JP2010188637A - Ic card using plant raw material plastic - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card of low environmental load using a plant raw material plastic as a main material, and using a nonbiodegradable plastic in combination therewith. <P>SOLUTION: An antenna coil 4 is formed in a nonbiodegradable and insulating resin sheet, noncontact IC chips 2 are mounted in both end parts of the antenna coil, to serve as an antenna sheet 12, the antenna sheet 12 is laid in the substantially center layer of the card, one layer or a plurality of layers of plant raw material plastic sheets 14a-16a, 14b-16b is laminated on both faces of the antenna sheet 12 via adhesive sheets 13a, 13b, and transparent oversheets 17a, 17b comprising a nonbiodegradable resin sheet are laminated on the surfacemost reverse face of the card, in the IC card 1A using the plant raw material plastic. The IC card 1A is applicable as a contact/noncontact both-use type IC card by mounting an IC module on an IC card base body layer-constituted by the same manner. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an IC card using plant raw material plastic. In particular, the present invention relates to an IC card that uses plant-derived plastic with suppressed biodegradability, but uses a non-biodegradable polymer material that is not a plant material for the antenna sheet and the top and bottom substrates, thereby improving durability. .
Therefore, the technical field of the present invention relates to the manufacture and use fields of IC cards.

  Conventionally, plastic cards are widely used for ID cards, membership cards, cash cards, and the like. As the base material for these cards, a polyvinyl chloride resin, an amorphous polyester resin, or the like is used. This card substrate is usually discarded when it is used up. The disposal method is generally incineration or landfill, but when vinyl chloride resin cards are incinerated, there is a risk of the generation of harmful substances such as dioxins. In the case of an amorphous polyester-based resin card base material, no harmful substances are generated by incineration, but when it is landfilled, there is a problem that it remains semi-permanently in the soil due to its high chemical stability. Above all, these resins have a problem of resource depletion because they use petroleum, which is a finite resource, as a starting material. There is also a problem that new carbon dioxide gas is generated by incineration.

Plant-based plastics have been developed as environmentally friendly materials, mainly as “biodegradable plastics”, with the goal of quickly returning to “soil”. This plant raw material plastic is most often made of polylactic acid using starch obtained from corn or the like as a raw material. Since these are made from plants and do not use petroleum resources, they do not cause the problem of resource depletion, do not generate harmful substances by incineration, and can be returned to "soil" when landfilled.
Carbon dioxide is generated by incineration, but plants are originally composed of carbon dioxide and water, and have the advantage of not generating new carbon dioxide as originated from petrochemical raw materials.

  The use of plant-based plastics for magnetic cards and IC cards has been studied, and all card base materials made of plant-based plastics have been prototyped and subjected to durability tests and the like. However, cards made only of such materials are extremely low in durability (particularly in high-temperature and high-humidity environments). Therefore, it is not practical, and in the card application, it is in a situation where all materials made of plant raw material plastic cannot be adopted.

  Polylactic acid resin with minimal biodegradability has also been developed, and trial production of cards using this material has also been studied. As a result, it became possible to mold the card in general, but the deterioration of the base material was still progressing. Therefore, in the present invention, a plant raw material plastic that is assumed not to biodegrade is used. However, since it cannot be considered that hydrolysis or biodegradation does not occur completely, it is expressed as “plant raw material plastic sheet with suppressed biodegradability” in the claims and the specification. Since this polylactic acid resin sheet is hot-pressed once, crystallization is promoted and the adhesiveness is lowered. Therefore, transferability of hologram foil and sign panel (seal provided on the back of the card for the user to sign) There is a problem that decreases.

  Therefore, the present invention uses a normal card base material such as polyester for the outermost surface back surface substrate (oversheet) of an IC card for transferring a hologram foil or a sign panel to improve transferability. In addition, the non-biodegradability of the card is intended to maintain a certain level of durability.

  Although prior patent documents directly related to the present invention cannot be detected, there are Patent Document 1 and Patent Document 2 regarding “biodegradable cards”. Moreover, there exists patent document 3 regarding the card | curd which made the biodegradable resin contain the wood component. There exists patent document 4 regarding the polylactic acid-type card | curd base material which suppressed biodegradability.

JP-A-8-267968 Japanese Patent Laid-Open No. 2000-141956 JP 2003-001987 A International Publication No. 2006/104013

By using a combination of plant-derived plastics that suppress biodegradability and completely non-biodegradable materials, it is possible to suppress the depletion of petroleum resources and to provide a certain degree of card durability while providing environmentally friendly benefits. To ensure a high level of practicality and to achieve a highly practical IC card that does not easily become brittle even when used in a high-temperature and high-humidity environment.
An object is to prevent deterioration of the base material from the front and back surfaces by disposing a non-biodegradable resin sheet on the outermost surface and back layer of the card while using plant raw material plastic.
Even after the card is completed, it is an object to improve the transferability of the hologram foil and the sign panel to the outermost surface.

