoelectric material layers 101, a plurality of internal electrode layers 102 and 103, and two side electrodes 104 and 105. The internal electrode layer 102 is formed so that one end thereof extends to one wall surface of the multilayer structure, is connected to the side electrode 104, and is insulated from the side electrode 105. The internal electrode layer 103 is formed so that one end thereof extends to the other wall surface of the multilayer structure, and is connected to the side electrode 105 and insulated from the side electrode 104. By applying a potential difference between the side electrode 104 and the side electrode 105, an electric field is applied to the piezoelectric material layer 101 disposed between the internal electrode layer 102 and the internal electrode layer 103, and the piezoelectric material layer 101 is caused by the piezoelectric effect. It expands and contracts.

  Incidentally, as shown in FIG. 14, an insulating region 106 in which no electrode is formed is provided in the layer in which the internal electrode layers 102 and 103 are disposed in order to insulate from the one side electrode. The insulating region 106 does not expand or contract even when a voltage is applied to the laminated structure 100. Therefore, there is a problem that stress is easily concentrated on this portion and easily damaged.

  A multilayer structure shown in FIG. 15 is also known as a method using another wiring method in the multilayer structure. 15 includes a plurality of piezoelectric material layers 201, a plurality of internal electrode layers 202, an insulating film 203 formed on one end face of each internal electrode layer 202, and two side electrodes 204. And 205. A circuit equivalent to the laminated structure 100 shown in FIG. 14 is formed by covering the end surfaces of the two adjacent internal electrode layers 202 opposite to each other with an insulating film 203 and insulating them from one of the side electrodes 204 and 205. Can be realized.

  As shown in FIG. 15, in the laminated structure 200, the internal electrode layer 202 is formed on the entire surface of the piezoelectric material layer 201, so that the development of piezoelectric performance is compared with that of the laminated structure 100 shown in FIG. 14. It is advantageous. Further, as described above, in the laminated structure 200, stress concentration does not occur as in the insulating region 106 (FIG. 14), so that the life of the laminated structure is not shortened.

  However, in order to fabricate the laminated structure 200, every other insulating film 203 must be formed on the end face of the internal electrode layer 202 exposed on each side surface of the laminated structure 200. At present, the insulating film 203 is often formed by brushing, printing, or photolithography, but these methods have a problem of low productivity. Also, with these techniques, it is very difficult to form an insulating film on a two-dimensional array in which a plurality of laminated structures are arranged at a narrow pitch.

  As another technique, Patent Document 1 discloses that an insulating layer is formed only on an exposed portion of an internal electrode plate of an electrostrictive effect element and an electrostrictive material in the vicinity thereof by an electrophoresis method. It is disclosed to form. In Patent Document 1, glass is used as a material for the insulating layer. However, a glass film formed by electrophoresis is an aggregate of cluster particles, and thus becomes a sparse film. Therefore, in order to obtain a sufficient withstand voltage, the thickness of the insulating layer needs to be about several tens of μm.

However, when an ultrasonic transducer array is manufactured, there is a problem that the ultrasonic transducers cannot be laid out at a narrow pitch due to the thickness of such an insulating layer. As described above, the array element of the laminated structure needs to be devised for the insulating film on the side surface, and since it is difficult to manufacture the electrode on the side surface, there are many problems in practical use from the production of the piezoelectric element to the mounting.
Japanese Examined Patent Publication No. 61-32835 (first page)

  Therefore, in view of the above points, the present invention has a laminated structure that has a first electrode layer and a second electrode layer on both sides of a piezoelectric layer, and can easily produce a side insulating film and a side electrode. An object is to provide a laminated structure array.

  In order to solve the above-described problem, a multilayer structure according to one aspect of the present invention is a multilayer structure configured by stacking a plurality of structures, and each of the plurality of structures is a first structure. A piezoelectric layer in which a first notch is formed at one end of the main surface and a second notch is formed at the other end of the second main surface opposite to the first main surface; A first electrode layer formed on the first main surface of the body layer; a second electrode layer formed on the second main surface of the piezoelectric layer; and a first electrode layer of the piezoelectric layer. A first lead electrode electrically connected to the first electrode layer at the notch and a second electrode electrically connected to the second electrode layer at the second notch of the piezoelectric layer. 2 extraction electrodes.

