JP2003133684A - Ic chip mounted body and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively provide a highly reliable IC chip mounted body having reinforcing members and a method for manufacturing the IC chip mounted body. SOLUTION: The IC chip mounted body is provided with a circuit board obtained by forming circuits 3a, 3b on a supporting body 1, an IC chip 5 connected and fixed on a prescribed position of a circuit on the circuit board through a 1st curing resin layer 7, a 1st reinforcing member 6a fixed on the IC chip 5 through a 2nd curing resin layer 11, and a 2nd reinforcing member 6b fixed through a part of the layer 11 penetrated into through holes 4a, 4b of the supporting body 1. Since the layer 11 simultaneously fixes the 1st and 2nd reinforcing members 6a, 6b, the reinforcing members 6a, 6b can be highly reliably and inexpensively fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The IC chip mounting body of the present invention is a contact type IC card used for bank cards, point cards, etc., a ticket, a telephone card,
The present invention relates to a so-called non-contact type IC card which is used as a luggage tag or the like for performing data communication and the like by external radio waves, and a so-called combination type IC card having both contact type and non-contact type functions.

These IC mounting bodies are also called so-called data carriers and are commonly called IC cards.
It does not necessarily have to be in the form of a card, but also includes a sheet-like member that is attached to an object, a tag enclosed in a container, a carrier of various forms such as a wristwatch type, and the like. In this specification, the IC mounting body is also used as including an IC card or a card-shaped device.

[0003]

2. Description of the Related Art In recent years, small electronic devices having an IC chip as a new information recording medium on a commuter pass used for personal information management, physical distribution management, commuting to school, etc. have become popular. In particular, a card-type large-capacity variable information recording medium called an IC card, which is convenient for carrying, is beginning to spread widely. IC cards are roughly classified into three types: contact type, non-contact type, and combination type having both functions. The contact-type IC card is provided with a metal terminal for data exchange electrically connected to the IC chip on the surface of the card, and data is exchanged with an external reader through the terminal. Is. Currently, the disposable type is widely distributed as a telephone card in Europe and the like, and an experiment using a rewritable type of information as a money card is being conducted in each country. In particular, it is attracting attention as a card used in financial relations.

On the other hand, the non-contact type IC card exchanges data by radio waves in a non-contact manner, so that, for example, a conventional ticket, a commuter ticket, or the like, which is replaced with a ticket having a magnetic recording layer provided on one side, is used. It is attracting attention as a medium. In particular,
It is expected that convenience will be greatly improved because data can be exchanged even from a passport or bag without having to take out the ticket one by one when passing through the ticket gate. In the field of physical distribution, RFID tags, which exchange data with mobile objects by radio waves, are becoming the mainstream instead of bar codes and magnetic recording.

A wire bonding method has been widely used as a method for mounting an IC chip on a small electronic device typified by such an IC card. With the wire bonding method, the IC chip pad and the metal lead are several μm.
Electrical connection is achieved by connecting with a gold wire having a thickness of m. However, due to the characteristics of the connection structure, the gold wire forms a large arc on the chip pad. To protect this gold wire, sealing is performed with resin such as epoxy, and then packaging is performed with a ceramic medium. It is usually done. Therefore, the structure is very bulky, and it is not suitable as an IC chip mounting method for small electronic devices.

[0006] Under such circumstances, mounting of an IC chip by a face-down method using an IC chip in which bumps such as gold or solder are provided on pads has begun to attract attention. In the face-down method using the IC chip with bumps,
Since the bumps are directly connected to the circuit board, it is not necessary to use gold wires for wiring, and the mounting volume can be reduced. Therefore, it has attracted great attention as an IC chip mounting method for small portable electronic devices. It has been conventionally practiced to provide a reinforcing member on the IC chip for the purpose of protecting the IC chip mounted and fixed on the circuit board by a face-down method. To further enhance the reinforcing effect, the IC chip on the circuit board There is a method of sandwiching between two reinforcing members.

[0007]

However, in the conventional method, it is necessary to process the adhesive in two steps in order to provide the reinforcing member at the two positions on the IC chip side and the support side, which complicates the working process. There are problems such as standardization and increase of quality control items. Further, since the adhesive layer to be cured is present at two places with the support interposed, there is a problem in that when the simultaneous curing is carried out, the curing degree of the adhesive layer varies widely, and as a result, the desired reinforcing effect cannot be obtained. Has occurred. It is an object of the present invention to provide an IC chip package having a reinforcing member that is inexpensive and highly reliable and a method for manufacturing the same in order to solve the above-mentioned problems. .

