JP2005079464A - Light receiving/emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light receiving/emitting device which can improve a high frequency characteristic by shielding an electronic component such as a driving IC, prevent light wraparound from a light emitting element to a light receiving element, and increase light use efficiencies of the light emitting and receiving elements. <P>SOLUTION: A light receiving/emitting device 10 comprises a support member 11, a light emitter 12 mounted to the support member and including a light emitting element 12a and an electronic component forming a drive circuit or the like for the light emitting element, a light receiver 13 mounted to the support member and including a light receiving element 13a and an electronic component forming a drive circuit or the like for the light receiving element, and light-shielding covers 14, 15 mounted to the support member for optically separating the light emitter and the light receiver from each other and for surrounding the light emitter and the light receiver except regions in vicinities of optical axes of the light emitter and the light receiver. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light emitting / receiving device including a light emitting element, a light receiving element, and a drive circuit.

  Conventionally, such a light receiving and emitting device is configured as shown in FIG. 11 or FIG. 12, for example.

  In FIG. 11, the light emitting / receiving device 1 has a light emitting element 3a, a light receiving element 3b, a driving IC 3c for the light emitting element, and a light receiving element for the printed wiring board 2 on which the driving wiring 2a is formed by etching or the like. The driving IC 3d for mounting is mounted by die bonding, and after these electrodes and the driving wiring 2a are electrically connected by wire bonding, the resin mold 4 having the lens portion 4a is formed by, for example, transfer molding or the like. It is configured.

  In FIG. 12, the light emitting / receiving device 5 similarly applies a light emitting element 3a, a light receiving element 3b, and a metal frame 6 on which a drive wiring 6a and a light emitting cone 6b are formed by etching or stamping. The driving ICs 3c and 3d are mounted by die bonding, and after these electrodes and the driving wiring 6a are electrically connected by wire bonding, the resin mold 7 having the lens portion 7a is integrally formed by, for example, potting. It is configured.

Further, for example, LED devices shown in Patent Documents 1 and 2 are disclosed.
First, an LED device according to Patent Document 1 is configured by mounting an LED chip in a cavity of a substrate and providing a light reflecting layer on the cavity side wall surrounding the LED chip.

In addition, the LED device according to Patent Document 2 includes an LED chip mounted in a concave opening of a substrate, and a reflective layer made of a metal layer having a two-layer structure on the cavity side wall surrounding the LED chip. The concave opening is formed by sealing with a coating member.
JP 09-045965 A JP 10-215001 A

However, in each of the light emitting / receiving devices 1 and 5 shown in FIGS. 11 and 12, the driving IC 3c is covered with the resin mold 4 or 7,
Since they are not electrically shielded, the driving ICs 3c and 3d are affected by the high frequency signal from the surroundings, and the high frequency characteristics are degraded.

  In the light emitting / receiving devices 1 and 5, since the light emitting element 3a and the light receiving element 3b are arranged close to each other on the substrate 2 or the metal frame 6, the light emitted from the light emitting element 3a directly Alternatively, it may be incident on the light receiving element 3b by being reflected by the inner surface of the resin mold 4 or 7 and causing a malfunction. For this reason, when such light receiving and emitting devices 1 and 5 are used to perform optical communication with each other, it becomes difficult to perform bidirectional optical communication simultaneously in the full duplex system, so-called half duplex. The optical communication was unavoidable.

Further, with respect to the light emitting element 3a, the reflection member is not provided in the case of the light receiving and emitting device 1, so that the light extraction efficiency from the light emitting element 3a is low. In the case of the light receiving and emitting device 5, the metal frame 6 Although the light-emitting cone 6a formed above is provided, the light-emitting cone 6a itself is very small, and similarly, the light extraction efficiency from the light-emitting element 3a is relatively low.
Similarly, with respect to the light receiving element 3b, the light receiving / emitting elements 1 and 5 are not provided with a reflecting member that guides light from the outside to the light receiving element 3b, and the light receiving characteristics of the light receiving element 3b are not so good. .