  According to another aspect of the present invention, there is provided a method for manufacturing a laminated structure, wherein a first notch is formed at one end of a first main surface of a piezoelectric layer, and the first main surface of the piezoelectric layer is formed. A step (a) of forming a second notch at the other end of the second main surface opposite to the step, and a step (b) of forming a first electrode layer on the first main surface of the piezoelectric layer. ), A step (c) of forming a second electrode layer on the second main surface of the piezoelectric layer, and a first notch on the first electrode layer in the first notch portion of the piezoelectric layer. A step (d) of electrically connecting the lead electrode of the second electrode, a step (e) of electrically connecting the second lead electrode to the second electrode layer at the second notch of the piezoelectric layer, and And (f) laminating a plurality of structures manufactured in steps (a) to (e).

  According to the present invention, by providing notches on both sides of a piezoelectric layer and having lead-out electrodes in those portions, it is possible to easily produce a multilayer ultrasonic element that was difficult with a conventional production method with a high yield. Is possible.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. The same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 1 is a diagram showing a structure of a laminated structure according to an embodiment of the present invention. The laminated structure 1 includes a plurality of piezoelectric layers 10, a plurality of first electrode layers 11, a plurality of second electrode layers 12, a plurality of lead electrodes 13a, 13b and 14a, 14b, and a plurality of insulating films 15a. , 15b.

  In the present embodiment, the piezoelectric layer 10 is formed by an aerosol deposition (AD) method. Note that the piezoelectric layer 10 may be formed using a film forming method based on a green sheet method. Moreover, you may use the member previously formed in plate shape. The piezoelectric layer 10 is made of, for example, PZT (Pb (lead) zirconate titanate). Other dielectric materials may be used as the piezoelectric layer. Cutout portions for attaching extraction electrodes are provided on the upper and lower surfaces of the plurality of piezoelectric layers 10 to prevent thickness mismatch.

  A first electrode layer 11 and a second electrode layer 12 are disposed on the upper and lower surfaces of the plurality of piezoelectric layers 10. The lead electrodes 13 a and 13 b are electrically connected to the first electrode layer 11, and the lead electrodes 14 a and 14 b are electrically connected to the second electrode layer 12. The extraction electrodes 13a and 14a are insulated by an insulating film 15a so as not to be electrically connected to the first electrode layer 11 and the second electrode layer 12 between the piezoelectric elements. The lead electrodes 13b and 14b are insulated by an insulating film 15b so as not to be electrically connected to the first electrode layer 11 and the second electrode layer 12 between the piezoelectric elements.

  In the present embodiment, the plurality of insulating films 15a and 15b are formed by applying a resin such as epoxy. As the resin, an acrylic resin, a urethane resin, or the like may be used. Alternatively, the insulating films 15a and 15b may be formed by forming a film of a conductive material by electrodeposition and then insulating the film by oxidation.

  As the conductive material, nickel (Ni) or aluminum (Al) can be used. Here, the electrodeposition method includes an electroplating method and a film forming method using electrophoretic force. In addition to the oxidation treatment, nitriding treatment, fluorination treatment, or sulfurization treatment may be performed.

  When an electric field is applied to the piezoelectric layer 10 by applying a voltage between the extraction electrodes 13a and 14a and the extraction electrodes 13b and 14b, the piezoelectric layer 10 expands and contracts due to the piezoelectric effect. A laminated structure using such a piezoelectric material as a dielectric layer can be used for a piezoelectric pump, a piezoelectric actuator, an ultrasonic transducer that transmits and receives ultrasonic waves in an ultrasonic probe, and the like. Since a structure including a stacked structure increases the area of the opposing electrode as compared with a single-layer structure, the electrical impedance can be reduced. Therefore, it operates efficiently with respect to the applied voltage as compared with a single-layer structure.

  Next, the manufacturing method of the laminated structure according to the present embodiment will be described with reference to FIGS. 2-6 is a figure for demonstrating the manufacturing method of the laminated structure which concerns on this embodiment.