[0008]

An IC chip mounting body according to the present invention comprises a circuit board provided with a circuit on a support and a first curable resin layer at a predetermined position of the circuit on the circuit board. The IC chip fixedly connected and fixed with the first reinforcing member fixed by the second curable resin layer on the IC chip, and the through hole portion of the support on the side of the circuit board where the IC chip is not present. And a second reinforcing member fixed by a part of the second curable resin layer that penetrates. For more details,
An IC in which the first reinforcing member is fixed so as to have a structure in which a part of the second curable resin layer is sandwiched between the first reinforcing member and the IC chip.
It may be a chip mounting body. Further, more specifically, it may be an IC chip mounting body in which the second reinforcing member is fixed and has a structure in which a part of the second curable resin layer is sandwiched between the second reinforcing member and the circuit board.

One of the methods for manufacturing an IC chip package is to dispose a first curable resin before curing on a predetermined position of a circuit on a circuit board, dispose the IC chip on the first curable resin, and then dispose the IC chip on the first curable resin. Step of connecting and fixing the IC chip with the curable resin, and arranging a second reinforcing member on the side of the support on which the IC chip is not mounted and fixed, and setting the second pre-curing second portion on the IC chip of the support.
Of the curable resin, the first reinforcing member is disposed on the curable resin, and the second curable resin fixes the first reinforcing member to the IC chip by applying pressure.
And a step of passing a part of the curable resin through the through hole of the support to integrally fix the second reinforcing member to the support. One of other methods of manufacturing an IC chip package is to dispose a first curable resin before curing on a predetermined position of a circuit on a circuit board, dispose the IC chip on the first curable resin, and dispose the IC chip on the first curable resin. The step of connecting and fixing the IC chip with the curable resin, and disposing the second curable resin before curing on the side of the support on which the IC chip is not fixed, and by applying the second curable resin to the second curable resin. Of the second reinforcing member is arranged on the IC chip by arranging the first reinforcing member on the IC chip, and applying the pressure to fix the second reinforcing member to the support and the second curing member. And a step of passing a part of the conductive resin through the through hole portion of the support to integrally fix the first reinforcing member to the IC chip.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below by taking a non-contact IC card as an example. 1 is a plan view of the inlet of the non-contact IC card of the present invention before the reinforcing member is attached. FIG. 2 is a sectional view taken along the line AA of an embodiment of the present invention in which a reinforcing member is attached to the inlet of FIG. It is to be noted that I having an IC chip and a communication antenna on a support
The C chip mounting body is called an inlet. Since the inlet itself is not suitable for use by the general end user as it is, it is hard to be a final product. However, it may be distributed among manufacturers, and the inlet is broadly defined as I of the present invention.
Included in the C chip package.

First, each part will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, as the support 1 for forming the circuits 3a and 3b for obtaining electrical conduction with the IC chip, the antenna 2 and the through holes 4a and 4b, polyethylene, polypropylene, polybutene, polystyrene, Polymethylpentene, ethylene / propylene copolymer, ethylene / butylene copolymer, propylene /
Polyolefin resin-based polymer such as butene copolymer, polyvinylidene fluoride, fluororesin-based polymer such as polytetrafluoroethylene, polyurethane, phenolic polyether, cellulose acetate, acrylonitrile-based polymer, amide-based resin, polyester-based resin, glass Examples thereof include epoxy resin, polycarbonate, acrylonitrile butadiene styrene, polyethylene naphthalate, polyphenyl sulfide, paper, etc., or a mixture or composite thereof. Moreover, you may use what mixed the inorganic substance with the said substance. As a method for obtaining the circuit board by providing the circuits 3a and 3b and the antenna 2 on the support 1, a winding method,
An etching method, a paste screen printing method and the like can be mentioned. In particular, since the etching method using copper or aluminum and the screen printing method using a paste containing silver particles are suitable for mass production in the manufacturing method, the circuits 3a and 3 of the present invention are used.
It is more preferable as a method of forming b and the antenna 2.

