JP2005084710A - Ic card and radio information transmitter/receiver using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card, in which the fluctuation of a resonance frequency at the time of card integration is made small and communication distance is large. <P>SOLUTION: This IC card is provided with an antenna substrate 1 on which an antenna coil 2 for non-contact communication is formed, an IC chip 5 electrically connected via a wiring pattern 4 for connection formed on the antenna substrate to the antenna substrate and exterior materials 8 to 13 attached to both the main surfaces of the antenna substrate. The exterior materials 8 to 10 at the main surface sides of the antenna substrate, on which at least the antenna coil is formed, are made of aliphatic polyester. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC card and a wireless information transmission / reception device using the same, and more particularly, to use a non-contact communication type IC card that performs power supply power reception and signal transmission using an electromagnetic coupling method without providing an electrical contact. The present invention relates to a wireless information transmitting / receiving apparatus.

 Conventionally, a method of magnetically or optically reading an ID card for identifying an individual has been widely used in a credit card or the like. However, due to the popularization of technology, data falsification and counterfeit cards have become available, and in fact forgery The number of people who are damaged by cards is increasing, and so on. For this reason, in recent years, an IC card incorporating an IC chip has attracted attention as a means for managing personal data from the viewpoint that information capacity is large and encrypted data can be loaded.

 An IC card incorporating this type of IC chip has a connection terminal for electrically and mechanically joining the IC circuit to exchange information with an external data processing device. For this reason, there are various problems such as ensuring confidentiality inside the IC circuit, countermeasures against electrostatic breakdown, poor electrical connection of terminal electrodes, and the complexity of the mechanism of the read / write device. In addition, a remote data processing device that requires a human operation of inserting or mounting an IC card into a read / write device and is complicated and inefficient depending on the field of use. The advent of a contactless IC card capable of exchanging information is desired.

 Therefore, a non-contact IC card has been developed in which an antenna for using electromagnetic waves and an IC chip having a memory and a calculation function are embedded in a plastic card base. This type of non-contact IC card drives an IC card with an induced electromotive force excited on an antenna in the IC card by an external electromagnetic wave from a reader / writer, and can provide a card with excellent activity. Thus, there is a growing need for an IC card that has a visible recognition display function and is confidentially managed by electronic information.

 Such a non-contact IC card, as shown in FIG. 7, by mounting an IC chip 102, a sealing resin 103 and a stainless protection plate 104 on an antenna substrate 101 on which an antenna coil and a capacitor are formed in advance. The antenna module 105 is manufactured. An IC card can be obtained by sandwiching the antenna module 105 between the pair of exterior members 106 and 107 using a heat sealing method. In addition, polyethylene terephthalate, amorphous polyethylene terephthalate, and polycarbonate were used as the organic polymer compound used for the exterior materials 106 and 107.

 By the way, the antenna coil needs to have a resonance frequency of 13.56 MHz in an IC card state (that is, a finished product state). However, when an IC card is formed, a capacitor is formed between the exterior material and the antenna. The resonance frequency is lower than that in the antenna module state. For this reason, the resonance frequency in the antenna module state has been slightly increased from 13.56 MHz, for example, set to 14.0 MHz, and adjusted to 13.56 MHz in an IC card state by visual measurement.

 However, such an adjustment by measurement cannot guarantee an accurate resonance frequency in the state of being an IC card, and particularly if there is a manufacturing error in the thickness of the exterior materials 106 and 107, the resonance frequency starts from 13.56 MHz. There was a problem that the communication distance would be shortened due to a large shift.

An object of the present invention is to provide an IC card having a small change in resonance frequency when formed into a card and a long communication distance, and a wireless information transmitting / receiving apparatus using the IC card.
In order to achieve the above object, according to a first aspect of the present invention, an antenna substrate on which an antenna coil for non-contact communication is formed and the antenna is connected via a connection wiring pattern formed on the antenna substrate. In an IC card comprising an IC chip electrically connected to a substrate and an exterior material attached to both main surfaces of the antenna substrate, at least the main surface side of the antenna substrate on which the antenna coil is formed An IC card is provided in which the exterior material is made of aliphatic polyester.

 In order to achieve the above object, according to a second aspect of the present invention, an antenna substrate on which an antenna coil for non-contact communication is formed and a connection wiring pattern formed on the antenna substrate are used. In an IC card comprising an IC chip electrically connected to the antenna substrate and an exterior material attached to both main surfaces of the antenna substrate, at least a main surface of the antenna substrate on which the antenna coil is formed An IC card is provided in which the outer packaging material is made of an organic polymer compound having a dielectric constant of less than 3.0.

 Furthermore, in order to achieve the above object, according to a third aspect of the present invention, there is provided a wireless information transmitting / receiving device comprising the IC card and a read / write device, wherein the IC card, the read / write device, Operation is started by a high frequency signal induced by the coupling between the antenna coil of the IC card and the antenna coil of the read / write device when the two are relatively close to each other, and data is transmitted / received via the high frequency signal A wireless information transmitting / receiving apparatus is provided.

  In the present invention, the exterior material on the main surface side of the antenna substrate on which the antenna coil is formed is composed of an aliphatic polyester having a low dielectric constant of less than 3.0, or an organic polymer compound. The variation in the resonance frequency when the card is attached to the card becomes smaller than that in the case of using polyethylene terephthalate (dielectric constant: 3.3) that is used as an ordinary card packaging material.