  The first of the gist of the present invention for solving the above problems is that an antenna coil is formed on an insulating resin sheet that is non-biodegradable, and a non-contact IC chip is attached to both ends of the antenna coil to form an antenna sheet. A plant raw material plastic sheet with suppressed biodegradability of one or more layers is laminated on both sides of the antenna sheet via an adhesive sheet so that the antenna sheet is a substantially central layer of the card base, and the outermost surface of the card. An IC card using a plant raw material plastic sheet, wherein a transparent oversheet made of a non-biodegradable resin sheet is laminated on the back surface.

  In the IC card using the plant material plastic sheet, the thickness of the IC chip is absorbed by the adhesive sheet on both sides of the antenna sheet and the plant material plastic sheet in which the biodegradability of one layer on both sides in contact with the adhesive sheet is suppressed. A through-hole can be formed.

  The second of the gist of the present invention for solving the above-mentioned problems is that an antenna coil and both ends of the antenna coil are formed on an insulating resin sheet that is non-biodegradable to form an antenna sheet, and the antenna sheet is substantially at the center of the card base. Laminate one or more plant-derived plastic sheets with suppressed biodegradability on both sides of the antenna sheet so as to form layers, and further, a non-biodegradable resin sheet on the outermost surface of the card After laminating a transparent oversheet comprising the IC module, the IC module mounting recess is cut from the front side of the card, the contact / non-contact type IC module is fixed in the mounting recess, and the IC module non-contact interface IC car using plant material plastic sheet, characterized in that the antenna coil and both ends of the antenna coil of the antenna sheet are electrically connected , Located in.

In the IC card using the first and second plant raw material plastic sheets of the above summary,
With respect to the antenna sheet in which the layer configuration of the entire card is a substantially central layer, the front and back layer configuration can be made symmetric, and the side surface of the transparent oversheet of the plant raw material plastic sheet with suppressed biodegradability, or Adhesive silk screen medium ink can be applied to the side surface of the plant raw material plastic sheet in which the biodegradability of the transparent oversheet is suppressed. In this case, adhesion can be enhanced. Further, the transparent oversheet can be a PET-G sheet, and in that case, the transferability of the hologram foil or the sign panel can be improved.

The plant-based plastics with suppressed biodegradability are used in combination with completely non-biodegradable polymer materials, ensuring the durability of the card while suppressing the depletion of petroleum resources, It is possible to realize an IC card that does not easily become weak even when used in a humidity environment.
The non-biodegradable resin sheet is disposed on the outermost surface layer of the card while using plant material plastic, so that the card deterioration from the front and back surfaces can be prevented while considering the environment.
When a PET-G sheet is used for the outermost surface of the card, the transferability of the hologram foil or sign panel can be improved.

The IC card of the present invention will be described below with reference to the drawings.
1 is a cross-sectional view showing the layer configuration of an IC card according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view showing the layer configuration of an IC card according to the second embodiment of the present invention, and FIG. FIG. 4 is a plan view showing an antenna sheet according to the second embodiment.

The 1st form of this invention is related with a non-contact IC card. The cross-sectional layer configuration of the non-contact IC card 1A is as shown in FIG. The non-contact IC card 1A has a configuration in which a plurality of card base materials are stacked, and an antenna sheet 12 is inserted into a layer that is substantially at the center. The “substantially center” means approximately the center and means that the antenna sheet 12 does not become the outermost surface.
On the back surface side of the antenna sheet 12 (the surface side where the antenna 4 is not formed), a first surface base material sheet 14a made of a plant raw material plastic sheet with suppressed biodegradability is laminated via an adhesive sheet 13a. Yes. If necessary, second and third surface substrate sheets 15a and 16a are sequentially laminated on the surface of the first surface substrate sheet 14a. Therefore, at least one surface base sheet is used.
In the case of FIG. 1, an example in which a three-layer surface base sheet is laminated on one side of the antenna sheet 12 is illustrated. All are made of plant raw material plastic sheets with suppressed biodegradability. A surface side oversheet 17a is laminated on the outermost surface which is the outer side of the third surface base material sheet 16a surface. A non-biodegradable resin sheet based on a petrochemical raw material such as polyethylene terephthalate (PET) or PET-G sheet is used for the surface side oversheet 17a.

The reason why the second and third surface base sheets are provided as necessary may or may not need to be multilayered depending on the adjustment of the overall thickness of the card and the thickness of the material sheet and the thickness of the IC chip 2. Therefore, it is not indispensable when one layer is sufficient. However, since there are usually few sheet products that have a considerable thickness and are entirely uniform, thin ones are often laminated.
A hot-melt adhesive sheet 13a is used between the antenna sheet 12 and the first surface base sheet 14a. This is because the antenna base material 12b made of a non-biodegradable insulating sheet in which PET or vinyl chloride is often used and the plant raw material plastic sheet are not thermally fused. It is not necessary to use an adhesive sheet between the first and second surface substrate sheets and between the second and third surface substrate sheets. This is because the plant raw material plastic sheets with suppressed biodegradability exhibit self-bonding properties when hot-pressed. In addition, an adhesive silk screen medium coated on the surface base material sheet 16a or the oversheet 17a is provided between the surface side oversheet 17a and the third surface base material sheet 16a in which PET or PET-G sheet is used. The ink 18a or the like is used for adhesion. This is because the non-biodegradable resin sheet and the plant raw material plastic sheet are bonded. However, a normal adhesive having card suitability may be applied and used.