  On the other hand, in the LED device according to Patent Documents 1 and 2, by providing a reflective layer that surrounds the LED chip, the light emitted from the LED chip is reflected to improve the light extraction efficiency. However, these LED devices are not mounted with a driving IC and are not configured to shield the driving IC.

  From the above points, the present invention improves high-frequency characteristics by shielding electronic components such as driving ICs, prevents light from flowing from the light-emitting element to the light-receiving element, and further uses light in the light-emitting element and the light-receiving element. It is an object of the present invention to provide a light emitting / receiving device that improves the above.

  According to the present invention, the above object is achieved by providing a support member, a light emitting unit mounted on the support member and including a light emitting element and an electronic component constituting a drive circuit for the light emitting element, and the like on the support member. A light receiving unit including a light receiving element mounted and an electronic component constituting a drive circuit for the light receiving element, and the light emitting unit and the light receiving unit are optically separated from each other on the support member. This is achieved by a light receiving and emitting device characterized in that it includes a cover having a shielding property that surrounds except for a region near the optical axis of the light receiving portion.

  In the light emitting / receiving device according to the present invention, preferably, the support member is a printed wiring board including wiring portions for a light emitting portion and a light receiving portion.

  In the light emitting / receiving device according to the present invention, preferably, the support member is a metal frame provided with a wiring portion for a light emitting portion and a light receiving portion.

  The light emitting / receiving device according to the present invention preferably includes a sealing portion made of a translucent material filled between the support member and the cover.

  In the light emitting / receiving device according to the present invention, preferably, the sealing portion is integrally formed by insert molding between the support member and the cover.

  In the light emitting / receiving device according to the present invention, preferably, the sealing portion includes a lens portion for the light emitting portion and the light receiving portion.

  In the light emitting / receiving device according to the present invention, preferably, the cover includes a locking portion that locks the sealing portion.

  In the light emitting / receiving device according to the present invention, preferably, the cover includes a resin injection hole provided at a position that does not affect the optical paths of the light emitting part and the light receiving part when the sealing part is molded.

  In the light emitting / receiving device according to the present invention, preferably, the cover is separated into a part covering the light emitting part and a part covering the light receiving part.

  In the light emitting / receiving device according to the present invention, preferably, the cover is grounded to the support member.

  In the light emitting / receiving device according to the present invention, preferably, the cover includes a reflector for the light emitting unit and the light receiving unit.

  In the light emitting / receiving device according to the present invention, preferably, the reflector is formed integrally with the cover.

  In the light emitting / receiving device according to the present invention, preferably, the reflector includes a cut.

  According to the above configuration, the light emitting unit and the light receiving unit mounted on the support member are covered by the cover having a shielding property, so that an external high frequency signal is blocked by the cover. Various ICs of the light emitting unit and the light receiving unit are not affected by the high frequency signal. Thereby, the high frequency characteristics of the light emitting part, the light receiving part, and the light receiving and emitting device are improved.

  Further, the light emitting unit and the light receiving unit are optically separated from each other by the cover, thereby preventing the light from flowing from the light emitting unit to the light receiving unit. Accordingly, it is possible to simultaneously emit an optical signal from the light emitting unit and enter an optical signal from the light receiving unit, and to perform bidirectional, that is, full duplex optical communication.

In the case where the support member is a printed wiring board provided with wiring portions for the light emitting portion and the light receiving portion, the same steps as those of the conventional light receiving and emitting device including the light emitting portion and the light receiving portion mounted on the printed wiring board Thus, the present light emitting / receiving device can be manufactured.

  When the support member is a metal frame provided with a wiring part for the light emitting part and the light receiving part, the same process as the light receiving and emitting device comprising the light emitting part and the light receiving part mounted on the conventional metal frame, This light emitting / receiving device can be manufactured.

  In the case where a sealing portion made of a translucent material filled between the support member and the cover is provided, the light emitting portion and the light receiving portion are sealed within the cover with a simple configuration. Is surely sealed and protected.