Next, as shown in FIG. 2, the IC chip 5 has bumps 8 for electrically connecting to the circuits 3a and 3b.
a and 8b. Bump 8 used for IC chip 5
It is preferable that a and 8b are made of a metal-based material such as gold or solder, or a conductive paste. The gold bumps can be formed by a method applying a wire bonder technique, a plating method, or a sputtering method. Gold bumps have a characteristic shape depending on the manufacturing method. The plating or sputtering method has a round or columnar shape, and the shape of the bump manufactured by the wire bonder is a unique shape because the wire is cut in the middle. Further, the resin bumps made of the conductive paste are formed on the pad portion of the IC chip by screen printing, dispenser or the like.

Examples of the curable resin layer 7 for connecting and fixing the IC chip 5 on the support 1 include a thermosetting resin, an ultraviolet curable resin, a humidity curable resin and the like. The thermosetting resin is particularly preferable as the curable resin layer 7 of the present invention because it can be cured in a short time and can be easily handled at room temperature. Furthermore, it is also possible to use a resin film in which a curable resin is in a film state. Making the curable resin into a film facilitates handling and is preferable as the curable resin layer 7 of the present invention. further,
This is an anisotropic conductive resin containing curable resin containing metal particles of gold, silver, copper, aluminum, nickel, etc., or resin particles obtained by coating plastic particles of styrene, acrylic, etc. with a metal such as nickel, gold, etc. It may be used as the curable resin layer 7 of the invention. The amount of the curable resin layer 7 may be such that the IC chip 5 can be sufficiently fixed on the support 1.

In the present invention, the first and second reinforcing members are formed by the curable resin layer 11 which is integrated on the side where the IC chip 5 of the support 1 is mounted and the side where the IC chip is not mounted. It is necessary to have through holes 4a and 4b in the support 1 in order to fix 6a and 6b constant. As the shape of the through hole, a shape having no corners is preferable, and a round shape is particularly preferable. For example, in a shape having a corner portion such as a triangle, a crack may be generated from the corner portion, which may damage the support. In the present invention, although not particularly limited, the number of through holes, the cross-sectional area, etc. may be such that the curable resin layer 11 can sufficiently adhere the reinforcing member. Further, the position of the through hole may be a position where the curable resin layer 11 can be sufficiently attached to the two reinforcing members 6a and 6b. It is preferable that at least a part of the through hole is located between the two reinforcing members, and more preferably the entire through hole is located between the two reinforcing members 6a and 6b. .

As a method of providing a through hole in the support, there are a method of punching with a press, a method of cutting with a cutter or a knife, a method of burning with a heated metal rod or the like, and a method of piercing with a pointed tip such as a needle. Can be mentioned. Thus, by providing the through holes in the support 1, the two reinforcing members 6a and 6b provided on the side where the IC chip 5 is mounted and the side where the IC chip 5 is not mounted on the support 1 It becomes possible to integrally fix the chip 5 with the chip 5 sandwiched therebetween.

The reinforcing members 6a and 6b are connected to the IC of the support 1.
Examples of the curable resin layer 11 for integrally fixing the side on which the chip 5 is mounted and the side on which the IC chip is not mounted are thermosetting resin, ultraviolet curable resin, humidity curable resin and the like. it can. As the curable resin, a thermosetting resin can be cured in a short time and is easily handled at room temperature. Therefore, the curable resin layer 11 of the present invention is particularly preferable. Furthermore, it is also possible to use a resin film in which a curable resin is in a film state. Making the curable resin into a film facilitates handling and is preferable as the curable resin layer 11 of the present invention. The amount of the curable resin layer 11 is set such that the reinforcing members 6a and 6b are formed in the support 1
It is sufficient if the amount can be fixed sufficiently. The reinforcing members 6a and 6b of the present invention have only to be hard enough to protect the IC chip, and examples thereof include a stainless material and a ceramic material. The shape of the reinforcing member may be triangular, square, round, or the like.

A method of manufacturing an inlet which is an IC chip mounting body of the non-contact type IC card of the present invention shown in FIG. 2 will be described with reference to FIGS. 3 and 4. Figure 3
FIG. 6 is a cross-sectional view showing a process of assembling the reinforcing members 6a and 6b to the inlet 9. FIG. 4 shows the reinforcing member 6a.
FIG. 9 is a cross-sectional view showing a pressurized state in the course of assembling for fixing 6 and 6b to the inlet 9.