On the antenna surface side of the antenna sheet 12, a first back surface base material sheet 14b made of a plant raw material plastic sheet with suppressed biodegradability is laminated via an adhesive sheet 13b.
If necessary, second and third back surface base sheets 15b and 16b are sequentially laminated on the surface of the first back surface base sheet 14b. Therefore, similarly, at least one surface base sheet is used. All are made of plant raw material plastic sheets with suppressed biodegradability. A back surface side oversheet 17b is laminated on the outermost surface that is the outer surface of the third back surface substrate sheet 16b. For the back side oversheet 17b, a non-biodegradable resin sheet based on petrochemical raw materials such as PET and PET-G sheet is used.
It is not necessary to use an adhesive sheet between the first and second back substrate sheets and between the second and third back substrate sheets. This is because the plant raw material plastic sheets whose biodegradability is suppressed as described above exhibit self-bonding properties. Similarly, the back side oversheet 17b and the third back side base sheet are bonded by the surface of the back side base sheet 17b or the adhesive silk screen medium ink 18b coated on the oversheet 17b. . The IC card base 10 has the above layer structure.

FIG. 3 is a plan view showing the antenna sheet according to the first embodiment. In the antenna sheet 12 of the non-contact IC card 1A, a coiled antenna pattern is formed on the insulating plastic substrate 12b, and the IC chip 2 is mounted between both end portions (start end portion 4a and end end portion 4b) of the antenna coil 4. It consists of a structure. Usually, an antenna pattern is often formed by etching a metal foil (thickness, about 10 to 40 μm) such as copper or aluminum laminated on the insulating plastic substrate 12b. There may be.
The antenna coil 4 is formed to turn the card several times. A part of the antenna coil 4 can be formed so as to pass through the bridge 5 on the back surface of the base material in order to prevent a short circuit.
The insulating plastic substrate 12b is based on a petrochemical raw material, and of course is non-biodegradable.

The IC chip 2 is an IC chip having only a non-contact interface. The planar shape ranges from a very small size of about 1.0 mm square to a size of about 5.0 mm square. The position of the IC chip 2 in the non-contact IC card 1A is not particularly defined. However, when a printing layer or the like is provided on the card surface, it is preferable to avoid the position in order to make the printing clear.
The thickness of the IC chip 2 itself is about 0.3 mm to 0.15 mm. As shown in FIG. 1, the IC chip 2 is mounted on the antenna 4 surface side of the antenna sheet 12. A metal upper reinforcing plate 2u is provided on the IC chip 2 through the insulating plastic substrate 12b of the antenna sheet, and a lower reinforcing plate 2d is provided on the lower surface of the IC chip 2. When the thicknesses of the upper and lower reinforcing plates and the base material 12b are added, the overall thickness may exceed 0.5 mm.
In this way, when the thickness of the IC chip 2 is considerable, if the card base material is laminated as it is, an uneven shape is generated on the card surface, so the adhesive sheets 13a and 13b and the first front and back base material sheets It is preferable to form through holes 7 and 8 in 14a and 14b.

  Although the biaxially stretched PET sheet is often used for the insulating plastic substrate 12b, various plastic materials can be used as will be described later. Since the antenna sheet 12 is a member that easily affects card characteristics, plant-based plastics that are easily affected by moisture and the like are not used in the present invention. As the insulating plastic substrate 12b, one having a thickness of about 30 μm to 100 μm can be used.

The second embodiment of the present invention relates to a contact / non-contact type IC card. The cross-sectional layer structure of the contact / non-contact type IC card 1B is as shown in FIG.
The contact / non-contact type IC card 1B also has a configuration in which a plurality of card bases are stacked, but the antenna sheet 12 is inserted in a layer that is substantially at the center.
On the surface side of the antenna sheet 12, surface base sheets 14a and 15a made of a plant raw material plastic sheet with suppressed biodegradability are laminated via an adhesive sheet 13a. A 3rd surface base material sheet is laminated | stacked in order on the surface base material sheets 14a and 15a surface as needed. All are made of plant raw material plastic sheets with suppressed biodegradability.
In the case of FIG. 2, although the example which uses the 1st and 2nd base material sheet 14a, 15a, 14b, 15b for front and back is shown in figure, it may be a single layer. Further, the antenna sheet 12 may not have a symmetrical configuration, and the antenna coil 4 may be brought closer to the card surface side by reducing the thickness on the front surface side. A surface side oversheet 17a is laminated on the outermost surface of the surface side substrate sheet 15a. A non-biodegradable resin sheet based on a petrochemical raw material such as PET or PET-G sheet is used for the surface side oversheet 17a.