 That is, it is considered that a capacitor is formed between the antenna coil and the exterior material, and thereby the capacitor capacity is increased, which is considered to be a factor of fluctuation (decrease) in the resonance frequency of the antenna coil. In order to suppress this, the exterior material is made of a low dielectric constant material. Thereby, it is possible to provide an IC card having a small communication frequency variation and a long communication distance when the card is formed, and a wireless information transmitting / receiving apparatus using the IC card.

 In particular, when the exterior material is composed of aliphatic polyester, polysaccharide, polyamino acid, polyvinyl alcohol or polyalkylene glycol, or a copolymer containing at least one of these, these materials are biodegradable. Even if it is disposed of in the natural environment, it will not adversely affect the environment.

  In the above invention, as the aliphatic polyester, polylactic acid, polycaprolactone, polyhydroxybutyric acid, polyhydroxyvaleric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid or microbial synthetic polyester, or at least thereof The copolymer containing any one can be illustrated.

  In the above invention, examples of the organic polymer compound include aliphatic polyesters, polysaccharides, polyamino acids, polyvinyl alcohol or polyalkylene glycols, or copolymers containing at least one of them. In these organic polymer compounds, it is more preferable to use at least one compound selected from a carbodiimide compound, an isocyanate compound and an oxozoline compound as a hydrolysis control agent.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a plan view showing an antenna module according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line II-II of FIG. 1, showing a method for manufacturing an IC card according to an embodiment of the present invention, and FIG. 1 is a cross-sectional view taken along line II-II in FIG. 1, showing a method for manufacturing an IC card according to an embodiment of the present invention, FIG. 4 is a cross-sectional view showing a method for manufacturing an IC card according to an embodiment of the present invention, and FIG. FIG. 6 is a sectional view showing an IC card according to another embodiment of the present invention, and FIG. 6 is an equivalent circuit diagram of the IC card according to the embodiment of the present invention.
As shown in FIG. 1, an antenna module 100 according to the present embodiment includes an antenna substrate 1, an antenna coil 2, a capacitor 3, an IC chip 5, and a connection wiring pattern 4.

 The antenna substrate 1 is made of an electrically insulating material, particularly a material having high mechanical strength and excellent heat resistance, such as polyimide, but other than these, esters such as glass epoxy, polyethylene terephthalate, and polyethylene naphthalate are representative. A polymer material can also be used. Further, it can be constituted by a biodegradable organic polymer compound described later. However, the biodegradable organic polymer compound constituting the antenna substrate 1 does not have to have a dielectric constant of less than 3.0.

 The antenna coil 2, the capacitor 3, and the connection wiring pattern 4 are made by attaching a sheet of copper, aluminum, an alloy containing copper, an alloy containing aluminum, or the like to the main surface of the antenna substrate 1. The capacitor 3 is formed by performing an etching process or the like so as to have a predetermined shape of the connection wiring pattern.

 Here, the antenna coil 2, one electrode of the capacitor 3, and a part of the connection wiring pattern 4 are formed on the surface side of the antenna substrate 1 shown in the figure, and the other electrode of the capacitor 3 and the connection wiring pattern 4 are formed. Is formed on the back surface of the antenna substrate 1. That is, the capacitor 3 is a film capacitor configured by using the antenna substrate 1 as a dielectric layer and forming electrodes on the front and back surfaces thereof. The connection wiring pattern 4 includes an antenna coil 2 formed on the front surface side of the antenna substrate 1, one electrode of the capacitor 3 and an IC chip, and the other electrode of the capacitor 3 formed on the back surface side of the antenna substrate 1. Are electrically connected as in the equivalent circuit shown in FIG. 6, and the connection wiring patterns on the front surface side and the back surface side are connected through through holes formed in the antenna substrate 1. In the front view of FIG. 1, the capacitor 3 and the connection wiring pattern 4 formed on the front surface side of the antenna substrate 1 are indicated by solid lines, and the capacitor 3 and the connection wiring pattern 4 formed on the back surface side are indicated by dotted lines.

 The IC chip 5 is electrically connected to the connection wiring pattern 4 of the antenna substrate 1 by, for example, flip chip mounting. FIG. 2 shows a mounting cross section of the IC chip. The IC chip 5 of this example is sealed together with the metal plate 7 by a sealing resin 6 as shown in FIG. The metal plate 7 is for protecting the IC chip 5 from external force, and is formed of, for example, a circular stainless steel plate having a thickness of 200 μm to 20 μm (preferably 150 μm to 30 μm). If the thickness of the metal plate 7 is 30 μm or less, the strength of the metal plate 7 is weakened, the IC chip 5 is damaged by bending or the like, and if the thickness is 150 μm or more, it is at the center in the thickness direction of the card. This is because the antenna substrate 1 cannot be disposed, which causes warping of the card and lowering the yield.

 The sealing resin 6 may be a thermosetting epoxy adhesive, but any type of resin can be used as long as it can protect the IC chip 5 from being damaged by external factors such as bending. In order to suppress thermal shrinkage when the sealing resin 6 is cured, it is effective to add a filler to the sealing resin. In this case, a non-conductor such as alumina or titanium oxide is added as the filler. It is desirable to do.

 As shown in FIG. 3, the same metal plate 7a is provided on the main surface opposite to the main surface of the antenna substrate on which the IC chip 5 is mounted, and the IC chip 5 is attached to the two metal plates 7, 7a. The mechanical strength is enhanced by sandwiching between the two. However, the metal plate 7 may be provided only on one side of the antenna substrate 1.

