JP7360939B2 - Resin card medium and its manufacturing method - Google Patents

Description

The present invention relates to a resin card medium equipped with a tactile switch and a method for manufacturing the same, and in particular, the surface layer of the card covering the upper part of the tactile switch is arranged so as to form a gap with the protective sheet of the tactile switch. etc., the reliability of ON-OFF switch ON/OFF and the click feeling are not impaired even by pressing operation through the surface layer, and the beauty of the resin card medium is such that the unevenness of the surface layer housing the tactile switch is not noticeable. It relates to its manufacturing method.

Due to recent demands for higher functionality, multi-functionality, and improved security, cards are equipped with IC (Integrated Circuit) chips as large-capacity variable information storage media, antenna circuits for obtaining power and signals from the outside, In many cases, a component board is installed with a large number of electronic components, such as a display section for displaying information, a sensor section for detecting fingerprints, etc., a power source (battery), and a switch for turning the power on and off. It has become.

In particular, switches built into cards need to be thin and compact, and must also include some means of confirming the completion of an operation, such as vibration, so tactile switches have been widely used in recent years. has been done.

This tactile switch is generally equipped with a circuit board on which multiple contacts are arranged, and the outer edge contacts the contacts on both sides, and the apex is located on the center contact. It consists of a dome-shaped leaf spring arranged so that the leaf spring is placed in the shape of a dome, a case that houses the leaf spring, and a protective sheet that is fixed to the top surface of the case with adhesive or the like to hold the leaf spring inside the case. There is.

For this reason, in a tactile switch, when a pressing force is applied to the top of the leaf spring, the top of the leaf spring elastically deforms downward and comes into contact with the contact point in the center of the circuit board, while the pressing force is released. Then, the top portion of the leaf spring rises due to its elastic restoring force until it returns to its original position, and is separated from the contact point at the center of the circuit board. This allows the tactile switch to turn on and off electronic devices.

By the way, with a small tactile switch such as the one mentioned above, it is important to be able to turn the switch ON and OFF reliably, and to notify the switch operator of the completion of the ON-OFF operation, it is important to provide a clear click feeling to the switch operator. Giving is also important. Therefore, in recent years, improved tactile switches have been developed so that a clear click feeling can be obtained even in thinner and smaller tactile switches.

For example, in Japanese Unexamined Patent Publication No. 2015-170492 (Patent Document 1), a part of the protective sheet placed on the dome-shaped leaf spring and fixed to the edge of the upper surface of the case is made non-adhesive, so that the pressure By making sure that the protective sheet is sufficiently deformed when the switch is turned on, the disadvantage of shortening the length of the elastic part of the protective sheet due to miniaturization is eliminated, and the switch can be turned ON and OFF with certainty and a clear click feeling can be obtained. A miniaturized tactile switch has been developed.

However, in order to incorporate a tactile switch into a card, it is necessary to ensure the card's waterproofness and durability. A resin layer must be provided as a finishing layer to cover the entire surface of the card including the tactile switch. For this reason, the dome-shaped leaf spring of the tactile switch built into the card is always pressed through the above-mentioned resin layer, which is completely glued to the periphery of the tactile switch. Even if the tactile switch described in Cited Document 1, which is partially non-adhesive, is used, the resin layer does not deform sufficiently when pressed, resulting in unstable ON/OFF operation of the switch and a clear click feeling. There was a problem that it became impossible to obtain.

Furthermore, in order to incorporate the tactile switch into the card, the size of the opening of the switch accommodating portion provided in the card body must be made larger than the outer size of the case of the tactile switch. For this reason, the support span of the resin layer that covers the opening of the switch housing (the distance between opposing edges in the opening) is the same as the support span of the protective sheet that covers the space in the case (the distance between the opposing edges in the case). As a result, if you press the tactile switch from above the resin layer, it may not be able to fully support the resin layer and you will not be able to get a clear click feeling, or the resin may stretch due to pressure. There was a problem in that the layer itself could not be restored sufficiently, causing wrinkles and the like, resulting in poor appearance.

Furthermore, if the support span of the resin layer covering the opening of the switch accommodating portion is wide, the resin layer will stretch in a short period of time due to repeated operations of pressing the tactile switch, making it impossible to obtain sufficient restoring force. As a result, the resin layer serving as the finishing layer deteriorates in a short period of time, and the unevenness of the resin layer housing the tactile switch becomes noticeable, detracting from the aesthetic appearance of the card. Furthermore, depending on the manufacturing conditions, irregularities may occur in the resin layer near the switch accommodating portion immediately after hot pressing, which may impair the aesthetic appearance.

Japanese Patent Application Publication No. 2015-170492

Therefore, the present invention provides a resin card medium with a resin layer on the outermost surface that covers the entire surface of the card, and a tactile switch mounted inside the resin layer. To provide a resin card medium that does not impair ON-OFF reliability and clear click feeling, and has beauty in which unevenness on the surface housing a tactile switch is not noticeable.

The present inventors have discovered that when a resin card medium equipped with a tactile switch is provided with a resin layer on the outermost surface as a finishing layer to cover the entire surface of the card, the click feeling may be impaired and the We analyzed the factors that cause unevenness in the resin layer, and conducted extensive studies on the shape and size of the switch housing that houses the tactile switch, and the method of supporting the resin layer that covers the switch housing.

As a result, a gap is formed between the protective sheet of the tactile switch and the resin sheet of the card medium facing the card medium, and the edge of the opening of the accommodating part that accommodates the tactile switch is formed on the back side of the outermost surface layer of the card medium. Providing support means for supporting the surface layer that protrudes further inward than the switch provides reliable ON/OFF switching, a clear click feeling, and a beautiful appearance in which irregularities in the switch housing are not noticeable. The present inventors have found that the present invention is effective for this purpose, and have completed the present invention.

That is, according to the present invention, a component board on which a tactile switch and other electronic components are mounted, and a plant fiber-containing component board laminated on the component board on the side on which the tactile switch is mounted. A resin layer ("mixed paper" before hot press molding, the same applies hereinafter), and by providing a first opening in a part of the resin layer, the tactile switch is exposed to the surface of the resin layer containing vegetable fibers. the plant fiber-containing resin layer housed in the plant fiber-containing resin layer, and one or more resin layers not containing plant fibers laminated on the plant fiber-containing resin layer ("resin sheet" before hot press molding, the same hereinafter). ), wherein the resin layer in the first finishing layer facing the protective sheet of the tactile switch forms a gap with the protective sheet. Provided is a resin card medium characterized in that the card medium is disposed in the resin card medium.