  When the sealing part is integrally formed by insert molding between the support member and the cover, the light emitting part and the light receiving part are securely sealed by the sealing part in the cover by a simple process. It will be stopped and protected.

  When the sealing portion includes a lens portion for the light emitting portion and the light receiving portion, the light emitted from the light emitting element of the light emitting portion is converged and emitted through the lens portion of the sealing portion. The incident light from the outside is focused and incident on the light receiving element of the light receiving unit through the lens unit of the sealing unit, so that the light use efficiency in the light emitting unit and the light receiving unit is improved.

  In the case where the cover includes a locking portion that locks the sealing portion, adhesion of the cover to the sealing portion is improved.

  When the cover has a resin injection hole provided at a position that does not affect the light paths of the light emitting part and the light receiving part when the sealing part is molded, when the cover is placed on the support member The resin material for molding can be injected between the support member and the cover through the resin injection hole, and the light incident from the resin injection hole after the completion of the product affects the optical paths of the light emitting part and the light receiving part. There is nothing.

  In the case where the cover is separated into a part covering the light emitting part and a part covering the light receiving part, each part is formed separately and mounted on the region of the light emitting part and the light receiving part on the support member, respectively. By being placed, the light emitting unit and the light receiving unit are shielded based on the shielding property of the cover and are optically separated from each other, so that the light from the light emitting unit to the light receiving unit can be reliably prevented. It will be.

  When the cover is grounded to the support member, the light emitting part and the light receiving part can be more reliably shielded by the cover.

  When the cover includes a reflector for the light emitting unit and the light receiving unit, the cover is placed on the support member to thereby reflect the light emitting element of the light emitting unit and the light receiving element of the light receiving unit, respectively. Is positioned, and the light utilization efficiency of the light emitting element and the light receiving element is improved by these reflectors.

  When the reflector is molded integrally with the cover, it is not necessary to attach each reflector to the cover, so that the assembly can be easily performed and the assembly cost can be reduced.

  When the reflector has a cut, when the cover is placed on the support member, a bonding wire for mounting the light emitting element of the light emitting unit and the light receiving element of the light receiving unit enters the cut. The reflector does not interfere with the bonding wire, and the flow of the molten resin at the time of molding the sealing portion does not prevent the flow of the molten resin from being reflected by the reflector.

In this way, according to the present invention, the light emitting element and the light receiving element and the light emitting part and the light receiving part including the driving IC are covered with the cover having a shielding property, so that the influence of the high frequency signal from the outside is affected. Since the light emitting unit and the light receiving unit are optically separated from each other, the high frequency characteristics of the light receiving and emitting device can be improved and light from the light emitting unit to the light receiving unit can be prevented. Thus, for example, it is possible to perform so-called full-duplex optical communication by simultaneously transmitting and receiving optical signals.
Therefore, according to the present invention, high frequency characteristics are improved by shielding electronic components such as driving ICs, and light wraparound from the light emitting element to the light receiving element is prevented, and further, light use efficiency in the light emitting element and the light receiving element is improved. It is possible to provide an extremely excellent light emitting / receiving device that is improved.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 6.
The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. As long as there is no description of the effect, it is not restricted to these aspects.

1 to 6 show a configuration of a first embodiment of a light receiving and emitting device according to the present invention.
1 and 2, a light receiving and emitting device 10 includes a printed wiring board 11 as a support member, a light emitting unit 12 and a light receiving unit 13 configured on the printed wiring board 11, and the light emitting unit 12 and the light receiving unit. 13, and covers 14 and 15 that respectively enclose 13, and a sealing portion 16 disposed between the printed wiring board and the covers 14 and 15.

  The printed wiring board 11 is configured in the same manner as the printed wiring board 2 in the conventional light receiving and emitting device 1 shown in FIG. 11, and various electronic components constituting the light emitting part 12 and the light receiving part by etching or the like on the surface thereof. Mounting lands and wiring patterns (not shown) are formed.