 As shown in FIG. 3, the antenna coil 2, the capacitor 3, and the connection wiring pattern 4 are formed on the main surface of the antenna substrate 1, and after mounting the IC chip 5, the metal plates 7 and 7 a are sealed with the sealing resin 6. Then, the capacitor 3 embedded in the antenna module 100 is trimmed. This trimming is performed in order to adjust the capacitor capacity so that the resonance frequency of the antenna coil is 13.56 MHz in the state of being an IC card, that is, in the completed product state. Further, it is desirable to perform this trimming after the IC chip 5 is mounted. This is because the IC chip 5 itself has a parasitic capacitance, so that the capacitance of the capacitor is changed by mounting the IC chip 5 and, as a result, the resonance frequency is changed.

  When trimming of the capacitor 3 is completed, a card is formed by attaching an exterior material to the front and back surfaces of the antenna module 100. In the example shown in FIG. 4, the outer packaging materials 8 to 13 made of a polymer resin film are superposed on each of the front and back surfaces with the antenna module 100 as a center, and are carded by thermal fusion. Out of the outer packaging materials 8 to 13, the outer packaging materials 10 and 11 attached to the innermost layer in contact with the antenna substrate 1 are provided in order to eliminate a step with the IC chip 5 because the IC chip 5 has a predetermined thickness. The exterior materials 9 and 12 located in the outermost layer are provided to conceal the IC chip 5, and the exterior materials 8 and 13 located in the outermost layer are provided to perform pattern printing when the IC card is formed.

 Of these exterior materials 8 to 13, it is desirable that the exterior materials 10 and 11, the exterior materials 9 and 12, and the exterior materials 8 and 13 to be paired have the same material and thickness. This is because changing the material and thickness in the thickness direction causes warping of the card.

  In particular, among the materials constituting the exterior materials 8 to 13 of this embodiment, at least the exterior materials 8 to 10 on the side in contact with the antenna coil 2 are organic polymer compounds having a dielectric constant of less than 3, particularly aliphatic polyesters. Most preferred. As described above, when the exterior material 8 to 13 is attached to the antenna module 100 to form an IC card, the exterior material, in particular, the exterior material 8 to 10 on the side in contact with the antenna coil 2 acts as a capacitor, thereby the antenna module. The resonance frequency of the antenna coil 2 adjusted by trimming in the final process 100 varies. In the present embodiment, in order to suppress the fluctuation of the resonance frequency as much as possible, at least the exterior materials 8 to 10 are made of a low dielectric constant material. In addition, it is not always necessary to use this kind of material for the exterior materials 11 to 13 on the side not in contact with the antenna coil 2, but as described above, the exterior materials 10 and 11, the exterior materials 9 and 12, and the exterior Since the materials 8 and 13 are desirably the same material and thickness from the viewpoint of preventing warpage of the IC card, in this embodiment, the exterior materials 8 to 13 are all made of the same material.

 In the illustrated embodiment, the exterior materials 8 to 13 have a structure of three layers on each side. However, if they fall within 0.76 mm ± 0.08 mm defined by the JIS / ISO standard, the laminated materials are used. Any number. For example, as shown in FIG. 5, the exterior materials 9 to 12 can be configured to have two layers on each side.

The thickness of the exterior materials 8 to 13 is preferably 25 μm to 200 μm, although it varies depending on the laminated structure. If the thickness is less than 25 μm, the handling workability deteriorates in the manufacturing process, and if it exceeds 200 μm, the thickness of other parts becomes thin, and the handling workability deteriorates in the manufacturing process.
The exterior materials 8 to 13 are bonded to each other by heat fusion, and the heat fusion temperature is required to be higher than the softening temperature of the organic polymer compound constituting the exterior materials 8 to 13. This softening temperature has a remarkable fluidity when the ratio of the stress of the amorphous material to the plastic flow rate (plastic viscoelasticity) is very low and the temperature rises above a certain temperature. It is defined as a temperature at which a soft state, for example, a viscosity becomes 10 ¹⁰ to 10 ¹¹ Ns / m ^2, and a temperature at which a flow is recognized in a time of about ¹ to 10 s. And when heat-sealing, it is necessary to carry out at or above the softening temperature of all the exterior materials 8 to 13 constituting the IC card, and the softening temperature has a specific value depending on the material. Need to be optimized.

 Film materials made of organic polymer compounds are generally roughly classified into a stretched type and a non-stretched type, but any of the exterior materials 8 to 13 according to the present embodiment can be adopted. A film material made of a stretched organic polymer compound orients molecules by stretching during processing to improve physical properties such as strength and heat resistance. Since the stretch type film material has high crystallinity and a small proportion of the amorphous part, the softening temperature approaches the melting point, and the thermal fusion temperature becomes a temperature close to the melting point. Therefore, it is effective to improve the adhesion by performing a surface treatment. Typical examples include easy adhesion treatment and corona treatment. On the other hand, the non-stretched film material is amorphous and tends to have a low softening temperature. Therefore, there is an advantage that the self-adhesion property at the softening temperature or higher is higher than that of the stretch type film material, and the adhesiveness with the film material made of the organic polymer compound constituting the IC card is also high. However, it can be mentioned that the unstretched film material generally has a lower strength than the stretched film material. Therefore, it is desirable to select the stretch type and the non-stretch type depending on the specifications required for the IC card.