The present invention includes a switch board having a plurality of connection terminals formed on its top surface, and a switch board provided on the switch board, with the peripheral edge contacting the connection terminals on both sides, and the top part contacting the connection terminals on both sides. A dome-shaped leaf spring arranged so as to be located at the top of the switch board, a case that forms a space for accommodating the leaf spring, and a case that holds the leaf spring within the space of the case. For this purpose, a tactile switch including a protective sheet fixed to the upper surface of the case is used, but the switch is not particularly limited to this. Any general tactile switch can be used without particular limitation as long as it includes a dome-shaped leaf spring that is elastically deformed by a pressing force and elastically restored by releasing the pressing force.

Further, in order to accommodate the tactile switch in the card, the vegetable fiber-containing resin layer is provided with a first opening that is opened so as to expose the tactile switch to the surface of the vegetable fiber-containing resin layer. Furthermore, on the first opening and the resin layer containing vegetable fibers, one or more resin layers are laminated as a first finishing layer over the entire surface of the card medium, so that the tactile switch can be removed from the card medium. There is no risk of the card flying out, and the waterproofness of the card medium is also improved.

The tactile switch used in the present invention includes a protective sheet on the upper surface of the case. For this reason, there is no fear that the leaf spring in the space of the case will jump out, making it possible to easily assemble the tactile switch to the resin card medium. In this case, the protective sheet does not need to be fixed to the top of the dome-shaped leaf spring in consideration of the operability of the switch.

In the present invention, the resin layer in the first finishing layer facing the protective sheet is arranged so as to form a gap with the protective sheet. If a gap is provided between the resin layer in the first finishing layer and the protective sheet, it can be freely deformed independently of the displacement of the protective sheet of the tactile switch and the dome-shaped leaf spring underneath. Therefore, as long as the click feeling of the tactile switch itself is adjusted, the click feeling of the originally set tactile switch can be obtained as is even after it is incorporated into the card medium.

Note that the resin layer in the first finishing layer facing the protective sheet refers to the resin layer closest to the protective sheet when the first finishing layer is formed of multiple resin layers, and directly through the gap. means the resin layer facing the card, which resin layer substantially forms the outermost surface of the card. Further, the resin layer facing the protective sheet is preferably made of PET (polyethylene terephthalate) resin in order to prevent unintended deformation due to heat pressing.

Moreover, it is preferable that the protective sheet for the tactile switch has a through hole and/or a through slit for gas venting. If the protective sheet has through holes and/or through slits, the gas inside the case expanded by the heat of the heat press during card molding can easily escape to the outside, so the protective sheet glued to the top of the case can easily escape. This prevents the sheet from expanding irreversibly and impairing the click feeling of the tactile switch.

Note that the tactile switch used in the present invention may or may not include a protective sheet fixed to the upper surface of the case in order to hold the dome-shaped leaf spring within the space of the case. As mentioned above, if the top surface of the case is not provided with a protective sheet, there is a risk that the leaf spring in the space in the case will jump out, reducing the handling of the tactile switch. After assembly, the leaf spring is held in the case by the resin layer laminated on the outermost surface of the card, and the dome-shaped leaf spring inside the case can be pressed directly without using the protective sheet. Therefore, the deformation of the dome-shaped leaf spring can be directly felt as a click. Note that in this case, it is not necessary to provide a gap between the resin layer on the outermost surface of the card and the dome-shaped leaf spring. It may or may not be fixed to the top of the shaped leaf spring.

Furthermore, in the present invention, on the back side of the resin layer disposed on the outermost surface of the first finishing layer, there is provided a lower layer such as another resin layer or a vegetable fiber-containing resin layer disposed on the back side of the resin layer. An adhesive layer is laminated to fix it. The adhesive layer has a second opening aligned with the first opening of the plant fiber-containing resin layer, and the second opening is located inside the first opening in a plan view. A protruding portion may be provided that protrudes inward from the edge of the first opening so as to overlap the housed tactile switch (usually the tactile switch case).

Normally, the first opening that accommodates the tactile switch has an angular edge, which tends to cause unevenness such as creases in the surface resin layer during hot pressing or the like. In addition, since the opening is larger than the opening of the space in the case that accommodates the dome-shaped leaf spring, excessive expansion of the support span of the resin layer (distance between opposing edges within the opening) and the expansion/contraction area may cause , the click feeling may be impaired, the resin layer stretched by pressure may not be able to recover sufficiently, and the surface of the card housing the tactile switch may become uneven, detracting from its beautiful appearance.

However, in the present invention, an adhesive layer is disposed on the back surface of the resin layer disposed on the outermost surface, and the adhesive layer is provided with a second opening aligned with the first opening of the resin layer containing vegetable fibers. , and since the second opening is provided with a protruding part that protrudes inward from the edge of the first opening, the resin layer on the outermost surface is formed so that the edge of the first opening is the protruding part. By being covered, the corners are softened and unevenness such as creases is less likely to occur. Furthermore, the resin layer on the outermost surface can be supported from below with a support span (distance between opposing edges in the case) similar to that supported by the case of a tactile switch. Furthermore, since the adhesive layer does not substantially expand or contract, the outermost resin layer has a stretching area similar to that supported by the tactile switch case within the second opening that is not bonded to the adhesive layer. As a result, it is possible to suppress excessive expansion of the support span and the elastic region, and the click feeling is not impaired and the resin layer that has been stretched by pressure is not sufficiently restored. Moreover, as a result, the surface of the card housing the tactile switch is free from irregularities, making it possible to maintain a beautiful appearance.

In the resin card medium of the present invention, a plant fiber-containing resin layer may be further laminated on the surface of the component substrate on the side opposite to the side on which the tactile switch is mounted.

In this case, in the manufacturing process of the resin card medium of the present invention, the component substrate on which electronic components such as IC chips and tactile switches are mounted is made of plastic fibers made of copolymerized polyester resin such as PET (polyethylene terephthalate) resin and vegetable fibers. A front side mixed paper and a back side mixed paper (forming one "vegetable fiber-containing resin layer" after hot press molding, the same applies hereinafter) are used to wrap the component board and sandwich it from the upper and lower surfaces thereof. For this reason, the front mixed paper and back mixed paper laminated on the upper and lower surfaces receive approximately the same pressure from the electronic components on the upper and lower surfaces of the component board during heat pressing, and have approximately the same density and approximately the same heat shrinkage. Since it is compressed in the thickness direction while maintaining the ratio and forms one plant fiber-containing resin layer, it contributes to preventing deformation of the completed resin card.