The reason why the second and third surface base sheets are provided as necessary is that there are cases where it is necessary or not necessary to add depending on the total thickness of the card, the thickness of the sheet material to be used, and the thickness of the IC module 3. In the present invention, it is not an essential component.
A hot-melt adhesive sheet 13a is used between the antenna sheet 12 and the first surface base sheet 14a. This is because the non-biodegradable insulating sheet such as PET and the plant raw material plastic sheet are not heat-sealed as described above. It is not necessary to use an adhesive sheet between the first and second, second and third surface substrate sheets. This is because the plant-derived plastic sheets that have suppressed biodegradability are self-bonded when hot-pressed. Further, an adhesive silk screen medium ink 18a applied to the surface base sheet or oversheet 17a is provided between the surface side oversheet 17a and the second surface base sheet 15a in which PET, PET-G sheet or the like is used. It is made to adhere by such as. However, a normal adhesive having card suitability may be applied and used.

On the back surface side of the antenna sheet 12, first and second back substrate sheets 14b and 15b made of a plant raw material plastic sheet with suppressed biodegradability are laminated via an adhesive sheet 13b. However, you may make the 1st and 2nd back surface base material sheet into a single layer with thickness. All are made of plant raw material plastic sheets with suppressed biodegradability.
The back surface side oversheet 17b is laminated | stacked on the outermost surface of the back surface base material sheet 15b. A non-biodegradable resin sheet such as PET or PET-G sheet is also used for the back side oversheet 17b.

In order to mount the IC module 3 at a position defined by ISO, the IC module mounting recess 30 is excavated. The IC module mounting recess 30 includes a first recess having a depth and size in which the terminal board 3k of the IC module can be accommodated, and a second recess having a depth and size in which the mold portion 3m of the IC module can be accommodated. On the left and right sides of the IC module mounting recess 30 are conductive stages for electrically connecting the antenna coil both ends 4a, 4b in the card base 10 and the antenna connection terminals (non-contact interfaces) 3a, 3b of the IC module 3. The parts 20a and 20b are cut. A conductive adhesive is applied to the surfaces of the conductive steps 20a and 20b to electrically connect the non-contact interface. The IC module is fixed to the other part using a non-conductive adhesive sheet or the like.
In FIG. 2, the scale in the thickness direction of the card base is shown enlarged compared to the horizontal direction. Therefore, although the mold part 3m of the IC module 3 is shown in an extremely convex shape, it is actually flat because it has a height of several hundred μm. The scale of FIG. 1 is the same.

FIG. 4 is a plan view showing an antenna sheet of the second form. The antenna sheet 12 of the contact / non-contact type IC card 1B has a coiled antenna pattern formed on an insulating plastic substrate 12b. Both end portions (start end portion 4a and end end portion 4b) of the antenna coil 4 are formed so as to face the lower surface of the portion where the IC module 3 is mounted.
In FIG. 4, a substantially rectangular frame k indicated by a chain line is a range in which the terminal board 3k of the IC module is accommodated. This position is defined by ISO7816.
A substantially circular frame j indicated by a chain line is a portion in which the mold portion 3m of the IC module 3 is accommodated, and is deeper than the frame k portion. The antenna coil 4 has a starting end portion 4a and a terminal end portion 4b formed on the lower surface of a range in which the terminal board 3k of the IC module is accommodated and outside the mold portion 3m.
The start end portion 4a, the end portion 4b, and the non-contact interface (3a, 3b in FIG. 2) of the IC module 3 are electrically connected later, and an IC chip or the like is mounted at the stage of the antenna sheet. Not.

  The antenna pattern 4 is usually formed by etching a metal foil (thickness, about 10 to 40 μm) such as copper or aluminum laminated on the insulating plastic substrate 12b. The antenna to be used may be used. The antenna coil 4 is formed so as to turn one card substrate 12b several times. A part of the antenna coil 4 may be formed so as to pass through the bridge 5 on the back surface of the base material in order to prevent a short circuit.

  The IC module 3 is an IC card IC module having a contact and non-contact interface. The surface has contact terminals 3t defined by ISO7816, and the IC chip 2 is die-bonded on the back side of the terminal board 3k. The shape or the like of the IC chip 2 is substantially the same as that of the non-contact IC chip 2 described above. The planar shape has a size of about 2.0 mm square to about 5.0 mm square. The two antenna connection terminals 3a and 3b for the non-contact interface are formed on the back side of the terminal board so as to protrude out of the resin mold portion 3m. The total thickness including the thickness of the terminal substrate 3k of the IC module 3 and the mold part 3m is set to be about 500 μm to 650 μm.

The appearance configuration and the cross-sectional layer configuration of both the first type IC card 1A and the second type IC card 1B are the same as those of a conventional non-contact IC card and a contact / non-contact IC card.
The feature of the IC card 1A and the IC card 1B of the present invention is that the plant raw material plastic sheet having suppressed biodegradability is used in the card layer structure, but the whole is not composed of the plant raw material plastic sheet. The plant raw material plastic sheet is used for the portions excluding the antenna sheet 12 and the front and back oversheets. However, when the layer structure is viewed as a thickness, it is preferable that a plant raw material plastic sheet with a thickness of 60% to 70% or less suppresses biodegradability.