  The light emitting unit 12 constitutes a light emitting element 12a mounted on the printed wiring board 11 in the region of the light emitting unit of the printed wiring board 11, and a drive circuit and the like mounted similarly adjacent to the light emitting element 12a. And an electronic component (not shown) such as an IC.

  The light receiving unit 13 constitutes a light receiving element 13a mounted on the printed wiring board 11 and a drive circuit mounted in the same manner adjacent to the light receiving element 13a in the region of the light receiving unit of the printed wiring board 11. And an electronic component (not shown) such as an IC.

The covers 14 and 15 are made of a conductive plate-like or mesh-like material such as aluminum, stainless steel, copper, or brass so as to have a shielding property.
In the illustrated case, the covers 14 and 15 are configured separately from each other. However, the covers 14 and 15 are configured integrally with each other as long as a partition wall that optically separates the light emitting unit 12 and the light receiving unit 13 is provided. Also good.

Of the covers 14 and 15, the first cover 14 has a rectangular parallelepiped shape in which the lower part is opened in the illustrated case so as to cover only the light emitting unit 12 described above on the printed wiring board 11, as shown in FIG. The inner space is optically separated from the outside when the lower edge abuts on the printed wiring board 11 over substantially the entire circumference.
Further, the first cover 14 has an opening 14a on the upper surface thereof for projecting a lens portion by a sealing portion 16 described later.

Similarly, as shown in FIG. 4, the second cover 15 is formed in a rectangular parallelepiped shape in which the lower part is opened so as to cover only the light receiving unit 13 described above on the printed wiring board 11. The lower space abuts on the printed wiring board 11 over substantially the entire circumference so as to optically separate the internal space from the outside.
Further, the second cover 15 is similarly provided with an opening 15a on the upper surface for projecting a lens portion by a sealing portion 16 described later.

  Further, as shown in FIG. 5, the covers 14 and 15 have resin injection holes 14b, 14c, 15b, in order to inject molten resin into the covers 14 and 15 when the sealing portion 16 is integrally formed. 15c.

Here, the resin injection hole 14c of the first cover 14 and the resin injection hole 15b of the second cover 15 are opposed to and in contact with each other.
As a result, the molten resin injected into the first cover 14 from the resin injection hole 14c of the first cover 14 passes through the first cover 14 into the resin injection hole 14c as shown by an arrow in FIG. The resin enters the second cover 15 from the resin injection hole 14c through the resin injection hole 15b of the second cover 15, and advances toward the resin injection hole 15c.
As shown in FIG. 5, the resin injection holes 14b, 14c, 15b, and 15c are such that the flow of the molten resin affects the optical paths of the light emitting unit 12 and the light receiving unit 13 in the covers 14 and 15, respectively. And is provided at a position that does not affect the shielding effect.

The first cover 14 and the second cover 15 include connection portions 14d and 15d that wrap around from the edge of the printed wiring board 11 to the lower surface when mounted on the printed wiring board 11, respectively.
Thus, the first cover 14 and the second cover 15 come into contact with the grounding wiring pattern formed on the lower surface of the printed wiring board 11 when mounted on the printed wiring board 11.

The sealing portion 16 is made of a translucent resin material such as epoxy resin, urethane resin, acrylic resin, and the like. The light emitting portion 12 and the light receiving portion 13 are mounted on the first cover 14 and the second cover. The printed wiring board 11 on which the cover 15 is mounted is formed by filling the space between the first cover 14 and the second cover 15 and the printed wiring board 11. .
Here, the sealing portion 16 is formed by insert molding using, for example, a mold for the first cover 14 and the second cover 15 and the printed wiring board 11, or by injection / curing with a molten resin dispenser or the like. Can be formed.