In the present invention, the first finishing layer of the resin card medium is composed of two or more resin layers, and the first finishing layer of the resin card medium is composed of two or more resin layers, and a plant on or on the component board surface on the opposite side to the side on which the tactile switch is mounted. When a second finishing layer consisting of two or more resin layers not containing vegetable fibers is laminated on the fiber-containing resin layer, each resin layer of the first finishing layer and each of the second finishing layer Each of the resin layers has the same structure, and each resin layer of the first finishing layer and each resin layer of the second finishing layer are positioned symmetrically with each other with the vegetable fiber-containing resin layer in between. It is preferable to arrange.

In the resin card medium of the present invention, when each resin layer of the first finishing layer and each resin layer of the second finishing layer are arranged at symmetrical positions with the plant fiber-containing resin layer in between, During hot pressing, the upper and lower surfaces of the mixed paper that are in contact with the finishing layer can be restrained so that they exhibit more uniform thermal contraction.

Furthermore, in the present invention, each of the resin sheets constituting the first and second finishing layers (forming a "resin layer" after hot press molding; the same applies hereinafter) is made of the same material, the same thickness, etc. A card medium stack is prepared before hot pressing so that the resin sheets of the first and second finishing layers have the same structure and are arranged in symmetrical positions with the mixed paper sandwiched therebetween. When the card medium laminate is heat-pressed at a temperature above the softening point and below the melting point of the plastic fibers, the upper and lower surfaces of the mixed paper exhibit even more uniform heat shrinkage, resulting in extremely flat and smooth surfaces, and the same It is possible to obtain a resin card medium in which the resin layers of the first and second finishing layers, which are made of the same material, have the same thickness, and are arranged at symmetrical positions with the plant fiber-containing resin layer in between. In addition, in the present specification, "a temperature higher than the softening point and lower than the melting point" refers to the degree to which the vegetable fiber-containing resin layer and the first finishing layer and/or the vegetable fiber-containing resin layer and the second finishing layer are fused. includes, in part, the temperature at which plastic fibers melt.

For this reason, it is preferable that each resin sheet of the first finishing layer has the same thickness as each resin sheet of the second finishing layer disposed at a symmetrical position with the mixed paper sandwiched therebetween, and Preferably, each resin sheet of the second finishing layer is made of the same material.

In the present invention, the expression that the resin sheets or the resin layers after hot press molding "have the same configuration" means that the resin sheets or the resin layers after hot press molding that are in symmetrical positions with respect to each other are different in terms of material and size. This means that they are the same in terms of shape such as thickness.

In addition, in the present invention, "arranged in symmetrical positions" across the mixed paper or the plant fiber-containing resin layer after heat press molding means, for example, the resin sheet is placed on the surface of the mixed paper in the direction away from the surface. When the first finishing layer consisting of c/resin sheet b/resin sheet a (forms "resin layer c /resin layer b/resin layer a " after hot press molding) is laminated, the back side of the mixed paper Also, a second finishing layer is applied in the order of resin sheet c/resin sheet b/resin sheet a in the direction away from the back surface so that the resin sheets having the same structure as the front surface are lined up with the mixed paper as a mirror surface. means that they are laminated. In other words, the above resin card medium has, from top (front) to bottom (back), resin sheet a/resin sheet b/resin sheet c, mixed paper, and resin sheet c/resin sheet b. /resin sheet a means that they are laminated in this order.

In the present invention, each of the two or more resin sheets of the first finishing layer and the two or more resin sheets of the second finishing layer are arranged at symmetrical positions with the mixed paper sandwiched therebetween. The above-mentioned effects can be obtained, and there is no particular limit to the number of laminated resin sheets of the first and second finishing layers as long as the number is two or more.

In the resin card medium of the present invention, the mixed paper made of plastic fibers made of copolymerized polyester resin such as PET resin and plant fibers also functions as a cushioning material during hot pressing, so the flatness of the card medium after molding is improved. Absorbs unevenness (thickness of electronic components) on component boards caused by electronic components. In this way, in order to ensure that the mixed paper absorbs the unevenness of the component substrate, the total thickness of the component substrate and the thickness of the electronic component must be 80% or less of the thickness of the card medium after hot press molding. More preferably, it is adjusted to 70% or less.

Next, a method for manufacturing the above-described resin card medium of the present invention will be described. When the upper part of the tactile switch is covered with a protective sheet, the resin card medium of the present invention has a second layer made of two or more resin sheets (forming a "resin layer" after hot press molding) that does not contain vegetable fibers. a dome-shaped leaf spring that is elastically deformed by the pressing force from the protective sheet and elastically restored by the release of the pressing force from the protective sheet, is provided on the second finishing layer. placing a component board on which a tactile switch and other electronic components are mounted with the side on which the tactile switch is mounted facing upward; and forming a first opening in a part on the component board. and laminating a mixed paper made of plastic fibers and vegetable fibers (forming a "vegetable fiber-containing resin layer" after hot press molding) so that the tactile switch is exposed on the surface of the mixed paper. and, in the step of laminating a first finishing layer consisting of two or more resin sheets not containing vegetable fibers on the mixed paper, on the back side of the resin sheet placed on the uppermost surface of the first finishing layer. By including the step of further laminating an adhesive sheet (forming an "adhesive layer" after hot press molding) for adhering to the lower sheet placed on the back side of the resin sheet, card media lamination before hot press is possible. In the method of manufacturing a resin card medium by preparing a resin card medium and hot-pressing the card medium laminate at a temperature higher than the softening point and lower than the melting point of the plastic fiber, the adhesive layer includes the vegetable fiber-containing It has a second opening that is aligned with the first opening of the resin layer, and the second opening overlaps the tactile switch housed in the first opening in plan view. The protective sheet of the tactile switch has a protruding portion that protrudes inward from the edge of the first opening so as to overlap with the resin sheet in the first finishing layer facing the protective sheet. arranging so as to form a gap therebetween.