  As shown in FIG. 2, the piezoelectric layer 10 is formed on the substrate 20. At this time, in this embodiment, an aerosol deposition (AD) method is used. The AD method is a film forming method in which powder of a material is deposited by spraying on a lower layer at high speed, and is also called a gas deposition method, a jet printing system, or a jet deposition method.

  Next, the substrate 20 is removed from the piezoelectric layer 10 by polishing or peeling. Thereafter, in order to increase the grain size of PZT contained in the piezoelectric layer and enhance the piezoelectric performance, a heat treatment step at a predetermined temperature (for example, about 500 ° C. to 1000 ° C.) may be provided.

  Next, as shown in FIG. 3, notches having a width of about 0.2 mm and a depth of about 50 μm are formed on the upper and lower surfaces of the piezoelectric layer 10 by dicing. The reason for this is to provide electrode layers on the upper and lower surfaces of the piezoelectric layer, electrically connect the extraction electrodes, and prevent thickness mismatch due to the thickness of the extraction electrodes when laminating this structure. This is because the above thickness is required. Note that the notch may be formed by etching or bevel cutting, or the notch may be formed in a slope shape or a curved shape.

  Next, as shown in FIG. 4, platinum films of about 2 μm are formed on the upper and lower surfaces of the piezoelectric layer 10 as the first electrode layer 11 and the second electrode layer 12 by sputtering or vacuum deposition. Note that the first electrode layer 11 and the second electrode layer 12 may be formed by a green sheet method.

  Next, as shown in FIG. 5, the structure is obtained by attaching the lead electrodes 13 and 14 to the notches of the first electrode layer 11 and the second electrode layer 12 with a conductive paste such as silver paste or silver palladium paste. Create a body. The lead electrode may be a flexible printed circuit board (FPC) or a plurality of wires.

  Next, as shown in FIG. 6, a plurality of structures are bonded with a resin such as epoxy and pressed to form a laminated structure.

  Finally, insulating films 15a and 15b are formed on the side surfaces of the laminated structure so as to have the structure of FIG. These insulating films 15a and 15b are formed by applying a resin such as epoxy. As the resin, an epoxy resin, an acrylic resin, a urethane resin, or the like may be used. Alternatively, the insulating films 15a and 15b may be formed by forming a film of a conductive material by electrodeposition and then insulating the films by oxidation. As the conductive material, nickel (Ni) or aluminum (Al) can be used. Here, the electrodeposition method includes an electroplating method and a film forming method using electrophoretic force. In addition to the oxidation treatment, nitriding treatment, fluorination treatment, or sulfurization treatment may be performed.

  According to this embodiment, by providing notches on both sides of the piezoelectric layer and laminating a structure having an extraction electrode on that portion, a multilayer piezoelectric element that has been difficult with the conventional manufacturing method can be easily obtained. Therefore, it can be manufactured with a high yield.

  Here, the AD method used for forming the piezoelectric layer in the present embodiment will be described. FIG. 7 shows an apparatus used for film formation by the AD method. This film forming apparatus has an aerosol generation container 42 in which raw material powder 41 is arranged. Here, the aerosol refers to solid or liquid fine particles suspended in a gas.

The aerosol generation container 42 is provided with a carrier gas introduction part 43, an aerosol lead-out part 44, and a vibration part 45. By introducing a gas such as nitrogen gas (N ₂ ) from the carrier gas introduction part 43, the raw material powder disposed in the aerosol generation container 42 is blown up, and an aerosol is generated. At that time, vibration is applied to the aerosol generation container 42 by the vibration unit 45, whereby the raw material powder is stirred and the aerosol is efficiently generated. The generated aerosol is guided to the film forming chamber 46 through the aerosol deriving unit 44.

  The film forming chamber 46 is provided with an exhaust pipe 47, a nozzle 48 and a movable stage 49. The exhaust pipe 47 is connected to a vacuum pump and exhausts the film forming chamber 46. The nozzle 48 injects the aerosol generated in the aerosol generation container 42 and guided to the film forming chamber 46 through the aerosol deriving unit 44 toward the substrate 20. The substrate 20 is placed on a movable stage 49 that can move in three dimensions, and the relative position between the substrate 20 and the nozzle 48 is adjusted by controlling the movable stage 49.