As shown in FIG. 3, the second reinforcing member 6b is arranged on the side of the support 1 on which the IC chip 5 is not mounted and fixed, and the IC chip 5 of the support 1 on the inlet 9 is mounted and fixed. A predetermined amount of the curable resin layer 11 is arranged from the side on which the first reinforcing member 6a is arranged and the first reinforcing member 6a is arranged on the IC chip 5. Next, as shown in FIG. 4, pressure is applied from above the first reinforcing member 6a by the pressing jig 10 so that the curable resin layer 11 is poured into the through holes 4a and 4b of the support 1 and the second reinforcing member 6a is formed. The curable resin is adhered to the reinforcing member 6b, and the curable resin is cured in this state, and the first reinforcing member 6a and the second reinforcing member 6b are made of the curable resin through the through holes 4a and 4b provided in the support 1. The layers 11 are integrally fixed. In this case, the reinforcing member 6a is mainly fixed by a structure in which a part of the curable resin layer 11 is sandwiched between the upper surface of the IC chip and the lower surface of the first reinforcing member 6a. By the above method, it becomes possible to integrally fix the two reinforcing plates with a single curable resin,
It becomes possible to mount the two reinforcing members at a lower cost.

Next, FIG. 5 shows a cross section of another embodiment of the inlet which is the IC chip mounting body of the non-contact type IC card of the present invention. A method of manufacturing the inlet shown in FIG. 5 will be described with reference to FIGS. 6 and 7. Figure 6
It is sectional drawing which shows the progress of the assembly which fixes the reinforcement members 6a and 6b to the inlet 9. FIG. 7 shows reinforcing members 6a and 6
It is sectional drawing which shows the pressurization state of the progress of the assembly which fixes b to the inlet 9. As shown in FIG. As shown in FIG. 6, the second reinforcing member 6b is provided on the side of the inlet 9 on which the IC chip is not mounted and fixed, and the curable resin layer 11 is provided on the second reinforcing member 6b. Is arranged in a predetermined amount, the support 1 is arranged so that the surface of the support 1 on which the IC chip is not mounted and fixed is in contact with the curable resin layer 11, and the IC chip 5 of the support 1 is mounted and fixed. The first reinforcing member 6a is arranged on the IC chip 5 on the operating side. Next, as shown in FIG. 7, pressure is applied from above the first reinforcing member 6a by the pressurizing jig 10 to pour the curable resin layer 11 into the through holes 4a and 4b of the support 1, To the reinforcing member 6a. In this state, the curable resin layer 11 is cured, and the first reinforcing member 6
The a and the second reinforcing member 6b are integrally fixed by the curable resin layer 11 through the through holes 4a and 4b provided in the support 1. In this case, the reinforcing member 6b is mainly fixed by a structure in which a part of the curable resin layer 11 is sandwiched between the lower surface of the inlet 9 and the upper surface of the second reinforcing member 6b. Further, the reinforcing member 6a is mainly fixed by the curable resin layer 11 around the side surface of the IC chip 5. With the above method, it is possible to provide another mounting method having the same effect as the mounting method of the reinforcing member.

Although the above description of each example has been given based on the vertical relationship shown in each drawing, it goes without saying that the same manufacturing can be performed in a state in which the upper and lower sides are arranged opposite to each other. Moreover, the direction in which pressure is applied by the jig may be either from the upper or lower direction in the figure. In some cases, depending on conditions such as the influence of gravity when pouring the curable resin and the viscosity of the curable resin, a more preferable vertical arrangement and a direction in which pressure is applied may be selected.

Examples of the pressurizing source in the pressurizing method of the present invention include an air cylinder, hydraulic pressure, motor and the like. The pressing force in the pressurizing method of the present invention may be set to an appropriate pressing force depending on the size and thickness of the reinforcing member used, and 0.01 kgf / mm ^{2 to 1} kgf / mm ² is more preferably used. The pressurizing jig 10 in the pressurizing method of the present invention has only to have strength at the time of pressurizing and fixing, and examples of the material thereof include metals such as iron and stainless steel, and ceramics.