In the present invention, the vegetable fibers in the mixed paper suitable for obtaining a resin card medium having a high degree of flatness and smoothness by absorbing the unevenness of the component board caused by electronic components include, for example, softwood fibers. High yield unbleached kraft pulp (HNKP; N material), softwood bleached kraft pulp (NBKP; N material, NB material), hardwood unbleached kraft pulp (LUKP; L material), hardwood bleached kraft pulp (LBKP, L material), etc. chemical pulps; mechanical pulps such as ground wood pulp (GP), pressure-rised ground wood pulp (PGW), and thermomechanical pulp (TMP); waste paper pulps and semi-finished pulps such as deinking pulp (DIP) and waste pulp (WP); Wood pulps such as chemical pulp (CP) and non-wood pulps such as cotton, straw, bamboo, esparto, kenaf, cotton, bagasse, flax, hemp, jute, and gampi are used. can do.

These plant fibers may be used alone or in combination of two or more. Among these, NBKP, Western hemp, and Manila hemp pulps are preferred because pulps with appropriate fiber lengths are available and are easy to make strong paper, and NBKP is particularly preferred because it has high whiteness and is easily available.

In addition, in the present invention, the above-mentioned plastic fibers blended into the mixed paper, and the finishing layer used to improve the flatness and smoothness of the card surface as well as printability, gloss, and scratch resistance, etc. Examples of resin materials suitable for the resin sheet include polyvinyl chloride (PVC), polyethylene terephthalate (PET), polyethylene terephthalate copolymer (PETG), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), etc. .

According to the present invention, in a resin card medium, an adhesive layer is disposed on the back side of the resin layer disposed on the outermost surface, and the adhesive layer has a first opening aligned with the first opening of the vegetable fiber-containing resin layer. 2 openings are provided, and the second openings are provided with protruding parts that protrude inward from the edges of the first openings, so that the resin layer on the outermost surface is By covering the edges with protruding parts, the corners are softened and unevenness such as creases is less likely to occur. Furthermore, the resin layer on the outermost surface can be supported from below with a support span (distance between opposing edges in the case) similar to that supported by the case of a tactile switch. Furthermore, since the adhesive layer does not substantially expand or contract, the outermost resin layer has a stretching area similar to that supported by the tactile switch case within the second opening that is not bonded to the adhesive layer. As a result, it is possible to suppress excessive expansion of the support span and the elastic region, and the click feeling is not impaired and the resin layer that has been stretched by pressure is not sufficiently restored. Moreover, as a result, the surface of the card housing the tactile switch is free from irregularities, making it possible to maintain a beautiful appearance.

Further, according to the present invention, when a tactile switch using a resin card medium is provided with a protective sheet on the upper surface of the case, the protective sheet is provided between the resin layer in the first finishing layer facing the protective sheet. Since the tactile switch is arranged to form a gap, it can be deformed freely independent of the displacement of the tactile switch's protective sheet and the dome-shaped leaf spring underneath, and even the click feeling of the tactile switch itself can be adjusted. If this is done, the click feeling of the originally set tactile switch can be obtained even after it is incorporated into the card medium.

As a result of the above, according to the resin card medium of the present invention, the outermost surface is provided with a resin layer that covers the entire surface of the card, and the resin card medium that is equipped with a tactile switch inside the resin layer has the resin layer. Even with the intervening pressing operation, it is possible to turn the switch ON and OFF with certainty and to obtain a clear click feeling.

FIG. 2 is a cross-sectional view schematically showing a cross section of a resin card medium of Example 1 according to the present embodiment. FIG. 2 is a partially enlarged cross-sectional view of the vicinity of the tactile switch of the resin card medium of Example 1 according to the present embodiment. FIG. 2 is an exploded cross-sectional view schematically showing the laminated structure of the resin card medium of Example 1 according to the present embodiment before hot press molding. FIG. 3 is a partially enlarged cross-sectional view of the vicinity of the tactile switch of the resin card medium of Example 2; FIG. 3 is a partially enlarged cross-sectional view of the resin card medium of Comparative Example 1 near the tactile switch. It is a load-stroke curve showing the behavior of a dome-shaped leaf spring of a tactile switch made of a resin card medium. (a) is a partially enlarged sectional view of the card medium near the tactile switch of Example 1, and (b) is a schematic sectional view further enlarged of the surface layer of the card medium of (a). (a) is a partially enlarged sectional view of the card medium in the vicinity of the tactile switch of Example 2 , and (b) is a schematic sectional view further enlarged of the surface layer of the card medium of (a).

Hereinafter, a resin card medium and a method for manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments shown below, and various changes can be made without departing from the technical idea of the present invention.

FIG. 1 schematically shows a cross section of the resin card medium 1 according to the present embodiment, and FIG. 2 shows a partial cross section of the resin card medium 1 near the tactile switch 2 according to the present embodiment. It is shown enlarged. FIG. 3 schematically shows the laminated structure of the resin card medium 1 according to this embodiment before hot press molding.

As shown in FIG. 1, the resin card medium 1 according to the present embodiment includes a component board 3 on which a tactile switch 2 and other electronic components 30 are mounted, a battery 31, and a tactile switch 2. On the side component board 3, a plant fiber-containing resin layer 4 containing plant fibers is laminated, which accommodates the tactile switch 2 so as to be exposed to the surface by providing a first opening 41 in a part. On top of the vegetable fiber-containing resin layer 4, there is provided a first finishing layer 5a consisting of two different resin layers 50a and 51a that do not contain vegetable fibers.

Further, the resin card medium 1 according to the present embodiment has two different resin layers 50b and 51b that do not contain vegetable fibers on the surface of the component board 3 on the opposite side to the side on which the tactile switch 2 is mounted. A second finishing layer 5b is provided.

In this embodiment, each layer before hot press molding is such that the plant fiber-containing resin layer 4 is formed from polyethylene terephthalate (PET) mixed paper, and the resin layer 50a on the outermost surface of the card medium 1 is formed from a polyethylene terephthalate (PET) sheet. The resin layer 51a is molded from a polyethylene terephthalate copolymer (PETG) sheet (FIG. 3).