In the above, a surface base material sheet and a back surface base material sheet are materials conventionally called a core sheet. When these are “k”, the antenna sheet is “a”, and the oversheet is “o”, the following various types of IC card layers can be adopted.
(1) o / k / a / k / o
(2) o / k / k / a / k / o
(3) o / k / k / a / k / k / o
(4) o / k / k / k / a / k / k / o
(5) o / k / k / k / a / k / k / k / o
(6) o / k / a / k / k / k / o
If the thicknesses of the above-mentioned (1), (3), and (5) are equal to each other and the thickness of each substrate centered on a is equivalent to the antenna sheet, “the front and back layer configurations are symmetrical”, It turns out that.

Next, an IC card manufacturing method will be described.
<Non-contact IC card of the first form>
The non-contact IC card 1A according to the first embodiment includes an antenna sheet 12 and then an adhesive sheet 13a, 13b and front and back base material sheets made of a plant material plastic sheet with suppressed biodegradability on both sides and an oversheet 17a, The card base 10 is manufactured by temporarily stacking and laminating 17b and laminating the whole with a single press. The plant raw material plastic sheet with suppressed biodegradability is preferably molded by a single hot pressing step because once the heat history is applied, crystallization is promoted and heat fusion is not caused again. The oversheets 17a and 17b can be fused for the first time by printing an adhesive medium ink. However, when a thermal history is applied, the adhesiveness is lowered.
In order to absorb the thickness of the IC chip, it is preferable to form through holes 7 and 8 in the adhesive sheets 13a and 13b and the first front and back substrate sheets 14a and 14b.
When the pattern is provided, the pattern is printed in advance on the outermost surface substrate sheet by offset printing or the like, and an adhesive transparent medium ink is coated on the pattern by silk screen printing.
In the case of painting transfer on the card surface, the painting transfer process and the hot-press press lamination of the card substrate 10 are preferably performed in separate processes. This is to prevent cracks in the pattern.

<Contact / non-contact IC card of the second form>
The contact / non-contact IC card 1B of the second form is also prepared by first manufacturing the antenna sheet 12, and then forming the front and back substrate sheets composed of the adhesive sheets 13a and 13b and the plant raw material plastic sheet with suppressed biodegradability on both sides. And the oversheets 17a and 17b are temporarily stacked and laminated, and then the whole is hot-press-laminated in one step to produce the card base 10.
Since the IC module 3 is fixed after the IC module mounting recess 30 is excavated in the card base 10, a process of forming a through hole in the base material is naturally not performed. The steps so far are performed in a multi-faceted state. After the card base 10 is manufactured, the unit is cut into individual pieces, and then the IC module mounting recess 30 and the IC module 3 are mounted by a known method.

<Embodiment related to material>
a. About plant raw material plastic sheet with suppressed biodegradability Plant raw material plastic with suppressed biodegradability refers to a material using a polylactic acid-based polymer as a main component in the present invention, and adding an aliphatic polyester as necessary. And Polylactic acid is obtained by fermenting starch extracted from plants such as corn, potatoes, and sugar cane, but in recent years, many are made from corn as a raw material.
Unlike conventional biodegradable plant plastics, it is premised that they will not biodegrade. However, compared to ordinary polymer plastics, the tendency to promote weakening in a high temperature environment cannot be denied. “Ecology” manufactured by Mitsubishi Plastics Co., Ltd. can be used as a commercial product. In this invention, since it uses for the base material sheet in a card | curd base | substrate, what was made white is used in many cases.

b. Insulating plastic base material for antenna sheet The antenna sheet can be made of an insulating material having excellent dimensional stability and heat resistance. Generally, polyesters such as PET, PET-G, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, poly-4 Polyethylene such as ethylene fluoride, ethylene-tetrafluoroethylene copolymer, nylon 6, nylon 6, 6, etc., polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, cellulose triacetate, polymethyl methacrylate, polymethacrylic acid Ethyl, polyethyl acrylate, polycarbonate, polyarylate, polyimide, etc. can be used.

c. About the outermost backside base sheet (oversheet) Since the outermost backside base sheet is a sheet that protects the front and back sides of the card, among the base materials listed for the antenna sheet, friction resistance and transparency, Materials with excellent transferability can be used. In recent years, PET and PET-G sheets are often used.
Note that PET-G is a non-crystalline polyester resin, and is generally a dehydrated condensate of an aromatic dicarboxylic acid and a diol. The aromatic polyester resin. As an amorphous polyester-based resin, products (trade name “PET-G”) in which 30 mol% of an ethylene glycol component in polyethylene terephthalate is replaced with 1,4 cyclohexanedimethanol are commercially available from Eastman Chemical Co., Ltd. Can also be used.
d. Adhesive Silk Media Ink Transparent media ink for vinyl chloride-based silk screen printing can be used. It is used by coating to a thickness of about 3 μm to 5 μm.

