JP2005078495A - Manufacturing method for noncontact ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a noncontact IC tag that can carry out the positioning and mounting work of an IC chip readily. <P>SOLUTION: An insulating marginal wall 25 that forms storage space 26 is provided at the end part of one conductive sheet 14a. In the storage space 26 of this marginal wall 25, an IC chip 20 having electrodes 21 and 22 on both sides and a granular adhesive agent 27 are stored. The other conductive sheet 14b is located on the marginal wall 25 provided at one conductive sheet 14a. While the granular adhesive agent 27 melts and one conductive sheet 14a is adhered to the other conductive sheet 14b, the IC chip 20 is secured as well. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a non-contact IC tag that exchanges data without contact with an external reader / writer.

  Conventionally, a non-contact IC tag that exchanges data without contact with an external reader / writer has an IC chip and an antenna circuit. Such a non-contact IC tag is obtained by a mounting operation in which the IC chip is positioned so as to be at a predetermined position on the antenna circuit, and then the IC chip is connected to the antenna circuit.

  As described above, the IC chip is positioned and mounted so as to be at a predetermined position of the antenna circuit. However, in the work of the IC chip, it is necessary to position the IC chip with respect to the antenna circuit with high accuracy, and the actual situation is that the work of positioning the IC chip is complicated and takes time.

  The present invention has been made in consideration of such points, and provides a non-contact IC tag manufacturing method that can easily position an IC chip and easily and easily obtain a non-contact IC tag. The purpose is to provide.

  A step of preparing one conductive sheet provided with an insulating peripheral wall forming a storage space, a step of disposing an IC chip having an electrode on each side and a granular adhesive in the storage space of the peripheral wall; The step of disposing the other conductive sheet on the peripheral wall of one conductive sheet, melting the granular adhesive, bonding the one conductive sheet and the other conductive sheet, and attaching the electrode on one side of the IC chip A non-contact IC tag manufacturing method comprising: connecting to one conductive sheet and connecting an electrode on the other surface to the other conductive sheet.

  The present invention is a method for manufacturing a non-contact IC tag, characterized in that, when one conductive sheet and the other conductive sheet are bonded, the granular adhesive is heated and melted.

  The present invention includes a step of preparing one conductive sheet provided with an insulating peripheral wall forming a storage space, a step of disposing IC chips each having electrodes on both surfaces in the storage space of the peripheral wall, A step of disposing the other conductive sheet on the peripheral wall of the conductive sheet, filling the storage space with an adhesive from an opening provided in one of the conductive sheets, and the other conductive sheet. And a step of connecting the electrode on one side of the IC chip to the one conductive sheet and connecting the electrode on the other side to the other conductive sheet. It is a manufacturing method of an IC tag.

  The present invention is a non-contact method characterized by sucking the inside of the storage space from the opening provided in the opposing conductive sheet when the adhesive is filled into the storage space from the opening of either one or the other conductive sheet. It is a manufacturing method of an IC tag.

  The present invention is a method for manufacturing a non-contact IC tag, wherein when sucking the inside of the storage space, the porous plate is pressed against the conductive sheet on the suction side and the inside of the storage space is sucked through the porous plate. is there.

  The present invention is a method for producing a non-contact IC tag, wherein an adhesive is filled into an accommodation space from an opening of a conductive sheet by squeezing.

  According to the present invention, an IC chip and a granular adhesive are stored in a storage space surrounded by a peripheral wall, and only one conductive sheet and the other conductive sheet are bonded to each other by the granular adhesive. Can be obtained easily and easily. In addition, since the IC chip is housed and mounted in a housing space surrounded by the peripheral wall, the IC chip can be positioned and mounted easily and easily.

Embodiments of the present invention will be described below with reference to the drawings.
FIGS. 1A, 1B and 3 are views showing a first embodiment of a method of manufacturing a non-contact IC tag according to the present invention.

  Here, FIG. 1A is a sectional view of a non-contact IC tag, and FIG. 1B is a plan view thereof. As shown in FIGS. 1A and 1B, the non-contact IC tag 10 includes one conductive sheet (one antenna circuit) 14a, the other conductive sheet (the other antenna circuit) 14b, and one conductive sheet 14a. Provided between the other conductive sheet 14b and sandwiched between the peripheral wall 25 having the storage space 26 and the one conductive sheet 14a and the other conductive sheet 14b and in the storage space 26 of the peripheral wall 25 The arranged IC chip 20 and an adhesive formed by melting the granular adhesive 27 filled in the storage space 26 of the peripheral wall 25 are provided.