In this embodiment, a switch board 20 having a plurality of connection terminals 21 a and 21 b formed on the upper surface is provided on the switch board 20, and the peripheral edge contacts the connection terminals 21 a on both sides, and the top is a case that is provided above the dome-shaped leaf spring 22 placed above the central connection terminal 21b and the switch board 20, and forms a space for accommodating the leaf spring 22. 23 and a protective sheet 24 fixed to the upper surface of the case 23 to hold the leaf spring 22 in the space of the case 23, but the present invention is not particularly limited thereto. isn't it. Any general tactile switch can be used without particular limitation as long as it includes a dome-shaped leaf spring that is elastically deformed by a pressing force and elastically restored by releasing the pressing force.

In addition, the vegetable fiber-containing resin layer 4 has a first opening 41 that is opened so as to expose the tactile switch 2 to the surface of the vegetable fiber-containing resin layer 4 in order to accommodate the tactile switch 2 in the card. It is provided. Further, on the first opening 41 and the vegetable fiber-containing resin layer 4, two resin layers 50a and 51a are laminated as a first finishing layer 5a over the entire surface of the card medium 1, so that the tactile switch 2 And the waterproofness of the entire card medium 1 is improved.

As shown in FIG. 2, the tactile switch 2 used in this embodiment includes a protective sheet 24 on the upper surface of the case 23, so there is no fear that the leaf spring 22 in the space of the case 23 will jump out. , it becomes possible to easily assemble the tactile switch 2 to the resin card medium 1. In this case, the protective sheet 24 may or may not be fixed to the top of the dome-shaped leaf spring 22 in consideration of the operability of the switch.

In this embodiment, since the tactile switch 2 is provided with the protective sheet 24 on the upper surface of the case 23, the resin layer 50a in the first finishing layer 5a facing the protective sheet 24 is between the protective sheet 24 and the resin layer 50a. They are arranged to form a gap d. If a gap d is provided between the resin layer 50a in the first finishing layer 5a and the protective sheet 24, the resin layer 50a becomes independent from the displacement of the protective sheet 24 of the tactile switch 2 and the dome-shaped leaf spring 22 thereunder. Since the tactile switch 2 can be freely deformed, as long as the click feeling of the tactile switch 2 itself is adjusted, the initially set click feeling of the tactile switch 2 can be obtained even after being incorporated into the card medium 1.

Note that the resin layer 50a in the first finishing layer 5a facing the protective sheet 24 refers to the protective layer 50a when the first finishing layer 5a is formed of a plurality of resin layers 50a and 51a as in this embodiment. This refers to the resin layer 50a that is closest to the sheet 24 and directly faces the sheet 24 through the gap d, and the resin layer 50a substantially forms the outermost surface of the card. Further, the resin layer 50a facing the protective sheet 24 is made of PET (polyethylene terephthalate) resin in order to prevent unintentional deformation due to heat pressing.

Furthermore, in this embodiment, the protective sheet 24 has through holes and/or through slits 240 for degassing. If the protective sheet 24 is provided with through holes and/or through slits 240, the gas inside the case 23 that expands due to the heat of the heat press during card molding can easily escape to the outside. This prevents the protected sheet 24 from expanding irreversibly and impairing the click feeling of the tactile switch 2.

Note that the tactile switch 2 used in this embodiment may include a protective sheet 24 fixed to the upper surface of the case 23 in order to hold the dome-shaped leaf spring 22 in the space of the case 23. You don't have to. Although not shown, if the protective sheet 24 is not provided on the upper surface of the case 23, there is a risk that the leaf spring 22 in the space of the case 23 will jump out, reducing the handling of the tactile switch 2. After being assembled to the card medium 1, the leaf spring 22 is held in the case 23 by the resin layer 50a laminated on the outermost surface of the card, and is directly attached to the dome inside the case 23 without using the protective sheet 24. Since the dome-shaped plate spring 22 can be pressed, the deformation of the dome-shaped plate spring 22 can be directly felt as a click feeling. In this case, it is not necessarily necessary to provide a gap d between the resin layer 50a on the outermost surface of the card and the dome-shaped leaf spring 22, and the tactile switch 2 is protected by considering the operability of the switch 2. It may or may not be fixed to the top of the dome-shaped leaf spring 22 like the sheet 24.

Furthermore, in the resin card medium 1 of this embodiment, on the back surface of the resin layer 50a disposed on the outermost surface of the first finishing layer 5a, another resin layer disposed on the back surface side of the resin layer 50a is provided. An adhesive layer 6 for adhering to the lower layer such as 51a and the vegetable fiber-containing resin layer 4 is laminated. The adhesive layer 6 has a second opening 61 that is aligned with the first opening 41 of the vegetable fiber-containing resin layer 4, and the second opening 61 is aligned with the first opening 41 in the plant fiber-containing resin layer 4. A protruding portion 62 is provided that protrudes inward from the edge of the first opening 41 so as to overlap the tactile switch 2 (usually the case 23 of the tactile switch) housed in the opening 41.

Normally, the first opening 41 that accommodates the tactile switch 2 has an angular edge, which tends to cause crease-like irregularities in the surface resin layer 50a during hot pressing or the like. In addition, since the opening is larger than the opening of the space of the case 23 that accommodates the dome-shaped leaf spring 22, the support span of the resin layer 50a (distance between opposing edges in the opening 41) and the expansion/contraction area Due to excessive expansion, the click feeling is impaired, the resin layer 50a stretched by pressure cannot be restored sufficiently, and the surface of the card 1 housing the tactile switch 2 becomes uneven, detracting from its beautiful appearance.

However, in this embodiment, an adhesive layer 6 is arranged on the back surface of the resin layer 50a arranged on the outermost surface, and the adhesive layer 6 has a first opening 41 aligned with the first opening 41 of the resin layer 4 containing vegetable fibers. 2 openings 61 are provided, and the second openings 61 are provided with protruding portions 62 that protrude inward from the edges of the first openings 41, so that the resin layer 50a on the outermost surface is By covering the edge of the first opening 41 with the protruding portion 62, its corners are softened and unevenness such as creases is less likely to occur. Further, the resin layer 50a on the outermost surface can be supported from below with a support span (distance between opposing edges in the case 23) similar to that supported by the case 23 of the tactile switch 2. It becomes like this. Furthermore, since the adhesive layer 6 does not substantially expand or contract, the resin layer 50a on the outermost surface is supported by the case 23 of the tactile switch 2 in the second opening 61 that is not bonded to the adhesive layer 6. As a result of having a stretchable region similar to the above, it is possible to suppress excessive expansion of the support span and stretchable region, which may impair the click feeling or prevent the resin layer 50a stretched by pressure from restoring sufficiently. There is no. Furthermore, the surface of the card 1 housing the tactile switch 2 is free from irregularities, making it possible to maintain a beautiful appearance.