<Example of non-contact IC card>
As the insulating plastic substrate 12b for the antenna sheet 12, a biaxially stretched PET sheet having a thickness of 38 μm was used. After laminating aluminum foil with a thickness of 30 μm on both surfaces of the insulating plastic substrate 12b, a coiled antenna pattern was formed by etching, and the non-contact IC chip 2 was mounted on both ends of the antenna.
Although the IC chip 2 itself is about 5 mm square, a lower reinforcing plate 2d made of a stainless steel plate φ 7.0 mm having a thickness of 50 μm is fixed to the IC chip 2 with an epoxy resin.

  The antenna sheet 12 was completed by fixing an upper reinforcing plate 2u made of a stainless steel plate having a thickness of 50 μm to the side facing the IC chip 2 through the insulating plastic substrate 12b with an epoxy resin. As a result, the total thickness including the upper reinforcing plate 2u and the lower reinforcing plate 2d of the IC chip 2, the epoxy resin, and the insulating plastic substrate 12b was 450 μm.

On the side of the antenna sheet 12 on the card surface side, a white first made of a plant raw material plastic (“Ecology” manufactured by Mitsubishi Plastics, Inc.) with suppressed biodegradability is provided via a polyester hot melt adhesive sheet 13a having a thickness of 50 μm. 1 surface base sheet (thickness 150 μm) 14a, second surface base sheet (thickness 40 μm) 15a, and third surface base sheet (thickness 100 μm) 16a were laminated. The second and third surface substrate sheets are made of the same plant raw material plastic sheet as the first surface substrate sheet. In addition, the adhesive sheet is not used between the 1st and 2nd surface base material sheet and between the 2nd and 3rd surface base material sheet. Offset pattern printing was performed on the surface of the third surface base sheet, and an adhesive transparent vinyl ink for vinyl chloride silk screen printing (“VAHS medium” manufactured by Showa Ink Co., Ltd.) was further printed.
A transparent PET-G sheet (“Diafix PG-MCT”; thickness 50 μm) manufactured by Mitsubishi Plastics Co., Ltd. was temporarily stacked as an oversheet 17a on the outermost surface of the card.

  It should be noted that the adhesive sheet 13a and the first surface base sheet 14a absorb the thickness of the IC chip 3a (so that an uneven shape of the IC chip does not occur on the card surface after hot pressing). A through hole 7 having a size corresponding to the planar shape (about 7 mm square) of the reinforcing plates 2u and 2d of the chip is formed by punching, and the IC chip 2 and the upper and lower reinforcing plates 2u and 2d are formed in the through hole 7. I made it fit. In addition, although temporary stacking is a state in which the main adhesion is not performed, it means that the sheet is temporarily fixed so as not to be displaced between the sheets. Since the antenna sheet 12 is bent at the time of pressing, the through hole 7 naturally has an effect of absorbing the thickness of the IC chip 2 body.

On the side of the antenna sheet 12 which is the back side of the card, a white first made of a plant raw material plastic (“Ecology” manufactured by Mitsubishi Plastics, Inc.) with suppressed biodegradability is provided via a polyester hot melt adhesive sheet 13b having a thickness of 50 μm. 1 back substrate sheet (thickness 150 μm) 14b, second back substrate sheet (thickness 40 μm) 15b, and third back substrate sheet (thickness 100 μm) 16b were laminated. No adhesive sheet is used between the first and second, and second and third back surface substrate sheets. Further, an adhesive transparent vinyl chloride silk screen printing medium ink (“VAHS medium” manufactured by Showa Ink Co., Ltd.) was printed on the third back substrate sheet 16b. On this surface, a transparent PET-G sheet (thickness 50 μm) was temporarily stacked as an oversheet 17b. The material of the oversheet is the same as the surface side.
The planar shape (about 7 mm square) of the upper and lower reinforcing plates 2u and 2d of the IC chip is also applied to the adhesive sheet 13b and the first back substrate sheet 14b in order to absorb the thickness of the lower reinforcing plate 2d and the IC chip 2. A through-hole 8 having a size corresponding to is formed by punching.

For convenience, 9 layers of base sheet (11 layers including the adhesive sheets 13a and 13b) were temporarily stacked and placed on a hot plate of a press machine for press lamination. The conditions for the pressing process were a hot plate temperature of 135 ° C., a pressure of 450 kN, and a molding (heating) time of 3 minutes. After pressing, the total thickness of the card substrate 10 was 800 μm.
Since the total thickness of the material itself is 820 μm, it is considered that the adhesive sheet or the like is compressed. Of the total thickness of the material, 580 μm is made of plant raw material plastic, so 70.1% (about 70%) of the total thickness of the card is made of plant raw material plastic.
After performing concealment transfer (transfer of the concealment layer) using a transfer film, a hologram transfer foil was transferred to the card surface and a sign panel was transferred to the back side of the card under normal conditions to complete a non-contact IC card 1A.