  As shown in FIG. 3, the IC chip 20 used in the non-contact IC tag 10 includes an IC chip body 20a, one electrode 21 provided on one surface of the IC chip body 20a, and the IC chip body 20a. And the other electrode 22 provided on the other surface.

  The non-contact IC tag 10 having such a configuration is used not only as a normal IC tag but also as a member for an IC tag for manufacturing a normal IC tag.

  Next, a method for manufacturing a non-contact IC tag will be described. First, as shown in FIGS. 1A and 1B, one conductive sheet 14a provided with an insulating peripheral wall 25 that forms a storage space 26 is prepared. In this case, the insulating peripheral wall 25 is provided at the end of the one conductive sheet 14 a and continuously surrounds the storage space 26. The height of the peripheral wall 25 is substantially the same as the height of the IC chip 20.

  The insulating peripheral wall 25 is made of a resin material, and is applied so as to form a storage space 26 by pad printing or dispenser on one conductive sheet 14a made of a metal such as gold, silver or copper and a material such as carbon or conductive polymer. And then dried.

  Next, the IC chip 20 is housed and disposed in the housing space 26 (see FIG. 2). At this time, one electrode 21 of the IC chip 20 faces one conductive sheet 14a.

  As shown in FIGS. 1A and 1B and FIG. 2, since the storage space 26 has a larger shape than the IC chip 20, the IC chip 20 is positioned when the IC chip 20 is placed in the storage space 26. Has become easy.

  Next, the insulating granular adhesive 27 is stored in the storage space 26 and the gap between the peripheral wall 25 and the IC chip 20 is filled. At this time, doctor ring or air is sprayed on the IC chip 20 to remove the granular adhesive 27 placed on the IC chip 20.

  Next, an end portion of the other conductive sheet 14b made of a metal such as gold, silver, or copper and a material such as carbon or a conductive polymer is disposed on the peripheral wall 25 of the one conductive sheet 14a, and the other conductive sheet 14b has a peripheral edge. Temporarily bonded to the wall 25.

  Then, the granular adhesive 27 is heated and melted, and then the granular adhesive is cooled and solidified again. As a result, the one conductive sheet 14 a and the other conductive sheet 14 b are bonded by the granular adhesive, and the IC chip 20 is fixed in the storage space 26. In this case, one electrode 21 of the IC chip 20 is connected to one conductive sheet 14a, and the other electrode 22 is connected to the other conductive sheet 14b. In this way, the non-contact IC tag 10 is obtained.

  As described above, according to the present embodiment, the IC chip 20 and the granular adhesive 27 are sequentially housed and disposed in the housing space 26 formed by the peripheral wall 25, and then one conductive sheet 14a and the other conductive sheet 14b. The non-contact IC tag 10 can be easily obtained simply by adhering with the granular adhesive 27. In this case, the IC chip 20 is stored in a storage space 26 having a shape larger than that of the IC chip 20, and then the electrodes 21 and 22 of the IC chip 20 are connected to the antenna circuits 14a and 14b. Therefore, the positioning and mounting work of the IC chip 20 can be performed easily and simply.

  Further, since the adhesive 27 is granular, when the granular adhesive 27 is stored in the storage space 26, no large gap is formed in the storage space 26, and one conductive sheet 14a and the other conductive material are not formed. The IC chip 20 can be securely fixed while firmly bonding to the sheet 14b. Furthermore, since the adhesive 27 is granular and has a large surface area, the adhesive 27 is easy to melt and work efficiency is good. For this reason, it is not necessary to heat the adhesive 27 for a long time, and damage to the IC chip 20 due to the long-time heating can be prevented.

  Next, a second embodiment of a method for manufacturing a non-contact IC tag will be described with reference to FIGS.

  The second embodiment shown in FIGS. 4 (a) and 4 (b) is different only in the method of filling the storage space 26 with the insulating adhesive, and the others are shown in FIGS. 1 (a), (b) and FIG. This is substantially the same as the first embodiment shown.

  4A and 4B, the same parts as those of the first embodiment shown in FIGS. 1A and 1B to FIG. 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  4A is a cross-sectional view of a non-contact IC tag, and FIG. 4B is a plan view thereof.

  As shown in FIGS. 4A and 4B, a plurality of openings 15 are provided at positions corresponding to the storage space 26 of one conductive sheet 14a, and a plurality of openings 15 are provided at positions corresponding to the storage space of the other conductive sheet 14b. An opening 16 is provided. The number and shape of these openings 15 and 16 are not particularly limited.

  Next, the IC chip 20 having the electrodes 21 and 22 on both sides is accommodated in the accommodation space 26 formed by the peripheral wall 25 on the one conductive sheet 14a. Thereafter, the other conductive sheet 14b is disposed on the peripheral wall 25 of the one conductive sheet 14a and temporarily bonded thereto.

