JP2005057306A - Adsorption nozzle of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable the detection of an attachment failure and erroneous attachment to a attachment head, and to provide an adsorption nozzle of an electronic component which can make an alert to artificial erroneous setting. <P>SOLUTION: The adsorption nozzle 15 of an electronic part which is attached to a attachment head 9 in a removable manner is provided with, on the surface of the adsorption nozzle 15, an image identification device 10 and identification marking 31 which represents the number of the adsorption nozzles 15 or classification by nature or by purpose of the use of the adsorption nozzle. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a suction nozzle for an electronic component to be mounted on a mounting head such as an electronic component mounting apparatus.

As this type of electronic component suction nozzle, for example, one mounted on an electronic component mounting apparatus described in Patent Document 1 is known. In this electronic component mounting apparatus, after replacing the suction nozzle set in the mounting head and the suction nozzle set in the nozzle stocker, the suction nozzle is imaged with the recognition camera from the lower side, and the suction nozzle is mounted incorrectly (not mounted) ) And mis-installation (installation of different nozzles). The suction nozzle (diffusion plate) is provided with a one-letter marking indicating the type of the suction nozzle, and the recognition camera determines the type of the suction nozzle based on the length of the marking.
JP-A-4-107996

  However, mounting errors and mounting errors of this type of conventional suction nozzle are often caused by human errors. These mistakes are when the suction nozzle set in each stock hole of the nozzle stocker is different from the suction nozzle of each stock hole that has been input data, whether it is set incorrectly or input incorrectly, It becomes a human error. Of these, input errors can be prevented by software processing due to the relationship with the substrate, but setting errors can be caused by mistakes in the stock holes when the suction nozzle is set in each stock hole after data input. It is easy to set a suction nozzle that is not used, and prevention of mistakes is left to the attention of the operator.

  On the other hand, in the conventional apparatus, it is possible to detect the mounting mistake and the erroneous mounting by recognizing the marking of the suction nozzle, but there is no countermeasure against the setting mistake of the suction nozzle. For this reason, even if a mounting mistake and a wrong mounting can be detected, it is necessary to stop the operation of the apparatus at that time, and there is a problem that work efficiency deteriorates.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component suction nozzle capable of detecting mounting errors and mounting errors on a mounting head and calling attention to a human setting error.

  Therefore, according to a first aspect of the present invention, in the suction nozzle of an electronic component that is detachably mounted on the mounting head, an identification mark that is composed of a plurality of characters that can be recognized by the image recognition device and the operator and displays the number of the suction nozzle It is characterized by being provided in.

  According to a second aspect of the present invention, a suction nozzle of an electronic component that is detachably mounted on a mounting head is composed of characters that can be recognized by an image recognition device and an operator, and displays a classification according to the form of the suction nozzle and a classification according to purpose of use. An identification mark is provided on the surface.

  As described above, according to the electronic component suction nozzle of the present invention, the identification mark can be recognized by the image recognition device and the operator, and a plurality of characters or forms classified or used for displaying the suction nozzle number. Because it is composed of characters that display classifications according to purpose, it is possible not only to detect suction nozzle mounting mistakes or incorrect mounting, but also to alert people to setting errors, so mounting The frequency of mistakes and mounting errors can be reduced. Therefore, it is possible to reduce the frequency of the operation stop of the apparatus based on these mounting mistakes and erroneous mountings.

  In addition, the identification mark can be recognized by the image recognition device and the operator, and the suction nozzle held in the hand for the operator to set by configuring the characters by displaying the classification according to the form and the classification according to the purpose of use, It is possible to grasp what kind of electronic component is the suction nozzle.

  Hereinafter, an electronic component mounting apparatus equipped with an electronic component suction nozzle will be described with reference to the accompanying drawings. This electronic component mounting apparatus is a so-called multi-function chip mounter, and is configured to be able to mount various electronic components such as surface mount components such as chip capacitors and chip resistors, and multi-lead components such as flat pack ICs. FIG. 1 is a plan view of an electronic component mounting apparatus. As shown in FIG. 1, the electronic component mounting apparatus 1 includes a mounting apparatus main body 2 for mounting the supplied electronic component on a substrate, and a surface on the mounting apparatus main body 2. A first component supply device 3 that supplies small electronic components such as mounted components and a second component supply device 4 that supplies large electronic components such as multi-lead components to the mounting apparatus main body 2 are provided.