[Comparative Example 1]
A non-contact IC card was produced in the same manner as in Example 1, but the oversheets 17a and 17b on the outermost and back surfaces were made of plant raw material plastic having a thickness of 50 μm and suppressed biodegradability (“Ecology” manufactured by Mitsubishi Plastics, Inc.). Comparative Example 1 was prepared by making a prototype with other materials and manufacturing conditions the same as in Example 1.

<Example of contact / non-contact type IC card>
As the insulating plastic substrate 12b for the antenna sheet 12, a biaxially stretched polyethylene terephthalate (PET) sheet having a thickness of 38 μm was used. After laminating an aluminum foil having a thickness of 35 μm on the front and back surfaces of the insulating plastic substrate 12b, the front surface side has a coiled antenna pattern 4, an antenna start end portion 4a, a termination portion 4b, and a capacitor pattern. An antenna sheet 12 having a capacitor pattern paired with the surface-side capacitor pattern was formed by etching.

  A white surface made of plant-derived plastic (“Ecology” manufactured by Mitsubishi Plastics, Inc.) with suppressed biodegradability on the card surface side of the antenna sheet 12 through a polyester hot melt adhesive sheet 13a having a thickness of 50 μm. After laminating a substrate sheet (thickness: 280 μm) 14a and offset printing the pattern on the surface of the surface substrate sheet 14a, an adhesive transparent vinyl chloride-based silk screen printing medium ink (“VAHS Medium” manufactured by Showa Ink Co., Ltd.) ) Was printed. On that surface, a transparent PET-G sheet (“Diafix PG-MCT”; thickness 50 μm) manufactured by Mitsubishi Plastics Co., Ltd. was temporarily stacked as an oversheet 17a.

A white back surface made of plant raw material plastic (“Ecologe” manufactured by Mitsubishi Plastics, Inc.) with suppressed biodegradability on the card back side of the antenna sheet 12 through a polyester hot melt adhesive sheet 13b having a thickness of 50 μm. A base sheet (thickness: 280 μm) 14b was laminated, and an adhesive transparent vinyl ink for vinyl chloride silk screen printing (“VAHS medium” manufactured by Showa Ink Co., Ltd.) was printed on the surface of the back base sheet 14b. A transparent PET-G sheet (thickness 50 μm) was temporarily stacked on the surface as an oversheet 17b. The material of the oversheet is the same as the surface side.
In addition, Example 2 differs from FIG. 2 in that the plant raw material plastic is made into one layer on the front side and one layer on the back side without using two layers on one side.

For convenience, 5 layers of base material sheets (7 layers if including adhesive sheets 13a and 13b) were temporarily stacked and placed on a hot plate of a press machine for press lamination. The press process conditions were a hot plate temperature of 120 ° C., a pressure equivalent to 550 kN, and a molding (heating) time of 5 minutes. The total thickness of the card substrate 10 was 780 μm.
Since the total thickness of the material itself is 798 μm, it is considered that the adhesive sheet or the like is compressed. Of the total thickness, 560 μm is made of plant raw material plastic, so 70.2% (over 70%) of the total card thickness is made of plant raw material plastic.

  Thereafter, a hologram transfer foil was transferred to the card surface, and a sign panel was transferred to the card back surface under normal conditions. After cutting into individual card sizes, the first concave portion of the IC module mounting concave portion 30 is cut by NC processing on the antenna base embedded card base 10, and then the second concave portion is further inserted between both antenna end portions. The module 3 was excavated to such a depth that the mold resin part of the module 3 could be embedded sufficiently. Further, the conduction step portions 20a and 20b were cut to a depth where the antenna start end portion 4a and terminal end portion 4b appeared.

  On the other hand, a copper foil is attached to both sides of a terminal substrate (thickness: 120 μm) made of a glass epoxy substrate, a photoetching process is performed to form contact terminals 3t for connecting external devices on the surface, and antenna connection terminals 3a, Two portions of 3b were formed so that one of them had a size of 2.0 mm × 3.0 mm. The terminal part was plated with nickel and gold. After mounting the contact / non-contact type IC chip 2 on the terminal board 3k, the connection between the external device connection contact terminal plate 3t and the antenna connection terminals 3a, 3b is performed with gold wires through wire bonding and through holes, Further, the periphery of the IC chip was sealed with an epoxy resin. Thereby, the IC module 3 was completed.

  The conductive paste is applied to the surfaces of the conductive step portions 20a and 20b with respect to the antenna start end portion 4a and the terminal end portion 4b excavated from the first recess surface, and the first recess surface other than the conductive paste coating area is insulatively bonded. The sheet was pasted. After loading the IC module 3 prepared above, heat pressure is applied (180 ° C., 20 seconds) to bond the IC module 3 and the card base 10 and contactless interface (antenna end portions 4a and 4b and antenna connection) Terminals 3a and 3b) were electrically connected to each other. Thereby, the contact / non-contact type IC card 1B was completed.

[Comparative Example 2]
A contact / non-contact type IC card was manufactured in the same manner as in Example 2, but the oversheets 17a and 17b on the outermost surface and back surface were made of plant raw material plastic (Mitsubishi Resin Co., Ltd.) having a thickness of 50 μm and suppressed transparent biodegradability A comparative example 2 was prepared by replacing the “eco-rouge”) with other materials and production conditions the same as in Example 2.