Although not shown, in the resin card medium 1 of this embodiment, a plant fiber-containing resin layer may be further laminated on the surface of the component board 3 on the side opposite to the side on which the tactile switch 2 is mounted. .

In this case, in the manufacturing process of the resin card medium 1, the component substrate 3 on which the electronic components 30 such as the IC chip and the tactile switch 2 are mounted is made of plastic fibers made of copolymerized polyester resin such as PET (polyethylene terephthalate) resin and vegetable fibers. The front side mixed paper and the back side mixed paper made of fibers are used to wrap the component board 3 and sandwich it from its upper and lower surfaces. For this reason, the front mixed paper and the back mixed paper laminated on the upper and lower surfaces receive approximately the same pressure from the electronic components 30 on the upper and lower surfaces of the component board 3 during heat pressing, and have approximately the same density and approximately the same Since it is compressed in the thickness direction while maintaining the heat shrinkage rate to form one plant fiber-containing resin layer 4, it contributes to preventing deformation of the resin card 1 after completion.

In this embodiment, the first finishing layer 5a of the resin card medium 1 is composed of two or more resin layers 50a and 51a, and the component board 3 on the side opposite to the side on which the tactile switch 2 is mounted A second finishing layer 5b consisting of two or more resin layers 50b and 51b not containing vegetable fibers is also laminated on the surface of. Further, each resin layer 50a, 51a of the first finishing layer 5a and each resin layer 50b, 51b of the second finishing layer 5b have the same configuration, and each resin layer 50a, 51a of the first finishing layer 5a and the resin layer 50b, 51b of the second finishing layer 5b have the same structure. The resin layers 50b and 51b of the second finishing layer 5b are arranged symmetrically with each other with the plant fiber-containing resin layer in between.

As in this embodiment, the resin layers 50a, 51a of the first finishing layer 5a and the resin layers 50b, 51b of the second finishing layer 5b are arranged symmetrically with each other with the vegetable fiber-containing resin layer 4 in between. When placed in such a position, the upper and lower surfaces of the mixed paper 40 in contact with the finishing layers 5a and 5b can be restrained so as to exhibit more uniform thermal contraction during hot pressing.

Specifically, in this embodiment, the resin layer 50a of the first finishing layer 5a and the resin layer 50b of the second finishing layer 5b arranged on the outermost surface of the card are made of PET (polyethylene terephthalate) having the same thickness. The resin layer 51a of the first finishing layer 5a and the resin layer 51b of the second finishing layer 5b arranged on the back side of the respective resin layers 50a and 50b are made of PETG (polyethylene terephthalate) having the same thickness. polymer). Further, the resin layers 50a and 50b are obtained by hot press molding resin sheets 500a and 500b of the same thickness made of PET resin, and the resin layers 51a and 51b are obtained by hot press molding resin sheets 510a and 500b of the same thickness made of PETG resin, 510b by hot press molding. Further, the plant fiber-containing resin layer 4 can be obtained by hot press molding the PET mixed paper 40, and the adhesive layer 6 can be obtained by hot press molding the adhesive sheet 60.

When the above-mentioned resin sheets, PET mixed paper, and adhesive sheets are directly laminated with sheets made of the same material, heat press molding is performed to form one resin layer for each, even if the thicknesses are different. A plant fiber-containing resin layer and an adhesive layer are formed.

Therefore, as in the present embodiment, each resin sheet constituting the first and second finishing layers 5a and 5b is made of the same material and has the same thickness, and each of the first and second finishing layers is made of the same material and has the same thickness. The card medium laminate 10 before hot pressing is prepared so that each of the resin sheets 500a, 500b, 510a, and 510b is placed in a symmetrical position with the PET mixed paper 40 in between (see FIG. 3). When the card medium laminate 10 is heat-pressed at a temperature higher than the softening point and lower than the melting point of the plastic fibers, the upper and lower surfaces of the PET mixed paper 40 exhibit even more uniform heat shrinkage, making them extremely flat and smooth. , and each of the resin layers 50a, 50b, 51a, 51b of the first and second finishing layers 5a, 5b made of the same material, the same thickness, etc. is symmetrical to each other with the vegetable fiber-containing resin layer 4 in between. It is possible to obtain the resin card medium 1 placed in the desired position.

In this embodiment, during hot pressing, the PET mixed paper 40 made of PET fibers and vegetable fibers also functions as a cushioning material, so the component substrate formed by the electronic component 30 is 3. Absorbs unevenness (thickness of electronic components). In this way, in order to ensure that the PET mixed paper 40 absorbs the unevenness of the component substrate 3, the total thickness of the component substrate 3 and the thickness of the electronic component 30 must be equal to the thickness of the card medium 1 after hot press molding. It is preferable to adjust it to 80% or less, more preferably 70% or less.

Next, a method for manufacturing the resin card medium 1 according to this embodiment will be described using FIG. 3.

In the manufacturing method of this embodiment, first, a resin sheet 500b made of PET resin that does not contain vegetable fibers is prepared, an adhesive sheet 60 is laminated on the resin sheet 500b, and then an adhesive sheet 60 made of PETG resin is further placed on the adhesive sheet 60. The second finishing layer 5b is prepared by laminating the resin sheets 510b.

Next, on the second finishing layer 5b, a tactile switch 2 is provided with a dome-shaped leaf spring 22 that is elastically deformed by the pressing force from the protective sheet 24 and elastically returned to its original state when the pressing force from the protective sheet 24 is released. The component board 3 on which other electronic components 30 are mounted is placed with the side on which the tactile switch 2 is mounted facing upward.

Subsequently, a PET mixed paper 40 made of PET fibers and vegetable fibers is laminated on the component substrate 3. At this time, since the first opening 41 is provided in a part of the PET mixed paper 40, the tactile switch 2 is housed so as to be exposed on the surface of the PET mixed paper 40.