  Particles (raw material powder) having high kinetic energy accelerated at high speed by being ejected from the nozzle 48 collide with the substrate 20 and accumulate. At that time, a chemical reaction called a mechanochemical reaction occurs due to the collision energy of the particles, and it is considered that the particles are firmly attached to the substrate and the previously formed film. As the substrate 20, glass, quartz, ceramics such as PZT, and metals such as SUS can be used. In this embodiment, glass is used.

  As the raw material powder 41, for example, a PZT single crystal powder having an average particle size of 0.3 μm is used for growing crystals in heat treatment, if necessary, such as germanium, silicon, lithium, bismuth, boron, lead, etc. The film forming apparatus is driven by being placed in the aerosol generation container 42 shown in FIG. Thereby, a piezoelectric layer is formed.

  According to the present embodiment, since the piezoelectric layer is formed using the AD method, the piezoelectric layer can be thin because the breakdown voltage of the piezoelectric layer is high. For example, when the voltage for driving the laminated structure is 200 to 300 V, the thickness of the piezoelectric layer can be reduced to 2 to 3 μm. In addition, since the piezoelectric layer formed using the AD method is denser and stronger than the insulating film formed of an epoxy resin or the like, the mechanical strength is improved.

  Furthermore, the present invention is effective in the case of laminating structures using materials that cannot be produced continuously. For example, a single crystal material or a composite material is used. Single crystal materials are produced by the floating zone melt method (FZ method: Float Zoning Method) or the pulling method (CZ method: Czochralski Method). The invention is effective. As the single crystal material, a PNN-PT material or a PMN-PT material can be used.

  Since the composite material can only be laminated after the composite is produced, the present invention is effective. As the composite material, dicing preparation 1-3 composite, fiber preparation 1-3 composite, or LIGA composite can be used. In particular, the composite material is a very superior material such as band performance. However, since the dielectric constant is remarkably low, the sensitivity can be increased by taking a laminated structure.

  The laminated structure described above can be used as an arrayed laminated structure (for example, an ultrasonic transducer array) by arranging a plurality of one-dimensional, 1.5-dimensional, or two-dimensional structures. It is. Here, the 1.5-dimensional shape means a structure in which ultrasonic transducers and the like are arranged so that the number in the column direction is smaller than the number in the row direction. Since the laminated structure according to the present embodiment can be integrated with high density, for example, when the laminated structure is used as an ultrasonic transducer, an ultrasonic probe capable of capturing a high-resolution image is obtained. It becomes possible. Further, by using an ultrasonic probe having a 1.5-dimensional or 2-dimensional ultrasonic transducer array in which a large number of ultrasonic transducers are densely integrated, a three-dimensional ultrasonic image is obtained in an ultrasonic diagnostic apparatus. Can be acquired in real time.

Next, an ultrasonic probe using the laminated structure as described above as an ultrasonic transducer will be described with reference to FIGS.
First, as shown in FIG. 8, the produced laminated structure 1 is attached to the backing member 30. Then, as shown in FIG. 9, an acoustic matching layer is affixed. The acoustic matching layer is made of glass, ceramics, metal powder epoxy resin, or the like that can easily transmit ultrasonic waves. The acoustic matching layer eliminates the mismatch of acoustic impedance between the subject that is a living body and the transducer. Thereby, the ultrasonic wave transmitted from the ultrasonic transducer can be efficiently propagated into the subject.

Next, as shown in FIG. 10, the laminated structure to which the acoustic matching layer is attached is cut at a desired pitch in the direction of the broken line by dicing. Or it can also cut | disconnect by the sandblasting method. As a result, a laminated structure array (ultrasonic transducer array) in which a plurality of laminated structures (ultrasonic transducers) are arranged in a one-dimensional array is produced. FIG. 11 shows an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in a one-dimensional array. Further, the groove formed between the plurality of laminated structures and the periphery thereof are filled with a filler such as epoxy resin and cured. In addition, as the filler, urethane resin, silicone rubber, or the like may be used.
Further, by arranging a plurality of such one-dimensional ultrasonic transducer arrays, the 1.5-dimensional ultrasonic transducer array shown in FIG. 12A or the two-dimensional ultrasonic transducer array shown in FIG. The ultrasonic transducer array may be manufactured.