Next, referring to FIGS. 8 and 9, a non-contact type IC
The method of molding the card will be described. FIG. 8 shows I of the present invention.
FIG. 6 is a cross-sectional view for explaining manufacturing and assembling of an example of a non-contact type IC card which is an embodiment of a C chip mounting body. Figure 9
FIG. 7 is a cross-sectional view for explaining manufacturing and assembling of another example of the non-contact type IC card which is one embodiment of the IC chip mounted body of the present invention. As shown in FIG. 8, the adhesive layer 13 is formed on the front and back of the inlet 12 having the reinforcing member obtained by the above operation.
A non-contact type IC card can be obtained by sticking the insulating base materials 14a and 14b using a and 13b and punching them into a card mold. Further, as shown in FIG. 9, after the insulating base material 14c is attached only to the surface of the inlet 12 having the reinforcing member having the IC chip by using the adhesive layer 13c, the insulating base material 14c is punched out into a card shape to be non-contact. You can also get an IC card.

As the adhesive layers 13a, 13b and 13c, generally used adhesives for dry laminating such as polyester, ABS, acrylic, polyurethane, etc., hot melt resin and thermosetting resin, moisture curable resin, Examples thereof include line-curing resins. Insulating base material 14
Examples of a, 14b and 14c include polyethylene terephthalate resin, acrylonitrile butadiene styrene resin, polybutylene resin, polyvinyl chloride resin, polycarbonate resin, paper and synthetic paper.

[0024]

The present invention will be described in more detail with reference to the following examples, but of course the present invention is not limited thereto. Example 1 Example 1 will be described with reference to FIGS. 1, 2, 3, 4, and 8. As shown in FIG. 1, a support 1 (PET, Lumirror: manufactured by Toray) having a thickness of 188 μm by an etching method.
A loop antenna 2 having four turns and electrical connection terminals 3a and 3b were provided on the upper side by a copper foil having a thickness of 18 μm, and further through holes 4a and 4b having a diameter of 1 mm were provided to prepare a circuit board. Circuit board electrical connection terminals 3a, 3b
A film-shaped curable resin layer 7 (flip tack F
C-110A: a thermosetting resin containing gold-plated resin particles, a film thickness of 30 μm, manufactured by Hitachi Chemical Co., Ltd.) is temporarily attached, and gold bumps 8a and 8b are provided thereon by a wire bonder method by a face-down method. (Mifare
Light: SLE44R31, thickness 180 μm, manufactured by Siemens Co., Ltd.) is sequentially placed temporarily, and then pressure 0.1 kgf,
The curable resin layer 7 was cured at a temperature of 180 degrees to produce the inlet 9.

Next, as shown in FIG. 3, a second reinforcing member 6b (SUS-301, thickness 100 μm) is arranged on the surface of the support body 1 of the inlet 9 on which the IC chip is not mounted, and the support body is formed. A predetermined amount of a thermosetting resin layer 11 (A-1002: manufactured by Nagase Ciba Co., Ltd.) is applied on the IC chip 5 on which the IC chip 1 is mounted, and the first reinforcing member 6 is applied thereon.
a (SUS-301, thickness 100 μm) was placed. Next, using the pressing jig 10 as shown in FIG.
Curable resin layer 1 is pressed with a load of gf / mm ^2.
1 was attached to the second reinforcing member 6b, and then heat-cured to integrally fix the reinforcing members 6a and 6b to the front and back surfaces of the inlet to obtain the inlet having the reinforcing member shown in FIG. Further, as shown in FIG. 8, hot-melt adhesive layers 13a and 13b (manufactured by Toagosei Co., Ltd.) having a thickness of 100 μm and 188 μm were formed on the front and back of the inlet 12 obtained by the above operation.
m insulating base materials 14a and 14b (PET, Lumirror: manufactured by Toray Industries, Inc.) were respectively provided, and after lamination, punched into a card mold to obtain a non-contact type IC card.

Second Embodiment A second embodiment will be described with reference to FIGS. 5, 6 and 7.
As shown in FIG. 6, the second reinforcing member 6b (SU) is provided on the surface of the support body 1 of the inlet 9 on which the IC chip is not mounted.
S-301, 100 μm), and a predetermined amount of thermosetting resin layer 11 (A-1002: manufactured by Nagase Ciba Co., Ltd.) is applied thereon to cure the surface of the support 1 on which the IC chip is not mounted. The support 1 is arranged so as to be in contact with the resin layer 11, and the first reinforcing member 6a (SUS-301, thickness 10) is provided on the IC chip 5 of the support 1 on which the IC chip 5 is mounted and fixed.
0 μm). Next, as shown in FIG. 7, pressure is applied from above the first reinforcing member 6a by the pressing jig 10,
The curable resin layer 1 is formed in the through holes 4a and 4b of the support 1.
The same operation as in Example 1 was performed except that 1 was poured and adhered to the first reinforcing member 6b to obtain a non-contact type IC card having an inlet cross-sectional structure as shown in FIG.