  Thereafter, the melted adhesive 28 is pushed into the storage space 26 from the opening 15 of one conductive sheet 14a by squeezing and filled. During this time, the porous plate 30 is pressed against a portion corresponding to the storage space 26 of the other conductive sheet 14b toward the one conductive sheet 14a, and the storage space is provided via the porous plate 30 by an external suction device (not shown). 26 is aspirated.

  In this way, the adhesive 28 is filled into the storage space 26 from the one opening 15, and the inside of the storage space 26 is sucked from the other opening 16, whereby the highly viscous adhesive 28 is smoothly put into the storage space 26. Can be filled.

  Further, by pressing the porous plate 30 from the other conductive sheet 14b toward the one conductive sheet 14a, between the one conductive sheet 14a and the one electrode 21 of the IC chip 20, and between the other conductive sheet 14b and the IC. It is possible to prevent the adhesive 28 having an insulating property from entering the other electrode 22 of the chip 20.

  In this way, the molten adhesive 28 surrounds the IC chip 20 and fills the storage space 26. Thereafter, the adhesive 28 is heated or cooled to solidify. As a result, one conductive sheet 14a and the other conductive sheet 14b are bonded together and the IC chip 20 is fixed. In this way, the non-contact IC tag 10 is obtained.

  As described above, according to the present embodiment, the adhesive 28 is filled from the opening 15 on the one conductive sheet 14a side, and the inside of the storage space 26 is sucked from the opening 16 of the other conductive sheet 14b. 28 can be smoothly filled into the storage space 26 without a gap. As a result, one conductive sheet 14a and the other conductive sheet 14b can be firmly bonded, and the IC chip 20 can be securely fixed.

  Further, since the inside of the storage space 26 is sucked while pressing the porous plate 30 from the other conductive sheet 14b toward the one conductive sheet 14a, the space between the conductor sheets 14a and 14b and the electrodes 21 and 22 of the IC chip 20 is reduced. Thus, the insulating adhesive 28 does not enter the conductive sheet 14 and the conductive sheets 14 a and 14 b and the electrodes 21 and 22 are not poorly connected.

The figure which shows 1st Embodiment of the manufacturing method of the non-contact IC tag by this invention. The perspective view which shows one conductive sheet and an insulating peripheral wall. The side view which shows IC chip. The figure which shows 2nd Embodiment of the manufacturing method of the non-contact IC tag by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Non-contact IC tag 14a One conductive sheet 14b The other conductive sheet 15 Opening 16 Opening 20 IC chip 20a IC chip main body 21 One electrode 22 The other electrode 25 Perimeter wall 26 Storage space 27 Granular adhesive 28 Adhesive 30 Perforated plate

Claims (6)

Preparing one conductive sheet provided with an insulating peripheral wall forming a storage space;
A step of disposing an IC chip having an electrode on each side and a granular adhesive in the storage space of the peripheral wall;
Placing the other conductive sheet on the peripheral wall of one conductive sheet;
Melt the granular adhesive to bond one conductive sheet and the other conductive sheet, connect the electrode on one side of the IC chip to one conductive sheet, and connect the electrode on the other side to the other conductive sheet And a process of
A method of manufacturing a non-contact IC tag, comprising:   2. The method of manufacturing a non-contact IC tag according to claim 1, wherein when the one conductive sheet and the other conductive sheet are bonded, the granular adhesive is heated and melted. Preparing one conductive sheet provided with an insulating peripheral wall forming a storage space;
A step of disposing IC chips each having electrodes on both sides in the storage space of the peripheral wall;
Placing the other conductive sheet on the peripheral wall of one conductive sheet;
Adhesive is filled into the accommodation space from the opening provided in one of the other conductive sheets, the one conductive sheet and the other conductive sheet are bonded, and the electrode on one surface of the IC chip is connected to the other conductive sheet. Connecting to the sheet and connecting the electrode on the other surface to the other conductive sheet;
A method of manufacturing a non-contact IC tag, comprising:   4. The non-conductive space according to claim 3, wherein when the adhesive is filled into the storage space from the opening of one of the other conductive sheets, the storage space is sucked from the opening provided in the opposing conductive sheet. A method of manufacturing a contact IC tag.   5. The method of manufacturing a non-contact IC tag according to claim 4, wherein when the inside of the storage space is sucked, the porous plate is pressed against the suction side conductive sheet and the inside of the storage space is sucked through the porous plate. .   4. The method of manufacturing a non-contact IC tag according to claim 3, wherein an adhesive is filled into the storage space from the opening of the conductive sheet by squeezing.

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