  The mounting apparatus body 2 includes a machine base 5, a substrate transport mechanism 6 having a set table 7 in the center of the machine base 5, a head unit 8 on which two mounting heads 9 and a substrate recognition camera 10 are mounted, and a head unit. And an XY stage 11 for moving 8 in the XY direction. By the operation of the XY stage 11, the mounting head 9 faces the first component supply device 3 or the second component supply device 4 to pick up an electronic component, and this electronic component is further mounted on the substrate set on the set table 7. When this operation is repeated and the mounting of the electronic components on the board is completed, the board is sent forward by the board carrying mechanism 6 on the carrying path 12 and a new board is introduced into the set table 7 instead. .

  The first component supply device 3 has a large number of cassette-type tape feeders 13 arranged side by side so that the tip on the component supply side faces one side of the machine base 5 parallel to the transport path 12. That is, it is disposed so as to face the pickup position of the mounting head 9. Each tape feeder 13 stores electronic components in a state of being loaded on a carrier tape (not shown), and the electronic components are supplied one by one from the tip of the tape feeder 13.

  The second component supply device 4 is disposed on the other one side that intersects the one side of the machine base 5 facing the first component supply device 3 at a right angle. In the second component supply device 4, a large number of electronic components are arranged on the tray, and one or more trays are mounted on the pallet 14, and the pallet 14 is set with the first component supply device 3. By facing the pickup position between the table 7 and the electronic component, the electronic component is supplied to the mounting apparatus body 2.

  On the other hand, a suction nozzle 15 that sucks an electronic component is detachably attached to the lower end of each mounting head 9. A plurality of types of suction nozzles 15 are prepared and can be appropriately replaced in accordance with the planar shape and weight of the electronic component. In this case, the suction nozzle 15 for replacement is accommodated in a nozzle stocker 16 disposed on the upper surface of the machine base 5. As shown in FIG. 2, the nozzle stocker 16 has five set holes 16a arranged side by side at an equal pitch, and a plurality of types of suction nozzles 15 to be used are set in a mounting posture. When replacing the suction nozzle 15, the mounting head 15 faces the empty set hole 16a, the suction nozzle 15 is left in the set hole 16a, and then the substrate recognition camera 10 is attached to the suction nozzle 15 to be newly mounted. , The presence / absence and correctness of the suction nozzle 15 is recognized (details will be described later), and the mounting head 9 is mounted on the suction nozzle 15.

  In addition to detecting the type of the suction nozzle 15 as described above, the board recognition camera 10 detects the home position of the board set on the set table 7, that is, the reference position in the XY directions for component mounting. A component recognition camera 17 that recognizes the position of the electronic component sucked by the suction nozzle 15 is disposed in the vicinity of the nozzle stocker 16. The component recognition camera 17 detects a positional deviation amount in the X direction, the Y direction, and the θ direction (rotation angle in the horizontal plane) with respect to the axis of the suction nozzle 15.

  Next, the head unit 8 will be described with reference to FIG. The head unit 8 includes a support frame 18 attached to the XY stage 11, two attachment heads 9, 9 attached to the support frame 18, and a substrate attached to the support frame 18 so as to be sandwiched between the two attachment heads 9, 9. A recognition camera 10. Each mounting head 9 includes a mounting head body 21, a head lifting device 22 that lifts and lowers the mounting head body 21, and a suction nozzle 15 that is detachably mounted on the lower end of the mounting head body 21. On the other hand, the board recognition camera 10 includes a camera body 23 disposed downward and a camera lifting device 24 that lifts and lowers the camera body 23. The board recognition camera 10 and an image processing apparatus (not shown) constitute an image recognition apparatus.

  At the lower end portion of the mounting head main body 21, a gripping mechanism 25 that detachably grips the suction nozzle 15 and a main diffusion plate 26 that is used when an electronic component is imaged by the component recognition camera 17 are provided. On the other hand, the sub-diffusion plate 27 is integrally attached to the suction nozzle 15 at the upper and lower intermediate positions. As shown in FIG. 4, the sub-diffusion plate 27 is formed in a disk shape, and a mark 30 for identifying the type of the suction nozzle 15 is provided on the upper surface thereof.