  Next, as shown in FIG. 13, a convex acoustic lens 61 is provided for each ultrasonic transducer. The acoustic lens 61 has a lens portion 61a that is a curved surface portion and a flat portion 61b that is a flat portion formed on the outside thereof, and the position of the boundary between the lens portion 61a and the flat portion 61b is the cutting position of the piezoelectric layer. It is formed so as to be inside the notch. With such a configuration, it is possible to eliminate the influence of ultrasonic waves radiated from the notch portion of the piezoelectric layer in the multilayer structure 1. The acoustic lens 61 is formed of, for example, a silicone resin, and performs acoustic impedance matching in the acoustic matching layer 50 and focuses an ultrasonic beam at a predetermined depth. As described above, an ultrasonic probe can be manufactured.

  As an ultrasonic transducer used in an ultrasonic probe, by using the above laminated structure, it is possible to reduce electrical impedance and improve impedance matching with a transmission / reception circuit. It is possible to improve the application efficiency of and increase the detection sensitivity of ultrasonic waves. In addition, the number of ultrasonic transducers to be mounted can be increased by narrowing the element arrangement in the ultrasonic transducer array, thereby improving the scanning density of ultrasonic waves and controlling the transmission / reception direction more accurately. Is possible. Therefore, it is possible to increase the resolution and improve the image quality of the ultrasonic image. Alternatively, the entire ultrasonic probe can be reduced in size while maintaining the conventional ultrasonic transmission / reception performance.

  As a result, it is easy to integrate a large number of ultrasonic transducers with high density, and an ultrasonic probe capable of capturing an image with high resolution can be obtained. In addition, in the ultrasonic probe in which the ultrasonic transducers to which the laminated structure according to the present invention is applied are arranged in a 1.5-dimensional or 2-dimensional array, the ultrasonic transducers are densely integrated. The present invention can be applied to an ultrasonic diagnostic apparatus that acquires a three-dimensional ultrasonic image.

  INDUSTRIAL APPLICABILITY The present invention can be used in a laminated structure and a laminated structure array in which a piezoelectric layer and an electrode layer are laminated, and a manufacturing method thereof.

It is a figure which shows the structure of the laminated structure which concerns on one Embodiment of this invention. It is a figure for demonstrating formation of the piezoelectric material layer of the structure which concerns on this embodiment. It is a figure for demonstrating notch formation of the piezoelectric material layer of the structure which concerns on this embodiment. It is a figure for demonstrating formation of the electrode layer of the structure which concerns on this embodiment. It is a figure for demonstrating formation of the extraction electrode of the structure which concerns on this embodiment. It is a figure for demonstrating formation of the lamination | stacking of the laminated structure which concerns on this embodiment. It is a figure which shows the apparatus used in order to form into a film by AD method. It is a figure for demonstrating sticking the laminated structure which concerns on this embodiment to a backing member. It is a figure for demonstrating sticking an acoustic matching layer to the laminated structure which concerns on this embodiment. It is a figure for demonstrating formation of the laminated structure of the array form which concerns on this embodiment. It is a figure which shows the some laminated structure arrange | positioned on the board | substrate in the one-dimensional array form. 12A is a diagram showing a plurality of laminated structures arranged in a 1.5-dimensional shape, and FIG. 12B shows a plurality of laminated structures arranged in a two-dimensional shape. FIG. It is a figure for demonstrating formation of the acoustic lens which concerns on this embodiment. It is sectional drawing for demonstrating the wiring method in the conventional laminated structure. It is sectional drawing for demonstrating another wiring method in the conventional laminated structure.