  Examples of preferable materials used as the exterior materials 8 to 13 are shown below.

  It is more preferable that the organic polymer compound having a dielectric constant of less than 3.0 used in the present embodiment further has biodegradability. As such an organic polymer compound, any one of aliphatic polyester, polysaccharide, peptide, polyamino acid, polyvinyl alcohol, polyamide or polyalkylene glycol having a dielectric constant of less than 3.0, or at least one of the above compounds And a copolymer containing one.

  Among these, aliphatic polyester is preferable as a polymer compound used in the present embodiment because it is excellent in mixing property and mass productivity. As the aliphatic polyester, polylactic acid such as poly-L-lactic acid (PLLA), a random copolymer of L-lactic acid and D-lactic acid having a dielectric constant of about 2.7 at room temperature, or a derivative thereof is more preferable. Of course, other polyesters, such as polycaprolactone, polyhydroxybutyric acid, polyhydroxyvaleric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid, polyglycolic acid, polysuccinic acid ester, polyoxalic acid ester Polydiglycolic acid butylene, polydioxanone, microbial synthetic polyester and the like can also be used as long as the dielectric constant is less than 3.0. Here, examples of the microbial synthetic polyester include 3-hydroxybutyrate (3HB), 3-hydroxyvalerate (3HV), or a copolymer thereof.

  The polymer compound used in the present embodiment can be produced according to a known method. For example, the biodegradable polyester is composed of (i) lactide method, (ii) polycondensation of polyhydric alcohol and polybasic acid, or (iii) intermolecular polymerization of hydroxycarboxylic acid having a hydroxyl group and a carboxyl group in the molecule. It can be produced by a method such as condensation.

  The hydrolysis inhibitor used in the present embodiment is not particularly limited as long as it is an additive that suppresses hydrolysis of the biodegradable polymer compound. In particular, even when the composition according to this embodiment is aged for 48 hours under a constant temperature and humidity condition of a temperature of 80 ° C. and a relative humidity of 80%, the decrease in the molecular weight of the organic polymer having biodegradability is about 20%. Is preferably within.

Examples of the hydrolysis inhibitor include compounds having reactivity with active hydrogen in a biodegradable polymer compound. By adding the compound, the amount of active hydrogen in the biodegradable polymer compound is reduced, and active hydrogen can be prevented from catalytically hydrolyzing the biodegradable polymer chain. Here, active hydrogen is hydrogen in a bond (N—H bond or O—H bond) of oxygen, nitrogen or the like and hydrogen, and such hydrogen is in a bond of carbon and hydrogen (C—H bond). Reactivity is higher than hydrogen. More specifically, for example, hydrogen in a carboxyl group: —COOH, a hydroxyl group: —OH, an amino group: —NH ₂ , or an amide bond: —NHCO— in the biodegradable polymer compound may be mentioned.

  As the compound having reactivity with active hydrogen in the polymer compound, a carbodiimide compound, an isocyanate compound, or an oxozoline compound can be applied. In particular, a carbodiimide compound is preferable because it can be melt-kneaded with a biodegradable polymer compound, and hydrolysis can be more effectively suppressed with a small amount of addition.

  The carbodiimide compound is a compound having one or more carbodiimide groups in the molecule, and also includes a polycarbodiimide compound. As a method for producing the carbodiimide compound, for example, O, O-dimethyl-O- (3-methyl-4-nitrophenyl) phosphorothioate, O, O-dimethyl-O- (3-methyl-4- ( Organophosphorus compounds such as methylthio) phenyl) phosphorothioate, O, O-diethyl-O-2-isopropyl-6-methylpyrimidin-4-ylphosphorothioate, or rhodium complexes, titanium complexes, tungsten complexes, palladium complexes, etc. A process in which various polymer isocyanates are produced by decarboxylation polycondensation in a solvent-free or inert solvent (for example, hexane, benzene, dioxane, chloroform, etc.) at a temperature of about 70 ° C. or higher. Can be mentioned.

  Examples of the monocarbodiimide compound contained in this carbodiimide compound include dicyclohexylcarbodiimide, diisopropylcarbodiimide, dimethylcarbodiimide, diisobutylcarbodiimide, dioctylcarbodiimide, diphenylcarbodiimide, naphthylcarbodiimide, and among them, particularly industrially available. Easy dicyclohexylcarbodiimide and diisopropylcarbodiimide are preferred.

  Examples of the isocyanate compound that is reactive with active hydrogen in the biodegradable polymer compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-phenylene diisocyanate, and p-phenylene diisocyanate. 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 2,2′-diphenylmethane diisocyanate, 3,3′-dimethyl-4,4′-biphenylene diisocyanate, 3,3′-dimethoxy-4,4 '-Biphenylene diisocyanate, 3,3'-dichloro-4,4'-biphenylene diisocyanate, 1,5-naphthalene diisocyanate, 1,5-tetrahydronaphthalene diisocyanate, tetramethylene diisocyanate, 1, -Hexamethylene diisocyanate, dodecamethylene diisocyanate, trimethylhexamethylene diisocyanate, 1,3-cyclohexylene diisocyanate, 1,4-cyclohexylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, hydrogenated xylylene diisocyanate, lysine diisocyanate, isophorone Examples include diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, or 3,3′-dimethyl-4,4′-dicyclohexylmethane diisocyanate.