The sealing portion 16 includes lens portions 16 a and 16 b that protrude upward from the openings 14 a and 15 a of the first cover 14 and the second cover 15.
These lens parts 16a and 16b are arranged on the optical axes of the light emitting element 12a and the light receiving element 13a of the light emitting part 12 and the light receiving part 13, respectively, to the light from the light emitting element 12a and to the light receiving element 13a. Each of the incident light beams is focused to give desired optical characteristics.

  In addition, as shown in FIG. 6, the sealing portion 16 has a locking portion in which the upper surfaces of the first cover 14 and the second cover 15 project inward to define the openings 14a and 15a. Therefore, the first cover 14 and the second cover 15 are not detached from the sealing portion 16 and are not lifted, and are kept in close contact with each other.

  The light emitting / receiving device 10 according to the embodiment of the present invention is configured as described above, and when assembling, first, an electronic component including the light emitting element 12a constituting the light emitting unit 12 is mounted on the printed wiring board 11, In addition to being connected to the wiring pattern by wire bonding, an electronic component including the light receiving element 13a constituting the light receiving unit 13 is mounted and connected to the wiring pattern by wire bonding.

  Subsequently, a first cover 14 is placed on the printed wiring board 11 so as to surround the light emitting unit 12, and a second cover 15 is placed so as to surround the light receiving unit 13. As a result, the connecting portions 14d and 15d of the covers 14 and 15 respectively go around the lower surface of the printed wiring board 11 and come into contact with the ground wiring pattern, whereby the covers 14 and 15 are grounded. .

Next, molten resin for forming the sealing portion 16 is filled in the internal space between the covers 14 and 15 and the printed wiring board 11 by, for example, insert molding. At that time, the molten resin advances from the resin injection hole 14b of the first cover 14 into the cover 14, and then enters the cover 15 from the resin injection hole 14c through the resin injection hole 15b of the second cover 15. The process proceeds toward the resin injection hole 15c. At that time, a part of the molten resin advances upward through the openings 14a and 15a on the upper surfaces of the covers 14 and 15, whereby the lens portions 16a and 16b are defined in the mold.
Thus, the sealing part 16 will be formed when the filled molten resin hardens | cures.

  According to the light emitting / receiving device 10 assembled in this manner, when the light emitting element 12a of the light emitting unit 12 is driven by a drive circuit using an electronic component, light is emitted from the light emitting element 12a, and the lens unit from the sealing unit 16 The light is irradiated to the outside while being focused through 16a. At this time, since the light emitting unit 12 is covered with the first cover 14 and optically separated from the outside, the light receiving unit 13a of the light receiving unit 13 is not reached.

  In addition, light is incident on the light receiving element 13a of the light receiving unit 13 while being focused through the lens unit 16b of the sealing unit 16 from the outside, and the light receiving element 13a outputs a detection signal. Amplified by the drive circuit and output to the outside. At this time, since the light receiving unit 13 is covered with the second cover 15 and optically separated from the outside, disturbance light is not incident on the light receiving element 13a and malfunctions.

  Therefore, since the light emitting unit 12 and the light receiving unit 13 are respectively covered with the covers 14 and 15 having shielding properties and are optically separated from each other, the light emitted from the light emitting unit 12 wraps around the light receiving unit 13. Is completely eliminated. As a result, it is possible to detect light incident from the outside simultaneously with the light receiving unit 13 while irradiating the light from the light emitting unit 12 to the outside, and so-called full duplex optical communication can be performed.

  In addition, each cover 14, 15 has a shielding property, and its connection portions 14 d, 15 d wrap around the lower surface of the printed wiring board 11 and are in contact with the ground connection portion, so that the first cover 14 And the second cover 15 is grounded to the printed wiring board 11, and the shielding by the covers 14 and 15 can be performed more effectively.

  Here, the resin injection holes 14b, 14c, 15b, and 15c of the covers 14 and 15 are positions where the flow of the molten resin does not affect the optical paths of the light emitting unit 12 and the light receiving unit 13 and does not affect the shielding effect. Therefore, the light from the light emitting element 12a of the light emitting unit 12 does not reach the light receiving element 13a of the light receiving unit 13 through the resin injection holes 14c and 15b, and the covers 14, 15 are provided. The inside can be reliably shielded.

