JP2005068546A - 3次元周期性階層構造をもつ複合合金とその製造方法 - Google Patents
3次元周期性階層構造をもつ複合合金とその製造方法 Download PDFInfo
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- JP2005068546A JP2005068546A JP2003343794A JP2003343794A JP2005068546A JP 2005068546 A JP2005068546 A JP 2005068546A JP 2003343794 A JP2003343794 A JP 2003343794A JP 2003343794 A JP2003343794 A JP 2003343794A JP 2005068546 A JP2005068546 A JP 2005068546A
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- composite alloy
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 82
- 239000000956 alloy Substances 0.000 title claims abstract description 82
- 230000000737 periodic effect Effects 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000151 deposition Methods 0.000 claims abstract description 29
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000002131 composite material Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 14
- 238000004070 electrodeposition Methods 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 6
- 238000000206 photolithography Methods 0.000 claims description 4
- 230000001815 facial effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 229910001080 W alloy Inorganic materials 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 235000019589 hardness Nutrition 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000005300 metallic glass Substances 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005501 phase interface Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
- C22C49/08—Iron group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/619—Amorphous layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Nanotechnology (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003343794A JP2005068546A (ja) | 2003-08-26 | 2003-08-26 | 3次元周期性階層構造をもつ複合合金とその製造方法 |
| US10/924,970 US7473328B2 (en) | 2003-08-26 | 2004-08-25 | Composite alloy having a three-dimensional periodic hierarchical structure and method of producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003343794A JP2005068546A (ja) | 2003-08-26 | 2003-08-26 | 3次元周期性階層構造をもつ複合合金とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005068546A true JP2005068546A (ja) | 2005-03-17 |
| JP2005068546A5 JP2005068546A5 (enExample) | 2005-05-26 |
Family
ID=34214282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003343794A Pending JP2005068546A (ja) | 2003-08-26 | 2003-08-26 | 3次元周期性階層構造をもつ複合合金とその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7473328B2 (enExample) |
| JP (1) | JP2005068546A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696353B (zh) * | 2005-05-16 | 2010-05-12 | 山东科技大学 | 一种金属材料表面纳米化方法 |
| JP2021038445A (ja) * | 2019-09-04 | 2021-03-11 | 公立大学法人兵庫県立大学 | 多層材及びその製造方法、多層材メッキ方法 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005146405A (ja) * | 2003-11-14 | 2005-06-09 | Toru Yamazaki | 電析積層合金薄板とその製造方法 |
| BE1018130A3 (fr) * | 2008-09-19 | 2010-05-04 | Magotteaux Int | Materiau composite hierarchique. |
| EP2754735B1 (en) * | 2013-01-11 | 2020-07-22 | Elsyca N.V. | A device suitable for the electrochemical processing of an object, and a method for the electrochemical processing of an object |
| US9677191B2 (en) | 2013-01-17 | 2017-06-13 | Elsyca N.V. | Device suitable for the electrochemical processing of an object, a holder suitable for such a device, and a method for the electrochemical processing of an object |
| US10465307B2 (en) * | 2015-11-19 | 2019-11-05 | Fabric8Labs, Inc. | Apparatus for electrochemical additive manufacturing |
| CN110172655B (zh) * | 2019-04-19 | 2021-05-04 | 武汉理工大学 | 表层粗晶内部纳米晶或超细晶的梯度金属材料及制备方法 |
| US11512404B2 (en) | 2019-08-23 | 2022-11-29 | Fabric8Labs, Inc. | Matrix-controlled printhead for an electrochemical additive manufacturing system |
| US10914000B1 (en) | 2019-08-23 | 2021-02-09 | Fabric8Labs, Inc. | Method for manufacturing a printhead of an electrochemical additive manufacturing system |
| US11680330B2 (en) | 2021-07-22 | 2023-06-20 | Fabric8Labs, Inc. | Electrochemical-deposition apparatuses and associated methods of electroplating a target electrode |
| US11795561B2 (en) | 2021-08-02 | 2023-10-24 | Fabric8Labs, Inc. | Electrochemical-deposition system, apparatus, and method using optically-controlled deposition electrodes |
| US11920251B2 (en) | 2021-09-04 | 2024-03-05 | Fabric8Labs, Inc. | Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate |
| US12264405B2 (en) | 2021-09-20 | 2025-04-01 | Fabric8Labs, Inc. | Methods for electrochemical additive manufacturing while modifying electrolyte solutions |
| US11970783B2 (en) | 2021-09-23 | 2024-04-30 | Fabric8Labs, Inc. | Systems and methods for manufacturing electrical components using electrochemical deposition |
| US11745432B2 (en) | 2021-12-13 | 2023-09-05 | Fabric8Labs, Inc. | Using target maps for current density control in electrochemical-additive manufacturing systems |
| US12104264B2 (en) | 2021-12-17 | 2024-10-01 | Fabric8Labs, Inc. | Systems and methods for electrochemical additive manufacturing of parts using capacitive sensing |
| US20240218546A1 (en) | 2022-12-31 | 2024-07-04 | Fabric8Labs, Inc. | Electrophoretically-deposited masks on electrode arrays |
| US12467153B2 (en) | 2023-01-05 | 2025-11-11 | Fabric8Labs, Inc. | Electrochemical-additive manufacturing systems comprising membranes |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5641391A (en) * | 1995-05-15 | 1997-06-24 | Hunter; Ian W. | Three dimensional microfabrication by localized electrodeposition and etching |
| US6261469B1 (en) * | 1998-10-13 | 2001-07-17 | Honeywell International Inc. | Three dimensionally periodic structural assemblies on nanometer and longer scales |
| US6409907B1 (en) * | 1999-02-11 | 2002-06-25 | Lucent Technologies Inc. | Electrochemical process for fabricating article exhibiting substantial three-dimensional order and resultant article |
| JP2001342591A (ja) | 2000-03-27 | 2001-12-14 | Takayasu Mochizuki | 高強度合金及びその製造方法並びにその高強度合金を被覆してなる金属とその高強度合金を用いたマイクロ構造体 |
| US20020197042A1 (en) * | 2001-04-06 | 2002-12-26 | Shigeo Kittaka | Optical device, and wavelength multiplexing optical recording head |
| GB2390230B (en) * | 2002-06-07 | 2005-05-25 | Murata Manufacturing Co | Applications of a three dimensional structure |
| JP4612844B2 (ja) * | 2004-02-23 | 2011-01-12 | キヤノン株式会社 | 3次元周期構造及びそれを有する機能素子 |
-
2003
- 2003-08-26 JP JP2003343794A patent/JP2005068546A/ja active Pending
-
2004
- 2004-08-25 US US10/924,970 patent/US7473328B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696353B (zh) * | 2005-05-16 | 2010-05-12 | 山东科技大学 | 一种金属材料表面纳米化方法 |
| JP2021038445A (ja) * | 2019-09-04 | 2021-03-11 | 公立大学法人兵庫県立大学 | 多層材及びその製造方法、多層材メッキ方法 |
| JP7391356B2 (ja) | 2019-09-04 | 2023-12-05 | 兵庫県公立大学法人 | 多層材及びその製造方法、多層材メッキ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050045252A1 (en) | 2005-03-03 |
| US7473328B2 (en) | 2009-01-06 |
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