  The said isocyanate compound can be easily manufactured by a well-known method, and a commercial item can be used suitably. As commercially available polyisocyanate compounds, aromatic isocyanate adducts such as coronate (manufactured by Nippon Polyurethane; hydrogenated diphenylmethane diisocyanate) or myrionate (manufactured by Nippon Polyurethane) can be used. In particular, when the composition according to the present invention is produced by melt-kneading, the use of a polyisocyanate compound in which a solid substance, for example, an isocyanate group is blocked with a masking agent (polyhydric aliphatic alcohol, aromatic polyol, etc.) from a liquid is used. preferable.

  Examples of the oxazoline-based compound that is reactive with active hydrogen in the polymer compound include 2,2′-o-phenylenebis (2-oxazoline), 2,2′-m-phenylenebis (2 -Oxazoline), 2,2'-p-phenylenebis (2-oxazoline), 2,2'-p-phenylenebis (4-methyl-2-oxazoline), 2,2'-m-phenylenebis (4- Methyl-2-oxazoline), 2,2′-p-phenylenebis (4,4′-dimethyl-2-oxazoline), 2,2′-m-phenylenebis (4,4′-dimethyl-2-oxazoline) 2,2′-ethylenebis (2-oxazoline), 2,2′-tetramethylenebis (2-oxazoline), 2,2′-hexamethylenebis (2-oxazoline), 2,2′-octane Methylenebis (2-oxazoline), 2,2'-ethylenebis (4-methyl-2-oxazoline), or 2,2'- diphenylenebis (2-oxazoline).

  The biodegradation rate and thus the mechanical strength of the composition according to this embodiment can be adjusted by the type or amount of the hydrolysis inhibitor used in this embodiment, so that it is blended according to the intended product. What is necessary is just to determine the kind and compounding quantity of a hydrolysis inhibitor. Specifically, the addition amount of the hydrolysis inhibitor is desirably in the range of about 0.5 to 8% by weight. In particular, when the hydrolysis inhibitor is a carbodiimide compound, an isocyanate compound or an oxozoline compound, the addition amount is preferably within the above range. Moreover, the said hydrolysis inhibitor may use the said compound independently, and may use it in combination of 2 or more types.

  The manufacturing method of the composition which concerns on this embodiment is not specifically limited, You may use a well-known method.

  The composition according to the present embodiment may contain other known additives as long as the purpose of the present embodiment is not impaired. Other known additives include reinforcing materials, inorganic or organic fillers, antioxidants, heat stabilizers, UV absorbers, lubricants, waxes, colorants, crystallization accelerators, starches, etc. Examples include organic substances having degradability. These may be used alone or in combination.

  Examples of the reinforcing material include glass microbeads, carbon fibers, chalk, quartz such as novoculite, asbestos, feldspar, mica, talc, silicates such as wollastonite, kaolin, and the like. Examples of the inorganic filler include carbon, silicon dioxide, metal oxide fine particles such as alumina, silica, magnesia, or ferrite, silicates such as talc, mica, kaolin, and zeolite, barium sulfate, calcium carbonate, or fullerene. In addition, examples of the organic filler include an epoxy resin, a melamine resin, a urea resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, a polyester resin, and a Teflon (registered trademark) resin. Of these, carbon and silicon dioxide are preferably contained in the composition of the present invention. The fillers may be used alone or in combination of two or more.

Examples of the antioxidant include phenol-based, amine-based, phosphorus-based, sulfur-based, hydroquinone-based, and quinoline-based antioxidants. Phenol antioxidants include hindered phenols such as 2,6-di-t-butyl-p-cresol, 1,3,5-trimethyl-2,4,6-tris (3,5-di- -T-butyl-4-hydroxybenzyl) benzene, 2,2'-methylenebis (4-methyl-6-t-butylphenol), 4,4'-methylenebis (2,6-di-t-butylphenol), 4, C ₂₋ such as 4′-butylidenebis (3-methyl-6-tert-butylphenol), 1,6-hexanediol-bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] ₁₀ alkylenediol - bis [3- (3,5-di - branched C _3-6 alkyl-4-hydroxyphenyl) propionate], for example, triethylene glycol - bis [3- (3-t-butyl - - methyl-4-hydroxyphenyl) propionate] and the like di- or Toriokishi C _2-4 alkylene diol - bis [3- (3,5-di - branched C _3-6 alkyl-4-hydroxyphenyl) propionate], such as glycerin C _3-8 alkanetriol-bis [3- (3,5-di-branched C _3-6 alkyl-4] such as tris [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] -Hydroxyphenyl) propionate], for example C _4-8 alkanetetraol tetrakis [3- (3,5-, 5-pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate]). Di-branched C _3-6 alkyl-4-hydroxyphenyl) propionate], for example n-octadecyl-3- (4 ′, 5′-di-t-butyl) Tilphenol) propionate, n-octadecyl-3- (4′-hydroxy-3 ′, 5′-di-t-butylphenol) propionate, stearyl-2- (3,5-di-t-butyl-4-hydroxyphenol) ) Propionate, distearyl-3,5-di-t-butyl-4-hydroxybenzylphosphonate, 2-t-butyl-6- (3-t-butyl-5-methyl-2-hydroxybenzyl) -4-methyl Phenyl acrylate, N, N′-hexamethylenebis (3,5-di-tert-butyl-4-hydroxy-hydrocinnamide), 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy) -5-methylphenyl) propionyloxy] -1,1-dimethylethyl} -2,4,8,10-tetraoxaspiro [5,5] undecane, 4, Examples thereof include 4′-thiobis (3-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenol) butane, and the like.