7 to 10 show the configuration of the second embodiment of the light emitting and receiving device according to the present invention.
7 to 10, the light emitting / receiving device 20 is basically configured in the same manner as the light emitting / receiving device 10 shown in FIGS. 1 and 2. The description is omitted.
The light receiving and emitting device 20 is different from the light emitting and receiving device 10 shown in FIGS. 1 and 2 in that the first cover 14 includes a reflector portion 14e protruding inward, and the second cover 15 is inward. The structure is different only in that it includes a protruding reflector portion 15e.

  Here, as shown in FIG. 9, the reflector portion 14 e emits light on the printed wiring board 11 when the first cover 14 is placed at a predetermined position in the region of the light emitting portion on the printed wiring board 11. With respect to the optical axis of the light emitting element 12a of the part 12, it is formed so as to have a reflecting surface that expands upward in a truncated cone shape.

Further, as shown in FIG. 8, the reflector portion 14 e includes a notch 14 f extending along the longitudinal direction of the printed wiring board 11.
As a result, when the first cover 14 is placed in the region of the light emitting portion of the printed wiring board 11, the bonding wire for the light emitting element 12a of the light emitting portion 12 mounted on the printed wiring board 11 is cut into the reflector portion 14e. By entering 14f, the reflector part 14e of the 1st cover 14 does not interfere with this bonding wire. In addition, when the molten resin is injected for molding the sealing portion 16, the molten resin may flow through the cut 14f of the reflector portion 14e, so that the flow of the molten resin is blocked by the reflector portion 14e. Absent.

  Further, as shown in FIGS. 9 and 10, the reflector portion 15 e is arranged on the printed wiring board 11 when the second cover 15 is placed at a predetermined position in the region of the light receiving portion on the printed wiring board 11. With respect to the optical axis of the light receiving element 13a of the light receiving portion 13, a reflecting surface that extends upward in a truncated cone shape is formed.

Further, as shown in FIG. 8, the reflector portion 15 e includes a notch 14 f extending along the longitudinal direction of the printed wiring board 11.
Thus, when the second cover 15 is placed in the region of the light receiving portion of the printed wiring board 11, the bonding wire to the light receiving element 13a of the light receiving portion 13 mounted on the printed wiring board 11 is cut into the reflector portion 15e. By entering into 15f, the reflector part 15e of the second cover 15 does not interfere with this bonding wire. In addition, when the molten resin is injected for molding the sealing portion 16, the molten resin may flow through the notch 15f of the reflector portion 15e, thereby blocking the flow of the molten resin by the reflector portion 15e. Absent.

  According to the light emitting / receiving device 40 having such a configuration, the light emitting / receiving device 10 operates in the same manner as the light emitting / receiving device 10 shown in FIGS. By providing the reflector portions 14e and 15e for the light receiving element 13a, a part of the light from the light emitting element 12a is reflected by the reflector portion 14e, so that the light extraction efficiency from the light emitting portion 12 is improved. While improving, a part of light which injects into the light-receiving part 13 is reflected by the reflector part 15e, and injects into the light-receiving element 13a, The incident light quantity which injects into the light-receiving element 13a will increase, and the light-receiving element 13a The light detection by can be performed better.

In the above-described embodiment, the case where the printed wiring board 11 is used as the support member has been described. However, the present invention is not limited thereto, and the present invention is similarly applied to a light emitting and receiving device using a metal frame as the support member. be able to.
In the embodiment described above, the sealing unit 16 includes the lens units 16a and 16b. However, the present invention is not limited to this, and the lens units 16a and 16b may be omitted.
Furthermore, in the embodiment described above, the first cover 14 and the second cover 15 are formed separately from each other. However, the present invention is not limited thereto, and the covers 14 and 15 are formed on the printed wiring board 11. You may be comprised integrally so that the partition which optically isolates the light emission part 12 and the light-receiving part 13 may be provided.
Moreover, in embodiment mentioned above, although the light emitting / receiving apparatuses 10 and 20 provided with the light emission part 12 and the light-receiving part 13 were demonstrated, it is not restricted to this, For various electronic devices provided with the light-emitting part 12 and the light-receiving part 13 It is apparent that the present invention can be applied.