Explanation of symbols

1, 100, 200 Laminated structure 10 Piezoelectric layer 11 First electrode layer 12 Second electrode layer 13a, 13b, 14a, 14b Lead electrode 15a, 15b, 203 Insulating film 20 Substrate 30 Backing member 41 Raw material powder 42 Aerosol Production container 43 Carrier gas introduction part 44 Aerosol outlet part 45 Vibration part 46 Deposition chamber 47 Exhaust pipe 48 Nozzle 49 Movable stage 50 Acoustic matching layer 61 Acoustic lens 101 201 Piezoelectric material layer 102, 103, 202 Internal electrode layers 104, 105, 204, 205 Side electrode 106 Insulation region

Claims (9)

A laminated structure configured by laminating a plurality of structures, each of the plurality of structures being
A piezoelectric layer in which a first notch is formed at one end of the first main surface and a second notch is formed at the other end of the second main surface opposite to the first main surface;
A first electrode layer formed on the first main surface of the piezoelectric layer;
A second electrode layer formed on the second main surface of the piezoelectric layer;
A first lead electrode electrically connected to the first electrode layer at a first notch in the piezoelectric layer;
A second lead electrode electrically connected to the second electrode layer at a second notch of the piezoelectric layer;
A laminated structure comprising: In the adjacent first structure and second structure, the first notch portion of the first structure and the second notch portion of the second structure face each other.
The second lead electrode of the second structure is connected to the first lead electrode of the first structure, and the first lead electrode of the second structure is the first lead of the first structure. The laminated structure according to claim 1, connected to two lead electrodes. The second lead electrode of the second structure and the first lead electrode of the first structure are connected to the second electrode layer of the first structure and the first lead electrode of the second structure. A first insulating film for insulating from the electrode layer;
The second lead electrode of the first structure and the first lead electrode of the second structure are connected to the second electrode layer of the second structure and the first lead electrode of the first structure. A second insulating film for insulating from the electrode layer;
The laminated structure according to claim 2, further comprising: The multilayer structure is a multilayer piezoelectric element that generates ultrasonic waves by applying a voltage between the first extraction electrode and the second extraction electrode,
The acoustic lens has a curved surface portion and a flat portion formed outside the curved surface portion, and the curved surface portion is formed inside the first and second cutout portions of the piezoelectric layer. The laminated structure according to any one of 1 to 3.   A laminated structure array configured by arranging a plurality of laminated structures according to any one of claims 1 to 4 in a one-dimensional shape, a 1.5-dimensional shape, or a two-dimensional shape. A first notch is formed at one end of the first main surface of the piezoelectric layer, and a second notch is formed at the other end of the second main surface opposite to the first main surface of the piezoelectric layer. Forming step (a);
A step (b) of forming a first electrode layer on the first main surface of the piezoelectric layer;
A step (c) of forming a second electrode layer on the second main surface of the piezoelectric layer;
Electrically connecting a first lead electrode to the first electrode layer at a first notch in the piezoelectric layer;
Electrically connecting a second lead electrode to the second electrode layer at a second notch in the piezoelectric layer; and
A step (f) of laminating a plurality of structures produced in steps (a) to (e);
The manufacturing method of the laminated structure which comprises this. In the step (f), in the adjacent first structure and second structure, the first notch of the first structure and the second notch of the second structure; Including facing and laminating
The second lead electrode of the second structure and the first lead electrode of the first structure are connected to the second electrode layer of the first structure and the first lead electrode of the second structure. The first insulating film for insulating from the electrode layer, the second extraction electrode of the first structure body, and the first extraction electrode of the second structure body are connected to the second structure body of the second structure body. Forming a second insulating film for insulating from the first electrode layer and the first electrode layer of the first structure,
The second lead electrode of the second structure is connected to the first lead electrode of the first structure, and the first lead electrode of the second structure is connected to the first lead electrode of the first structure. Connecting to the two extraction electrodes;
The method for producing a laminated structure according to claim 6, further comprising: The multilayer structure is a multilayer piezoelectric element that generates ultrasonic waves by applying a voltage between the first extraction electrode and the second extraction electrode,
A step of providing an acoustic lens having a curved surface portion and a flat portion formed outside the curved surface portion, the curved surface portion being formed inside the first and second cutout portions of the piezoelectric layer; The manufacturing method of the laminated structure of Claim 6 or 7 to comprise.   A plurality of laminated structures produced by the method for producing a laminated structure according to any one of claims 6 to 8 are laminated in a one-dimensional shape, a 1.5-dimensional shape, or a two-dimensional shape. A manufacturing method of a laminated structure array comprising a step of forming a structure array.

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