  Examples of the amine antioxidant include phenyl-1-naphthylamine, phenyl-2-naphthylamine, N, N′-diphenyl-1,4-phenylenediamine, or N-phenyl-N′-cyclohexyl-1,4- Examples include phenylenediamine.

  Examples of phosphorus antioxidants include triisodecyl phosphite, triphenyl phosphite, trisnonylphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, 2,2-methylenebis (4,6-di-). t-butylphenyl) octyl phosphite, 4,4′-butylidenebis (3-methyl-6-tert-butylphenyl) ditridecyl phosphite, tris (2,4-di-t-butylphenyl) phosphite, tris ( 2-t-butyl-4-methylphenyl) phosphite, tris (2,4-di-t-amylphenyl) phosphite, tris (2-t-butylphenyl) phosphite, bis (2-t-butylphenyl) ) Phenyl phosphite, tris [2- (1,1-dimethylpropyl) -pheny ] Phosphite, tris [2,4- (1,1-dimethylpropyl) -phenyl] phosphite, tris (2-cyclohexylphenyl) phosphite, tris (2-t-butyl-4-phenylphenyl) phosphite, etc. Phosphite compounds; triethylphosphine, tripropylphosphine, tributylphosphine, tricyclohexylphosphine, diphenylvinylphosphine, allyldiphenylphosphine, triphenylphosphine, methylphenyl-p-anisylphosphine, p-anisyldiphenylphosphine, p-tolyl Diphenylphosphine, di-p-anisylphenylphosphine, di-p-tolylphenylphosphine, tri-m-aminophenylphosphine, tri-2,4-dimethylphenylphosphine, tri-2,4, -Trimethylphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tri-o-anisylphosphine, tri-p-anisylphosphine, or 1,4-bis (diphenyl) And phosphine compounds such as phosphino) butane.

Examples of the hydroquinone antioxidant include 2,5-di-t-butylhydroquinone, and examples of the quinoline antioxidant include 6-ethoxy-2,2,4-trimethyl-1,2. -Dihydroquinoline etc. are mentioned, As a sulfur type antioxidant, dilauryl thiodipropionate, distearyl thiodipropionate etc. are mentioned, for example. Among them, preferred antioxidants include phenolic antioxidants (particularly hindered phenols), for example, polyol-poly [(branched C _3-6 alkyl group and hydroxy group-substituted phenyl) propionate] and the like. In addition, the above antioxidants may be used alone or in combination of two or more.

  Examples of the heat stabilizer include nitrogen-containing compounds such as basic nitrogen-containing compounds such as polyamide, poly-β-alanine copolymer, polyacrylamide, polyurethane, melamine, cyanoguanidine, and melamine-formaldehyde condensate; organic carboxylic acid Metal salts (calcium stearate, calcium 12-hydroxystearate, etc.), metal oxides (magnesium oxide, calcium oxide, aluminum oxide, etc.), metal hydroxides (magnesium hydroxide, calcium hydroxide, aluminum hydroxide, etc.), metal carbonates Alkali or alkaline earth metal-containing compounds such as salts; zeolites; or hydrotalcites. In particular, alkali or alkaline earth metal-containing compounds (especially alkaline earth metal-containing compounds such as magnesium compounds and calcium compounds), zeolite, hydrotalcite and the like are preferable. In addition, the above heat stabilizers may be used alone or in combination of two or more.

  Examples of the ultraviolet absorber include conventionally known benzophenone-based, benzotriazole-based, cyanoacrylate-based, salicylate-based, oxalic acid anilide-based, and the like. For example, [2-hydroxy-4- (methacryloyloxyethoxy) benzophenone] -methyl methacrylate copolymer, [2-hydroxy-4- (methacryloyloxymethoxy) benzophenone] -methyl methacrylate copolymer, [2-hydroxy -4- (methacryloyloxyoctoxy) benzophenone] -methyl methacrylate copolymer, [2-hydroxy-4- (methacryloyloxidedecyloxy) benzophenone] -methyl methacrylate copolymer, [2-hydroxy-4- ( Methacryloyloxybenzyloxy) benzophenone] -methyl methacrylate copolymer, [2,2′-dihydroxy-4- (methacryloyloxyethoxy) benzophenone] -methyl methacrylate copolymer, [2,2′-dihydroxy-4- (Methacrylo Oxy) benzophenone] - methyl methacrylate copolymer, or 2,2'-dihydroxy-4- (methacryloyloxy-octoxybenzophenone) - methyl methacrylate copolymer, and the like. In addition, the above ultraviolet absorbers may be used alone or in combination of two or more.