[0027]

As described above, according to the present invention, the reinforcing member on the surface side on which the IC chip is mounted and fixed and the reinforcing member on the surface opposite to the surface side are formed of the same curable resin layer. Since the joint member is integrally fixed through the through hole, the reinforcing member can be efficiently fixed.

[Brief description of drawings]

FIG. 1 is a plan view of an inlet before mounting a reinforcing member of a non-contact IC card of the present invention.

FIG. 2 is a sectional view of an embodiment of an inlet which is an IC chip mounting body of the non-contact type IC card of the present invention.

FIG. 3 is a cross-sectional view showing an initial state of an assembling process for connecting and fixing the reinforcing member of the inlet shown in FIG. 2 and the IC chip to the circuit board.

FIG. 4 is a cross-sectional view showing a pressurized state during an assembly process in which the reinforcing member of the inlet shown in FIG. 2 and the IC chip are connected and fixed to a circuit board.

FIG. 5 is a sectional view of an inlet which is another example of the IC chip mounting body of the non-contact type IC card of the present invention.

6 is a cross-sectional view showing an initial state of an assembling process in which the reinforcing member of the inlet shown in FIG. 5 and an IC chip are connected and fixed to a circuit board.

FIG. 7 is a cross-sectional view showing a pressurized state during the assembly process for connecting and fixing the reinforcing member of the inlet shown in FIG. 6 and the IC chip to the circuit board.

FIG. 8 is a cross-sectional view for explaining the manufacturing and assembling of an example of a non-contact type IC card that is an embodiment of an IC chip package of the present invention.

FIG. 9 is a sectional view for explaining the manufacturing and assembling of another example of the non-contact type IC card which is an embodiment of the IC chip mounting body of the present invention.

[Explanation of symbols]

1 support 2 antenna circuit 3a, 3b circuit 4a, 4b through hole 5 IC chip 6a First reinforcing member 6b Second reinforcing member 7 First curable resin layer 9 inlet 11 Second curable resin layer

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Claims (5)

[Claims] 1. A circuit board provided with a circuit on a support, an IC chip connected and fixed to a predetermined position of the circuit on the circuit board through a first curable resin layer, and a first IC chip on the IC chip. A first reinforcing member fixed by the second curable resin layer;
An IC chip mounting body, comprising: a second reinforcing member fixed to a part of the second curable resin layer which penetrates a through hole portion of the support, on a side of the circuit board where the IC chip is not provided. 2. The IC chip mounting body according to claim 1, wherein the first reinforcing member is fixed so as to have a structure of sandwiching a part of the second curable resin layer between the first reinforcing member and the IC chip. 3. The IC chip mounting body according to claim 1, wherein the second reinforcing member is fixed so as to have a structure in which a part of the second curable resin layer is sandwiched between the second reinforcing member and the circuit board. 4. An unhardened first curable resin is arranged at a predetermined position of a circuit on a circuit board, an IC chip is arranged thereon, and the IC chip is connected and fixed by the first curable resin. And a second reinforcing member is arranged on the side of the support on which the IC chip is not mounted and fixed, and the second curable resin before curing is arranged on the IC chip of the support, and then The first reinforcing member is arranged in the
Fixing the first reinforcing member to the IC chip by using the curable resin, and passing a part of the second curable resin through the through hole of the support so that the second reinforcing member is integrated with the support. The method of manufacturing an IC chip package according to claim 2, further comprising a step of fixing. 5. An unhardened first curable resin is arranged at a predetermined position of a circuit on a circuit board, an IC chip is arranged thereon, and the IC chip is connected and fixed by the first curable resin. And the second curable resin before curing is disposed on the side of the support on which the IC chip is not fixed, and the second reinforcing member is disposed through the second curable resin. The second reinforcing member is fixed to the support by the second curable resin by arranging the first reinforcing member on the support and applying a pressure, and at the same time, a part of the second curable resin is applied to the support. 4. The method for manufacturing an IC chip package according to claim 3, further comprising the step of: passing the through hole portion to fix the first reinforcing member integrally with the IC chip.