Subsequently, a resin sheet 510a made of PETG resin that does not contain vegetable fibers is laminated on the PET mixed paper 40, an adhesive sheet 60 is laminated on the resin sheet 510a, and a sheet made of PET resin is further laminated on the adhesive sheet 60. By laminating the resin sheets 500a and the protective sheet 24 of the tactile switch 2 so as to form a gap therebetween, a card medium laminate 10 with the first finishing layer 5a before hot pressing is prepared. Further, the adhesive sheet 60 has a second opening 61 that is aligned with the first opening 41 of the PET mixed paper 40, and the second opening 61 is closer to the edge of the first opening 41. Since the protruding portion 62 protrudes inwardly, the protruding portion 62 is arranged so as to overlap the tactile switch 2 accommodated in the first opening 41 in a plan view.

1. Evaluation of click feel of card media The click feel of resin card media was evaluated by measuring the load (N) when pressing a tactile switch and the stroke (mm) when pressing the tactile switch. .

FIG. 6 shows a "load-stroke curve" showing the behavior of the dome-shaped leaf spring 22 of the tactile switch 2 such as the resin card medium 1 according to the present embodiment. The vertical axis of the graph in FIG. 6 shows the load (N) when pressing the tactile switch 2 with the resin layer 50a of the first finishing layer 5a interposed, and the horizontal axis shows the load (N) when pressing the tactile switch 2. It shows the stroke (mm) when performing a pressing operation.

As shown in the graph of FIG. 6, when pressing the tactile switch 2 from the OFF state to the ON state, the leaf spring 22 is initially elastically deformed, so the load of the pressing operation increases as the stroke increases. The value increases and reaches a buckling point (hereinafter referred to as "OF (operation force) value") which is a peak value. After that, the leaf spring 22 is reversed and deformed, so the load of the pressing operation decreases as the stroke increases, and when the top of the leaf spring 22 comes into contact with the connection terminal of the switch board, the bottom value is the return point. (hereinafter referred to as "RF (Return Force) value"). Further, when pressing the tactile switch 2 from the ON state to the OFF state, the weight of the pressing operation follows a trajectory substantially opposite to the above-described load-stroke curve.

In addition, among the click sensations that are generally felt in the fingers, as an index for obtaining a sharp, crisp, and clear click sensation, using the following formula 1, the click rate calculated from the weight-stroke curve above is 20% or more. It is considered good to be within this range.
Click rate (%) = (OF value - RF value) / OF value x 100...Formula 1

FIG. 4 shows a partially enlarged cross section of the resin card medium 1a of Example 2 according to another embodiment of the present invention near the tactile switch 2, and FIG. 5 shows a comparative example. A cross section of the resin card medium 1b in the vicinity of the tactile switch 2 is shown partially enlarged.

In addition to the resin card medium 1 of Example 1 according to the present embodiment described above, a resin card medium 1a of Example 2 and a resin card medium 1b of Comparative Example 1 were manufactured, and the dome shape of each tactile switch 2 was prepared. The behavior and click feeling of the leaf spring 22 was investigated.

2. Appearance evaluation of card media The appearance of resin card media was evaluated by measuring the maximum distance from the flat surface of the surface plate on all parts of the convex surface of the card using a laser displacement sensor (Keyence LK-030). The evaluation was made by checking whether the unevenness could be visually recognized no matter what angle the surface of the resin card medium was irradiated with.

[Example 1]
The second opening 61 of the adhesive layer 6 has a protruding part 62, and a gap d is provided between the resin layer 50a of the first finishing layer 5a and the protective sheet 24 of the tactile switch 2. The resin card medium 1 according to this embodiment was referred to as Example 1 (FIGS. 1 and 2). A load-stroke curve 7 of the tactile switch 2 of Example 1 is shown in FIG.

[Example 2]
Example 2 is a resin card medium 1a having the same configuration as Example 1 except that a gap d is provided between the resin layer 50a and the protective sheet 24, but there is no protruding portion 62. Figure 4). A load-stroke curve 7a of the tactile switch 2 of Example 2 is shown in FIG.

[Comparative example 1]
Comparative Example 1 was a resin card medium 1b having the same configuration as Example 1, except that the gap d was not provided between the resin layer 50a and the protective sheet 24, and there was no protruding portion 62. The load-stroke curve 8 of the tactile switch 2 of Comparative Example 1 is shown in FIG.

From FIG. 6 and Equation 1, in the case of the resin card medium 1 of Example 1, the click rate calculated from the weight-stroke curve 7 of the tactile switch 2 is 20%, and the weight of the tactile switch 2a of Example 2- The click rate determined from the stroke curve 7a was 20%. On the other hand, the click rate determined from the load-stroke curve 8 of the tactile switch 2 of Comparative Example 1 was 3%.

As a result, when comparing Examples 1 and 2 with Comparative Example 1, it was found that even by pressing the resin layer 50a of the first finishing layer 5a, the switch could be turned on and off with certainty and with a clear click feeling. In order to obtain this, it has been found that it is effective to arrange the resin layer 5 in the first finishing layer 5a facing the protective sheet 24 so as to form a gap d between the resin layer 5 and the protective sheet 24. .

FIG. 7(a) shows a partially enlarged cross-sectional view of the card medium 1 near the tactile switch 2 of Example 1, and FIG. 7(b) shows the surface of the card medium 1 of FIG. A schematic cross-sectional view of a further enlarged portion is shown. Further, FIG. 8(a) is a cross-sectional view of the card medium 1a in which the vicinity of the tactile switch 2 of Example 2 is partially enlarged, and FIG. 8(b) is a cross-sectional view of the card medium 1a of (a). A schematic cross-sectional view further enlarging the surface layer portion is shown.

As can be understood by comparing FIGS. 7 and 8, the card medium 1 of Example 1 in which the second opening 61 of the adhesive layer 6 is provided with the protruding part 62 is different from the resin of the first finishing layer 5a. The unevenness in the layer 50a was approximately 0 μm, and it was not possible to visually confirm the unevenness on the surface of the card medium 1. On the other hand, the card medium 1a of Example 2, which did not have the protruding portion 62, was particularly rough on the surface of the card medium 1. It was found that a depression of about 20 μm was formed in the resin layer 50a of the first finishing layer 5a at the edge of the opening 41 of the card medium 1, and the unevenness of the surface of the card medium 1 could be visually confirmed. In this way, by providing the protruding part 62 in the second opening 61 of the adhesive layer 6, the edge (corner) of the first opening 41 is covered with the protruding part 62, and the surface layer of the card medium 1 is covered with the protruding part 62. It has been found that by narrowing the support span of the resin layer 50a, it is possible to effectively prevent unevenness from occurring on the surface layer of the card medium 1, and it is possible to maintain a beautiful appearance.