It is a schematic perspective view which shows the structure of 1st embodiment of the light emitting / receiving apparatus by this invention. It is a schematic side view of the light emitting / receiving device of FIG. It is a schematic perspective view of the 1st cover in the light emitting / receiving apparatus of FIG. It is a schematic perspective view of the 2nd cover in the light emitting / receiving apparatus of FIG. It is a schematic plan view which shows the flow of the molten resin at the time of sealing part shaping | molding in the light emitting / receiving apparatus of FIG. It is sectional drawing of the light emission part in the light-emitting / receiving device of FIG. It is a schematic perspective view which shows the structure of 2nd embodiment of the light emitting / receiving apparatus by this invention. FIG. 8 is a schematic plan view of the light emitting / receiving device of FIG. 7. It is the sectional view on the AA line of the light emitting / receiving apparatus of FIG. FIG. 8 is a cross-sectional view of the light emitting / receiving device of FIG. 7 taken along the line BB. It is a schematic perspective view which shows the structure of an example of the conventional light emitting / receiving apparatus. It is a schematic perspective view which shows the structure of the other example of the conventional light emitting / receiving apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting / receiving apparatus 11 Printed wiring board 12 Light emitting part 12a Light emitting element 13 Light receiving part 13a Light receiving element 14 First cover 14a Opening 14b, 14c Resin injection hole 14d Connection part 14e Reflector part 14f Cut 15 Second cover 15a Opening 15b, 15c Resin injection hole 15d Connection part 15e Reflector part 15f Notch 16 Sealing part 16a, 16b Lens part 20 Light emitting / receiving device

Claims (13)

A support member;
A light-emitting unit that is mounted on the support member and includes an electronic component that constitutes a light-emitting element and a drive circuit for the light-emitting element; and
A light receiving portion that is mounted on the support member and includes electronic components that constitute a light receiving element and a drive circuit for the light receiving element;
On the support member, the light-emitting part and the light-receiving part are optically separated from each other, and a cover having a shielding property that surrounds the light-emitting part and the light-receiving part except for the region near the optical axis;
A light emitting and receiving device comprising:   The light receiving and emitting device according to claim 1, wherein the support member is a printed wiring board including wiring portions for a light emitting portion and a light receiving portion.   The light receiving and emitting device according to claim 1, wherein the supporting member is a metal frame including a wiring portion for a light emitting portion and a light receiving portion.   4. The light emitting / receiving device according to claim 1, further comprising a sealing portion made of a translucent material filled between the support member and the cover. 5.   The light receiving and emitting device according to claim 4, wherein the sealing portion is integrally formed by insert molding between the support member and the cover.   6. The light receiving and emitting device according to claim 1, wherein the sealing portion includes a lens portion for a light emitting portion and a light receiving portion.   The light receiving and emitting device according to claim 1, wherein the cover includes a locking portion that locks the sealing portion.   The said cover is equipped with the resin injection hole provided in the position which does not affect the optical path of a light emission part and a light-receiving part in the case of sealing part shaping | molding, The any one of Claim 1 to 7 characterized by the above-mentioned. The light emitting / receiving device according to 1.   9. The light receiving and emitting device according to claim 1, wherein the cover is separated into a part covering the light emitting part and a part covering the light receiving part.   The light receiving and emitting device according to claim 1, wherein the cover is grounded to a support member.   The light receiving / emitting device according to claim 1, wherein the cover includes a reflector for a light emitting unit and a light receiving unit.   The light emitting / receiving device according to claim 11, wherein the reflector is formed integrally with a cover.   The light receiving and emitting device according to claim 1, wherein the reflector includes a cut.

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