  The mark 30 includes an identification mark 31 made up of four-digit characters and a submark 32 provided so as to surround the lower half of the identification mark 31. The identification mark 31 can be recognized by the substrate recognition camera 10 and the operator, and includes, for example, an alphabet and a three-digit number. Of course, the number of digits of the identification mark 31 and the characters used are arbitrary, but it is preferable that the classification according to the form of the suction nozzle 15 and the classification according to the purpose of use can be displayed in addition to the nozzle number.

  The sub-mark 32 is provided so that the substrate recognition camera 10 can instantly recognize the position (region) of the identification mark 31, and is formed by a pair of “L” -shaped thick lines 32 a and 32 a that are symmetrically formed. It is configured. However, in practice, the pair of thick lines 32a and 32a are connected in the middle and formed in a flat “U” shape as a whole. The identification mark 31 and the sub-mark 32 are formed by, for example, engraving desired characters on the surface of the sub-diffusion plate 27 and applying or baking paints of colors that complement the sub-diffusion plate 27 to the grooves. To.

  In the recognition of the mark 30 by the substrate recognition camera 10, first, in the field of view of the substrate recognition camera 10, the submark 32 is recognized by optical scanning in the XY directions, and the intersections of the pair of thick lines 32a and 32a are detected. Next, the area of the recognition mark 31 (actually the area of each character) is obtained from these two intersections, and each character is recognized in turn. At that time, the character read as the image is compared with the reference character stored as data to determine the character of the recognition mark 31. When the recognition mark 31 is recognized in this way, the data of the desired suction nozzle 15 is compared with this identification data. If both data match, it is determined that the suction nozzle 15 is correct, and the process proceeds to a mounting step for mounting it. If the data does not match, it is determined that the suction nozzle 15 is incorrect. Then, the process proceeds to a notification step such as an alarm. When the mark (recognition mark 31 and / or submark 32) 30 itself cannot be identified, it is determined that the suction nozzle 15 is not set, and the process proceeds to a notification step such as an alarm.

  As described above, according to the present embodiment, since the mark 30 indicating the type of the suction nozzle 15 is formed on the upper surface of the suction nozzle 15 and recognized by the substrate recognition camera 10, the suction nozzle 15 Can be detected when the suction nozzle 15 is wrong or when there is no suction nozzle 15 to be sucked. Further, since the identification mark 31 is composed of characters, an operator who sets the suction nozzle 15 can also recognize the suction nozzle 15 in the setting operation. For this reason, an operator's set mistake can be suppressed and the frequency | count of the mounting | wearing mistake of a suction nozzle 15 and an incorrect mounting | wearing can be decreased.

  Furthermore, since the mark 30 is composed of the identification mark 31 and the submark 32 capable of instantaneously recognizing the position of the identification mark 31, the time required for recognizing the type of the suction nozzle 15 can be shortened.

  The sub-marks may be separated from each other by a pair of “L” -shaped thick lines, or may be arranged asymmetrically. Further, both “L” -shaped lines of each thick line need only extend in the orthogonal direction, and the ends of both lines may be separated or crossed. However, the sub-mark is not limited to the “L” shape, and may be any image that can instantly identify the position of the identification mark. Therefore, it may be a simple circle or square point.

It is a top view of the electronic component mounting apparatus carrying the adsorption nozzle which concerns on one Embodiment of this invention. It is a top view of the nozzle stocker which set the suction nozzle of embodiment. It is a front view around a head unit. It is an enlarged plan view of the suction nozzle of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 9 Mounting head 10 Board | substrate recognition camera 15 Adsorption nozzle 16 Nozzle stocker 16a Set hole 27 Subdiffusion plate 31 Identification mark

Claims (2)

In the suction nozzle for electronic components that are detachably mounted on the mounting head,
An electronic component suction nozzle comprising an image recognition device and a plurality of characters that can be recognized by an operator, and an identification mark for displaying the number of the suction nozzle. In the suction nozzle for electronic components that are detachably mounted on the mounting head,
An adsorption nozzle for an electronic component, characterized in that an identification mark is provided on the surface, which is composed of characters that can be recognized by an image recognition device and an operator, and displays a classification for each type of adsorption nozzle and a classification for each purpose of use.

Images