<Environmental resistance test>
About the IC card of Example 1, Example 2, Comparative Example 1, and Comparative Example 2, it is 168 hours, 336 hours, and 504 hours in an untested state and a constant temperature and humidity chamber of 60 ° C. and 90% RH. After storage for 720 hours, 840 hours, and 1008 hours, the test article is taken out from the constant temperature and humidity chamber, and then placed under a room temperature condition of 23 ° C., and then a hydroshot test is performed to determine the energy required for destruction. Calculated. The results were as shown in [Table 1] and [Table 2].
[Table 1] is the result for the non-contact IC card of Example 1 and Comparative Example 1, and [Table 2] is the result for the contact / non-contact type IC card of Example 2 and Comparative Example 2. is there.

The hydro-shot test is performed using a hydro-shot impact tester “HTM-1” manufactured by Shimadzu Corporation. A 0.5-inch diameter weight is made to collide with the IC card surface at a speed of 3 m / sec, and half the number of samples ( 50%) is calculated as energy required for destruction.
Note that the measurement is in accordance with JISK7124.

  [Table 1] and [Table 2] show almost the same test results. In Comparative Example 1 and Comparative Example 2 in which the oversheet is made of plant raw material plastic, when 500 hours have passed (504 hours), the hydroshot It was observed that the value decreased significantly. Further, cracking occurred in the IC card at 720 hours. On the other hand, it was confirmed that Example 1 and Example 2 in which the oversheet was made of PET-G had a considerable hydroshot value even after 500 hours had elapsed.

  From the above results, it can be seen that even when using plant-derived plastics with suppressed biodegradability, when the plastics are used for the entire IC card, the IC card will remain in a high temperature and high humidity environment for a long time. It became clear that there was a problem with the durability of the card, and it was confirmed that an IC card that can be used practically could be obtained if the conventional plastic made of petrochemical resources was used for the front and back oversheets.

It is sectional drawing which shows the layer structure of the IC card of the 1st form of this invention. It is sectional drawing which shows the layer structure of the IC card of the 2nd form of this invention. It is a top view which shows the antenna sheet | seat of a 1st form. It is a top view which shows the antenna sheet of a 2nd form.

1A, 1B IC card 2 IC chip 2u Upper reinforcing plate 2d Lower reinforcing plate 3 IC module 3a, 3b Antenna connection terminal 3k Terminal board 3m Mold part 4 Antenna coil (antenna pattern)
4a Start end 4b Termination 5 Bridge 7, 8 Through hole 10 Card base 12 Antenna sheet 12b Insulating plastic base 13a, 13b Adhesive sheet 14a First surface base sheet 15a Second surface base sheet 16a Third Front base sheet 17a Front side oversheet 14b First back base sheet 15b Second back base sheet 16b Third back base sheet 17b Back side oversheet 20a, 20b Conductive step 30 For mounting IC module Recess

Claims (6)

An antenna coil is formed on a non-biodegradable insulating resin sheet, and a non-contact IC chip is attached to both ends of the antenna coil to form an antenna sheet, so that the antenna sheet becomes a substantially central layer of the card base. A transparent oversheet comprising a non-biodegradable resin sheet on the front and back surfaces of a card, wherein a plant-derived plastic sheet in which one or more layers are suppressed via adhesive sheets is laminated on both sides of the antenna sheet. An IC card using a plant material plastic sheet, characterized by being laminated. A through-hole that absorbs the thickness of the IC chip is formed in the adhesive sheet on both sides of the antenna sheet and the plant raw material plastic sheet that suppresses the biodegradability of one layer on both sides in contact with the adhesive sheet. An IC card using the plant material plastic sheet according to claim 1. The antenna coil and both ends of the antenna coil are formed on a non-biodegradable insulating resin sheet to form an antenna sheet. Adhesive sheets are attached to both sides of the antenna sheet so that the antenna sheet is a substantially central layer of the card base. 1 layer or multiple layers of plant raw material plastic sheets with suppressed biodegradability are laminated, and a transparent oversheet made of a non-biodegradable resin sheet is laminated on the outermost surface of the card, and then the front side of the card The IC module mounting recess is cut from the mounting, the contact / non-contact type IC module is fixed in the mounting recess, and the non-contact interface of the IC module and both ends of the antenna coil of the antenna sheet are electrically connected. IC card using plant raw material plastic sheet characterized by the above. The plant raw material plastic sheet according to claim 1 or 3, wherein the layer configuration of the entire card is symmetrical with respect to the antenna sheet having a substantially central layer configuration. IC card. Adhesive silk screen medium ink is coated on the side of the transparent oversheet of the plant-based plastic sheet with suppressed biodegradability or the side of the plant-based plastic sheet with suppressed biodegradability of the transparent oversheet. An IC card using the plant material plastic sheet according to claim 1. The IC card using the plant material plastic sheet according to claim 1 or 3, wherein the transparent oversheet is a PET-G sheet.

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