  Examples of the lubricant include petroleum-based lubricating oils such as liquid paraffin; synthetic lubricating oils such as halogenated hydrocarbons, diester oils, silicone oils, and fluorosilicones; various modified silicone oils (epoxy-modified, amino-modified, alkyl-modified, Ether-modified, etc .; Silicon-based lubricants such as copolymers of silicon and organic compounds such as polyoxyalkylene glycols; Silicon copolymers; Various fluorosurfactants such as fluoroalkyl compounds; Fluorine-based lubricating substances such as polymers; waxes such as paraffin wax and polyethylene wax; higher aliphatic alcohols, higher aliphatic amides, higher fatty acid esters, higher fatty acid salts, or molybdenum disulfide. Among these, it is particularly preferable to use a silicon copolymer (a resin obtained by polymerizing silicon by block or graft). Silicon copolymers include acrylic resins, polystyrene resins, polynitrile resins, polyamide resins, polyolefin resins, epoxy resins, polybutyral resins, melamine resins, vinyl chloride resins, polyurethane resins or polyvinyl resins. Any ether-based resin or the like obtained by block or graft polymerization of silicon may be used, and a silicon graft copolymer is preferably used. These lubricating substances may be used alone or in combination of two or more.

  Examples of the waxes include olefin wax such as polypropylene wax and polyethylene wax, paraffin wax, Fischer-Tropsch wax, microcrystalline wax, montan wax, fatty acid amide wax, higher aliphatic alcohol wax, and higher fatty acid wax. , Fatty acid ester wax, carnauba wax, rice wax and the like. These waxes may be used alone or in combination of two or more.

  Examples of the colorant include inorganic pigments, organic pigments, and dyes. Examples of inorganic pigments include chromium pigments, cadmium pigments, iron pigments, cobalt pigments, ultramarine blue, and bitumen. Specific examples of organic pigments and dyes include, for example, carbon black; phthalocyanine pigments such as phthalocyanine copper; quinacridone pigments such as quinacridone magenta and quinacridone red; for example, hansa yellow, disazo yellow, permanent yellow, and permanent. Examples include azo pigments such as red and naphthol red; for example, spirit black SB, nigrosine base, nigrosine dye such as oil black BW, oil blue, and alkali blue. In addition, the above colorants may be used alone or in combination of two or more.

  Examples of the crystallization accelerator include organic acid salts such as sodium pt-butylbenzoate, sodium montanate, calcium montanate, sodium palmitate, and calcium stearate; for example, calcium carbonate, calcium silicate, magnesium silicate, sulfuric acid Inorganic salts such as calcium, barium sulfate and talc; for example, metal oxides such as zinc oxide, magnesium oxide and titanium oxide. These crystallization accelerators may be used alone or in combination of two or more.

  You may perform a well-known process with respect to the composition which concerns on this embodiment. For example, in order to suppress hydrolysis of the polymer compound in the composition according to this embodiment, the composition according to this embodiment may be irradiated with active energy rays.

  Examples of the active energy ray source include electromagnetic waves, electron beams, particle beams, and combinations thereof. Examples of the electromagnetic wave include ultraviolet rays (UV) and X-rays, and examples of the particle beam include rays of elementary particles such as protons and neutrons. Among these, electron beam irradiation by using an electron accelerator is particularly preferable.

  The above-mentioned active energy rays can be irradiated using a known apparatus. For example, examples of the known device include a UV irradiation device and an electron accelerator. The irradiation dose and irradiation intensity are not particularly limited as long as they effectively delay the hydrolysis of the biodegradable polymer compound in the composition according to the present invention. For example, in the case of an electron beam, the acceleration voltage is preferably about 100 to 5000 kV, and the irradiation dose is preferably about 1 kGy or more.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  The present invention will be described with reference to further specific examples.

Example 1
An antenna coil and a capacitor circuit were formed by attaching an aluminum foil having a thickness of 20 μm on an antenna substrate made of polyethylene naphthalate (hereinafter referred to as PEN) having a thickness of 50 μm and etching the aluminum foil. An IC chip was mounted at a predetermined position on the antenna substrate, and the IC chip was sealed thereon using a thermosetting one-component epoxy adhesive as a sealing resin and a 50 μm stainless steel plate as a metal plate.

 In order to adjust the IC card to a predetermined resonance frequency, the capacitor on the antenna substrate was trimmed to 14.0 MHz in the antenna module state.

  As shown in FIG. 4, the IC card is manufactured from the antenna module side by using a polylactic acid outer packaging material 10 and 11 having a thickness of 125 μm, an outer packaging material 9 and 12 having an amorphous polyethylene terephthalate thickness of 125 μm, and a thickness of 125 μm. The stretched polyethylene terephthalate exterior materials 8 and 13 were laminated on the front and back surfaces of the antenna module 100 in this order, and heat-sealed while applying a pressure of 1.5 MPa at 150 ° C. for 2 minutes.

  The manufactured IC card was measured for resonance frequency and communication distance. A weak reader / writer (RC-S440C manufactured by Sony Corporation) was used as the reader / writer. The results are shown in Table 1.

 Subsequently, an IC card storage test and an operation test were performed, and the resonance frequency and communication distance after the test were measured. The results are shown in Table 2.

 As a storage test, high temperature storage at 70 ° C./60% RH / 72 hours and low temperature storage at −20 ° C./72 hours were performed.

 The operation test includes a high-temperature operation test in the environment after storage at 55 ° C./50% RH / 16 hours, a low-temperature operation test in the environment after storage at −10 ° C./16 hours, and 40 ° C./95% RH / 96. A high-humidity operation test was performed in that environment after storage for a period of time.

 The number of measurements was n = 20, and the average value of resonance frequency and communication distance n = 20 was the numerical value.

Example 2
When producing an IC card, from the antenna module side, a 125 μm-thick polylactic acid exterior material 10, 11, a 125 μm-thick polylactic acid exterior material 9, 12, a 125 μm-thick stretched polyethylene terephthalate exterior material 8, The method was the same as in Example 1, except that the antenna modules were stacked on the front and back surfaces of the antenna module in the order of 13, respectively. The results are shown in Tables 1 and 2.