1, 1a, 1b... Resin card medium 10... Card medium laminate 2... Tactile switch 20... Switch board 21a, 21b... Connection terminal 22... Leaf spring 23... Case 24... Protective sheet 240... Through hole, through slit 3... Component board 30... Electronic component 31... Battery 4...・Plant fiber-containing resin layer 40...Mixed paper (PET blended paper)
41...First opening 5a...First finishing layer 50a...Resin layer (PET)
500a...Resin sheet (PET)
51a...Resin layer (PETG)
510a...Resin sheet (PETG)
5b...Second finishing layer 50b...Resin layer (PET)
500b...Resin sheet (PET)
51b...Resin layer (PETG)
510b...Resin sheet (PETG)
6...Adhesive layer 60...Adhesive sheet 61...Second opening 62...Protrusion part 7, 7a...Load-stroke of tactile switch of Examples 1 and 2 Curve 8: Load-stroke curve of the tactile switch of Comparative Example 1 d: Gap

Claims (14)

A switch board with multiple connection terminals formed on the top surface,
a dome-shaped leaf spring provided on the switch board, the peripheral edge of which is in contact with the connecting terminals on both sides, and the top of which is positioned above the central connecting terminal;
a case provided on the switch board and forming a space for accommodating the leaf spring; and a protection fixed to the upper surface of the case for holding the leaf spring in the space of the case. a component board on which the tactile switch and other electronic components are mounted;
A plant fiber-containing resin layer containing plant fibers, which is laminated on the component board on the side on which the tactile switch is attached, is provided with a first opening in a part of the resin layer. The plant fiber-containing resin layer is housed so as to be exposed on the surface of the plant fiber-containing resin layer;
A resin card medium comprising a first finishing layer consisting of one or more resin layers not containing vegetable fibers and laminated on the resin layer containing vegetable fibers,
A resin card medium , wherein a resin layer in the first finishing layer facing the protective sheet is arranged to form a gap between the resin layer and the protective sheet. An adhesive layer is laminated on the back side of the resin layer disposed on the outermost surface of the first finishing layer for adhering to the lower layer disposed on the back side of the resin layer, and the adhesive layer has a second opening aligned with the first opening of the plant fiber-containing resin layer,
The second opening has a protruding part that protrudes inward from an edge of the first opening so as to overlap the tactile switch housed in the first opening in plan view. The resin card medium according to claim 1, further comprising a resin card medium. 3. The resin card medium according to claim 1, wherein the protective sheet has a through hole and/or a through slit for degassing. 4. The plant fiber-containing resin layer is further laminated on the surface of the component substrate on the side opposite to the side on which the tactile switch is attached. resin card medium. The first finishing layer is composed of two or more resin layers,
On the surface of the component board opposite to the side on which the tactile switch is mounted, or on the plant fiber-containing resin layer thereon, a second finishing layer consisting of two or more resin layers not containing plant fibers is provided. are laminated, and each resin layer of the first finishing layer and each resin layer of the second finishing layer have the same structure, and each resin layer of the first finishing layer 5. Any one of claims 1 to 4, wherein the resin layers of the second finishing layer and the second finishing layer are arranged in symmetrical positions with the vegetable fiber-containing resin layer in between. The resin card medium according to item 1. Each of the resin layers of the first finishing layer has the same thickness as each of the resin layers of the second finishing layer, which are arranged at symmetrical positions with the vegetable fiber-containing resin layer in between. The resin card medium according to claim 5, characterized in that: Each of the resin layers of the first finishing layer is formed from the same material as each of the resin layers of the second finishing layer, which are arranged at symmetrical positions with the vegetable fiber-containing resin layer in between. The resin card medium according to claim 5 or 6, characterized in that: 8. The total thickness of the component board and the electronic component is 80% or less of the total thickness of the resin card medium, according to any one of claims 1 to 7. Resin card medium. preparing a second finishing layer consisting of two or more resin sheets that do not contain vegetable fibers;
A tactile switch and other electronic components are mounted on the second finishing layer, including a dome-shaped leaf spring that is elastically deformed by the pressing force from the protective sheet and elastically restored by the releasing of the pressing force from the protective sheet. placing the component board with the side on which the tactile switch is mounted facing upward;
A mixed paper having a first opening in a part and made of plastic fibers and vegetable fibers is laminated on the component substrate so that the tactile switch is exposed on the surface of the mixed paper. step and
In the step of laminating a first finishing layer made of two or more resin sheets that do not contain vegetable fibers on the mixed paper, the back side of the resin sheet placed on the uppermost surface of the first finishing layer is preparing a card medium laminate before heat pressing by further laminating an adhesive sheet for adhesion to a lower sheet disposed on the back side of the resin sheet; In a method for producing a resin card medium by hot pressing at a temperature above the softening point and below the melting point of the fiber,
The adhesive sheet has a second opening aligned with the first opening of the mixed paper,
The second opening has a protruding part that protrudes inward from an edge of the first opening so as to overlap the tactile switch housed in the first opening in plan view. We are equipped with
The method for manufacturing a resin card medium, wherein the resin layer in the first finishing layer facing the protective sheet is arranged so as to form a gap with the protective sheet. 10. The method of manufacturing a resin card medium according to claim 9, wherein the protective sheet has a through hole and/or a through slit for degassing. Before hot press molding, each resin sheet of the first finishing layer and each resin sheet of the second finishing layer have the same configuration, and each resin sheet of the first finishing layer 11. The method of manufacturing a resin card medium according to claim 9, wherein the resin sheets of the second finishing layer and the second finishing layer are arranged at symmetrical positions with the mixed paper interposed therebetween. Each resin sheet of the first finishing layer before hot press molding has the same thickness as each resin sheet of the second finishing layer before hot press molding, which is arranged at a symmetrical position with the mixed paper sandwiched therebetween. 12. The method for manufacturing a resin card medium according to claim 11, further comprising: Each resin sheet of the first finishing layer before hot press molding is made of the same material as each resin sheet of the second finishing layer arranged at symmetrical positions with the mixed paper sandwiched therebetween. 13. The method for manufacturing a resin card medium according to claim 11 or 12. From claim 9, wherein the total thickness of the component substrate and the electronic component is adjusted to be 80% or less of the thickness of the resin card medium after hot press molding. 14. The method for producing a resin card medium according to any one of Item 13.

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