Example 3
When producing an IC card, from the antenna module side, a 125 μm-thick polylactic acid exterior material 10, 11; a 125 μm-thick amorphous polyethylene terephthalate exterior material 9, 12, a 125 μm-thick polylactic acid exterior material The same method as in Example 1 was performed except that the antenna modules were stacked on the front and back surfaces of the antenna module in the order of 8, 13, respectively. The results are shown in Tables 1 and 2.

Example 4
When producing an IC card, from the antenna module side, 125 μm thick polylactic acid exterior materials 10 and 11, 125 μm thick polylactic acid exterior materials 9 and 12, and 125 μm thick polylactic acid exterior materials 8 and 13 The same procedure as in Example 1 was performed except that the antenna modules were laminated in the order of The results are shown in Tables 1 and 2.

表１に示す結果から明らかなように、実施例１〜４は、アンテナモジュール状態の共振周波数１４．０ＭＨｚに対してＩＣカード化した後の共振周波数の低下が−０．４７〜−０．４８ＭＨｚと抑制されているのに対し、比較例１は−０．５５ＭＨｚとなっている。したがって、少なくともアンテナコイルに接する側にポリ乳酸製外装材を採用したものは共振周波数の低下が抑制され、通信距離も１４７〜１４８ｍｍと長くなっていることが確認された。 Comparative Example 1
When producing an IC card, from the antenna module side, 125 μm-thick amorphous polyethylene terephthalate exterior materials 10 and 11, 125 μm-thick amorphous polyethylene terephthalate exterior materials 9 and 12, 125 μm-thick stretched polyethylene The same procedure as in Example 1 was performed, except that the outer packaging materials 8 and 13 made of terephthalate were laminated on the front and back surfaces of the antenna module, respectively. The results are shown in Tables 1 and 2.

As is clear from the results shown in Table 1, in Examples 1 to 4, the decrease in the resonance frequency after making an IC card with respect to the resonance frequency of 14.0 MHz in the antenna module state is -0.47 to -0.48 MHz. In contrast, Comparative Example 1 is -0.55 MHz. Therefore, it was confirmed that the one using a polylactic acid exterior material on the side in contact with the antenna coil suppresses the decrease in the resonance frequency and the communication distance is as long as 147 to 148 mm.

  Also, from the results in Table 2, it was confirmed that the IC cards of Examples 1 to 4 suppressed the decrease in resonance frequency and the communication distance was longer than that of the IC card of Comparative Example 1. It was confirmed that the effect in the low temperature operation test and the high humidity operation test was great.

It is a top view which shows the antenna module which concerns on embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. 1 which shows the manufacturing method of the IC card which concerns on embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. 1 which shows the manufacturing method of the IC card which concerns on embodiment of this invention. It is sectional drawing which shows the manufacturing method of the IC card which concerns on embodiment of this invention. It is sectional drawing which shows the IC card which concerns on other embodiment of this invention. 1 is an equivalent circuit diagram of an IC card according to an embodiment of the present invention. It is sectional drawing which shows the conventional IC card.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Antenna module 1 ... Antenna board 2 ... Antenna coil 3 ... Capacitor 4 ... Connection wiring pattern 5 ... IC chip 6, 6a ... Sealing resin 7, 7a ... Metal plate 8-13 ... Exterior material

Claims (7)

An antenna substrate on which an antenna coil for non-contact communication is formed, an IC chip electrically connected to the antenna substrate via a connection wiring pattern formed on the antenna substrate, and both main surfaces of the antenna substrate In an IC card provided with an exterior material attached to
An IC card, wherein an exterior material on at least a main surface side of an antenna substrate on which the antenna coil is formed is made of aliphatic polyester. 2. The IC card according to claim 1, wherein the relative dielectric constant of the aliphatic polyester is less than 3.0 at room temperature. The aliphatic polyester is polylactic acid, polycaprolactone, polyhydroxybutyric acid, polyhydroxyvaleric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid or microbial synthetic polyester, or at least one of these The IC card according to claim 1, wherein the IC card is a copolymer containing An antenna substrate on which an antenna coil for non-contact communication is formed, an IC chip electrically connected to the antenna substrate via a connection wiring pattern formed on the antenna substrate, and both main surfaces of the antenna substrate In an IC card provided with an exterior material attached to
An IC card, wherein an exterior material on at least a main surface of an antenna substrate on which the antenna coil is formed is made of an organic polymer compound having a dielectric constant of less than 3.0. 5. The IC according to claim 4, wherein the organic polymer compound is a polysaccharide, an aliphatic polyester, a polyamino acid, a polyvinyl alcohol, a polyalkylene glycol, or a copolymer containing at least one of them. card. 5. The IC card according to claim 4, wherein at least one compound selected from a carbodiimide compound, an isocyanate compound and an oxozoline compound is used as the hydrolysis control agent for the organic polymer compound. A wireless information transmitting / receiving device comprising the IC card according to any one of claims 1 to 6 and a read / write device, wherein the IC card and the read / write device are relatively close to each other, A radio information transmitting / receiving apparatus that starts operation by a high-frequency signal induced by coupling of an antenna coil of an IC card and an antenna coil of the read / write device and transmits / receives data via the high-frequency signal.

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